JPS6439643U - - Google Patents
Info
- Publication number
- JPS6439643U JPS6439643U JP1987134076U JP13407687U JPS6439643U JP S6439643 U JPS6439643 U JP S6439643U JP 1987134076 U JP1987134076 U JP 1987134076U JP 13407687 U JP13407687 U JP 13407687U JP S6439643 U JPS6439643 U JP S6439643U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- semiconductor device
- type semiconductor
- carrier type
- ceramic cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000005394 sealing glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来例の断面図である。
１……セラミツク容器、２，２′……セラミツ
クキヤツプ、３……半導体チツプ、４……外部電
極、５……封止硝子、６……ボンデイング線、７
……スペーサ。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1... Ceramic container, 2, 2'... Ceramic cap, 3... Semiconductor chip, 4... External electrode, 5... Sealing glass, 6... Bonding wire, 7
……Spacer.
Claims (1)
ミツクキヤツプで封止してなるチツプキヤリヤ型
半導体装置において、前記セラミツクキヤツプは
周縁部に積層されたスペーサを有し、前記スペー
ス部で前記セラミツク容器と封止されていること
を特徴とするチツプキヤリヤ型半導体装置。 In a chip carrier type semiconductor device formed by sealing a ceramic container in which a semiconductor chip is mounted with a ceramic cap, the ceramic cap has a spacer laminated on a peripheral portion thereof, and the ceramic cap is sealed with the ceramic container in the space portion. A chip carrier type semiconductor device characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987134076U JPS6439643U (en) | 1987-09-01 | 1987-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987134076U JPS6439643U (en) | 1987-09-01 | 1987-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6439643U true JPS6439643U (en) | 1989-03-09 |
Family
ID=31392500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987134076U Pending JPS6439643U (en) | 1987-09-01 | 1987-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6439643U (en) |
-
1987
- 1987-09-01 JP JP1987134076U patent/JPS6439643U/ja active Pending