JPH05343452A - Method and apparatus for holding and transferring semiconductor sealing resin - Google Patents

Abstract

PURPOSE:To safely and efficiently hold a resin tablet while transferring it. CONSTITUTION:Conical protrusions 104 each tapered toward an upper part are arranged in a bottom 102 of a pallet 100, and lower parts of adjacent protrusions 104 are bridged with a partition plate 105. Thus, a small space 106 for individually holding tablets 3 is formed. A flange 108 is provided at an upper edge 101a of a body 101. A groove 108b to be engaged with the edge 102a of a bottom 102 of the other pallet 100 is formed on an upper surface 108a of the flange 108. Accordingly, since the space 106 is wider toward its upper part, the tablet 3 can be easily inserted. The pallet 100 can be safely and easily superposed via the groove 108b. The safely and easily pallet 100 can be conveyed due to the flange 108.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for holding and transferring a semiconductor encapsulating resin which is capable of efficiently holding and transferring a solid semiconductor encapsulating resin (tablet) without damage.

[0002]

2. Description of the Related Art In one of the steps of manufacturing a semiconductor device, which is a step of sealing a semiconductor device with a resin, a resin such as an epoxy resin is pressed into a predetermined cavity of a mold in which the semiconductor device is previously inserted. It is executed by Usually, the resin used in this step is supplied as a solid resin (tablet) obtained by compression molding the powder. In the process of supplying this tablet to the resin sealing step, it is necessary to safely hold the tablet and transfer it to a predetermined position.

By the way, since the tablet is vulnerable to impact and is easily damaged, a technique is required to prevent damage such as chipping or cracking in the process of holding and transferring. JP-A-6
Japanese Patent Laid-Open No. 1-190474 discloses a technique that meets this demand. This technique is shown in FIG.
(Corresponding to the figure), by placing a tray (saucepan) 2 having a plurality of recesses 1 on the upper and lower parts of the tablet 3, the tablet 3 is stored and held,
Further, these are stacked and stored in the packaging container 4.

[0004]

<Problems in the Prior Art> The conventional semiconductor encapsulating resin holding and transferring technology has the following problems because it is configured as described above.

First, the prior art requires both the tray 2 that holds the lower portion of the tablet 3 and the tray 2 that holds the upper portion of the tablet 3, and also needs to store these in the packaging container 4. For this reason, there is a drawback in that the process of housing the tablet 3 or the process of taking it out is complicated and the work efficiency is poor.

Secondly, in the prior art, the trays 2 holding the tablets 3 are simply stacked. For this reason, it is not possible to prevent misalignment of the stacked trays 2, and it is also possible to store the tablets 3 in a stacked state without packing the entire stacked trays 2 in the packing container 4. There was a drawback that you couldn't do it either.

Thirdly, in the conventional technique, when the tablet 3 is housed in the tray 2, it is necessary to insert the tablet 3 into the concave portion 1 accurately, and there is a drawback that precise positioning is required with respect to the insertion position.

Fourthly, in the prior art, the powder of the tablet 3 generated by rubbing between the tablet 3 and the concave portion 1 in the process of transfer is accumulated on the bottom of the tray 2, and the powder is newly stored in the tablet 3. It had the drawback of sticking.

Fifthly, in the prior art, there is no disclosure about a member that allows the tray 2 itself to be gripped, and the tray 2 holding the tablet 3 in the state where the tray 2 is unpacked and the tray 2 is taken out from the packaging container 4 is disclosed. Is not easy to transfer safely. Further, since the tray 2 needs to be stored in the packing container 4, it is difficult to provide the grip portion on the tray 2.

<Object of the Invention> The present invention has been made in order to solve the above problems. First, the process of storing or removing the tablet is simple and the workability is good. In addition, the tablets can be stored and moved after being stacked and stored without packing. Thirdly, there is no need for precise positioning when storing the tablets, and fourthly, the powder of the tablets is newly held. A fifth object of the present invention is to provide a technique for holding and transferring a resin for semiconductor encapsulation, which does not adhere to the tablet and fifthly can be safely and easily transferred while holding the tablet.

