TWI729625B - Resin casting device - Google Patents

Abstract

The present invention provides a resin molding device, which does not require substantial changes in the device, but can simultaneously use a transfer molding device and a compression molding device to meet the needs of multiple products. The pressing part C does not use a dedicated machine, but can be used in any of the following situations: supply the pre-molding resin R1 to the lower mold 16, and use the transfer molding device 13 to press the pre-molding resin R1 to the cavity for transfer molding. The compression molding device 18 overflows the pre-molding resin R1 that has been supplied into the cavity of the lower mold to perform compression molding.

Description

Resin mold device

The present invention relates to a resin supply and take-out device for supplying resin before molding and taking out resin after molding, a workpiece conveying device for loading and unloading workpieces before and after molding with respect to a mold mold, and a resin mold device including these devices. .

In recent years, the thinning of workpieces has progressed, and the cavity filled with mold resin has become thinner. On the other hand, the resin mold area (workpiece size) tends to expand. In addition, from the viewpoint of increasing the speed of semiconductor devices, there is an increasing number of products for flip-chip connection. The flip-chip connection is a semiconductor chip (hereinafter referred to as a chip) that does not pass through metal. The wire is connected to the substrate via bump terminals. Therefore, it is necessary to perform an underfill mold in the narrow gap between the wafer and the substrate. In addition, in view of the necessity of dissipating the heat of the wafer, there is also a need to expose the surface of the wafer to perform resin molding. As an example, the heat dissipation effect is obtained by bonding the heat dissipation plate to the exposed surface. In addition, for the purpose of reducing manufacturing costs, the workpiece size is, for example, a strip substrate type of 100mm×300mm or less. Therefore, a larger semiconductor wafer-like workpiece may be connected to a wiring pattern formed thereon. Examples of substrates and so on. Furthermore, there are many semiconductor manufacturing methods, so if one example is given, there is also the so-called embedding Embedded Wafer Level Ball Grid Array (eWLB), etc., the so-called eWLB is to adhere a thermoplastic tape to a semiconductor wafer-shaped circular carrier, and then adhere the chip to the tape, and after the mold is formed After peeling off the carrier and tape, connect the rewiring layer to the terminal side of the chip. At this time, in order to improve the heat dissipation effect, it is required to expose the back side of the wafer and mold it. That is, a resin mold is required for the workpiece as follows: the wafer is exposed by the same circular carrier as the semiconductor wafer. Furthermore, considering the requirements for further cost reduction in the future, it is conceivable that there will also be the following requirements: wafer exposure molding is performed on a square large-format workpiece that is larger than a circular workpiece.

The so-called transfer molding device or compression molding device, as shown in FIG. 20, was developed as a device that satisfies any mold method and is put into practical use (see Patent Document 1). A work supply part 52, a resin supply part 53, a press part 54, a work storage part 55, etc. are arranged around the movement range of the articulated robot 51 that performs work transport. A compression molding device is provided in each of the plurality of pressing parts 54.

In addition, the applicant has proposed Japanese Patent Laid-Open No. 2012-114285 (refer to Patent Document 1) which developed a compression molding apparatus for compression molding of wafer-like workpieces, and integrated transfer molding and compression molding of the substrate type. Japanese Patent Laid-Open No. 2014-222711 (refer to Patent Document 2). However, there is no actual development of a device that integrates compression molding and transfer molding of wafer-type workpieces.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-114285

[Patent Document 2] Japanese Patent Laid-Open No. 2014-222711

If it is a newly developed device that transfers and molds wafer-type workpieces, it takes time and cost. In addition, in order to solve the heat capacity of the workpiece, it is desired to change to a wafer-exposed wafer type product, but it is not realistic to sleep or discard the operating compression molding device. Therefore, there is a need to effectively use the current device and reuse it.

In addition, if a wafer type compression molding device and a transfer molding device are used at the same time, the transportation of semiconductor wafers, resin materials, etc., parts units, unit units, etc. can be unified, and it is expected to reduce manufacturing costs or shorten production time. .

In addition, the wafer type compression molding device has been unitized, so the compression molding device and the transfer molding molding device can be assembled into one device. Therefore, two products can be selected in one device, and therefore, it also has the advantage that the clean room of the semiconductor manufacturing plant can be effectively used.

The disclosures applied in the several embodiments described below are completed to solve the above-mentioned problems, and the purpose is to provide a resin conveying device that can reduce the manufacturing cost and shorten the production time by making the components of the unit and the unit unit common, and reducing the production time. , Workpiece conveying device, and provide a resin molding device, which utilizes these resin conveying devices and workpiece conveying devices without major changes in the device, but can simultaneously use the transfer molding device and the compression molding device to meet the needs of a variety of products.

The related disclosures of the several embodiments described below include at least the following constitutions.

That is, it includes: a workpiece accommodating part, which respectively accommodates a workpiece before forming and a workpiece after forming; a plurality of press parts, which form a cavity in any one of the upper mold and the lower mold, and supply the pre-molding resin to the lower mold to form The rear workpiece and excess resin are formed; the resin supply part supplies the resin before forming; the resin processing part includes a resin recovery part that recovers the excess resin; the handling hand, at least the workpiece before forming is carried into the pressing part, at least The formed workpiece is carried out from the pressing part; and a multi-joint robot, which delivers the transporting hand to the pre-forming workpiece, and receives the formed workpiece from the transporting hand.

According to the above configuration, even if the transfer molding device and the compression molding device are used at the same time in a plurality of press sections, the workpiece storage section, the resin processing section, and the conveying hand can be shared. Therefore, a resin molding device can be provided without a device. It can respond to a variety of product needs.

In addition, it is also possible to perform a casting mold that repeatedly performs transfer molding and compression molding for the same product as needed.

In particular, in the pressing part, no dedicated machine is used, but any device can be selected for use in the following cases: supply the pre-molding resin into the lower mold pot, and press-feed the pre-molding resin to the mold by transfer molding Molding is performed in a cavity, or compression molding is used to flow and overflow the pre-molding resin supplied into the cavity of the lower mold to perform the molding. Therefore, the versatility is high and the manufacturing cost can be reduced. In addition, it can handle a variety of workpieces such as semiconductor wafers, panel substrates, and rectangular substrates.

Preferably, the carrying hand carries the workpiece and the workpiece before forming into the pressing part The resin before molding is carried out from the pressing section and the workpiece and excess resin after molding are carried out.

Thereby, regardless of the forming method, the workpiece before forming and the workpiece after forming are carried out by the common transporting hand, so the device configuration can be simplified and the versatility can be improved.

The carrying hand may also include: a work rotor, which carries the workpiece before forming into the pressing part, and receives the formed workpiece from the pressing part to the workpiece receiving part; and a resin loader, The resin before molding is carried in to the pressing part, and the excess resin after molding is carried out from the pressing part.

At this time, when the workpiece storage section and the resin processing section are separated and arranged via a plurality of pressing sections, they can be shared as follows: the loader carries the workpieces before and after forming, and the unloader carries the resin before forming and the excess resin after forming. Therefore, the workpiece and resin can be supplied and taken out quickly. In particular, the workpiece accommodating part and the resin processing part are separated from each other via a plurality of pressing parts, so that the influence of resin dust on molding can be reduced as much as possible.

The resin processing part is preferably provided with: a resin conveying tray (tray) for arranging and conveying the pre-molding resin delivered to the conveying hand; and a surplus resin recovery part for recovering surplus resin.

In this way, the resin processing unit includes a resin conveying tray and a surplus resin storage unit. Therefore, regardless of the molding method, the supply of resin before molding and the recovery of excess resin generated after molding can be combined. Therefore, the structure of the device can be simplified and the versatility can be improved. Sex.

The resin conveying tray and the excess resin recovery part are desirably moved forward and backward in relation to the resin supply position of the resin processing part and the pressing part. The carrying hand moves back and forth between the standby positions. In this way, the supply of workpieces to the conveying hand and the supply of resin before molding are delivered at the standby position of the conveying hand, and the excess resin can be quickly transferred from the conveying hand after the resin mold to the excess resin recovery section. Of submission.

The said excess resin collection part may be set to a predetermined position, and the bottom shutter (shutter) may open and close, and the excess resin may be discarded to a waste box.

Thereby, when the conveying hand separates and conveys the molded workpiece and the excess resin, only the excess resin and the workpiece can be collected separately and discarded.

The workpiece accommodating part and the resin processing part may be separately arranged on both sides via the pressing part.

Thereby, the possibility that resin dust easily generated in the resin treatment part adheres to the workpiece is reduced, and the molding quality can be maintained at a high level.

The pressing part may also include a bridging part and a movable part. The bridging part is arranged to overlap with the end of the workpiece so as to become a moving passage of air or casting resin connected to the cavity of the cavity. The recess is formed in any one of the upper mold and the lower mold, and the movable part is supported by moving upward in a manner that is separated from the clamping surface of the mold when the mold is opened, and the movable part is in the mold opened state. Separate from the mold clamping surface, move the workpiece holding portion toward the placement position to deliver the workpiece, press the movable part by closing the mold, and clamp the end of the workpiece by the bridge portion The placement position is a position where the end of the workpiece held by the transporting hand overlaps the bridging portion.

Thereby, the workpiece holding part is moved horizontally toward the placement position to deliver the workpiece, so The placement position is the position where the workpiece held by the transporting hand is separated from the mold clamping surface and overlaps the bridge portion of the movable part. Therefore, not only rectangular workpieces but also round workpieces can be positioned and delivered by the workpiece holding part. To the casting mold.

In addition, the movable part is pressed down by the mold closing action, and the end of the workpiece is clamped by the bridge portion to be clamped, so that the mold resin can be prevented from entering the end surface of the workpiece.

The movable member may also be any one of a pocket member, a runner gate member, and a vent member formed by connecting the bridge portion to the cavity recess.

Thereby, the casting mold can be accurately positioned with respect to the casting mold regardless of the shape of the workpiece, regardless of whether it is used for transfer casting or compression molding, without resin leakage at the end of the workpiece.

A resin casting device includes a workpiece conveying device that conveys a workpiece and resin to a pressing part. The resin casting device includes: a conveying device body that uses a positioning part provided on a mold clamping surface of a casting mold to perform relative to the casting mold. Positioning of the mold; a workpiece holding portion provided in the conveying device body to hold the workpiece before and after forming; and a resin holding portion capable of holding the pre-molding resin supplied to the casting mold.

Thereby, the same workpiece conveying device is used by holding the workpiece before molding and the resin before molding by the workpiece holding part and the resin holding part contained in the conveying device body and carrying it in the pressing part, and holding the molded workpiece and carrying it out. The workpiece and resin are transported to multiple pressing parts, thereby simplifying the device configuration and improving versatility.

