JPH0221755U - - Google Patents
Info
- Publication number
- JPH0221755U JPH0221755U JP10050688U JP10050688U JPH0221755U JP H0221755 U JPH0221755 U JP H0221755U JP 10050688 U JP10050688 U JP 10050688U JP 10050688 U JP10050688 U JP 10050688U JP H0221755 U JPH0221755 U JP H0221755U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- external lead
- discernible
- protrusion
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例１を示す平面図、第２
図は同側面図、第３図は本考案の実施例２を示す
側面図である。
１……封止樹脂、２……外部リード、２′……
フオーミングリード、３……溝部。
Figure 1 is a plan view showing the first embodiment of the present invention;
The figure is a side view of the same, and FIG. 3 is a side view showing Embodiment 2 of the present invention. 1... Sealing resin, 2... External lead, 2'...
Forming lead, 3... groove section.
Claims (1)
リード表面に識別可能な溝部もしくは突部を有す
ることを特徴とする半導体装置。 A semiconductor device having an external lead, the semiconductor device having a discernible groove or protrusion on the surface of the external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050688U JPH0221755U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10050688U JPH0221755U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221755U true JPH0221755U (en) | 1990-02-14 |
Family
ID=31328641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10050688U Pending JPH0221755U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221755U (en) |
-
1988
- 1988-07-28 JP JP10050688U patent/JPH0221755U/ja active Pending