JPH03109343U - - Google Patents

Info

Publication number
JPH03109343U
JPH03109343U JP1903590U JP1903590U JPH03109343U JP H03109343 U JPH03109343 U JP H03109343U JP 1903590 U JP1903590 U JP 1903590U JP 1903590 U JP1903590 U JP 1903590U JP H03109343 U JPH03109343 U JP H03109343U
Authority
JP
Japan
Prior art keywords
semiconductor device
package
package structure
radio wave
wave absorber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1903590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1903590U priority Critical patent/JPH03109343U/ja
Publication of JPH03109343U publication Critical patent/JPH03109343U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例による半導体素子
のパツケージ構造を示す断面図、第2図は従来の
半導体素子のパツケージ構造を示す断面図である
。 1……パツケージ、2……キヤツプ、3……電
波吸収体層、4……FET、5,6……内部整合
回路である。なお図中同一符号は同一又は相当部
分を示す。
FIG. 1 is a sectional view showing a package structure of a semiconductor device according to an embodiment of the invention, and FIG. 2 is a sectional view showing a conventional package structure of a semiconductor device. 1...Package, 2...Cap, 3...Radio wave absorber layer, 4...FET, 5, 6...Internal matching circuit. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】 半導体素子のパツケージ構造において、 半導体素子を装着する底面以外のパツケージの
内壁全面に、電波吸収体の層を備えたことを特徴
とする半導体素子のパツケージ構造。
[Claims for Utility Model Registration] A package structure for a semiconductor device, characterized in that a layer of a radio wave absorber is provided on the entire inner wall of the package other than the bottom surface on which the semiconductor device is mounted.
JP1903590U 1990-02-26 1990-02-26 Pending JPH03109343U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1903590U JPH03109343U (en) 1990-02-26 1990-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1903590U JPH03109343U (en) 1990-02-26 1990-02-26

Publications (1)

Publication Number Publication Date
JPH03109343U true JPH03109343U (en) 1991-11-11

Family

ID=31522171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1903590U Pending JPH03109343U (en) 1990-02-26 1990-02-26

Country Status (1)

Country Link
JP (1) JPH03109343U (en)

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