A resin casting device, which includes conveying the workpiece and resin to a pressing part A workpiece conveying device, the resin casting device comprising: a conveying device body, which is positioned relative to the casting mold using a positioning portion provided on a mold clamping surface of the casting mold; a workpiece holding portion is provided on the conveying device body , Holding the workpiece before and after molding; and a resin holding portion that can hold the resin before molding and the excess resin after molding that are supplied to the casting mold, respectively; and the resin holding portion is configured to be able to be clamped relative to the mold positioned The conveying device body on the surface moves in a horizontal direction.

Thereby, by using the same workpiece conveying device for both the workpiece conveying before and after forming and the resin conveying, the installation area can be reduced and the device configuration can be made compact.

In the resin holding portion, the first resin holding portion and the second resin holding portion may be provided so as to be able to alternately move toward the carry-in/out position of the conveying device body, and the first resin holding portion can hold the supply to the press The pre-molding resin of the portion, and the second resin holding portion retains the excess resin after molding.

At this time, the first resin holding portion is moved toward the loading and unloading position by cooperating with the workpiece before the molding of the press section to carry out the mold loading operation of the resin before molding, and the second The resin holding part moves to the carry-in and carry-out position to carry out the unloading operation of the excess resin after molding, and the workpiece conveying device can be used for resin conveying before and after molding.

The pressing part can also be assembled with at least one lower die cavity type transfer injection molding device.

Thereby, it is possible to provide a resin molding device that can simultaneously use a transfer molding device and a compression molding device in the pressing part to meet the needs of a variety of products.

A resin molding device includes a resin processing section, the resin processing section includes a resin supply section for supplying resin before molding, and a resin recovery section for recovering excess resin after molding. In the resin molding apparatus, the resin supply section includes : A subtank, which contains a plurality of resins before molding; and a parts feeder, which arranges and sends out a plurality of resins before molding supplied from the subtank; at the bottom of the subtank, overlap A pallet for accumulating resin dust on the bottom and a punching metal for supporting a plurality of resins before molding are arranged above the pallet. When the sub-tank is assembled on the feeder, the pallet is Connected to an actuator, the pallet and the punching metal are drawn out of the tank body by operating the actuator in a predetermined time sequence, and the bottom of the auxiliary tank is opened and closed, thereby opening and closing the bottom of the auxiliary tank. The resin is supplied to the feeder before molding.

As a result, the resin powder and other dust generated in the sub-tank containing the plurality of pre-molding resins are collected to the pallet through the through holes of the punched metal, so that the dust carried into the pressing part can be reduced. Therefore, even if the resin supply device is arranged in the clean room, a clean use environment can be maintained.

It is possible to provide a resin conveying device and a workpiece conveying device, which can make the structure of the part unit and the unit unit common to reduce the manufacturing cost and shorten the production time.

Furthermore, it is possible to provide a resin molding device which utilizes the resin conveying device and the workpiece conveying device without major changes in the device, and can simultaneously use the transfer molding device and the compression molding device to meet the needs of a variety of products.

1a: Supply box

1b: storage box

1c: partition wall

2: Secondary storage tank

2a: Tank body

2b: Lid

2c: handle

2d: bottom plate

2d1: Pallet

2d2: punched metal

2d3: hook

2e: Opening and closing actuator

2f: Open and close arm

2f1: connecting part

3: feeder

4: Flat picker

4a: Open and close claws

5: Resin handling tray

5a: Keep hole

5b: Flat push mechanism

5c: Up putter

6: Excess resin recovery department

6a: bottom baffle

6b: Chute

6c: Waste box

7: Resin handling track

7a: Resin supply position

7b: Standby position

8: Liquid resin supply part

8a: Syringe

8b: Syringe supply part

8c: Distribution unit

9, 19: Direct-acting guide rail

10: Carrying device body

10a: positioning block

10b: Cleaning brush

11: Workpiece holding part

11a: Chuck jaw

11b: positioning pin

12: Resin holding part

12a: The first resin holding part

12a1: Cylindrical storage section

12a2: bezel

12b: Second resin holding part

12b1: Adsorption pad

13: Transfer injection molding device

14: Casting mold

15, 15': upper die

15a: Upper die base

15b: Upper module

15c: Upper die locking block

15d: Upper die clamp

15e: Upper mold cavity parts

15f, 15k, 16k', 16f', 16s: coil spring

15g: upper mold col

15h: Upper mold runner gate

15h', 16h: Place the recess

15i: Upper die vent

15j: cut-off pin

15m: The upper die bridge is connected to the air groove

15n: concave part of upper mold cavity

15q': The upper die bridge is connected to the gas part

15r: Upper mold overflow cavity

16, 16': Lower die

16a, 16b': lower module

16a': Lower die base

16b: Lower mold locking block

16c: recess

16d: sealing material

16d': Die clamp

16e: Slot parts

16e': Lower mold cavity parts

16e1, 16n1, 16q1: bridge part

16e2: slot hole

16f: plunger

16g: Workpiece support block

16i, 22a: adsorption hole

16i': Die vent

16j: Support pin

16j': cut-off pin

16k: suction hole

16m: slot

16m': The lower die bridge is connected to the air groove

16n: Lower mold runner gate

16p: Lifting pole

16q: The lower die bridge is connected to the gas part

16r: Lower mold cavity recess

16t: positioning pin

17: Release film

18: Compression forming device

20: Gate cutting part

21a, 21b, 21c: vertical axis

22b: Suction path

51, E: Multi-joint robot

52: Workpiece Supply Department

53: Resin Supply Department

54: Suppression Department

55: Work storage department

A: Workpiece storage department

B: Resin Processing Department

B1: Resin Supply Department

B2: Resin Recycling Department

C: Suppression Department

D: Carrying hand (carrying hand)

D1: Loader

D2: Unloader

D3: Workpiece loader

D4: Resin Loader

E1: Robot hand

E2: Horizontal connecting rod

E3: vertical link

E4: Base

F: Visual inspection department (cooling department)

G: curing oven

H: Control Department

L: Overhang

R1: Resin before molding (flat resin)

R2: Excess resin

T: Semiconductor wafer (wafer)

W: Workpiece (semiconductor wafer)

W1: Workpiece before forming

W2: Workpiece after forming (formed product after forming)

W11: Notch

X, Y: direction

Fig. 1 is a plan layout diagram of a resin casting device.

Fig. 2 is a front view of the resin treatment part of Fig. 1.

Fig. 3 is a left side view of the resin treatment part of Fig. 1.

Figs. 4(a) to 4(d) are a plan view, a vertical cross-sectional view, a right side view, and a vertical cross-sectional view of a state in which the bottom plate is opened, of a sub-tank provided in the resin processing part of Fig. 1.

Fig. 5(a) is a plan view of the conveying hand during a carry-in operation, and Fig. 5(b) is a plan view of the conveying hand during a carry-out operation.

Fig. 6 (a) and Fig. 6 (b) are explanatory views of a work and tablet resin supply cross-sections centering on the casting mold of the transfer molding apparatus.

Figs. 7(a) and 7(b) are plan views and cross-sectional views for explaining the reason why the workpiece is approached by the conveying hand.

Fig. 8(a) is a plan view of the upper mold, and Fig. 8(b) is a plan view of the lower mold.

Fig. 9 is an explanatory diagram showing the arrangement of the pockets.

Fig. 10(a) is a cross-sectional explanatory view of a resin casting apparatus with a runner gate as a movable part, and Fig. 10(b) is a cross-section of a resin casting apparatus with a vent and a runner gate as the movable part Illustrating.

Fig. 11 is a cross-sectional view of a resin casting apparatus for compression molding in which a vent is used as a movable part.

Fig. 12 is a plan layout diagram showing a resin casting apparatus according to a modification of Fig. 1.

Fig. 13 is a plan layout diagram of a resin casting apparatus of another embodiment 1. Figs.

Fig. 14 is a plan layout diagram of a resin casting apparatus of another embodiment 2.

Fig. 15 is a plan layout diagram of a resin casting apparatus according to a modification of Fig. 14.

Fig. 16 is a plan layout diagram of a resin casting apparatus of another embodiment 3.

Fig. 17 is a plan layout diagram of a resin casting apparatus of another embodiment 4.

Fig. 18 is a plan layout diagram of a resin molding apparatus of another embodiment 5.

19(A) and 19(B) are a side view showing an example of a multi-joint robot and an explanatory diagram of a robot hand.

Fig. 20 is a plan layout diagram of a dedicated machine for compression molding equipment.

Hereinafter, preferred embodiments of the resin supply device, the workpiece conveying device, and the resin molding device including the device according to the present invention will be described in detail together with the accompanying drawings. In addition, when referring to a casting mold, it refers to an upper mold and a lower mold respectively supported on the mold base, and refers to molds other than the mold opening and closing mechanism (pressing device). Also, when talking about a resin casting device, it includes at least a casting mold and a mold opening and closing mechanism that opens and closes the casting mold (as an example, a pressing device such as an electric motor, a screw shaft, or a toggle link mechanism) ; Not shown), and is a device that further includes a resin conveying device, a workpiece conveying device, and a molded workpiece unloading device for automation. It is assumed to include the following mechanisms: a transfer mechanism that operates a plunger inserted into the cavity during transfer molding, and a decompression mechanism that forms a decompression space in the mold when the mold is closed. Hereinafter, the description will be focused on the structure of the casting mold. In addition, the workpiece W is assumed to be resin-molded in a circular shape of a semiconductor wafer on which a wafer is mounted, but it is not particularly limited to a circular shape, and may be a quadrilateral or rectangular shape. rectangle. In the casting mold, as an example, the lower mold is a movable mold and the upper mold is a fixed mold. However, the upper mold may be a movable mold and the lower mold may be a fixed mold, or both may be movable molds.

(The overall structure of the resin casting device)

Fig. 1 is a plan layout diagram of an embodiment of the resin casting apparatus of the present invention. The resin molding apparatus of this embodiment includes: a workpiece storage section A, which respectively accommodates the workpiece W1 before molding and the workpiece W2 after molding; a resin supply section B1 (resin supply device), which supplies resin R1 before molding; and a resin processing section B, including recycling molding. After the resin recovery part B2 of the excess resin R2; the pressing part C forms a cavity in any one of the upper mold and the lower mold, and supplies the pre-molding resin R1 to the lower mold to shape the molded workpiece W2 and the excess resin R2; Carrying hand D (workpiece conveying device) moves the pre-forming workpiece and pre-forming resin to the pressing section C, at least the pre-forming work W1 into the pressing section C, and at least the post-forming work W2 from the pressing section C; and more The articulated robot E delivers the workpiece before forming to the handling hand D, and receives the formed workpiece from the handling hand D.

