CN218429397U - Automatic plastic packaging equipment for semiconductor - Google Patents

Abstract

The utility model relates to an automatic plastic packaging device for semiconductors, which comprises a base and a sheet arranging device, wherein a first space is arranged in the base; the sheet discharging device is arranged in the first space and comprises a material pushing mechanism, a transfer platform, a first carrying mechanism, a preheating platform and a second carrying mechanism, and the material pushing mechanism is used for pushing the sheets in the material box to the sheet conveying rail; the transfer platform is arranged beside the conveying track and provided with a plurality of temporary storage positions which are arranged in parallel and used for temporarily storing the material sheets; the first conveying mechanism is arranged above the transfer platform and the conveying track in a sliding mode and used for conveying the material sheets to the temporary storage position from the conveying track; the preheating platform is arranged beside the transfer platform and is provided with a plurality of preheating positions for preheating material sheets; the second carrying mechanism is provided with a plurality of transfer stations corresponding to the temporary storage stations, each transfer station can clamp at least one material sheet, and the second carrying mechanism can carry the plurality of material sheets to the preheating platform from the plurality of temporary storage stations which are arranged in parallel.

Description

Automatic plastic packaging equipment for semiconductor

Technical Field

The utility model relates to a semiconductor plastic envelope technical field especially relates to an automatic plastic envelope equipment of semiconductor.

Background

In the current semiconductor plastic packaging factory, workers have the reasons of high temperature, dust, high labor intensity and the like in the operation environment of a plastic packaging workshop, so that on one hand, the labor cost of enterprises is increased; on the other hand, enterprises also face the problems of difficult recruitment and staff management. Therefore, the automation equipment for plastic packaging of semiconductors is applied, material sheets need to be preheated in the sheet arranging module due to the process, in the prior art, the material sheets are pushed to the transfer platform through the material pushing mechanism and are preheated on the transfer platform, and due to the fact that certain time is needed for pushing and preheating of the material sheets, the material sheets on the transfer platform cannot be transferred by the main robot in the preheating process, namely, the material sheets on the transfer platform need to stop moving and wait for materials when being preheated by the main robot, so that the beat of the whole automation plastic packaging equipment is slow, and the production efficiency is further influenced.

SUMMERY OF THE UTILITY MODEL

Therefore, the semiconductor automatic plastic packaging equipment is needed to be provided aiming at the problem that the production efficiency is influenced by slow production beat of the semiconductor automatic plastic packaging equipment in the prior art.

The automatic plastic packaging equipment for the semiconductor comprises a base and a chip arranging device, wherein a first space is arranged in the base; arrange the piece device and locate in the first space, arrange the piece device and include:

the pushing mechanism is used for pushing the material sheets in the material box to the material sheet conveying rail;

the transfer platform is arranged beside the conveying track and provided with a plurality of temporary storage positions which are arranged in parallel and used for temporarily storing the material sheets;

the first conveying mechanism is arranged above the transfer platform and the conveying track in a sliding mode and used for conveying the material sheets from the conveying track to the temporary storage position;

the preheating platform is arranged beside the transfer platform and is provided with a plurality of preheating positions for preheating the material sheets;

the material sheet conveying device is provided with a plurality of conveying stations corresponding to the temporary storage stations, each conveying station can clamp at least one material sheet, and the second conveying mechanism can convey a plurality of material sheets to the preheating platform from the temporary storage stations arranged in parallel.

In some embodiments, the staging platform comprises:

the material sheet conveying device comprises a plurality of transfer slideways arranged side by side, wherein each slideway is provided with two mutually-spaced supporting surfaces for supporting material sheets, the two mutually-spaced supporting surfaces define a plurality of temporary storage positions, and the plurality of temporary storage positions are arranged along the extension direction of the transfer slideways;

the transmission assembly is movably connected to the transfer slide way and can move along the extension direction of the transfer slide way, and the transmission assembly is used for being linked with the material sheets so that the material sheets can move from one temporary storage position to another temporary storage position along the extension direction of the transfer slide way.

In some embodiments, the transmission assembly comprises:

the transmission rod is rotatably connected to the bottom of the transfer slide way;

the driving block is in threaded transmission connection with the transmission rod, and a part of the top surface of the driving block is in sliding fit with the bottom surface of the transfer slideway so as to limit the driving block to rotate around the axis of the transmission rod;

and one end of the positioning pin is fixedly connected to the top surface of the driving block, the other end of the positioning pin is higher than the supporting surface, and the positioning pin is positioned beside the edge of the supporting surface.

In some embodiments, the first carrying mechanism is slidably connected above one end of the transfer chute, and the preheating platform is arranged beside one end of the transfer chute departing from the first carrying mechanism.

In some embodiments, the second handling mechanism includes a plurality of mutually spaced gripping claw portions, the number of the gripping claw portions corresponds to the number of the transfer chute, and the gripping claw portions are used for gripping the material sheets on the transfer chute.

In some embodiments, the base further includes a second space and a third space, the second space, the first space and the third space are sequentially distributed from top to bottom inside the base, and the semiconductor automatic plastic packaging apparatus further includes:

the pressing machine is staggered with the base and is used for plastically packaging the workpiece;

the die sweeping mechanism is movably connected to the press and used for cleaning a die on the press;

the glue removing and boxing module is arranged in the second space, and can remove a pouring channel on the material sheet and place the material sheet in a finished box;

the resin discharging mechanism is arranged in the third space and used for discharging resin;

the main robot, the neighbour the press with the base sets up, the main robot be used for with the tablet is in preheat the platform the press with transport between the box module that goes to glue, the main robot still be used for with resin is in arrange resin mechanism with transport between the press.

