JP2017177455A - Resin molding device, resin molding method, and fluid material discharging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily reduce variation in discharged amounts of a fluid resin from a plurality of discharge ports.SOLUTION: The resin molding device includes: a molding die with a cavity that is provided at least one of an upper die and a lower die disposed to face each other; a resin discharging mechanism 18 which discharges a fluid resin 25 for feeding the fluid resin 25 to the cavity; and a clamping mechanism which clamps the molding die. The resin discharging mechanism 18 includes: a flow passage member 38 having branch passages 41 branched between an inflow port 40 and discharge ports 37 for the fluid resin 25; a rotary body 45 which is disposed in each of the branch passages 41 to be rotatable in accordance with flow of the passing fluid resin 25; and an interlocking mechanism 43 which interlockingly rotates each of the rotary bodies 45 disposed in the branch passages 41. This makes it possible to easily reduce variation in the discharged amounts of the fluid resin 25 from a plurality of the discharge ports 37.SELECTED DRAWING: Figure 3

Description

  In the present invention, a chip-shaped electronic component (hereinafter referred to as “chip” as appropriate) such as a transistor, an integrated circuit (IC), and a light emitting diode (LED) is sealed with a liquid resin. The present invention relates to a resin molding apparatus, a resin molding method, and a flowable material discharging apparatus used in the case of performing the above. In the present application document, the term “liquid” means that it is liquid at room temperature and has fluidity, regardless of the degree of fluidity, in other words, the degree of viscosity.

  Conventionally, a semiconductor chip mounted on a substrate is resin-sealed using a liquid resin made of a thermosetting resin such as a silicone resin or an epoxy resin. As a resin sealing technique, a resin molding technique such as compression molding or transfer molding is used. In resin molding using a liquid resin, resin molding is performed by mixing a liquid resin serving as a main agent with a liquid resin serving as an auxiliary agent such as a curing agent and heating the mixed liquid resin.

  In resin sealing using a liquid resin, the liquid resin is supplied from a nozzle attached to the tip of a dispenser, which is a resin discharge mechanism, to a cavity provided in the lower mold. There are various sizes and shapes of cavities corresponding to the products to be sealed with resin. Accordingly, the lower mold is provided with one cavity having a large area or a plurality of cavities having a small area corresponding to the product. If one cavity is provided in the lower mold, the liquid resin is supplied by one dispenser. Even when a plurality of cavities are provided in the lower mold, the liquid resin can be sequentially supplied to the plurality of cavities by one dispenser. However, since the liquid resin is sequentially supplied to the plurality of cavities using one dispenser, the time required for the supply becomes long and the productivity is lowered. Although a plurality of dispensers can be provided so as to correspond to the plurality of cavities, respectively, the liquid resin can be supplied, but the configuration of the entire apparatus becomes complicated and the cost increases.

  In order to supply the liquid resin to the plurality of cavities, a plurality of nozzles can be provided at the tip of the dispenser. In this case, a predetermined amount of liquid resin is supplied to each cavity simultaneously from a plurality of nozzles. Therefore, it is important to supply the liquid resin from a plurality of nozzles evenly and stably.

  As a molding apparatus which enables compression molding by taking a large number of pieces, “a plurality of branch paths 2 for feeding the plasticized resin molding material 6 to the tip of an extruder 1 for plasticizing and extruding the resin molding material 6 are provided and each branch path 2 is provided. A multi-nozzle extruder 4 formed by providing an extrusion nozzle 3 having a metering mechanism and an injection mechanism, and a compression mold 5 to which a plasticized resin molding material 6 extruded from the extrusion nozzle 3 is supplied. A molding apparatus has been proposed (see, for example, paragraph [0005] of Patent Document 1 and FIGS. 1 to 2).

JP-A-6-114867

  However, the conventional molding apparatus disclosed in Patent Document 1 has the following problems. As shown in FIG. 1 of Patent Document 1, a branch path 2 that is branched into a plurality of branches is connected to the tip of a delivery path 14 that feeds the plasticized resin molding material 6. A measuring / injecting unit 17 provided at the base of the extrusion nozzle 3 is connected to the tip of each branch passage 2. The plasticized resin molding material 6 supplied to the metering / injection unit 17 of each extrusion nozzle 3 is individually weighed and injected in each metering / injection unit 17, and is compressed from the nozzle port 18 of each extrusion nozzle 3. 5 is supplied to each cavity of the lower die 5a.

  In such an apparatus configuration, in each measuring / injecting unit 17, the plasticized resin molding material 6 supplied to each cavity by each unit is measured and injected to each extrusion nozzle. Therefore, the metering / injection units 17 corresponding to the number of cavities are provided, and each unit 17 controls the injection amount. Therefore, the apparatus configuration becomes complicated because a large number of pieces are taken, and the cost of the apparatus increases.

  The present invention solves the above-described problems, and provides a resin molding apparatus, a resin molding method, and a fluid material discharge apparatus that can easily reduce variations in the discharge amount of the fluid resin from a plurality of discharge ports. The purpose is to do.

  In order to solve the above-described problems, a resin molding apparatus according to the present invention supplies a molding die in which a cavity is provided in at least one of an upper die and a lower die arranged to face each other, and a fluid resin is supplied to the cavity. In order to achieve this, a resin discharge mechanism that discharges a fluid resin and a mold clamping mechanism that clamps a mold are provided, and the resin discharge mechanism is a branch branched between an inlet and an outlet of the fluid resin. Rotating in conjunction with each of a flow path member having a flow path, a rotating body that is disposed in each branch flow path and that can rotate as the flowable resin passes, and a rotary body that is disposed in the branch flow path Interlocking mechanism.

  In order to solve the above-mentioned problems, a resin molding method according to the present invention uses a molding die in which a cavity is provided in at least one of an upper die and a lower die arranged to face each other, and a fluid resin is added to the cavity. In order to supply, a resin discharge step of discharging a fluid resin and a mold clamping step of clamping a molding die supplied with the resin material, the resin discharge step includes an inlet and a discharge port of the fluid resin, By rotating the rotating bodies arranged in each of the branch flow channels branched between the two, the flowable resin passes through the respective rotating bodies.

  In order to solve the above-described problems, a fluid material discharge device according to the present invention includes a flow path member having a branch flow path branched between a flow material inlet and a discharge port, A rotating body that is disposed in the flow path and is rotatable with the passage of the flowable material, and an interlocking mechanism that rotates the rotating bodies that are disposed in the branch flow path in conjunction with each other.

  According to the present invention, variation in the discharge amount of the fluid resin from the plurality of discharge ports can be easily reduced.

