TWI787411B - Resin molding device - Google Patents

Abstract

Efficiently supply film and molding resin.

The resin molding apparatus 1 of the present invention includes: a transporter 400, which is a tool for holding the molding resin R in the through holes 400a, 400b formed corresponding to the shape of the cavity recess 209 of the lower mold 206 and transporting it together with the film F; The first station 308 is used to hold the film F sent out from the film roll 306 and cut into a predetermined length, and the cut film F is combined with the carrier 400; the second station 310 is used to place the film F on the lower side and keep it state of the carrier 400, and is configured to be movable; the carrier picker 304 holds the carrier 400 in the state where the film F is held on the lower side, and is transported from the first station 308 to the second station 310; and the distributor 312, The molding resin R is injected into the inside of the through-holes 400 a and 400 b of the carrier 400 placed on the second table 310 .

Description

Resin molding device

The present invention relates to a resin molding device and a resin molding method for resin molding a workpiece with electronic components mounted on a base material.

Among the methods of manufacturing electronic devices such as semiconductor devices by resin molding, there is known a method of collectively resin-molding a workpiece in which a plurality of electronic components are mounted on a base material, and then cutting the molded product into individual pieces to form individual electronic devices. . One of such resin molding methods is compression molding.

Roughly speaking, the compression molding method is to supply a predetermined amount of resin to a molding area (cavity) provided in a molding mold composed of an upper mold and a lower mold, and place a workpiece in the molding area. A method of performing resin molding by clamping an upper mold and a lower mold. At this time, in the case of using a molding die in which a cavity is provided in an upper die, a method of collectively supplying a high-viscosity resin to a central position on a workpiece for molding is used. In this case, in order to fill the cavity with the resin to be supplied to the workpiece, since the molding resin must flow to the edge of the cavity, flow marks may be generated.

On the other hand, when using a molding die in which a cavity is provided in the lower mold, it is generally practiced to cover the mold surface including the cavity with a film, supply the molding resin with a uniform thickness, and hold it in the upper mold. Resin molding is performed by immersing the workpiece in molten molding resin. For example, devices described in Patent Document 1 (Japanese Patent Laid-Open No. 2010-247429 ), Patent Document 2 (Japanese Patent Laid-Open No. 2004-148621 ), Patent Document 3 (Japanese Patent Laid-Open No. 2017-024398 ), etc. expose.

prior art literature patent documents

Patent Document 1 Japanese Patent Laid-Open No. 2010-247429

Patent Document 2 Japanese Patent Laid-Open No. 2004-148621

Patent Document 3 Japanese Patent Laid-Open No. 2017-024398

In the resin molding apparatus of the conventional compression molding method exemplified in the above-mentioned patent documents, etc., the mechanism for supplying the workpiece or housing the molded product, the mechanism for measuring the thickness of the workpiece, the mechanism for conveying the molded product, etc. The composition of mode arrangement is a general practice. Therefore, there is a problem that the installation area of the resin molding apparatus tends to increase.

Furthermore, when the thickness measurement of the workpiece or the counting of the mounted electronic parts, or the thickness measurement of the molded product, and then carry out the process of conveying the workpiece and the molded product one by one (one by one), the process time will be lengthened and cause a bottleneck. There is a problem that it is difficult to improve the productivity of the whole apparatus.

In addition, in the resin molding apparatus of the conventional compression molding method exemplified in the above-mentioned patent documents, etc., in the case where the upper die of the molding die has a cavity structure, since the molding resin can be mounted on one workpiece Transport and resin molding are carried out in the upper state, so there is an advantage that the device configuration and manufacturing process can be simplified. However, when the lower mold of the molding die has a cavity structure, since the required amount of film (release film) or molding resin must be loaded after the workpiece is loaded, when the number of molded workpieces increases, There is a problem of complicated device configuration or manufacturing process.

In this way, especially in a resin molding apparatus in which a lower mold has a cavity, an apparatus that can efficiently supply workpieces, molded products, films, and molding resins, and that can simplify the configuration or process is desired.

The present invention was developed in view of the above circumstances, and its object is to provide a resin molding device that can be arranged in layers in the vertical direction through mechanisms for supplying, storing, measuring and transporting workpieces and molded products. The realization of the structure can reduce the installation area compared with the traditional device, and can shorten the process time compared with the traditional device by seeking the realization of the configuration of processing and transporting the workpiece and the molded product in two arranged states.

Furthermore, the present invention was developed in view of the above circumstances, and the object is to provide a resin molding apparatus capable of efficiently supplying workpieces, molded products, films, and molding resins used for resin molding, and whose configuration or manufacturing process can be simplified. and resin molding methods.

The present invention solves the above-mentioned problems by using the solutions described below as an embodiment.

The resin molding apparatus of the present invention uses: a molding mold; The conveying part for carrying out the molded product is a resin molding device for resin-molding the aforementioned workpiece, and its requirements include: a supply box lifter for lifting the supply box for storing the aforementioned workpiece; a storage box lifter arranged on the aforementioned supply box lifter At different positions in the vertical direction, the storage box for storing the aforementioned molded products is lifted; the supply rail is arranged in front of the aforementioned supply box elevator, and is used to place the aforementioned workpiece taken out from the predetermined position of the aforementioned supply box; the storage track, While placing the molded product, it passes through the storage box; the workpiece measuring device is arranged under the supply rail, and measures the thickness of the workpiece on the supply rail from the lower side; the supply pick-up a device for holding the aforementioned workpiece on the aforementioned supply track and transporting it to the aforementioned transport section; and a storage picker for holding the aforementioned molded product on the aforementioned transport section and transporting it to the aforementioned storage track; The device, and the aforementioned storage track system are repeated and arranged in the up and down direction.

According to such a configuration, it is possible to achieve a configuration in which the mechanisms for supplying, storing, measuring thickness, and conveying workpieces and molded products are arranged in layers in the vertical direction. Therefore, the installation area of the device can be greatly reduced compared with a conventional device in which components are arranged side by side in a planar manner.

Furthermore, preferably, the aforementioned supply track is configured in two rows so that the two aforementioned workpieces can be arranged and placed in the left-right direction, and the aforementioned workpiece measuring device has two rows of the aforementioned two aforementioned workpieces on the aforementioned supply track. One or two thickness sensors that measure each thickness with a predetermined scan. According to this structure, the same corresponding positions of the two workpieces W can be scanned simultaneously by one or two thickness sensors. Therefore, since two workpieces W can be measured in one scan with the shortest scan distance and scan time, the process time can be greatly shortened.

Furthermore, it is preferable to further include a workpiece heater for heating the workpiece from the lower surface side, and the workpiece heater is located above the supply rail so that the workpiece held by the supply picker can be positioned closer to the outer periphery of the workpiece. The position on the outer side and the position opposite to the bottom are arranged so as to move forward and backward. According to such a configuration, the workpiece W held by the supply picker can be heated (preheated) by the workpiece heater in the middle of the upward moving path. Therefore, compared with a conventional device in which components are arranged side by side in a planar manner, the installation area of the device can be greatly reduced.

In addition, it is preferable that the left-right direction carry-in passage for the supply picker to convey the workpiece to the conveyance unit and the left-right direction carry-out passage for the storage picker to convey the molded product from the conveyance unit are set to be parallel in the front-rear direction. According to this configuration, since the loading-in operation of the workpiece by the supply picker and the unloading of the molded product by the storage picker can be performed simultaneously and in parallel, compared with the traditional device in which the loading-in and unloading lanes are overlapped, the process The time can be greatly shortened.

Furthermore, the resin molding apparatus of the present invention belongs to the molding process using an upper mold for holding a workpiece on which an electronic component is mounted on a base material, and a lower mold formed with a cavity recess for supplying molding resin through a film. A resin molding device that uses a mold to perform resin molding on the aforementioned workpiece and process it into a molded product. Its requisites include: a conveying tool that is formed with a through hole corresponding to the shape of the concave portion of the aforementioned mold cavity, and is held in the aforementioned through hole. A device for conveying the aforementioned molded resin together with the aforementioned film; a first unit for holding the aforementioned film fed from a roll of film and cut to a predetermined length, and combining the aforementioned cut film with the aforementioned transporter; second unit , placing the aforementioned conveyer in a state where the aforementioned film is kept on the lower side, and is constituted as Movable; the conveyer picker, which holds the conveyer in the state where the film is kept on the lower side, and conveys it from the first station to the second station; and the dispenser, which injects the molding resin into the second station The inner side of the aforementioned through-hole of the aforementioned carrier placed on it.

According to such a configuration, the first station for supplying the film and the second station for supplying the molded resin are separately installed, and the film and the molded resin are held on the conveyor. Preparation of the required film or preparation of the molding resin can be performed in parallel. Therefore, the process time can be greatly shortened compared with conventional devices that perform these processes by the same platform.

Furthermore, it is preferable that the conveyer has two rows of film holding parts so that the two films can be aligned and held in the left-right direction, and each of the film holding parts has a resin injection hole corresponding to each of the above-mentioned films as the above-mentioned. Through hole. According to this structure, the two films on which the molding resin is respectively loaded can be held by one conveyer, and can be conveyed to the mold for molding. Therefore, the process time can be greatly shortened compared with the conventional device that transports films one by one with a single conveyor.

Moreover, it is preferable that the said 1st stage and the said film roll are facing up and down and are provided in a layered form. According to this structure, the installation area of the device can be reduced compared with a conventional device in which the components are arranged side by side in a planar manner.

Furthermore, it is preferable to further include a resin heater for heating from the upper surface side of the carrier holding the film and the molding resin. According to this structure, since the molding resin can be heated immediately after being mounted on the film to liquefy the mounting surface, especially In the case of using a granular or powdery molding resin, dust (fine powder of resin, etc.) can be prevented from occurring, thereby suppressing the occurrence of defective products.

Furthermore, the resin molding apparatus of the present invention belongs to a resin molding apparatus that uses a molding die including an upper mold and a lower mold to resin-mold a workpiece with electronic components mounted on a base material and process it into a molded product, Its requirements are to have: a first conveying part, a first holding part for holding the workpiece on the upper surface, and a second holding part for holding the molded product obtained by resin molding, and hold the predetermined holding of the workpiece to the upper mold. position transfer, and transfer the aforementioned molded product to a predetermined position outside the aforementioned molding die; The fourth holding part of the film conveys the film and the molded resin to a predetermined holding position of the lower mold, and holds the conveyer in which the holding state of the film and the molded resin is released, and transfers the film and the molded resin to the mold for molding. and convey the used film remaining in the lower mold in the state where the molded product obtained by resin molding has been taken out, and convey it to a predetermined position outside the molding mold.

According to this configuration, since the workpiece and molded product used for resin molding, as well as the film and molding resin can be efficiently conveyed, the process time can be shortened compared with conventional devices. Moreover, the device configuration and manufacturing process can also be simplified.

Moreover, preferably, the aforementioned workpiece is a narrow strip-shaped workpiece; the aforementioned film is a narrow strip-shaped thin film corresponding to the aforementioned narrow strip-shaped workpiece; The aforementioned first holding portion has two rows of workpiece holding portions that can arrange and hold the two aforementioned strip-shaped workpieces so that the longitudinal directions of the strip-shaped workpieces are parallel; the aforementioned second holding portion can hold the aforementioned The two aforementioned molded products obtained by processing the strip-shaped workpiece have two rows of molded product holding parts arranged and held in a manner that makes the long-side direction of the molded product parallel; The long side direction of the strip-shaped film is arranged and held in parallel to have two rows of film holding parts; the aforementioned third holding part has a carrier holding part for holding the aforementioned carrier; the aforementioned fourth holding part can be used The above-mentioned two strip-shaped films that have been completed have two rows of carry-out film holding portions that are aligned and held so that the longitudinal directions of the strip-shaped films are parallel. According to this configuration, since two simultaneous transfers of the workpiece and the molded product, and the film and the molding resin can be realized, the process time can be greatly shortened compared with the conventional device that transfers one by one.

In addition, preferably, the aforementioned workpiece is a narrow strip-shaped workpiece, or a wider workpiece wider than the narrow strip-shaped workpiece; the aforementioned film is a narrow strip-shaped strip corresponding to the aforementioned narrow strip-shaped workpiece. film, or a wide film wider than the strip-shaped film; the aforementioned 3rd holding part has a carrier holding part as the aforementioned carrier, and it is so that two aforementioned strip-shaped films can be used to make the strip-shaped film A strip-shaped film carrier with two rows of film holders held in parallel to the longitudinal direction of the film, or a wide film carrier with one film holder for holding a piece of the aforementioned wide film. According to this structure, since the workpiece to be processed into a molded product is a narrow workpiece or a wide workpiece, it can be kept different by the common carrier holder. Since the film is loaded into the conveyor, it can be configured to supply the film with simple switching.

Furthermore, it is preferable that the first holding portion has two rows of workpiece holding portions so that the two aforementioned narrow workpieces can be aligned and held so that the longitudinal directions of the narrow workpieces are parallel. It is replaceable with a workpiece holding part that holds a aforementioned wide workpiece; the aforementioned second holding part is to use the two aforementioned formed products obtained by processing the aforementioned narrow workpiece to make the length of the formed product The configuration having two rows of molded product holding parts aligned and held in parallel to the side direction is interchangeable with the configuration having one molded product holding part holding one molded product obtained by processing the aforementioned wide workpiece. According to this structure, even if it is either a narrow workpiece or a wide workpiece, it is possible to transfer the workpiece and the molded product by replacing the simple structure of the first holding part and the second holding part.

