JPH0242444U - - Google Patents

Info

Publication number
JPH0242444U
JPH0242444U JP12132888U JP12132888U JPH0242444U JP H0242444 U JPH0242444 U JP H0242444U JP 12132888 U JP12132888 U JP 12132888U JP 12132888 U JP12132888 U JP 12132888U JP H0242444 U JPH0242444 U JP H0242444U
Authority
JP
Japan
Prior art keywords
hole
reference hole
package body
semiconductor chip
expose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12132888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12132888U priority Critical patent/JPH0242444U/ja
Publication of JPH0242444U publication Critical patent/JPH0242444U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の斜視図、第2図は
その平面図、第3図は内部構造の平面図、第4図
は一部を破断した拡大正面図である。 1……半導体チツプ、2,2A……リード、3
……パツケージ本体、4……基準穴、5……穴。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a plan view of the internal structure, and FIG. 4 is an enlarged partially cutaway front view. 1... Semiconductor chip, 2, 2A... Lead, 3
...Package body, 4...Reference hole, 5...Hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージ本体内に半導体チツプと共に封止さ
れるリードの一部に基準穴を設け、この基準穴に
対応する前記パツケージ本体の一部に穴をあけて
、この穴内に前記基準穴を露呈させるように構成
したことを特徴とする基準穴付半導体装置。
A reference hole is provided in a part of the lead sealed together with the semiconductor chip in the package body, and a hole is made in a part of the package body corresponding to the reference hole to expose the reference hole in the hole. A semiconductor device with a reference hole, characterized in that:
JP12132888U 1988-09-16 1988-09-16 Pending JPH0242444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12132888U JPH0242444U (en) 1988-09-16 1988-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12132888U JPH0242444U (en) 1988-09-16 1988-09-16

Publications (1)

Publication Number Publication Date
JPH0242444U true JPH0242444U (en) 1990-03-23

Family

ID=31368235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12132888U Pending JPH0242444U (en) 1988-09-16 1988-09-16

Country Status (1)

Country Link
JP (1) JPH0242444U (en)

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