JPH03113831U - - Google Patents
Info
- Publication number
- JPH03113831U JPH03113831U JP2409590U JP2409590U JPH03113831U JP H03113831 U JPH03113831 U JP H03113831U JP 2409590 U JP2409590 U JP 2409590U JP 2409590 U JP2409590 U JP 2409590U JP H03113831 U JPH03113831 U JP H03113831U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- cap
- bonding
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 2
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第1図および第2図はそれぞれ本考案の一実施
例の縦断面図および拡大縦断面図。第3図および
第4図は従来のセラミツク基板のシール構造の縦
断面図および拡大縦断面図である。
1……多層セラミツク基板、2……シールリン
グ、3……キヤツプ。
1 and 2 are a longitudinal sectional view and an enlarged longitudinal sectional view, respectively, of an embodiment of the present invention. 3 and 4 are a longitudinal sectional view and an enlarged longitudinal sectional view of a conventional seal structure for a ceramic substrate. 1...Multilayer ceramic substrate, 2...Seal ring, 3...Cap.
Claims (1)
ツプで気密封止するセラミツク基板のシール構造
において、前記セラミツク基板の側面に前記キヤ
ツプを接着するシール部を設けたことを特徴とす
る多層セラミツク基板のシール構造。 A sealing structure for a multilayer ceramic substrate in which a ceramic substrate on which an LSI chip is mounted is hermetically sealed with a cap, characterized in that a sealing part for bonding the cap is provided on a side surface of the ceramic substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2409590U JPH03113831U (en) | 1990-03-09 | 1990-03-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2409590U JPH03113831U (en) | 1990-03-09 | 1990-03-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03113831U true JPH03113831U (en) | 1991-11-21 |
Family
ID=31527070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2409590U Pending JPH03113831U (en) | 1990-03-09 | 1990-03-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03113831U (en) |
-
1990
- 1990-03-09 JP JP2409590U patent/JPH03113831U/ja active Pending