Moreover, preferably, the aforementioned film is a narrow strip-shaped film corresponding to the aforementioned strip-shaped workpiece, or a wide-width film wider than the narrow strip-shaped film; the aforementioned 4th holding portion has a film holding portion, It is an area where the two narrow regions where the two strip-shaped films are aligned and held in parallel to the left and right direction and the wide region where one piece of the aforementioned wide-width film is held are overlapped. A plurality of adsorption parts that adsorb and hold the thin film are arranged. According to this structure, the plurality of suction parts are arranged at positions where the film can be held regardless of the situation of suction and holding of the narrow film or the situation of suction and holding of the wide film, so that the narrow film and the wide film can be carried out. Any kind of thin film that does not require replacement of the composition, etc.

In addition, it is preferable that the aforementioned carrier is provided with a plurality of units so that the cleaning process of cleaning the aforementioned carrier, the film setting process of combining the aforementioned film with the aforementioned carrier, and dropping the aforementioned mold on the aforementioned carrier that has been combined with the aforementioned film Different processes such as a resin casting process for making resin and a resin supply process for supplying the film and the molding resin to the mold for molding are performed. According to such a structure, by circulating each carrier in each process for performing resin molding, the waiting time of a carrier in each process can be shortened, and productivity can be improved.

Moreover, it is preferable that the aforementioned carrier has a first adsorption hole that generates an adsorption force to hold the aforementioned film; The position is to generate the second adsorption hole of adsorption force. According to such a configuration, the carrier can be conveyed by the third holding portion in a state where the film is adsorbed to the lower surface of the carrier.

Furthermore, the resin molding method of the present invention is a resin molding method that uses the aforementioned resin molding apparatus to perform resin molding. A film setting process for combining the film on the carrier, a resin dropping process for dropping the molding resin on the carrier combined with the film, and a resin supplying the film and the molding resin to the molding die Between the supply processes, the above-mentioned plurality of conveyers are processed in different processes. According to such a configuration, by circulating each carrier in each process for performing resin molding, the carrier waiting time for each process can be shortened, and productivity can be improved.

According to the present invention, the installation area can be reduced compared with conventional devices through the realization of a structure in which the mechanisms for supplying, storing, measuring thickness, and conveying workpieces and molded products are arranged in layers in the up and down direction. Furthermore, by realizing the realization of processing and transporting workpieces and molded products in a two-arranged state, the process time can be shortened compared with conventional devices.

Furthermore, according to the present invention, it is possible to realize a configuration in which two or more cavities are provided in one lower mold, and resin molding is performed while arranging workpieces in each cavity. In particular, the process time can be shortened compared with conventional devices because the workpieces and molded products used for resin molding, as well as films and molding resins can be efficiently supplied. Furthermore, the device configuration and manufacturing process can be simplified.

1.2‧‧‧Resin molding device

100A, 500A‧‧‧Workpiece handling unit

100B, 500B‧‧‧press unit

100C, 500C‧‧‧dispensing unit

103‧‧‧Supply box elevator

104, 104A, 104B‧‧‧supply track

108, 108A, 108B‧‧‧Storage track

113‧‧‧Storage box lift

114‧‧‧Workpiece Measuring Device

116‧‧‧Workpiece heater

118‧‧‧Measuring device for molded products

120‧‧‧Supply Pickup

122‧‧‧The first storage picker

124‧‧‧The second storage picker

202‧‧‧Mold for molding

204‧‧‧upper mold

206‧‧‧Lower mold

210‧‧‧1st loader (1st conveying part)

212‧‧‧The second loader (the second conveying part)

302‧‧‧Preparation table

304‧‧‧Conveyor picker

306, 306A, 306B‧‧‧film reel

308‧‧‧Film Platform (1st Unit)

310‧‧‧Resin drop platform (2nd unit)

312‧‧‧Distributor

314‧‧‧Resin Heater

400‧‧‧Conveyor

F‧‧‧Film

Fd‧‧‧used film

R‧‧‧molding resin

W‧‧‧workpiece

Wp‧‧‧Molded products

Fig. 1 is a plan view of an example of a resin molding apparatus according to an embodiment of the present invention.

Fig. 2 is a left side view of the II-II position in Fig. 1 .

Fig. 3 is a plan view of an example of a supply rail of the resin molding apparatus of Fig. 1 .

Fig. 4 is a plan view of an example of storage rails of the resin molding apparatus of Fig. 1 .

Fig. 5 is a left side view of the V-V position in Fig. 1 .

FIG. 6 is a left side view of VI-VI in FIG. 1 .

Fig. 7 is a left side view of the VII-VII position in Fig. 1 .

FIG. 8 is a front view of the VIII-VIII position of FIG. 1 .

Fig. 9 is a plan view of an example of a carrier of the resin molding apparatus of Fig. 1 .

Fig. 10 is a plan view of an example of a molding die of the resin molding apparatus of Fig. 1 .

Fig. 11 is an explanatory view showing the operation of the resin molding apparatus according to the embodiment of the present invention.

FIG. 12 is an explanatory diagram of operations following FIG. 11 .

FIG. 13 is an explanatory diagram of operations following FIG. 12 .

FIG. 14 is an explanatory diagram of operations following FIG. 13 .

FIG. 15 is an explanatory diagram of operations following FIG. 14 .

FIG. 16 is an explanatory diagram of operations following FIG. 15 .

FIG. 17 is an explanatory diagram of operations following FIG. 16 .

FIG. 18 is an explanatory diagram of operations following FIG. 17 .

FIG. 19 is an explanatory diagram of operations following FIG. 18 .

FIG. 20 is an explanatory diagram of operations following FIG. 19 .

FIG. 21 is an explanatory diagram of operations following FIG. 20 .

FIG. 22 is an explanatory diagram of operations following FIG. 21 .

FIG. 23 is an explanatory diagram of operations following FIG. 22 .

FIG. 24 is an explanatory diagram of operations following FIG. 23 .

FIG. 25 is an explanatory diagram of operations following FIG. 24 .

FIG. 26 is an explanatory diagram of operations following FIG. 25 .

FIG. 27 is an explanatory diagram of operations following FIG. 26 .

Fig. 28 is a plan view of a modified example of the resin molding apparatus according to the embodiment of the present invention.

Fig. 29 is a block diagram showing an example of a control structure according to the embodiment of the present invention.

Fig. 30 is a flow chart showing an example of resin supply operation according to the embodiment of the present invention.

Embodiment of the invention (overall composition)

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic view (plan view) of an example of a resin molding apparatus 1 according to an embodiment of the present invention. 2 to 10 are schematic diagrams showing details of each configuration of the resin molding apparatus 1 . In addition, for the expediency of description, in each figure, arrows may be used to describe the front and rear, left and right, and up and down directions of the resin molding apparatus 1 . In addition, in all the drawings for explaining the respective embodiments, members having the same functions are assigned the same symbols, and overlapping descriptions may be omitted.

The resin molding apparatus 1 of this embodiment is an apparatus for performing resin molding of a workpiece (molded article) W using a molding die 202 including an upper die 204 and a lower die 206 . Next, the resin molding apparatus 1 holds the workpiece W by the upper mold 204, covers the cavity (cavity) 208 (including a part of the mold surface 206a) provided on the lower mold 206 with a film (release film) F, and supplies the molding resin R to carry out the upper mold. A compression molding apparatus in which the mold 204 and the lower mold 206 are clamped, and the workpiece W is immersed in the molten molding resin R to perform resin molding will be described as a main example. In addition, the mold cavity 208 is defined by the mold cavity concave portion 209 that is recessed into a predetermined shape on the upper surface of the lower mold 206 , and can be compression-molded by supplying the molding resin R through the film F.

First, the workpiece W to be molded has a configuration in which a plurality of electronic components Wb are mounted on the base material Wa in a matrix form. more detail For example, examples of the substrate Wa include a strip-shaped resin substrate, a ceramic substrate, a metal substrate, a carrier plate (carrier plate), a lead frame, a wafer, and other plate-shaped members (strip-shaped rectangular workpieces). ). In addition, examples of the electronic component Wb include semiconductor wafers, MEMS wafers, passive elements, radiator plates, conductive members, spacers, and the like. In addition, as will be described later, an apparatus modification that can be used particularly when a square shape or a circle shape is used can also be considered as the base material Wa.

Examples of the method of mounting the electronic component Wb on the base material Wa include mounting methods such as flip chip mounting and wire bonding mounting. Alternatively, when the substrate (glass or metal carrier plate) Wa is peeled from the molded product after resin molding, there are also adhesive tapes with heat peelability or ultraviolet curable resin that is hardened by ultraviolet radiation. A method of setting the electronic part Wb.

On the other hand, as an example of the molding resin R, a granular thermosetting resin (for example, a filler-containing epoxy-based resin) can be used. In addition, it is not limited to the above-mentioned state, and other states (shape) such as liquid, powder, columnar, plate, sheet, etc. may be used.

In addition, among the examples of the film F, film materials excellent in heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine Impregnated glass fiber cloth, polypropylene, polyvinylidene chloride, etc. are very suitable. The film F may be, for example, a strip-formed strip-shaped film corresponding to the strip-shaped workpiece W. As shown in FIG.

Next, the outline of the resin molding apparatus 1 of this embodiment is demonstrated. As shown in Figure 1, the resin molding device 1 has: The workpiece processing unit 100A mainly performs the supply of the workpiece W and the storage of the molded product Wp after resin molding; the pressing unit 100B mainly performs the processing of resin molding the workpiece W into the molded product Wp; and the distributing unit 100C mainly The supply of the film F and the molding resin R, and the storage (disposal) of the used film Fd after resin molding are performed as the main configuration. In addition, in this embodiment, the resin molding of the compression molding method which provides two cavities in one lower die and arranges two workpieces W to carry out resin molding collectively to obtain two molded products Wp at the same time is mentioned. device as an example.

In this embodiment, units such as the workpiece processing unit 100A, the pressing unit 100B, and the dispensing unit 100C are connected and assembled. In one example, the workpiece processing unit 100A, the pressing unit 100B, and the distributing unit 100C are arranged side by side sequentially from the left in the left-right direction. In addition, there is an arbitrary number of guide rails (not shown) provided in a straight line across the units, and a first loader (first conveying part) 210 for conveying workpieces W and the like, and a second loader for conveying films F and the like. The device (second conveying part) 212 is provided so as to be able to move between predetermined units along any guide rail. In addition, since these loaders 210 and 212 not only carry out, for example, the operation of loading the workpiece W into the molding die 202, but also carry out the operation of carrying out the molded product Wp from the molding die 202, they also serve as off loaders. ) function.

Therefore, the configuration of the resin molding apparatus 1 can be changed by changing the configuration of the unit. For example, although the configuration shown in FIG. 1 is an example of setting three pressing units 100B, it may also be configured such that only one pressing unit 100B is installed, or a tree of two or more units are connected and set. Grease molding apparatus (not shown). In addition, other units may also be provided. For example, a unit for supplying molding resin R different from the dispensing unit 100C, or a unit (not shown) for supplying members assembled with the workpiece W in the mold is provided. In one example, the member may also be a plate-shaped member that functions as a heat dissipation plate or a shielding plate. In this case, after laminating|stacking a plate-shaped member on the film F, you may supply and convey the mold resin R on a plate-shaped member.

(workpiece handling unit)

Next, the conveying operation of the workpiece W and the molded product Wp will be described in detail, focusing on the configuration of the workpiece processing unit 100A included in the resin molding apparatus 1 .

First, the workpiece processing unit 100A includes a supply cassette elevator 103 for lifting and lowering the supply cassette 102 storing a plurality of workpieces W, and a storage cassette elevator 113 for lifting and lowering a storage cassette 112 storing a plurality of molded products Wp. The storage cassette lifter 113 is disposed at a position different from the supply cassette lifter 103 in the vertical direction. For example, these elevators 103, 113 may be arranged in a layered state facing up and down in a planar view. Here, known stacking magazines, slit magazines, and the like can be used for the supply magazine 102 and the storage magazine 112 . In the present embodiment, the mounting surfaces of the electronic components Wb are each housed in a downward state of the workpiece W and the molded product Wp. In addition, from the viewpoint of protecting the electronic component Wb, it is preferable to use a slot box in which the workpieces W are inserted into and held in recesses facing each other inside the cassette frame, and the workpieces W are held separately from each other. In addition, the supply box elevator 103 is configured to pass through the way that the supply box 102 is raised and lowered. Take out the workpiece W from the predetermined position. The storage case lifter 113 is configured to store the molded product Wp at a predetermined position by holding the storage case 112 to move up and down.

Next, the workpiece processing unit 100A includes a supply rail 104 which is arranged in front of the supply magazine 102 and on which the workpiece W taken out from the supply magazine 102 is placed. In the present embodiment, the relay rail 106 through which the workpiece W passes is provided between the supply magazine 102 and the supply rail 104, but it may be configured to omit it. In addition, a well-known pusher etc. (not shown) can be used for moving the workpiece W from the supply magazine 102 to the supply rail 104 .

