JPH0415855U - - Google Patents
Info
- Publication number
- JPH0415855U JPH0415855U JP5675690U JP5675690U JPH0415855U JP H0415855 U JPH0415855 U JP H0415855U JP 5675690 U JP5675690 U JP 5675690U JP 5675690 U JP5675690 U JP 5675690U JP H0415855 U JPH0415855 U JP H0415855U
- Authority
- JP
- Japan
- Prior art keywords
- trademark
- lead
- package body
- engraved
- manufacturer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の部分側面図、第２
図は他の実施例の部分平面図である。
１，１１……パツケージ本体、２，１２……外部
リード、３……打刻印字社票。
Fig. 1 is a partial side view of one embodiment of the present invention;
The figure is a partial plan view of another embodiment. 1, 11...Package body, 2, 12...External lead, 3...Stamped company label.
Claims (1)
有する半導体装置において、前記リード部分に会
社名、商標、トレードマーク、コーポレイトアイ
デンテイテイなどのメーカー表示が打刻されてい
ることを特徴とする半導体装置。 1. A semiconductor device having a lead drawn out from a package body, characterized in that a manufacturer's indication such as a company name, trademark, trademark, corporate identity, etc. is engraved on the lead portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5675690U JPH0415855U (en) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5675690U JPH0415855U (en) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415855U true JPH0415855U (en) | 1992-02-07 |
Family
ID=31580867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5675690U Pending JPH0415855U (en) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415855U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0835277A (en) * | 1994-07-25 | 1996-02-06 | Natl House Ind Co Ltd | Structure of joint section |
| JP2002331312A (en) * | 2001-05-07 | 2002-11-19 | Sumitomo Metal Mining Co Ltd | Marking component for blanking die and blanking die using the same |
-
1990
- 1990-05-30 JP JP5675690U patent/JPH0415855U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0835277A (en) * | 1994-07-25 | 1996-02-06 | Natl House Ind Co Ltd | Structure of joint section |
| JP2002331312A (en) * | 2001-05-07 | 2002-11-19 | Sumitomo Metal Mining Co Ltd | Marking component for blanking die and blanking die using the same |