KR20190099143A - Resin molding machine and resin molding method - Google Patents

Abstract

The present invention relates to a resin molding machine and a resin molding method, for efficiently supplying films and a mold resin. A resin molding machine (1) according to the present invention comprises: a returning device (400) which is a jig that holds and supports a mold resin (R) and returns the mold resin (R) along with a film (F) within through holes (400a, 400b) formed to correspond to the shape of a cavity recessed portion (209) of a lower mold (206); a first table (308) which holds and supports the film (F) extracted from a film roll (306) and cut to a predetermined length, and on which the cut film (F) and the returning device (400) combine together; a second table (310) which is configured to be movable while being mounted with the returning device (400) holding and supporting the film (F) on a lower surface thereof; a returning device pick-up (304) which holds and supports the returning device (400) holding and supporting the film (F) on the lower surface thereof and returns the returning device (400) from the first table (308) to the second table (310); and a dispenser (312) which injects the mold resin (R) into the through holes (400a, 400b) in the returning device (400) mounted on the second table (310).

Description

Resin mold apparatus and resin mold method {RESIN MOLDING MACHINE AND RESIN MOLDING METHOD}

TECHNICAL FIELD This invention relates to the resin mold apparatus and resin mold method which resin-mold the workpiece | work with which the electronic component was mounted in the base material.

A method of manufacturing an electronic device such as a semiconductor device by a resin mold, wherein a work in which a plurality of electronic components are mounted on a substrate is collectively resin-molded, and the molded product is diced into pieces to form respective electronic devices. Methods are known. One such resin mold method is a compression molding method.

In the compression molding method, the workpiece is disposed in the mold region while supplying a predetermined amount of resin to the mold region (cavity) provided in the mold mold including the upper mold and the lower mold. This is a method for resin molding by an operation of clamping the upper mold and the lower mold. At this time, when using the mold metal mold | die which provided the cavity in the upper mold | type, it is generally performed to shape | mold by supplying resin with high viscosity collectively in a center position on a workpiece | work. In this case, in order to fill the resin supplied on the workpiece in the cavity, it is necessary to flow the mold resin to the end of the cavity, so that a flow mark may occur.

On the other hand, when using the mold metal mold | die which provided the cavity in the lower mold | type, the mold surface containing the said cavity is covered with a film, mold resin is supplied in equal thickness, and the workpiece | work held by the upper mold was immersed in molten mold resin, Resin molding is generally performed. For example, Patent Document 1 (Japanese Patent Laid-Open No. 2010-247429), Patent Document 2 (Japanese Patent Laid-Open No. 2004-148621), Patent Document 3 (Japanese Patent Laid-Open No. 2017-024398), and the like. An apparatus is disclosed.

Japanese Patent Laid-Open No. 2010-247429 Japanese Patent Application Laid-Open No. 2004-148621 Japanese Patent Application Laid-Open No. 2017-024398

In the conventional compression molding method resin mold apparatus illustrated by the said patent document etc., planarly arranges the mechanism which supplies a workpiece | work and accommodates a molded article, the mechanism which measures the thickness of a workpiece | work, a molded article, or the mechanism which conveys etc. planarly. The arrangement to arrange | position is common. Therefore, there existed a subject that the installation area of a resin mold apparatus becomes large easily.

In addition, when the thickness measurement of a workpiece | work, the count of the electronic component mounted, or the thickness measurement of a molded article, and also a process, such as conveyance of a workpiece | work and a molded article, are performed one by one (one sheet), a process time becomes long and a bottle neck is carried out. This has led to the problem of increasing the productivity of the entire apparatus.

Moreover, in the resin molding apparatus of the conventional compression molding method illustrated by said patent document etc., in the case of the structure which has a cavity in the upper mold | die of a mold metal mold | die, it conveys in the state which mounted the mold resin on one workpiece | work, and resin Since it can mold, there exists an advantage which can simplify an apparatus structure and a process. However, in the case of the structure which has a cavity in the lower mold of a mold metal mold | die, after carrying in a workpiece | work, it is necessary to carry in a film (release film) and mold resin as many times as needed, and when the workpiece | work to shape | mold increases, an apparatus structure and a process are carried out. There was a problem that became complicated.

Thus, especially in the resin mold apparatus which has a cavity in a lower mold | type, the apparatus which can supply a workpiece | work and molded article, a film, and mold resin efficiently, and can simplify a structure and a process is desired.

This invention is made | formed in view of the said situation, and implement | achieves the structure which the mechanism which performs supply, storage, measurement of thickness, conveyance, etc. with respect to a workpiece | work and a molded article is arrange | positioned hierarchically in the up-down direction, and is installed than a conventional apparatus. It is an object of the present invention to provide a resin mold apparatus capable of shortening the process time compared to the conventional apparatus by reducing the area and realizing a configuration in which processing and conveying are performed in a state where two workpieces and molded articles are arranged. .

Moreover, this invention is made | formed in view of the said situation, the resin mold apparatus which can supply the workpiece | work and molded article used for a resin mold, a film, and mold resin efficiently, and can also simplify a structure and a process, and It is an object to provide a resin mold method.

This invention solves the said subject by the solving means described below as one Embodiment.

The resin mold apparatus which concerns on this invention uses the conveyance part which conveys the mold metal mold | die and the workpiece | work mounted with the electronic component in the base material to the said mold metal mold, and carries out the molded article resin-molded from the said mold metal mold, The said workpiece | work A resin mold apparatus for resin-molding, comprising: a supply magazine elevator for elevating a supply magazine in which the work is stored, and a storage magazine for elevating a storage magazine disposed at different positions in the up and down direction with respect to the supply magazine elevator; A supply rail arranged at a front of the magazine elevator, a front of the supply magazine elevator, on which the work taken out from a predetermined position of the supply magazine is mounted, and a storage rail allowing the molded article to pass through the storage magazine; Disposed below the supply rail, and on the supply rail The work measuring device which measures the thickness of the said workpiece | work from the lower surface side with respect to the said workpiece, the supply pick-up which hold | maintains the said workpiece on the said supply rail and conveys it to the said conveyance part, and hold | maintains the said molded article on the said conveyance part, The storage pickup to convey is provided and it is a requirement that the said supply rail, the said workpiece | work meter, and the said storage rail overlap and install in the up-down direction.

According to this, the structure in which the mechanism which supplies, accommodates, measures the thickness, conveys, etc. with respect to a workpiece | work and a molded article is arrange | positioned hierarchically can be realized. Therefore, compared with the conventional apparatus in which each structure is planarly arranged, it becomes possible to reduce the installation area of a apparatus drastically.

Moreover, the said supply rail is comprised by two rows so that two said workpieces can be arranged side by side in the left-right direction, The said workpiece | work measuring device scans each thickness of two said workpieces on the said supply rails of two rows by 1 predetermined | prescribed scan. It is preferable to have one or two thickness sensors to measure by. According to this, the same correspondence position of two workpiece | work W can be scanned by one or two thickness sensors simultaneously. Therefore, since it is possible to measure two workpieces W in one scan in which the scanning distance and the scanning time are the shortest, the process time can be significantly shortened.

The work heater further includes a work heater for heating the work from the lower surface side, wherein the work heater faces a position outside the outer circumference and a lower surface of the work in the state held by the supply pickup above the supply rail. It is preferable to arrange | position so that advancing movement is possible between positions. According to this, heating (preheating) can be performed by the workpiece | work heater in the middle of the path | route which moves the workpiece | work W of the state hold | maintained by supply pickup upward. Therefore, compared with the conventional apparatus in which each structure is planarly arranged, it becomes possible to reduce the installation area of a apparatus drastically.

In addition, the carrying path in the left-right direction in which the said supply pickup conveys the said workpiece to the said conveyance part, and the carrying out path in the left-right direction in which the said storage pickup conveys the said molded article from the said conveyance part are set in parallel with the front-back direction. desirable. According to this, the carrying in operation of the workpiece by the supply pickup and the carrying out operation of the molded article by the storage pickup can be performed in parallel at the same time. Significant shortening is possible.

Moreover, the resin mold apparatus which concerns on this invention uses the said mold metal mold | die which has the upper mold which hold | maintains the workpiece | work with which the electronic component was mounted in the base material, and the lower mold | type with which the cavity recessed part to which mold resin is supplied through the film is formed. A resin mold apparatus for resin-molding a workpiece and processing into a molded article, wherein a through hole corresponding to the shape of the cavity recess is formed, and a conveying port which is a jig for holding the mold resin and conveying it with the film in the through hole ( And a first table in which the film fed out from the film roll and cut into a predetermined length is retained, the cut film and the conveyance port are combined, and the conveyance port in which the film is retained on the lower surface side. And a second table configured to be movable by holding a second table and the conveyance port in a state where the film is held on a lower surface side of the first table. From it a requirement that with a dispenser to inject the molding resin in the inside of the through hole in the transfer tool and the transfer tool for transferring the pickup to the second table, mounted on the second table.

According to this, by realizing the structure which provides a 1st table used for supply of a film, and a 2nd table used for supply of a mold resin, respectively, it is required when carrying a film and mold resin in a conveyance port, It becomes possible to perform processing of preparation of a film, preparation of a mold resin, etc. in parallel. Therefore, compared with the conventional apparatus which performs them by the same table, the process time can be shortened drastically.

Moreover, the said conveyance port has two rows of film holding | maintenance parts, and the resin injection hole corresponding to each said film | membrane in each said film holding | maintenance part so as to be able to arrange | position and hold two said films in the left-right direction as said through hole. It is preferable to have. According to this, it becomes possible to hold | maintain two films in which mold resin was mounted, respectively, by one conveyance port, and to convey to a mold metal mold | die. Therefore, compared with the conventional apparatus which conveys a film one by one conveyance port, a significant shortening of process time becomes possible.

Moreover, it is preferable that the said 1st table and the said film roll are arranged side by side in the vertical direction. According to this, the installation area of an apparatus can be reduced compared with the conventional apparatus in which each structure is planarly arranged.

Moreover, it is preferable to further provide the resin heater which heats from the upper surface side of the said conveyance opening in the state where the said film and the said mold resin were hold | maintained. According to this, since the mold surface can be heated immediately after the mold resin is mounted on the film to liquefy the mounting surface, especially when granular or powdered mold resin is used, generation of dust (fine powder of a resin, etc.) is prevented. This prevents the occurrence of product defects.

Moreover, the resin mold apparatus which concerns on this invention is a resin mold apparatus which resin-molds the workpiece | work mounted with the electronic component in the base material and processes it into a molded article using the mold metal mold | die provided with an upper mold | type and a lower mold | type, and hold | maintains the said workpiece | work The upper surface is provided with the 1st holding part and the 2nd holding part which hold | maintains the said molded article resin-molded, hold | maintains the said workpiece, and conveys it to the predetermined holding | maintenance position of the said upper mold, Furthermore, the said molded article is predetermined position other than the said mold die The lower surface is provided with the 1st conveyance part which conveys by a film, the 3rd holding | maintenance part which hold | maintains the conveyance port holding a film and mold resin, and the 4th holding | maintenance part which hold | maintains the used film on the lower surface, Is conveyed to the predetermined holding position of the lower mold, and the holding port of the state in which the holding of the film and the mold resin is released to hold the predetermined position outside the mold mold. It is required to have a 2nd conveyance part which conveys to the said, and hold | maintains the said film which remained in the said lower mold | type of the state in which the said molded article with which the resin mold was taken out, and conveys it to the predetermined position other than the said mold metal mold | die.

According to this, since the workpiece | work and molded article used for a resin mold, a film, and mold resin can be conveyed efficiently, it becomes possible to shorten process time compared with the conventional apparatus. Moreover, it becomes possible to simplify an apparatus structure and a process.

Moreover, the said workpiece | work is a rectangular workpiece of a rectangular shape, The said film is a rectangular film of a rectangular shape corresponding to the said rectangular workpiece, The said 1st holding part carries two said rectangular workpieces, and parallels the longitudinal direction of the said rectangular workpiece. 2 rows of molded article holding parts so that the said 2nd holding parts may hold | maintain the said 2 molded articles which processed the said rectangular workpiece by arranging them in parallel in the longitudinal direction of the said molded article so that they may be arranged and hold | maintained. The conveyance port has two rows of carrying film holding | maintenance parts so that the said rectangular film can arrange two rectangular films in parallel with the longitudinal direction of the said rectangular film, and the said 3rd holding part hold | maintains the conveyance port holding the said conveyance port And a fourth holding portion, wherein the used two rectangular films are parallel with each other in the longitudinal direction of the rectangular film. Lists to be seen to, preferably having 2 parts of heat out to see the film. According to this structure, since the structure which conveys a workpiece | work, a molded article, and a film and a mold resin two by one simultaneously can be implement | achieved, compared with the conventional apparatus which conveys them one by one, the process time can be shortened drastically.

In addition, the said workpiece | work is a rectangular workpiece of a rectangular shape, or a wider workpiece | work wider than the said rectangular workpiece, and the said film is wider than the rectangular film of the rectangular shape corresponding to the said rectangular workpiece, or the said rectangular film One rectangular film conveyance port which has 2 rows of carrying film retention parts so that the said 3rd holding | maintenance part can hold and arrange two said rectangular films in parallel in the longitudinal direction of the said rectangular film as said conveyance port. Or it is preferable to have a conveyance port holding part which hold | maintains the wide film conveyance port which has one carrying film holding part which hold | maintains one said wide film in common. According to this, since the workpiece conveyed by a common conveyance port holding part can carry in a film by the common conveyance port holding part, depending on whether the workpiece | work processed by a molded article is a rectangular workpiece | work or a wide workpiece | work, it is a film by simple switching. It can be set as the structure which can supply.

In addition, the first holding part has a configuration having two rows of work holding parts and one work holding holding one of the wide workpieces so that the two rectangular workpieces can be arranged in parallel in the longitudinal direction of the rectangular workpiece. The structure which has a part is comprised so that replacement is possible, The said 2nd holding part has the structure which has two rows of molded article holding parts so that the said two molded articles which processed the said rectangular workpiece can be held in parallel in the longitudinal direction of the said molded article, It is preferable that the structure which has one molded article holding | maintenance part holding one said molded article which processed one said wide workpiece | work is comprised so that substitution is possible. According to this, any workpiece | work of a rectangular workpiece and a wide workpiece can be set as the structure which can convey a workpiece | work and a molded article by substitution of the simple structure of a 1st holding part and a 2nd holding part.