[0011]

[Means for Solving the Problems] Claim 1 according to the present invention
The method for holding and transferring a resin for semiconductor encapsulation according to the item (a) is a method of holding and transferring a plurality of resins for semiconductor encapsulation in a predetermined arrangement, and (a) is a step of preparing a pallet, 1) a main body having a bottom surface and side surfaces and having a substantially box-like shape with an open top surface; and (a-2) a space inside the main body, which is arranged along the bottom surface. A partition forming a small space that is substantially equal to each other, and the widths of the respective ones are wider from the bottom surface to the upper portion, and the resin is housed at least one by one in a mutually separated manner. And a step of preparing a pallet having
(B) a step of charging at least one of the plurality of semiconductor sealing resins into each of the small spaces, and (c)
Transferring the pallet while holding the plurality of semiconductor sealing resins in the small space.

A method for holding and transferring a semiconductor sealing resin according to a second aspect of the present invention is a method of holding and transferring a plurality of semiconductor sealing resins in a predetermined arrangement.
(A) a step of preparing a pallet, (a-1) a main body having a bottom surface and side surfaces, and having a substantially box shape with an open top surface; and (a-2) the main body portion. A partition formed by dividing an internal space, arranged along the bottom surface, being substantially equivalent to each other, and accommodating at least one of each of the resins separated from each other, the partition forming a small space. ,
And the main body portion (a-1) has (a-1-1) the bottom surface in which a hole having a shape through which the resin cannot pass is formed in each of the small spaces. And (b) injecting at least one of the plurality of semiconductor encapsulating resins into each of the small spaces, and (c) adding the plurality of semiconductor encapsulating resins to each other. And a step of transferring the pallet while being held in a small space.

A method for holding and transferring a semiconductor sealing resin according to a third aspect of the present invention is a method for holding and transferring a plurality of semiconductor sealing resins in a predetermined arrangement.
(A) a step of preparing a pallet, (a-1) a main body having a bottom surface and side surfaces, and having a substantially box shape with an open top surface; and (a-2) the main body portion. A partition formed by dividing an internal space, arranged along the bottom surface, being substantially equivalent to each other, and accommodating at least one of each of the resins separated from each other, the partition forming a small space. ,
(A-3) a step of preparing a pallet having an outwardly projecting flange provided on the upper edge of the main body,
(B) a step of charging at least one of the plurality of semiconductor sealing resins into each of the small spaces, and (c)
A step of supporting the flange and transferring the pallet while holding the plurality of semiconductor sealing resins in the small space.

According to a fourth aspect of the present invention, there is provided a method for holding and transferring a semiconductor-sealing resin according to the third aspect, wherein the flange (a-
3) In the main body part, (a-3-1) a groove capable of engaging with an edge portion of the bottom surface of the main body part included in another pallet having the same structure as the pallet is formed on the upper surface thereof. An outwardly projecting flange provided on the upper edge of the flange, and (d) by supporting the flange, the edge of the bottom surface is engaged with the groove of the flange provided on the other main body. And a step of stacking a plurality of the pallets by combining them.

The semiconductor sealing resin holding and transferring device according to any one of claims 5 to 8 is suitable for carrying out the semiconductor sealing resin holding and transferring method according to any one of claims 1 to 4. It has a configuration.

[0016]

In the technique for holding and transferring the resin for semiconductor encapsulation according to the present invention, since the inside of the substantially box-shaped main body is partitioned into small spaces that are wider toward the top, when storing the resin in each small space. Moreover, it is not necessary to precisely position the resin (claims 1 and 5).

In the technique for holding and transferring the resin for semiconductor encapsulation according to the present invention, the substantially box-shaped main body is partitioned into small spaces, and the bottom of each small space is provided with a hole through which the resin cannot penetrate. Powder does not accumulate on the bottom of the small space.
(Claims 2 and 6).

In the technique for holding and transferring the semiconductor-sealing resin according to the present invention, since a flange having a shape protruding outward is provided at the upper edge of the substantially box-shaped main body whose interior is partitioned into a small space. By supporting the bottom surface of the flange and moving the main body, while holding the resin in each small space,
It can be transported safely and easily without damage (claims 3 and 7).

Further, in the technique for holding and transferring the resin for semiconductor encapsulation according to the present invention, since the groove which can be engaged with the edge portion of the bottom surface of another main body portion is formed on the upper surface of the flange, the packing work is not required. Therefore, the main body portions can be safely stacked and transferred and stored (claims 4 and 8).

