JPS63157947U - - Google Patents
Info
- Publication number
- JPS63157947U JPS63157947U JP5059187U JP5059187U JPS63157947U JP S63157947 U JPS63157947 U JP S63157947U JP 5059187 U JP5059187 U JP 5059187U JP 5059187 U JP5059187 U JP 5059187U JP S63157947 U JPS63157947 U JP S63157947U
- Authority
- JP
- Japan
- Prior art keywords
- package
- piggy
- top surface
- lead frame
- seal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 241001071864 Lethrinus laticaudis Species 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは、本考案のセラミツクパツケー
ジの実施例の平面図、断面図、第２図および第３
図は本考案の別の各実施例の平面図、第４図は従
来例セラミツクパツケージの断面図である。
１……セラミツクパツケージの本体、２……キ
ヤビテイ、３……Ａｕベース、４……リードフレ
ーム、５……キヤツプシール部、６……ポストピ
ン。
FIGS. 1a and 1b are a plan view and a sectional view of an embodiment of the ceramic package of the present invention, and FIGS.
The figure is a plan view of other embodiments of the present invention, and FIG. 4 is a sectional view of a conventional ceramic package. 1... Main body of ceramic package, 2... Cavity, 3... Au base, 4... Lead frame, 5... Cap seal portion, 6... Post pin.
Claims (1)
電気的接続されたポストピンを有し、かつ上記ピ
ギーパツケージの上面に、半導体チツプを密封す
るための金属キヤツプシール部に溝を設けたこと
を特徴とするセラミツクパツケージ。 1. A ceramic package comprising a post pin electrically connected to a lead frame on the top surface of the piggy package, and a groove provided in a metal cap seal portion for sealing a semiconductor chip on the top surface of the piggy package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5059187U JPS63157947U (en) | 1987-04-02 | 1987-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5059187U JPS63157947U (en) | 1987-04-02 | 1987-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157947U true JPS63157947U (en) | 1988-10-17 |
Family
ID=30874094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5059187U Pending JPS63157947U (en) | 1987-04-02 | 1987-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157947U (en) |
-
1987
- 1987-04-02 JP JP5059187U patent/JPS63157947U/ja active Pending