In some embodiments, the depolluting cassette module comprises:

the material storage platform is provided with a plurality of material storage positions and is used for storing the plastic-packaged material sheets;

the de-pouring mechanism is arranged at the side of the material storage platform and used for removing pouring channels on the plastic-encapsulated material sheets;

the boxing mechanism is arranged on the side, away from the material storage platform, of the de-watering mechanism, and the boxing mechanism is used for removing the material sheets after watering and placing the material sheets in the finished product box.

In some embodiments, the de-gating mechanism comprises:

the de-pouring mould comprises an upper mould and a lower mould, the lower mould is fixed on the bottom wall corresponding to the first space, the upper mould can move relative to the lower mould, and a pouring channel between the two material sheets is removed through the stamping force between the upper mould and the lower mould;

the first grabbing mechanical arm is arranged on one side of the material storage platform and used for transferring the material sheet from the material storage platform to the lower die.

In some embodiments, the boxing mechanism comprises:

the finished product box storage platform is arranged on the bottom wall corresponding to the second space and used for fixing the finished product box;

the second grabbing mechanical arm is arranged on one side of the finished product box storage platform and used for conveying the material sheet to the inside of the finished product box from the de-watering mechanism.

In some embodiments, the finished box storage platform has two spaced storage locations for storing the finished boxes;

the second grabbing mechanical arm is provided with two mutually-spaced grabbing portions, and the distance between the two grabbing portions corresponds to the distance between the cavities of the finished product boxes on the two storage positions.

In some embodiments, the main robot includes a loading and unloading mechanism for loading and unloading the web and the resin, the loading and unloading mechanism including:

a plurality of clamping assemblies, each clamping assembly comprising a clamping part which can be opened and closed to clamp and release the material sheet;

the feeding assemblies are connected to the clamping assemblies and comprise accommodating cavities for accommodating the resin, and the feeding assemblies are used for feeding the resin in the accommodating cavities.

In some embodiments, the mold sweeping mechanism comprises:

the visual unit is arranged above the plastic package mold and used for detecting the cleaning state of the surface of the plastic package mold;

the cleaning unit is connected to the press in a sliding mode and used for purging the plastic package mold, and the cleaning unit can extend to the upper side of the plastic package mold or can retract to the side of the plastic package mold;

and the control unit is in communication connection with the vision unit and the cleaning unit and responds to the detection result of the vision unit to control the cleaning unit to run or stop.

The utility model has the advantages that:

according to the technical scheme, the automatic plastic packaging equipment for the semiconductor is used for pushing the material sheets in the material boxes to the conveying rail through the material pushing mechanism, so that the material sheets move along with the movement of the conveying rail, and then the material sheets move to the side of the transfer platform, and therefore the material sheets are conveniently conveyed to the temporary storage position on the transfer platform by the first conveying mechanism from the conveying rail. The preheating platform is arranged beside the transfer platform, and the material sheets are conveyed to the preheating platform through the second conveying mechanism so as to be preheated. Because in prior art, promote the tablet to the transfer orbit through pushing equipment on, then through the manipulator with the tablet from the transfer orbit on transporting to the transfer platform to and the transfer orbit all needs time to the removal of tablet, and heat the tablet on the transfer platform, often to the preheating time of tablet with the preheating time of last tablet as the standard, so preheating in-process, the main robot just needs the preheating time of waiting for the tablet to satisfy the demands just can transport. And this technical scheme has set up the preheating platform that is used for preheating specially at the side of transfer platform, once can once transport the tablet on the position of keeping in that a plurality of flat rows were arranged to preheating the platform through second transport mechanism for preheat the platform and preheat a plurality of tablets simultaneously, transfer platform and delivery track transport the tablet. The material waiting time of the main robot is reduced through the synergistic effect of the material pushing mechanism, the transfer platform, the first carrying mechanism, the preheating platform and the second carrying mechanism, so that the production beat of the whole semiconductor automatic plastic packaging equipment is improved, and the production efficiency is further improved.

Drawings

Fig. 1 is a schematic structural diagram of a chip arranging device of an automatic semiconductor plastic packaging apparatus provided in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a chip arranging device of the semiconductor automatic plastic packaging equipment provided by the embodiment of the present invention;

fig. 3 is a schematic structural diagram of a pushing mechanism side in a sheet arranging device of the semiconductor automatic plastic packaging equipment provided by the embodiment of the present invention;

fig. 4 is a schematic structural diagram of a conveying track in a sheet arranging device of the semiconductor automatic plastic packaging equipment provided by the embodiment of the present invention;

fig. 5 is a schematic structural diagram of a transfer platform in a sheet arranging device of the semiconductor automatic plastic packaging equipment provided by the embodiment of the present invention;

fig. 6 is a schematic structural diagram of a first conveying mechanism in a sheet arranging device of the semiconductor automatic plastic packaging equipment according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of an automatic semiconductor plastic packaging device provided in an embodiment of the present invention;

fig. 8 is a schematic view of a three-dimensional structure of the layout of each mechanism in the base of the semiconductor automatic plastic packaging device provided by the embodiment of the present invention;

fig. 9 is a schematic plan structure diagram of the layout of the mechanisms in the base of the semiconductor automatic plastic packaging apparatus provided by the embodiment of the present invention;

fig. 10 is a schematic perspective view of the layout of the mechanisms in the base of the semiconductor automatic plastic packaging device according to the embodiment of the present invention;

fig. 11 is a schematic view of a three-dimensional structure of a glue removing and box packing module in the semiconductor automatic plastic packaging device provided by the embodiment of the present invention;