In addition, the said film is a rectangular film of the rectangular shape corresponding to the said rectangular workpiece, or a wide film which is wider than the said rectangular film, The said 4th holding | maintenance part carries out two said rectangular films in the longitudinal direction of the said rectangular film. It is preferable to have a film holding | maintenance part arrange | positioned in parallel with two rectangular areas hold | maintained in parallel to the left-right direction, and several adsorption | suction parts which adsorb | suck and hold | maintain a film in the area | region overlapped in the wide area | region which hold | maintains one said wide film . According to this, the plurality of adsorption units are disposed at positions where the film can be held even when the wide film is adsorbed and held by the rectangular film, so that any film of the rectangular film and the wide film can be replaced by a configuration. It can be set as the structure which can be carried out without carrying out.

Moreover, the said conveyance port is the cleaning process which cleans the said conveyance port, the film setting process of combining the said film with the said conveyance port, the resin dropping process of dropping the said mold resin to the said conveyance port combined with the said film, It is preferable that the plurality in which the process in the different process of the resin supply process which supplies the said film and the said mold resin to the said mold metal mold | die is performed is provided. According to this, by circulating each conveyance port in each process for resin molding, the waiting time of the conveyance port in each process can be shortened and productivity can be improved.

Moreover, the said conveyance port has a 1st suction hole which generate | occur | produces a suction force, and hold | maintains the said film, The said 3rd holding part is arrange | positioned in the position which communicates with a said 1st suction hole in the state which hold | maintained the said conveyance port in a predetermined position. It is preferable to have a 2nd suction hole which generate | occur | produces a suction force. According to this, it becomes possible to convey the said conveyance opening by the 3rd holding part in the state which attracted the film to the lower surface of the conveyance opening.

Moreover, the resin mold method which concerns on this invention is a resin mold method which performs a resin mold using said resin mold apparatus, The plurality of conveyance ports are provided, The cleaning process which cleans the said conveyance port, The said conveyance Between a film setting step of combining the film with a sphere, a resin dropping step of dropping the mold resin into the conveying port combined with the film, and a resin supply step of supplying the film and the mold resin to the mold die. In the above, the plurality of conveying ports are required to be processed in different processes. According to this, by circulating each conveyance port in each process for resin molding, the waiting time of the conveyance port in each process can be shortened and productivity can be improved.

According to the present invention, it is possible to reduce the installation area compared to the conventional apparatus by realizing a configuration in which mechanisms for supplying, storing, measuring thickness, and conveying the workpiece and the molded article are arranged hierarchically in the vertical direction. Become. In addition, it is possible to shorten the process time compared with the conventional apparatus by realizing a configuration in which processing and conveying are performed in a state where two workpieces and molded articles are arranged.

In addition, according to the present invention, two or more cavities are provided in one lower mold, and work can be arranged in each cavity and resin mold can be realized simultaneously. In particular, since it becomes possible to supply the workpiece | work and molded article used for a resin mold, a film, and a mold resin efficiently, it becomes possible to shorten process time compared with the conventional apparatus. Moreover, it becomes possible to simplify an apparatus structure and a process.

1 is a plan view illustrating an example of a resin mold apparatus according to an embodiment of the present invention.
FIG. 2 is a left side view of the II-II position in FIG. 1. FIG.
3 is a plan view illustrating an example of a supply rail of the resin mold apparatus of FIG. 1.
4 is a plan view illustrating an example of a storage rail of the resin mold apparatus of FIG. 1.
5 is a left side view of the VV position in FIG. 1.
FIG. 6 is a left side view of the VI-VI position in FIG. 1. FIG.
FIG. 7 is a left side view of the VII-VII position of FIG. 1. FIG.
8 is a front view of the position VIII-VIII in FIG. 1.
9 is a plan view illustrating an example of a transport port of the resin mold apparatus of FIG. 1.
FIG. 10 is a plan view illustrating an example of a mold mold of the resin mold apparatus of FIG. 1.
11 is an operation explanatory diagram of the resin mold apparatus according to the embodiment of the present invention.
12 is an explanatory diagram of the operation connected to FIG. 11.
13 is an explanatory diagram of the operation connected to FIG. 12.
14 is an explanatory diagram of the operation connected to FIG. 13.
15 is an explanatory diagram of the operation connected to FIG. 14.
FIG. 16 is an explanatory diagram of the operation connected to FIG. 15.
17 is an explanatory diagram of the operation connected to FIG. 16.
18 is an explanatory diagram of the operation connected to FIG. 17.
19 is an explanatory diagram of the operation connected to FIG. 18.
20 is an explanatory diagram of the operation connected to FIG. 19.
21 is an explanatory diagram of the operation connected to FIG. 20.
22 is an explanatory diagram of the operation connected to FIG. 21.
FIG. 23 is an explanatory diagram of the operation connected to FIG. 22.
24 is an explanatory diagram of the operation connected to FIG. 23.
25 is an explanatory diagram of the operation connected to FIG. 24.
FIG. 26 is an explanatory diagram of the operation connected to FIG. 25.
27 is an explanatory diagram of the operation connected to FIG. 26.
It is a top view which shows the modification of the resin mold apparatus which concerns on embodiment of this invention.
29 is a block chart showing an example of a control configuration according to the embodiment of the present invention.
30 is a flowchart showing an example of a resin supply operation according to the embodiment of the present invention.

(Overall configuration)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings. 1 is a schematic view (plan view) showing an example of a resin mold apparatus 1 according to an embodiment of the present invention. 2-10 is schematic which shows the detail of each structure of the resin mold apparatus 1. In addition, for convenience of description, in the figure, the arrow may illustrate the front, back, left, and right directions in the resin mold apparatus 1 by the arrow. In addition, in the whole figure for demonstrating each embodiment, the same code | symbol is attached | subjected to the member which has the same function, and description of the repetition may be abbreviate | omitted.

The resin mold apparatus 1 which concerns on this embodiment performs the resin mold shaping | molding of the workpiece | work (molded object) W using the mold metal mold | die 202 provided with the upper mold | type 204 and the lower mold | type 206. to be. Hereinafter, as the resin mold apparatus 1, the workpiece | work W is hold | maintained by the upper mold | type 204, and the cavity 208 (partly containing mold surface 206a) provided in the lower mold | type 206 is film (release film) The compression molding apparatus which covers with (F), supplies mold resin R, clamps the upper mold | type 204 and the lower mold | type 206, immerses the workpiece | work W in the molten mold resin R, and molds resin. Will be described as a main example. The cavity 208 is defined by a cavity recess 209 that is recessed in a predetermined shape on the upper surface of the lower mold 206, and compression molding is performed by supplying the mold resin R through the film F. It becomes possible.

First, the workpiece | work W which is shaping | molding object is equipped with the structure by which the some electronic component Wb was mounted in matrix form in the base material Wa. More specifically, examples of the substrate Wa include plate-shaped members (rectangular rectangular workpieces) such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers formed in rectangular shapes. . Moreover, as an example of the electronic component Wb, a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, a spacer, etc. are mentioned. In addition, as will be described later, an apparatus modification example that can be applied to the case of using a square or circular one as a base material Wa is also conceivable.

As an example of the method of mounting the electronic component Wb on the base material Wa, there is a mounting method by flip chip mounting, wire bonding mounting, or the like. Or in the case of the structure which peels a base material (glass or metal carrier plate) Wa after a resin mold, the electronic component (Wb) using the adhesive tape which has heat-peelability, or ultraviolet curable resin hardened by ultraviolet irradiation. ) Can also be attached.

On the other hand, as an example of mold resin (R), granular thermosetting resin (for example, epoxy resin of filler containing) is used. Moreover, it is not limited to said state, Other states (shape), such as a liquid form, a powder form, a cylinder form, a plate form, a sheet form, may be sufficient.

Moreover, as an example of the film F, the film material excellent in heat resistance, peelability, flexibility, and stretchability, for example, PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP , Fluorine-impregnated glass cross, polypropylene, polyvinyl chloride, and the like are suitably used. As this film F, the rectangular-shaped rectangular film corresponding to the rectangular workpiece | work W can be used, for example.

Next, the outline | summary of the resin mold apparatus 1 which concerns on this embodiment is demonstrated. As shown in FIG. 1, the resin mold apparatus 1 resin-molds the workpiece processing unit 100A and the workpiece | work W which mainly perform supply of the workpiece | work W, and storage of the molded article Wp after resin mold, Dispensing unit mainly for supplying press unit 100B, film F and mold resin R, which mainly process the molded product Wp, and storage (disposal) of the used film Fd after the resin mold. 100C is provided as a main configuration. Moreover, in this embodiment, while providing two cavities in one lower mold | type, two workpieces W are arrange | positioned, resin mold is carried out collectively, and the resin mold of the compression molding system which obtains two molded articles Wp simultaneously. The apparatus will be described as an example.

In this embodiment, units, such as the workpiece | work processing unit 100A, the press unit 100B, and the dispense unit 100C, are connected and assembled. As an example, the workpiece processing unit 100A, the press unit 100B, and the dispense unit 100C are arranged side by side in that order from the left side in the left and right directions. Moreover, arbitrary numbers of guide rails (not shown) are provided in linear form between each unit, The 1st loader (1st conveyance part) 210 which conveys the workpiece | work W, etc., and the film F The 2nd loader (2nd conveyance part) 212 which conveys a back etc. is provided so that a movement is possible between predetermined units along arbitrary guide rails. In addition, since such loaders 210 and 212 perform not only an operation | movement operation | movement, such as the workpiece | work W, etc. to the mold die 202, but also the operation | movement operation | movement of the molded article Wp from the mold die 202, It also functions as an off loader.

Therefore, the structure aspect of the resin mold apparatus 1 can be changed by changing the structure of a unit. For example, although the structure shown in FIG. 1 is an example in which three press units 100B were installed, only one press unit 100B was installed, or the resin mold apparatus which connects and installs 2 or 4 or more units ( (Not shown). It is also possible to install other units. For example, it is also possible to provide the unit which supplies the mold resin R different from the dispense unit 100C, and the unit which supplies the member which assembles with the workpiece | work W in a metal mold | die (not shown). As an example, the member may be a plate member that functions as a heat sink or a shield plate. In this case, after laminating | stacking a plate-shaped member on the film F, you may convey, after supplying mold resin R on a plate-shaped member.

(Work processing unit)

Subsequently, the conveyance operation | movement of the workpiece | work W and the molded product Wp is mainly demonstrated about the structure of the workpiece processing unit 100A with which the resin mold apparatus 1 is equipped.

The work processing unit 100A firstly supplies a supply magazine elevator 103 for elevating a supply magazine 102 in which a plurality of workpieces W are stored, and a storage magazine 112 in which a plurality of molded products Wp are stored. The storage magazine elevator 113 which elevates is provided. This storage magazine elevator 113 is arrange | positioned with respect to the supply magazine elevator 103 in a different position in an up-down direction. For example, such elevators 103 and 113 can be arranged side by side in the vertical direction in the state of having an overlap in plan view. Here, a well-known stack magazine, a slit magazine, etc. are used for the supply magazine 102 and the storage magazine 112, In this embodiment, it is a workpiece | work in the state which the mounting surface of the electronic component Wb is all downward in this embodiment. (W) and molded article Wp are stored, respectively. In addition, from the viewpoint of protecting the electronic component Wb, it is preferable to drop and hold the workpieces W by using a slit magazine which sandwiches and holds the workpiece W in a concave portion facing from the inside of the magazine frame. . In addition, the supply magazine elevator 103 is comprised so that the workpiece | work W can be taken out from a predetermined position by holding | maintaining and raising the supply magazine 102. As shown in FIG. The storage magazine elevator 113 is comprised so that the molded article Wp can be accommodated in a predetermined position by holding and raising the storage magazine 112. As shown in FIG.

Next, the work processing unit 100A is provided in front of the supply magazine 102 and is provided with the supply rail 104 on which the workpiece | work W taken out from the supply magazine 102 is mounted. In this embodiment, although the relay rail 106 which passes the workpiece | work W is provided between the supply magazine 102 and the supply rail 104, it can also be set as the structure which abbreviate | omits this. In addition, a well-known pusher etc. (not shown) is used for the movement of the workpiece | work W from the supply magazine 102 to the supply rail 104. FIG.

Here, the supply rail 104 supports the long side of the workpiece | work W from below by a pair of rails, avoiding the mounting position of the electronic component Wb, and supports the workpiece | work W from the side to the front-back direction. To guide. Moreover, the supply rail 104 is comprised by two rows (104A, 104B in a figure), and can move to the left-right direction so that the two workpiece | work W can be arranged side by side from the short direction to the left-right direction. It has a moving mechanism (not shown). Thereby, after mounting the workpiece | work W taken out from the supply magazine 102 to one row (for example, 104A), supply rail 104A, 104B in any left-right predetermined direction (for example, right direction). ), And the next work W can be mounted in the other row (for example, 104B). Moreover, each of supply rail 104A, 104B is comprised by the width | variety between rails according to the width | variety of the workpiece | work W.

Next, while the work processing unit 100A is disposed below the supply rail 104, the work processing unit 100A is configured to be movable in the front, rear, left and right directions, and has a lower surface side with respect to the work W on the supply rail 104. The workpiece | work meter 114 which measures the thickness of the workpiece | work W from the mounting surface side of the electronic component Wb is provided. This workpiece | work meter 114 is comprised with a laser displacement meter and a camera (monocular camera or a compound eye camera), and measures the thickness of the workpiece | work W based on these output data. In addition, in "measurement of thickness" here, the presence or absence of the mounting of the electronic component Wb in the base material Wa, the measurement of the mounting height of the electronic component Wb, the measurement of the position shift of the mounting, the measurement of the mounting number And necessary measurement are included. Based on the result of "measurement of the thickness" here, the volume of the electronic component Wb mounted in the workpiece | work W is calculated from the presence or absence of the mounting of the electronic component Wb, mounting height, etc. By adjusting the supply amount of (R), the molding thickness of the molded article can be controlled with high accuracy.

Here, the workpiece | work measuring instrument 114 has the two thickness sensors 114a and 114b which measure each thickness of the two workpiece | work W on the supply rail 104A, 104B of two rows. As an example, the thickness sensor 114a is arrange | positioned at the position corresponding to the workpiece | work W of the right side row, and the thickness sensor 114b is arrange | positioned at the position corresponding to the workpiece | work W of the left side row. Thereby, it becomes possible to scan the same correspondence position of each workpiece | work W at the same time, and it becomes possible to measure two workpiece | work W by one scan in which scanning distance and scanning time become the shortest. Therefore, the process time can be greatly shortened. As a measurement operation of the workpiece | work W in 1 scan, the workpiece | work W along the pattern comprised by the line which connected the adjacent ends of the straight line which divides the workpiece | work W vertically or horizontally (n is an integer of 2 or more). What is necessary is just to measure the workpiece | work W at predetermined intervals, moving W) with respect to thickness sensors 114a and 114b. Thereby, the thickness of the base material Wa, the height of the electronic component Wb, etc. in the workpiece | work W can be measured arbitrarily by "1 scanning operation | movement (1 scan) according to a predetermined pattern. In addition, in the structure of this embodiment, the mechanism of the movement operation | movement of the left-right direction of supply rail 104A, 104B for mounting the workpiece | work W, and the workpiece | work measuring device The mechanism of the movement operation | movement of the front-back direction of 114) can be implemented with a simple structure. In addition, similarly to supply rail 104A, 104B, the space | interval of thickness sensor 114a, 114b is variablely comprised according to the width | variety of the workpiece | work W. As shown in FIG. Thereby, even if the magnitude | size (width) of the workpiece | work W changes, it becomes possible to measure two workpiece | work W by one scan.