Here, the supply rail 104 avoids the mounting position of the electronic component Wb, supports the longitudinal side of the workpiece W from below by a pair of rails, and guides the workpiece W in the front-rear direction from the side. Furthermore, the supply rail 104 is configured in two rows (104A, 104B in the figure) so that two workpieces W can be placed side by side in the lateral direction in the short side direction, and has a moving mechanism (not shown) that can move in the left and right directions. icon). With this configuration, after the workpiece W taken out from the supply magazine 102 is placed on one row (for example, 104A), the supply rails 104A, 104B are moved in a predetermined direction (for example, right) on either the left or right, and the lower row can be moved. One workpiece W is placed on the other row (for example, 104B). In addition, each of the supply rails 104A and 104B is configured to have a variable width between rails in accordance with the width of the workpiece W. As shown in FIG.

Next, the workpiece processing unit 100A is equipped with a workpiece measuring device 114, which is arranged below the supply rail 104 and is configured to be movable in the front, rear and left and right directions so as to measure the workpiece W on the supply rail 104 from the lower side (electronic parts). Mounting surface side of Wb) to measure the thickness of workpiece W. The workpiece measuring device 114 is a laser displacement meter or a camera (monocular camera) or compound eye camera), and measure the thickness of the workpiece W according to the output data of these measuring devices. In addition, the "thickness measurement" referred to here includes the presence or absence of electronic components Wb mounted on the substrate Wa, the measurement of the mounting height of the electronic components Wb, the measurement of the displacement of the mounting position, the measurement of the number of mountings, etc. Measure. Based on the results of "thickness measurement" here, such as the presence or absence of mounting of electronic parts Wb or the mounting height, etc., the volume of electronic parts Wb mounted on the workpiece W is calculated, and by adjusting the supply amount of molding resin R, the The molded thickness of molded products can be controlled with high precision.

Here, the workpiece measuring device 114 has two thickness sensors 114a, 114b for measuring the respective thicknesses of the two workpieces W on the two supply rails 104A, 104B. In one example, a thickness sensor 114a is disposed at a position corresponding to the workpiece W in the right column, and a thickness sensor 114b is disposed at a position corresponding to the workpiece W in the left column. With this configuration, the same corresponding position of each workpiece W can be scanned at the same time, and two workpieces W can be measured in one scan with the shortest scanning distance and scanning time. Therefore, the process time can be greatly shortened. The measurement action of the workpiece W in one scan, as long as the pattern formed by the connecting lines between the near ends of the straight line that divides the workpiece W vertically or laterally into n (n is an integer greater than 2), the workpiece It is only necessary to measure the workpiece W at predetermined intervals while moving the thickness sensors 114a and 114b. In this manner, the thickness of the base material Wa of the workpiece W or the height of the electronic component Wb can be measured arbitrarily according to "one scanning operation (one scan)" in a predetermined pattern. In addition, in the configuration of this embodiment, the scanning operation (movement in the front, rear, left, and right directions) can be performed by the mechanism that moves the supply rails 104A, 104B for placing the workpiece W in the left and right directions, and the workpiece can be measured. The mechanism for moving the tool 114 in the front-back direction is implemented with a simple structure. In addition, like the supply rails 104A, 104B, the distance between the thickness sensors 114a, 114b is variable in accordance with the width of the workpiece W. As shown in FIG. In this way, even if the size (width) of the workpiece W changes, two workpieces W can be measured in one scan.

In addition, as a modification example, in one scan of the workpiece W measurement operation, the cameras as the thickness sensors 114a and 114b may collectively capture a predetermined width during one movement in the front and rear direction to perform workpiece W alignment. Measurement of surface thickness. In addition, the workpiece measuring device 114 may be moved forward, backward, left, and right to perform a scanning operation. In addition, a configuration may be adopted in which one thickness sensor is provided and two workpieces W are sequentially measured with one predetermined scan (not shown).

Furthermore, although the workpiece measuring device 114 is preferably used to measure the thickness of the workpiece W from the lower side on the workpiece W on the supply rail 104 in relation to the supply operation of the workpiece W described later; Composition for measuring the thickness of workpiece W. In this case, the workpiece measuring device 114 may be provided on either or both of the upper and lower surfaces of the relay rail 106 through which the workpiece W passes. In addition, the workpiece measuring device 114 may also be configured to read not only the thickness of the workpiece W, but also the identification information attached to the workpiece W (such as a two-dimensional code). Furthermore, the code reader 115 capable of reading the two-dimensional code of the workpiece W may be provided on either the upper or lower surface of the relay rail 106 . The identification information of the workpiece W can be identified which workpiece W it is by attaching, for example, a serial number or a non-repetitive code. By correlating and recording the identification information such as the detailed conditions of resin molding, it is possible to implement a program for improving traceability as described later.

Next, the workpiece processing unit 100A includes a supply picker 120 that holds the workpiece W placed on the supply rail 104 and transports it to a predetermined position. In addition, the "pickup" referred to below is a configuration corresponding to a pick-and-place mechanism that transfers a predetermined object between arbitrary positions. In this supply picker 120, there is a known holding mechanism (for example, a structure having holding claws for clamping, a structure having suction holes communicated with the suction device and performing suction, etc.) in terms of the mechanism for holding the workpiece W (not shown). Show). In addition, a well-known mechanism, such as a vacuum pump, can be used for an adsorption|suction device (the same applies hereinafter). Here, the supply picker 120 is configured to be able to move left and right and up and down. With this configuration, the workpiece W placed on the supply rail 104 is held and raised, and finally can be conveyed (supplied) to the first holding portion 210A described later.

Furthermore, the supply picker 120 of this embodiment is configured so that the above-mentioned holding mechanisms are arranged in two rows in the left-right direction at positions corresponding to the two workpieces W on the two-row supply rails 104A, 104B. With this configuration, the two workpieces W on the two-row supply rails 104A, 104B can be simultaneously held and conveyed in a state aligned in the left-right direction. In other words, the workpieces W can be held so that their longitudinal directions are aligned in parallel.

Next, workpiece processing unit 100A has workpiece heater 116 for heating workpiece W from the lower surface side. Here, as a configuration for heating the workpiece W, a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) (not shown) is disposed on the upper surface of the workpiece heater 116 . With this configuration, by preheating the workpiece W before being loaded into the molding die 202 for heating, the stretching of the workpiece W in the molding die 202 can be suppressed. In addition, as a modification example, it is also possible to consider The configuration of the component heater 116. In this case, a heater may be provided on the first holding portion 210A (first loader 210 ). In this case, preheating may be performed while the workpiece W is held by the first holding portion 210A. In addition, a heater may be provided on the first loader 210 . In this case, when transferring the workpiece W, it is possible to avoid the position of the first holding portion 210A, and to perform preheating during the conveyance of the workpiece W.

The workpiece heater 116 of the present embodiment is disposed above the supply rail 104 so as to be movable forward and backward on the lower surface side of the workpiece W held by the supply picker 120 (see FIG. 2 ). That is, the workpiece heater 116 can be said to be arranged so as to be movable between a position outside the outer periphery of the workpiece W and a position directly below the lower surface of the workpiece W. As shown in FIG. With this configuration, a preheating process for heating the workpiece W before resin molding can be performed. In addition, when the workpiece heater 116 is moved to a position directly under the lower surface of the workpiece W, the supply picker 120 holding the workpiece W is moved downward to perform an operation of bringing the workpiece W close to the workpiece heater 116. become more efficient heating.

In addition, the workpiece heater 116 of this embodiment is configured so that the above-mentioned heating mechanisms are arranged in two rows in the left-right direction at positions corresponding to the two workpieces W held by the supply picker 120 . With this configuration, the two workpieces W held side by side by the supply picker 120 can be heated simultaneously and equally.

In this way, the workpiece W held by the supply picker is heated by the workpiece heater 116 above the supply rail 104, that is, during the movement in the vertical direction by the supply picker (preheating process). Composition can be realized. Therefore, compared with a conventional device in which components are arranged side by side in a planar manner, the installation area of the device can be greatly reduced.

Next, the first loader 210 cooperating with each mechanism of the workpiece processing unit 100A has, on its upper surface, a first holding portion 210A for transferring the workpiece W to a predetermined holding position of the upper mold 204 . This first holding portion 210A is for placing the workpiece W conveyed by the supply picker 120 when the supply rail 104 is moved to a lateral (in one example, rightward) position. When the workpiece W is handed over, the supply picker 120 will go through the preheating process on the supply track 104 and rise again, and then move to the right to be able to deliver to the position on the right of the supply track 104. The position of the first holding part 210A. In the first holding unit 210A, there is a known holding mechanism (for example, a structure having holding claws for pinching the workpiece W to be placed thereon) as a work holding portion for holding the placed workpiece W, and a structure having suction holes communicated with the suction device for suction. etc.) (symbols 210a, 210b in the figure).

In the present embodiment, the above-mentioned workpiece holding parts 210 a and 210 b are provided in parallel in two rows in the left-right direction at positions corresponding to the two workpieces W held by the supply picker 120 . That is, the workpieces W can be held in a line in the longitudinal direction. With this configuration, the two workpieces W which are held side by side by the supply picker 120 can be placed in their existing arrangement at the same time without being rearranged, and can be held side by side and conveyed in the sideways direction.

In addition, the first loader 210 holding the workpiece W by the first holding portion 210A is configured to be movable in the front-back, left-right, and up-down directions. The workpiece W can be conveyed from the workpiece processing unit 100A to the pressing unit 100B by moving in the left-right direction. On the other hand, the workpiece W can be moved from the outside of the molding die 202 to the inside (ie, That is, it is conveyed between the upper mold 204 and the lower mold 206 in the mold-open state). Furthermore, the workpiece W can be transferred (delivered) to a predetermined holding position of the upper die 204 inside the molding die 202 by moving in the vertical direction. In addition, as a modification example, instead of the configuration in which the first holding portion 210A moves left and right, a configuration in which the movement of the movement range is replaced by the supply picker 120 may be considered. In addition, instead of the configuration in which the first holding portion 210A moves up and down, a configuration in which the movement of the movement range is replaced by the mold opening and closing mechanism of the molding die 202 is conceivable (both are not shown).

Next, the first loader 210 is equipped with the second holding portion 210B, and the molded article Wp obtained by resin molding is removed from the molding die 202 (here, the upper die 204 ) and placed on it, and the molded product Wp is molded. The product Wp is conveyed to a predetermined position outside the molding die 202 . In addition, the second holding part 210B has a well-known holding mechanism (for example, a structure having holding claws for clamping, a structure having suction holes communicated with the suction device for suction, etc.) (in the figure, reference numerals 210c, 210d) as a holding mechanism. The molded product holding part of the placed molded product Wp.

In addition, the second holding part 210B of the present embodiment is provided so that the above-mentioned molded product holding parts 210c and 210d are arranged side by side in two rows in the left and right direction, and are held by the molding die 202 (upper die 204) after resin molding. The configuration of the positions corresponding to the two molded products Wp. That is, the molded articles Wp can be held in parallel with their longitudinal directions. With this configuration, the two molded products Wp held in the left-right direction by the molding die 202 (upper die 204) are placed at the same time in their original arrangement, and can be arranged in the left-right direction and transported without changing the arrangement. .

Here, in this embodiment, the second holding part 210B and the above-mentioned first holding part 210A are integrally formed as the first loader 210 . In one example, the first loader 210 is provided with a first holding unit 210A having two rows of left and right workpiece holders 210a, 210b on the front side, and a first holding unit 210c having two rows of left and right workpiece holders 210c and 210b on the rear side. 210d of the second holding portion 210B. Therefore, the first holding unit 210A and the second holding unit 210B are configured to be integrally movable as the first loader 210 in front and rear, left and right, and up and down directions. With this configuration, not only can the device configuration be simplified and miniaturized, but also two workpieces W and two molded products Wp can be transported at the same time, so the process time can also be shortened.

In addition, as a modification example, it is conceivable to configure the carrier including the second holding portion 210B and the carrier including the above-mentioned first holding portion 210A as separate bodies (not shown). In this case, what is necessary is just to set it as the structure which can move similarly to 210 A of said 1st holding parts.

Next, the workpiece processing unit 100A includes a first storage picker 122 that holds the molded product Wp placed on the second holding unit 210B and conveys it to a predetermined position. Furthermore, 100 A of work processing units are equipped with the 2nd storage picker 124 which mounts the molded product Wp held by the 1st storage picker 122, and conveys to the predetermined position in a unit. As the mechanism for holding the molded product Wp, there are known holding mechanisms (for example, a structure with holding claws for clamping, a structure with adsorption holes communicated with the adsorption device for adsorption, a mechanism for simply placing, etc.) (not shown). In this embodiment, the 1st storage picker 122 and the 2nd storage picker 124 are combined, and the storage picker which conveys the molded product Wp from the 1st loader 210 is comprised.

Here, the 1st storage picker 122 of this embodiment is comprised so that it can move to a left-right direction. With this configuration, the molded product Wp placed on the second holding unit 210B can be held and conveyed to the second storage picker 124 . Here, during the handover between the first storage picker 122 and the second storage picker 124, the warping of the molded product Wp can also be prevented by pinching the molded product Wp and waiting for flattening and cooling. or out of shape. In addition, as a modification example of the first storage picker 122, a configuration (storage picker) capable of moving not only in the left-right direction but also in the up-down direction may be employed. In this manner, it is possible to omit the configuration of the vertical movement mechanism of the second holding portion 210B.