fig. 12 is a schematic structural diagram of a material storage platform in the semiconductor automatic plastic packaging apparatus provided in the embodiment of the present invention;

fig. 13 is a schematic structural view of a finished product box storage platform in a glue removal and box packing module in the semiconductor automatic plastic packaging equipment provided by the embodiment of the present invention;

fig. 14 is a schematic structural view of a de-runner mold in a de-glue boxing module in the semiconductor automatic plastic packaging equipment according to the embodiment of the present invention;

fig. 15 is a schematic structural diagram of a main robot in the semiconductor automatic plastic packaging apparatus according to an embodiment of the present invention;

fig. 16 is a schematic structural diagram of a press and a mold cleaning mechanism in the semiconductor automatic plastic packaging apparatus provided by the embodiment of the present invention;

fig. 17 is a schematic structural diagram of a resin discharging mechanism in the semiconductor automatic plastic packaging apparatus according to an embodiment of the present invention.

A base 10; a first space 101; a second space 102; a third space 103; a first base plate 104; a second base plate 105;

a sheet arranging device 20; a material pushing mechanism 201; a transit platform 202; a transfer chute 2021; a bearing surface 2022; a drive assembly 2023; a drive link 2023a; a drive block 2023b; an end plate 2024; a first conveyance mechanism 203; a guide rail 2031; a preheating stage 204; preheat bit 2041; the second conveyance mechanism 205; a transfer station 2051; a conveying track 206;

a press 30; a plastic package mold 301;

a mold cleaning mechanism 40; a vision unit 401; a cleaning unit 402;

a glue removal and box packing module 50; a material storage platform 501; a material storage location 5011; a de-gating mechanism 502; the de-gating mold 5021; an upper die 5021a; a lower die 5021b; a first grabbing robot 5022; a casing mechanism 503; a finished cartridge storage platform 5031; storage bay 5031a; a second grasping robot arm 5032;

a resin discharge mechanism 60;

a main robot 70; a gripping assembly 701; a charging assembly 702; a magazine 80.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

Referring to fig. 1-17, fig. 1 shows a schematic structural diagram of a sheet arranging device of a semiconductor automatic plastic packaging apparatus provided by an embodiment of the present invention, and an embodiment of the present invention provides a semiconductor automatic plastic packaging apparatus, which includes a base 10 and a sheet arranging device 20, wherein a first space 101 is provided inside the base 10; the sheet arranging device 20 is arranged in the first space 101, the sheet arranging device 20 comprises a material pushing mechanism 201, a transfer platform 202, a first conveying mechanism 203, a preheating platform 204 and a second conveying mechanism 205, and the material pushing mechanism 201 is used for pushing the sheets in the material box 80 to a sheet conveying track 206; the transfer platform 202 is arranged beside the conveying track 206, and the transfer platform 202 has a plurality of temporary storage positions arranged in parallel for temporarily storing the material sheets; the first conveying mechanism 203 is arranged above the transfer platform 202 and the conveying track 206 in a sliding manner, and the first conveying mechanism 203 is used for conveying the material sheets from the conveying track 206 to the temporary storage position; the preheating platform 204 is arranged beside the transfer platform 202, and the preheating platform 204 is provided with a plurality of preheating positions 2041 for preheating material sheets; the second conveying mechanism 205 has a plurality of transfer stations 2051 corresponding to the buffer stations, each transfer station 2051 can clamp at least one material sheet, and the second conveying mechanism 205 can convey a plurality of material sheets from the buffer stations arranged in parallel to the preheating platform 204.

According to the automatic semiconductor plastic packaging equipment provided by the technical scheme, the material sheets in the material boxes 80 are pushed to the conveying rail 206 through the material pushing mechanism 201, so that the material sheets move along with the movement of the conveying rail 206, and then the material sheets move to the side of the transfer platform 202, and therefore the material sheets are conveniently conveyed to the temporary storage positions on the transfer platform 202 from the conveying rail 206 by the first conveying mechanism 203. The preheating platform 204 is disposed beside the transfer platform 202, and the web is conveyed onto the preheating platform 204 by the second conveying mechanism 205, so as to preheat the web. In the prior art, the material sheets are pushed to the conveying rail 206 by the material pushing mechanism 201, then the material sheets are transferred from the conveying rail 206 to the transfer platform 202 by the manipulator, and the time is required for the movement of the material sheets by the conveying rail 206, while the material sheets are heated on the transfer platform 202, the preheating time of the material sheets is usually determined by the preheating time of the last material sheet, so that the main robot 70 needs to wait for the preheating time of the material sheets to meet the requirement for transferring in the preheating process. And this technical scheme has set up the preheating platform 204 that is used for preheating specially at the side of transfer platform 202, can once transport the tablet on the position of keeping in that a plurality of parallel arranged to preheat the platform 204 through second handling mechanism 205 for preheat the platform 204 and preheat a plurality of tablets simultaneously, transfer platform 202 and delivery track 206 transport the tablet. That is, the material waiting time of the main robot 70 is reduced by the synergistic effect of the material pushing mechanism 201, the transfer platform 202, the first carrying mechanism 203, the preheating platform 204 and the second carrying mechanism 205, so that the production takt of the whole semiconductor automatic plastic packaging equipment is improved, and further, the production efficiency is improved.