Around the articulated robot E, processing units such as an appearance inspection unit (cooling unit) F, a curing furnace (cure furnace) G and the like that perform various processing steps may also be provided. In addition, a control unit H that controls the operations of these processing units is arranged. When the processing units are arranged around the moving range of the articulated robot E as described above, the moving distance can be shortened, so that the workpiece and resin before and after forming can be efficiently transported between steps. Hereinafter, the configuration of each part will be described in detail.

(Work storage area A)

In Fig. 1, the workpiece W is used to arrange a semiconductor wafer matrix on a semiconductor wafer On the artifacts. In the workpiece storage section A, a plurality of magazines 1a for supplying the workpiece W1 before forming and a storage box 1b for storing the workpiece W2 after forming are provided. The workpiece W may also be a workpiece W for an embedded wafer level packaging (E-WLP) (eWLB) that holds a semiconductor wafer on a carrier plate. In addition, the work W may also be a resin substrate or a lead frame on which a semiconductor chip is packaged.

In addition, the supply cassette 1a provided with two rows may be a case where the same type of work W is stored, or may be a case where a different type of work W is stored. The same applies to the storage box 1b. In addition, the supply cassette 1a and the storage cassette 1b may be provided in a configuration in which each row is provided, or may be provided in a configuration in which three or more rows are provided respectively.

The transfer area where the articulated robot E moves and the workpiece storage section A are partitioned by a partition wall 1c. The purpose is to store the work W in an environment free from the influence of dust, heat, or the like. The supply box 1a is supported so that it can be raised and lowered by a well-known elevator mechanism. The elevator mechanism moves up and down along the elevator guide by a conveying element (a loop-shaped conveying belt, a conveying chain, etc.) that is rotated by a driving source. In the elevator mechanism, the supply cassette 1a is placed in a double-layered manner. On both side walls of each supply cassette 1a, slits (recesses) are formed facing each other, and the workpiece W (semiconductor wafer) is inserted into and supported by the slits. In the partition wall 1c, in the vicinity of the ascending position of the elevator mechanism, an openable and closable flap blocks the take-out port.

(Resin processing part B)

It includes a resin supply part B1 that supplies resin before molding, and a resin recovery part B2 that collects excess resin. First, the structure of the resin supply part B1 is demonstrated. Resin supply The part B1 is supplied with the pre-molding resin R1 supplied to the press part C. The sub tank 2 (storage container) accommodates a plurality of pre-molding resins R1 (for example, plate resin). Below the sub-tank 2, a feeder 3 (orderly arrangement part) is provided. The feeder 3 opens the bottom of the sub tank 2 to receive a plurality of plate resins R1, and applies vibrations to arrange them neatly.

As shown in FIG. 3, the plate resin R1 neatly arranged in a row by the feeder 3 is held by the opening and closing claws 4a of the tablet pick-up 4 from the front side. The plate pickup 4 is rotated by 90° to make the plate resin R1 stand up, and the opening and closing claws 4a are opened to insert the plate resin R1 into the holding holes 5a of the resin conveying tray 5 waiting below to hold them individually.

In addition, in this embodiment, the excess resin recovery part 6 which recovers the excess resin R2 to the resin conveyance tray 5 is integrally provided in parallel. As shown in FIG. 2, the surplus resin collection part 6 opens and closes the bottom flap 6a at a predetermined position (near the resin supply position), and discards the surplus resin R2 through a chute 6b to a disposal box 6c.

The resin conveyance tray 5 and the excess resin recovery part 6 are provided so as to be able to move back and forth between the resin supply position 7a shown in FIG. 2 and the standby position 7b of the conveyance hand D along the resin conveyance rail 7 provided below. When the resin conveying tray 5 moves on the resin conveying rail 7 to the standby position 7b, the plate resin R1 is pushed up from the bottom side of the holding hole 5a by the upper push rod 5c included in the plate push mechanism 5b, and delivered to the The resin holding part 12 (the first resin holding part 12a) of the conveyance hand D of an upper standby.

Furthermore, the workpiece W1 before forming is delivered from the robot hand E1 of the articulated robot E to a lifter (lift table) not shown. The pre-forming workpiece W1 supported by the elevator is moved by the workpiece holding portion 11 (chuck claw 11a) of the conveying hand D maintain.

Here, an example of the sub tank 2 will be described with reference to FIGS. 4(a) to 4(d). As shown in FIG. 4(a) to FIG. 4(c), it includes a tank body 2a as a rectangular container and a lid 2b that closes the upper opening. The cover 2b is provided with a handle 2c. The operator can appropriately replenish the plate resin R1 by opening the lid 2b by grasping the handle 2c. In addition, the bottom of the sub-tank 2 is provided with a bottom plate 2d that can be opened and closed. The bottom plate 2d is provided with a predetermined interval in the height direction, and a tray-shaped pallet 2d1 and a punching metal 2d2 are integrally superposed and arranged, the punching metal 2d2 is provided with a plurality of through holes in the metal plate. This has a structure in which resin scum (dust such as resin powder) during resin transportation is supported by a pallet 2d1 arranged below the punching metal 2d2. A hook 2d3 is provided on the side of the pallet 2d1. As shown in FIG. 1, one end of an opening and closing arm 2f is connected to a rod of an opening and closing actuator 2e (for example, a linear motor or a cylinder capable of opening and closing control). In addition, a connecting portion 2f1 is provided at the other end of the opening/closing arm 2f. The connecting portion 2f1 of the opening/closing arm 2f is connected to the hook 2d3 of the bottom plate 2d.

When the opening and closing actuator 2e is operated, the cylinder rod is extended and the opening and closing arm 2f also moves. Therefore, the pallet 2d1 locked to the hook 2d3 via the connecting portion 2f1 is drawn out to the tank body 2a as shown in FIG. 4(d). Outside. At this time, the plurality of plate resins R1 placed on the punching metal 2d2 fall to the feeder 3 below the bottom opening.

As a result, the resin powder and other dust generated in the sub tank 2 containing a plurality of pre-molding resins R1 are collected to the pallet 2d1 through the through holes of the punching metal 2d2, so that the amount of dust generated in the resin transport tray 5 can be reduced. dust. Therefore, even if the resin supply device is arranged in the clean room, a clean use environment can be maintained.

In addition, in this embodiment, flat resin is supplied as the pre-molding resin R1, but a liquid resin supply part 8 may be provided as needed. In the liquid resin supply part 8, two systems of dispensing units (dispense) 8c are provided on both sides with a revolver type syringe supply part 8b sandwiched therebetween, and the revolver type syringe supply part 8b is rotatably arranged. A plurality of syringes 8a are maintained. Furthermore, the liquid resin supply unit 8 can adjust the internal temperature and humidity to cool and dehumidify the resin. In addition, a door is provided on the side of the device so that the operator can replace the syringe.

(Multi-joint robot E)

In FIG. 1, the articulated robot E holds the workpiece W in the robot hand E1, and performs rotation and linear movement that are transported between steps. The articulated robot E includes, for example, a combination of a vertical articulated robot and a horizontal articulated robot that can move up and down by a foldable vertical link E3, and the horizontal articulated robot can make a horizontal link E2 Rotate and move in the horizontal plane. A robot hand E1 is provided at the front end of the horizontal link E2. Each of the links uses an encoder included in a servo motor (not shown) to detect the amount of rotation and perform feedback control.

As described above, by adopting the configuration including the articulated robot E, the following operations can be performed in parallel by moving the robot hand E1 to an arbitrary position in the vertical direction by the vertical link E3, and by the horizontal link E2 and move the robot hand E1 at an arbitrary position in the horizontal direction. Therefore, the workpiece W can be linearly transported between the processing units arranged around the movement range of the articulated robot E, and the time required for the transport to each processing unit can be minimized. Furthermore, the articulated robot E can also be as follows Composition: The vertical link E3 is not used, and the horizontal link E2 moves up and down in the vertical direction.

In (A) of FIG. 19, an example of the articulated robot E is shown. The articulated robot E includes a combination of a vertical articulated robot and a horizontal articulated robot, the vertical articulated robot can move up and down by a plurality of foldable vertical links E3, and the horizontal articulated robot can make multiple horizontal The connecting rod E2 rotates and moves in the horizontal plane. A robot hand E1 is provided at the front end of the horizontal link E2. The two horizontal links E2 and the robot hand E1 are rotatably supported around the vertical shaft 21a, the vertical shaft 21b, and the vertical shaft 21c, respectively. Each of the links uses an encoder included in a servo motor (not shown) to detect the amount of rotation and perform feedback control.

As described above, by adopting the configuration including the articulated robot E, the following operations can be performed in parallel by moving the robot hand E1 to an arbitrary position in the vertical direction by the vertical link E3, and by the horizontal link E2 and move the robot hand E1 at an arbitrary position in the horizontal direction. Therefore, the workpiece W can be linearly transported between the processing units arranged around the movement range of the articulated robot E, and the time required for the transport to each processing unit can be minimized. Therefore, the workpiece W can be quickly transported to the next step of carrying the workpiece W and the pre-molding resin R1 into the press part C to perform the resin molding, which can contribute to the improvement of molding quality.

Moreover, as shown in FIG. 19(B), the robot hand E1 can avoid the center of the workpiece W by dividing the front end into a double-fork shape, and can hold the vicinity of the outer periphery of the workpiece W. As shown in FIG. 19(B), in the robot hand E1, at three locations on the front end and the base side, suction holes 22a capable of sucking the outer circumference of the workpiece W and suction paths communicating with the suction holes 22a are formed 22b. The robot hand E1 places the workpiece W and sucks and holds its back surface. Furthermore, in addition to sucking and holding the workpiece W, the robot hand E1 may be mechanically clamped by clamping it with a claw. In addition to rotating around the vertical axis, the robot hand E1 may have a configuration in which the workpiece W can be reversed by rotating around the horizontal axis.

In addition, in (A) of FIG. 1 and FIG. 19, the base portion E4 of the articulated robot E is provided so as to be able to move back and forth along the plurality of linear guide rails 9. For example, a ball screw is connected to a nut provided on the base portion E4, and is driven by a servo motor (not shown) to rotate forward and backward, thereby causing the articulated robot E to move back and forth along the linear motion guide 9.

Furthermore, it is also possible to adopt a configuration in which instead of the articulated robot E, a horizontal articulated robot, a vertical articulated robot, other types of robots, or a robot in which actuators or the like are appropriately combined can be used. In addition, according to the number of pressing parts C, a plurality of articulated robots may be installed.