[0020]

[Example] [Example 1. <Structure of Pallet 100> FIGS. 1 and 2 are a partially cut perspective view and a plan view, respectively, of a pallet 100, which is a semiconductor sealing resin holding and transferring device according to a first embodiment of the present invention. The pallet 100 has a main body 101, which has a rectangular bottom surface 102 and side surfaces 103, and is in the shape of a box with an open top surface. On the bottom surface 102, cone-shaped protrusions 104 having a width that narrows toward the top are arranged at equal intervals along two central axes X and Y of the bottom surface 102 that are orthogonal to each other. ing. Desirably, the protrusions 1 are formed on the inner surface of the side surface 103.
A part of 04, for example, a protrusion 104a corresponding to half,
Alternatively, the protruding portion 104b corresponding to four halves is provided. Further, a partition plate 105 that stands upright with respect to the bottom surface 102 is provided so as to bridge between the lower portions of the adjacent protruding portions 104 and 104a. On the bottom surface 102, each small space 106
A hole 107 is provided for each.

These protrusions 104, 104a, 10
4b and the partition plate 105 divide the space inside the main body 101 into small spaces 106 that are substantially equal to each other. The small spaces 106 are arranged at equal intervals along the central axes X and Y by the arrangement of the protrusions 104. In addition, small space 1
The horizontal width of 06 is defined by the shape of the protruding portion 104, and becomes wider toward the upper side.

Along the upper edge 101a of the main body 101,
A flange 108 having a shape projecting outward is provided. On the upper surface 108a of the flange 108, another pallet 100
Groove 10 that can engage the edge 102a of the bottom surface 102 at
8b is provided. Preferably, a resin that is resistant to corrosion and has excellent durability is selected and used as the material of the pallet 100.

<Function of Pallet 100> One or a plurality of tablets 3 are stored in each small space 106.
The tablet 3 is constrained by each small space 106 and is held separately from the tablets 3 housed in the adjacent small spaces 106. For this reason, when the pallet 100 storing the tablet 3 is moved, the tablet 3 is moved to the pallet 1
It is possible to prevent the tablet 3 from being damaged by freely moving around in 00. That is, the pallet 10
By using 0, the tablet 3 can be transferred while being safely held without being damaged.

Further, since the width of the small space 106 becomes wider toward the upper side, the tablet 3 is placed in each small space 1
It is not necessary to precisely determine the relative position between the tablet 3 and the small space 106 at the time of throwing into the 06. That is, it is possible to easily insert the tablet 3 into the small space 106.

Further, a hole 1 is formed on the bottom surface 102 of each small space 106.
Since the tablet 07 is provided, powder of the tablet 3 generated by the tablet 3 rubbing against the protrusion 104, the partition plate 105, or the like in the process of transfer, or dust or dust entering from the outside is deposited on the bottom surface 102. Never. Therefore, since these deposits do not adhere to the tablet 3, there is no risk of causing a deviation in the amount of resin to be sealed or mixing impurities into the sealing resin. Furthermore, since the labor of cleaning the main body 101 can be saved, the work efficiency is also improved. The size and shape of the hole 107 are
The size and shape of the tablet 3 are determined so that the tablet 3 does not drop from the small space 106 through the hole 107.

Since the flange 108 is provided on the upper edge 101a of the main body 101, the pallet 100 can be easily transported by supporting the flange 108. Furthermore, since the flange 108 is provided with the groove 108b, a plurality of pallets 100 can be stacked by engaging the groove 108b and the edge portion 102a with each other as shown in FIG.

FIG. 4 schematically shows how the pallets 100 are conveyed and stacked. In FIG. 4, arrows represent the moving direction of each member. Forklift 21
0 is provided with forks 212a and 212b that slide in a substantially vertical direction along the guide 211. The distance between the two forks 212a and 212b is substantially equal to the lateral width of the side surface 103, and the forks 212a and 212b are the main body 101.
The flange 108 is scooped up so as to sandwich. At this time, the pallet 100 has both forks 212.
It is stably supported by a and 212b. Forklift 21
0 is equipped with wheels 213 for moving the floor surface 10, and can move in any direction and at any distance while supporting the pallet 100 at any height. For example, the pallet 100 is moved to a predetermined position such as on the lift 220.
Of the pallets 100 may be sequentially stacked and placed such that the grooves 108b and the edges 102a engage each other. Conversely, stacked pallets 10
It is also possible to sequentially release the engaged state from 0 and convey each 1 to another predetermined position.

