JPH01135741U - - Google Patents

Info

Publication number
JPH01135741U
JPH01135741U JP3107188U JP3107188U JPH01135741U JP H01135741 U JPH01135741 U JP H01135741U JP 3107188 U JP3107188 U JP 3107188U JP 3107188 U JP3107188 U JP 3107188U JP H01135741 U JPH01135741 U JP H01135741U
Authority
JP
Japan
Prior art keywords
peripheral portion
cap
semiconductor device
view
adhering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3107188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3107188U priority Critical patent/JPH01135741U/ja
Publication of JPH01135741U publication Critical patent/JPH01135741U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図aは本考案の第1の実施例の半導体装置
を説明するための斜視図、第1図bは第1図aの
断面図、第1図cは第1図aで示すキヤツプを用
いて気密封止したトランジスタ容器の側面図、第
2図は、本考案の第2の実施例の半導体装置を説
明するための断面図、第3図aは、第1の従来例
のキヤツプの断面図、第3図bは第2の従来例の
キヤツプの断面図、第3図cは従来例のキヤツプ
を用いて気密封止したトランジスタ容器の側面図
である。 1……サフアイヤ、2……面とり部、3,13
,24……メタライズ部、4……トランジスタ容
器。
FIG. 1a is a perspective view for explaining the semiconductor device of the first embodiment of the present invention, FIG. 1b is a sectional view of FIG. 1a, and FIG. 1c is a cap shown in FIG. 1a. 2 is a cross-sectional view for explaining the semiconductor device of the second embodiment of the present invention, and FIG. 3a is a side view of the cap of the first conventional example. 3b is a sectional view of a second conventional cap, and FIG. 3c is a side view of a transistor container hermetically sealed using the conventional cap. 1... Sahuaia, 2... Chamfered part, 3, 13
, 24...Metallized portion, 4...Transistor container.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] その下表面の周辺部には半導体素子用容器に固
着し得るメタライズ層をもち、その上表面の周辺
部の角に面とりをほどこしたキヤツプを有するこ
とを特徴とする半導体装置。
1. A semiconductor device comprising a cap having a metallized layer capable of adhering to a semiconductor element container on a peripheral portion of its lower surface, and chamfered corners on the peripheral portion of its upper surface.
JP3107188U 1988-03-08 1988-03-08 Pending JPH01135741U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3107188U JPH01135741U (en) 1988-03-08 1988-03-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3107188U JPH01135741U (en) 1988-03-08 1988-03-08

Publications (1)

Publication Number Publication Date
JPH01135741U true JPH01135741U (en) 1989-09-18

Family

ID=31256669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3107188U Pending JPH01135741U (en) 1988-03-08 1988-03-08

Country Status (1)

Country Link
JP (1) JPH01135741U (en)

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