In FIG. 1, an information reading unit (not shown) may be provided between the workpiece accommodating part A and the conveying hand D. The information reading part is provided with a code information reading device and an aligner. The code information reading device reads the product-related information codes (quality requirement codes (registered trademarks), bar codes, etc.) assigned to the workpiece W. Corresponding to the information code, the control unit H stores resin supply information (resin type, resin supply amount, supply time, etc.), mold conditions (pressing number, pressing temperature, pressing time, molding thickness, etc.), and curing information (Curing temperature, curing time, etc.), cooling information (cooling time) and other molding conditions. Based on the forming condition information corresponding to the information code read by the code information reading device, the following steps are performed on the workpiece W being conveyed. deal with. The articulated robot E delivers the workpiece W whose forming conditions have been read to an elevator (not shown) for delivery to the transport hand D.

(Carrying hand D)

The conveying hand D carries the pre-forming workpiece W1 and the pre-forming resin R1 into the pressing section C, and the post-forming workpiece W2 and the excess resin R2 are carried out from the pressing section C. Hereinafter, an example of the transport hand D will be described.

The main body 10 of the conveying device is provided with a workpiece holding portion 11 that clamps and holds the outer peripheral end of the workpiece at multiple places, and a resin holding portion 12 that can hold the resin R1 before molding and the excess resin R2 after molding, respectively. The conveying device body 10 is provided with positioning blocks 10a at multiple locations. As will be described later, positioning parts (lock blocks) provided on the mold clamping surface of the casting mold are used to perform positioning with respect to the mold clamping surface. Positioning.

In addition, as shown in FIG. 5(a), the workpiece holding portion 11 is capable of holding a circular pre-forming workpiece W1 (for example, a semiconductor wafer), and is provided with cards that can be opened and closed at four positions along the outer circumference of the workpiece at 90 degrees. Claw 11a. Furthermore, the chuck claws 11a are provided in four places, but the number is not limited as long as they can be stably gripped and transported. A notch portion W11 for positioning is provided on the outer periphery of the workpiece W1 before forming. In the workpiece holding portion 11, the positioning pin 11b is locked to the notch portion W11, and the workpiece W is blocked and positioned and held.

In addition, the workpiece holding portion 11 is provided so as to be movable in at least one of the X direction and the Y direction orthogonal to the conveying device main body 10. In this embodiment, the workpiece holding portion 11 is configured to be able to build in an air cylinder and The linear motion mechanism of the linear motion guide mechanism moves back and forth between the carry-in/out position (refer to FIG. 5(a)) and the delivery position (refer to FIG. 5(b)) along the longitudinal direction of the conveying device body 10. The so-called delivery position refers to a position where the work center of the conveying device body 10 overlaps with the work center of the lower mold. The loading and unloading position is a position where when the workpiece W is moved up and down as described later, it is shifted from the delivery position until the end of the workpiece does not hit the bridging portion 16e1 of the pocket 16e described later. In the present embodiment, the conveying device body 10 is provided with a mechanism for moving the workpiece between the loading and unloading position and the delivery position. However, a known method of moving the workpiece by a mold is used (as an example, Japanese Patent Laid-Open In the case of the publication No. 2015-051557), in the conveying device body 10, a movement mechanism for the workpiece is not required.

In addition, a cleaning brush 10b is provided on the front side of the mold entering direction of the conveying device main body 10. If the cleaning brush 10b is operated, the mold surface can be cleaned when the conveying hand D advances and retreats with respect to the casting mold. In addition, the cleaning brush includes a function of sucking off excess resin with a suction duct (duct) and the like.

According to the above configuration, the conveying hand D holding the pre-molding workpiece W1 and the pre-molding resin R1 positions the conveying device body 10 by using the positioning portion provided on the mold clamping surface of the mold so that the workpiece holding portion 11 faces It moves in at least any one of the XY directions (horizontal direction), and the pre-molding work W1 and the pre-molding resin R1 can be supplied to the mold by the work loading operation of the transport hand D.

In FIGS. 5( a) and 5 (b ), the conveying device main body 10 is provided with a resin holding part 12 in parallel with the work holding part 11. In the resin holding portion 12, the first resin holding portion 12a and the second resin holding portion 12b are provided so as to be able to be transported toward The loading and unloading positions (slot holes 16e2) of the device body 10 alternately move, the first resin holding portion 12a holds the pre-molding resin R1 supplied to the mold, and the second resin holding portion 12b holds the excess resin after molding R2. In this embodiment, the first resin holding portion 12a is provided with a cylindrical storage portion 12a1 for holding a solid resin (flat-shaped resin), and a baffle 12a2 for opening and closing the bottom. In addition, the second resin holding portion 12b is provided with an adsorption pad 12b1. The suction pad 12b1 sucks air by a suction device not shown, and sucks and holds the excess resin R2 after the resin mold. The excess resin R2 can also be adsorbed by the adsorption pad 12b1, and can also be grasped by the clamping claw mechanism.

The first resin holding portion 12a and the second resin holding portion 12b are provided so as to be able to move in and out of the conveying device body 10 (corresponding positions of the slots), in a direction orthogonal to the entry direction of the mold (the conveying device body 10). The short side direction: Y direction) to move up. In addition, it may be provided so as to be movable in the longitudinal direction (X direction) of the conveying device main body 10. Thereby, when the workpiece is carried in (refer to Figure 5(b)), the first resin holding portion 12a can be used to carry the pre-molding resin R1 (plate resin) into the mold, and when the workpiece is carried out (refer to the figure) 5(a)), the operation of carrying out the excess resin R2 (molded product cavity) from the mold by the second resin holding portion 12b is switched.

According to the above configuration, the workpiece holding portion 11 can hold the workpiece W before and after molding. In the resin holding portion 12, the first resin holding portion 12a and the second resin holding portion 12b are provided so as to be able to move in and out of the conveying device body 10 (slots). Holes 16e2: Referring to Fig. 6(a)) alternately move, the first resin holding portion 12a holds the pre-molding resin R1 supplied to the mold, and the second resin holding portion 12b holds it as The excess resin R2 (molded product cavities) after molding can be carried in and out of the workpiece and resin before and after molding by the same workpiece conveying device.

In addition to the solid resin, the first resin holding portion 12a may hold any one of powder resin, pellet resin, and liquid resin before molding resin R1. Thereby, no matter what kind of resin is used, the resin can be carried in and out together with the common transport hand D and the work W. Furthermore, in the case of liquid resin, it may be a syringe.

(Suppression Department C)

Next, referring to Fig. 6(a) to Fig. 11, the structure of the pressing portion C will be described.

In the pressing part C, a cavity is formed in either the upper mold or the lower mold, and the pre-molding resin R1 is supplied to the lower mold, and the post-molding workpiece W2 and the excess resin R2 are molded. Hereinafter, as an example, a case will be described in which an upper mold cavity, a lower mold cavity type transfer molding device, and a lower mold cavity type compression molding device are assembled in parallel in the pressing section C.

6(a) and 6(b), the structure of the upper mold cavity and the lower mold cavity type transfer molding apparatus 13 provided in the pressing part C will be described. In addition, the mold opening and closing mechanism is omitted, and the description is centered on the structure of the mold mold 14. The casting mold 14 uses the upper mold 15 and the lower mold 16 to clamp the pre-molding workpiece W1 and the pre-molding resin R1 carried in from the conveying hand D to perform transfer molding, and carry out the molded product W2 and excess resin R2 to Carrying hand D.

First, the structure of the upper mold 15 will be explained. In FIG. 6(a), the upper mold base 15a is suspended and supported in a ring shape along the outer peripheral edge of the upper mold base 15b. In the upper mold On the lower end surface of the block 15b, an upper mold locking block 15c for positioning with the lower mold 16 is protrudingly provided. As shown in FIG. 8(a), on the two pairs of opposite sides of the upper module 15b, upper mold locking blocks 15c (convex modules) are respectively arranged on the center line passing through the center of the workpiece W. As shown in FIG. Furthermore, it is not necessary to arrange the locking block on the center line passing through the center of the workpiece W, as long as it is provided at least on each side.

In the upper mold space enclosed by the upper module 15b, a rectangular upper mold clamp 15d and a circular upper mold are respectively suspended and supported on the upper mold base 15a via a coil spring 15f. The cavity 15e (refer to FIG. 6(a) and FIG. 8(a)). The upper mold cavity 15e (cavity bottom) and the upper mold clamp 15d (cavity side) surrounding the upper mold cavity 15e (cavity bottom) are used to form the upper mold cavity recess 15n.

On the clamping surface (lower end surface) of the upper mold clamp 15d, an upper mold cavity 15g and an upper mold runner connected to the upper mold cavity 15g are engraved in a manner connected to the upper mold cavity concave portion 15n Gate 15h.

In addition, on the opposite side of the workpiece via the upper mold cavity recess 15n and the upper mold runner gate 15h of the upper mold clamp 15d, a plurality of upper mold vent grooves 15i connected to the upper mold cavity recess 15n are engraved. In each upper mold vent groove 15i, a shut-off pin 15j is assembled so as to be openable and closable. The stop pin 15j is assembled in the upper mold base 15a in a state of being urged downward via the coil spring 15k. Thereby, the front end (lower end surface) of the stop pin 15j is supported at a position substantially flush with the bottom of the upper die vent groove 15i.

In addition, on the upper mold clamping surface, a release film 17 is sucked and held and covered on a suction hole (not shown), and the upper mold clamping surface includes an upper mold cavity cavity. Part 15n and a resin path connected to the upper mold cavity recess 15n. The reason is that when the surface of the semiconductor wafer T mounted on the workpiece W is exposed and molded, it is necessary to cover it with the release film 17 sucked and held in the cavity recess 15n of the upper mold. The release film 17 may be a long film continuous in a long strip shape between reels, or a single piece of film cut according to the size of the upper mold clamping surface. As the release film 17, a film having a thickness of about 50 μm, heat resistance, easy peeling from the mold surface, flexibility, and stretchability can be suitably used, such as polytetrafluoroethylene (PTFE), tetrafluoroethylene (Ethyl Tetra Fluoro Ethylene (ETFE), Polyethylene Terephthalate (PET), Fluorinated Ethylene Propylene (FEP) film, glass cloth impregnated with fluorine (glass cloth), polypropylene film, Single-layer film or multi-layer film mainly composed of polyvinylidene chloride, etc.

Next, the structure of the lower die 16 will be explained.

In Fig. 6(a), the lower mold base (not shown) supports the lower module 16a in a ring shape along its outer peripheral edge. On the upper end surface of the lower module 16a, a lower mold locking block 16b (two pairs of rectangular parallelepiped blocks or one concave module) for positioning with the upper mold 15 is provided. As shown in FIG. 8(b), on the opposite sides of the lower module 16a, the concave portions 16c of the lower mold lock block 16b are respectively arranged on the center line passing through the center of the workpiece W. Furthermore, it is not necessary to arrange the locking block on the center line passing through the center of the workpiece W, as long as it is provided at least on each side, as long as the upper mold locking block 15c and the lower mold locking block 16b are engaged in a group, it can be arranged on Anywhere on the side. Therefore, the upper mold 15 and the lower mold 16 are aligned with each other by engaging the upper mold locking block 15c with the concave portion 16c of the lower mold locking block 16b. Clamp.