Moreover, the first storage picker 122 of this embodiment is provided so that the above-mentioned holding mechanism faces toward the position corresponding to the two molded products Wp placed on the second holding part 210B (two rows of molded product holding parts 210c, 210d). The left and right directions are arranged in two columns. With this configuration, the two molded products Wp on the second holding unit 210B can be simultaneously held and conveyed in a state aligned in the left-right direction.

In addition, in this embodiment, it is set so that the supply picker 120 conveys the workpiece W to the left-right direction carrying path to the first holding part 210A, and the storage picker (first storage picker 122) transports the workpiece W from the second holding part 210B. The left and right directions of the product Wp are moved out of the road, and they are arranged side by side toward the front and rear directions. In this way, since the carrying-in operation of the workpiece W by the supply picker 120 does not intersect or overlap with the carrying-out operation of the molded product Wp by the storage picker (first storage picker 122), it is possible to suppress waiting time. time to happen. Therefore, since a plurality of actions are performed in parallel, each action can be executed efficiently, so that the processing can be streamlined and the process time can be shortened.

On the other hand, the 2nd storage picker 124 of this embodiment is comprised so that it may move to an up-down direction. With this configuration, the molded product Wp placed on the second storage picker 124 can be held and conveyed to the storage rail 108 described later.

In addition, the second storage picker 124 of the present embodiment is configured so that the above-mentioned holding mechanisms are arranged side by side in two rows in the left-right direction at positions corresponding to the two molded products Wp held by the first storage picker 122 . With this configuration, the two molded products Wp held by the first storage picker 122 can be simultaneously held and conveyed in a state aligned in the left-right direction.

In addition, in this embodiment, it is set as the structure provided with two storage pickers (the first storage picker 122 and the second storage picker 124) as described above, but it can also be set as a structure that can be directed to the left and right and up and down. The configuration of one movable storage picker is a modification example (not shown). With this configuration, the molded article Wp placed on the second holding portion 210B can be held and conveyed directly to the storage rail 108 . Moreover, the supply picker 120 and the storage picker can also be constituted by an articulated robot (transfer robot. In this case, if the conveying mechanism is combined, for example, by a horizontal articulated robot and a lifting mechanism, the workpiece W can be formed and formed. The product Wp moves in the left, right and up and down directions, and has the same function as the above-mentioned configuration.

In addition, in the above-mentioned configuration, as long as the first loader 210 moves to a position where the molded product Wp can be delivered between the first storage picker 122 (a position overlapping with the first storage picker 122 in FIG. 1 ), the above-mentioned operation is be implemented. However, by making the first loader 210 Since it can be moved to the side of the device, the operator can easily access the workpiece W or molded product Wp held by the first loader 210 . In this case, the workpiece processing unit 100A may employ a configuration in which the rail itself on which the first loader 210 moves is moved in the left-right direction. According to this structure, when the second storage picker 124 moves up and down, the track can be retreated from the moving range of the second storage picker 124 first. As a result, during normal production, the molded product Wp can be transported by the cooperative operation of the first loader 210 and the two storage pickers 122, 124, and the first loader 210 can be used during maintenance. The workpiece W or the molded product Wp is directly moved to a position (side position of the device) which is easy for the operator to operate.

Next, the workpiece processing unit 100A is provided with a storage rail 108 disposed below the workpiece measuring device 114 for placing the molded product Wp conveyed by the storage picker (here, the second storage picker 124 ). In addition, the molded product Wp placed on the storage rail 108 passes (slides) on the storage rail 108 and is stored in the storage cassette 112 . In addition, since the storage rail 108 is basically the same as the supply rail 104 in terms of its configuration, only the moving direction of the workpiece W or the molded product Wp is different, so the part already explained in the supply rail 104 may be omitted (related to the processing of the molded product). The other components of Wp are also the same).

In the present embodiment, the relay rail 110 through which the molded product Wp passes is provided between the storage rail 108 and the storage case 112, but a configuration in which this is omitted may also be employed. In addition, the movement of the molded product Wp from the storage rail 108 to the storage case 112 can use a well-known pusher etc. (not shown).

Here, the storage rail 108 avoids the mounting position of the electronic component Wb, supports the longitudinal side of the molded product Wp from below, and is sideways. Fang guides the workpiece W. Furthermore, the storage rail 108 is configured in two rows (108A, 108B in the figure) so that the two molded products Wp can be placed side by side in the lateral direction in the lateral direction, and has a moving mechanism ( not shown). With this configuration, after the two molded products Wp held by the storage picker (here, the second storage picker 124) are simultaneously placed in a state aligned in the left-right direction, the molded products Wp can be sequentially placed in the storage case. 112 moves. For example, the molded products Wp on one row (for example, 108B) can be moved toward the storage box 112, and then the storage rails 108A, 108B can be moved in any predetermined direction (for example, left) on the left and right, and the other row (for example, , 108A) The molded product Wp on the storage box 112 moves.

Next, the workpiece processing unit 100A includes a molded product measuring device 118 that is disposed below the storage rail 108 and inspects the molded product Wp on the storage rail 108 from the lower surface side (the mounting surface side of the electronic component Wb). In one example, the molded product measuring device 118 may be arranged at a lower position when the storage rails 108A and 108B reach a predetermined position when the molded product Wp is moved to the storage cassette 112 . The molded product measuring device 118 is composed of a laser displacement meter or a camera (monocular camera or compound eye camera), and is used for comparison with a reference value based on the output data of these measuring devices, or for measurement by means of pattern matching, etc. The thickness of the molded product Wp and the appearance loss of the molded part of the molded product Wp were detected. In addition, the "underside of the storage rail" also includes the underside of the relay rail when the relay rail 110 is installed. In addition, the "inspection" referred to here includes the thickness of the resin molded part (resin molded part) on the substrate Wa, the appearance of the resin mold (exposed lead wires), and the defect of the resin mold (poor filling, etc.). measurement and other necessary measurements. It can also be based on the results of "checking" here, such as from the tree The difference between the actual thickness and the target thickness of the molded part is used to adjust the supply amount of the molding resin R, so that the molded thickness of the molded product Wp can be controlled with high precision.

The molded product measuring device 118 of this embodiment is fixedly equipped with a thickness sensor 118a. Thereby, the thickness of the molded product Wp passing through the predetermined position (for example, the central position or the outer peripheral position of the resin molded part) on the storage rail 108 can be measured.

As explained above, in the present embodiment, the supply rail 104, the workpiece measuring device 114, the storage rail 108, and the molded product measuring device 118 are arranged repeatedly in the vertical direction, and are sequentially arranged in layers from above. Set the configuration (including the offset (offset) setting in the front, back, left, and right directions). At the same time, the supply cassette lifter 103 and the storage cassette lifter 113 are also arranged at different positions in the vertical direction, and have a configuration in which they are sequentially arranged in layers from above. According to these configurations, the installation area of the device can be greatly reduced compared with a conventional device in which the components are arranged side by side in a planar manner.

In addition, in the above embodiment, the workpiece W is resin-molded using the first loader 210 that unloads the molded product Wp obtained by resin molding with the molding die 202 while transferring the workpiece W to the molding die 202. In the resin molding apparatus 1 of W, by setting the workpiece measuring device 114 for measuring the thickness of the workpiece W and the molded product measuring device 118 for inspecting the molded product Wp to be arranged overlappingly, it can be reduced compared with conventional devices. Set the area. In this case, the workpiece W is transported to the molding die 202 by the first loader 210 after the thickness measurement by the workpiece measuring device 114 , and the molding of the workpiece W transferred from the molding die 202 by the first loader 210 The product Wp is inspected by the molded product measuring device 118 .

In addition, during the vertical movement by the second storage picker 124, for example, during the transfer between the first storage picker 122 and the second storage picker 124, the heat dissipation process of the molded product Wp is performed while pinching and flattening it. The structure can be realized, so it is not necessary to provide a heat dissipation unit separately, and the installation area of the device can also be reduced.

Moreover, according to the above-mentioned structure, the process from the state where two, for example, narrow workpieces W are placed on the supply rail 104 to the state where two processed molded products Wp are placed on the storage rail 108 is all in the direction of left and right. The state of aligning two workpieces W or molded products Wp is carried out. Therefore, the process time can be greatly shortened compared with the conventional device which contains a local time-consuming process due to the process of sequentially processing one by one in the middle.

Moreover, according to the above-mentioned structure, it is possible to realize the entire process from taking out the workpiece W from the supply magazine 102 to processing it into a molded product Wp and storing it in the storage magazine 112. When the workpiece W and the molded product Wp are moved, the workpiece W And the orientation (direction of holding and placing) of the molded product Wp is moved in the front-back, left-right, and up-down directions without changing at all. Therefore, compared with the conventional device in which the orientation of the workpiece W and the molded product Wp needs to be changed during the process, the process time can be shortened, and the device configuration can also be simplified.

In addition, as a modified example of the above-mentioned resin molding apparatus 1, it may also be configured such that one cavity is provided in one lower mold, and one workpiece W is arranged at the same time (it is conceivable to use, for example, a circular wafer, or a square or rectangular wafer). In the case where a substrate or the like is used as the base material Wa), resin molding is performed to obtain a compression molding resin molding apparatus 2 (see FIG. 28 ) to obtain one molded product. In this case, the workpiece W can be set as a pair of narrow strip-shaped workpieces as described above. The type of workpiece W wider wide workpiece (large-area type workpiece) is processed. The wide workpiece can also use a wider square or rectangular or polygonal workpiece W than a narrow workpiece, or a circular wafer with a relatively wider diameter (width) than a narrow workpiece or a workpiece as a carrier plate W. In this case, instead of the workpiece processing unit 100A, a configuration of the workpiece processing unit 500A as described below may be considered.

In one example, the workpiece processing unit 500A may be provided with a transfer robot including a robot arm 504 for taking out the workpiece W from the supply magazine or storing the molded product Wp into the storage magazine, instead of the above-mentioned supply rail 104 or storage rail. 108. Here, as the manipulator 504 , a mechanism in which a fork-shaped member conforming to the shape of the workpiece W is equipped with a suction mechanism can be used at the tip of a known articulated robot or the like. In addition, it may be configured to include a plurality of manipulators (not shown). Furthermore, not only the supply picker 120 and the storage picker described above, but also a transfer robot that can be installed on the supply rail 104 or the storage rail 108 to transfer the workpiece W and the molded product Wp.

In addition, in the first holding part 210A, the aforementioned two rows of work holding parts 210a, 210b and the wide work holding part 506 for holding one work W (wide work) may be provided in a configuration that can be replaced. Furthermore, in the second holding part 210B, the above-mentioned two rows of formed product holding parts 210c, 210d may be configured to hold a wide-width formed product Wp (a formed product Wp corresponding to a wide-width workpiece W). The structure in which the holding part 508 is replaced.

In this way, regarding the configuration that can switch between a narrow workpiece and a wide workpiece, it is conceivable that, for example, the first holding portion 210A can be made Two workpieces W belonging to narrow workpieces can be held in parallel in the longitudinal direction with two rows of workpiece holding parts 210a and 210b, and one workpiece W which is a wide workpiece can be held. The configuration of the part 506 is replaced. Furthermore, it is also conceivable to configure the second holding portion 210B to have two rows of formed product holdings in such a manner that the two formed products Wp obtained by processing the workpiece W that is a narrow workpiece are held in parallel in the longitudinal direction. The configuration of the parts 210c and 210d is replaced with the configuration having one workpiece holding part 508 that holds one molded product Wp processed from one workpiece W. As shown in FIG. With such a structure, even if the workpiece W is either a narrow workpiece or a wide workpiece, the workpiece W and the molded product can be transported by replacing the simple structure of the first holding part 210A and the second holding part 210B. Composition of Wp.

(press unit)

Next, the configuration of the press unit 100B included in the resin molding apparatus 1 will be described in detail.

The pressing unit 100B firstly includes a molding die 202 having a pair of openable and closable dies (for example, a die assembled from a plurality of modules made of alloy tool steel, templates, mold pillars, etc., or other members). In the present embodiment, among the pair of dies, one die located on the upper side in the vertical direction is used as the upper die 204 , and the other die on the lower side is used as the lower die 206 . The mold 202 for molding can be closed and opened by the upper mold 204 and the lower mold 206 approaching and separating from each other. That is, the vertical direction is the mold opening and closing direction.

In addition, the molding die 202 is opened and closed by a known die opening and closing mechanism (not shown). For example, the mold opening and closing mechanism consists of: a pair of templates; a plurality of connecting mechanisms (tie-bars or columns) for erecting a pair of templates; motor) and a drive transmission mechanism (for example, a toggle link) etc. (the relevant drive mechanism is not shown).

Here, the molding die 202 is disposed between a pair of die plates of the die opening and closing mechanism. In this embodiment, the upper mold 204 as a fixed mold is assembled to a fixed template (a template fixed to a connecting mechanism), and the lower mold 206 as a movable mold is assembled to a movable template (a template that moves up and down along a connecting mechanism). However, it is not limited to this configuration, and the upper mold 204 may be used as a movable mold, and the lower mold 206 may be used as a fixed mold; or both the upper mold 204 and the lower mold 206 may be used as a movable mold. Alternatively, two movable templates and two sets of upper dies 204 and lower dies 206 may also be provided.

Next, the lower die 206 of the molding die 202 will be specifically described. The lower die 206 includes a lower plate 224, a cavity member 226, a clamper 228, and the like, and is constituted by assembling these units (see FIG. 10 ).