In the resin molding apparatus of Embodiment 1, it is a top view which shows the outline | summary of an apparatus. (A)-(c) is a schematic sectional drawing which shows the process of resin-sealing the chip | tip mounted in the board | substrate in the resin molding apparatus of Embodiment 1. FIG. (A) is the schematic which shows the dispenser used in the resin molding apparatus of Embodiment 1, (b) is the schematic which shows the resin discharge part used in Embodiment 1, (c) is A- of (b). It is A sectional view. (A) is the schematic which shows the modification of the resin discharge part used in Embodiment 1, (b) is the BB sectional drawing of (a). (A) is a top view which shows the resin discharge part used in Embodiment 2, (b) is CC sectional view taken on the line of (a). (A) is a top view which shows the resin discharge part used in Embodiment 3, (b) is the DD sectional view taken on the line of (a). It is a schematic sectional drawing which shows the modification of each resin discharge part shown in Embodiments 1-3, respectively.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.
Embodiment 1

(Configuration of resin molding equipment)
The structure of the resin molding apparatus according to the present invention will be described with reference to FIG.

  A resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using, for example, a compression molding method. The resin molding apparatus 1 includes a substrate supply / storage module 2, four molding modules 3A, 3B, 3C, and 3D, and a resin supply module 4 as components. The substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and 3D, and the resin supply module 4, which are constituent elements, can be attached to and detached from each other, and can be exchanged. Can be done.

  The substrate supply / storage module 2 is provided with a pre-sealing substrate supply unit 6 that supplies the pre-sealing substrate 5 and a sealed substrate storage unit 8 that stores the sealed substrate 7. For example, a semiconductor chip or the like is mounted on the pre-sealing substrate 5. The substrate supply / storage module 2 includes a loader 9 and an unloader 10, and a rail 11 that supports the loader 9 and the unloader 10 is provided along the X direction. The loader 9 and the unloader 10 move in the X direction along the rail 11.

  The loader 9 and unloader 10 supported by the rail 11 move in the X direction between the substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and 3D and the resin supply module 4. The loader 9 is provided with a moving mechanism 12 for supplying the pre-sealing substrate 5 to the upper mold in each of the molding modules 3A, 3B, 3C, and 3D. In each molding module, the moving mechanism 12 moves in the Y direction. The unloader 10 is provided with a moving mechanism 13 that receives the sealed substrate 7 from the upper mold in each of the molding modules 3A, 3B, 3C, and 3D. In each molding module, the moving mechanism 13 moves in the Y direction.

  Each molding module 3A, 3B, 3C, 3D is provided with a lower mold 14 that can be moved up and down, and an upper mold (not shown, see FIG. 2) disposed opposite to the lower mold 14. The upper mold and the lower mold 14 together constitute a mold. Each of the molding modules 3A, 3B, 3C, and 3D includes a mold clamping mechanism 15 that molds and opens the upper mold and the lower mold 14 (part indicated by a two-dot chain line in the figure). The lower mold 14 is provided with a cavity 16 that is a space in which a fluid resin or a fluid resin that is a fluid material is accommodated and cured. In other words, the cavity 16 is a housing portion that houses the liquid resin. FIG. 1 shows a case where two cavities 16 are provided in the lower mold 14. A mold release film can be coated on the mold surface of the cavity 16. Here, the configuration in which the cavity is provided in the lower mold will be described. However, the cavity may be provided in the upper mold, or may be provided in both the upper mold and the lower mold.

  The resin supply module 4 is provided with a resin transport mechanism 17 that supplies liquid resin to the cavity 16. The resin transport mechanism 17 is supported by the rail 11 and moves in the X direction along the rail 11. The resin transport mechanism 17 is provided with a dispenser 18 which is a liquid resin discharge mechanism or discharge device. The dispenser 18 includes a resin discharge portion 19 that discharges a liquid resin at the tip portion. The resin discharge part 19 is provided with a plurality of nozzles corresponding to the number of cavities 16 (see FIGS. 3 to 7). In each molding module 3 </ b> A, 3 </ b> B, 3 </ b> C, 3 </ b> D, the dispenser 18 is moved in the Y direction by the moving mechanism 20 to supply liquid resin to the cavity 16.

  The dispenser 18 shown in FIG. 1 is a one-component dispenser that uses a liquid resin in which a main agent and a curing agent are mixed in advance. As the main agent, for example, a thermosetting silicone resin or epoxy resin is used. A two-component mixing type dispenser that mixes the main agent and the curing agent when discharging the liquid resin can also be used.

  The resin supply module 4 is provided with a vacuuming mechanism 21. The vacuuming mechanism 21 forcibly sucks and discharges air from the cavity 16 immediately before the upper mold and the lower mold 14 are clamped in the molding modules 3A, 3B, 3C, and 3D. The resin supply module 4 is provided with a control unit 22 that controls the operation of the entire resin molding apparatus 1. In FIG. 1, the case where the vacuuming mechanism 21 and the control unit 22 are provided in the resin supply module 4 is shown. Not only this but the vacuuming mechanism 21 and the control part 22 may be provided in another module.

  The control unit 22 controls discharge of the liquid resin, transport of the pre-sealing substrate 5 and the sealed substrate 7, heating of the mold, opening and closing of the mold. In other words, the control unit 22 controls each operation in the substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and 3D and the material supply module 4.

  The control unit 22 may be disposed at any position, and may be disposed in at least one of the substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and 3D, and the resin supply module 4. It can also be placed outside. Moreover, the control part 22 can also be comprised as a some control part which isolate | separated at least one part according to the operation | movement used as control object.

(Operation of resin molding equipment)
With reference to FIGS. 1-2, the operation | movement which carries out resin sealing of the chip | tip mounted in the board | substrate in the resin molding apparatus 1 is demonstrated. A case where the molding module 3C is used as the operation of the resin molding apparatus 1 will be described.

  First, for example, the pre-sealing substrate 5 on which the chip 23 (see FIG. 2A) is mounted is transferred from the pre-sealing substrate supply unit 6 to the loader 9 with the surface on which the chip 23 is mounted facing down. Deliver. Next, the loader 9 is moved in the + X direction from the substrate supply / storage module 2 along the rail 11 to the molding module 3C.

  Next, in the molding module 3C, the moving mechanism 12 is used to move the pre-sealing substrate 5 in the −Y direction to a predetermined position between the lower mold 14 and the upper mold 24 (see FIG. 2A). Let The pre-sealing substrate 5 with the surface on which the chip 23 is mounted facing down is fixed to the lower surface of the upper mold 24 by suction, clamping, or the like. After the pre-sealing substrate 5 is disposed on the lower surface of the upper mold 24, the moving mechanism 12 is moved backward to the loader 9. The loader 9 is moved to the original standby position in the substrate supply / storage module 2.

