JPS53135585A - Wiring for electronic components - Google Patents

Wiring for electronic components

Info

Publication number
JPS53135585A
JPS53135585A JP4995277A JP4995277A JPS53135585A JP S53135585 A JPS53135585 A JP S53135585A JP 4995277 A JP4995277 A JP 4995277A JP 4995277 A JP4995277 A JP 4995277A JP S53135585 A JPS53135585 A JP S53135585A
Authority
JP
Japan
Prior art keywords
wiring
electronic components
corner
shape
angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4995277A
Other languages
Japanese (ja)
Other versions
JPS6156608B2 (en
Inventor
Takeo Yoshimi
Hideo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4995277A priority Critical patent/JPS53135585A/en
Publication of JPS53135585A publication Critical patent/JPS53135585A/en
Publication of JPS6156608B2 publication Critical patent/JPS6156608B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To prevent the occurrence of cracks for film, by avoiding the stress due to the difference of the thermal expansion coefficient with the passivation film protecting the IC surface from being subjected to the corner of the electrode wirings, through taking the shape of the IC electrode wiring as flat shape and each corner angle as obtuse angle.
COPYRIGHT: (C)1978,JPO&Japio
JP4995277A 1977-05-02 1977-05-02 Wiring for electronic components Granted JPS53135585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4995277A JPS53135585A (en) 1977-05-02 1977-05-02 Wiring for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4995277A JPS53135585A (en) 1977-05-02 1977-05-02 Wiring for electronic components

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5589385A Division JPS60242643A (en) 1985-03-22 1985-03-22 Wiring for electronic part

Publications (2)

Publication Number Publication Date
JPS53135585A true JPS53135585A (en) 1978-11-27
JPS6156608B2 JPS6156608B2 (en) 1986-12-03

Family

ID=12845362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4995277A Granted JPS53135585A (en) 1977-05-02 1977-05-02 Wiring for electronic components

Country Status (1)

Country Link
JP (1) JPS53135585A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56162854A (en) * 1980-05-20 1981-12-15 Nec Corp Semiconductor integrated circuit device
JPS5745259A (en) * 1980-09-01 1982-03-15 Hitachi Ltd Resin sealing type semiconductor device
JPS5756935A (en) * 1980-09-22 1982-04-05 Nec Corp Semiconductor device
JPS5936945A (en) * 1982-08-24 1984-02-29 Mitsubishi Electric Corp Input connection terminal of semiconductor device
JPS61255039A (en) * 1985-05-07 1986-11-12 Rohm Co Ltd Semiconductor device
JPH0373438U (en) * 1989-11-21 1991-07-24
US7525190B2 (en) 1998-05-19 2009-04-28 Ibiden Co., Ltd. Printed wiring board with wiring pattern having narrow width portion
JP2016195286A (en) * 2010-01-15 2016-11-17 ローム株式会社 Semiconductor device
JP2018139290A (en) * 2018-03-28 2018-09-06 ルネサスエレクトロニクス株式会社 Semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0511528Y2 (en) * 1986-11-17 1993-03-23
JPS63305309A (en) * 1987-06-05 1988-12-13 Akai Electric Co Ltd Connecting device for optical fiber

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56162854A (en) * 1980-05-20 1981-12-15 Nec Corp Semiconductor integrated circuit device
JPS6346981B2 (en) * 1980-09-01 1988-09-20 Hitachi Seisakusho Kk
JPS5745259A (en) * 1980-09-01 1982-03-15 Hitachi Ltd Resin sealing type semiconductor device
US5023699A (en) * 1980-09-01 1991-06-11 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
JPS5756935A (en) * 1980-09-22 1982-04-05 Nec Corp Semiconductor device
JPH0130301B2 (en) * 1982-08-24 1989-06-19 Mitsubishi Electric Corp
JPS5936945A (en) * 1982-08-24 1984-02-29 Mitsubishi Electric Corp Input connection terminal of semiconductor device
JPS61255039A (en) * 1985-05-07 1986-11-12 Rohm Co Ltd Semiconductor device
JPH0373438U (en) * 1989-11-21 1991-07-24
US7525190B2 (en) 1998-05-19 2009-04-28 Ibiden Co., Ltd. Printed wiring board with wiring pattern having narrow width portion
US8018046B2 (en) 1998-05-19 2011-09-13 Ibiden Co., Ltd. Printed wiring board with notched conductive traces
US8629550B2 (en) 1998-05-19 2014-01-14 Ibiden Co., Ltd. Printed wiring board with crossing wiring pattern
JP2016195286A (en) * 2010-01-15 2016-11-17 ローム株式会社 Semiconductor device
JP2018139290A (en) * 2018-03-28 2018-09-06 ルネサスエレクトロニクス株式会社 Semiconductor device

Also Published As

Publication number Publication date
JPS6156608B2 (en) 1986-12-03

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