Here, the mold socket 226 is fixedly assembled on the upper surface of the lower plate 224 (the surface on the side of the upper mold 204 ). The clamping part 228 forms a ring shape 6 in such a manner as to surround the socket part 226 , and is separated (floating) assembled on the lower plate 224 adjacent to the socket part 226 .

In this embodiment, although the lower die 206 has the die cavity 208 recessed from the die surface (parting face) 206a, the inner part (bottom) of the die cavity 208 is formed by the die die part 226, and the mold part is formed by the clamp part 228. side of socket 208 . In other words, the mold cavity recess 209 that is depressed into a predetermined shape is formed by the upper surface of the mold cavity part 226 and the inner peripheral wall surface of the clamping part 228 .

In addition, in the present embodiment, as shown in FIG. 21 and the like, two dimples 208 are arranged side by side in the left and right directions (in the figure, reference numerals 208A and 208B), and dimples 226A and 226B are provided respectively. With this configuration, the two films F (parts carrying the molding resin R) can be accommodated in the cavities 208A and 208B at the same time, respectively. Therefore, since it is possible to resin-mold two works W at the same time, the process time can be shortened. In addition, in the lower mold 206, the clamping member 228 can also be cut out for each cavity 208A, 208B so that they can be raised and lowered separately, and the upper mold 204 can be provided with a mechanism for absorbing the two workpieces W with an elastic body. Configuration of the plate thickness adjustment mechanism for plate thickness difference. According to this configuration, even if there is a difference in thickness between the two workpieces W to be compression-molded at the same time, no inclination will occur, and molding can be performed while reducing the influence of resin amount supply deviations and the like. In addition, in the present embodiment, the mold members are arranged so that the cavities 208A, 208B are arranged laterally in the left-right direction. Therefore, the mold socket parts 226A, 226B and the clamping parts 228 constituting the mold sockets 208A, 208B are made into a left and right separated mold cover (chase) structure, so the base for accommodating these components can be inserted and removed respectively towards the front and rear directions of the device. , for maintenance.

Here, a suction groove (not shown) is provided on the mold surface of the upper mold 204 opposite to the clamping member 228, and is connected to a suction device (not shown). Furthermore, by providing a sealing structure around these parts and driving the suction device to depressurize, the degassing in the mold cavity 208 can be performed in a closed mold state.

Furthermore, the molding die 202 includes a film suction mechanism for sucking the film F from the die surface 206 a side of the lower die 206 . In one example, the film suction mechanism is via a suction device disposed through the clamp member 228. Attached to the path 230a, 230b, it communicates with the adsorption device (not shown). Specifically, one end of the suction paths 230 a and 230 b is connected to the mold surface 206 a of the lower mold 206 , and the other end is connected to the suction device disposed outside the lower mold 206 . With this configuration, the suction device can be driven to suck the film F from the suction paths 230 a and 230 b, so that the film F can be sucked and held on the mold surface 206 a including the inner surface of the mold cavity 208 . More specifically, the film F can be adsorbed from the suction path 230b, and the film F can be adsorbed and held on the mold surface 206a outside the cavity 208, and by absorbing the film F from the suction path 230a, the film F can be adsorbed on the mold surface 206a and It is held on the inner surface of the cavity 208 (mold surface of the cavity concave portion 209).

In this way, by providing the film F covering the inner surface of the cavity 208 and the mold surface 206a (part) of the lower mold 206, the part of the molded resin R under the molded product Wp can be easily peeled off, so that it can be easily removed. The molded product Wp is taken out from the molding die 202 .

Furthermore, the molding die 202 includes a potential energy imparting member (for example, a spring such as a coil spring) 232 between the lower plate 224 and the clamp 228 . Via the potential energy imparting member 232 , the clamp 228 can be movably assembled to the lower plate 224 . With this configuration, the die socket 226 is surrounded by the clamping member 228 , so that the die socket 226 and the clamping member 228 can reciprocate relative to the opening and closing direction of the mold. In this manner, in the lower mold 206 , the die socket 226 is fixed and held on the lower plate 224 , while the clamping member 228 is movably kept separated (floating) via the potential energy imparting member 232 . In this case, the gap between the inner peripheral surface of the clamp member 228 and the outer peripheral surface of the cavity member 226 is secured at a predetermined size. Therefore, the clamper 228 can operate smoothly.

However, the above-mentioned gap is included in the suction path 230a of the film suction mechanism, and the film F is adsorbed at the junction of the cavity 226 and the clamping component 228 (the corner of the cavity 208). Therefore, the film suction mechanism includes a sealing member 234 (for example, an O-ring). The sealing member 234 uses the above-mentioned gap as the suction path 230a and is arranged between the cavity part 226 and (the lower part of) the clamping part 228 to produce a sealing effect so that air will not leak out.

In addition, the lower mold 206 is equipped with: a heater (for example, an electric heating wire heater), an auxiliary heater (for example, an electric heating wire heater), a temperature sensor, a control unit, and a power supply (not shown), so as to perform Heating and its control. In one example, the heater of the lower mold 206 is built in the lower plate 224 or the mold base (not shown) for accommodating these elements, and mainly heats the entire lower mold 206 and the workpiece W. With these heaters of the lower mold 206, the lower mold 206 can be heated and adjusted to a predetermined temperature (for example, 120° C. to 180° C.).

Next, the upper die 204 of the molding die 202 will be specifically described. The upper die 204 includes an upper plate 222, a cavity plate 236, and the like, and is constituted by assembling these components. Here, the cavity plate 236 is fixedly assembled on the lower surface of the upper plate 222 (the surface on the lower mold 206 side).

In addition, the upper mold 204 is provided with: a heater (for example, an electric heating wire heater), a temperature sensor, a control unit, and a power supply (not shown), so as to perform heating and control thereof. In one example, the heater of the upper mold 204 is built in the upper plate 222 and mainly heats the upper mold 204 and the molding resin R as a whole. By the heater of the upper mold 204, the upper mold 204 can be heated and adjusted to a predetermined temperature (for example, 120° C. to 180° C.).

Furthermore, the upper mold 204 has a workpiece holding mechanism 240 for holding the workpiece W at a predetermined position under the cavity plate 236 . In one example, the workpiece holding mechanism 240 communicates with a suction device (not shown) through a suction path 240 a disposed on the cavity plate 236 . Specifically, one end of the suction path 240 a is connected to the mold surface 204 a of the upper mold 204 , and the other end is connected to the suction device disposed outside the upper mold 204 . With this configuration, the suction device can be driven to suction the workpiece W from the suction path 240a, and the workpiece W can be suctioned and held on the mold surface 204a (here, the lower surface of the cavity plate 236). In addition, a configuration including holding claws that pinch the outer periphery of the workpiece W may be provided in addition to the configuration including the suction path 240a.

In addition, in this embodiment, as shown in FIG. 21 etc., the workpiece|work holding mechanism 240 has the structure (symbol 240A, 240B in a drawing) provided in two sets in parallel in the left-right direction. With this configuration, two workpieces W can be held simultaneously by the workpiece holding mechanisms 240A, 240B, respectively. Therefore, since the simultaneous resin molding of two works W can be realized, the process time can be shortened. In addition, in the above-mentioned plate pressure adjustment mechanism, by lifting and lowering the cavity plate 236 holding the workpiece W separately for each cavity 208A, 208B, even if the two workpieces W to be compressed and formed at the same time have a difference in thickness, they can be formed. without tilting.

As mentioned above, as a modification example of the above-mentioned resin molding apparatus 1, it is also possible to configure a die cavity in a lower die, and arrange a workpiece W to perform resin molding to obtain a compressed molded product. The resin molding apparatus 2 of the forming method (refer to FIG. 28 ). In this case, it may be considered to replace the pressing unit 100B with a configuration of the pressing unit 500B as described below.

In one example, the pressing unit 500B may be provided with a cavity 208 for storing the molding resin through a single film in the lower mold 206 instead of the two-row cavity 208A and 208B for containing the two films and the molding resin. . Moreover, what is necessary is just to make it the structure which uses the workpiece holding mechanism 240A, 240B which holds the said two workpiece together as the workpiece holding mechanism 240 which holds one workpiece W in the upper die|die 204.

(dispensing unit)

Next, the supply operation of the film F and the molding resin R will be described in detail, focusing on the configuration of the dispensing unit 100C included in the resin molding apparatus 1 .

As described above, the dispensing unit 100C is a unit that supplies the film F and the molding resin R, and the like. In this embodiment, when transferring the film F and molding resin R to the mold 202 for molding, the transfer tool 400 is used as a tool for holding and transferring these materials. That is, by using this conveyance tool 400 as a tool, the molding resin R is held and conveyed together with the film F. As shown in FIG. In addition, the conveyer 400 can hold the film F so that its longitudinal direction can be aligned and held in parallel (details will be described later).

First, the distributing unit 100C is equipped with a preparation table 302, which is used to place the carrier 400 that has not yet maintained the state of the film F and the molding resin R, and has been properly cleaned. For example, the mold resin R adheres to the carrier 400 unloaded from the molding die 202 , causing a malfunction. Therefore, malfunction can be prevented by cleaning the surface with a brush or a suction mechanism (neither of which is shown) together with through-holes described later.

Next, a carrier picker 304 that holds the carrier 400 and transfers it between a plurality of predetermined positions (tables) is installed. In addition, the mechanism for holding the carrier 400 has a well-known holding mechanism (for example, a structure with holding claws for clamping, a structure with suction holes communicated with the suction device for suction, etc.) (not shown). For example, a concavo-convex portion may be provided on the outer peripheral portion of the carrier 400 , and the concavo-convex portion may be hooked and held on holding claws erected downward from the lower surface of the carrier picker 304 for conveyance.

Here, the carrier picker 304 is configured to be movable in front and rear, left and right, and up and down directions. With this configuration, the carrier 400 placed on the preparation stage 302 can be held and conveyed toward the film stage 308 and the resin casting stage 310 described later.

Then, the distributing unit 100C is provided at a position behind the preparation table 302: a film roll 306, which is rolled into a roll shape by a long strip-shaped film F; Above the cylinder 306 (obliquely upward in this embodiment), the film F sent out from the film roll 306 is cut into strips of a predetermined length and held.

In one example, the film table 308 and the film roll 306 have a structure (including offsets in the front, rear, left, and right directions) arranged in a layered manner sequentially from above in the vertical direction. With this configuration, the installation area of the device can be reduced compared with a conventional device in which the components are arranged side by side in a planar manner.

In this embodiment, the film roll 306 is arranged so that two film rolls 306A, 306B are aligned in the left-right direction. With this configuration, two films F of the same shape can be supplied on the film table 308 at the same time. Here, the film rolls 306A, 306B can be supported by their central axis 307a, or A plurality of rollers 307b provided at intervals smaller than the outer shapes of the film rolls 306A and 306B can be supported from below. In this case, since the film rolls 306A, 306B are supported from below by the roller 307b, the two aligned film rolls 306A, 306B can be easily replaced without inserting or pulling out the center shaft 307a. In addition, the feeding of the film roll 306 to the film table 308 may be carried out by pinching and pulling out the ends, or by a driving roller provided in front of the film table 308 .

On the other hand, the film table 308 has a known cutting mechanism (for example, a fixed-blade cutter, a thermal fusion cutter, etc.) (not shown) as a mechanism for cutting the long strip-shaped film F. In addition, the mechanism for holding the two films F has a known holding mechanism (for example, a structure in which suction is performed through suction holes communicated with the suction device, etc.) (not shown). The film F cut here is combined with the carrier 400 on the film table 308 .

Here, as shown in FIG. 9 , the carrier 400 of this embodiment has a substantially flat plate shape formed on a plane parallel to the upper surface and the lower surface, and has two rows of carrying-in film holding parts that hold the film F (in the figure, 400A, 400A, 400B). In addition, each carried-in film holding unit 400A, 400B is provided with a resin injection hole 400a formed as a through hole so that each film F is exposed when viewed from above at a position corresponding to each film F (position where each film F is held). , 400b. The resin injection holes 400a, 400b are formed in a shape corresponding to the aforementioned cavity recess 209, and the molded resin R can be prepared in an appropriate state when the molded resin R is dropped and held in the resin injection holes 400a, 400b.

Furthermore, around the resin injection holes 400a and 400b, a plurality of first adsorption holes 400c that generate suction force and hold the thin film are arranged. Other In addition, the first suction hole 400c is used to transmit suction through the second suction hole 212b provided in the third holding part 212A described later, or through (communicates with) the third suction hole (not shown) provided in the carrier picker 304 described later. The composition of the adsorption force generated by the device (not shown). According to the above configuration, the two films F can be held in a state of being aligned and sucked in the left-right direction under the carrier 400 conveyed to the film table 308 by the carrier picker 304 . In addition, a structure may be adopted in which the outer periphery of the film F is pinched and held by holding claws.

Next, there is a resin casting table (second table) 310, which is arranged on the side (in one example, on the right) with respect to the film table 308, and is configured to be movable in the front, rear, left, and right directions for loading and unloading. The carrier 400 conveyed by the carrier picker 304 (the state where two films F are held on the lower surface). In addition, the resin throwing table 310 has a known holding mechanism (for example, a structure having holding claws for pinching, a structure having suction holes communicated with a suction device for suction, etc.) (not shown) as a means to hold and carry the placed material. With 400 institutions.

