JPS6214738U - - Google Patents
Info
- Publication number
- JPS6214738U JPS6214738U JP10638685U JP10638685U JPS6214738U JP S6214738 U JPS6214738 U JP S6214738U JP 10638685 U JP10638685 U JP 10638685U JP 10638685 U JP10638685 U JP 10638685U JP S6214738 U JPS6214738 U JP S6214738U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- package
- perspective
- view
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示しモールドパツ
ケージに採用した斜視図、第２図は本考案の他の
実施例を示しキヤンケースパツケージに採用した
斜視図、第３図は従来の半導体装置のモールドパ
ツケージの斜視図である。
１……リード、２……モールド樹脂、３……捺
印、４……本考案の特長である凹部、５……金属
キヤツプである。
FIG. 1 is a perspective view showing one embodiment of the present invention, and is a perspective view of the molded package, FIG. 2 is a perspective view of another embodiment of the present invention, and is a perspective view of the device being used in a can case package, and FIG. 3 is a conventional semiconductor device. FIG. 3 is a perspective view of the mold package of FIG. 1...Lead, 2...Mold resin, 3...Seal, 4...Concave portion which is a feature of the present invention, 5...Metal cap.
Claims (1)
印する事を特徴とする半導体装置。 A semiconductor device characterized in that a recess is provided on the surface of a package, and a mark is printed in the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10638685U JPS6214738U (en) | 1985-07-11 | 1985-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10638685U JPS6214738U (en) | 1985-07-11 | 1985-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214738U true JPS6214738U (en) | 1987-01-29 |
Family
ID=30981693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10638685U Pending JPS6214738U (en) | 1985-07-11 | 1985-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133447U (en) * | 1991-05-31 | 1992-12-11 | 京セラ株式会社 | semiconductor package |
-
1985
- 1985-07-11 JP JP10638685U patent/JPS6214738U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133447U (en) * | 1991-05-31 | 1992-12-11 | 京セラ株式会社 | semiconductor package |