  Next, using the resin transport mechanism 17, the dispenser 18 is moved in the −X direction from the standby position in the resin supply module 4 to the molding module 3 </ b> C along the rail 11. Thus, the resin transport mechanism 17 is moved to a predetermined position near the lower mold 14 in the module 3C. The dispenser 18 is moved to a predetermined position above the lower mold 14 using the moving mechanism 20 (see FIG. 2A).

  Next, as shown in FIG. 2A, the liquid resin 25 is discharged from the resin discharge portion 19 of the dispenser 18 toward the cavity 16 provided in the lower mold 14. As a result, the liquid resin 25 is supplied to the cavity 16.

  Next, after supplying the liquid resin 25 to the cavity 16, the dispenser 18 is moved backward to the resin transport mechanism 17 using the moving mechanism 20. The resin transport mechanism 17 is moved to the original standby position in the resin supply module 4.

  Next, in the molding module 3C, the upper mold 24 and the lower mold 14 are clamped by raising the lower mold 14 using the mold clamping mechanism 15 (see FIG. 2B). By clamping the mold, the chip 23 mounted on the substrate 5 before sealing is immersed in the liquid resin 25 supplied to the cavity 16. At this time, a predetermined resin pressure can be applied to the liquid resin 25 in the cavity 16 using a cavity bottom member (not shown) provided in the lower mold 14.

  In the process of clamping the mold, the inside of the cavity 16 may be sucked using the vacuuming mechanism 21. As a result, air remaining in the cavity 16 or bubbles contained in the liquid resin 25 are discharged to the outside of the mold. In addition, the inside of the cavity 16 is set to a predetermined degree of vacuum.

  Next, using a heater (not shown) provided on the lower mold 14, the liquid resin 25 is heated for a time necessary to cure the liquid resin 25. As a result, the liquid resin 25 is cured to form the cured resin 26 (see FIG. 2C). As a result, the chip 23 mounted on the pre-sealing substrate 5 is resin-sealed with the cured resin 26 formed corresponding to the shape of the cavity 16. After the liquid resin 25 is cured, the upper mold 24 and the lower mold 14 are opened using the mold clamping mechanism 15. A molded product 27 (sealed substrate 7) sealed with resin is fixed to the lower surface of the upper mold 24 (see FIG. 2C).

  Next, the loader 9 is retracted to an appropriate position that does not prevent the unloader 10 from moving to the molding module 3C. For example, the loader 9 is retracted from the substrate supply / storage module 2 to an appropriate position in the molding module 3D or the resin supply module 4. Thereafter, the unloader 10 is moved in the + X direction along the rail 11 from the substrate supply / storage module 2 to the forming module 3C.

  Next, in the molding module 3 </ b> C, after the moving mechanism 13 is moved in the −Y direction to a predetermined position between the lower mold 14 and the upper mold 24, the moving mechanism 13 removes the sealed substrate 7 from the upper mold 24. receive. After receiving the sealed substrate 7, the moving mechanism 13 is returned to the unloader 10. The unloader 10 is returned to the substrate supply / storage module 2 and the sealed substrate 7 is stored in the sealed substrate storage portion 8. At this point, resin sealing of the first pre-sealing substrate 5 is completed, and the first sealed substrate 7 is completed.

  Next, the loader 9 that has been retracted to an appropriate position in the molding module 3 </ b> D or the resin supply module 4 is moved to the substrate supply / storage module 2. The next pre-sealing substrate 5 is delivered from the pre-sealing substrate supply unit 6 to the loader 9. Resin sealing is repeated as described above.

  In the resin molding apparatus 1, the control unit 22 supplies the pre-sealing substrate 5, moves the resin transport mechanism 17 and the dispenser 18, discharges the liquid resin 25, closes and opens the upper mold 24 and the lower mold 14, Operations such as storage of the sealed substrate 7 are controlled.

(Composition of dispenser)
With reference to FIG. 3, the dispenser 18 used in the resin molding apparatus 1 is demonstrated. As shown in FIG. 3, the dispenser 18 includes a resin delivery mechanism 28 that delivers the liquid resin 25, a syringe 29 that is a storage unit that stores the liquid resin 25, a resin transfer unit 30 that transfers the liquid resin 25, And a resin discharge part 19 for discharging the liquid resin 25. In the dispenser 18, the dispenser 18 is integrally configured by connecting the resin delivery mechanism 28, the syringe 29, the resin transfer unit 30, and the resin discharge unit 19. Therefore, the syringe 29 or the resin discharge part 19 can be replaced with another syringe 29 or the resin discharge part 19 depending on the application.

  The resin delivery mechanism 28 includes a servo motor 31, a ball screw 32 that is rotated by the servo motor 31, a slider 33 that is attached to a ball screw nut (not shown) and converts rotational motion into linear motion, and a tip portion of the slider 33. And a plunger 35 attached to the tip of the rod 34. As the servo motor 31 rotates, the plunger 35 moves in the Y direction via the ball screw 32, slider 33, and rod 34, respectively.

  The servo motor 31 is a motor that can control the rotation of the motor. The servo motor 31 has a rotation detector (encoder) 36 that monitors the rotation of the motor. The encoder 36 detects and feeds back the rotation angle and rotation speed of the servo motor 31. By controlling the rotation of the servo motor 31, position control, speed control, torque control, and the like of the plunger 35 can be performed with high accuracy. In addition, by monitoring the load torque of the servo motor 31, it is possible to detect whether an abnormality (such as clogging of the liquid resin) has occurred in the dispenser 18.

  The dispenser 18 shown in FIG. 3A is a one-component dispenser that uses a liquid resin 25 in which a main agent and a curing agent are mixed in advance. FIG. 3 shows a case where a resin discharge portion having two resin discharge ports 37 is used as the resin discharge portion 19. By exchanging the resin discharge portion 19, a resin discharge portion having more resin discharge ports can be used (see FIGS. 4 to 7).

(Configuration of resin discharge part)
With reference to FIGS. 3-4, Embodiment 1 of the resin discharge part used in the resin molding apparatus 1 is demonstrated. As shown in FIG. 3C, the resin discharge section 19 has a branch in which a flow path is branched between a resin inlet 40 into which the liquid resin 25 flows and a resin outlet 37 through which the liquid resin 25 is discharged. A flow path member 38 having a flow path 41 and two nozzles 39 attached to both ends of the flow path member 38 are provided. A resin inlet 40 to which the liquid resin 25 is supplied is provided at the center of the flow path member 38. A branch channel 41 extending from the resin inlet 40 to both sides along the horizontal direction is provided. Therefore, the branch flow dew 41 is branched into two so as to extend in opposite directions in one axis. The nozzle 39 is provided with a resin flow path 42 connected to the branch flow path 41 and extending along the vertical direction. A resin discharge port 37 is provided at the tip of the resin flow path 42. The nozzle 39 is detachably attached to the flow path member 38 and can be exchanged. Nozzles with different calibers and shapes can be selected and used according to the product and application. 3 (b), 3 (c), 4 (a), 4 (b) and FIGS. 5 (b), 6 (b), and 7 (a) to 7 (c) described later, The shape (direction) of the groove and the rotation direction are schematically illustrated, and are not necessarily intended to coincide with the flowing direction of the liquid resin.

