JPH0373438U - - Google Patents
Info
- Publication number
- JPH0373438U JPH0373438U JP13578689U JP13578689U JPH0373438U JP H0373438 U JPH0373438 U JP H0373438U JP 13578689 U JP13578689 U JP 13578689U JP 13578689 U JP13578689 U JP 13578689U JP H0373438 U JPH0373438 U JP H0373438U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply wiring
- semiconductor device
- branches
- wide power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案の一実施例を示す半導体装置の
部分平面図、第２図は従来の半導体装置の部分平
面図である。
１……幅の広い電源配線、２……幅の狭い電源
配線、３……内部回路。
FIG. 1 is a partial plan view of a semiconductor device showing an embodiment of the present invention, and FIG. 2 is a partial plan view of a conventional semiconductor device. 1... wide power supply wiring, 2... narrow power supply wiring, 3... internal circuit.
Claims (1)
ら垂直にＴ字形に分岐して内部回路に接続する幅
の狭い電源配線を有する半導体装置において、前
記幅の狭い電源配線の分岐する部分に設けた前記
幅の広い電源配線に対して４５°の角度の脹みを
備えたことを特徴とする半導体装置。 In a semiconductor device having a wide power supply wiring and a narrow power supply wiring that branches vertically from the wide power supply wiring in a T-shape and connects to an internal circuit, the method is provided at a part where the narrow power supply wiring branches. A semiconductor device characterized in that the wide power supply wiring has a bulge at an angle of 45°.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13578689U JPH0373438U (en) | 1989-11-21 | 1989-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13578689U JPH0373438U (en) | 1989-11-21 | 1989-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373438U true JPH0373438U (en) | 1991-07-24 |
Family
ID=31683031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13578689U Pending JPH0373438U (en) | 1989-11-21 | 1989-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373438U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027264A (en) * | 2005-07-13 | 2007-02-01 | Seiko Epson Corp | Semiconductor device |
| JP2007027481A (en) * | 2005-07-19 | 2007-02-01 | Seiko Epson Corp | Semiconductor device |
| JP2010028134A (en) * | 2009-10-28 | 2010-02-04 | Renesas Technology Corp | Thin film magnetic memory device |
| US8018046B2 (en) | 1998-05-19 | 2011-09-13 | Ibiden Co., Ltd. | Printed wiring board with notched conductive traces |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135585A (en) * | 1977-05-02 | 1978-11-27 | Hitachi Ltd | Wiring for electronic components |
| JPS63164337A (en) * | 1986-12-26 | 1988-07-07 | Toshiba Corp | Thin film wiring for semiconductor device |
-
1989
- 1989-11-21 JP JP13578689U patent/JPH0373438U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135585A (en) * | 1977-05-02 | 1978-11-27 | Hitachi Ltd | Wiring for electronic components |
| JPS63164337A (en) * | 1986-12-26 | 1988-07-07 | Toshiba Corp | Thin film wiring for semiconductor device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8018046B2 (en) | 1998-05-19 | 2011-09-13 | Ibiden Co., Ltd. | Printed wiring board with notched conductive traces |
| US8629550B2 (en) | 1998-05-19 | 2014-01-14 | Ibiden Co., Ltd. | Printed wiring board with crossing wiring pattern |
| JP2007027264A (en) * | 2005-07-13 | 2007-02-01 | Seiko Epson Corp | Semiconductor device |
| JP4605378B2 (en) * | 2005-07-13 | 2011-01-05 | セイコーエプソン株式会社 | Semiconductor device |
| JP2007027481A (en) * | 2005-07-19 | 2007-02-01 | Seiko Epson Corp | Semiconductor device |
| JP2010028134A (en) * | 2009-10-28 | 2010-02-04 | Renesas Technology Corp | Thin film magnetic memory device |