JPS6318854U - - Google Patents
Info
- Publication number
- JPS6318854U JPS6318854U JP11292286U JP11292286U JPS6318854U JP S6318854 U JPS6318854 U JP S6318854U JP 11292286 U JP11292286 U JP 11292286U JP 11292286 U JP11292286 U JP 11292286U JP S6318854 U JPS6318854 U JP S6318854U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- package
- semiconductor device
- larger
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図、第２図はそれぞれ本考案の実施例を示
す平面図、第３図は従来の一例を示す平面図であ
る。
１１，２１，３１……電源端子、１２，２２，
３２……接地端子、１３，２３，３３……信号端
子、１４，２４，３４……パツケージ本体、１５
，２５，３５……半導体集積装置。
FIGS. 1 and 2 are plan views showing an embodiment of the present invention, and FIG. 3 is a plan view showing a conventional example. 11, 21, 31...power terminal, 12, 22,
32...Grounding terminal, 13,23,33...Signal terminal, 14,24,34...Package body, 15
, 25, 35...Semiconductor integrated device.
Claims (1)
面積を信号端子よりも大きくした事を特徴とする
半導体装置用パツケージ。 A package for a semiconductor device, characterized in that the cross-sectional area of at least one of a power supply terminal and a ground terminal is larger than that of a signal terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11292286U JPS6318854U (en) | 1986-07-22 | 1986-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11292286U JPS6318854U (en) | 1986-07-22 | 1986-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6318854U true JPS6318854U (en) | 1988-02-08 |
Family
ID=30994246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11292286U Pending JPS6318854U (en) | 1986-07-22 | 1986-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6318854U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230264A (en) * | 1988-03-10 | 1989-09-13 | Nec Corp | Lsi package |
| JPH0330666U (en) * | 1989-08-04 | 1991-03-26 | ||
| JPH0330667U (en) * | 1989-08-04 | 1991-03-26 | ||
| JPH0330668U (en) * | 1989-08-04 | 1991-03-26 | ||
| JPH0336565U (en) * | 1989-08-19 | 1991-04-09 | ||
| JPH05167000A (en) * | 1991-12-18 | 1993-07-02 | Kawasaki Steel Corp | Lead wiring of semiconductor device package |
| US11108178B2 (en) | 2018-09-19 | 2021-08-31 | Kabushiki Kaisha Toshiba | Electronic device with housing storing electronic component |
-
1986
- 1986-07-22 JP JP11292286U patent/JPS6318854U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230264A (en) * | 1988-03-10 | 1989-09-13 | Nec Corp | Lsi package |
| JPH0330666U (en) * | 1989-08-04 | 1991-03-26 | ||
| JPH0330667U (en) * | 1989-08-04 | 1991-03-26 | ||
| JPH0330668U (en) * | 1989-08-04 | 1991-03-26 | ||
| JPH0336565U (en) * | 1989-08-19 | 1991-04-09 | ||
| JPH05167000A (en) * | 1991-12-18 | 1993-07-02 | Kawasaki Steel Corp | Lead wiring of semiconductor device package |
| US11108178B2 (en) | 2018-09-19 | 2021-08-31 | Kabushiki Kaisha Toshiba | Electronic device with housing storing electronic component |