Moreover, as a modification, in the measurement operation | movement of the workpiece | work W in 1 scan, the camera as the thickness sensors 114a and 114b image | photographs predetermined width | variety collectively by one movement in the front-back direction, and the workpiece | work W You may measure the thickness of the whole surface. In addition, you may perform the scanning operation | movement by making the workpiece | work meter 114 move back and forth and left and right. In addition, it is good also as a structure which has one thickness sensor and measures two workpieces W by one predetermined scan one by one (not shown).

In addition, although it is preferable that the workpiece | work measuring instrument 114 measures the thickness of the workpiece | work W from the lower surface side with respect to the workpiece | work W on the supply rail 104 in relationship with the supply operation | movement of the workpiece | work W mentioned later, It is good also as a structure which measures the thickness of the workpiece | work W with respect to the workpiece | work W from the upper surface side. In this case, the workpiece | work measuring instrument 114 can also be provided in the upper and lower sides, or both of the relay rails 106 which let the workpiece | work W pass. In addition, it is good also as a structure which the workpiece | work measuring instrument 114 reads not only the thickness of the workpiece | work W but identification information (for example, two-dimensional code) provided to the workpiece | work W. As shown in FIG. Furthermore, the code reader 115 which can read the two-dimensional code of the workpiece | work W can be provided in the upper and lower sides of the relay rail 106. As shown in FIG. As identification information of such a workpiece | work W, it is possible to identify which workpiece | work W is provided, for example by a serial number or a code which does not overlap. By recording this identification information by connecting the detailed conditions of the resin mold and the like, the process of increasing the traceability as described later becomes possible.

Next, the workpiece processing unit 100A includes a supply pickup 120 that holds the workpiece W mounted on the supply rail 104 and conveys it to a predetermined position. In addition, below, "pickup" is a structure corresponding to the pick-and-place mechanism which transfers a predetermined object between arbitrary positions. This supply pickup 120 has a known holding mechanism (for example, a structure holding a holding claw and holding a suction hole communicating with a suction device, etc.) as a mechanism for holding the workpiece W. (Not shown). In addition, a well-known mechanism, such as a vacuum pump, is used for a suction device (it is the same below). Here, the supply pickup 120 is configured to be movable in the left and right and up and down directions. Thereby, by carrying out a raise operation by holding the workpiece | work W mounted on the supply rail 104, it can finally convey (supply) to the 1st holding part 210A mentioned later.

In addition, in the supply pickup 120 which concerns on this embodiment, the said holding mechanism has two rows arranged side by side at the position corresponding to the two workpiece | work W on two rows of supply rails 104A, 104B. It is composed. Thereby, it becomes possible to hold | maintain and convey two workpiece | work W on the supply rail 104A, 104B of two rows simultaneously in the state arranged in the left-right direction. In other words, the workpiece | work W can be hold | maintained by making the longitudinal direction parallel.

Next, the work processing unit 100A includes a work heater 116 that heats the work W from the lower surface side. Here, as a structure which heats the workpiece | work W, the well-known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is arrange | positioned on the upper surface of the workpiece heater 116 (not shown). As a result, the work W is loaded into the mold die 202 and preheated before being heated, thereby preventing elongation of the work W in the mold die 202. In addition, as a modification, the structure which does not include the workpiece heater 116 can also be considered. In this case, a heater can be provided in 210A of 1st holding | maintenance parts (1st loader 210). In this case, preheating can be performed while holding the workpiece | work W by the 1st holding part 210A. In addition, a heater may be provided in the first loader 210. In this case, when the workpiece | work W is exchanged, it can be evacuated from the position of the 1st holding part 210A, and can be preheated at the time of conveyance of the workpiece | work W. FIG.

The work heater 116 which concerns on this embodiment is arrange | positioned so that advancing movement is possible with respect to the lower surface side of the workpiece | work W of the state hold | maintained by the supply pick-up 120 above the supply rail 104 (FIG. 2). In other words, it can be said that the work heater 116 is arrange | positioned so that a movement is possible between the position which becomes outward rather than the outer periphery of the workpiece | work W, and the position which becomes just under the lower surface of the workpiece | work W. Thereby, it becomes possible to perform the preheating process of heating the workpiece | work W before a resin mold is performed. In addition, when the work heater 116 is moved to a position which is directly below the lower surface of the work W, the supply pickup 120 in a state where the work W is held is moved downward to move the work W. By performing the operation of approaching the heater 116, more efficient heating becomes possible.

In addition, the workpiece heater 116 which concerns on this embodiment is the structure which said heating mechanism was arranged in two rows in the left-right direction at the position corresponding to the two workpiece | work W hold | maintained by the supply pickup 120. It is. Thereby, it becomes possible to simultaneously and equally heat the two workpiece | work W hold | maintained side by side by the supply pick-up 120 in the left-right direction.

Thus, the workpiece | work W in the state hold | maintained by the supply pick-up is heated by the workpiece heater 116 above the supply rail 104, ie, during the movement of the up-down direction by the supply pick-up (preheating process). Can be realized. Therefore, compared with the conventional apparatus in which each structure is planarly arranged, it becomes possible to reduce the installation area of a apparatus drastically.

Next, the 1st loader 210 which works together with each mechanism of the workpiece processing unit 100A has the 1st holding part which conveys the said workpiece | work W to the predetermined holding | maintenance position of the upper mold | type 204 in the upper surface. 210A is provided. The workpiece | work W conveyed by the supply pick-up 120 is mounted in this 1st holding | maintenance part 210A when it moves to the position of the side (for example, right side) with respect to the supply rail 104. FIG. In the case of exchanging the workpiece W, the supply pickup 120 further rises on the supply rail 104 through a preheating step, and then continuously moves to the right side, whereby the first holding positioned on the right side of the supply rail 104 is performed. It moves to the position which can be delivered to the part 210A. 210 A of 1st holding | maintenance parts are the workpiece holding | maintenance parts which hold | maintain the mounted workpiece | work W, and it has a well-known holding | maintenance mechanism (for example, the structure which clamps with a holding claw, and has a suction hole which communicates with a suction device, and adsorption | suction) Or the like, in the drawing, reference numerals 210a and 210b.

In this embodiment, the said workpiece holding | maintenance part 210a, 210b is a structure arrange | positioned 2 rows side by side at the position corresponding to the two workpiece | work W hold | maintained by the supply pickup 120. That is, the workpiece | work W can be hold | maintained by arranging the longitudinal direction in parallel. As a result, the two workpieces W arranged side by side in the left and right directions by the supply pickup 120 can be mounted at the same time without being arranged in the same arrangement, arranged side by side in the left and right directions, and transported. .

Moreover, the 1st loader 210 which hold | maintained the workpiece | work W by the 1st holding part 210A is comprised so that a movement to back, front, left, and right is possible. By moving in the left-right direction, it becomes possible to convey the workpiece | work W from the workpiece processing unit 100A to the press unit 100B. On the other hand, the conveyance of the workpiece | work W from the exterior of the mold metal mold | die 202 inside (namely, between the upper mold | type 204 and the lower mold | type 206 of the state which opened | released) by the movement of the front-back direction It becomes possible. In addition, the movement of the vertical direction makes it possible to convey (transfer) the workpiece W to the predetermined holding position of the upper die 204 in the mold die 202. Further, as a modification, instead of the configuration in which the first holding portion 210A moves left and right, it is conceivable to use a configuration in which the supply pickup 120 replaces the movement of the movement range. Instead of the configuration in which the first holding portion 210A moves up and down, it is also conceivable to use a mold opening and closing mechanism of the mold die 202 to replace the movement in the movement range (all of which are not shown).

Next, in the upper surface of the first loader 210, the resin molded molded product Wp is mounted separately from the mold mold 202 (here, the upper mold 204) to mold the molded product Wp. The 2nd holding part 210B conveyed to the predetermined position other than the metal mold | die 202 is provided. Moreover, the 2nd holding part 210B is a molded article holding part which hold | maintains the mounted molded product Wp, and uses a well-known holding | maintenance mechanism (for example, a structure which has a holding claw and clamps the suction hole which communicates with a suction device). And the like to be adsorbed) (symbols 210c and 210d in the drawing).

In addition, in the 2nd holding part 210B which concerns on this embodiment, the said molded article holding parts 210c and 210d are two molded articles (holding | maintenance) in the mold metal mold | die 202 (upper mold | type 204) after resin mold. At a position corresponding to Wp), two rows are arranged side by side in the left-right direction. That is, the molded article Wp can be held in parallel with its longitudinal direction. Thereby, the two molded articles Wp arranged side by side in the left and right direction by the mold die 202 (upper mold 204) are mounted at the same time without being arranged in the same arrangement and arranged side by side in the left and right directions. , It becomes possible to convey.

Here, in this embodiment, the 2nd holding part 210B and said 1st holding part 210A are comprised integrally as the 1st loader 210. As shown in FIG. As an example, the first loader 210 has a first holding part 210A having two left and right work holding parts 210a and 210b on its front side, and a molded product holding part 210c having two left and right rows on its rear side. The second holding part 210B having 210d is disposed. Therefore, 210 A of 1st holding | maintenance parts and 210 B of 2nd holding | maintenance parts are comprised as the 1st loader 210 in the structure which can move back and forth, right and left, and a vertical direction. Thereby, not only the simplification and the miniaturization of the apparatus configuration can be realized, but also the configuration of simultaneously conveying the workpieces W and the molded articles Wp, two by one, can be realized, thereby shortening the process time.

Moreover, as a modification, it is also possible to comprise the loader provided with the 2nd holding part 210B separately from the loader provided with 210A of said 1st holding parts (not shown). In that case, it is good to set it as the structure which can move similarly to 210 A of said 1st holding parts.

Next, the workpiece processing unit 100A includes a first storage pickup 122 that holds the molded product Wp mounted on the second holding unit 210B and conveys it to a predetermined position. Moreover, the workpiece processing unit 100A is equipped with the 2nd storage pick-up 124 which the molded article Wp hold | maintained in the 1st storage pick-up 122 is mounted, and conveys to the predetermined position in a unit. Both of them have a known holding mechanism (for example, a structure having a holding claw and a holding mechanism, a structure having a suction hole communicating with a suction device, a suction mechanism, and a mechanism for mounting only) as a mechanism for holding the molded product Wp. (Not shown). In this embodiment, the storage pick-up which conveys the molded object Wp from the 1st loader 210 is comprised by combining the 1st storage pick-up 122 and the 2nd storage pick-up 124.

Here, the 1st accommodation pickup 122 which concerns on this embodiment is comprised so that a movement to a left-right direction is possible. Thereby, it becomes possible to hold | maintain the molded article Wp mounted on the 2nd holding part 210B, and to convey it on the 2nd storage pickup 124. FIG. Here, in the exchange of the first storage pick-up 122 and the second storage pick-up 124, the molded article Wp may be interposed and cooled to be cooled while being flattened to prevent warpage and deformation of the molded article Wp. . In addition, as a modification of the 1st storage pickup 122, it is good also as a structure (storage pickup) which can move not only in a left-right direction but also in an up-down direction. Thereby, the structure which abbreviate | omits the moving mechanism of the up-down direction of the 2nd holding part 210B can be implement | achieved.

In addition, in the 1st storage pick-up 122 which concerns on this embodiment, the said holding | maintenance mechanism has two molded articles with which the said holding mechanism was mounted on the 2nd holding part 210B (two molded articles holding part 210c, 210d) ( At a position corresponding to Wp), two rows are arranged side by side in the left-right direction. Thereby, it becomes possible to hold | maintain and convey two molded articles Wp on the 2nd holding part 210B simultaneously in the state arranged in the left-right direction.

In addition, in this embodiment, the carry-in path of the left-right direction in which the supply pick-up 120 conveys the workpiece | work W to 210 A of 1st holding parts, and the storage pickup (1st storage pick-up 122) are 2nd The carrying-out path of the left-right direction which conveys the molded article Wp from the holding part 210B is set in parallel with the front-back direction. Thereby, the carry-in operation | movement of the workpiece | work W by the supply pick-up 120 and the carrying out operation | movement of the molded article Wp by the storage pick-up (1st storage pick-up 122) do not intersect or overlap, and wait time Can be suppressed. Therefore, since each operation | movement can be performed efficiently by carrying out several operation | movement simultaneously simultaneously, a process becomes smooth and a process time can be shortened.

On the other hand, the 2nd storage pickup 124 which concerns on this embodiment is comprised so that a movement to an up-down direction is possible. Thereby, it becomes possible to hold | maintain the molded article Wp mounted on the 2nd storage pickup 124, and to convey it on the storage rail 108 mentioned later.

In addition, the 2nd storage pick-up 124 which concerns on this embodiment has two rows in a left-right direction at the position corresponding to the two molded articles Wp in which the said holding mechanism was hold | maintained by the 1st storage pick-up 122. It is arranged in parallel. Thereby, it becomes possible to hold | maintain and convey the two molded articles Wp hold | maintained at the 1st storage pick-up 122 simultaneously in the state arranged in the left-right direction.

In addition, in this embodiment, although it is set as the structure provided with two storage pickups (1st storage pickup 122 and the 2nd storage pickup 124) as mentioned above, as a modification, it moves to a left-right and up-down direction. It is good also as a structure provided with one storage pickup as possible (not shown). Thereby, it becomes possible to hold | maintain the molded article Wp mounted on the 2nd holding part 210B, and to convey it on the storage rail 108 directly. In addition, you may comprise the supply pick-up 120 and the storage pick-up with an articulated robot (transfer robot). In this case, according to the conveyance mechanism which combined the horizontal articulated robot and the lifting mechanism, for example, the workpiece | work W and the molded article Wp can be moved to left and right and up-down direction, and it is set as the function similar to the structure mentioned above. Can be.

