JPH03117843U - - Google Patents

Info

Publication number
JPH03117843U
JPH03117843U JP2669990U JP2669990U JPH03117843U JP H03117843 U JPH03117843 U JP H03117843U JP 2669990 U JP2669990 U JP 2669990U JP 2669990 U JP2669990 U JP 2669990U JP H03117843 U JPH03117843 U JP H03117843U
Authority
JP
Japan
Prior art keywords
container
base
metallized
sealed
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2669990U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2669990U priority Critical patent/JPH03117843U/ja
Publication of JPH03117843U publication Critical patent/JPH03117843U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図は本考案の実施例の縦断面図、
第3図は従来例の縦断面図である。 1……ベース、2……外部リード、3,3′…
…アースリード、4……セラミツク絶縁部、7…
…ベース、7A……セラミツク基板、7B……フ
ランジ。
1 and 2 are longitudinal sectional views of an embodiment of the present invention,
FIG. 3 is a longitudinal sectional view of a conventional example. 1...Base, 2...External lead, 3, 3'...
...Earth lead, 4...Ceramic insulation part, 7...
...base, 7A...ceramic substrate, 7B...flange.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 容器のベースから貫通して引出されている外部
リードが、貫通部において内表面をメタライズさ
れたセラミツクに封着されていることを特徴とす
る半導体装置用容器。
1. A container for a semiconductor device, characterized in that an external lead extending through a base of the container is sealed to ceramic whose inner surface is metallized at the penetrating portion.
JP2669990U 1990-03-15 1990-03-15 Pending JPH03117843U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2669990U JPH03117843U (en) 1990-03-15 1990-03-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2669990U JPH03117843U (en) 1990-03-15 1990-03-15

Publications (1)

Publication Number Publication Date
JPH03117843U true JPH03117843U (en) 1991-12-05

Family

ID=31529580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2669990U Pending JPH03117843U (en) 1990-03-15 1990-03-15

Country Status (1)

Country Link
JP (1) JPH03117843U (en)

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