JPS5756935A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5756935A
JPS5756935A JP55132012A JP13201280A JPS5756935A JP S5756935 A JPS5756935 A JP S5756935A JP 55132012 A JP55132012 A JP 55132012A JP 13201280 A JP13201280 A JP 13201280A JP S5756935 A JPS5756935 A JP S5756935A
Authority
JP
Japan
Prior art keywords
arc
semiconductor device
stresses
corners
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55132012A
Other languages
Japanese (ja)
Inventor
Junzo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55132012A priority Critical patent/JPS5756935A/en
Publication of JPS5756935A publication Critical patent/JPS5756935A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)

Abstract

PURPOSE:To avoid the stress concentration and to prevent the induction of defect in a semiconductor device by forming the pattern of an oxidized part in circular-arc or polygonal shape at the corners. CONSTITUTION:To disperse the stresses at the corners of a rectangle, two sides are slowly connected with shorter arc than the circular arc of a quadrant. Or, stresses at one corner is dispersed into a plurality of points with a plurality of obtuse angles. Thus, when a region 6 is oxidized, the stress to the region 7 can be alleviated, the stress concentration at the point 10 can be avoided.
JP55132012A 1980-09-22 1980-09-22 Semiconductor device Pending JPS5756935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55132012A JPS5756935A (en) 1980-09-22 1980-09-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55132012A JPS5756935A (en) 1980-09-22 1980-09-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5756935A true JPS5756935A (en) 1982-04-05

Family

ID=15071466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55132012A Pending JPS5756935A (en) 1980-09-22 1980-09-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5756935A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7525190B2 (en) 1998-05-19 2009-04-28 Ibiden Co., Ltd. Printed wiring board with wiring pattern having narrow width portion
US20180136529A1 (en) * 2015-01-08 2018-05-17 Innolux Corporation Display panels

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135585A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Wiring for electronic components
JPS542666A (en) * 1977-06-08 1979-01-10 Mitsubishi Electric Corp Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135585A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Wiring for electronic components
JPS542666A (en) * 1977-06-08 1979-01-10 Mitsubishi Electric Corp Manufacture of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7525190B2 (en) 1998-05-19 2009-04-28 Ibiden Co., Ltd. Printed wiring board with wiring pattern having narrow width portion
US8018046B2 (en) 1998-05-19 2011-09-13 Ibiden Co., Ltd. Printed wiring board with notched conductive traces
US8629550B2 (en) 1998-05-19 2014-01-14 Ibiden Co., Ltd. Printed wiring board with crossing wiring pattern
US20180136529A1 (en) * 2015-01-08 2018-05-17 Innolux Corporation Display panels

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