JPH0463145U - - Google Patents
Info
- Publication number
- JPH0463145U JPH0463145U JP10552190U JP10552190U JPH0463145U JP H0463145 U JPH0463145 U JP H0463145U JP 10552190 U JP10552190 U JP 10552190U JP 10552190 U JP10552190 U JP 10552190U JP H0463145 U JPH0463145 U JP H0463145U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- recessed portion
- melting point
- low melting
- point glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案のセラミツクキヤツプであり
、第２図、第３図は、それぞれ第１図のＡ−Ａ′
，Ｂ−Ｂ′の断面図である。第４図は、本考案の
セラミツクキヤツプを使用したサーデイツプ型半
導体装置である。第５図は、本考案のセラミツク
キヤツプと融着されるセラミツクベースである。
１……セラミツクキヤツプ、２……セラミツク
キヤツプ本体、２１……セラミツクキヤツプ凹部
、３……低融点ガラス、３１……低融点ガラス厚
肉部、３２……低融点ガラス薄肉部、４……セラ
ミツクベース、５……セラミツクベース本体、５
１……セラミツクベース凹部、６……金膜、７…
…半導体ＩＣ、８……低融点ガラス、９……金綻
、１０……リードフレーム。
Fig. 1 shows the ceramic cap of the present invention, and Figs. 2 and 3 respectively show A-A' in Fig. 1.
, BB'. FIG. 4 shows a ceramic cap type semiconductor device using the ceramic cap of the present invention. FIG. 5 shows a ceramic base fused with the ceramic cap of the present invention. 1... Ceramic cap, 2... Ceramic cap body, 21... Ceramic cap recess, 3... Low melting point glass, 31... Low melting point glass thick part, 32... Low melting point glass thin part, 4... Ceramic Base, 5... Ceramic base body, 5
1... Ceramic base recess, 6... Gold film, 7...
...Semiconductor IC, 8...Low melting point glass, 9...Finance, 10...Lead frame.
Claims (1)
の凹部側主面に低融点ガラスが固着されているＩ
Ｃパツケージ用キヤツプにおいて、 上記低融点ガラスが、上記主面の短辺及びこれ
と平行する凹部開口端辺に接することなく、上記
主面の長辺及びこれと平行する凹部開口端辺に接
するように凹部の周囲に設けられた厚肉部を有す
ることを特徴とするキヤツプ。[Claims for Utility Model Registration] I which has a rectangular cross section, has a recessed portion approximately in the center, and has a low melting point glass fixed to the main surface on the side of the recessed portion.
In the cap for a C package, the low melting point glass is arranged so that it does not touch the short side of the main surface and the opening edge of the recess parallel to it, but contacts the long side of the main surface and the opening edge of the recess parallel to this. A cap characterized in that it has a thick walled portion provided around a recessed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10552190U JPH0463145U (en) | 1990-10-05 | 1990-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10552190U JPH0463145U (en) | 1990-10-05 | 1990-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463145U true JPH0463145U (en) | 1992-05-29 |
Family
ID=31851236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10552190U Pending JPH0463145U (en) | 1990-10-05 | 1990-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463145U (en) |
-
1990
- 1990-10-05 JP JP10552190U patent/JPH0463145U/ja active Pending