JPH0267658U - - Google Patents
Info
- Publication number
- JPH0267658U JPH0267658U JP14606688U JP14606688U JPH0267658U JP H0267658 U JPH0267658 U JP H0267658U JP 14606688 U JP14606688 U JP 14606688U JP 14606688 U JP14606688 U JP 14606688U JP H0267658 U JPH0267658 U JP H0267658U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- frame
- lead frame
- semiconductor device
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
本考案の他の実施例の断面図、第３図は従来の半
導体装置用セラミツクケースの断面図である。
１，１′……リードフレーム、２，２′……セ
ラミツクベース、３，３′……半導体素子、４，
４′……キヤツプ、５……樹脂を充填した時の樹
脂表面、６，６′……枠状のセラミツク。
FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIG. 2 is a cross-sectional view of another embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional ceramic case for a semiconductor device. 1, 1'... Lead frame, 2, 2'... Ceramic base, 3, 3'... Semiconductor element, 4,
4'... Cap, 5... Resin surface when filled with resin, 6, 6'... Frame-shaped ceramic.
Claims (1)
スを用いてリードフレームが固着され、前記リー
ドフレーム上に枠状セラミツクが固着され、枠状
セラミツク上にセラミツクキヤツプを設けて封止
する半導体装置用セラミツクケースにおいて、前
記リードフレームは半導体素子が搭載されるアイ
ランド部が外部リードと一体的に形成されたもの
であることを特徴とする半導体装置用セラミツク
ケース。 A ceramic for semiconductor device in which a lead frame is fixed to the end of a flat ceramic base using low melting point glass, a frame-shaped ceramic is fixed on the lead frame, and a ceramic cap is provided on the frame-shaped ceramic for sealing. 1. A ceramic case for a semiconductor device, wherein the lead frame has an island portion on which a semiconductor element is mounted and is integrally formed with an external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14606688U JPH0267658U (en) | 1988-11-08 | 1988-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14606688U JPH0267658U (en) | 1988-11-08 | 1988-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267658U true JPH0267658U (en) | 1990-05-22 |
Family
ID=31415217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14606688U Pending JPH0267658U (en) | 1988-11-08 | 1988-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267658U (en) |
-
1988
- 1988-11-08 JP JP14606688U patent/JPH0267658U/ja active Pending