In addition, in FIG. 1 , the film stage 308 is arranged with the above-mentioned resin casting stage 310 sandwiched therebetween, and a dispenser is provided at a position higher than the resin casting stage 310 on the side (right side in one example). 312. The dispenser 312 injects the molded resin R into the resin injection holes 400a, 400b of the carrier 400 placed on the resin dropping table 310, and mounts (drops) the molded resin R on the exposed film F (resin into the inside of the holes 400a, 400b). The dispenser 312 is equipped with, for example, a hopper 312a for storing the molding resin R, a weight gauge 312b for weighing the weight of the dropped resin, and feeds the weighed molding resin R with a vibrating feeder (not shown). (shown) is composed of a trough 312c for sending out, a nozzle 312d for regulating the injection position of the molded resin R sent out from the chute 312c and dropped, and the like.

Here, the resin casting table 310 of this embodiment is comprised so that it may move to front-back and left-right directions (in FIG. 1, it shows in three positions). By moving in the left-right direction, the carrier 400 mounted on the resin casting table 310 can be moved forward and backward under the dispenser 312 while holding the film F. FIG. With this configuration, the transporter 400 can move between the intermediate position between the dispenser 312 and the film table 308 and the position directly below the nozzle 312d of the dispenser 312 . Furthermore, the carrier 400 holding the film F mounted with the molding resin R can be transferred to a predetermined position (the position where the carrier 400 is held by the third holding portion 212A described later) by moving in the front-rear direction. . In addition, as a modification example, instead of the configuration in which the resin casting table 310 moves left and right, a configuration in which the dispenser 312 replaces the movement of the movement range may be considered. In addition, instead of the configuration in which the resin casting table 310 moves back and forth, a configuration in which the movement of the movement range is replaced by the third holding portion 212A (described later) may be considered (both are not shown).

Furthermore, by moving the resin injection platform 310 along the predetermined path in the front, rear and left and right directions, the molding resin R is sent from the two nozzles 312d to the resin injection holes 400a, 400b, and the molding resin R exposed in the resin injection holes 400a, 400b can be formed. On the inner film F, the molding resin R is evenly and unbiasedly filled with a predetermined thickness. In this way, defective products caused by deviation of the molding resin R on the film F can be prevented.

Here, the distributor 312 of the present embodiment has injection molding trees in the two rows of resin injection holes 400a, 400b of the carrier 400, respectively. Two nozzles 312d for grease. In one example, one nozzle 312d is disposed at a position corresponding to the right resin injection hole 400a, and the other nozzle 312d is disposed at a position corresponding to the left resin injection hole 400b. In other words, the center-to-center distances of the two nozzles 312d and the center-to-center distances of the resin injection holes 400a and 400b are configured to be the same. In this way, the molding resin R can be injected while passing through the same corresponding positions of the resin injection holes 400a and 400b at the same time, so the molding resin R can be filled on the two films by the path with the shortest moving distance and moving time. on F. Therefore, the process time can be greatly shortened. In addition, as a modification example, there may be a configuration in which one nozzle is provided and molding resin R (not shown) is sequentially filled on two films F through a predetermined path.

Next, a resin heater 314 is provided for heating the molded resin R by heating from the upper surface side of the carrier 400 holding the film F on which the molded resin R is mounted. In addition, the heating carrier 400 (molding resin R) is configured by disposing a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) (not shown) under the resin heater 314 . In this way, the molding resin R held in a state mounted on the two films F can be heated simultaneously by the carrier 400 .

Here, the resin heater 314 of this embodiment is arranged on the moving path of the resin casting table 310, more specifically, it moves from a position directly below the nozzle 312d of the dispenser 312 to a third holding part described later. 212A is in the middle of the path between the positions where the conveyance tool 400 is held. In this way, immediately after the molding resin R is injected into the film F held by the carrier 400 through the nozzle 312d of the dispenser 312, the process of heating the molding resin R is performed immediately. Therefore, especially in the use of granular, powder When a resin such as powder is used as the molding resin R, it can be heated immediately after being mounted on the film F, and the resin such as powder located on the surface can be heated and melted to integrate them. In this way, generation of dust (fine powder of resin, etc.) can be prevented, and operation failure or product failure caused by dust spreading in the device can be prevented.

In addition, a supply resin measuring device 315 may be provided at the front and rear positions of the resin heater 314 to measure the appearance of the molding resin R supplied on the film F in the resin injection holes 400a and 400b. The supplied resin inspector 315 can record the casted molded resin R by installing a camera (single-eye camera or compound-eye camera) above the moving path of the resin casting table 310, and using the output values or captured images of these devices. thickness or shape. With this configuration, for example, by associating the molded thickness of the molded product Wp with actual information and storing the data, the operator can compare these data and select the casting conditions of the molded resin R. In this manner, traceability regarding the supply of molding resin R can be ensured to maintain molding quality.

Next, the second loader 212 that cooperates with each mechanism of the dispensing unit 100C includes a third holding portion 212A. The third holding unit 212A receives the carrier 400 placed on the resin casting table 310 on its lower surface, and transfers the carrier 400 to the predetermined holding position of the lower mold 206, and releases the carrier 400 from holding the film F and the molded resin R. 400 is transported to the aforementioned preparation table 302 . In addition, the third holding unit 212A has a known holding mechanism (for example, a structure having holding claws for clamping, a structure having suction holes communicated with the suction device for suction, etc.) as a carrier for holding the carrier 400. Holder 212a. Furthermore, with the second adsorption hole 212b is arranged at a position communicating with the first suction hole 400c of the carrier 400 held at a predetermined position to generate (transmit) the suction force provided by the suction device (not shown). With this structure, the state in which the two films F (in which the molding resin R is respectively mounted) is aligned and adsorbed on the lower surface of the carrier 400 in the left-right direction can be maintained, and the predetermined holding position of the lower mold 206 (disposed There is a mold cavity 208 position) conveying. Moreover, the 3rd holding part 212A which has the holding claw which pinches and holds the outer periphery of the two films F on the lower surface of the conveyance tool 400 may be made.

Here, the second loader 212 provided with the third holding portion 212A of the present embodiment is configured to be movable in the front-back, left-right, and up-down directions. By moving in the left-right direction, the conveyer 400 (in a state where the two films F on which the molding resin R is mounted is held) can be conveyed from the dispensing unit 100C to the pressing unit 100B. Furthermore, by moving in the front-rear direction, it is possible to move the carrier 400 (in a state where the two films F each carry the molding resin R) from the outside of the molding die 202 to the inside (that is, to open the mold). state between the upper mold 204 and the lower mold 206) transport action.

Furthermore, by moving up and down (there may be a combination of front and rear or left and right movements), the carrier 400 placed on the resin casting table 310 (holding the molded resin R respectively loaded thereon) can be carried out. The state of the two films F) maintains the action. In this case, it is possible to release the holding of the two films F on which the molding resin R is respectively mounted while holding the carrier 400 at the predetermined holding position of the lower mold 206 (the position where the cavity 208 is arranged), and respectively ( One-to-one) the operation of placing on the two mold cavities 208A, 208B (including a part of the mold surface 206a). Furthermore, also An operation of placing the carrier 400 in the state where the hold of the film F and the molding resin R is released can be performed on the above-mentioned preparation table 302 . In addition, as a modification example, a configuration in which a part of the movement range of the third holding portion 212A is replaced by movement of other mechanisms (resin casting table 310, lower mold 206, etc.) may also be considered (not shown).

Next, the second loader 212 includes a fourth holding portion 212B for holding the film remaining on the lower mold 206 after the molded article Wp obtained by the resin molding is taken out from the molding mold 202 (here, the upper mold 204 ). (Used film) Fd, and conveyed to a predetermined position (film disposer (film disposer) 316 described later). In addition, the 4th holding part 212B has a well-known holding mechanism (for example, has a suction hole communicated with the suction device so as to perform suction, etc.) as an unloaded film holding part (symbols 212c, 212d in the figure) that holds the used film Fd. ).

In addition, the fourth holding part 212B of the present embodiment is made to be arranged side by side in the left-right direction at positions corresponding to the above-mentioned unloading film holding parts 212c, 212d and the two cavities 208A, 208B of the molding die 202 (lower die 206). The composition of the columns. That is, the film F can be held in parallel with its longitudinal direction. In this manner, after resin molding, the two used films Fd aligned in the left and right directions can be simultaneously held and transported in the left and right directions by the molding die 202 (lower die 206).

Here, in the present embodiment, the fourth holding portion 212B is integrally formed with the above-mentioned third holding portion 212A as the second loader 212 . In one example, the second loader 212 is equipped with a third holding unit 212A having a carrier holding unit 212a on the front side, and a fourth holding unit 212c and 212d having two rows of unloaded film holding units 212c and 212d on the rear side. Holder 212B. Therefore, the third holding part 212A and the fourth holding part 212B are configured to be integrally movable as the second loader 212 in front and rear, left and right, and up and down directions. In this way, not only can the device structure be simplified and miniaturized, but also the film F loaded with the molding resin R and the used film Fd can be transported in two at the same time, and the process time can also be shortened.

In addition, as a modification example, it is conceivable to configure the carrier including the fourth holding portion 212B and the carrier including the third holding portion 212A as separate bodies (not shown). In this case, what is necessary is just to be comprised so that it can move similarly to 212 A of said 3rd holding parts.

Next, the distributing unit 100C is equipped with a film residue processor 316 for storing the used film Fd conveyed by the fourth holding unit 212B. In one example, the film residue processor 316 is formed in a box shape with an opening in the upper part (upper part). With this configuration, when the fourth holding portion 212B that conveys the used film Fd reaches the position directly above the film residue processor 316, the conveying operation of the fourth holding portion 212B is stopped, and the used film Fd can be released by releasing the used film Fd. Keeping, the used film Fd is dropped and stored in the film residue processor 316.

As described above, according to the configuration of this embodiment, an apparatus can be realized in which two strip-shaped workpieces W are supplied and the operation of taking out two molded products Wp after processing (resin molding) can be efficiently performed. In particular, when two cavities 208A, 208B are provided in one lower die, and two workpieces W are arranged to carry out resin molding collectively, it is possible to maintain the state in which the molding resin R is mounted on the two films F, while The cavities 208A, 208B of the lower die 206 are conveyed. Therefore, compared with conventional devices, it is possible to While suppressing the complexity of the process and device structure, productivity is greatly improved. Furthermore, compared with the configuration in which two die cavities 208A, 208B are provided in one lower mold 206 and two workpieces W are arranged, and the whole is covered with one (one) film F, the amount of film usage can also be reduced. .

Furthermore, since the film table 308 for supplying the film F and the resin casting table 310 for supplying the molding resin R can be made into separate structures, and can be processed in parallel, so compared with conventional devices, The process time can be shortened.

As mentioned above, as a modification example of the above-mentioned resin molding device 1, it may also be configured as a compression molding method in which one cavity is provided in one lower mold, and one workpiece W is placed for resin molding to obtain one molded product. The resin molding device 2 (refer to FIG. 28 ). In this case, as the film F, a wide film wider than the film F made of the above-mentioned narrow film can be used. Furthermore, it is very simple to use a square or rectangular monolithic film F wider than the narrow strip film as the wide film. However, as the wide-width film, as long as the width is larger than that of the strip-shaped film, the single-sheet-shaped film F cut into a circle can also be used. In this case, instead of the dispensing unit 100C, the constitution of the dispensing unit 500C as described below may be considered.

In one example, the distributing unit 500C can be configured so that the two-row input film holders 400A, 400B of the carrier 400 can be replaced with the large-sized input film holder 516 that holds a single film F (wide film). Can. Furthermore, the above-mentioned two-line unloading film holding parts 212c, 212d can be sucked and held no matter whether it is the used film Fd of two strip-shaped films or the used film Fd of one wide film. Can.

In this way, regarding the configuration that can switch between the narrow film and the wide film, it is conceivable that, for example, the third holding portion 212A has a structure for holding the two types of carriers 400 for the narrow film and the wide film in common. The structure of the carrier holding part 212a. The first carrier 400 held by the carrier holding portion 212a has two rows of film holding portions 400A, 400A, and 400A in such a manner that two films F belonging to the strip-shaped film can be aligned and held in parallel in the longitudinal direction. A strip-shaped film carrier 400 of 400B. As the second carrier 400 held by the carrier holder 212a, it is conceivable to use the carrier holder 212a commonly held by the carriers 400 having one carry-in film holder 516 holding the film F belonging to one wide film. constitute.

With such a configuration, different carriers 400 can be held by the common carrier holder 212a according to whether the workpiece W to be processed into a molded product Wp belongs to either a narrow workpiece or a wide workpiece W. Since the film F and the molding resin R are loaded together, the film F can be easily switched and supplied.

Furthermore, regarding the structure that can switch between the narrow film and the wide film, since the fourth holding part 212B can be set so that the long side direction of the used film Fd belonging to the two narrow films is parallel The two strip-shaped areas arranged and held in the left and right directions overlap with the wide area holding a used film Fd belonging to a wide film, and there are a plurality of adsorption parts arranged to absorb and hold the used film Fd. The structure of unloading film holding|maintenance part 212c, 212d. In this case, for example, since the position to be adsorbed overlaps, the same can be used regardless of whether it is a used film Fd belonging to a narrow film for a narrow workpiece or a used film Fd belonging to a wide film. The adsorption part is adsorbed and held.

According to this structure, regardless of whether it is the case of holding the used film Fd belonging to the narrow film, or the case of holding the used film Fd belonging to the wide film by suction, the position where the used film Fd can be held Arrangement of the suction section allows the used film Fd of either the narrow film or the wide film to be unloaded without replacement of the structure or the like.