On the clamping surface of the lower module 16a, a sealing material 16d is embedded in a ring shape. The lower module 16a abuts against the clamping surface of the opposing upper module 15b to seal the space in the mold. In the lower module 16a, the helical spring 16s urges the lower mold base upward when the mold is opened to suspend and support the pocket member 16e (movable member). The upper end of the pocket member 16e includes a flat mold parting surface and a bridge portion 16e1, and a pocket hole 16e2 is formed substantially in the center. The slot hole 16e2 has a cylindrical shape filled with the resin R1 (for example, a plate resin) before molding, and a plunger 16f is inserted into the slot hole 16e2 so as to be liftable. Furthermore, the slot hole 16e2 is not limited to one place. For example, as shown in FIG. 9, a plurality of holes may be arranged.

In addition, in the mold space enclosed by the lower module 16a, a circular workpiece support block 16g is supported and fixed to the lower mold base. The upper end surface of the workpiece support block 16g is supported in such a way that the height is lower than the upper end surface of the surrounding lower module 16a by a height equivalent to the plate thickness of the workpiece W. Thereby, the workpiece W is placed in the mounting recess 16h, and the mounting recess 16h includes a workpiece support block 16g and a lower module 16a surrounding the workpiece support block 16g. The placement recess 16h can also be used for positioning the workpiece W. However, by setting the positioning pin 16t (refer to FIG. 8(b)) upright from the lower mold 16, the placement portion does not necessarily have to be a recess. The positioning pin 16t corresponds to a V-shaped notch (notch) provided in the positioning of the workpiece W.

7(a) and 7(b), a bridging portion 16e1 is formed at the upper end of the pocket member 16e, and the bridging portion 16e1 is connected to the upper end of the workpiece W placed in the recessed portion 16h The parts are overlapped and arranged in an overhang shape. Bridge 16e1 is provided at a position facing the upper mold runner gate 15h, and is formed in a wedge shape such that the closer to the outer peripheral edge portion from the pocket side, the thinner the plate thickness. As a result, the resin R1 before molding passes through the upper end surface of the pocket 16e, that is, between the bridge portion 16e1 and the upper mold runner gate 15h, and fills the upper mold cavity recess 15n, so it spans and does not pass through the end of the workpiece W Part, so no resin leakage occurs. In addition, the runner and the gate groove forming the upper mold runner gate 15h are provided on the upper mold side in this example, but they may be provided on the bridging portion 16e1 side or both. The boundary between the upper mold runner gate 15h and the upper mold cavity recess 15n is a gate, so the cross-sectional shape is tapered so that gate break described later can be easily realized.

Moreover, as shown in FIG. 8(b), the workpiece W (semiconductor wafer) has a plurality of wafers T arranged in the vicinity of the circular end. The mold area is thin and has a large area, so the resin injection balance must be ensured so that the gap between the wafers T in the horizontal direction or the gap under the wafer T does not produce an unfilled area of the resin R1 before molding. Therefore, considering the filling property of the resin R1 before molding, in order to ensure as much as possible the runner gate width G on the front end side (the gate connecting the cavity and the runner) connected to the cavity (refer to FIG. 7 (A)) is large, and is formed into a tapered shape whose width G expands from the cavity toward the cavity. When the pocket member 16e is overlapped with the circular workpiece W in a plan view, the overhanging amount L of the bridge portion 16e1 (the length of overlap from the workpiece overlapping end of the pocket member 16e to the outer peripheral end of the workpiece: refer to FIG. 7 (B)) increase. Therefore, when the upper and lower molds are closed, a resin path is formed between the upper end surface of the pocket member 16e and the upper mold runner gate 15h.

Furthermore, the bridging portion 16e1 of the pocket piece 16e is in the open mold state with the lower mold The clamping surfaces are separated (refer to FIG. 6(a)), the end surface of the workpiece held by the conveying hand D is positioned in the seating recess 16h below the bridging portion 16e1, and the bridging portion 16e1 is made to overlap the outer peripheral end of the workpiece The method overlaps and clamps the workpiece W to the mold 14 of the casting mold. As described above, the workpiece W is not only configured as a mold, but also positioned by the conveying hand D. The reason is that because the workpiece W is particularly circular, even if it is desired to have an edge mechanism similar to the conventional rectangular substrate Generally, moving parts are used to push the end of the workpiece to the side of the pocket. Since the workpiece W has a large body, the amount of movement (overhanging amount L of the bridge portion 16e1) is large, and position deviation or rotation of the workpiece W is likely to occur. Furthermore, in the lower mold 16, blocking and positioning can also be performed by providing positioning pins 16t, which correspond to the V-shaped recesses provided in the workpiece W for positioning (see FIG. 8(b)) ).

In FIG. 6(a), a plurality of suction holes 16i are provided in the workpiece support block 16g, and the suction holes 16i suction and hold the workpiece W placed in the mounting recess 16h. The suction hole 16i is connected to a suction device not shown. In addition, a plurality of movable support pins 16j are provided penetrating the workpiece support block 16g. The support pin 16j is provided so that it can move in the position where the pin front-end part protrudes from the bottom part of the recessed part 16h, and the position where the pin front-end part is retracted in the workpiece|work support block 16g. When the workpiece W held by the conveying hand D is delivered to the mounting recess 16h, the pin tip portions of the plurality of support pins 16j are protruding from the mounting recess 16h, so that the workpiece W is delivered to the support pin 16j. Thereby, when the workpiece W is positioned on the mold, it will not be damaged by sliding with the mold surface. Furthermore, the support pin 16j may be omitted.

In addition, the lower module 16a is closer to the inner side in the radial direction than the sealing material 16d, and A suction hole 16k is provided at a position facing the upper mold overflow cavity 15r (see Fig. 8(a) and Fig. 8(b)). The suction hole 16k is connected to a suction device not shown. By sucking air from the suction hole 16k while the workpiece W is clamped in the mold 14, the air remaining in the cavity 15n of the upper mold is discharged through the upper mold vent groove 15i. Resin mold, thereby preventing the generation of voids.

According to the above configuration, when the workpiece W held by the conveying hand D is carried into the mold mold 14, the workpiece W is positioned and positioned with the end surface of the workpiece slid to a position overlapping the bridge portion 16e1 of the pocket 16e. It is delivered to the lower mold 16 (placement recess 16h), so no matter what the shape of the workpiece W, accurate positioning with respect to the casting mold 14 will be performed, and no resin leakage will occur at the end of the workpiece.

Fig. 10(a) is a cross-sectional description of a trans-injection molding device that replaces the pocket part 16e as a movable part in other embodiments, and includes a movable runner gate part 16n (movable part) with a fixed cavity Figure. The same reference numerals are assigned to the same components as those in the above-mentioned embodiment, and the description is cited. The structure of the conveying hand D and the upper mold 15 are the same, and therefore the description will focus on the structure of the lower mold 16.

In the lower module 16a of the lower mold 16, a cylindrical fixed cavity 16m is assembled, and a plunger 16f is inserted. In addition, between 16 m of slots and 16 h of placement recesses, lower mold runner gates 16 n are provided so as to be capable of raising and lowering. The lower mold runner gate material 16n is connected and supported to the upper end of the lift rod 16p which penetrates the lower module 16a. The lower mold runner gate 16n is urged upward when the mold is opened by a coil spring or the like not shown.

A resin path is formed between the upper surface of the lower mold runner gate 16n and the opposing upper mold cavity 15g or the upper mold runner gate 15h. Especially with the upper mold runner gate A bridge portion 16n1 is formed on the facing surface of 15h, and the bridge portion 16n1 is arranged to overlap the upper end portion of the work W placed in the mounting recess 16h in a hanging shape. The bridging portion 16n1 has both ends formed in a wedge shape in such a way that the plate thickness becomes thinner toward the outer peripheral end connected to the upper mold cavity recess 15n, and further toward the outer peripheral end connected to the cavity 16m.

Fig. 10(b) is a cross-sectional explanatory view of the resin molding apparatus in Fig. 10(a) further as a movable part, including a lower mold bridge connected to the upper mold cavity recess and the upper mold vent groove 16q. In the lower module 16a of the lower mold 16, a cylindrical fixed cavity 16m is assembled, and a plunger 16f is inserted. Between the cavity 16m of the lower module 16a and the recessed portion 16h, a lower mold runner gate member 16n is vertically arranged. The lower mold runner gate material 16n is connected and supported to the upper end of the lift rod 16p which penetrates the lower module 16a. The lower mold runner gate 16n is urged upward when the mold is opened by a coil spring or the like not shown.

A resin path is formed between the upper surface of the lower mold runner gate 16n and the opposing upper mold cavity 15g or the upper mold runner gate 15h. In particular, a bridge portion 16n1 is formed on the surface facing the upper mold runner gate 15h, and the bridge portion 16n1 is arranged to overlap the upper end portion of the workpiece W placed in the mounting recess 16h in a hanging shape. The bridging portion 16n1 has both ends formed in a wedge shape so that the closer the outer peripheral end connected to the upper mold cavity recess 15n, and the closer the outer peripheral end connected to the cavity 16m, the thinner the plate thickness.

Furthermore, the upper mold clamp 15d is engraved with 15m of upper mold bridge connecting air grooves connected to the upper mold cavity recess 15n and the upper mold air groove 15i. At the position of the lower module 16a opposite to the upper mold bridge connecting air groove 15m, the lower mold bridge connecting air groove is set up and down. Piece 16q (movable piece). The lower mold bridge air fitting 16q is connected and supported on the upper end of the lifting rod 16p that penetrates the lower module 16a. The lower mold bridge air element 16q is urged upward when the mold is opened by a coil spring or the like (not shown). A ventilation path is formed between the upper surface of the lower mold bridge connecting air piece 16q and the opposite upper mold bridge connecting air groove 15m. In particular, a bridge portion 16q1 is formed, and the bridge portion 16q1 is arranged to overlap the upper end portion of the work W placed in the mounting recess 16h in a hanging shape. The bridging portion 16q1 has both ends formed in a wedge shape such that the closer the outer peripheral end connected to the upper mold cavity concave portion 15n, and the closer the upper mold overflow cavity 15r side end, the thinner the plate thickness.

