JPS62125779U - - Google Patents

Info

Publication number
JPS62125779U
JPS62125779U JP1342186U JP1342186U JPS62125779U JP S62125779 U JPS62125779 U JP S62125779U JP 1342186 U JP1342186 U JP 1342186U JP 1342186 U JP1342186 U JP 1342186U JP S62125779 U JPS62125779 U JP S62125779U
Authority
JP
Japan
Prior art keywords
case
sealing
resin material
cushioning material
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1342186U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1342186U priority Critical patent/JPS62125779U/ja
Publication of JPS62125779U publication Critical patent/JPS62125779U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例によるＩＣ封止用
樹脂材の梱包ケースを示す斜視図、第２図は従来
のＩＣ封止用樹脂材の梱包ケースを示す斜視図で
ある。 図中、１１はケース、１２は第２の緩衝材、１
３は第２の緩衝材、１４は樹脂材である。 FIG. 1 is a perspective view showing a packaging case for a resin material for IC sealing according to an embodiment of this invention, and FIG. 2 is a perspective view showing a conventional packaging case for a resin material for IC sealing. In the figure, 11 is a case, 12 is a second cushioning material, 1
3 is a second buffer material, and 14 is a resin material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内面に第１の緩衝材を貼着した蓋付のケースと
、このケースの中に装着され、かつ、ＩＣ封止用
の樹脂材を収納してその位置決めをする穴を設け
た第２緩衝材とよりなるＩＣ封止用樹脂材の梱包
ケース。 A case with a lid on which a first cushioning material is adhered to the inner surface, and a second cushioning material that is attached to the case and has a hole for storing and positioning a resin material for IC sealing. A packaging case made of resin material for IC sealing.
JP1342186U 1986-01-30 1986-01-30 Pending JPS62125779U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1342186U JPS62125779U (en) 1986-01-30 1986-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1342186U JPS62125779U (en) 1986-01-30 1986-01-30

Publications (1)

Publication Number Publication Date
JPS62125779U true JPS62125779U (en) 1987-08-10

Family

ID=30802466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1342186U Pending JPS62125779U (en) 1986-01-30 1986-01-30

Country Status (1)

Country Link
JP (1) JPS62125779U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343452A (en) * 1992-06-09 1993-12-24 Mitsubishi Electric Corp Method and apparatus for holding and transferring semiconductor sealing resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343452A (en) * 1992-06-09 1993-12-24 Mitsubishi Electric Corp Method and apparatus for holding and transferring semiconductor sealing resin

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