JPH01174939U - - Google Patents
Info
- Publication number
- JPH01174939U JPH01174939U JP1988071963U JP7196388U JPH01174939U JP H01174939 U JPH01174939 U JP H01174939U JP 1988071963 U JP1988071963 U JP 1988071963U JP 7196388 U JP7196388 U JP 7196388U JP H01174939 U JPH01174939 U JP H01174939U
- Authority
- JP
- Japan
- Prior art keywords
- base
- integrated circuit
- upper opening
- package
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示し、同図ａは一
部破断平面図、同図ｂは縦断面図、第２図は従来
構造を示し、同図ａは一部破断平面図、同図ｂは
縦断面図である。
１……ベース、１ａ……上面開口部、２……集
積回路、３……リード、４……金属細線、５……
ロー材、６……キヤツプ、７……凹溝。
FIG. 1 shows an embodiment of the present invention, FIG. Figure b is a longitudinal sectional view. DESCRIPTION OF SYMBOLS 1...Base, 1a...Top opening, 2...Integrated circuit, 3...Lead, 4...Thin metal wire, 5...
Raw material, 6...cap, 7...concave groove.
Claims (1)
の上面開口部にキヤツプをロー付けして該集積回
路を封止してなるパツケージにおいて、前記ベー
スの上面開口部に、ベースの外周に沿つて凹溝を
形成したことを特徴とする集積回路のパツケージ
。 In a package in which an integrated circuit is mounted on a container-shaped base and a cap is soldered to an upper opening of the base to seal the integrated circuit, a recess is formed in the upper opening of the base along the outer periphery of the base. An integrated circuit package characterized by forming a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071963U JPH01174939U (en) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071963U JPH01174939U (en) | 1988-05-31 | 1988-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174939U true JPH01174939U (en) | 1989-12-13 |
Family
ID=31297145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988071963U Pending JPH01174939U (en) | 1988-05-31 | 1988-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174939U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005302990A (en) * | 2004-04-12 | 2005-10-27 | Miyota Kk | Sealing board with brazing material for package, and manufacturing method therefor |
-
1988
- 1988-05-31 JP JP1988071963U patent/JPH01174939U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005302990A (en) * | 2004-04-12 | 2005-10-27 | Miyota Kk | Sealing board with brazing material for package, and manufacturing method therefor |
| JP4494849B2 (en) * | 2004-04-12 | 2010-06-30 | シチズンファインテックミヨタ株式会社 | Sealing plate with brazing material for package and manufacturing method thereof |