  The flow path member 38 is provided with a rotation shaft 43 that is an interlocking mechanism that can rotate in the branch flow path 41. The rotating shaft 43 is supported at both ends of the flow path member 38. On both sides of the resin inflow port 40, rotating bodies 45 having spiral grooves 44 are fitted in the rotating shaft 43. For example, the rotating body 45 is configured by a screw, a rotor, or the like. Therefore, the rotating body 45 is a rotating body that rotates together with the rotating shaft 43, and the rotating shaft 43 is a rotating shaft that is common to the two rotating bodies 45. The rotating bodies 45 arranged on both sides of the resin inlet 40 are fitted into the rotating shaft 43 so that the directions of the spiral grooves 44 are opposite to each other. Accordingly, the two rotating bodies 45 have a spiral groove 44 whose directions are opposite to each other. Accordingly, the rotating body 45 and the rotating shaft 43 are integrally rotated in the same direction by the resin pressure of the liquid resin 25 supplied to the resin inlet 40. In addition, as a rotor which can comprise the rotary body 45, the rotor which can be eccentrically rotated used for a Mono pump can be used. When using a rotor of a Monopump, for example, a female screw-like elastic body is arranged around the rotor inside the branch flow path 41, and two universal joints and a cup that connects these universal joints to the rotating shaft system By using the ring rod, the rotor can be rotated eccentrically.

  The rotating body 45 can be replaced according to the type, viscosity, specific gravity, etc. of the liquid resin to be used. Therefore, the material, length, diameter, and pitch, height, taper angle, etc. of the spiral groove 44 can be optimized corresponding to the liquid resin.

  As shown in FIG. 4, the shape of the groove provided in the rotating body 45 is such that the two rotating bodies 45 are opposite to each other and tilted with respect to the rotating shaft 43 when viewed from the direction orthogonal to the rotating shaft 43. A plurality of linear grooves 44a may be provided. 4 (a) and 4 (b) correspond to FIGS. 3 (b) and 3 (c), respectively. 4 shows the linear groove 44a when viewed from the direction orthogonal to the rotation shaft 43, but the curved groove including at least a portion inclined with respect to the rotation shaft 43 when viewed from the direction orthogonal to the rotation shaft 43 is shown. It can also be a groove.

  The rotating body 45 may be provided with a hole instead of the groove. Specifically, the grooves 44 and 44a can be formed as holes so as to cover the outer periphery of the rotating body 45 as shown in FIGS.

(Dispenser operation)
With reference to FIG. 3, the operation of the dispenser 18 discharging the liquid resin 25 will be described. As shown in FIG. 3A, the ball screw 32 is rotated by rotating the servo motor 31. As the ball screw 32 rotates, the slider 33 attached to the ball screw nut advances in the -Y direction. As the slider 33 moves forward, the rod 34 fixed to the slider 33 moves forward in the −Y direction. In the syringe 29, when the rod 34 moves forward in the −Y direction, the plunger 35 attached to the tip of the rod 34 moves forward in the −Y direction. When the plunger 35 advances in the −Y direction, the liquid resin 25 stored in the syringe 29 is pressed and pushed out in the −Y direction. The liquid resin 25 pushed out by the plunger 35 is supplied to the flow path member 38 of the resin discharge part 19 via the resin transfer part 30.

  As shown in FIG. 3B, the liquid resin 25 supplied to the flow path member 38 branches from the resin inlet 40 to the branch flow paths 41 on both sides and flows. 3 to 7, the direction in which the liquid resin 25 flows is indicated by a thick arrow. The branched liquid resin 25 flows to both sides along a spiral groove 44 formed in each rotating body 45. Since the rotating bodies 45 are arranged so that the directions of the spiral grooves 44 are opposite to each other, a force is applied to rotate each rotating body 45 in the same direction by the resin pressure of the liquid resin 25. Therefore, when the liquid resin 25 flows from the resin inlet 40 to both sides and passes through the rotating body 45 in the branch flow path 41, the rotating body 45 and the rotating shaft 43 are integrally rotated in the same direction. In other words, each rotating body 45 rotates at the same speed in synchronization with the rotation of the rotating shaft 43.

  Since each rotating body 45 rotates at the same speed, the liquid resin 25 having the same flow rate can be delivered from each rotating body 45. When the rotating body 45 and the rotating shaft 43 are integrally rotated at the same speed, the liquid resin 25 can be delivered uniformly. Therefore, the rotator 45 having the spiral groove 44 has a function as a resin metering unit that uniformly delivers the liquid resin 25.

  The liquid resin 25 sent out equally by the rotator 45 is discharged into the cavity 16 (see FIG. 2A) through the branch channel 41, the resin channel 42, and the resin discharge port 37 in this order. Therefore, the liquid resin 25 having the same flow rate can be evenly supplied from the two nozzles 39 to the cavities 16.

(Function and effect)
In the present embodiment, in order to supply the liquid resin 25 that is a fluid resin or a fluid material to the cavity 16, a dispenser 18 that is a resin ejection mechanism or ejection device that ejects the liquid resin 25 is used as an inlet of the liquid resin 25. And a flow passage member 38 having a branch flow passage 41 branched between the discharge port and a rotary body 45 that is disposed in each branch flow passage 41 and is a rotary body that can rotate as the liquid resin 25 passes. And a rotating shaft 43 that is an interlocking mechanism that rotates each of the rotating bodies 45 arranged in the branch flow path 41 in an interlocking manner.

  With such a configuration, variations in the discharge amount of the liquid resin 25 from the plurality of discharge ports can be easily reduced. In addition, by monitoring the load torque at the time of discharge, for example, when one of the plurality of discharge ports is clogged, it is possible to suppress a problem that the liquid resin 25 is discharged from only some of the discharge ports. it can.

  Furthermore, in this embodiment, the branch flow path 41 is branched into two so as to extend in opposite directions in one axis, and the two rotating bodies 45 are rotated in conjunction with the common rotating shaft 43 so that the two rotating bodies 45 rotate. The two rotators 45 have a spiral groove whose directions are opposite to each other.

  By adopting such a configuration, it is possible to easily reduce variations in the discharge amount of the liquid resin 25 from the two discharge ports.