In addition, in the above-described configuration, the first loader 210 overlaps with the position where the molded article Wp can be exchanged with the first storage pickup 122 (the first storage pickup 122 in FIG. 1). Position), the above-described operation can be performed. However, the operator can easily access the workpiece W and the molded product Wp held by the first loader 210 by making the first loader 210 moveable to the side of the apparatus. In this case, the structure which moves the rail itself which moves the 1st loader 210 to the left-right direction in the workpiece | work processing unit 100A can be employ | adopted. According to this, when the 2nd storage pick-up 124 moves up and down, this rail can be retracted from the moving range of the 2nd storage pick-up 124. FIG. As a result, when performing normal production, the molded article Wp can be conveyed by acting together with the 1st loader 210 and two storage pickups 122 and 124, and when carrying out maintenance, the 1st loader ( The workpiece W and the molded product Wp can be moved directly to a position (device side position) that is easy for a worker to handle by the 210.

Next, 100 A of workpiece | work processing units are arrange | positioned under the workpiece | work meter 114, and the storage rail 108 by which the molded article Wp conveyed by the accommodation pick-up (here, 2nd storage pickup 124) is mounted is mounted. ). In addition, the molded product Wp mounted on the storage rail 108 passes (slides) on the storage rail 108 and is stored in the storage magazine 112. In addition, since the storage rail 108 is basically the same as the supply rail 104 in the structure, and the moving direction of the workpiece | work W and the molded product Wp only differs, in the supply rail 104, Omitted parts may be omitted (the same applies to other configurations that handle the molded product Wp).

In this embodiment, although the relay rail 110 which lets the molded object Wp pass between the storage rail 108 and the storage magazine 112 is provided, it can also be set as the structure which abbreviate | omits. In addition, a well-known pusher etc. (not shown) is used for the movement of the molded product Wp from the storage rail 108 to the storage magazine 112.

Here, the storage rail 108 supports the long side of the molded product Wp from below, avoiding the mounting position of the electronic component Wb, and guides the workpiece | work W from the side. Moreover, the storage rail 108 is comprised by two rows (108A, 108B in a figure), and can move to the left-right direction so that two molded articles Wp can be mounted side by side in the short direction. It has a moving mechanism (not shown). Thereby, the two molded articles Wp held in the storage pickup (here, the second storage pickup 124) are simultaneously mounted in a state arranged in the left and right directions, and then the molded articles Wp are sequentially stored in the storage magazine 112. Can be moved towards. For example, the molded article Wp on one row (for example, 108B) is moved toward the storage magazine 112, and then the storage rails 108A, in either of the left and right predetermined directions (for example, the left direction) are moved. 108B can be moved, and the molded article Wp on the other row (for example, 108A) can be moved toward the storage magazine 112.

Next, the workpiece processing unit 100A is disposed below the storage rail 108 and is formed from the lower surface side (mounting surface side of the electronic component Wb) with respect to the molded product Wp on the storage rail 108. A molded article measuring instrument 118 for inspecting Wp) is provided. As an example, this molded article measuring instrument 118 can be disposed at a lower position when the storage rails 108A and 108B become a predetermined position when the molded article Wp is moved toward the storage magazine 112. This molded article measuring device 118 is composed of a laser displacement meter and a camera (monocular camera or compound eye camera), and the thickness of the molded article Wp is compared with reference values based on these output data or by a method such as pattern matching. It is used to measure or detect a problem on the appearance of the molded part of the molded product Wp. In addition, the "downside of a storage rail" includes the downside of the relay rail in the case of providing the relay rail 110. In addition, in the "inspection" here, the measurement of the thickness of the resin-molded part (resin molding part) on the base material Wa, the appearance of the resin mold (exposed wire), the problem of the resin mold (poor charge, etc.) Necessary measurements are included. Based on the result of the "inspection" here, for example, the supply amount of the mold resin R is adjusted based on the difference between the actual thickness of the resin molded part and the target thickness value, thereby forming the molded product Wp. The thickness may be controlled with high precision.

One thickness sensor 118a is fixed to the molded article measuring instrument 118 according to the present embodiment. Thereby, it becomes possible to measure the thickness of the predetermined position (for example, the center position of the resin molding part, or the outer peripheral position) of the molded article Wp passing through the storage rail 108.

As described above, in the present embodiment, in the present embodiment, the supply rail 104, the work measuring instrument 114, the storage rail 108, and the molded product measuring instrument 118 are arranged to overlap each other in the vertical direction. It consists of the structure (including the front-back, left-right direction offset) arranged in a hierarchical shape in order. In addition, the supply magazine elevator 103 and the storage magazine elevator 113 are also arrange | positioned in a position different from an up-down direction, and are provided with the structure arranged in parallel in order from the top. According to these, compared with the conventional apparatus in which each structure is planarly arranged, it becomes possible to significantly reduce the installation area of an apparatus.

Moreover, in embodiment mentioned above, while conveying the workpiece | work W to the mold metal mold | die 202, the 1st loader 210 which carries out the molded article Wp resin-molded from the said mold metal mold | die 202 is used, In the resin mold apparatus 1 which resin-molds the workpiece | work W, it arrange | positions overlapping with the workpiece | work meter 114 which measures the thickness of the workpiece | work W, and the molded article measuring device 118 which examines the molded product Wp. By setting it as such a structure, it is possible to reduce the installation area compared with the conventional apparatus. In this case, after the workpiece | work W is measured of the thickness with the workpiece | work meter 114, it is conveyed to the mold metal mold | die 202 by the 1st loader 210, and the 1st loader 210 from the mold metal mold | die 202 is carried out. The molded article Wp conveyed by this is inspected by the molded article measuring instrument 118.

In addition, in the up-and-down movement by the 2nd storage pick-up 124, for example, the molded article Wp is interposed and flattened in the exchange of the 1st storage pick-up 122 and the 2nd storage pick-up 124, for example. Since the structure which performs the heat radiation process of this can be implement | achieved, it is not necessary to provide a separate heat radiation unit, and the installation area of an apparatus can also be aimed at.

In addition, according to the said structure, two molded articles Wp after processing are mounted on the storage rail 108 from the state which mounted the workpiece | work W of rectangular shape, for example on the supply rail 104. FIG. The process up to one state can be performed in the state which arrange | positioned two workpiece | work W or the molded product Wp in the left-right direction all. For this reason, compared with the conventional apparatus which includes the process which takes a time partly by including the process which performs one by one process on the way, the process time can be shortened drastically.

Moreover, according to the said structure, in the whole process from taking out the workpiece | work W from the supply magazine 102, and processing into the molded article Wp and being accommodated in the storage magazine 112, the workpiece | work W is And when the molded article Wp is moved, the structure which moves to the front-back, left-right, up-down direction, without switching the direction (holding and mounting direction) of the workpiece | work W and the molded article Wp at all can be implement | achieved. Therefore, compared with the conventional apparatus which changes the direction of the workpiece | work W and the molded article Wp in a process, the process time can be shortened and the apparatus structure can also be simplified.

Moreover, as a modification of the said resin mold apparatus 1, while providing one cavity in one lower mold | type, one wafer W (for example, a circular wafer as a base material Wa, a square, a rectangle) May be used as the resin mold apparatus 2 (refer FIG. 28) of the compression molding system which arrange | positions a resin mold and arrange | positions one resin and obtains one molded article. In this case, as the workpiece | work W, it can be set as the structure which processes the wide workpiece (large workpiece) which is wider than the workpiece | work W as a rectangular workpiece mentioned above. As this wide workpiece | work, you may use the workpiece | work W of the square, rectangle, and polygon which is wider than a rectangular workpiece, and the workpiece | work W as a circular wafer and a carrier plate with a larger diameter (width) than a rectangular workpiece. In that case, the same structure as the following workpiece processing unit 500A can be considered instead of the workpiece processing unit 100A.

As an example, the work processing unit 500A may take out from the supply magazine of the work W or store the molded product Wp in the storage magazine instead of the above-described supply rail 104 or the storage rail 108. You may provide the conveyance robot provided with the robot hand 504 which performs the operation. Here, the robot hand 504 can be used a mechanism provided with a suction mechanism in a fork-shaped member corresponding to the shape of the workpiece W at the tip of a known articulated robot. In addition, it is good also as a structure provided with a some robot hand (illustration omitted). Moreover, you may provide the conveyance robot which conveys the workpiece | work W and the molded article Wp in the supply rail 104 and the storage rail 108 as well as the supply pickup 120 and the storage pickup mentioned above.

In addition, in 210 A of 1st holding | maintenance parts, the 2nd row of workpiece holding parts 210a and 210b and the wide workpiece holding part 506 which hold | maintain one workpiece | work W (wide workpiece | work) are replaced and installed. Possible configurations are possible. Moreover, in the 2nd holding part 210B, the width | variety which hold | maintains the molded article holding parts 210c and 210d of the above-mentioned two rows, and one molded article Wp (molded product Wp corresponding to the wide workpiece W). The molded article holding part 508 can be substituted and installed.

Thus, about the structure which can switch a rectangular workpiece and a wide workpiece, for example, the 1st holding part 210A can arrange and hold the workpiece | work W which is two rectangular workpieces in parallel in the longitudinal direction, It is conceivable to configure a configuration having two work holding portions 210a and 210b and a configuration having one work holding portion 506 holding the workpiece W which is one wide work. In addition, the molded article holding portions 210c and 210d of the two rows are formed so that the second retaining portions 210B can be held by arranging the two molded articles Wp processed by the workpieces W which are rectangular workpieces in parallel in the longitudinal direction thereof. It is conceivable to configure a structure having a structure having a structure and a structure having a work holding portion 508 for holding one molded product Wp processed by this work W. By such a configuration, any of the workpieces W of the rectangular workpiece and the wide workpiece can be replaced by the simple configuration of the first holding portion 210A and the second holding portion 210B. It can be set as the structure which can be conveyed.

(Press unit)

Next, the structure of the press unit 100B with which the resin mold apparatus 1 is equipped is demonstrated in detail.

The press unit 100B firstly includes a mold die 202 having a pair of molds to be opened and closed (for example, a plurality of mold blocks made of alloy tool steel, a mold plate, a mold filler, and the like, and other members joined together). ). In this embodiment, one mold on the upper side is made into the upper mold | type 204, and the other mold on the lower side is made into the lower mold | type 206 among a pair of metal mold | die. In this mold die 202, mold closing and mold opening are performed by the upper mold 204 and the lower mold 206 approaching and transferring each other. That is, the vertical direction becomes the mold opening and closing direction.

In addition, the mold die 202 is opened and closed by a known mold opening and closing mechanism (not shown). For example, the type opening / closing mechanism moves (elevates) a pair of platens, a plurality of coupling mechanisms (tie bars and pillars) on which a pair of platens are installed, and a platen. Drive source (for example, an electric motor), a drive transmission mechanism (for example, a toggle link), etc. are comprised (not shown about all the drive mechanisms).

Here, the mold metal mold | die 202 is arrange | positioned between a pair of platens of the said mold opening and closing mechanism. In this embodiment, the upper mold | type 204 which becomes a fixed type is stuck to a fixed platen (platen fixed to a coupling mechanism), and the lower mold | type 206 which becomes a movable type raises and lowers along a movable platen (connection mechanism) Platen). However, it is not limited to this structure, The upper mold | type 204 may be a movable type | mold, the lower mold | type 206 may be a fixed type | mold, or both the upper mold | type 204 and the lower mold | type 206 may be movable type | molds. Alternatively, two movable platens may be provided and two sets of the upper mold 204 and the lower mold 206 may be provided.

Next, the lower mold 206 of the mold die 202 will be described in detail. The lower die 206 includes a lower plate 224, a cavity sphere 226, a clamper 228, and the like.

Here, the cavity sphere 226 is fixed and joined with respect to the upper surface (surface of the upper mold | type 204 side) of the lower plate 224. The clamper 228 is configured in an annular shape so as to surround the cavity sphere 226 and is spaced apart (floating) and joined to the upper surface of the lower plate 224 adjacent to the cavity sphere 226.

In the present embodiment, the lower mold 206 has a cavity 208 that is concave from the mold surface (parting surface) 206a, but the cavity sphere 226 constitutes the inner side (bottom) of the cavity 208. The clamper 228 constitutes the side of the cavity 208. In other words, the cavity recessed portion 209 which is concave in a predetermined shape is formed by the upper surface of the cavity sphere 226 and the inner circumferential wall surface of the clamper 228.

In addition, in this embodiment, as shown to FIG. 21 etc., the cavity 208 is provided with the structure provided two parallel to the left-right direction (symbol 208A, 208B in the figure), and the cavity sphere corresponding to each, 226A and 226B are provided. Thereby, two films F (part on which the mold resin R is mounted) can be accommodated in the cavity 208A, 208B, respectively. Therefore, since the structure which resin-molds two workpieces W simultaneously can be implement | achieved, shortening of a process time becomes possible. In the lower die 206, the clamper 228 is cut out for each of the cavities 208A and 208B so as to be lifted and lifted separately, and the plate thickness difference between the two workpieces W in the upper die 204 is adjusted. It is good also as a structure provided with the plate | board thickness adjustment mechanism absorbed by an elastic body. According to this, even if there exists the difference of the thickness of the two workpiece | work W to compression-molding simultaneously, it can shape | mold, without making inclination, reducing the influence, such as supply variation of resin amount. In addition, in this embodiment, the member of a metal mold | die is arrange | positioned so that the cavity 208A, 208B may be arranged side by side in the left-right direction. For this reason, the cavity spheres 226A and 226B and the clampers 228 constituting the cavities 208A and 208B are formed as separate chase structures from the left and the right, and the bases are accommodated in the front and rear directions of the apparatus with respect to the base housing them. I can do it.

Here, a suction groove (not shown) is provided in the mold surface of the upper die 204 opposite to the clamper 228, which communicates with a suction device (not shown). Moreover, by providing the seal structure surrounding these, it becomes possible to perform degassing in the cavity 208 in the state which closed mold by driving and depressurizing a suction apparatus.

In addition, the mold metal mold | die 202 is equipped with the film suction mechanism which sucks the film F from the metal mold surface 206a side of the lower mold | type 206. As shown in FIG. As an example, this film suction mechanism communicates with a suction device (not shown) via the suction paths 230a and 230b disposed through the clamper 228. Specifically, one end of the suction paths 230a and 230b passes through the mold surface 206a of the lower mold 206, and the other end is connected to a suction device that is disposed outside the lower mold 206. Thereby, it is possible to drive the suction device, to suck the film F out of the suction paths 230a and 230b, and to adsorb and hold the film F on the mold surface 206a including the inner surface of the cavity 208. Become. More specifically, it is possible to suck the film F from the suction path 230b, to adsorb and hold the film F on the mold surface 206a on the outside of the cavity 208, and the suction path 230a. By sucking the film F from the inside, the film F can be adsorbed and held on the mold surface 206a on the inner surface of the cavity 208 (the mold surface of the cavity recess 209).