The plastic-packaged workpiece of the semiconductor automatic plastic-packaging equipment is not limited, and a lead frame is taken as an example in the present embodiment. In the present embodiment, as shown in fig. 9, a cavity is provided in the frame of the base 10, and the cavity of the frame is partitioned into a second space 102, a first space 101, and a third space 103 from top to bottom by a first bottom plate 104 and a second bottom plate 105. The sheet arranging device 20 is disposed in the first space 101, and a magazine 80 for placing lead frames is disposed in the first space 101 on the left side as shown in fig. 2, and the magazines 80 are sequentially placed from the front of the left side of the first space 101 to the back. When the openings of the magazine 80 are aligned with the end portions of the conveying rails 206, the material pushing mechanism 201 pushes the lead frames on the first layer at the lowest position of the magazine 80 onto the conveying rails 206 from one end of the magazine 80, which is away from the conveying rails 206, then the magazine 80 descends, so that the lead frames on the second layer are exactly aligned with the plane of the conveying rails 206, and then the lead frames on the second layer are continuously pushed by the material pushing mechanism 201. When all the lead frames in the magazine 80 are pushed, the magazine 80 descends to the bottommost part of the first space 101, and the front magazine 80 is pushed to be aligned with the conveying rail 206, so that the pushing mechanism 201 pushes the lead frames in the magazine 80 aligned with the conveying rail 206. As for the conveying track 206, it is a conventional track for conveying lead frames, and will not be described herein.

In some embodiments, as shown in fig. 1-2 and fig. 5, the transfer platform 202 includes a plurality of transfer chutes 2021 disposed side by side, each having two spaced supporting surfaces 2022 for supporting the web, and a driving assembly 2023 for driving the lead frame to slidably move along the temporary storage, each having two spaced supporting surfaces 2022 for supporting the web, the two spaced supporting surfaces 2022 defining a plurality of temporary storage locations, the plurality of temporary storage locations being disposed along an extending direction of the transfer chutes 2021; the transmission assembly 2023 is movably connected to the transfer chute 2021 and can move along the extension direction of the transfer chute 2021, and the transmission assembly 2023 is configured to be linked with the material sheets so as to move the material sheets from one temporary storage location to another temporary storage location along the extension direction of the transfer chute 2021.

It should be noted that, in the present embodiment, the extending direction of all the transfer chutes 2021 is the same as the extending direction of the conveying rails, that is, all the transfer chutes 2021 and the conveying rails are arranged side by side, as shown in fig. 9, and the transfer chutes 2021 and the conveying rails extend along the left and right direction of the first space 101. The magazine 80 and the preheating stage 204 are respectively provided at both ends of the transfer chute 2021 in the extending direction. Specifically, as shown in fig. 5, each transfer chute 2021 includes two spaced structural members, each structural member is provided with an L-shaped groove along an extending direction thereof, the grooves on the two structural members are oppositely disposed, and a plane along a horizontal plane on the L-shaped groove is a supporting plane 2022. A bracket is respectively arranged at two ends of the structural member, and one end of the bracket is fixed on the second bottom plate 105, so that a certain accommodating space is formed between the structural member and the second bottom plate 105, and other parts can be conveniently arranged. The both ends of structure are connected respectively on the support, and the support is used for the supporting structure spare. The support surfaces 2022 of the two structural members define temporary storage locations for supporting the lead frames, and as shown in fig. 5, two temporary storage locations are disposed on the same transfer slide 2021 along the extending direction thereof, that is, two lead frames can be temporarily stored on one transfer slide 2021 along the extending direction thereof.

The transmission assembly 2023 may be disposed above the transfer chute 2021, or may be disposed below the transfer chute 2021 or at another position. In the present embodiment, as shown in fig. 1-2 and 5, the transmission assembly 2023 is integrally disposed below the transfer chute 2021, that is, the transmission assembly 2023 is disposed between the support structure and the second base plate 105. A portion of the transmission assembly 2023 is movable along the extending direction of the transfer slide 2021, so that the lead frame placed on the transfer slide 2021 is driven by the driving force of the transmission assembly 2023 to move from one temporary storage location to the next temporary storage location along the extending direction of the transfer slide 2021.

Specifically, as shown in fig. 5, the transmission assembly 2023 includes a transmission rod 2023a, a driving block 2023b, and a positioning pin, the transmission rod 2023a is rotatably connected to the bottom of the transfer chute 2021; the driving block 2023b is in threaded transmission connection with the transmission rod 2023a, and a part of the top surface of the driving block 2023b is in sliding fit with the bottom surface of the transfer slideway 2021 so as to limit the rotation of the driving block 2023b around the axis of the transmission rod 2023a; one end of the positioning pin is fixedly connected to the top surface of the driving block 2023b, the other end of the positioning pin is higher than the supporting surface 2022, and the positioning pin is located beside the edge of the supporting surface 2022. The transmission rod 2023a is provided with an external thread, the driving block 2023b is provided with an internal thread, and a part of the top surface of the driving block 2023b is in sliding fit with the bottom surface of the structural member constituting the transfer chute 2021, so that the bottom surface of the structural member can abut against the driving block 2023b, and further the driving member is limited to rotate around the axis of the transmission rod 2023a, so that the rotation of the transmission rod 2023a around the axis thereof is converted into the linear movement of the driving rod along the axis of the transmission rod 2023 a. Two ends of the transmission rod 2023a are respectively and rotatably connected to two brackets of the transfer chute 2021, so that the driving block 2023b moves along the extending direction of the transfer chute 2021. A positioning pin is provided on the driving block 2023b so that the positioning pin can move in accordance with the movement of the driving block 2023 b. The end of the positioning pin, which is away from the driving block 2023b, is set to be higher than the supporting surface 2022, so that the higher portion of the positioning pin can be inserted into the pin hole on the lead frame, thereby realizing the connection between the positioning pin and the lead frame. With this arrangement, when the dowel pins move along the transfer slide 2021 along with the drive block 2023b, the lead frame can move from one temporary storage location to the next temporary storage location along the extending direction of the dowel pins along the transfer slide 2021.