  More specifically, according to the present embodiment, in the dispenser 18, two nozzles 39 are provided at both ends of the resin discharge portion 19. In the resin discharge unit 19, a rotatable shaft 43 is provided in the branch flow path 41. On both sides of the resin inflow port 40 provided in the center of the resin discharge portion 19, a rotating body 45 having a spiral groove 44 is fitted into the rotation shaft 43. Since the rotating body 45 is fitted into the rotating shaft 43 so that the directions of the spiral grooves 44 are opposite to each other, the rotating body 45 and the rotating shaft 43 rotate together in the same direction. Each rotating body 45 rotates at the same speed in synchronization with the rotation of the rotating shaft 43. As a result, the liquid resin 25 having the same flow rate is evenly delivered via the spiral grooves 44 of the respective rotating bodies 45. When the rotator 45 having the spiral groove 44 rotates in synchronization with each other, each rotator 45 functions as a resin metering unit that uniformly delivers the liquid resin 25. Therefore, the liquid resin 25 having the same flow rate can be evenly supplied to the cavities 16 from the two nozzles 39 provided at both ends of the resin discharge portion 19 via the respective rotating bodies 45.

  According to the present embodiment, the plurality of rotating bodies 45 having the spiral grooves 44 are rotated together with the rotating shaft 43 at the same speed. Since the plurality of rotating bodies 45 rotate in synchronization with each other, each rotating body 45 functions as a resin metering unit that uniformly delivers the liquid resin 25. Therefore, it is possible to configure a resin weighing unit with a very simple structure and reduced cost. In addition, the rotating body 45 can be replaced corresponding to the liquid resin. The optimum rotating body 45 can be used corresponding to the type, viscosity, specific gravity, etc. of the liquid resin. Therefore, it can respond to a wide variety of liquid resins with a very simple configuration.

  In the present embodiment, four molding modules 3A, 3B, 3C, and 3D are mounted side by side in the X direction between the substrate supply / storage module 2 and the resin supply module 4. The substrate supply / storage module 2 and the resin supply module 4 may be combined into one module, and a single molding module 3A may be mounted side by side in the X direction. Further, another molding module 3B may be attached to the molding module 3A. As a result, the number of molding modules 3A, 3B,. Therefore, since the structure of the resin molding apparatus 1 can be optimized, productivity can be improved.

In the present embodiment, the resin molding apparatus 1 has been described as a configuration including the substrate supply / storage module 2, the four molding modules 3 </ b> A, 3 </ b> B, 3 </ b> C, and 3 </ b> D and the resin supply module 4. The resin molding apparatus is not limited to this configuration, and is an apparatus that has at least a molding die, a resin ejection mechanism that ejects a fluid resin, and a mold clamping mechanism that clamps the molding die and has a function of performing resin molding. I just need it.
[Embodiment 2]

(Configuration of resin discharge part)
With reference to FIG. 5, Embodiment 2 of the resin discharge part used in the resin molding apparatus 1 is demonstrated. The difference from the first embodiment is that more nozzles and parallel flow paths are provided in the resin discharge portion.

  As shown in FIG. 5B, the resin discharge part 46 includes a flow path member 47, and the flow path member 47 includes a plurality of nozzles 48 arranged in parallel. FIG. 5 shows a case where four nozzles 48 are provided in the flow path member 47. Not limited to this, five or more nozzles 48 can be provided, or two or three nozzles can be provided.

  The flow path member 47 is provided with a resin inlet 40 to which the liquid resin 25 is supplied and a branch flow path 41 extending from the resin inlet 40 to both sides along the horizontal direction. Each nozzle 48 is provided with a plurality of juxtaposed channels 42a that branch from the branch channel 41 and extend in the vertical direction. A resin discharge port 37 is provided at the tip of each parallel flow path 42a. The nozzle 48 may be configured to be attachable to and detachable from the flow path member 47. Nozzles with different diameters and lengths can be selected and used according to the product and application. Further, if a detachable nozzle is separately attached to the tip of each side-by-side channel 42a, the rotating body 45 can be used in common for a plurality of types of nozzles.

  Each nozzle 48 is provided with a rotation shaft 49 that is an interlocking member that can rotate in the parallel flow path 42a. Each rotating shaft 49 is fitted with a rotating body 45 having a spiral groove 44. The rotating body 45 is constituted by a screw, a rotor, or the like. The rotating body 45 is a rotating body that rotates together with the rotating shaft 49. Each rotating body 45 is fitted into the rotating shaft 49 so that the directions of the spiral grooves 44 are the same. As a result, the respective rotary bodies 45 and the rotary shaft 49 rotate together in the same direction. Each rotating shaft 49 is supported in the vertical direction by the upper surface of the flow path member 47 and the support member 50.

  In addition, about the shape of a groove | channel, it is good also as a some linear groove | channel (refer FIG. 4) demonstrated in Embodiment 1, and it is good also as a some groove | channel curved. Further, as described in the first embodiment, a hole may be used instead of the groove.

  As shown in FIG. 5A, a pulley 51 is connected to one end (the upper end in FIG. 5B) of each rotating shaft 49 as a rotating plate that is an interlocking mechanism. A belt 52 that is an interlocking mechanism that can rotate in contact with the outer periphery of each pulley 51 is provided so as to surround each pulley 51. When each rotating body 45 rotates in the same direction, each pulley 51 rotates in the same direction as the rotating body 45 via the rotating shaft 49. As each pulley 51 rotates in the same direction, the belt 52 rotates. The outer diameter of each pulley 51 can be set arbitrarily.

(Operation of resin discharge part)
With reference to FIG. 5, the operation of discharging the liquid resin 25 from the resin discharge portion 46 will be described. As shown in FIG. 5 (b), the liquid resin 25 supplied to the resin discharge portion 46 branches and flows from the resin inlet 40 to the branch passages 41 on both sides. The branch channel 41 is filled with the liquid resin 25 that has branched and flowed. The liquid resin 25 flows from the branch flow path 41 to the parallel flow paths 42a formed in the nozzles 48, respectively. In each side-by-side channel 42a, the rotating bodies 45 fitted into the respective rotation shafts 49 are arranged such that the directions of the spiral grooves 44 are the same. As a result, a force is applied to rotate each rotating body 45 in the same direction by the resin pressure of the liquid resin 25. Therefore, when the liquid resin 25 flows through each parallel flow path 42a and passes through each rotary body 45, the rotary body 45 and the rotary shaft 49 rotate together in the same direction.

  As shown in FIG. 5A, each rotating body 45 and the rotating shaft 49 rotate together in the same direction, so that each pulley 51 also rotates in the same direction as the rotating shaft 49 and the rotating body 45. . Since each pulley 51 rotates in the same direction, the belt 52 rotates along the outer periphery of each pulley 51 by the frictional force between each pulley 51 and the belt 52. As a result, the belt 52 rotates along the outer periphery of the pulley 51 at a constant speed.