In this way, the flange 10 is attached to the main body 101.
Since the pallet 100 is provided, the pallet 100 can be stably supported and transported, so that the tablet 3 can be transferred safely without damaging the tablet 3.
Moreover, since the plurality of pallets 100 can be engaged with each other, the pallets 100 can be stacked safely without damaging the tablets 3. Further, the stacking does not require the packaging container 4 required in the conventional technique, and therefore the stacking work is simple and easy, and the work efficiency is good. In addition, by stacking, the main body 101 does not have to be provided with a lid.
It is possible to prevent dust and debris from entering from the outside to the inside. In the device 100 of this embodiment, the lid 3 is not required, and since it is not necessary to hold the upper portion and the lower portion of the tablet 3 by using separate trays 2 as in the prior art, the tablet 3 to the main body 101 can be held. Can be efficiently stored and removed.

FIG. 5 is a front sectional view of the pallet 100 showing the tablet 3 held in the small space 106. 5A shows an example in which the tablet 3 having a relatively small diameter is held, and FIG. 5B shows an example in which a tablet 3 having a large diameter and a relatively short length is held. Since the partition plate 105 is provided, the tablet 3 having a small diameter as shown in FIG. 5A can be restrained and held in the small space 106 without protruding from the small space 106. You can Also, the large diameter tablet 3
Then, as shown in FIG. 5B, each small space 10
It is possible to hold a plurality of tablets 3 on top of each other. In this case, since the diameter is large, the upper side 1 of the partition plate 105
Even if the tablet 3 is located above 05a, the tablet 3 is not blocked by the protrusion 104 and does not protrude to the outside of the small space 106.

[Embodiment 2] FIG. 6 is a front view of a pallet 100, which is a semiconductor sealing resin holding and transferring apparatus according to the second embodiment of the present invention. FIG. 6 (b) is shown in FIG.
It is the detailed view which expanded the part of A in (a). In this embodiment, the side surface 103 of the pallet 100 has a substantially rectangular shape whose base is slightly shorter than its top. That is, side surface 1
03 has a certain inclination angle α with the vertical line. Corresponding to this angle, the groove 108b on the upper surface 108a of the flange is provided so that its edge surface 108d forms an inclination angle α with respect to the vertical direction.

FIG. 7 is a front view showing a state in which the two pallets 100 in this embodiment are stacked with the groove 108b and the edge portion 102a engaged with each other. Side 103
When the plurality of pallets 100 are stacked, the pallets 1 and the edge surface 108d have an inclination angle.
The edge portion 1 without precisely determining the relative position of 00s.
02a and the groove 108b can be easily engaged with each other. Further, since the side surface 103 and the edge surface 108d have the same inclination angle, the edge portion 102a can be engaged with the groove 108b without a gap. Therefore, when carrying a plurality of pallets 100 in a stacked state, the pallets 1
00 does not vibrate unnecessarily and the stored tablet 3 is not damaged.

[Embodiment 3] FIG. 8 is a partially cutaway perspective view of a pallet 100, which is a semiconductor sealing resin holding and transferring device according to a third embodiment of the present invention. The pallet 100 of this embodiment has a configuration in which the partition plate 105 is removed from the pallet 100 of the first embodiment shown in FIG. Therefore, in this embodiment, the configuration is simpler than that of FIG. 1, and the pallet 100 can be configured more easily. If the tablet 3 has a sufficiently large diameter, the tablet 3 can be restrained and held in the small space 106 without the partition plate 105. For this reason,
The pallet 100 of this embodiment is a tablet 3 having a large diameter.
Suitable for holding.

[Embodiment 4] FIG. 9 shows a main part of a holding and transferring system 200, which is a holding and transferring device for semiconductor sealing resin, according to a fourth embodiment of the present invention, together with a main part of a carrying device 300 and a main part of a resin sealing device 400. FIG. In FIG. 9, arrows represent the moving direction of each member. The transfer device 300 is a device that supplies the lead frame 20 incorporating the semiconductor device and the tablet 3 to a predetermined position of the lower mold 401 that constitutes the resin sealing device 400. The holding and transfer system 200 is a device that supplies the tablet 3 to the transfer device 300.

