JPH03117843U - - Google Patents
Info
- Publication number
- JPH03117843U JPH03117843U JP2669990U JP2669990U JPH03117843U JP H03117843 U JPH03117843 U JP H03117843U JP 2669990 U JP2669990 U JP 2669990U JP 2669990 U JP2669990 U JP 2669990U JP H03117843 U JPH03117843 U JP H03117843U
- Authority
- JP
- Japan
- Prior art keywords
- container
- base
- metallized
- sealed
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第1図、第2図は本考案の実施例の縦断面図、
第3図は従来例の縦断面図である。
1……ベース、2……外部リード、3,3′…
…アースリード、4……セラミツク絶縁部、7…
…ベース、7A……セラミツク基板、7B……フ
ランジ。
1 and 2 are longitudinal sectional views of an embodiment of the present invention,
FIG. 3 is a longitudinal sectional view of a conventional example. 1...Base, 2...External lead, 3, 3'...
...Earth lead, 4...Ceramic insulation part, 7...
...base, 7A...ceramic substrate, 7B...flange.
Claims (1)
リードが、貫通部において内表面をメタライズさ
れたセラミツクに封着されていることを特徴とす
る半導体装置用容器。 1. A container for a semiconductor device, characterized in that an external lead extending through a base of the container is sealed to ceramic whose inner surface is metallized at the penetrating portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2669990U JPH03117843U (en) | 1990-03-15 | 1990-03-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2669990U JPH03117843U (en) | 1990-03-15 | 1990-03-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03117843U true JPH03117843U (en) | 1991-12-05 |
Family
ID=31529580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2669990U Pending JPH03117843U (en) | 1990-03-15 | 1990-03-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03117843U (en) |
-
1990
- 1990-03-15 JP JP2669990U patent/JPH03117843U/ja active Pending