In addition, the planar arrangement of the dispensing unit 500C may be such that the film stage 308 and the resin casting stage 310 are exchanged, instead of the structures shown in FIGS. 1 and 8 . In this case, the preparation table 302 is also moved to the side of the device in conjunction with this replacement, and the setting of the carrier 400 or brushes for cleaning can be entered and removed from the side of the device, making these replacement operations easier.

(resin molding action)

Next, the operation of resin molding using the resin molding apparatus 1 according to the embodiment of the present invention will be described focusing on the operations of the pressing unit 100B and the dispensing unit 100C while referring to FIGS.

First, the carrier 400 cleaned on the preparation stage 302 (without the film F and molding resin R) is held by the carrier picker 304 and transferred to the film stage 308 as shown in FIG. 11 . In this case, the carrier 400 can be conveyed in a state held by the holding claws of the carrier picker 304 . On the other hand, the two films F delivered from the two film rolls 306A, 306B are respectively cut into strips of predetermined lengths and held on the film table 308 .

Next, as shown in FIG. 12 , the lower surface of the carrier 400 is brought into contact with the two films F on the film table 308 by moving (dropping) the carrier picker 304 downward.

Next, as shown in Figure 13, the first suction hole 400c of the conveyer 400 is generated through the conveyer picker 304 to generate an adsorption force, and the two films F are adsorbed and held under the conveyer 400, so that the conveyer picker 304 moves upward (rising).

Then, as shown in FIG. 14 , by moving the carrier picker 304 sideways (to the right), the carrier 400 held by the carrier picker 304 (in a state where two films F are held) is dropped onto the resin. Transport on stage 310.

Next, as shown in FIG. 15 , the two films F on the lower surface of the carrier 400 come into contact with the resin casting table 310 by moving (falling) the carrier picker 304 downward. In this state, the holding of the carrier 400 by the holding mechanism of the carrier picker 304 is released (stopped), and the carrier 400 (the state holding the two films F) is placed on the resin casting table 310 . With this operation, the carrier picker 304 holds the carrier 400 holding the film F on the lower surface, and a series of operations from the film stage 308 to the resin casting stage 310 is completed.

Next, by moving the resin casting table 310 to the side (to the right), as shown in FIG. The position directly below the nozzle 312d of the device 312 is conveyed.

Then, as shown in FIG. 17, the molding resin R is supplied to the two rows of resin injection holes 400a, 400a, The inside of 400b is put in at the same time. At this time, by measuring the thickness of the workpiece W in advance, the amount of molding resin R dropped and supplied into each resin injection hole 400a, 400b can be adjusted, so the amount of molding resin R supplied to the cavity 208 can be optimized. optimization. For example, the molding resin R dropped from the two nozzles 312d is measured separately in advance on the side of the dispenser 312, and the molding resin R is stopped when a predetermined amount of molding resin R has been dropped from one of the nozzles 312d. R throws, and the other party continues to throw the action until a predetermined amount of molding resin has been thrown.

In addition, when casting the molding resin R from the two nozzles 312d, the resin casting table 310 on which the carrier 400 is mounted is moved along an arbitrary pattern. By this operation, the molding resin R can be supplied in a corresponding pattern (a pattern obtained by rotating the arbitrary pattern described above by 180 degrees) in each of the resin injection holes 400a and 400b. Here, by moving the resin dropping table 310 along a pattern without gaps, the molding resin R can be spread and filled on the two films F with a predetermined thickness uniformly and without deviation. For example, by moving the resin injection stage 310 along a pattern formed by a straight line connecting near ends of a straight line that divides the resin injection holes 400a, 400b in the longitudinal direction or the lateral direction by n (n is an integer greater than or equal to 2), That is, the molding resin R is uniformly supplied as a whole in the resin injection holes 400a and 400b. In addition, the "straight line" referred to here does not have to be evenly spaced, and may be bent in the middle.

Next, by moving the resin dropping table 310 forward, as shown in FIG. 18 , the carrier 400 placed on the resin dropping table 310 can be conveyed while passing through the position directly under the resin heater 314 . By this action, the molded tree on the film F that remains in the state of the carrier 400 The heating of fat R just can carry out. Then, by moving the resin throwing table 310 forward again, as shown in FIG. location) transport.

Next, from the state shown in FIG. 19 , by moving (falling) the third holding portion 212A downward, the lower surface of the third holding portion 212A comes into contact with the carrier 400 on the resin casting table 310 . Then, the third holding unit 212A holds the conveyance tool 400 with the holding claws. Then, the first suction hole 400c of the carrier 400 generates an adsorption force via the third holding portion 212A, and the two films F are adsorbed to the lower surface of the carrier 400 . While maintaining this state, the carrier 400 is held by the third holder 212A, and the third holder 212A and the carrier 400 are moved upward (raised) as shown in FIG. 20 .

Next, by moving the second loader 212, as shown in FIG. 21 , the carrier 400 held by the third holder 212A moves from the outside of the molding die 202 to the inside (that is, to the upper side of the mold-opening state). between the mold 204 and the lower mold 206). On the other hand, the two workpieces W held in the first holding portion 210A of the first loader 210 are first carried into the upper mold 204 before the carrier 400 is conveyed to the molding die 202 . At this time, first, the first loader 210 retreats (enters) into the mold for molding, performs resin molding on the second holding portion 210B, and receives the formed molded product Wp from the upper mold 204 (see FIG. 5). Next, the first loader 210 advances inside the molding die, and the two workpieces W held by the holding portion 210A are delivered to the upper die 204 . By this operation, as shown in FIG. 21, the two workpieces W carried in by the first holding part 210A are held. While being held in the upper mold 204 , the workpiece W is sufficiently heated before being conveyed by the conveyer 400 .

Furthermore, before the carrier 400 is conveyed to the mold 202 for molding, the used film Fd is held by the fourth holding portion 212B of the second loader 212 and carried out from the lower mold 206 . At this time, first, the second loader 212 retreats (enters) into the mold for molding, and absorbs and receives the used resin previously used in resin molding and held in the lower mold 206 by the fourth holding portion 212B. Through the film Fd (refer to Figure 6). In this manner, the mold 202 for molding can be loaded into the carrier 400 .

Next, as shown in FIG. 22 , by moving (lowering) the third holding portion 212A downward, the two films F on the lower surface of the carrier 400 (in a state where the molding resin R is mounted) come into contact with the lower mold 206 . At this time, each film F (the portion on which the molding resin R is mounted) is housed and mounted in the cavities 208A and 208B.

Next, the suction force of the first suction hole 400c of the carrier 400 via the third holding portion 212A is stopped, and the holding of the two films F (the state where the molding resin R is mounted) is released from the carrier 400 . At this time, the outer edge portion of each film F is placed on the mold surface 206a outside the mold cavity 208A, 208B so as to be attached to one end portion of the suction path 230b. Here, the film F is sucked from the suction path 230b, and the film F is sucked and held on the mold surface 206a outside the cavity 208. FIG. Then, by sucking the film F from the suction path 230a, as shown in FIG. 23, the film F is adsorbed on the mold surface 206a and held on the inner surface of the cavity 208 (mold surface of the cavity concave portion 209). By this operation, the molding resin R is supplied into the cavity 208 (on the cavity concave portion 209 ) through the film F.

Next, as shown in FIG. 24 , the carrier 400 is taken out by moving the third holding portion 212A. At this time, the carrier 400 held by the third holder 212A (the state where the film F and the molding resin R are not held) is moved from the inside of the molding die 202 to the outside (that is, from the upper side of the mold-opened state). between the mold 204 and the lower mold 206 to the outside) and transported to the preparation table 302. Here, the carrier 400 can be cleaned for reuse.

Then, as shown in FIG. 25 , the molding die 202 is closed, and the two workpieces W are clamped by the upper die 204 and the lower die 206 .

Next, as shown in FIG. 26, by raising the cavity parts 226A, 226B of the respective cavity 208A, 208B relatively, the two workpieces W can be thermally cured by applying heat and pressure to the molding resin R, and at the same time Resin molding (compression molding) is performed. By this operation, two molded products Wp can be produced.

Next, as shown in FIG. 27 , the molding die 202 is opened. At this time, the molded product Wp and the used film Fd are separated, and the two molded products Wp are held in the upper die 204 and the two used films Fd are held in the lower die 206 . In this state, as described above, the molded product Wp and the used film Fd are taken out and conveyed separately, and one set of molding operations is completed.

In addition, regarding the molding operation as described above, it is preferable to use a plurality of carriers 400 to parallelize each process at the same time in order to increase the efficiency of the operation. In this case, it is preferable to provide a plurality of carriers 400 inside the resin molding apparatus 1 , and to have a configuration in which the carriers 400 circulate through the above-mentioned respective processes. That is, as long as: the cleaning process of cleaning the carrier 400 at the preparation table 302, the combination of the film F on the carrier 400 Between the film setting process, the resin dropping process of dropping the molding resin R to the carrier 400 combined with the film F, and the resin supply process of supplying the film F and the molding resin R to the molding die 202, multiple The way in which the conveyor 400 handles different processes is to control a control unit (not shown) that controls the operations of each part in the resin molding apparatus 1 .

In this way, the waiting time of the carrier 400 in each process can be shortened, and the productivity can be improved. For example, by making the process of supplying the molding resin R to the film F, which is generally time-consuming, parallel to other processes, the process in the device can be efficiently performed and productivity can be improved.

In addition, the operation when resin molding is performed using the resin molding apparatus 2 as a modified example is basically the same as the operation when resin molding is performed using the above-mentioned resin molding apparatus 1 . In this case, for two workpieces W, two films F (and the molded resin R mounted thereon), and two molded articles Wp, the device configuration, etc., should be compared with one workpiece W, one film F (and the molded resin R mounted thereon), respectively. The molded resin R) and one molded product Wp may correspond.

As explained above, according to the resin molding apparatus and resin molding method of the present invention, it is possible to achieve a structure in which the mechanisms for supplying, storing, measuring thickness, and conveying workpieces and molded products are arranged in layers in the vertical direction. . Therefore, compared with conventional devices, the installation area can be reduced.

Furthermore, it is possible to achieve a configuration in which workpieces and molded products are processed and transported in two arrayed states, and a configuration in which two cavities are set in one lower mold and the workpieces are respectively placed in each cavity to perform resin molding at the same time realization. In this way, since two workpieces and molded products, as well as film and molding resin can be transported at the same time, and two workpieces can be resin molded at the same time, compared with the traditional device, the process time can be greatly shortened. Moreover, the configuration of the device and the manufacturing process can be simplified.

In addition, this invention is not limited to the Example demonstrated above, Various changes are possible in the range which does not deviate from this invention. In particular, although a resin molding apparatus of a compression molding method in which a lower mold is provided is described as an example, a configuration in which an upper mold is provided with a dimple, etc. may also be applied.

In addition, in the overall operation of the resin molding apparatus described above, it is also possible to maintain the molding quality (uniformity of the molding thickness) in the compression molding by sequentially performing the resin molding while performing the resin supply control described below. For critical resin supply homogenization.

(resin supply control)

Hereinafter, the configuration and operation for controlling resin supply in this embodiment will be described in detail with reference to the drawings. Fig. 29 is a block diagram showing an example of the control structure of the resin molding apparatus according to the embodiment of the present invention. The control unit CTR is constituted by a CPU, etc., and cooperates with controlling each unit in the workpiece processing unit 100A or the dispensing unit 100C to control the supply of the molding resin R. Furthermore, the control part CTR executes display control of the display part DIS for operator's operation, accepts an input from the input part INP, and reads or stores necessary information from the memory part MEM.

Fig. 30 is a flow chart showing an example of the resin supply operation of the resin molding apparatus according to the embodiment of the present invention. The motions described here correspond to a set of motions (a series of motions) required for resin molding one workpiece W. do). In addition, in the actual resin molding apparatus 1 , since each operation is performed in parallel on a plurality of workpieces W, necessary parts of these series of operations are performed on a time axis that is locally repeated.

In the resin supply operation shown in the figure, first, the control unit CTR acquires the molding condition information Dc from the memory unit MEM (step S1). Here, the control unit CTR reads, for example, the molded thickness (target value) of the resin part of the molded product Wp or the pattern of dropping the molded resin R in the carrier 400 from the memory unit MEM as molding condition information Dc. Although the injection pattern of the molded resin R is pre-memorized as the operation control pattern of the resin injection table 310, it is not only the moving position of the resin injection table 310 composed of moving target points, but also includes the resin injection table between each point. 310 movement speed. In addition, the injection pattern of the molded resin R also includes the speed at which the molded resin R is injected from the nozzle 312d (the amount of injection per unit time).

On the other hand, the control unit CTR acquires the workpiece information Dw of the workpiece W to be resin-molded thereafter (step S2). Here, in the workpiece processing unit 100A, the code reader 115 reads the two-dimensional code attached to the workpiece W taken out from the supply magazine 102 and outputs it to the control unit CTR, so that the control unit CTR obtains the ID of each workpiece W. Workpiece information Dw (such as serial numbers, etc.). Next, the control unit CTR obtains the thickness information Dt (step S3). Here, the workpiece measuring device 114 measures the thickness of the workpiece W (as described above in detail), and through the output to the control unit CTR, the control unit CTR obtains the thickness of the base material Wa or the electronic component Wb of each workpiece W, etc. Thickness information Dt.

