JPH03124653U - - Google Patents
Info
- Publication number
- JPH03124653U JPH03124653U JP3364690U JP3364690U JPH03124653U JP H03124653 U JPH03124653 U JP H03124653U JP 3364690 U JP3364690 U JP 3364690U JP 3364690 U JP3364690 U JP 3364690U JP H03124653 U JPH03124653 U JP H03124653U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting part
- element mounting
- lead frame
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１実施例を示す断面図、第
２図は本考案の第２実施例の断面図、第３図は従
来の樹脂封止型半導体装置の断面図である。
１……リードフレームの半導体素子搭載部、２
……リードフレームのリード、３……半導体素子
、４……金属細線、５……封止樹脂（体）、６，
７，８……レーザ彫り込みマーク。
FIG. 1 is a cross-sectional view showing a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional resin-sealed semiconductor device. 1...Semiconductor element mounting portion of lead frame, 2
... Lead frame lead, 3 ... Semiconductor element, 4 ... Fine metal wire, 5 ... Sealing resin (body), 6,
7, 8...Laser engraved mark.
Claims (1)
導体素子の回路形成面の反対側の面が固着され、
前記半導体素子および半導体素子搭載部が封脂で
封止され、さらに、前記リードフレームの半導体
素子搭載部の上面側を覆う封止樹脂体の表面側に
この半導体装置の品名などを表わすマークがレー
ザにて彫り込まれていることを特徴とする樹脂封
止型半導体装置。 The surface of the semiconductor element opposite to the circuit forming surface is fixed to the lower surface of the semiconductor element mounting part of the lead frame.
The semiconductor element and the semiconductor element mounting part are sealed with a sealant, and a mark indicating the product name of the semiconductor device, etc. is laser-marked on the surface side of the sealing resin body that covers the upper surface side of the semiconductor element mounting part of the lead frame. A resin-sealed semiconductor device characterized by being engraved with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3364690U JPH03124653U (en) | 1990-03-30 | 1990-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3364690U JPH03124653U (en) | 1990-03-30 | 1990-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124653U true JPH03124653U (en) | 1991-12-17 |
Family
ID=31537474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3364690U Pending JPH03124653U (en) | 1990-03-30 | 1990-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124653U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015088731A (en) * | 2013-09-25 | 2015-05-07 | 株式会社大真空 | Lead type electronic equipment |
| JP2022046252A (en) * | 2020-09-10 | 2022-03-23 | ローム株式会社 | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175448A (en) * | 1987-01-16 | 1988-07-19 | Hitachi Ltd | Semiconductor device |
-
1990
- 1990-03-30 JP JP3364690U patent/JPH03124653U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175448A (en) * | 1987-01-16 | 1988-07-19 | Hitachi Ltd | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015088731A (en) * | 2013-09-25 | 2015-05-07 | 株式会社大真空 | Lead type electronic equipment |
| JP2022046252A (en) * | 2020-09-10 | 2022-03-23 | ローム株式会社 | Semiconductor device |