In some embodiments, the first transporting mechanism 203 is slidably connected above one end of the transit chute 2021, and the preheating platform 204 is disposed on a side of the transit chute 2021 facing away from the end of the first transporting mechanism 203.

Specifically, as shown in fig. 1-2 and fig. 6, a guide rail 2031 assembly is disposed above a side of the transfer chute 2021 facing one end of the magazine 80 storage area, wherein the guide rail 2031 assembly includes two end plates 2024, a connector and a guide rail 2031, the two end plates 2024 are respectively fixed on the second base plate 105, and two ends of the connector are respectively connected with the two end plates 2024, so that a stable whole is formed between the two end plates 2024. In this embodiment, two spaced connectors are provided, and the extending direction of the two connectors is perpendicular to the extending direction of the transfer chute 2021. Two ends of the guide rail 2031 are fixedly connected to the two end plates 2024, respectively, and the extending direction of the guide rail 2031 is perpendicular to the extending direction of the transit chute 2021. The first conveying mechanism 203 is slidably connected to the guide rail 2031, so that the first conveying mechanism 203 can move from the position of the conveying rail 206 to the position of the foremost transfer chute 2021. In this embodiment, only one conveying rail 206 is provided, so that only one clamping station is provided on the first handling mechanism 203, that is, only one lead frame can be transported by one first handling mechanism 203. Of course, in other embodiments, a plurality of conveying rails 206 may be arranged side by side, and a plurality of clamping stations corresponding to the number of the conveying rails 206 are arranged on the first handling mechanism 203, so that the lead frames on the plurality of conveying rails 206 can be transferred to the plurality of transfer chutes 2021 at one time. The specific structure of the first carrying mechanism 203 may be conventional, and will not be described herein. The preheating platform 204 is disposed beside the end of the transfer slide 2021 departing from the first carrying mechanism 203, so as to prevent interference between the second carrying mechanism 205 and the first carrying mechanism 203, and further make the space arrangement of the entire sheet arranging device 20 more reasonable and the operation more stable and reliable.

In some embodiments, the second conveying mechanism 205 includes a plurality of claw portions spaced from each other, the number of the claw portions corresponding to the number of the transfer chute 2021, and the claw portions are configured to grip the material sheets on the transfer chute 2021. The second conveying mechanism 205 is used to convey the lead frame on the end of the relay chute 2021 away from the first conveying mechanism 203. A plurality of claw portions are provided on the second conveying mechanism 205, and the number of the claw portions corresponds to the number of the relay slide ways 2021, so that the second conveying mechanism 205 can convey all the lead frames on the side of the relay slide ways 2021 close to the preheating stage 204 onto the preheating stage 204 at a time. Therefore, the production efficiency is improved, and the preheating beat of the lead frame on the whole preheating platform 204 can be reduced, so that the waiting time of the main robot 70 is saved, and the production beat of the plastic packaging equipment of the whole semiconductor automation equipment is improved.

As will be understood with reference to fig. 1-9, the overall operation of the sheet discharge device 20 is: the material pushing mechanism 201 pushes the lead frames in the material box 80 to the conveying rail 206, then the lead frames are conveyed to the transfer slide 2021 through the first conveying mechanism 203, and the lead frames are moved to a station close to the preheating platform 204 from a temporary storage position departing from the preheating platform 204 through the transmission assembly 2023. The lead frames on the plurality of transfer chutes 2021 are then conveyed onto the preheating platform 204 by the second conveying mechanism 205. The plurality of lead frames are then preheated by the preheating stage 204. It should be noted that the number of the preheating stations 2041 on the preheating platform 204 is the same as the number of the plastic packaging stations on the plastic packaging press 30, and is also the same as the number of the clamping portions of the main robot 70. This allows the main robot 70 to transfer all the lead frames on the preheating stage 204 to the molding die 301 at one time. Through setting up like this, the transportation track, first transport mechanism 203, transfer platform 202, second transport mechanism 205 and preheat platform 204 and respectively play its own duties, each other do not influence to make main robot 70 need not to wait for the transport of the lead frame on the transfer slide 2021, only need according to preheat the condition of the lead frame on the platform 204 come to the lead frame transport can, thereby saved post robot and transported the beat, also improved the production efficiency of whole semiconductor automation plastic envelope equipment.

In some embodiments, as will be understood by referring to fig. 7 to 9, the base 10 further includes a second space 102 and a third space 103, the second space 102, the first space 101 and the third space 103 are sequentially distributed from top to bottom inside the base 10, the semiconductor automatic plastic packaging apparatus further includes a press 30, a mold cleaning mechanism 40, a glue removing and packaging module 50, a resin discharging mechanism 60 and a main robot 70, wherein the press 30 is disposed in a staggered manner from the base 10 for plastic packaging of the workpiece; the die sweeping mechanism 40 is movably connected to the press 30 and used for cleaning the die on the press 30; the glue removal and box packing module 50 is arranged in the second space 102, and the glue removal and box packing module 50 can remove a runner on a material sheet and place the material sheet in a finished box; the resin discharge mechanism 60 is provided in the third space 103 for discharging the resin; a main robot 70 is disposed adjacent to the press 30 and the base 10, the main robot 70 being used to transfer the web between the preheating station 204, the press 30 and the depolluting cassette module 50, the main robot 70 also being used to transfer resin between the resin discharge mechanism 60 and the press 30.