Next, the control part CTR outputs resin supply setting information Dd1 (step S4). Here, the control unit CTR is calculated from the distributor 312 The amount (weight) of the molding resin R to be supplied is dropped. This operation can be obtained by subtracting the electronic component Wb obtained by measuring the thickness of the workpiece W from the volume of the cavity 208 at the time of molding obtained from the molded thickness of the resin part as the target value and the shape of the cavity 208 (planar view shape). Calculate the volume obtained from the volume and the specific gravity of the molded resin R after molding (cured state). Then, the control unit CTR outputs the previously read injection pattern of the molding resin R together with the calculated value to the dispenser 312 as the resin supply setting information Dd1.

Next, the dispenser 312 drops the molding resin R to the inner side of the resin injection holes 400 a and 400 b on the film F according to the resin supply setting information Dd1 . Here, in the dispenser 312, a predetermined amount of molding resin R is measured by a weight meter 312b, sent out by vibration through a trough 312c, and dropped from a nozzle 312d. In such a casting operation of the molding resin R, it may be difficult to uniformly drop the molding resin R from the dispenser 312 in some cases.

For example, in the hopper (hopper) 312a for storing the molded resin R of the distributor 312, the particle size contained in the upper side and the lower side of the interior is likely to be different, and the particle size of the molded resin R may be changed due to the timing of throwing. changing situation. Moreover, when sending out on the trough 312c by a vibrating feeder, the sending speed will be different due to the particle size of the molded resin R, so even if you want to perform the dropping operation in the same dropping mode, it may be difficult to get the actual dropped molded resin. The case of R homogenization. Therefore, in the dispenser 312, the molded resin R may not be dispensed in accordance with the resin supply setting information Dd1 (the weight of the supplied molded resin R) output from the control unit CTR. For this point, the actual supply amount information Dd2 which is the amount (weight) of the molded resin R actually supplied is output to The control unit CTR can obtain the actual supply amount information Dd2 (step S5).

Next, the control part CTR acquires supply resin shape information Dr (step S6). Here, the supplied resin checker 315 measures the appearance of the molding resin R dropped on the film F. As shown in FIG. For example, a camera serving as the supply resin inspector 315 captures the molded resin R mounted on the film F in the carrier 400 placed on the resin casting table 310, and outputs the captured image as supply resin shape information Dr to Control part CTR.

Next, the control part CTR acquires the molded product information Dp (step S7). Here, the thickness of the molded product Wp is measured by the molded product measuring device 118 with respect to the molded product Wp obtained by resin molding using the molding resin R prepared as described above. Then, by outputting the measured value to the control unit CTR, the control unit CTR can obtain the molded product information Dp of the thickness (resin molded portion) of each molded product Wp.

Next, the control unit CTR associates the plurality of pieces of information acquired in the above manner with the workpiece information Dw and stores them in the memory unit MEM (step S8 ) as the acquired information about one workpiece W for resin molding. By storing the information obtained in this way in the memory part MEM, the operator can use the display part DIS device to confirm the actual state of resin molding, make necessary changes from the input part INP, or send it to the manufacturing plant The higher-level system is used for quality control, etc. In addition, it is also possible to perform only the above steps as resin supply control to ensure traceability.

In the case of implementing further control in the device, the control unit CTR uses the information obtained in the above manner to determine whether the resin supply is correct (step S9). Here, the control unit CTR compares, for example, the molding condition information Dc, which is the target value of the molding thickness of the resin portion, with the molded product information Dp, which is the thickness of the molded product Wp (resin molded portion). According to this method, when the difference between the target value and the actual thickness of the molded product Wp exceeds a predetermined value (allowable value), it can be judged that the resin supply is inappropriate.

Next, the control part CTR adjusts the resin supply setting information Dd1 of the next workpiece|work W (step S10). Here, for example, when calculating the weight of the molded resin R dropped and supplied from the dispenser 312, the weight of the molded resin R to be supplied is obtained by determining whether the thickness difference between the target value and the molded product Wp is positive or negative. The correction value for correction is set to a positive and negative negative value, so that the forming thickness of the subsequent workpiece W can be brought close to the target value.

As another example of the operation in step 9, the control unit CTR sets the resin supply setting information Dd1 which is the weight of the molded resin R to be supplied, and the actual supply amount information Dd2 which is the amount (weight) of the molded resin to be supplied actually. compared to. According to this configuration, when the difference between the set value and the actual value exceeds a predetermined value (permissible value), it is judged that the resin supply is inappropriate. At this time, in step 10, the control unit CTR can increase or decrease the amount of the molding resin R that is weighed and dropped by the weight meter 312b to supply the subsequent workpiece W. FIG.

As another example of the operation in step 9, the control unit CTR determines whether the resin supply is appropriate based on the supplied resin shape information Dr belonging to the captured image of the molding resin R mounted on the film F, for example. Here, the captured image of the molding resin R is divided into predetermined Divide areas (n rows and m columns), compare the divided areas of the captured image, and calculate the degree of deviation, and then judge whether the resin supply is appropriate according to the degree of deviation. For example, obtain the color or brightness distribution (the product of the depth of color and the number of pixels) of the image constituting each divided area, and judge whether the resin supply is appropriate according to the degree of deviation of the amount of resin cast represented by the color density of each divided area .

For example, in the case of black epoxy resin generally used in resin molding, the more the amount of molded resin R supplied to a predetermined area, the denser the molded resin R will be, and the smaller the gaps between the molded resins R will be. In this case, since the film F (for example, milky white) under the molding resin R becomes difficult to photograph, the image will be close to the color of the molding resin R (black). Therefore, for example, in the case of uneven casting of the mold resin R, the section in which the film F is photographed more and the color of the image becomes lighter and the section in which the film F is not photographed and the color of the image is darker are mixed. In this way, when the depth of the image is greatly different in each section (when the deviation is large), it is judged that the resin supply is inappropriate. At this time, that is, in step 10 , the instructions for supplying the resin to the workpiece W thereafter are adjusted. For example, the control unit CTR may decrease the moving speed of the resin dropping table 310 or increase the dropping speed of the molded resin R from the nozzle 312d so as to drop more molded resin R in the divided area where the image becomes lighter. On the other hand, the control unit CTR may increase the moving speed of the resin casting table 310 or decrease the casting speed of the molded resin R from the nozzle 312d so that the molded resin R dropped in the divided area where the image becomes darker decreases. .

As described above, the resin supply setting information Dd1 of the next workpiece W is adjusted by the control unit CTR according to the obtained information, that is, The supply of molding resin R, which is important for maintaining the quality of compression molding, can be made uniform.

Furthermore, although the characteristics of each unit of the molding device have been described above, it belongs to a unit that processes or handles a common workpiece, and the configuration or action performed in any unit can also be performed in other units. won't get in the way. In addition, in this case, the functions of these units also have different functions in the unit units, and belong to the invention that includes them as monomer units. For example, in the dispensing unit, it is possible to prepare a unit that combines a film and a carrier to supply molding resin. Therefore, there is a situation where the same effect can be obtained by preparing and utilizing the distributing unit and the pressing unit separately.

In addition, the above mainly describes an example in which two workpieces W which are narrow workpieces are transported and molded in the molding apparatus 1 in a state in which their longitudinal directions are aligned in parallel. However, it is also possible to adopt a configuration in which three workpieces W belonging to a narrow workpiece are conveyed and molded in the molding apparatus 1 in a state in which their longitudinal directions are aligned in parallel. In addition, in consideration of the convenience of mold replacement, the work W, which is a narrow workpiece, is conveyed and formed in the molding device 1 in a state parallel to the front and rear direction of the device. However, it is also possible to adopt a configuration in which the workpieces W are conveyed and molded in the molding apparatus 1 in a state of being arranged in parallel in the left-right direction of the apparatus. In this case, the workpiece W can be efficiently conveyed without rotating the orientation of the workpiece W by arranging the supply cassette elevator 103 or the storage cassette elevator 113 on the left side of the workpiece processing unit 100A.

In addition, although the above is an example of cutting from a roll film and preparing and conveying a narrow or wide film F, the part not related to the film F in the invention of the above-mentioned embodiment is not used. It can also be implemented when the mold 202 for molding the film F is compression-molded. In this case, a dedicated carrier for transferring only the molding resin R is used. Furthermore, instead of using a narrow or wide film F, a roll film is provided on the press units 100B and 500B to supply the film F, and a dedicated conveyor for transporting only the molding resin R may be used. In this conveyor, the molded resin R can be conveyed in the closed state and supplied to the cavity 208 in the open state by making the lower part of the position where the molded resin R is accommodated openable and closable.

In addition, although the above description is based on the premise that the electronic component Wb mounting surface of the base material Wa is turned downward and then supplied into the device, it may also be set so that the workpiece W is reversed before the resin is molded in the device. The composition of the turn. In this case, the molded product Wp or the storage case 112 may be reversed again after molding. In addition, the unit of the workpiece W or the molded product Wp may be reversed, and the unit of the supply cassette 102 or the storage cassette 112 may be reversed. As a structure for achieving this purpose, for example, when transferring or delivering the workpiece W or the outer periphery of the molded product Wp with the outer periphery of the workpiece W or the molded product Wp clamped or held by suction, the rotation axis parallel to the outer periphery of the workpiece W or the molded product Wp can be penetrated. It can be reversed by rotating 180 degrees from the base. According to such a configuration, it is unnecessary to perform inversion work before and after the process (joining process or inspection process) in which the forming surface is operated upward, so it is possible to prevent production stoppage due to operational errors.

In addition, when the workpiece W or the molded product Wp is not reversed due to an operation error, that is, when the workpiece W is supplied in a wrong direction reversed from the expected direction, an alarm can be issued to the operator for correction. for the correct orientation. In this case, when the workpiece measuring device 114 measures the thickness of the workpiece W, the mounting direction of the semiconductor wafer or the like may be detected as the thickness of the workpiece W as well.

1‧‧‧Resin molding device

100A‧‧‧Workpiece Handling Unit

100B‧‧‧press unit

100C‧‧‧Dispensing unit

102‧‧‧Supply box

104, 104A, 104B‧‧‧supply track

106‧‧‧relay track

114‧‧‧Workpiece Measuring Device

116‧‧‧Workpiece heater

120‧‧‧Supply Pickup

122‧‧‧The first storage picker

124‧‧‧The second storage picker

202‧‧‧Mold for molding

208A, 208B‧‧‧Mould cavity

210‧‧‧1st loader (1st conveying part)

210A‧‧‧1st maintenance part

210B‧‧‧The second maintenance part

210a, 210b‧‧‧workpiece holding part

210c, 210d‧‧‧Molded product holding part

212‧‧‧The second loader (the second conveying part)

212A‧‧‧3rd maintenance department

212B‧‧‧4th maintenance part

212c, 212d‧‧‧Film holding part

240A, 240B‧‧‧workpiece holding mechanism

302‧‧‧Preparation table

304‧‧‧Conveyor picker

306, 306A, 306B‧‧‧film reel

308‧‧‧Film Platform (1st Unit)

310‧‧‧Resin drop platform (2nd unit)

312‧‧‧Distributor

314‧‧‧Resin Heater

315‧‧‧Supply resin checker (supply resin measuring device)

316‧‧‧Film residue processor

400‧‧‧Conveyor

F‧‧‧Film

Fd‧‧‧used film

R‧‧‧molding resin

W‧‧‧workpiece

Wp‧‧‧Molded products

Claims (4)

A resin molding apparatus using: a mold for molding; and conveying a workpiece with electronic parts mounted on a base material to the mold for molding and unloading a molded product obtained by resin molding with the mold for molding The conveying part performs resin molding on the workpiece, and is characterized in that it includes: a supply box elevator for lifting and lowering a supply box for storing the workpiece; a storage box elevator arranged at a position different from the supply box elevator in the vertical direction, The storage box for storing the above-mentioned molded products is lifted; the supply rail is arranged in front of the aforementioned supply box elevator, and the aforementioned workpieces taken out from the predetermined position of the aforementioned supply box are placed on the supply rail; Make it pass to the aforementioned storage box; the workpiece measuring device is arranged below the aforementioned supply track, and measures the thickness of the aforementioned workpiece from the lower side of the aforementioned workpiece on the aforementioned supply track; the supply picker keeps the aforementioned workpiece on the aforementioned supply track The workpiece is conveyed to the conveying part; and the storage picker holds the molded product on the conveying part and conveys it to the storage track, and the supply track, the workpiece measuring device, and the storage track are vertically aligned Overlap and juxtapose. The resin molding device according to claim 1, wherein the supply rail is configured in two rows so that the two workpieces can be placed side by side in the left and right direction, and the workpiece measuring device has two rows on the two rows of the supply rail. One or two thickness sensors that measure each thickness of the aforementioned workpieces with a predetermined scan. The resin molding apparatus according to claim 1 or 2, further comprising a workpiece heater for heating the workpiece from the lower side, the workpiece heater is located above the supply rail, and can be held in the state of the supply picker. The workpiece is arranged to move forward and backward between the position outside the outer periphery and the position opposite to the lower surface of the workpiece. The resin molding apparatus according to claim 1 or 2, wherein the supply picker conveys the workpiece to the conveying unit in the left-right direction, and the storage picker conveys the molded product from the conveying unit in the left-right direction. Set to juxtapose in the front-back direction.

Images