JPH02125344U - - Google Patents
Info
- Publication number
- JPH02125344U JPH02125344U JP1989034497U JP3449789U JPH02125344U JP H02125344 U JPH02125344 U JP H02125344U JP 1989034497 U JP1989034497 U JP 1989034497U JP 3449789 U JP3449789 U JP 3449789U JP H02125344 U JPH02125344 U JP H02125344U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- base
- view
- chip
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005394 sealing glass Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図ａは本考案の実施例１を示す斜視図、第
１図ｂは同縦断面図、第２図ａは本考案の実施例
２を示す斜視図、第２図ｂは同縦断面図、第３図
ａは従来のバツケージを示す斜視図、第３図ｂは
同縦断面図である。
１，８，１６……ベース、２，９，１５……キ
ヤツプ、３，１１……位置決め用凸部、４，１０
……位置決め用凹部、５，１２，１７……ＩＣチ
ツプ、６，１３，１８……リードフレーム、７，
１４，１９……ワイヤ、２０，２１……封止ガラ
ス。
Fig. 1a is a perspective view showing Embodiment 1 of the present invention, Fig. 1b is a longitudinal sectional view of the same, Fig. 2a is a perspective view showing Embodiment 2 of the invention, and Fig. 2b is a longitudinal sectional view of the same. 3A is a perspective view showing a conventional bagage, and FIG. 3B is a longitudinal sectional view thereof. 1, 8, 16... Base, 2, 9, 15... Cap, 3, 11... Positioning protrusion, 4, 10
...Positioning recess, 5, 12, 17...IC chip, 6,13,18...Lead frame, 7,
14, 19... Wire, 20, 21... Sealing glass.
Claims (1)
用いキヤツプをシールするＩＣパツケージにおい
て、キヤツプとベースの接する部分に位置決め用
の凸凹を設けたことを特徴とするＩＣパツケージ
。 An IC package in which a cap is sealed using a sealing glass or the like on a base on which an IC chip is mounted, characterized in that unevenness for positioning is provided at the part where the cap and the base come into contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989034497U JPH02125344U (en) | 1989-03-27 | 1989-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989034497U JPH02125344U (en) | 1989-03-27 | 1989-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125344U true JPH02125344U (en) | 1990-10-16 |
Family
ID=31539015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989034497U Pending JPH02125344U (en) | 1989-03-27 | 1989-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125344U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07115145A (en) * | 1993-10-15 | 1995-05-02 | Nec Corp | Semiconductor package |
-
1989
- 1989-03-27 JP JP1989034497U patent/JPH02125344U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07115145A (en) * | 1993-10-15 | 1995-05-02 | Nec Corp | Semiconductor package |