JPS63193846U - - Google Patents
Info
- Publication number
- JPS63193846U JPS63193846U JP8602187U JP8602187U JPS63193846U JP S63193846 U JPS63193846 U JP S63193846U JP 8602187 U JP8602187 U JP 8602187U JP 8602187 U JP8602187 U JP 8602187U JP S63193846 U JPS63193846 U JP S63193846U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- semiconductor devices
- raised
- sealing cap
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000012945 sealing adhesive Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図Ａは本考案の第１の実施例を示す平面図
、第１図Ｂは第１の実施例の側面図である。第２
図Ａは本考案の第２の実施例を示す平面図、第２
図Ｂは第２図Ａのａ―ａ′面で切断した断面図で
ある。
１……封止キヤツプ用セラミツク材、２……封
止用接着剤層、３……溝部。
FIG. 1A is a plan view showing a first embodiment of the present invention, and FIG. 1B is a side view of the first embodiment. Second
Figure A is a plan view showing a second embodiment of the present invention;
FIG. B is a sectional view taken along the a-a' plane of FIG. 2A. 1...Ceramic material for sealing cap, 2...Sealing adhesive layer, 3...Groove portion.
Claims (1)
ツプの、封止用接着剤で封止される表面の一部が
他のセラミツク面より隆起していて、且つ隆起部
には接着剤層がない事を特徴とす半導体素子用セ
ラミツクパツケージの封止キヤツプ。 A sealing cap of a ceramic package for semiconductor devices is characterized in that a part of the surface to be sealed with a sealing adhesive is raised from other ceramic surfaces, and there is no adhesive layer on the raised part. Sealing cap for ceramic packages for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8602187U JPS63193846U (en) | 1987-06-01 | 1987-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8602187U JPS63193846U (en) | 1987-06-01 | 1987-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193846U true JPS63193846U (en) | 1988-12-14 |
Family
ID=30941951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8602187U Pending JPS63193846U (en) | 1987-06-01 | 1987-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302556A (en) * | 2009-08-31 | 2009-12-24 | Renesas Technology Corp | Semiconductor device |
-
1987
- 1987-06-01 JP JP8602187U patent/JPS63193846U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302556A (en) * | 2009-08-31 | 2009-12-24 | Renesas Technology Corp | Semiconductor device |
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