Thus, by providing the film F which covers the inner surface of the cavity 208 and the mold surface 206a (part of) of the lower mold | type 206, the part of the mold resin R in the lower surface of the molded product Wp is provided. Since it can peel easily, the molded article Wp can be taken out from the mold metal mold | die 202 easily.

The mold die 202 includes a pressing member (for example, a spring such as a coil spring) 232 between the lower plate 224 and the clamper 228. The clamper 228 is movable to the lower plate 224 via this pressing member 232. As a result, the cavity sphere 226 is surrounded by the clamper 228, and the cavity sphere 226 and the clamper 228 can be relatively reciprocated in the mold opening and closing direction. In this way, in the lower mold 206, the cavity sphere 226 is held and held with respect to the lower plate 224, while being spaced apart (floating) via the pressing member 232 so that the clamper 228 is movable. Is not seen. At this time, the clearance between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the cavity sphere 226 is secured to a predetermined dimension. Therefore, the clamper 228 can be smoothly operated.

By the way, the said gap is contained in the suction path 230a of the film suction mechanism mentioned above, and sucks the film F in the boundary (corner part of the cavity 208) of the cavity sphere 226 and the clamper 228. do. For this reason, the film suction mechanism is provided with the sealing member 234 (for example, O-ring). The seal member 234 is provided between the cavity sphere 226 and the clamper 228 (lower portion) so that the above gap is no air leakage as the suction path 230a and performs sealing.

The lower mold 206 is provided with a heater (for example, a heating wire heater), an auxiliary heater (for example, a heating wire heater), a temperature sensor, a control unit, a power supply, and the like (both not shown), and the heating and control thereof. Is performed. As an example, the heater of the lower mold 206 is built in the lower plate 224 or a mold base (not shown) that accommodates them, and mainly heats the entire lower mold 206 and the work W. By the heater of this lower mold | type 206, the lower mold | type 206 is adjusted to predetermined temperature (for example, 120 degreeC-180 degreeC), and is heated.

Next, the upper mold | type 204 of the mold metal mold | die 202 is demonstrated concretely. The upper mold | type 204 is provided with the upper plate 222, the cavity plate 236, etc., and they are joined together and are comprised. Here, the cavity plate 236 is fixed and joined to the lower surface (surface on the lower mold 206 side) of the upper plate 222.

Moreover, the upper mold | type 204 is equipped with the heater (for example, a heating wire heater), a temperature sensor, a control part, a power supply, etc. (all are not shown), and heating and its control are performed. As an example, the heater of the upper mold | type 204 is built in the upper plate 222, and mainly heats the whole upper mold | type 204 and mold resin (R). By the heater of this upper mold | type 204, the upper mold | type 204 is adjusted to a predetermined temperature (for example, 120 degreeC-180 degreeC), and is heated.

Moreover, the upper mold | type 204 is equipped with the workpiece holding mechanism 240 which hold | maintains the workpiece | work W at the predetermined position in the lower surface of the cavity plate 236. As shown in FIG. This work holding mechanism 240 communicates with a suction device (not shown) via the suction path 240a arrange | positioned at the cavity plate 236 as an example. Specifically, one end of the suction path 240a passes through the mold surface 204a of the upper mold 204, and the other end is connected to a suction device disposed outside the upper mold 204. Thereby, it is possible to drive the suction device and suck the workpiece | work W from the suction path 240a, and to adsorb | suck and hold | maintain the workpiece | work W on the metal mold surface 204a (here, the lower surface of the cavity plate 236). Become. Moreover, it is good also as a structure which has a holding claw which clamps the outer periphery of the workpiece | work W in parallel with the structure provided with the suction path 240a.

In addition, in this embodiment, as shown to FIG. 21 etc., the structure holding two workpiece holding mechanisms 240 in the left-right direction is provided (240A, 240B in drawing). Thereby, it becomes possible to hold | maintain the two workpiece | work W by workpiece holding mechanism 240A, 240B, respectively. Therefore, since the structure which resin-molds two workpieces W simultaneously can be implement | achieved, shortening of a process time becomes possible. In addition, as the above-described plate pressure adjusting mechanism, the cavity plate 236 holding the workpiece W is divided for each of the cavities 208A and 208B so as to be lifted separately, thereby the thickness of the two workpieces W which are simultaneously compression molded. Even if there is a difference, the molding may be performed without causing any inclination.

As described above, as a modification of the resin mold apparatus 1, a compression molding method in which one cavity is provided in one lower mold, one workpiece W is disposed, a resin mold is formed, and one molded article is obtained. You may comprise like the resin mold apparatus 2 (refer FIG. 28). In that case, instead of the press unit 100B, the structure similar to the following press unit 500B can be considered.

As an example, the press unit 500B, in the lower mold 206, accommodates the mold resin via one film instead of the two rows of cavities 208A and 208B that accommodate the two films and mold resin described above. What is necessary is just to have the structure provided with the cavity 208. In the upper mold 204, the work holding mechanisms 240A and 240B holding the two workpieces described above may be used as the work holding mechanism 240 holding the one work W together.

(Dispensing Unit)

Then, the structure of the dispense unit 100C with which the resin mold apparatus 1 is equipped is mainly demonstrated in detail about supply operation of the film F and the mold resin R. As shown in FIG.

As described above, the dispensing unit 100C is a unit that supplies the film F, the mold resin R, and the like. In this embodiment, when conveying the film F and the mold resin R to the mold metal mold | die 202, the conveyance port 400 is used as a jig for holding and conveying these. That is, by using this conveyance port 400 as a jig | tool, it will hold | maintain mold resin R, and conveyance with film F is performed. In addition, the conveyance port 400 can hold | maintain and arrange the film F in parallel with the longitudinal direction (it mentions later).

Dispensing unit 100C is equipped with the preparation table 302 which mounts the conveyance port 400 of the state which does not hold | maintain film F and mold resin R first, and performs appropriate cleaning. For example, the conveyance port 400 carried out from the mold die 202 may adhere to the mold resin R, which may cause a malfunction. Therefore, malfunction can be prevented by cleaning the surface with a brush or a suction mechanism (both not shown), including the through hole, which will be described later.

Next, a transport port pickup 304 is provided which holds the transport port 400 and transports it between a plurality of predetermined positions (tables). Moreover, as a mechanism for holding the conveyance port 400, it has a well-known holding mechanism (for example, the structure which clamps with a holding claw, the structure which has a suction hole which communicates with a suction device, etc.) (not shown) ). For example, the structure which provides an uneven | corrugated part in the outer peripheral part of the conveyance opening 400, hangs and conveys an uneven | corrugated part in the retaining claw which was provided upright from the lower surface of the conveyance opening pickup 304 can be employ | adopted.

Here, the conveyance port pick-up 304 is comprised so that it can move to back, front, left, and right directions. Thereby, it becomes possible to hold | maintain the conveyance port 400 mounted on the preparation table 302, and to convey to the film table 308 and resin dropping table 310 mentioned later.

Next, the dispensing unit 100C is a film roll 306 in which the long film F is wound in a roll shape and a film roll 306 at a position to be rearward of the preparation table 302. ) Film table (first table) 308 which is disposed above (obliquely upward in the present embodiment), and the film F extracted from the film roll 306 is cut and held in a rectangular shape of a predetermined length. Equipped with.

As an example, the film table 308 and the film roll 306 are equipped with the structure (including the offset of the front-back left and right directions) arranged side by side in the order from the top in the up-down direction. Thereby, compared with the conventional apparatus in which each structure is planarly arranged, it becomes possible to reduce the installation area of an apparatus.

In this embodiment, as the film roll 306, two film rolls 306A and 306B are arranged side by side in the left-right direction. Thereby, it becomes possible to supply two isomorphic films F on the film table 308 simultaneously. Here, the film rolls 306A and 306B may be supported by the central axis 307a and installed, or may be supported and installed from below by the rollers 307b provided in plural at intervals smaller than the outer shapes of the film rolls 306A and 306B. do. In this case, by setting the film rolls 306A and 306B to be supported by the roller 307b from below, the two film rolls 306A and 306B listed are simply replaced by removing the central shaft 307a from unnecessary. can do. In addition, it is good also as a structure which sends out to the film table 308 of the film roll 306 with the structure which draws out through the edge part, and the structure which sends out with the drive type roller provided in front of the film table 308.

On the other hand, the film table 308 has a well-known cutting mechanism (for example, a fixed blade cutter, a hot melt cutter, etc.) as a mechanism which cuts the elongate film F (not shown). Moreover, as a mechanism which hold | maintains two films F, it has a well-known holding | maintenance mechanism (for example, the structure which has a suction hole which communicates with a suction apparatus, etc. to adsorb | suck). In this film table 308, the film F cut | disconnected here and the conveyance port 400 are combined.

Here, as shown in FIG. 9, the conveyance port 400 which concerns on this embodiment has the shape of the outline flat plate shape formed in the plane which an upper surface and a lower surface become parallel, and the carrying film which holds film F It has two rows of holding parts (400A, 400B in drawing). In addition, each carrying film holding | maintenance part 400A, 400B is a through hole so that each film F may be exposed and seen from an upper surface in the position (position holding each film F) corresponding to each film F. FIG. The resin injection holes 400a and 400b formed in the are arranged. The resin inlet holes 400a and 400b are formed in correspondence with the shapes of the cavity recesses 209 described above, so that the mold resin R is dropped into the resin inlet holes 400a and 400b to be held in an appropriate state. The mold resin R can be prepared.

Moreover, the some 1st suction holes 400c which generate | occur | produce a suction force and hold | maintain a film are arrange | positioned around resin injection hole 400a, 400b. In addition, the 1st suction hole 400c is the 2nd suction hole 212b provided in the 3rd holding part 212A mentioned later, and the 3rd suction hole (not shown) provided in the conveyance port pickup 304 mentioned later. ), The suction force generated by the suction device (not shown) is transmitted. According to the said structure, holding | maintenance is carried out in the state which attracted two films F in the left-right direction at the lower surface of the conveyance port 400 conveyed on the film table 308 by the conveyance port pickup 304. It becomes possible. Moreover, it is good also as a structure which clamps the outer periphery of the film (F) by holding chloro.

Next, it is arrange | positioned in the side (as an example, right side) with respect to the film table 308, and is comprised so that it can move to front and rear, left and right directions, and conveyed by the conveyance port pick-up 304 (2 below) The resin dropping table (second table) 310 on which the two films F are held is mounted. In addition, the resin dropping table 310 is a mechanism for holding the mounted conveyance port 400, and has a well-known holding mechanism (for example, a structure holding a holding claw and holding a suction hole communicating with a suction device to suck it). Configuration, etc.) (not shown).

In addition, in FIG. 1, the dispenser 312 is located in a position higher than the resin dropping table 310 in the side (for example, right side) by the arrangement which sandwiches the said resin dropping table 310 with respect to the film table 308. In FIG. Equipped with. This dispenser 312 puts mold resin R into the resin injection holes 400a and 400b in the conveyance port 400 mounted in the resin dropping table 310, and exposes the film F image ( The mold resin R is mounted (dropped) inside the resin injection holes 400a and 400b. The dispenser 312 is, for example, a hopper 312a for storing the mold resin R, a weight scale 312b for measuring the weight of the resin to be dropped, and the measured mold resin R is a vibrating feeder. It is comprised with the trough 312c sent out (not shown), and the nozzle 312d which regulates the dropping position of the mold resin R sent out from the trough 312c and is dropped.

Here, the resin dropping table 310 according to the present embodiment is configured to be movable in the front, rear, and left and right directions (shown at three positions in FIG. 1). By the movement in the left-right direction, the conveyance port 400 mounted on the resin dropping table 310 can be moved forward and backward under the dispenser 312 in a state where the film F is held. Thereby, the conveyance port 400 can be moved between the position which is intermediate | middle of the dispenser 312 and the film table 308, and the position just under the nozzle 312d of the dispenser 312. In addition, by the movement of the front-rear direction, the conveyance port 400 of the state which hold | maintained the conveyance port 400 in the state in which the film F which mounted the mold resin R was hold | maintained by the predetermined position (3rd holding part 212A mentioned later) ) Can be conveyed to the position where the holding is performed. In addition, as a modification, instead of the structure in which the resin drop table 310 moves left and right, it is also conceivable to use the dispenser 312 to replace the movement of the movement range. In addition, instead of the structure which the resin drop table 310 moves back and forth, it is also conceivable to set it as the structure which replaces the movement of the said movement range by 3rd holding part 212A (after-mentioned) (all are abbreviate | omitted).

Moreover, the resin injection hole 400a is sent by sending the mold resin R to the resin injection holes 400a and 400b from the two nozzles 312d while moving the resin dropping table 310 in a predetermined path in the front and rear and left and right directions. , On the film F exposed in 400b), it becomes possible to apply the mold resin R to the entire surface without biasing to a predetermined thickness. Thereby, the generation of the defective article resulting from the bias of the mold resin R on the film F becomes possible.

Here, the dispenser 312 which concerns on this embodiment has two nozzles 312d which inject | mold a mold resin into two rows of resin injecting holes 400a and 400b in the conveyance port 400, respectively. As an example, one nozzle 312d is disposed at a position corresponding to the right resin inlet 400a and the other nozzle 312d is disposed at a position corresponding to the left resin inlet 400b. . In other words, the distance between the centers of each of the two nozzles 312d and the distance between the centers of the resin injection holes 400a and 400b are configured to be the same. This makes it possible to inject the mold resin R while simultaneously passing the same corresponding positions of the respective resin inlet holes 400a and 400b, so that the two films ( It is possible to spread the mold resin R on the entire surface on F). Therefore, the process time can be greatly shortened. In addition, as a modification, it is good also as a structure which has one nozzle and spreads mold resin R on the whole surface in turn on two films F by a predetermined | prescribed 1 path | path (not shown).

Next, the resin heater 314 which heats the said mold resin R is provided by heating from the upper surface side of the conveyance port 400 of the state in which the film F in which the mold resin R was mounted was hold | maintained. . Moreover, as a structure which heats the conveyance port 400 (mold resin R), the well-known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is arrange | positioned on the lower surface of the resin heater 314 ( Not shown). Thereby, the mold resin R hold | maintained in the state mounted on the two films F by the conveyance port 400 becomes possible to heat simultaneously.