As described above, in the configuration in which the lower mold runner gates 16n and the lower mold bridge air connections 16q are arranged on both sides of the recessed portion 16h, the workpiece holding portion 11 of the conveying hand D is in the short-side direction of the conveying device body 10. (The direction perpendicular to the paper surface of FIG. 10(b)) slides upward to perform positioning of the workpiece W and the mounting recess 16h, and delivery of the workpiece W.

Next, an example of the compression molding apparatus 18 of the lower mold cavity type provided in the press section C in parallel with the transfer molding apparatus 13 will be described. The compression molding apparatus shown in FIG. 11 has a structure in which the structure of the lower mold 16 is replaced with the upper mold 15 in the structure of the casting mold 14 of FIG. That is, the structure of the upper mold 15' in FIG. 11 is a structure in which the structure of the lower mold 16 in FIG. 10(b) is inverted, and the symbol is indicated by "." In the structure of the lower mold 16', the structure enclosed by the lower mold base 16a' and the lower module 16b' is different. Hereinafter, different configurations will be described.

The lower mold 16' supports the lower module 16b' in a ring shape along the outer peripheral edge of the lower mold base 16a'. On the upper end surface of the lower module 16b', a lower mold locking block (not shown) for positioning with the upper mold 15' is protrudingly provided.

Moreover, in the lower mold space enclosed by the lower module 16b', the ring-shaped lower mold clamp 16d' is suspended and supported by the lower mold base 16a' via the coil spring 16f'. In addition, the lower mold cavity 16e' is supported and fixed to the lower mold base 16a' surrounded by the lower mold clamp 16d'. The lower mold cavity 16e' (cavity bottom) and the lower mold clamp 16d' (cavity side) surrounding the lower mold cavity 16e' (cavity bottom) are used to form a lower mold cavity concave portion 16r.

On the clamping surface (upper end surface) of the lower mold clamp 16d', a lower mold bridge connecting air groove 16m' connected to the lower mold cavity concave portion 16r is engraved. An air groove 16m' is connected to the lower mold bridge and a plurality of lower mold vent grooves 16i' are connected. In each lower mold vent groove 16i', a stop pin 16j' is assembled so as to be openable and closable. The stop pin 16j' is assembled in the lower mold base 16a' in a state of being urged upward via the coil spring 16k'. Thereby, the front end (upper end surface) of the stop pin 16j' is supported at a position substantially flush with the bottom of the lower die vent groove 16i'.

It is preferable that the mold release film 17 is sucked and held on the lower mold clamping surface including the lower mold cavity concave portion 16r.

The conveyance hand D maintains the state of holding the workpiece W in the workpiece holding portion 11, enters the casting mold 14 (the left-right direction of the paper surface of FIG. 11), and suction-holds it in the mounting recess 15h' of the upper mold 15'. The workpiece holding portion 11 slides in the short-side direction of the conveying device body 10 (the direction perpendicular to the paper surface of FIG. 11), and the upper die bridge connecting air pieces 15q' respectively hang over the outer peripheral end of the workpiece W, in the vertical direction Move into the paper in Figure 11. The workpiece holding portion 11 not only holds the workpiece W by the chuck claws 11a, but can also be configured to be pushed to the mounting recess 15h' while sucking the workpiece W, and sucked and held. In the carrying hand D, the resin residue may adhere to the surface of the upper mold bridge connecting air piece 15q', so although there is no cleaning mechanism, it is better.

Furthermore, in the lower mold cavity recessed portion 16r, the pre-molding resin R1 (for example, pelletized resin, powdered resin, liquid resin, etc.) may be supplied by the transporting hand D (resin holding portion 12), or Only the pre-molding resin R1 is conveyed by another resin conveying device, and other resin conveying devices may also be used to take out only the excess resin R2 after molding. Furthermore, in the compression molding, when the excess resin R2 after molding is not allowed to flow out into the overflow cavity, the workpiece W and the resin are taken out integrally. In addition, although the lower cavity compression molding mold is taken as an example, in the case of the upper cavity compression molding mold, the resin R1 before molding can be placed on the workpiece and simultaneously carried into the mold by the conveying hand D . In addition, it may be a mold formed by upper and lower cavity recesses.

Here, while referring to FIG. 1, an example of the mold operation of the resin mold device will be described. First, the sub tank 2 is filled with the plate resin R1. The auxiliary storage tank 2 has no clean room countermeasures, so the operator maintains the state of putting the auxiliary storage tank 2 into the outer box (outer box) and puts it into the resin casting device. The resin supply door of the resin mold apparatus is opened, and the sub tank 2 is taken out from the outer box and mounted on the feeder 3. At this time, after the sub tank 2 is mounted on the feeder 3, the hook 2d3 of the bottom plate 2d is automatically connected to the connection portion 2f1 of the opening/closing arm 2f. As an example of the automatic connection method, when the sub tank 2 is slid laterally to the feeder 3 and placed, the hook 2d3 of the sub tank 2 and the connection portion (hook) 2f1 on the opening and closing actuator 2e side engage with each other. After connecting, close the resin supply door of the resin casting device. When the resin supply part B1 is turned on, the opening and closing actuator 2e operates, and the bottom plate 2d of the tank body 2a slides, thereby placing it on the flat plate of the punching metal 2d2 The resin R1 falls to the feeder 3. In order to smoothly supply the plate resin R1 into the feeder 3, the bottom plate 2d is The opening and closing control is performed at a predetermined timing. Since the resin supply door of the resin molding device is closed and the flat resin R1 is dropped, it is difficult or impossible for dust to escape to the outside of the resin molding device. Then, the feeder 3 oscillates the plate resin R1 and arranges it in a line. The plate resin R1 on the front side is grasped by the opening and closing claws 4a of the plate pickup 4, rotated by 90°, and inserted and held on the resin conveying tray 5 in an upright position的holding hole 5a.

After the flat resin R1 is loaded on the resin conveying tray 5, the resin conveying tray 5 moves from the resin supply position 7a on the resin conveying rail 7 to the standby position 7b of the conveying hand D waiting on the near side of the pressing part C ( Refer to Figure 2).

The workpiece W1 before forming is held by the robot hand E1 of the articulated robot E from the supply cassette 1a, and is placed on a lifter (not shown) at the standby position of the transport hand D located on the near side of the pressing part C. The transport hand D is held by the robot hand E1 of the robot E from the elevator, and is placed on the elevator (not shown) in the standby position of the transport hand D located on the near side of the pressing part C. The elevator supporting the workpiece W1 before forming rises, and the transport hand D located in the standby position is gripped by the chuck claw 11a of the workpiece holding portion 11 from the elevator to deliver the workpiece W1 before forming.

In addition, the plate push-up mechanism 5b is operated to deliver the pre-molding resin R1 to the resin holding portion 12 (first resin holding portion 12a), and the pre-molding resin R1 is held on the resin transport tray 5 that has moved to the standby position 7b. Specifically, the upper push rod 5c pushes up the plate resin R1 from the bottom of the holding hole 5a to be stored in the cylindrical housing portion 12a1, and closes the shutter 12a2, thereby delivering the plate resin R1 to the first resin holding portion 12a ( Refer to Figure 5(b)).

The conveying hand D holds the workpiece W1 before forming and the resin R1 before forming while moving Into the suppression section C. For example, it enters the transfer molding apparatus 13 that has opened the mold, places the pre-molding workpiece W1 on the lower mold 16, and fills the pre-molding resin R1 into the cavity 16e2 (see FIG. 6(b)).

Alternatively, it enters into the compression molding apparatus 18 that has opened the mold, sets the pre-molding workpiece W1 on the upper mold 15, and supplies the pre-molding resin R1 to the lower mold cavity recess 16r (see FIG. 11). When the conveying hand D is retracted from the casting mold 14, the mold is closed and transfer molding or compression molding is performed.

After the resin is molded, when the mold 14 is opened, for example, in the transfer molding device 13, the pocket member 16e is urged by the coil spring 16s (see FIG. 8(b)) to make the bridge portion 16e1 and the lower module 16a urge. Move in a separate way. Furthermore, the pocket member 16e is not limited to the coil spring 16s, and may be configured to be moved upward by a cylinder or a motor that can be driven separately. The workpiece W is kept sucked and held in the mounting recess 16h. Thereby, the excess resin R2 (molded product cavity) on the pocket 16e is cut from the molded product (workpiece W2 after molding) through the gate, and is separated and raised. The release film 17 is held on the clamping surface of the upper mold 15 by suction, so it is easily separated from the resin. In addition, the gate cut when the lower mold runner gate material 16n is provided and the lower mold bridge is connected to the gas element 16q is also performed in the same way.

The conveying hand D enters the opened mold 14 and the workpiece holding portion 11 holds the molded workpiece W2, and maintains the second resin holding portion 12b to absorb and hold the excess resin R2 (molded product cavity) from the mold. The mold 14 is moved out. Furthermore, when the conveyance hand D enters the casting mold 14, the position of the second resin holding portion 12b is switched from the state of FIG. 5(b) to the state of FIG. 5(a).

When the conveying hand D returns to the standby position, the molded workpiece W2 is delivered from the workpiece holding portion 11 to the elevator again, and the excess resin R2 adsorbed and held by the second resin holding portion 12b (suction pad 12b1) is desorbed and dropped. To the excess resin recovery part 6 (refer to FIG. 2) arranged directly below.

The resin conveyance tray 5 prepares for the next resin conveyance, and returns to the resin supply position 7a along the resin conveyance rail 7 from the standby position 7b. At this time, the bottom shutter 6a of the excess resin recovery part 6 is opened, and the excess resin R2 (molded product cavity) is discarded to the waste box 6c via the chute 6b.

In addition, the formed workpiece W2 delivered to the elevator maintains the state of being sucked and held by the robot hand E1 of the articulated robot E shown in FIG. 1, and is transferred to the workpiece accommodating part A and stored in the storage box 1b. Hereinafter, the same operation is repeated.

According to the above configuration, even if the transfer molding device 13 and the compression molding device 18 are used in the press section C, the workpiece storage section A, the resin processing section B, the conveying hand D, etc. can be shared. Therefore, a resin molding device can be provided. It does not undergo substantial changes to the device, but can respond to a variety of product needs. In addition, it is also possible to perform multiple repetitive transfer molding and compression molding molds for the same product as needed.

In particular, the pressing section C does not use a dedicated machine, but can be used in any of the following situations: supply the pre-molding resin R1 into the lower mold cavity, and press-feed the pre-molding resin R1 to the cavity by transfer molding The molding or compression molding allows the pre-molding resin R1 supplied into the lower mold cavity concave portion 16r to flow and overflow to perform the molding. Therefore, the versatility is high and the manufacturing cost can be reduced. Regarding the workpiece W, various workpieces such as semiconductor wafers and rectangular substrates can be handled.

