JPS52104087A - Preparation of inter-layer insulation film utilized in multi-layer wir ing of electronic parts - Google Patents
Preparation of inter-layer insulation film utilized in multi-layer wir ing of electronic partsInfo
- Publication number
- JPS52104087A JPS52104087A JP1998876A JP1998876A JPS52104087A JP S52104087 A JPS52104087 A JP S52104087A JP 1998876 A JP1998876 A JP 1998876A JP 1998876 A JP1998876 A JP 1998876A JP S52104087 A JPS52104087 A JP S52104087A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulation film
- inter
- preparation
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To obtain an inter-layer insulation film free from contamination, humidity and corrision utilized in an IC etc. by providing Si3N4 films on the upper and lower side of a glass insulation film such as silicate glass.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1998876A JPS52104087A (en) | 1976-02-27 | 1976-02-27 | Preparation of inter-layer insulation film utilized in multi-layer wir ing of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1998876A JPS52104087A (en) | 1976-02-27 | 1976-02-27 | Preparation of inter-layer insulation film utilized in multi-layer wir ing of electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52104087A true JPS52104087A (en) | 1977-09-01 |
Family
ID=12014548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1998876A Pending JPS52104087A (en) | 1976-02-27 | 1976-02-27 | Preparation of inter-layer insulation film utilized in multi-layer wir ing of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52104087A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55157242A (en) * | 1979-05-28 | 1980-12-06 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS562654A (en) * | 1979-06-21 | 1981-01-12 | Nec Corp | Semiconductor device |
JPS56123416U (en) * | 1980-02-22 | 1981-09-19 | ||
JPS5834945A (en) * | 1981-08-26 | 1983-03-01 | Nippon Telegr & Teleph Corp <Ntt> | Multilayer wiring constitution |
JPS5850755A (en) * | 1981-09-21 | 1983-03-25 | Nippon Denso Co Ltd | Semiconductor device |
JPS5893324A (en) * | 1981-11-30 | 1983-06-03 | Nec Corp | Semiconductive device |
JPS58137233A (en) * | 1982-02-09 | 1983-08-15 | Mitsubishi Electric Corp | Semiconductor device |
US4668973A (en) * | 1978-06-19 | 1987-05-26 | Rca Corporation | Semiconductor device passivated with phosphosilicate glass over silicon nitride |
JPS62222674A (en) * | 1985-11-08 | 1987-09-30 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS62248239A (en) * | 1986-04-22 | 1987-10-29 | Nec Corp | Manufacture of semiconductor device |
JPS63236317A (en) * | 1987-03-25 | 1988-10-03 | Toshiba Corp | Manufacture of semiconductor device |
JP2005310915A (en) * | 2004-04-19 | 2005-11-04 | Denso Corp | Semiconductor device |
-
1976
- 1976-02-27 JP JP1998876A patent/JPS52104087A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668973A (en) * | 1978-06-19 | 1987-05-26 | Rca Corporation | Semiconductor device passivated with phosphosilicate glass over silicon nitride |
JPS55157242A (en) * | 1979-05-28 | 1980-12-06 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS562654A (en) * | 1979-06-21 | 1981-01-12 | Nec Corp | Semiconductor device |
JPS56123416U (en) * | 1980-02-22 | 1981-09-19 | ||
JPS5834945A (en) * | 1981-08-26 | 1983-03-01 | Nippon Telegr & Teleph Corp <Ntt> | Multilayer wiring constitution |
JPS5850755A (en) * | 1981-09-21 | 1983-03-25 | Nippon Denso Co Ltd | Semiconductor device |
JPS5893324A (en) * | 1981-11-30 | 1983-06-03 | Nec Corp | Semiconductive device |
JPS58137233A (en) * | 1982-02-09 | 1983-08-15 | Mitsubishi Electric Corp | Semiconductor device |
JPS62222674A (en) * | 1985-11-08 | 1987-09-30 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS62248239A (en) * | 1986-04-22 | 1987-10-29 | Nec Corp | Manufacture of semiconductor device |
JPS63236317A (en) * | 1987-03-25 | 1988-10-03 | Toshiba Corp | Manufacture of semiconductor device |
JP2005310915A (en) * | 2004-04-19 | 2005-11-04 | Denso Corp | Semiconductor device |
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