JPH0224540U - - Google Patents
Info
- Publication number
- JPH0224540U JPH0224540U JP10126188U JP10126188U JPH0224540U JP H0224540 U JPH0224540 U JP H0224540U JP 10126188 U JP10126188 U JP 10126188U JP 10126188 U JP10126188 U JP 10126188U JP H0224540 U JPH0224540 U JP H0224540U
- Authority
- JP
- Japan
- Prior art keywords
- section
- semiconductor device
- active element
- semiconductor
- wiring section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案の半導体装置におけるアルミ配
線の第１の実施例を示す要部平面図、第２図は、
本考案の第２の実施例を示す平面図、第３図は、
従来の半導体装置におけるアルミ配線の要部平面
図である。
１……幅広アルミ配線、２，２′……スリツト
、３……接続アルミ配線部、４……能動素子部、
５……コンタクト、６……能動素子内部配線。
FIG. 1 is a plan view of essential parts showing a first embodiment of aluminum wiring in a semiconductor device of the present invention, and FIG.
A plan view showing the second embodiment of the present invention, FIG.
FIG. 2 is a plan view of main parts of aluminum wiring in a conventional semiconductor device. 1... wide aluminum wiring, 2, 2'... slit, 3... connection aluminum wiring section, 4... active element section,
5... Contact, 6... Active element internal wiring.
Claims (1)
導体素子内部に形成された能動素子部と、該配線
部と該能動素子部とを電気的に接続する接続配線
部とを有する半導体装置において、該接続配線部
にスリツトが形成されていることを特徴とする半
導体装置。 A semiconductor device having a wiring section formed on the outer periphery of a semiconductor element, an active element section formed inside the semiconductor element, and a connection wiring section electrically connecting the wiring section and the active element section, A semiconductor device characterized in that a slit is formed in the connection wiring portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101261U JP2535529Y2 (en) | 1988-07-29 | 1988-07-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101261U JP2535529Y2 (en) | 1988-07-29 | 1988-07-29 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0224540U true JPH0224540U (en) | 1990-02-19 |
| JP2535529Y2 JP2535529Y2 (en) | 1997-05-14 |
Family
ID=31330096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988101261U Expired - Lifetime JP2535529Y2 (en) | 1988-07-29 | 1988-07-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2535529Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590628A (en) * | 1991-09-27 | 1993-04-09 | Nec Yamagata Ltd | Semiconductor device |
| JP2007027481A (en) * | 2005-07-19 | 2007-02-01 | Seiko Epson Corp | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444048A (en) * | 1987-08-12 | 1989-02-16 | Hitachi Ltd | Semiconductor integrated circuit device |
-
1988
- 1988-07-29 JP JP1988101261U patent/JP2535529Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444048A (en) * | 1987-08-12 | 1989-02-16 | Hitachi Ltd | Semiconductor integrated circuit device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590628A (en) * | 1991-09-27 | 1993-04-09 | Nec Yamagata Ltd | Semiconductor device |
| JP2007027481A (en) * | 2005-07-19 | 2007-02-01 | Seiko Epson Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2535529Y2 (en) | 1997-05-14 |