The glue removing and packaging box module 50, the sheet arranging mechanism and the resin arranging mechanism 60 are respectively arranged in a second space 102, a first space 101 and a third space 103 in the height direction of the base 10, so that the main robot 70 is convenient to transport on the one hand, and the space is saved on the other hand, and further the whole semiconductor automatic plastic packaging equipment is compact in structure, small in occupied area and space-saving. The press 30 and the base 10 are arranged in a staggered manner so that a space is provided between the press 30 and the base 10, so that the main robot 70 can be arranged to facilitate the transfer of the lead frame between the base 10 and the press 30 by the main robot 70. The mold on the press 30 is cleaned through the mold cleaning mechanism, so that the automation degree of the whole plastic packaging equipment is improved. Through setting up the box module 50 that removes to glue, realize the function of automatic pouring water and automatic dress box, also improved the degree of automation of whole plastic envelope equipment to can save the manual work.

Further, as will be understood by referring to fig. 10 to 14, the glue removal and boxing module 50 includes a material storage platform 501, a de-watering mechanism 502 and a boxing mechanism 503, wherein the material storage platform 501 has a plurality of material storage positions 5011 for storing the plastic-encapsulated material sheets; the de-pouring mechanism 502 is arranged at the side of the material storage platform 501, and the de-pouring mechanism 502 is used for removing pouring channels on the plastic-encapsulated material sheets; the boxing mechanism 503 is arranged at the side of the de-pouring mechanism 502 departing from the material storage platform 501, and the boxing mechanism 503 is used for placing the material sheets with the pouring channels removed in a finished product box. The lead frame after plastic packaging is transferred to a material storage platform 501 through a main robot 70, and a runner of the lead frame generated in the plastic packaging process is removed through a runner removing mechanism 502. Finally, the leadframe after the sprue is removed from the sprue removing mechanism 502 is placed into a finished box through a boxing mechanism 503. Through the structural form, the lead frame without the pouring channel can be directly loaded into a finished product box, so that the labor is saved, and the automation degree of plastic packaging equipment is improved.

Specifically, as will be understood with reference to fig. 10 to 14, the degating mechanism 502 includes a degating mold 5021 and a first gripper robot 5022, the degating mold 5021 includes an upper mold 5021a and a lower mold 5021b, the lower mold 5021b is fixed on the corresponding bottom wall of the first space 101, the upper mold 5021a is movable relative to the lower mold 5021b, and the gate between the two webs is removed by the punching force between the upper mold 5021a and the lower mold 5021b; a first gripping robot 5022 is provided at one side of the material storage platform 501, and the first gripping robot 5022 is used to transfer the material sheet from the material storage platform 501 to the lower mold 5021 b. The lead frame placed on the material storage platform 501 is transferred onto the lower mold 5021b by the first grabbing robot 5022, and then the upper mold 5021a is moved so that the upper mold 5021a acts on the runner on the lead frame, and the runner is removed by the punching force. It should be noted that in the present embodiment, one plastic mold 301 can simultaneously mold two lead frames, so that the two lead frames share one runner. That is, the two lead frames are connected together by a runner after molding. Accordingly, the first grasping robot 5022 simultaneously grasps two lead frames, and the de-watering mold 5021 is also used to remove the watering between the two lead frames, and the boxing mechanism 503 can simultaneously load the two lead frames into two product boxes, respectively. It should be noted that the material storage platform 501 is provided with material storage positions 5011 corresponding to the number of the plastic package molds 301 in the press 30, and each material storage position 5011 can store two lead frames.

In some embodiments, as will be understood with reference to fig. 10-14, the boxing mechanism 503 includes a finished product cartridge storage platform 5031 and a second grabbing robot 5032, the finished product cartridge storage platform 5031 is disposed on the corresponding bottom wall of the second space 102 for fixing the finished product cartridge; a second grabbing robot 5032 is arranged at one side of the finished product box storage platform 5031, and the second grabbing robot 5032 is used for transferring the material sheets from the de-watering mechanism 502 to the finished product box. The leadframe after the degating on the degating mechanism 502 is transferred to a finished box by the second grabbing mechanical arm 5032, so as to complete the lead frame boxing process.

In this embodiment, as will be understood by referring to fig. 10-14, the finished product cartridge storage platform 5031 has two spaced storage locations 5031a for storing the finished product cartridges; the second gripper robot 5032 is provided with two spaced gripping portions, and the distance between the two gripping portions corresponds to the distance between the cavities of the product boxes at the two storage locations 5031 a. The two storage locations 5031a are used for storing finished product boxes, and specifically, a positioning structure may be disposed on the file storage device to fix the finished product boxes when the packaging packages are placed on the storage locations 5031a, and when the second grabbing mechanical arm 5032 puts the lead frames into the finished product boxes, the positions of the finished product boxes are fixed, so that the whole boxing process can be smoothly performed. Two grabbing parts on the second grabbing robot 5032 correspond to the positions of two lead frames on the degating mold 5021, so that the second grabbing robot 5032 can grab the two lead frames on the degating mold 5021 at the same time; the distance between the grasping portions of the second grasping arm 5032 is set to correspond to the distance between the cavities of the finished product cassettes at the two storage locations 5031a, so that the second grasping arm 5032 can just place two lead frames into the finished product cassettes, and the lead wire boxing process is smoothly completed.