(Modification)

In the above-mentioned embodiment, the case where one cavity is provided in the lower mold 16 in the transfer molding device 13 has been described, but as shown in FIG. 9, there may be multiple (for example, multiple columns and multiple rows).

In addition, in the pressing part C, the case where the transfer molding device 13 and the compression molding device 18 are used together has been exemplified, but as shown in FIG. 12, all of the transfer molding devices 13 or the compression molding device 18 may be used.

(Other embodiment 1)

The conveyance hand D merely moves back and forth in the front-rear direction with respect to the pressing portion C, but a configuration that moves back and forth in the left-right direction may be added. Hereinafter, the same reference numerals are assigned to the same members as the above-mentioned embodiment, and the description is cited, and the description is centered on the different configurations.

In FIG. 13, the supply box 1a that contains the workpiece W1 before forming and the storage box 1b that contains the workpiece W2 after forming are arranged on both sides via a plurality of press parts C. Moreover, the resin processing part B is provided in the supply cassette 1a side, and the supply side articulated robot E (display robot hand E1 and base part E4) and the storage side articulated robot E are respectively provided. The conveying hand D carries in the pre-molding workpiece W1 and the pre-molding resin R1 with respect to the mold 14 provided in the pressing section C, and unloads the molded workpiece W2 and excess resin R2 from the mold 14. In the transport hand D, from the workpiece supply side (supply box 1a and resin supply part B1), a plurality of pressing parts C are sandwiched to the workpiece storage side (storage box 1b), and linear guide rails are laid so that the units can be separated or connected to each other. 19. In the resin supply part B1, the sub tank 2, the feeder 3, the plate picker 4 (not shown), and the plate push mechanism 5b It is installed on the lower side of the gantry (indicated by a dotted line in FIG. 13), and installed at a position that does not affect the movement of the robot hand E1. When the pre-molding resin R1 is pushed up from under the frame, the conveying hand D stands by, and for delivery, the resin conveying tray 5 and the surplus resin recovery part 6 are not required. In addition, as the resin recovery part B2, a chute 6b and a waste box 6c for discarding excess resin R2 are provided.

The transport hand D is on the workpiece supply side, and delivers the pre-molding workpiece W1 from the supply-side articulated robot E to the workpiece holding section 11, and delivers the pre-molding resin R1 (plate resin) to the resin holding section 12 by the plate picker 4 . The conveying hand D holds the pre-molding workpiece W1 and the pre-molding resin R1, and moves in the left-right direction along the linear guide 19 to a predetermined pressing section C (for example, the transfer molding device 13). Then, the conveyance hand D moves in the front-rear direction to enter the mold mold 14 that has been opened, and the pre-molding work W1 and the pre-molding resin R1 are loaded.

After the forming, the workpiece W2 and the excess resin R2 are opened with the mold mold 14 and the gate is cut at the same time. Then, the conveying hand D enters the mold 14 to hold the molded workpiece W2 and the excess resin R2. The transfer hand D moves along the linear guide 19 to the workpiece storage side, and delivers the formed workpiece W2 to the multi-joint robot E on the storage side. Then, it may be assumed that the excess resin R2 is maintained and moved to the workpiece supply side along the linear guide 19, and the suction of the excess resin R2 is released directly above the chute 6b and discarded in the waste box 6c.

Thereby, regardless of the transfer or compression molding method, the common conveying hand D can be used to carry in the workpiece W1 before molding and the resin R1 before molding, and the workpiece W2 and the excess resin R2 after molding. Therefore, the structure of the device can be simplified and improved. Versatility.

(Other embodiment 2)

As shown in Figure 14, the carrying hand D may also include: a loader D1, which carries the pre-forming workpiece W1 and pre-forming resin R1 into the pressing section C; and an unloader D2, which carries out the formed workpiece W2 and excess from the pressing section C Resin R2. The supply box 1a that contains the workpiece W1 before forming and the storage box 1b that contains the workpiece W2 after forming are arranged on both sides via a plurality of press parts C. Moreover, the resin processing part B is provided in the supply cassette 1a side, and the supply side articulated robot E (the robot hand E1 and the base part E4 shown) and the storage side articulated robot E are respectively provided.

From the workpiece supply side (supply box 1a and resin processing part B), the plurality of press parts C are sandwiched to the workpiece storage side (storage box 1b), and the linear motion rail 19 is detachably laid. The loader D1 loads the pre-molding workpiece W1 and the pre-molding resin R1 into the mold mold 14 provided in the pressing section C, and the unloader D2 unloads the molded workpiece W2 and excess resin R2 from the mold mold 14.

In the resin supply part B1, the sub-tank 2, the feeder 3, the plate picker 4 (not shown), and the plate push-up mechanism 5b are provided on the lower side of the gantry, and the resin conveying tray 5 and the excess resin recovery part 6 are not required. In addition, on the workpiece storage side, as the resin collection part B2, a chute 6b and a disposal box 6c for discarding excess resin R2 are provided.

The loader D1 is on the workpiece supply side, and the pre-molding workpiece W1 is delivered from the supply side articulated robot E to the workpiece holding section 11, and the pre-molding resin R1 (plate resin) is delivered to the resin holding section 12 by the plate picker 4. The loader D1 holds the pre-molding workpiece W1 and the pre-molding resin R1, and moves along the linear guide 19 in the left-right direction to a predetermined pressing part C (for example, the transfer molding device 13). Then, carry hand D It moves in the front-rear direction and enters into the mold mold 14 that has been opened, and carries in the pre-molding work W1 and the pre-molding resin R1.

After the forming, the workpiece W2 and the excess resin R2 are opened with the mold mold 14 and the gate is cut at the same time. Then, the unloader D2 enters the casting mold 14 to hold the molded workpiece W2 and the excess resin R2. The unloader D2 moves along the linear guide 19 to the workpiece storage side, and delivers the formed workpiece W2 to the multi-joint robot E on the storage side. After that, the excess resin R2 may be moved to the workpiece storage side along the linear motion guide 19 while maintaining the excess resin R2, and the excess resin R2 may be released directly above the chute 6b and discarded to the disposal box 6c.

At this time, the transfer hand D is divided into the loader D1 and the unloader D2, so the productivity is improved.

In the above-mentioned embodiment, it is the time sequence when the mold 14 is opened after forming, and the gate is cut in the mold 14, but it can also be set to carry out the molded workpiece W2 and excess resin from the mold 14 R2 is an integrated object, and the gate is cut off outside the mold.

For example, in FIG. 15, the gate cutting part 20 is provided on the workpiece storage side where the storage box 1b is provided.

At this time, in the mold 14 of the casting mold, there is no need to cross the bridge portion of the workpiece W. Therefore, it is not necessary to move the workpiece holding portion 11 when the workpiece W1 before forming is placed in the mold and when the workpiece W2 is removed from the mold after forming.

The unloader D2 transports the integrated work piece W2 and the excess resin R2 from the casting mold 14 to the gate cutting part 20, and cuts the gate to form the The work W2 is separated from the excess resin R2. The molded workpiece W2 is held from the gate cutting part 20 by the storage-side articulated robot E, and is stored in the storage box 1b. In addition, the excess resin R2 may be recovered as an excess resin recovery part provided directly below the gate cutting part 20.

At this time, it is not necessary to use movable parts (cavity parts 16e, lower mold runner gate parts 16n, lower mold bridge air parts 16q, etc.) to provide bridging portions, so the mold structure can be simplified.

(Other embodiment 3)

As shown in FIG. 16, the same as FIG. 15 is that: the carrying hand D includes a loader D1 and an unloader D2. The loader D1 carries the workpiece W1 before forming and the resin R1 before forming into the pressing part C. The unloader D2 unloads the molded workpiece W2 and the excess resin R2 from the pressing section C. The supply box 1a that contains the workpiece W1 before forming and the storage box 1b that contains the workpiece W2 after forming are arranged on both sides via a plurality of press parts C. In addition, the resin supply part B1 (sub-tank 2, feeder 3, flat pick 4) of the resin processing part B is installed under the shelf on the side of the supply box 1a, and the resin recovery part B2 (chute 6b, disposal box 6c) It is installed on the side of the storage box 1b. Moreover, the supply side articulated robot E (the robot hand E1 and the base part E4 shown in the figure) and the storage side articulated robot E are respectively provided. In addition, although not shown, the plate push-up mechanism 5b is arranged on the near side of each pressing part C. As shown in FIG.

From the workpiece supply side (supply box 1a and resin supply part B1), a plurality of press parts C are interposed to the workpiece storage side (storage box 1b and resin recovery part B2), and a linear motion guide 19 is detachably laid. In addition, a plurality of pressing parts C are sandwiched from the workpiece supply side to the workpiece storage side, and resin conveying rails are also laid so that the units can be separated or connected to each other. 7. The resin conveying rail 7 movably supports the resin conveying tray 5 and the excess resin recovery part 6.

The loader D1 loads the pre-molding workpiece W1 and the pre-molding resin R1 into the mold mold 14 provided in the pressing section C, and the unloader D2 unloads the molded workpiece W2 and excess resin R2 from the mold mold 14.

The loader D1 is delivered by the supply-side articulated robot E to the workpiece W1 before forming, and moves to the front side of the predetermined pressing part C. In addition, the resin transport tray 5 holds the pre-molding resin R1 (flat resin) by the plate picker 4, and moves along the resin transport rail 7 to the front side of the pressing part C where the loader D1 is on standby. Then, the plate resin R1 is delivered to the loader D1 by the plate push-up mechanism 5b not shown. The loader D1 holds the pre-molding work W1 and the pre-molding resin R1 and carries it in to the press section C.

The unloader D2 enters the press section C after forming, receives the formed work W2 and the excess resin R2 cut through the gate, and carries it out to the front side of the press section C. The surplus resin R2 (molded product depression) is recovered by the surplus resin recovery part 6 provided integrally with the resin conveying tray 5 by releasing the suction of the unloader D2. The unloader D2 maintains only the formed workpiece W2, moves to the workpiece storage side, delivers the formed workpiece W2 to the storage side articulated robot E, and stores the formed workpiece W2 in the storage box 1b. In addition, the excess resin recovery part 6 containing excess resin R2 moves along the resin conveyance rail 7 to the workpiece storage side, opens the bottom flap 6a, and discards the excess resin R2 to the disposal box 6c via the chute 6b. In this embodiment, the resin conveying tray 5 and the excess resin recovery part 6 are integrated, but they may be separate bodies, or they may be able to move independently. Furthermore, the gate cut of the workpiece W2 after forming is It is done inside the casting mold, but it can also be done outside the mold.