  As the belt 52 rotates at a constant speed, the belt 52 rotates each pulley 51 in the same direction at the same speed. Each pulley 51 rotates in the same direction at the same speed, so that each rotating body 45 rotates in the same direction at the same speed via the rotation shaft 49. Accordingly, the respective rotating bodies 45 rotate in the same direction at the same speed in synchronization with the speed at which the belt 52 rotates. As a result, the liquid resin 25 having the same flow rate can be delivered from the respective rotating bodies 45. Since each rotating body 45 rotates in synchronization with the rotation speed of the belt 52, the rotating body 45 functions as a resin metering unit that uniformly delivers the liquid resin 25.

  The liquid resin 25 sent out equally by each rotating body 45 is discharged from each resin discharge port 37 into the cavity. Therefore, the liquid resin 25 having the same flow rate can be evenly supplied from the four nozzles 48 to the respective cavities.

(Function and effect)
In this embodiment, the branching channel 41 includes a plurality of juxtaposed channels 42a arranged in parallel, and the rotating body 45 is disposed in each juxtaposed channel 42a, and the juxtaposed channel 42a serves as an interlocking mechanism. Each of the rotating bodies 45 includes a rotating shaft 49 and a pulley 51 that is a rotating plate connected to the rotating shaft 49.

  According to such a configuration, variations in the discharge amount of the liquid resin 25 from the plurality of discharge ports can be easily reduced regardless of the number of discharge ports.

  Furthermore, in this embodiment, the belt 52 which connects the pulley 51 corresponding to the some rotary body 45 as an interlocking mechanism is further included, and it is set as the structure which has the helical groove | channel 44 in which each rotary body 45 aligned.

  According to such a configuration, variations in the discharge amount of the liquid resin 25 from the plurality of discharge ports can be easily reduced regardless of the number of discharge ports.

  More specifically, according to the present embodiment, the dispenser 18 is provided with a plurality of nozzles 48 for discharging the liquid resin 25 to the resin discharge portion 46. A rotatable shaft 49 is provided in each of the juxtaposed channels 42 a provided in each nozzle 48. A rotating body 45 having a spiral groove 44 is fitted into each rotating shaft 49. A pulley 51 is connected to one end of each rotating shaft 49. Each rotating body 45 is fitted into the rotating shaft 49 so that the directions of the spiral grooves 44 are the same. Therefore, due to the resin pressure of the liquid resin 25, the rotating body 45, the rotating shaft 49, and the pulley 51 rotate together in the same direction. Since all the pulleys 51 rotate in the same direction, the belt 52 rotates at a constant speed along the outer periphery of each pulley 51.

  When the belt 52 rotates at a constant speed, the pulley 51, the rotating shaft 49, and the rotating body 45 are integrally rotated in the same direction at the same speed in synchronization with the rotating speed of the belt 52. Since each rotating body 45 rotates in the same direction at the same speed, the liquid resin 25 having the same flow rate can be evenly fed through the spiral groove 44 of the rotating body 45. When each rotating body 45 rotates in the same direction at the same speed, each rotating body 45 functions as a resin metering unit that uniformly delivers the liquid resin 25. Therefore, the liquid resin 25 having the same flow rate can be evenly supplied from the resin discharge ports 37 to the respective cavities 16 via the respective rotating bodies 45.

  According to this embodiment, a large number of nozzles 48 that discharge the liquid resin 25 are provided in the resin discharge portion 46. The multiple nozzles 48 are each provided with a rotating body 45 having a spiral groove 44. Since each rotating body 45 rotates in the same direction at the same speed in synchronization with the rotation speed of the belt 52, the rotating body 45 delivers the liquid resin 25 evenly. Therefore, even when a large number of cavities are provided, the liquid resin 25 can be evenly supplied to the cavities.

According to the present embodiment, since the plurality of rotating bodies 45 rotate in synchronization with each other, each rotating body 45 functions as a resin metering unit that uniformly delivers the liquid resin 25. Therefore, it is possible to configure a resin weighing unit with a very simple structure and reduced cost. In addition, the rotating body 45 can be replaced corresponding to the liquid resin. The optimum rotating body 45 can be used corresponding to the type, viscosity, specific gravity, etc. of the liquid resin. Therefore, it can respond to a wide variety of liquid resins with a very simple configuration.
[Embodiment 3]

(Configuration of resin discharge part)
With reference to FIG. 6, Embodiment 3 of the resin discharge part used in the resin molding apparatus 1 is demonstrated. The difference from the second embodiment is that each rotating body 45 is rotated in the same direction at the same speed by a combination of gears, not a combination of a pulley and a belt.

  As shown in FIG. 6B, the configuration of the resin discharge section 46, the flow path member 47, the nozzle 48, the rotating body 45, the rotating shaft 49, the support member 50, and the like is exactly the same as that of the second embodiment, and thus the description thereof is omitted. .

  As shown in FIG. 6A, gears 53 that are interlocking mechanisms are connected to one end of each rotating shaft 49 (the upper end in FIG. 6B). Between the adjacent gears 53 and the gears 53, other gears 54 that are interlocking mechanisms are provided so as to mesh with the respective gears 53. Both the gear 53 and the gear 54 are spur gears. The adjacent gear 53 and gear 54 rotate in opposite directions by engaging each other. The gear ratio between the gear 53 and the gear 54 can be set arbitrarily.

(Operation of resin discharge part)
With reference to FIG. 6, the operation | movement which discharges the liquid resin 25 from the resin discharge part 46 is demonstrated. As in the second embodiment, the liquid resin 25 flows from the branch flow paths 41 through the parallel flow paths 42a, so that the rotating body 45 and the rotary shaft 49 rotate together in the same direction.

  As shown in FIG. 6A, since the rotating body 45 and the rotating shaft 49 are integrally rotated in the same direction, the gears 53 connected to the rotating shafts 49 are respectively in the same direction as the rotating shaft 49. Rotate. Each gear 53 rotates clockwise. As each gear 53 rotates clockwise, each gear 54 rotates counterclockwise. Since the gear ratio between the gear 53 and the gear 54 is set constant, the gear 53 and the gear 54 rotate in opposite directions at a constant speed. Accordingly, each gear 53 rotates in the same direction at a constant speed, and each gear 54 rotates in the opposite direction at a constant speed.

  When the respective gears 53 rotate in the same direction at the same speed, the respective rotating bodies 45 rotate in the same direction at the same speed via the rotation shaft 49. Accordingly, the rotating body 45 rotates in the same direction at the same speed in synchronization with the rotation speed of each gear 53. As a result, the liquid resin 25 having the same flow rate can be delivered from the respective rotating bodies 45. Since each rotating body 45 rotates in synchronization with the rotation speed of the gear 53, the rotating body 45 functions as a resin metering unit that uniformly delivers the liquid resin 25.