The holding and transfer system 200 includes the above-mentioned forklift 210 (FIG. 4), a lift 220, moving devices 230, 240, 250, and a lift 260. A plurality of pallets 100 holding the tablets 3 are stacked on the pedestal 221 of the elevating table 220 by the forklift 210 (FIG. 4). Lifting table 22
The pedestal 221 can be moved in the vertical direction by the action of the hydraulic cylinder 222 of 0. When the pallet 100 is loaded on the pedestal 221, the pedestal 221 is in a relatively low position, and when a predetermined number of pallets 100 are loaded, the bottom surface 102 of the pallet 100 located at the uppermost stage is the moving device 240. It is almost the same height as the top surface of.

The moving device 230 is a driving device (not shown).
The pallet 100 that extends horizontally and is located at the top
By supporting and lifting the flange 108, the engagement state with the lower pallet 100 is released, and the pallet 100 is further extended horizontally and placed on the upper surface of the moving device 240 at a predetermined position. After that, the moving device 230 moves in the opposite direction and returns to the original position. At this time, the moving device 23
0 is removed from the space above the elevator platform 220. In this state, the lift 220 raises the pedestal 221 by the height of one pallet 100. Moving device 240
The pallet 100 placed on the
When the predetermined position of the moving device 240 becomes empty, the above process is repeated to move the pallet 100 newly located at the uppermost stage and place it on the predetermined position of the moving device 240. By repeating the above steps, all the pallets 100 on the pedestal 221 are sequentially moved to the moving device 240.

The moving device 240 intermittently moves the pallet 100 placed on the upper surface horizontally by the action of the moving belt 241. The pallet 100 is placed on the moving device 240 such that the central axes X and Y of the pallet 100 are aligned with the moving direction of the moving belt 241. The moving belt 241 repeats the movement and the temporary stop for each distance corresponding to the distance in the moving direction of the small space 106 of the pallet 100. During the temporary stop, the limbs 311 of the robot 310 included in the transfer device 300 picks up the tablet 3 from the pallet 100 by suction and places it on the transfer unit 320 at a predetermined position. When all the rows of tablets 3 arranged in the direction perpendicular to the moving direction of the moving belt 241 are taken out, the moving belt 241 moves by the predetermined interval and then stops temporarily. And then
The tablets 3 arranged in the next row are sequentially taken out. By repeating this process, all the tablets 3 in the pallet 100 are taken out. Pallet 10
When the inside of 0 is empty, the pallet 100 moves to the moving device 250.
Are moved and are sequentially stacked and placed on the pedestal 261 of the elevating table 260. The moving device 250 has the same configuration as the moving device 230, and the lifting platform 260 is the lifting platform 2.
It has the same structure as 20. The empty pallets 100 loaded on the lift 260 are moved to a predetermined place by the forklift 210. The process of moving the pallet 100 from the moving device 240 to the lifting table 260 by the moving device 250, and the lifting table 2 by the forklift 210.
The process of moving from 60 to a predetermined place is performed by the above-described moving device 230 from the lifting platform 220 to the moving device 240, respectively.
Is performed by the reverse procedure of the process of moving to and the process of moving from the predetermined position by the forklift 210 to the lift table 220.

In addition to the tablet 3, the lead frame 20 is placed on the carrying section 320. The lead frame 20 is mounted on the movable frame supply section 340 via the fixed frame supply section 330. The frame supply unit 340 on which the lead frame 20 is mounted moves in the vertical direction and the horizontal direction, and then stops at a predetermined position. At this time, due to the action of the frame pusher 350, the lead frame 20 above the frame supply section 340 moves horizontally and is placed at a predetermined position of the transport section 320. The transport unit 320 on which the tablet 3 and the lead frame 20 are placed moves horizontally and then
After temporarily stopping in the space above the lower mold 401, the tablet 3 and the lead frame 20 are placed and placed in predetermined positions of the lower mold 401, respectively. When loading and placing are completed,
The transport unit 320 retracts to the original position. After that, lower mold 4
01 is an upper mold (not shown) fixed in the upper space
Ascending toward, the lower die and the upper die are integrated. Thereafter, the resin melted by the heat of the tablet 3 is press-fitted into a predetermined cavity of both molds, so that the semiconductor device incorporated in the lead frame 20 is sealed.

