JPH0245645U - - Google Patents

Info

Publication number
JPH0245645U
JPH0245645U JP12456088U JP12456088U JPH0245645U JP H0245645 U JPH0245645 U JP H0245645U JP 12456088 U JP12456088 U JP 12456088U JP 12456088 U JP12456088 U JP 12456088U JP H0245645 U JPH0245645 U JP H0245645U
Authority
JP
Japan
Prior art keywords
visible light
semiconductor device
sealed
white ceramic
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12456088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12456088U priority Critical patent/JPH0245645U/ja
Publication of JPH0245645U publication Critical patent/JPH0245645U/ja
Pending legal-status Critical Current

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  • Light Receiving Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の第1実施例の縦断面図、第2
図は本考案の第2実施例の縦断面図である。 1……パツケージベース、2……半導体素子、
3……外部リード、4……金属細線、5……キヤ
ツプ、6……シール材、7,7A……黒色塗料膜
Fig. 1 is a longitudinal sectional view of the first embodiment of the present invention, and the second
The figure is a longitudinal sectional view of a second embodiment of the present invention. 1...Package base, 2...Semiconductor element,
3...External lead, 4...Thin metal wire, 5...Cap, 6...Sealing material, 7,7A...Black paint film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 白色セラミツクで構成したパツケージ内に可視
光の影響を受け易い半導体素子を封止した半導体
装置において、前記白色セラミツクパツケージの
少なくとも上面に可視光を遮断する有色塗料膜を
形成したことを特徴とするセラミツク封止型半導
体装置。
A semiconductor device in which a semiconductor element susceptible to visible light is sealed in a package made of white ceramic, characterized in that a colored paint film that blocks visible light is formed on at least the upper surface of the white ceramic package. Sealed semiconductor device.
JP12456088U 1988-09-22 1988-09-22 Pending JPH0245645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12456088U JPH0245645U (en) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12456088U JPH0245645U (en) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0245645U true JPH0245645U (en) 1990-03-29

Family

ID=31374402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12456088U Pending JPH0245645U (en) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0245645U (en)

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