  The liquid resin 25 sent out equally by each rotating body 45 is discharged from each resin discharge port 37 into the cavity. Therefore, the liquid resin 25 having the same flow rate can be evenly supplied from the four nozzles 48 to the respective cavities.

(Function and effect)
In this embodiment, the branching channel 41 includes a plurality of juxtaposed channels 42a arranged in parallel, and the rotating body 45 is disposed in each juxtaposed channel 42a, and the juxtaposed channel 42a serves as an interlocking mechanism. Each of the rotating bodies 45 includes a rotating shaft 49 and a gear 53 that is a rotating plate connected to the rotating shaft 49.

  According to such a configuration, variations in the discharge amount of the liquid resin 25 from the plurality of discharge ports can be easily reduced regardless of the number of discharge ports.

  Further, in the present embodiment, a gear 54 arranged so as to mesh with both of the gears 53 corresponding to adjacent rotating bodies 45 as an interlocking mechanism is included, and the spiral grooves 44 in which the respective rotating bodies 45 are aligned in direction. It has composition which has.

  According to such a configuration, variations in the discharge amount of the liquid resin 25 from the plurality of discharge ports can be easily reduced regardless of the number of discharge ports.

  More specifically, according to the present embodiment, a plurality of nozzles 48 that discharge the liquid resin 25 are provided in the resin discharge portion 46. A rotatable shaft 49 is provided in each parallel flow path 42 a, and a rotating body 45 having a spiral groove 44 is fitted in each of the rotating shafts 49. A gear 53 is connected to one end of each rotating shaft 49. Another gear 54 is provided between the adjacent gears 53 so as to mesh with the respective gears 53. Since the gear ratio between the gear 53 and the gear 54 is set to be constant, each gear 53 rotates in the same direction at a constant speed, and each gear 54 rotates in the opposite direction at a constant speed.

  The rotating body 45 rotates in the same direction at the same speed in synchronization with the rotation speed of each gear 53. Since each rotating body 45 rotates in the same direction at the same speed, the liquid resin 25 having the same flow rate can be evenly fed through the spiral groove 44 of the rotating body 45. When each rotating body 45 rotates in the same direction at the same speed, each rotating body 45 functions as a resin metering unit that uniformly delivers the liquid resin 25. Therefore, the liquid resin 25 having the same flow rate can be evenly supplied from the resin discharge ports 37 to the respective cavities 16 via the respective rotating bodies 45.

(Modification of Embodiment 3)
As a modification of the third embodiment, the gear 54 can be omitted and the adjacent gears 53 can be directly meshed with each other. In the configuration of this modification, adjacent gears 53 and gears 53 rotate in opposite directions. Therefore, the spiral grooves of the adjacent rotating bodies 45 may be provided so that the directions are opposite to each other. The adjacent rotators 45 rotate in the opposite direction at the same speed in synchronization with the rotation speeds of the respective gears 53. As a result, the liquid resin 25 can be evenly delivered from each rotating body 45. Also in this modified example, the same operational effects as those of the third embodiment described above can be achieved.
[Embodiment 4]

(Modification of resin discharge part)
With reference to FIG. 7, the modification of Embodiment 1-3 of the resin discharge part used in the resin molding apparatus 1 is each demonstrated. The difference from the first to third embodiments is that a motor is provided outside as a rotation mechanism that rotates the rotating body 45 in an auxiliary manner. 7B and 7C, the support member 50 is omitted for convenience.

  As shown in FIG. 7A, in the resin discharge unit 19, a motor 55 that is a rotation mechanism is connected to the rotation shaft 43. As the motor 55, for example, a servo motor or a stepping motor is used. When the liquid resin 25 is a liquid resin having high viscosity, the driving force (resin pressure) for rotating the rotating body 45 may not be sufficient because the liquid resin 25 flows at a low speed. In such a case, the rotating body 45 is rotated by using the motor 55 in an auxiliary manner. As a result, the rotating body 45 rotates at a constant speed, so that the liquid resin 25 can flow stably.

  In FIG. 7A, the rotary shaft 43 provided in the resin discharge part 19 and the motor 55 are directly connected. Not only this but the combination of a belt and a pulley, the combination of a pinion and a gear, the combination of a chain and a sprocket, etc. can be used between the rotating shaft 43 and the motor 55. By these things, the rotational speed of the rotating shaft 43 and the rotating body 45 can be adjusted corresponding to the rotational speed of the motor 55. Therefore, the speed at which the liquid resin 25 flows can be optimized in accordance with the type, viscosity, specific gravity, and the like of the liquid resin 25.

  As shown in FIG. 7B, a pulley 56 is connected to the tip of the motor 55 in the resin discharge portion 46. The pulley 56 is connected to each pulley 51 provided in the resin discharge part 46 through the belt 52. As the motor 55 rotates, the belt 52 is rotated via the pulley 56. As the belt 52 rotates, the rotating shaft 49 and the rotating body 45 are rotated. By adjusting the diameter of the pulley 56 connected to the motor 55 and the diameter of each pulley 52 connected to the rotation shaft 49 of the resin discharge unit 46, the rotation speed of the rotation shaft 49 and the rotating body 45 is adjusted. be able to. Therefore, the speed at which the liquid resin 25 flows can be optimized in accordance with the type, viscosity, specific gravity, and the like of the liquid resin 25.

  As shown in FIG. 7C, a gear 57 is connected to the tip of the motor 55 in the resin discharge portion 46. The gear 57 connected to the motor 55 and the gear 53 connected to the rotation shaft 49 of the resin discharge part 46 are engaged with each other. By rotating the motor 55 counterclockwise, the gear 57 rotates counterclockwise and the gear 53 rotates clockwise. By adjusting the gear ratio between the gear 57 connected to the motor 55 and the gear 53 connected to the rotation shaft 49 of the resin discharge portion 46, the rotation speed of the rotation shaft 49 and the rotating body 45 can be adjusted. Therefore, the speed at which the liquid resin 25 flows can be optimized in accordance with the type, viscosity, specific gravity, and the like of the liquid resin 25.

  The rotational speeds of the rotating shaft 49 and the rotating body 45 can be adjusted by using a combination of a pinion, a crown gear, a spur gear and the like connected to the motor 55, for example.

  In each Example, the structure which formed the penetration part for a rotating shaft and a groove part or a hole as the rotating body 45 in the columnar member was demonstrated. The rotating body is not limited to this structure. For example, the rotating shaft may have a structure in which a penetrating portion and a groove portion or a hole portion for penetrating the rotating shaft are formed in a drum-shaped member having a thick central portion, a drum shape having a thin central portion, or a conical shape. Regardless of the shape of the rotating shaft, the rotating body can be rotated by making the shape of the branch channel correspond to the shape of the rotating body.