In some embodiments, as will be understood in reference to fig. 15, the main robot 70 includes a loading and unloading mechanism for loading and unloading the material sheet and the resin, the loading and unloading mechanism includes a plurality of gripping assemblies 701 and a plurality of feeding assemblies 702, the gripping assemblies 701 include gripping portions that can be opened and closed to grip and release the material sheet; the feeding assembly 702 is connected to the clamping assembly 701, the feeding assembly 702 includes a containing cavity for containing resin, and the feeding assembly 702 is used for feeding the resin in the containing cavity. Through getting subassembly 701 and throwing material subassembly 702 to press from both sides and getting the integration together, when carrying out the plastic envelope to the lead frame, accessible clamp get subassembly 701 with the lead frame from preheating platform 204 transport to plastic envelope mould 301 on the back, directly throw the resin material into plastic envelope mould 301 through the material subassembly 702 of throwing that is connected with pressing from both sides the subassembly 701, in the whole process, the robot only need move to plastic envelope mould 301 department once from preheating platform 204, just can realize the input of the transport of lead frame and plastic envelope material. The material transfer process is saved, and the material transfer time is saved, so that the production efficiency can be improved, and the productivity is improved. It should be noted that, in the present embodiment, each of the clamping assemblies 701 includes two clamping portions, and each of the clamping portions can clamp one lead frame, that is, one clamping assembly 701 can clamp one lead frame. The number of the clamping assemblies 701 may be determined according to the number of the plastic molds 301 on the press 30. For example, if 4 plastic molds 301 are disposed on one press 30, and each plastic mold 301 includes a cavity for molding two lead frames, 4 clamping assemblies 701 need to be disposed on one main robot 70. The number of the feeding assemblies 702 is consistent with the number of the clamping portions, so that each feeding assembly 702 feeds one cavity in one plastic mold 301.

In some embodiments, as will be understood with reference to fig. 16, the mold cleaning mechanism 40 includes a vision unit 401, a cleaning unit 402, and a control unit, the vision unit 401 is disposed above the plastic mold 301, and the vision unit 401 is used for detecting the cleaning state of the surface of the plastic mold 301; the cleaning unit 402 is slidably connected to the press 30, the cleaning unit 402 is used for purging the plastic package mold 301, and the cleaning unit 402 can extend above the plastic package mold 301 or the cleaning unit 402 can retract to the side of the plastic package mold 301; the control unit is in communication connection with both the vision unit 401 and the cleaning unit 402, and controls the cleaning unit 402 to operate or stop in response to the detection result of the vision unit 401. A vision unit 401 is provided in the plastic mold 301 cleaning mechanism for detecting the cleaning state of the surface of the plastic mold 301, and the vision unit 401 can feed back the detected cleaning state to the control unit, which controls the operation of the cleaning element according to the result of the cleaning state detected by the vision unit 401. The cleaning unit 402 is arranged to slide relative to the plastic package pressing machine 30, and when the surface of the plastic package mold 301 needs to be cleaned, the cleaning unit 402 extends to the upper side of the plastic package mold 301 to clean the plastic package mold 301; after the plastic mold 301 is cleaned, the cleaning unit 402 is retracted to the side of the plastic mold 301 to provide a necessary operation space for the plastic molding process of the plastic mold 301. Through visual unit 401, clean unit 402 and the synergistic effect of control unit, clean plastic envelope mould 301 automatically, accessible visual unit 401 not only feeds back clean state, and then reduces the risk that the clean out-of-position leads to the card material, simultaneously, still can replace the manual work to clean to improve the mould and clean the degree of automation of process.

The embodiment of the utility model provides an automatic plastic envelope equipment of semiconductor's theory of operation as follows:

the sheet discharging device 20, the press 30, the glue removal and box filling module 50 and the resin discharging mechanism 60 operate independently to complete the respective functions.

The material pushing mechanism 201 pushes the lead frames in the material box 80 to the conveying rail 206, the first conveying mechanism 203 conveys the lead frames on the conveying rail 206 to the transfer platform 202, the transmission assembly 2023 on the transfer platform 202 conveys the lead frames from one end to the other end, and then the second conveying mechanism 205 conveys a plurality of lead frames to the preheating platform 204 at a time for preheating. The plastic package mold 301 in the press 30 is responsible for plastic package of the lead frame; the mold cleaning mechanism 40 is responsible for cleaning the plastic package mold 301 after the primary plastic package is finished; the resin discharge mechanism 60 is responsible for placing resin; the glue removing and box packing module 50 is responsible for removing the pouring channel on the lead frame after plastic package, and putting the lead frame finished product after pouring channel removal into a finished product box. In the whole process, the main robot is used for loading and unloading materials (including lead frames and resin) among the modules, and particularly, the main work flow of the main robot is as follows:

since the plastic package mold 301 needs a certain time in the process of plastic packaging the lead frame, at this time, the feeding and discharging mechanism of the main robot 70 moves to the resin discharging mechanism 60, the resin is put into the feeding assembly 702 in the feeding and discharging mechanism by other manipulators, and after the feeding and discharging mechanism of the main robot 70 is placed with the resin, the plastic package mold 301 basically completes one-time plastic package and opens the mold. At this time, the clamping assembly 701 in the loading and unloading mechanism of the main robot 70 clamps the lead frame which is already plastic-packaged on the plastic-packaging mold 301, and transfers the lead frame to the material storage platform 501. Then, the feeding and discharging mechanism of the main robot 70 moves to the preheating platform 204 of the sheet arranging device 20, and the preheated lead frames are clamped by the clamping assembly 701. The loading and unloading mechanism of the main robot 70 transfers the lead frame to the plastic mold 301, and then the resin is injected into the plastic mold 301 through the injecting assembly 702. And repeating the steps to complete the plastic package of the lead frame. Through the operation of the main robot 70, the whole plastic packaging process is orderly carried out, the production rhythm of the whole plastic packaging process is more compact, the utilization rate of each module is higher, and the production efficiency of the whole semiconductor automatic plastic packaging equipment is higher.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. The automatic plastic packaging equipment for the semiconductor is characterized by comprising a base and a chip arranging device, wherein a first space is arranged in the base; arrange the piece device and locate in the first space, arrange the piece device and include:

the pushing mechanism is used for pushing the material sheets in the material box to the material sheet conveying rail;

the transfer platform is arranged beside the conveying track and provided with a plurality of temporary storage positions which are arranged in parallel and used for temporarily storing the material sheets;

the first conveying mechanism is arranged above the transfer platform and the conveying track in a sliding mode and used for conveying the material sheets from the conveying track to the temporary storage position;

the preheating platform is arranged beside the transfer platform and is provided with a plurality of preheating positions for preheating the material sheets;

the second transport mechanism is provided with a plurality of transfer stations corresponding to the temporary storage positions, each transfer station can clamp at least one material sheet, and the second transport mechanism can transport a plurality of material sheets to the preheating platform from the temporary storage positions arranged in parallel.