Here, the resin heater 314 which concerns on this embodiment is mentioned later from the position which becomes just below the nozzle 312d of the dispenser 312 on the movement path of the resin dropping table 310 more specifically. It is arrange | positioned in the middle of the path | route between moving to the position where holding | maintenance of the conveyance port 400 is performed by 2nd holding part 212A. Thereby, the process of heating the said mold resin R immediately after the mold resin R was thrown in on the film F hold | maintained to the conveyance port 400 by the nozzle 312d of the dispenser 312 is performed. It becomes possible. Therefore, especially when resin, such as granular form or powder form, is used as the mold resin R, the resin such as powder form or the like placed on the surface by heating immediately after mounting on the film F can be melted and integrated. have. Thereby, it becomes possible to prevent the generation of dust (fine powder of a resin, etc.), and to prevent the occurrence of operation failure or product failure caused by the diffusion of dust in the apparatus.

Moreover, the supply resin measuring instrument 315 which measures the external appearance of the mold resin R which dropped and supplied on the film F in resin injection hole 400a, 400b in the position before and behind the resin heater 314. You may be provided. The supply resin inspector 315 includes a camera (monocular camera or compound eye camera) above the movement path of the resin dropping table 310, thereby dropping the molded resin R using these output values and captured images. It can be used to record the thickness and shape of the. Thereby, for example, by linking the molding thickness of the molded article Wp with the actual information and preserving data, the operator can compare them and select the dropping condition of the mold resin R, for example. Thereby, traceability regarding supply of mold resin R can be ensured and molding quality can be maintained.

Next, the 2nd loader 212 which works with each mechanism of the dispense unit 100C is equipped with the 3rd holding part 212A. This 3rd holding part 212A receives the conveyance port 400 mounted on the resin dropping table 310 in the lower surface, conveys it to the predetermined holding position of the lower mold | type 206, and is a film ( F) and the conveyance port 400 in which the holding | maintenance of the mold resin R were released are conveyed on the preparation table 302 mentioned above. In addition, the 3rd holding part 212A is a conveyance port holding part 212a which hold | maintains the said conveyance port 400, and communicates with a well-known holding | maintenance mechanism (for example, a structure which clamps with a holding claw, and a suction device). Has a suction hole to suck and the like). Moreover, the 2nd suction hole 212b arrange | positioned in the position which communicates with the 1st suction hole 400c of the conveyance port 400 hold | maintained at a predetermined position, and generates (transfers) the suction force by a suction apparatus (not shown). Have Thereby, the predetermined holding position of the lower mold | type 206, keeping the state which adsorbed two films F (state where mold resin R was mounted each) in the left-right direction on the lower surface of the conveyance port 400, and was made to adsorb | suck. It becomes possible to convey to (the position where the cavity 208 is arrange | positioned). Moreover, you may make it the 3rd holding part 212A which has the holding claw which clamps and hold | maintains the outer periphery of two films F in the lower surface of the conveyance port 400. FIG.

Here, the 2nd loader 212 provided with the 3rd holding part 212A which concerns on this embodiment is comprised so that a movement to back, front, left, and right is possible. By movement in the left-right direction, the operation of conveying the conveyance port 400 (the state in which two films F on which the mold resin R is mounted) is held from the dispense unit 100C to the press unit 100B is performed. It becomes possible. In addition, by the movement of the front-back direction, the conveyance port 400 (the state which hold | maintained the two films F in which the mold resin R was mounted respectively) was carried out from the exterior of the mold metal mold 202 (that is, a mold | die) The conveyance between the upper mold | type 204 and the lower mold | type 206 of the opened state is attained.

In addition, 2 by which the conveyance port 400 (mold resin R) was mounted on the resin dropping table 310 by mounting in the up-down direction (it may combine back and forth, or the movement in the left-right direction) may be carried out. Operation | movement which hold | maintains the state which hold | maintained two films F is attained. In this case, while holding the conveyance port 400 at the predetermined holding position (position where the cavity 208 is disposed) of the lower mold 206, the holding of the two films F on which the mold resin R is mounted is released. It is also possible to mount each of the two cavities 208A and 208B (including a part of the mold surface 206a) (one to one). Moreover, the operation | movement which mounts the conveyance port 400 of the state in which the holding | maintenance of the film F and the mold resin R was released on the above-mentioned preparation table 302 is also possible. Moreover, as a modification, it is also conceivable to set it as a structure which replaces a part of the movement range of 3rd holding part 212A by the movement of another mechanism (resin drop table 310, lower mold 206, etc.) ( Not shown).

Next, the second loader 212 is a film (used film) remaining in the lower mold 206 after the resin-molded molded product Wp is taken out from the mold mold 202 (in this case, the upper mold 204). ) Fd is provided and the 4th holding part 212B which conveys to a predetermined position (film disposer 316 mentioned later) is provided. In addition, the 4th holding | maintenance part 212B is a carrying out film holding part which hold | maintains the used film Fd, and uses a well-known holding | maintenance mechanism (for example, a structure which has a suction hole which communicates with a suction device, etc.). (212c and 212d in the figure).

In addition, in the 4th holding part 212B which concerns on this embodiment, the said carrying film holding parts 212c and 212d are two cavity 208A, 208B of the mold metal mold | die 202 (lower mold | type 206). In a position corresponding to, the two rows are arranged side by side in the horizontal direction. That is, the film F can be hold | maintained by making the longitudinal direction parallel. Thereby, two used films Fd which are arranged side by side in the left and right direction by the mold die 202 (lower mold 206) after the resin mold are arranged side by side in the left and right direction, and conveyed It becomes possible.

Here, in this embodiment, the 4th holding | maintenance part 212B and said 3rd holding | maintenance part 212A are comprised integrally as the 2nd loader 212. As shown in FIG. As an example, the 2nd loader 212 is arrange | positioned the 3rd holding | maintenance part 212A which has the conveyance port holding part 212a in the front side, and carries out carrying film holding | maintenance part 212c, 212d of 2 rows of right and left on the back side. The fourth holding part 212B has a branch. Therefore, the 3rd holding | maintenance part 212A and the 4th holding | maintenance part 212B are comprised as the 2nd loader 212 in the structure which can move back and forth, right and left, and an up-down direction. Thereby, not only the structure of the apparatus can be simplified and downsized, but also the film F on which the mold resin R is mounted and the used film Fd can be realized simultaneously. The time can also be shortened.

Moreover, as a modification, it is also possible to comprise the loader provided with the 4th holding part 212B separately from the loader provided with the said 3rd holding part 212A (not shown). In that case, it is good to set it as the structure which can move similarly to said 3rd holding part 212A.

Next, the dispensing unit 100C is equipped with the film dispenser 316 which accommodates the used film Fd conveyed by the 4th holding part 212B. As an example, the film disposer 316 is formed in the box shape which the upper part (upper surface part) opens. Thereby, when the 4th holding part 212B which conveys the used film Fd reaches the position immediately above the film disposer 316, the conveyance operation | movement of the 4th holding part 212B is stopped. In addition, by releasing the holding of the used film Fd, the used film Fd can be dropped and stored in the film disposer 316.

As described above, according to the configuration according to the present embodiment, two rectangular workpieces W are supplied and two molded articles Wp can be efficiently taken out after processing (resin mold). Device is realized. In particular, when two cavity 208A, 208B is provided in one lower mold, and two workpiece | work W are arrange | positioned and resin-molded collectively, the mold resin R was mounted in two films F, respectively. It becomes possible to convey to the cavity 208A, 208B of the lower mold | type 206, maintaining a state. Therefore, compared with the conventional apparatus, it becomes possible to significantly improve productivity, while suppressing the complexity of a process and apparatus structure. Moreover, compared with the structure which provides two cavity 208A, 208B in one lower mold | type 206, arrange | positions two workpiece | work W, and covers all with one (one sheet) film F, It is also possible to reduce the amount of film used.

In addition, the film table 308 used for the supply of the film F and the resin dropping table 310 used for the supply of the mold resin R are provided as the respective configurations, and the processing is performed in parallel. Since it becomes possible, it becomes possible to shorten a process time compared with the conventional apparatus.

As described above, as a modification of the resin mold apparatus 1, a compression molding method in which one cavity is provided in one lower mold, one workpiece W is disposed, a resin mold is formed, and one molded article is obtained. You may comprise like the resin mold apparatus 2 (refer FIG. 28). In this case, as film F, it can be set as the structure using the wide film which is wider than the film F as a rectangular film mentioned above. As this wide film, it is simple to use the film F of the square or rectangular sheet | leaf type which is wider than a rectangular film. However, as a wide film, when the width | variety is wider than a rectangular film, you may use the film F of the sheet | leaf type cut out circularly. In that case, the same structure as the following dispensing unit 500C can be considered instead of the dispensing unit 100C.

As an example, the dispensing unit 500C includes two rows of carrying film holding portions 400A and 400B of the transfer port 400 described above, and a large carrying film holding portion holding one film F (wide film) ( What is necessary is just to replace 516 and set it as the structure which can be installed. In addition, even if the used film Fd which is two rectangular films or the used film Fd which is one wide film can adsorb | suck and hold the above-mentioned 2nd export film holding | maintenance part 212c, 212d, It is good to make a configuration.

Thus, about the structure which can switch and use a rectangular film and a wide film, for example, the 3rd holding part 212A carries the conveyance port which hold | maintains two types of conveyance ports 400 for a rectangle and a width in common, for example. A configuration having the holding portion 212a can be considered. As the 1st conveyance port 400 hold | maintained by the conveyance port holding | maintenance part 212a, two films F of rectangular films are carried in two rows of carrying film holding parts 400A so that the longitudinal direction may be arranged in parallel, and it can hold | maintain. , It is one rectangular film conveyance port 400 which has 400B). As the 2nd conveyance port 400 hold | maintained by the conveyance port holding part 212a, the conveyance port 400 which has one carrying film holding part 516 holding the film F which is one wide film in common It can be considered to set it as the structure which has the conveyance port holding part 212a to hold | maintain.

By setting it as such a structure, different conveyance port 400 is common conveyance port holding part 212a according to which workpiece | work W of the workpiece | work W processed into the molded product Wp is a rectangular workpiece | work or the wide workpiece | work. Since the film F can be carried in together with the mold resin R, it can be set as the structure which can supply the film F by simple switching.

Moreover, about the structure which can be used by switching a rectangular film and a wide film, 4th holding part 212B arranges the used film Fd which is two rectangular films in parallel in the longitudinal direction, and arranges them in the left-right direction, A plurality of adsorption portions for adsorbing and retaining the used film Fd are disposed in a region overlapping in the rectangular region for holding and the wide region for holding the used film Fd which is one wide film. It can be set as the structure which has film holding parts 212c and 212d. In this case, since the position which should adsorb | suck, for example, is overlapped, even if it is the used film Fd which is a rectangular film for rectangular workpieces using the same adsorption | suction part, the used film Fd which is one wide film Even if it adsorbs, it can hold | maintain and hold | maintain.

According to this, even if it is a case where the used film Fd which is a rectangular film is hold | maintained, even if it is a case where the used film Fd which is a wide film is adsorptively held, it is in the position which can hold the used film Fd. By arrange | positioning an adsorption part, it becomes possible to carry out also about the used film Fd of either a rectangular film and a wide film, without performing a substitution of a structure, etc.

In addition, the planar layout of the dispensing unit 500C may be an arrangement in which the film table 308 and the resin dropping table 310 are replaced instead of the structures shown in FIGS. 1 and 8. In this case, the preparation table 302 is also moved to the device side position in accordance with this replacement, thereby making it accessible to the setting side of the conveyance port 400 and the brush for cleaning, from the side of the apparatus, thereby facilitating replacement thereof.

(Resin mold movement)

Subsequently, the operation | movement which performs resin mold using the resin mold apparatus 1 which concerns on embodiment of this invention centers on the operation | movement of the press unit 100B and the dispense unit 100C, FIGS. Explain while referring to.

First, the conveyance port 400 (state not holding film F and mold resin R) cleaned on the preparation table 302 is hold | maintained by the conveyance port pickup 304, and is shown in FIG. As it is, it is conveyed on the film table 308. In this case, the conveyance port 400 can convey in the state which hold | maintained the chloro holding of the conveyance port pick-up 304. On the other hand, the two films F drawn out from the two film rolls 306A and 306B are cut into rectangular shapes of predetermined lengths, respectively, and are held on the film table 308.

Next, as shown in FIG. 12, the lower surface of the conveyance port 400 comes into contact with the two films F on the film table 308 by moving (falling) the conveyance port pickup 304 downward.

Next, as shown in FIG. 13, a suction force is generated in the 1st suction hole 400c of the conveyance port 400 via the conveyance port pickup 304, and two films ( In the state where F) is adsorbed and held, the conveyance port pickup 304 is moved (rising) upward.

Next, as shown in FIG. 14, by carrying the conveyance port pickup 304 to the side (right side), the conveyance port 400 (two films F) hold | maintained by the conveyance port pickup 304 is hold | maintained, Present) is conveyed onto the resin dropping table 310.

Next, as shown in FIG. 15, two films F of the lower surface of the conveyance port 400 abut on the resin drop table 310 by moving (falling) the conveyance port pickup 304 downward. do. In that state, the holding | maintenance of the conveyance opening 400 is released (stopped) by the holding mechanism of the conveyance opening pick-up 304, and resin dropping of the conveyance opening 400 (a state holding two films F) is carried out. It is mounted on the table 310. Thereby, the conveyance port pick-up 304 hold | maintains the conveyance port 400 of the state in which the film F was hold | maintained on the lower surface side, and conveys a series of operation | movement from the film table 308 to the resin dropping table 310. FIG. This is done.

Next, by moving the resin dropping table 310 to the side (right side), as shown in FIG. 16, the conveyance port 400 (two films F) mounted on the resin dropping table 310 is hold | maintained, Present) is conveyed to the position immediately below the nozzle 312d of the dispenser 312.

Next, as shown in FIG. 17, the mold resin R is simultaneously thrown into the inside of the two rows of resin injection holes 400a and 400b in the conveyance port 400 using two nozzles 312d. . At this time, by measuring the thickness of the workpiece W, the amount of the mold resin R dropped and supplied into each of the resin injection holes 400a and 400b can be adjusted, so that the mold supplied to the cavity 208 can be adjusted. The quantity of resin (R) can be optimized. For example, the mold resin R dropped from the two nozzles 312d is measured separately on the dispenser 312 side, and the mold resin of a predetermined amount corresponding to one of the nozzles 312d ( When R) is dropped, the dropping of the mold resin R is stopped, and the dropping operation is continued until the drop of the predetermined amount of the mold resin is carried out.