In the system 200 of this embodiment, the moving device 240 intermittently moves the pallet 100 in the direction of the central axis X or Y at intervals at which the tablets 3 are arranged, so that the robot 310 moves the moving device 240. The tablet 3 can always be taken out at a fixed position in the direction. Therefore, the operation of the robot 310 is simple, and the robot 310 and a program that defines the operation are easy to design. In addition, the lift 220 and the lift 2
Since 60 has a vertically movable mechanism, a plurality of pallets 100 can be stacked and placed on these. Therefore, the space required for the sealing work can be saved, and the sealing work can be efficiently performed in a narrower space. The groove 108b provided on the upper surface of the flange 108 enables such stacking to be performed safely and efficiently.
The pallet 100 is easily transported from one process to another process.

[0039]

According to the technique for holding and transferring the resin for semiconductor encapsulation according to the present invention, since the inside of the substantially box-shaped main body is partitioned into small spaces having a width wider toward the upper part, the resin is housed in each small space. In doing so, there is an effect that it is not necessary to precisely position the resin, and the resin can be stored easily (Claims 1 and 5).

In the semiconductor encapsulating resin holding and transferring technique according to the present invention, since holes are provided in the bottom surface of each small space, resin powder and dust entering from the outside do not accumulate on the bottom surface. Therefore, there is an effect that these powders, dusts, and the like adhere to the resin held in the small space to cause a deviation in the amount of the resin, or the resin is not contaminated by foreign matter (claim 2, claim 2). Item 6).

In the technique for holding and transferring the resin for semiconductor encapsulation according to the present invention, since a flange having a shape projecting outward is provided at the upper edge of the main body, the bottom of the flange is supported to move the main body. The resin can be safely and easily transferred without being damaged while being held in each small space (claims 3 and 7).

Further, according to the technique for holding and transferring the resin for semiconductor encapsulation in the present invention, since the groove which can be engaged with the edge portion of the bottom surface of another main body portion is formed on the upper surface of the flange, the main body portions are safely stacked. Can be transported and stored. Therefore, it can contribute to the efficiency of transfer and space saving during storage. Also, since the main body is equipped with a flange, by supporting the bottom surface of the flange and moving the main body, it is possible to stack the resin safely and easily without damaging it while holding it in each small space. It can also be released from the stacked state. Further, by stacking the resins, the resin can be protected from the invasion of dust and garbage from the external space. Furthermore, the main body can be stacked without any packing work, and since it is not necessary to hold the upper and lower portions of the resin by using separate members, respectively, the steps of storing and removing the resin can be performed. It is simple and has high working efficiency (claims 4 and 8).

[Brief description of drawings]

FIG. 1 is a partial cutaway perspective view of an apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the device according to the first embodiment of the present invention.

FIG. 3 is a front view of the device according to the first embodiment of the present invention.

FIG. 4 is a view showing the transportation of the apparatus according to the first embodiment of the present invention,
FIG. 3 is a schematic diagram illustrating a stacking state.

FIG. 5 is a front sectional view of the device according to the first embodiment of the present invention.

FIG. 6 is a front view of the device according to the second embodiment of the present invention.

FIG. 7 is a front view of the device according to the second embodiment of the present invention.

FIG. 8 is a partial cutaway perspective view of an apparatus according to a third embodiment of the present invention.

FIG. 9 is a perspective view of an apparatus according to a fourth embodiment of the present invention.

FIG. 10 is a front sectional view of a conventional device.

[Explanation of symbols]

 3 tablet (resin) 100 pallet (holding and transferring device for semiconductor encapsulation resin) 101 main body 101a upper edge 102 bottom bottom 102a bottom edge 103 side 106 small space 107 hole 108 flange 108a flange top 108b groove X, Y center axis

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toru Kitera 1-1-1, Imajuku Higashi, Nishi-ku, Fukuoka City Mitsubishi Electric Engineering Co., Ltd. LSI Design Center Fukuoka Branch (72) Inventor Yu Koyama Hyogo Prefecture Mizuhohara 4-chome, Itami City Mitsubishi Electric Corporation Kita Itami Works

Claims (8)