2. The automated semiconductor plastic packaging apparatus of claim 1, wherein the transfer platform comprises:

the material sheet conveying device comprises a plurality of transfer slideways arranged side by side, wherein each slideway is provided with two mutually-spaced supporting surfaces for supporting material sheets, the two mutually-spaced supporting surfaces define a plurality of temporary storage positions, and the plurality of temporary storage positions are arranged along the extension direction of the transfer slideways;

the transmission assembly is movably connected to the transfer slide way, one part of the transmission assembly can move along the extension direction of the transfer slide way, and the transmission assembly is used for being linked with the material sheets so that the material sheets can move from one temporary storage position to another temporary storage position along the extension direction of the transfer slide way.

3. The automatic plastic packaging equipment for semiconductors according to claim 2, wherein the transmission assembly comprises:

the transmission rod is rotatably connected to the bottom of the transfer slideway;

the driving block is in threaded transmission connection with the transmission rod, and one part of the top surface of the driving block is in sliding fit with the bottom surface of the transfer slideway so as to limit the driving block to rotate around the axis of the transmission rod;

and one end of the positioning pin is fixedly connected to the top surface of the driving block, the other end of the positioning pin is higher than the supporting surface, and the positioning pin is positioned beside the edge of the supporting surface.

4. The automatic plastic packaging equipment of claim 1-3, wherein the base further comprises a second space and a third space, the second space, the first space and the third space are distributed in the base from top to bottom in sequence, the automatic plastic packaging equipment further comprises:

the press is arranged in a staggered manner with the base and is used for plastically packaging the workpiece;

the die sweeping mechanism is movably connected to the press and used for cleaning a die on the press;

the glue removing and boxing module is arranged in the second space, and can remove a pouring channel on the material sheet and place the material sheet in a finished box;

the resin discharging mechanism is arranged in the third space and used for discharging resin;

main robot, the adjacency the press with the base sets up, main robot be used for with the tablet is in preheat the platform the press with transport between the dress module is glued to the piece, main robot still be used for with the resin is in arrange resin mechanism with transport between the press.

5. The automatic plastic packaging equipment of claim 4, wherein the glue removal and boxing module comprises:

the material storage platform is provided with a plurality of material storage positions and is used for storing the plastic-packaged material sheets;

the de-pouring mechanism is arranged at the side of the material storage platform and used for removing pouring channels on the plastic-encapsulated material sheets;

the boxing mechanism is arranged on the side, away from the material storage platform, of the de-watering mechanism, and the boxing mechanism is used for removing the material sheets after watering and placing the material sheets in the finished product box.

6. The automated semiconductor plastic packaging apparatus of claim 5, wherein the de-watering mechanism comprises:

the de-pouring mould comprises an upper mould and a lower mould, the lower mould is fixed on the bottom wall corresponding to the first space, the upper mould can move relative to the lower mould, and a pouring channel between the two material sheets is removed through the stamping force between the upper mould and the lower mould;

the first grabbing mechanical arm is arranged on one side of the material storage platform and used for transferring the material sheet from the material storage platform to the lower die.

7. The automated semiconductor plastic packaging apparatus of claim 5, wherein the binning mechanism comprises:

the finished product box storage platform is arranged on the bottom wall corresponding to the second space and used for fixing the finished product box;

and the second grabbing mechanical arm is arranged on one side of the finished product box storage platform and is used for transferring the material sheet from the de-watering mechanism to the inside of the finished product box.

8. The automatic plastic packaging equipment for semiconductors according to claim 7, wherein the finished product box storage platform is provided with two storage positions spaced from each other for storing the finished product boxes;

the second grabbing mechanical arm is provided with two grabbing parts which are spaced mutually, and the distance between the two grabbing parts corresponds to the distance between the cavities of the finished product boxes on the two storage positions.

9. The automatic plastic packaging equipment for semiconductors according to claim 4, wherein the main robot comprises a loading and unloading mechanism for loading and unloading the material sheet and the resin, the loading and unloading mechanism comprising:

a plurality of clamping assemblies, each clamping assembly comprising a clamping part which can be opened and closed to clamp and release the material sheet;

the feeding assemblies are connected to the clamping assemblies and comprise accommodating cavities for accommodating the resin, and the feeding assemblies are used for feeding the resin in the accommodating cavities.

10. The automated semiconductor plastic packaging apparatus of claim 4, wherein the mold cleaning mechanism comprises:

the visual unit is arranged above the plastic package mold and used for detecting the cleaning state of the surface of the plastic package mold;

the cleaning unit is connected to the press in a sliding mode and used for purging the plastic package mold, and the cleaning unit can extend to the upper side of the plastic package mold or can retract to the side of the plastic package mold;

and the control unit is in communication connection with the vision unit and the cleaning unit and controls the cleaning unit to run or stop in response to the detection result of the vision unit.

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