In addition, when dropping mold resin R from two nozzles 312d, the resin dropping table 310 equipped with the conveyance port 400 is moved along an arbitrary pattern. Thereby, the mold resin R is supplied to the corresponding pattern (pattern which rotated 180 degrees of arbitrary patterns mentioned above) in each resin injection hole 400a, 400b. Here, by moving the resin dropping table 310 along the pattern without a gap, the mold resin R is spread | covered on the whole surface with the predetermined thickness on two films F, respectively. For example, the resin dropping table 310 is formed along a pattern formed by straight lines connecting adjacent ends of straight lines that divide the resin injection holes 400a and 400b vertically or horizontally (n is an integer of 2 or more). By moving, mold resin R can be supplied uniformly in the whole resin injection hole 400a, 400b. In addition, the "straight line" said here does not necessarily need to equalize these space | intervals, and may be bent on the way.

Next, by moving the resin drop table 310 forward, as shown in FIG. 18, the position where the conveyance port 400 mounted on the resin drop table 310 becomes just below the resin heater 314 is shown. Conveyed while passing through. Thereby, heating of the mold resin R on the film F of the state hold | maintained by the conveyance port 400 is performed. Next, by moving the resin drop table 310 further forward, as shown in FIG. 19, the conveyance port 400 mounted on the resin drop table 310 is a predetermined position (3rd holding part 212A). By the holding port of the conveyance port 400).

Next, from the state shown in FIG. 19, by moving (falling) the 3rd holding part 212A downward, the lower surface of the 3rd holding part 212A is matched with the conveyance port 400 on the resin dropping table 310. Next, as shown in FIG. Is reached. Subsequently, the 3rd holding part 212A hold | maintains the conveyance port 400 holding chloro. Moreover, a suction force is generated in the 1st suction hole 400c of the conveyance port 400 via 3rd holding part 212A, and two films F are adsorb | sucked on the lower surface of the conveyance port 400. As shown in FIG. While maintaining this state, the conveyance port 400 is held by the 3rd holding part 212A, and as shown in FIG. 20, the 3rd holding part 212A and the conveyance port 400 are moved upwards (rising upward). )

Next, by moving the 2nd loader 212, as shown in FIG. 21, the conveyance port 400 hold | maintained by the 3rd holding part 212A moves from the exterior of the mold metal mold 202 to inside (that is, Between the upper mold | type 204 and the lower mold | type 206 of the state which opened the die | dye. On the other hand, two workpieces W held by the first holding part 210A of the first loader 210 are carried into the upper mold 204 prior to the conveying port 400 being conveyed to the mold die 202. do. At this time, first, the first loader 210 retreats (ingress) toward the inside of the mold die, and a resin mold is first performed in the second retaining portion 210B to receive the molded article Wp from the upper mold 204. (See FIG. 5). Next, the 1st loader 210 advances in the inside of a mold metal mold | die, and the two workpiece | work W hold | maintained by the holding part 210A is exchanged with the upper mold | type 204, and is received. Thereby, as shown in FIG. 21, the two workpiece | work W carried in by the 1st holding part 210A is in the state hold | maintained by the upper mold | type 204, and before the conveyance of the conveyance port 400, the workpiece | work ( W) is sufficiently heated.

In addition, before the conveyance port 400 is conveyed to the mold metal mold | die 202, the used film Fd is hold | maintained in the 4th holding part 212B of the 2nd loader 212, and it is carried out from the lower mold | type 206. Are taken out. At this time, first, the second loader 212 moves backward (inward) toward the inside of the mold die, and first holds the used film Fd held in the lower mold 206 by first molding the resin. Adsorption by 212B is received (refer FIG. 6). Thereby, the conveyance port 400 can be carried in with respect to the mold metal mold | die 202.

Next, as shown in FIG. 22, the 2nd film F of the lower surface of the conveyance port 400 (moulded resin R) was mounted by moving (falling) 3rd holding part 212A below. ) Abuts on the lower mold 206. At this time, each film F (part in which the mold resin R is mounted) is mounted so that it may be accommodated in the cavity 208A, 208B.

Next, the suction force from the 1st suction hole 400c of the conveyance port 400 which was generated via the 3rd holding part 212A is stopped, and the two films F (mold) from the conveyance port 400 are stopped. The holding of the resin (R) is mounted) is released. At this time, the outer edge part of each film F is mounted so that it may be caught by the one end part of the suction path 230b in the mold surface 206a other than the cavity 208A, 208B, respectively. Here, the film F is sucked from the suction path 230b, and the film F is adsorbed and hold | maintained on the metal mold surface 206a of the outer side of the cavity 208. Next, by sucking the film F from the suction path 230a, as shown in FIG. 23, the film | membrane (206a) is formed on the inner surface (die surface of the cavity recessed part 209) of the cavity 208 by the film ( F) is adsorbed and held. Thereby, the mold resin R is supplied to the inside of the cavity 208 (on the cavity recessed portion 209) via the film F.

Next, by moving the 3rd holding part 212A, as shown in FIG. 24, the conveyance port 400 is taken out. At this time, the conveyance port 400 (state not holding the film F and the mold resin R) held by the 3rd holding part 212A is moved from the inside of the mold metal mold 202 to outside (that is, , And is taken out from between the upper mold 204 and the lower mold 206 in the mold-opened state, and is conveyed onto the preparation table 302. Here, the conveyance port 400 is cleaned and can be reused.

Next, as shown in FIG. 25, the mold closing of the mold die 202 is performed, and the two workpieces W are clamped by the upper mold 204 and the lower mold 206.

Next, as shown in FIG. 26, the cavity spheres 226A and 226B of each cavity 208A, 208B are raised relatively, and the thermosetting is carried out by heat-pressing the mold resin R with respect to the two workpiece | work W. Next, as shown in FIG. And a resin mold (compression molding) is performed at the same time. Thereby, two molded articles Wp are formed.

Next, as shown in FIG. 27, the mold opening of the mold die 202 is performed. At this time, the molded article Wp and the used film Fd are separated, and the two molded articles Wp are held in the upper mold 204, and the two used films Fd in the lower mold 206. This state is seen. In this state, as described above, each of the molded article Wp and the used film Fd is taken out and conveyed, thereby completing one set of mold operations.

In addition, it is preferable to perform each process in parallel with the above-mentioned mold operation | movement using the some conveyance opening 400 in order to improve operation efficiency. In this case, it is preferable to set it as the structure which provides the some conveyance opening 400 in the inside of the resin mold apparatus 1, and circulates the conveyance opening 400 in each process mentioned above. That is, the cleaning process of cleaning the conveyance opening 400 by the preparation table 302, the film setting process of combining the film F with the conveyance opening 400, and the conveyance opening 400 combined with the film F A process in which the several conveyance port 400 differs between the resin dropping process of dropping mold resin R to the resin supply process, and the resin supply process of supplying film F and mold resin R to the mold metal mold | die 202. What is necessary is just to control the control part (not shown) which controls the operation | movement of each part in the resin mold apparatus 1 so that the process at the inside may be performed.

Thereby, the waiting time of the conveyance port 400 in each process can be shortened and productivity can be improved. For example, a process in the apparatus can be efficiently performed by performing a process other than the supply process of the mold resin R with respect to the film F which is easy to take time in a normal case, and improve productivity. Can be.

In addition, the operation | movement at the time of performing resin mold using the resin mold apparatus 2 which is a modification is basically the same as the operation | movement at the time of performing resin mold using the said resin mold apparatus 1. In that case, one workpiece | work W, respectively with respect to the two workpiece | work W, two films F (and mounted mold resin R), and two molded articles Wp is used for an apparatus structure etc. What is necessary is to respond to one film F (and mounted mold resin R) and one molded article Wp.

As mentioned above, according to the resin mold apparatus and resin mold method which concern on this invention, the structure which supplies, storage, the measurement of thickness, conveyance, etc. with respect to a workpiece | work and a molded article is arrange | positioned hierarchically in the up-down direction Can be realized. Therefore, it becomes possible to reduce the installation area compared with the conventional apparatus.

Moreover, the structure which processes and conveys in the state which arrange | positioned two workpiece | work and molded articles, and the two cavity in one lower mold | type, and arrange | positions each workpiece | work respectively in each cavity, and can implement | achieve the structure which resin-molded simultaneously. have. In this manner, the workpiece, the molded article, the film, and the mold resin can be simultaneously conveyed two by one, and the two workpieces can be resin-molded at the same time, so that the process time can be significantly shorter than in the conventional apparatus. In addition, the device configuration and the process can be simplified.

In addition, this invention is not limited to the Example demonstrated above and can be variously changed in the range which does not deviate from this invention. In particular, the resin molding apparatus of the compression molding method having a cavity in the lower mold has been described as an example, but an application to a configuration having a cavity in the upper mold is also possible.

In addition, in the whole operation | movement of the resin mold apparatus demonstrated above, by carrying out a resin mold sequentially, performing resin supply control as demonstrated below, it can maintain the molding quality (uniformity of molding thickness) in compression molding. You may plan to equalize supply of resin which becomes important.

(Resin supply control)

EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, the structure and operation | movement for resin supply control in this embodiment are demonstrated in detail. It is a block chart which shows the example of the control structure of the resin mold apparatus which concerns on embodiment of this invention. The control part CTR is comprised with a CPU etc., and works together with each part in the above-mentioned work processing unit 100A and the dispense unit 100C, and performs supply control of the mold resin R. As shown in FIG. In addition, the control unit CTR performs display control of the display unit DIS used for the operator's operation, receives an input from the input unit INP, and retrieves or stores necessary information from the storage unit MEM.

30 is a flowchart showing an example of a resin supply operation of the resin mold apparatus according to the embodiment of the present invention. The operation described here corresponds to one set of operations (a series of operations) required for resin molding with respect to one work W. FIG. In addition, in the actual resin mold apparatus 1, since each operation | movement is performed in parallel with several workpiece | work W, about the necessary part of such a series of operation, it progresses on the partially overlapping time axis.

In the resin supply operation shown in the figure, first, the control unit CTR acquires the molding condition information Dc from the storage unit MEM (step S1). Here, the control part CTR is the molding resin R in the molding thickness (target value) of the resin part in the molded article Wp, and the conveyance port 400 as molding condition information Dc, for example. The pattern for dropping is retrieved from the storage unit MEM. Although the drop pattern of this mold resin R is memorize | stored as the operation control pattern of the resin drop table 310, not only the movement position of the resin drop table 310 comprised by the point of a moving destination, but also between each point. The moving speed of the resin drop table 310 is also included. In addition, the drop pattern of the mold resin R also includes the speed (drop amount per hour) at which the mold resin R is dropped from the nozzle 312d.

On the other hand, the control part CTR acquires the workpiece | work information Dw of the workpiece | work W to be resin-molded from now on (step S2). Here, in the work processing unit 100A, the code reader 115 reads the two-dimensional code applied to the work W taken out from the supply magazine 102 and outputs it to the control unit CTR. ) Obtains the work information Dw (for example, serial number, etc.) for each work W. Next, control part CTR acquires thickness information Dt (step S3). Here, the workpiece | work meter 114 measures the thickness of the workpiece | work W (it mentions in detail), and outputs it to the control part CTR, and the control part CTR is the base material Wa in the individual workpiece | work W here. And the thickness information Dt as the thickness of the electronic component Wb and the like.

Subsequently, the control unit CTR outputs the resin supply setting information Dd1 (step S4). Here, the control part CTR calculates the quantity (weight) of the mold resin R dropped and supplied from the dispenser 312. This is based on the measurement of the thickness of the workpiece W from the volume of the cavity 208 at the time of molding obtained from the molding thickness of the resin portion as a target value and the external shape (shape in plan view) of the cavity 208. It can calculate by the volume which removed the volume of the electronic component Wb acquired by this, and the specific gravity of the mold resin R after shaping | molding (hardening state). Subsequently, the control unit CTR outputs the drop pattern of the previously molded mold resin R to the dispenser 312 as the resin supply setting information Dd1 together with this calculated value.

Subsequently, the dispenser 312 drops the mold resin R inside the resin injection holes 400a and 400b on the film F based on the resin supply setting information Dd1. In the dispenser 312, a predetermined amount of the mold resin R is weighed by a weight scale 312b, sent out in a vibration via the trough 312c, and dropped from the nozzle 312d. In such a dropping operation of the mold resin R, it may be difficult to always uniformly drop the mold resin R from the dispenser 312.

For example, in the hopper 312a which stores the mold resin R in the dispenser 312, the size of the particle | grains contained in the upper side and the lower side is easy to differ inside, and mold resin R according to the timing dropped May change the particle size. In addition, since the delivery speed is different depending on the particle size of the mold resin R when it is sent out on the trough 312c by the vibrating feeder, even if it is operated to drop in the same drop pattern, the mold resin R actually dropped is uniformized. It may become difficult. For this reason, the dispenser 312 may not drop mold resin R as resin supply setting information Dd1 (weight of mold resin R to supply) output from control part CTR. In contrast, the dispenser 312 outputs the actual supply amount information Dd2 as the amount (weight) of the mold resin R actually supplied to the control unit CTR, so that the control unit CTR outputs the actual supply amount information Dd2. Acquisition (step S5).

Subsequently, the control unit CTR acquires the supply resin shape information Dr (step S6). Here, the supply resin tester 315 measures the external appearance of the mold resin R dropped on the film F. As shown in FIG. For example, the camera as the supply resin tester 315 picks up the mold resin R mounted on the film F in the conveyance port 400 mounted on the resin dropping table 310, and picks up an image Is output to the control unit CTR as supply resin shape information Dr.

Subsequently, the control unit CTR acquires the molded article information Dp (step S7). Here, the molded article measuring instrument 118 measures the thickness of the molded article Wp with respect to the molded article Wp resin-molded using the mold resin R prepared as described above. Subsequently, by outputting this measured value to the control part CTR, the control part CTR acquires the molded article information Dp as thickness of the (resin molding part) in each molded article Wp.

Subsequently, the control unit CTR connects the work information Dw as acquisition information about the resin mold of one work W to the plurality of pieces of information obtained as described above and stores them in the storage unit MEM ( Step S8). By storing the information thus obtained in the storage unit MEM, the operator checks the state of the resin mold actually being performed in the apparatus by using the display unit DIS, makes necessary changes from the input unit INP, or makes a factory. Can also be used for quality control and the like. As the resin supply control, only the above steps may be performed to ensure traceability.

In the case of further control in the apparatus, the control unit CTR determines whether or not the resin supply is appropriate using the information obtained as described above (step S9). Here, the control part CTR, for example, forms the molding condition information Dc as a target value of the molding thickness of the resin part and the molded product information Dp as the thickness of the (resin molding part) in the molded product Wp. Compare. According to this, when the difference between the target value and the actual thickness in the molded product Wp exceeds predetermined value (permissible value), it can be judged that resin supply is not appropriate.