(Other embodiment 4)

In this embodiment, the workpiece accommodating part A and the resin processing part B are separated and arranged on both sides via a plurality of pressing parts C. As shown in FIG. 17, the conveying hand D includes: a work loader D3, which conveys the pre-molding work W1 and the post-molding work W2; and a resin loader D4, which conveys the pre-molding resin R1 and the excess resin R2 after molding. The workpiece storage portion A is provided with: a supply box 1a for storing the workpiece W1 before forming; a storage box 1b for storing the workpiece W2 after forming; and an articulated robot E for taking out the workpiece W1 before forming and storing the workpiece W2 after forming. In addition, the resin processing part B is provided with a resin supply part B1 and a resin recovery part B2. That is, the resin supply part B1 including the sub-tank 2, the feeder 3, the plate pickup 4 (not shown), and the plate push-up mechanism 5b, and the resin collection part B2 including the chute 6b and the waste box 6c are provided.

The linear motion guide 19 is detachably laid from the workpiece accommodating part A to the resin processing part B with the plurality of pressing parts C sandwiched therebetween. The workpiece loader D3 is delivered by the articulated robot E from the supply box 1a to the workpiece W1 before forming, and then is carried into the mold 14 set in the pressing part C. The opened mold 14 takes out the molded workpiece W2 and delivers it to the articulated robot E. The articulated robot E stores the formed workpiece W2 in the storage box 1b.

The resin loader D4 push-up mechanism 5b from the plate uses the first resin holding portion 12a (refer to FIG. 5(b)) to receive the pre-molding resin R1 (plate resin), and to load it into the mold 14 (slot) provided in the pressing portion C , Cavity recesses, etc.). In addition, the resin loader D4 uses the second resin holding portion 12b (refer to FIG. 5(a)) to open the mold itself. The casting mold 14 sucks and holds and takes out the excess resin R2 after molding, moves to the resin collection part B2 to release the absorption of the excess resin R2, and discards it to the disposal box 6c via the chute 6b.

Thereby, the possibility that the resin dust easily generated in the resin processing part B adheres to the workpiece W supplied and accommodated from the workpiece accommodating part A is reduced, and the molding quality can be maintained at a high level.

In addition, the resin is not limited to plate resin, and may be granular resin or powder resin. The release film 17 may be a long film or a single film, or it may not exist. In addition, it may be an arrangement in which the upper mold cavity is covered with a release film, or an arrangement in which the lower mold cavity is covered with a release film. In addition, the arrangement of the plate push-up mechanism 5b, the chute 6b, and the disposal box 6c may not necessarily be the same as the switching interval between the first resin holding portion 12a and the second resin holding portion 12b.

(Other embodiment 5)

Figure 18 is the same as Figure 17 in that the workpiece accommodating part A and the resin processing part B are separately arranged on both sides via a plurality of pressing parts C, but the common conveying hand D carries the pre-molding work W1 and the pre-molding resin R1 in To the pressing part C, and carrying out the formed workpiece W2 and the excess resin R2 after forming from the pressing part.

From the workpiece accommodating part A, sandwiching the plurality of pressing parts C to the resin processing part B, a linear guide 19 is detachably laid. In addition, the resin conveying rail 7 is detachably laid from the resin processing part B to the pressing part C. As shown in FIG. The resin conveyance tray 5 and the excess resin collection part 6 are provided so as to be movable on the resin conveyance rail 7.

The carrying hand D is supplied by the articulated robot E to the box 1a before forming The piece W1 is delivered to the workpiece holding part 11, moved to the front side of the predetermined pressing part C, and waits. In addition, the pre-molding resin R1 (plate resin) is held on the resin conveying tray 5 and moved to the front side of the predetermined pressing part C. As shown in FIG. The flat plate push-up mechanism 5b, which is not shown, pushes up the flat plate resin R1 and delivers it to the resin holding part 12 (the first resin holding part 12a). The conveying hand D enters into the mold mold 14 that has been opened, and loads the pre-molding work W1 and the pre-molding resin R1.

After the resin mold is cast, when the mold 14 is opened, the workpiece W2 and the excess resin R2 are cut through the gate after the molding, and the conveying hand D enters, and the molded workpiece W2 is held by the workpiece holding part 11, and the molded workpiece W2 is held by the resin. The part 12 (the second resin holding part 12b) holds the excess resin R2 and carries it out to the front side of the pressing part C. At this time, the surplus resin recovery part 6 is on standby just below the conveyance hand D, so the adsorption of the second resin holding part 12b is released and the surplus resin R2 (molded product depression part) is recovered. The excess resin collection part 6 moves to the resin processing part B along the resin conveyance rail 7, and the bottom flap 6a is opened, and the excess resin R2 is discarded to the waste box 6c via the chute 6b. In addition, the conveying hand D moves to the workpiece accommodating part A while maintaining the state of holding the formed workpiece W2, and delivers the formed workpiece W2 to the articulated robot E to be stored in the storage box 1b.

At this time, the conveying hand D exclusively conveys the workpiece W, and the resin is exclusively conveyed by the resin conveying tray 5 and the surplus resin recovery part 6, so the productivity is improved compared to FIG.

In addition, the conveyance hand D adopts the common structure shown in FIG. 5(a) and FIG. 5(b), but it is also possible to separately provide the workpiece supply and storage and the resin supply and recovery.

In addition, the pressing section C is provided with multiple injection molding devices 13, but they can also be used at the same time Transfer injection molding device 13 and compression molding device 18.

The foregoing embodiments are described using a wafer-like workpiece W using a transfer molding device for upper mold cavity and lower mold cavity, but it may also be a transfer molding device for lower mold cavity and lower mold cavity. In addition, the transfer molding device for the upper mold cavity and the lower mold cavity may also be a device that also uses a compression device of the upper mold cavity.

The workpiece W may be a rectangular (square, rectangular, etc.) large-format panel in addition to the crystal circle (circular).

In addition to the plate resin, the mold resin may be granular resin, powder resin, liquid resin, or the like.

The release film can be a long film or a single film covering the clamping surface of the upper mold or the lower mold, but the film can also be set up and down.

The casting mold is provided with a cavity on the upper mold and a workpiece on the lower mold, but it can also be set as a cavity on the lower mold and a workpiece on the upper mold. In addition, cavities may be provided in the upper mold and the lower mold.

In addition, the excess resin R2 mainly exemplifies the cavity of the molded product for description, but in the case of compression molding, it may also be the excess resin generated at the bridge runner gate or the bridge gas fitting. The bridge runner gate or The bridging air element is formed by a movable element arranged at a position where the resin overflows in the mold cavity.

In addition, in the casting mold, gate cutting is performed at the timing of mold opening, but as shown in FIG. 15, gate cutting may be performed outside the mold. At this time, instead of using the bridge gate of the movable part, it may be a normal gate engraved on the mold clamping surface.

1a: Supply box

1b: storage box

1c: partition wall

2: Secondary storage tank

2e: Opening and closing actuator

2f: Open and close arm

2f1: connecting part

3: feeder

5: Resin handling tray

5a: Keep hole

6: Excess resin recovery department

6b: Chute

6c: Waste box

7: Resin handling track

8: Liquid resin supply part

8a: Syringe

8b: Syringe supply part

8c: Distribution unit

9: Direct-acting guide rail

13: Transfer injection molding device

14: Casting mold

17: Release film

18: Compression forming device

A: Workpiece storage department

B: Resin Processing Department

B1: Resin Supply Department

B2: Resin Recycling Department

C: Suppression Department

D: Carrying hands

E: Multi-joint robot

E1: Robot hand

E2: Horizontal connecting rod

E3: vertical link

E4: Base

F: Visual inspection department (cooling department)

G: curing oven

H: Control Department

R1: Resin before molding (flat resin)

R2: Excess resin

W1: Workpiece before forming

W2: Workpiece after forming (formed product after forming)

Claims (9)

A resin casting device, which is characterized by comprising: a workpiece accommodating part, respectively accommodating a workpiece before forming and a workpiece after forming; a pressing part, forming a cavity in either of the upper mold and the lower mold, and supplying the lower mold with the resin before forming , The molded workpiece and excess resin are molded; the resin processing section includes a resin supply section for supplying the resin before molding, and a resin recovery section for recovering the excess resin; a handling hand, at least the pre-molding work Carrying in to the pressing part, at least carrying out the formed workpiece from the pressing part; and a multi-joint robot, delivering the pre-forming workpiece to the conveying hand, and receiving the forming from the conveying hand A rear work piece, wherein the pre-molding resin is delivered from the resin supply part to the carrying hand, and after the shaping, the resin recovery part collects the resin from the carrying hand and the post-forming The excess resin separated from the workpiece. The resin casting apparatus according to claim 1, wherein the conveying hand moves the pre-molding workpiece and the pre-molding resin to the pressing section, and the post-molding work and the resin are carried out from the pressing section. The excess resin. The resin casting device according to claim 1 or claim 2, wherein the carrying hand includes a workpiece loader, which carries the workpiece before forming into the pressing part, and presses the workpiece after forming from the pressing part. Part is accommodated in the workpiece accommodating part; and a resin loader, which carries the pre-molding resin into the pressing part, and from the The pressing part carries out the excess resin after molding. The resin molding device according to claim 1 or claim 2, wherein the resin processing section is provided with: a resin conveying tray for arranging and conveying the resin before molding delivered to the conveying hand; and excess resin The recovery part recovers the excess resin. The resin molding apparatus according to claim 4, wherein the resin conveying tray and the excess resin recovery part are at a position where the resin supply of the resin processing part and the conveying hand move forward and backward relative to the pressing part Move back and forth between standby positions. The resin molding apparatus according to claim 4, wherein the excess resin recovery part opens and closes the bottom flap at a predetermined position to discard the excess resin to a disposal box. The resin molding apparatus according to claim 1 or claim 2, wherein the workpiece accommodating part and the resin processing part are separately arranged on both sides via the pressing part. The resin casting device according to claim 1 or claim 2, wherein the pressing part includes a bridge part and a movable part, and the bridge part is arranged so as to overlap with the end of the workpiece so as to become a concave part of the mold cavity. Connected air or mold resin moving passages, the cavity recesses are formed in any one of the upper mold and the lower mold, and the movable part moves upwards in such a way that it is separated from the mold clamping surface when the mold is opened The ground is supported, and the movable part is separated from the clamping surface of the mold when the mold is opened, so that the workpiece is protected The holding part moves toward the placement position to deliver the workpiece, the movable part is pressed by the mold closing action, and the end of the workpiece is clamped by the bridge portion to be clamped, and the placement position is controlled by the transporting hand The position where the held end of the workpiece coincides with the bridge portion. The resin casting device according to claim 8, wherein the movable part is any one of a pocket part, a runner gate part, and a vent formed by connecting the bridge portion to the cavity concave part By.

Images