[Claims] 1. A method of holding and transferring a plurality of semiconductor encapsulating resins in a predetermined arrangement, comprising: (a) preparing a pallet, comprising (a-1) a bottom surface and side surfaces. A main body having a substantially box shape with an open top surface, and (a-2) a space inside the main body that is divided, arranged along the bottom surface, and substantially equal to each other. hand,
And a step of preparing a pallet having a partition that forms a small space in which the width of each one is so wide as to extend from the bottom surface to the top, and at least one of the resins is stored separately from each other, (B) a step of charging at least one of the plurality of semiconductor encapsulating resins into each of the small spaces, and (c) holding the plurality of semiconductor encapsulating resins in the small spaces. A step of transferring the pallet in the state, and a method of holding and transferring the resin for semiconductor encapsulation. 2. A method for holding and transferring a plurality of semiconductor encapsulating resins in a predetermined arrangement, comprising: (a) preparing a pallet, comprising (a-1) a bottom surface and side surfaces. A main body having a substantially box shape with an open top surface, and (a-2) a space inside the main body that is divided, arranged along the bottom surface, and substantially equal to each other. hand,
And a partition forming a small space for accommodating at least one of the resins separately from each other, and the main body portion (a-1) is (a-1-1) of the small space. A step of preparing a pallet having, for each one, the bottom surface having a hole having a shape through which the resin cannot pass, and (b) each of the plurality of semiconductor encapsulating resins in one of the small spaces. Retaining the semiconductor encapsulating resin, including the steps of introducing at least one of them, and (c) transferring the pallet with the plurality of semiconductor encapsulating resins held in the small space. Transfer method. 3. A method of holding and transferring a plurality of semiconductor encapsulating resins in a predetermined arrangement, comprising: (a) preparing a pallet, comprising (a-1) a bottom surface and side surfaces. A main body having a substantially box shape with an open top surface, and (a-2) a space inside the main body that is divided, arranged along the bottom surface, and substantially equal to each other. hand,
Also, a pallet having a partition forming a small space for accommodating at least one of the above-mentioned resins separately from each other, and (a-3) an outwardly projecting flange provided at the upper end edge of the main body portion. And (b) injecting at least one of the plurality of semiconductor encapsulation resins into each of the small spaces, and (c) adding the plurality of semiconductor encapsulation resins to each other. A method of holding and transferring a resin for semiconductor encapsulation, which comprises a step of supporting the flange and transferring the pallet while being held in a small space. 4. The groove in which the flange (a-3) is (a-3-1) capable of engaging with an edge portion of the bottom surface of the main body portion included in another pallet having the same structure as the pallet. Has an outwardly projecting flange provided on the upper end edge of the main body formed on the upper surface of the main body, and (d) by supporting the flange, the edge of the bottom surface to the other main body. The method for holding and transferring a resin for semiconductor encapsulation according to claim 3, further comprising: stacking a plurality of the pallets by engaging with the groove of the provided flange. 5. An apparatus for holding and transferring a plurality of semiconductor encapsulating resins in a predetermined arrangement, comprising: (a) a main body having a bottom surface and side surfaces and having an open top surface. And (b) the space inside the main body (a) is divided,
Arranged along the bottom surface and being substantially equal to each other, and the width of each one is wider from the bottom surface to the upper portion,
Further, there is provided a semiconductor-encapsulating resin holding and transferring device comprising: a partition forming a small space, the partition containing at least one of the resins separated from each other. 6. A device for holding and transferring a plurality of semiconductor encapsulating resins in a predetermined arrangement, comprising: (a) a main body having a bottom surface and side surfaces and having a substantially box-shaped top surface. And (b) the space inside the main body (a) is divided,
A partition that is arranged along the bottom surface and is substantially equivalent to each other, and that stores at least one of the resins separated from each other and that forms a small space; (A-1) (a-1) A holding and transferring device for a resin for semiconductor encapsulation, comprising: (a-1) each bottom surface having a hole having a shape through which the resin cannot pass. 7. A device for holding and transferring a plurality of semiconductor encapsulating resins in a predetermined arrangement, comprising: (a) a main body having a bottom surface and side surfaces and having an open top surface. And (b) the space inside the main body (a) is divided,
A partition forming a small space, which is arranged along the bottom surface and is substantially equivalent to each other, and which stores at least one of the resins separately from each other; and (c) an upper end of the main body portion. A holding and transferring device for resin for semiconductor encapsulation, comprising an outwardly projecting flange provided on an edge. 8. A semiconductor sealing resin holding / transferring device, wherein the flange (c) comprises (c-1) another device having the same configuration as the device, wherein the bottom surface of the main body portion is provided. 8. The holding and transferring apparatus for semiconductor encapsulating resin according to claim 7, further comprising: an outwardly projecting flange provided on an upper edge of the main body formed on an upper surface of the groove, the groove being engageable with the edge of the resin.