Subsequently, the control unit CTR adjusts the resin supply setting information Dd1 of the next work W (step S10). Here, for example, when calculating the weight of the mold resin R dropped and supplied from the dispenser 312, it is determined whether the difference between the target value described above and the thickness in the molded product Wp is a positive value or a negative value. By setting the correction value for correcting the weight of the mold resin R to be supplied positively or negatively, the molding thickness of the subsequent work W can be made closer to the target value.

As another example of the operation of step 9, the control unit CTR is, for example, the resin supply setting information Dd1 as the weight of the mold resin R to be supplied, and the actual as the amount (weight) of the mold resin actually supplied. The supply amount information Dd2 is compared. According to this, when the difference between a setting value and an actual value exceeds a predetermined value (permissible value), it is judged that resin supply is not appropriate. In this case, in step 10, the control unit CTR can increase or decrease the amount of the mold resin R that is weighed and dropped by the weigh scale 312b to be supplied to the work W thereafter.

As another example of the operation of step 9, the control unit CTR supplies the resin based on the supply resin shape information Dr, which is an image of the mold resin R mounted on the film F, for example. It is determined whether this is appropriate. Here, the captured image of the mold resin R is divided into predetermined sections (n rows and m columns), the deviation is calculated by comparing the sections in the captured image, and whether the resin supply is appropriate based on this deviation. Determine whether or not. For example, based on the magnitude | size of the deviation of the discharge amount of resin represented as the density | concentration of the color of every image, and the distribution of the brightness | luminance (multiplication of the color density and the number of pixels) of the image which comprise each division, It is determined whether the resin supply is appropriate.

For example, in the case of a black epoxy resin generally used in a resin mold, when the amount of the mold resin R supplied in a predetermined section increases, the mold resin R becomes dense and the gap between the mold resin R becomes Less In this case, since the film F (for example, milky white) located under the mold resin R becomes difficult to be seen, the image becomes closer to the color (black) of the mold resin R. For this reason, for example, when the mold resin R is thrown away, the film F is seen through a lot, and the color of the image is lightened, and the film F is not seen, so that the color of the image becomes dark. The sections will be mixed. In this way, when the density of the image is significantly different in each section (when the deviation is large), it is determined that the resin supply is inappropriate. In this case, in step 10, an instruction relating to the resin supply in the subsequent work W is adjusted. For example, the control part CTR lowers the moving speed of the resin dropping table 310, or mold resin from the nozzle 312d so that more mold resin R may be dropped in the division into which the image became light. It is possible to increase the drop speed of (R). On the other hand, the control unit CTR increases the moving speed of the resin dropping table 310 or reduces the mold resin R from the nozzle 312d so as to reduce the mold resin R dropped in the section where the image is thickened. ) Can lower the rate of dropping.

As described above, the control unit CTR performs an operation of adjusting the resin supply setting information Dd1 of the next work W based on the acquired information, thereby making the mold resin R important for maintaining the quality in compression molding. ) Supply can be made uniform.

In addition, although the characteristic was demonstrated about each unit in the mold apparatus above, it is a unit which processes and processes with respect to a common workpiece | work, and it does not interfere with the structure and operation | work performed in which unit similarly in another unit. Do not. In addition, in this application, the function of such a unit has the individual effect also in a unit unit, and includes the invention as a unit of a unit. For example, in the dispensing unit, a combination of a film and a conveyance port can be prepared to supply a mold resin. For this reason, the same effect may be acquired even if a dispense unit and a press unit are prepared separately and used.

In addition, in the above, the example which conveys in the mold apparatus 1 and performs shaping | molding was mainly demonstrated in the state which arrange | positioned two workpiece | work W which is a rectangular workpiece in parallel in the longitudinal direction. However, it is good also as a structure which conveys and shape | molds in the mold apparatus 1 in the state which arranged the three workpiece | work W which is a rectangular workpiece in parallel in the longitudinal direction. In addition, in consideration of the convenience of exchanging molds, an example in which the workpieces W, which are rectangular workpieces, are arranged so as to be parallel to the front and rear directions of the apparatus, are mainly conveyed and molded in the mold apparatus 1. It is good also as a structure which conveys and shape | molds in the mold apparatus 1 in the state which arrange | positioned so that this workpiece | work W may become parallel to an apparatus left-right direction. In this case, when the supply magazine elevator 103 and the storage magazine elevator 113 are arrange | positioned at the left side of the workpiece processing unit 100A, it can convey efficiently, without rotating the direction of the workpiece | work W. As shown in FIG.

In addition, although the example which cut | disconnected and prepared the rectangular or wide film F from the roll film, and conveyed was demonstrated above, about the thing which is not related to the film F in invention of the above-mentioned embodiment, it is a film F It may also be carried out when compression molding is performed using the mold die 202 that does not use the. In this case, the exclusive conveyance port which conveys only mold resin R is used. In addition, without using the rectangular film or the wide film F, the roll film is installed in the press units 100B and 500B, the film F is supplied, and the exclusive conveyance port which conveys only the mold resin R is used. It is good also as a structure. In this conveyance port, by making it possible to open and close below the position which accommodates mold resin R, it can be set as the structure which conveys mold resin R in a closed state, and supplies it to the cavity 208 in an open state.

In addition, although the above description was made on the premise that the surface on which the electronic component Wb was mounted on the substrate Wa was inverted downward and then supplied into the apparatus, the work W before the resin mold in the apparatus. It may be configured to invert. In this case, after molding, the molded article Wp or the storage magazine 112 may be reversed again. Moreover, you may invert in the unit of the workpiece | work W and the molded article Wp, and may invert in the unit of the supply magazine 102 or the storage magazine 112. As shown in FIG. As a structure for this, for example, when the outer periphery of the workpiece | work W and the molded article Wp is pinched or a predetermined position is hold | maintained, the conveyance of these workpieces W and the molded article Wp is carried out when these are conveyed or received. Inversion is possible by rotating 180 degrees with respect to the axis of rotation parallel to the sides of the outer circumference. According to this, the reversal work before and after the front-back process (bonding process or an inspection process) which works | works a shaping | molding surface upwards becomes unnecessary, and the suspension of production by a work miss, etc. can be prevented.

In addition, when the work W or the molded product Wp are not inverted due to a work miss, that is, when the work W is supplied in the wrong direction inverted with respect to the assumed direction, the worker is in the right direction. You may sound the alarm to correct it. In this case, when the workpiece | work measuring instrument 114 measures the thickness of the workpiece | work W, the mounting direction of a semiconductor chip etc. can also be detected as the thickness of the workpiece | work W. As shown in FIG.

Claims (16)

As a resin mold apparatus which resin-molds the said workpiece | work using the conveyance part which conveys the mold metal mold | die and the workpiece | work mounted with the electronic component in the base material to the said mold metal mold | die, and carries out the molded article resin-molded in the said metal mold metal,
A supply magazine elevator for elevating a supply magazine in which the work is stored;
A storage magazine elevator arranged at different positions in the vertical direction with respect to the supply magazine elevator, and for lifting up and down a storage magazine in which the molded article is stored;
A supply rail disposed in front of the supply magazine elevator, on which the work taken out from a predetermined position of the supply magazine is mounted;
A storage rail which is passed toward the storage magazine while the molded product is mounted;
A work measuring device disposed below the supply rail and measuring a thickness of the work from a lower surface side with respect to the work on the supply rail;
A supply pickup for holding the workpiece on the supply rail and conveying it to the conveying unit;
A storage pickup for holding the molded article on the conveying unit and conveying the molded article to the storage rail;
The said supply rail, the said workpiece | work meter, and the said storage rail are piled up in the up-down direction, and the resin mold apparatus characterized by the above-mentioned. The method of claim 1,
The said supply rail is comprised by two rows so that two said workpieces can be mounted side by side,
The said workpiece measuring instrument has one or two thickness sensors which measure each thickness of the two said workpiece | work on the said supply rail of two rows by predetermined | prescribed 1 scan, The resin mold apparatus characterized by the above-mentioned. The method according to claim 1 or 2,
The work heater which further heats the said workpiece from the lower surface side is further provided,
The said workpiece heater is arrange | positioned so that advancing movement is possible between the position which is outside from an outer periphery, and the position which opposes a lower surface with respect to the said workpiece of the state hold | maintained by the said supply pick-up above the said supply rail. Device. The method according to any one of claims 1 to 3,
The supply path of the left-right direction in which the said supply pickup conveys the said workpiece | work to the said conveyance part, and the carrying out path of the left-right direction in which the said storage pickup conveys the said molded article from the said conveyance part are set in parallel with the front-back direction, It is characterized by the above-mentioned. Resin mold apparatus. The resin mold apparatus which molds the said workpiece | work and processes it into a molded article using the mold metal mold | die which has the upper mold which hold | maintains the workpiece | work mounted with an electronic component in the base material, and the lower mold | type with which the cavity recessed part to which mold resin was supplied via the film was formed. as,
A through hole corresponding to the shape of the cavity recessed portion, the conveying port being a jig for holding the mold resin and conveying the film together with the film;
A first table in which the film fed out from the film roll and cut into a predetermined length is held, and the cut film and the conveyance port are combined;
A second table configured to be movable by mounting the conveyance port in a state where the film is held on a lower surface side;
A transport port pickup for holding the transport port in a state where the film is held on a lower surface side and transporting the transport port from the first table to the second table;
The resin mold apparatus characterized by including the dispenser which inject | pours the said mold resin inside the said through hole in the said conveyance port mounted on the said 2nd table. The method of claim 5,
The conveyance port has two rows of film holding portions so that the two films can be arranged side by side in the left and right direction, and the resin holding holes corresponding to the films are provided in the respective film holding portions as the through holes. The resin mold apparatus made into. The method according to claim 5 or 6,
The said 1st table and the said film roll are juxtaposed in a hierarchical shape in the up-down direction, The resin mold apparatus characterized by the above-mentioned. The method according to any one of claims 5 to 7,
The resin mold apparatus further equipped with the resin heater which heats from the upper surface side of the said conveyance opening in the state where the said film and the said mold resin were hold | maintained. As a resin mold apparatus which uses the mold mold provided with an upper mold | type and a lower mold | type to resin-mold the workpiece | work mounted on the base material to a molded article,
A first holding portion for holding the workpiece and a second holding portion for holding the resin molded molded article are provided on an upper surface thereof to hold the workpiece and to convey it to a predetermined holding position of the upper mold. The 1st conveyance part conveyed to predetermined position other than a mold metal mold,
A third holding portion for holding the conveying port for holding the film and the mold resin and a fourth holding portion for holding the used film are provided on the lower surface thereof, and the film and the mold resin are held at the predetermined holding positions of the lower mold. The conveyance, the conveyance port of the state in which the holding | maintenance of the said film and the said mold resin were released, conveyed to the predetermined position other than the said mold metal mold | die, and the said remainder which remained in the said lower mold | type of the state in which the said resin molded product was taken out. The resin mold apparatus characterized by having a 2nd conveyance part which hold | maintains a used film and conveys to a predetermined position other than the said mold metal mold | die. The method of claim 9,
The said workpiece | work is a rectangular workpiece of rectangular shape,
The film is a rectangular film of a rectangular shape corresponding to the rectangular workpiece,
The said 1st holding | maintenance part has two rows of workpiece holding | maintenance parts so that the said 2nd rectangular workpieces can be arranged in parallel in the longitudinal direction of the said rectangular workpiece,
The second retaining section has two rows of molded article holding sections so that the two molded articles processed the rectangular workpiece can be arranged in parallel with the longitudinal direction of the molded article.
The said conveyance port has two rows of carrying film holding | maintenance parts so that the said rectangular film can be arranged and held in parallel with the longitudinal direction of the said rectangular film,
The third holding part has a conveying port holding part for holding the conveying port,
The said 4th holding | maintenance part has two rows of export film holding | maintenance parts so that the used two rectangular films may be arranged and held in parallel with the longitudinal direction of the said rectangular film. The resin mold apparatus characterized by the above-mentioned. The method of claim 9,
The said workpiece | work is a rectangular workpiece of a rectangular shape, or a wide workpiece | work wider than the said rectangular workpiece,
The film is a rectangular film of a rectangular shape corresponding to the rectangular workpiece, or a wide film having a wider width than the rectangular film,
One said rectangular film conveyance port which has two rows of carrying film retention parts so that the said 3rd holding | maintenance part can arrange and hold two said rectangular films in parallel with the longitudinal direction of the said rectangular film as said conveyance port, or 1 The resin mold apparatus characterized by having the conveyance port holding part which hold | maintains the wide film conveyance port which has one carrying film holding part which holds two said wide film in common. The method of claim 11,
The said 1st holding | maintenance part has the structure which has two rows of workpiece holding | maintenance parts, and the one workpiece holding | maintenance part which hold | maintains one said wide workpiece | work so that the said two rectangular workpieces can be arranged side by side in the longitudinal direction of the said rectangular workpiece. Is configured to replace the configuration,
The second holding part has a structure having two rows of molded product holding parts so as to be able to hold the two molded articles processed by the rectangular workpiece in parallel in the longitudinal direction of the molded article, and one of the one processed the one wide workpiece. The resin mold apparatus characterized by being replaceable with the structure which has one molded article holding part which hold | maintains the said molded article. The method according to claim 11 or 12,
The said film is a rectangular film of the rectangular shape corresponding to the said rectangular workpiece, or a wide film which is wider than the said rectangular film,
The fourth retaining portion includes two rectangular regions in which the two rectangular films are arranged side by side in parallel with the longitudinal direction of the rectangular film, and overlapped in a wide region in which one wide film is held. The resin mold apparatus characterized by having the film holding | maintenance part in which the several adsorption | suction part which adsorb | sucks and hold | maintains a film is arrange | positioned. The method according to any one of claims 9 to 13,
The conveying port,
A cleaning step of cleaning the conveying port, a film setting step of combining the film with the conveying port, a resin dropping step of dropping the mold resin into the conveying port combined with the film, and the film into the mold mold The resin mold apparatus characterized by the above-mentioned, The some in which the process in the different process of the resin supply process which supplies the said mold resin is performed is provided. The method according to any one of claims 9 to 14,
The conveying port has a first suction hole for generating a suction force to hold the film,
The said 3rd holding part has a 2nd suction hole arrange | positioned at the position which communicates with a said 1st suction hole in the state which hold | maintained the said conveyance port in the predetermined position, and generate | occur | produces a suction force, The resin mold apparatus characterized by the above-mentioned. As a resin mold method which performs a resin mold using the resin mold apparatus as described in any one of Claims 5-15,
The conveyance port is provided in plurality,
A cleaning step of cleaning the conveying port, a film setting step of combining the film with the conveying port, a resin dropping step of dropping the mold resin into the conveying port combined with the film, and the film into the mold mold And a plurality of conveying ports at different steps between the resin supply step of supplying the mold resin and the mold resin.

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