  In each embodiment, the case where a plurality of nozzles are provided in the resin discharge portion and the liquid resin 25 is supplied to the plurality of cavities has been described. When a plurality of nozzles are used, the liquid resin 25 may be clogged in some nozzles. When the clogging of the liquid resin 25 occurs, the load for causing the liquid resin 25 to flow increases, so that the load torque applied to the servo motor 31 of the dispenser 18 increases. Therefore, the clogging of the liquid resin 25 can be detected by monitoring the load torque applied to the servo motor 31. Thus, even when a plurality of nozzles are used, it is possible to easily find out whether an abnormality has occurred in the dispenser 18.

  In each embodiment, a combination of a servo motor 31 and a ball screw 32 is used as the resin delivery mechanism 28. Not only this but the combination of a stepping motor and a ball screw, a uniaxial eccentric screw system, delivery means, such as an air cylinder, can be used.

  In each embodiment, the case where a plurality of cavities 16 are provided in the lower mold 14 is shown. Not only this but as a modification, even if it is a case where one cavity which has a large area is provided, dispenser 18 in each embodiment is applicable. In this case, since the liquid resin 25 can be simultaneously discharged from a plurality of nozzles to a large area cavity, the liquid resin 25 can be supplied uniformly in a short time.

  In each embodiment, the 1 liquid type dispenser 18 which uses the liquid resin 25 produced | generated by mixing the main ingredient and the hardening | curing agent previously was shown. Not only this but also in the case of using a two-component mixing type dispenser in which the main agent and the curing agent are mixed and used in the dispenser when actually used, the same applies if the resin discharge part in each embodiment is applied. There is an effect.

  In each of the embodiments, the example in which the liquid resin 25 is supplied to the cavity 16 using the cavity 16 provided in the lower mold 14 as a housing portion has been described. In addition to the cavity, the accommodating portion may be any of the following.

  First, the accommodating portion is a space including the upper surface of the substrate and includes a chip (an electronic component chip such as a semiconductor chip or a non-semiconductor chip in which no semiconductor is used) mounted on the upper surface of the substrate. It is. The liquid resin 25 is supplied so as to cover the chip mounted on the upper surface of the substrate. In this case, it is preferable to perform electrical connection between the chip and the substrate by flip chip.

  Secondly, the accommodating portion is a space including the upper surface of a semiconductor substrate such as a silicon wafer. The liquid resin 25 is supplied so as to cover a functional part such as a semiconductor circuit formed on the semiconductor substrate. In this case, it is preferable that a protruding electrode (bump) is formed on the upper surface of the semiconductor substrate.

  Third, the accommodating portion is a space including the upper surface of the film that is to be finally accommodated in the cavity of the mold. The accommodating part in this case is a recessed part formed, for example, when a film is dented. The liquid resin 25 is supplied to the recess formed by the depression of the film. Examples of the purpose of the film include improvement of releasability, transfer of a shape composed of irregularities on the surface of the film, and transfer of a pattern formed in advance on the film. The liquid resin accommodated in the concave portion of the film is conveyed together with the film using an appropriate conveyance mechanism, and finally accommodated in the cavity of the mold.

  In any of the first to third cases, the liquid resin 25 accommodated in the accommodating portion is finally supplied and accommodated inside the cavity of the mold, and is cured inside the cavity.

  In any of the first to third cases, the liquid resin 25 is supplied to the accommodating portion outside the pair of opposing molds, and the components including at least the accommodating portion are conveyed between the molds. Can do.

  In each embodiment, the resin molding apparatus and the resin molding method used when resin-sealing a semiconductor chip have been described. The target for resin sealing may be a semiconductor chip such as an IC or a transistor, or a non-semiconductor chip. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a lead frame, a printed circuit board, or a ceramic substrate is sealed with a cured resin.

  In addition, the present invention is applied not only to resin-sealing electronic components, but also to optical components such as lenses, reflectors (reflecting plates), light guide plates, optical modules, and other resin products manufactured by resin molding. can do.

  The present invention is not limited to each of the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is.

DESCRIPTION OF SYMBOLS 1 Resin molding apparatus 2 Substrate supply / storage module 3A, 3B, 3C, 3D Molding module 4 Resin supply module 5 Pre-sealing substrate 6 Pre-sealing substrate supply unit 7 Sealed substrate 8 Sealed substrate storage unit 9 Loader 10 Unloader 11 Rail 12, 13 Movement mechanism 14 Lower mold (molding mold)
15 Mold Clamping Mechanism 16 Cavity 17 Resin Transport Mechanism 18 Dispenser (Resin Discharge Mechanism, Fluid Material Discharge Device)
19, 46 Resin discharge part 20 Movement mechanism 21 Vacuum suction mechanism 22 Control part 23 Chip 24 Upper mold (molding mold)
25 Liquid resin (flowable resin, flowable material)
26 Cured Resin 27 Molded Product 28 Resin Delivery Mechanism 29 Syringe 30 Resin Transfer Part 31 Servo Motor 32 Ball Screw 33 Slider 34 Rod 35 Plunger 36 Encoder 37 Resin Discharge Port (Discharge Port)
38, 47 Flow path member 39, 48 Nozzle 40 Resin inlet (inlet)
41 Branch channel 42 Resin channel 42a Parallel channel (Branch channel)
43, 49 Rotating shaft (interlocking mechanism)
44 spiral groove 44a linear groove 45 rotator 50 support member 51 pulley (rotary plate, interlocking mechanism)
52 Belt (interlocking mechanism)
53 Gears (rotary plate, interlocking mechanism)
54 Gear (interlocking mechanism)
55 Motor (rotating mechanism)
56 Pulley (interlocking mechanism)
57 Gear (Rotation mechanism)

Claims (14)

A molding die in which a cavity is provided in at least one of an upper die and a lower die arranged to face each other;
A resin discharge mechanism for discharging the flowable resin to supply the flowable resin to the cavity;
A mold clamping mechanism for clamping the mold;
The resin discharge mechanism is
A flow path member having a branch flow path branched between an inlet and an outlet of the fluid resin;
A rotating body that is disposed in each of the branch flow paths and is rotatable with the passage of the fluid resin;
A resin molding apparatus comprising: an interlocking mechanism for rotating each of the rotating bodies disposed in the branch flow path in conjunction with each other. In the resin molding apparatus described in claim 1,
The branch channel is branched into two so as to extend in opposite directions in one axis,
The interlocking mechanism is a rotating shaft common to the two rotating bodies corresponding to the branch flow path,
The two rotating bodies are resin molding apparatuses that are cylindrical members having spiral grooves whose directions are opposite to each other. In the resin molding apparatus described in claim 1,
The branch flow path includes a plurality of parallel flow paths arranged in parallel,
The rotating body is disposed in each of the parallel flow paths,
The interlocking mechanism is a resin molding apparatus including a rotation shaft provided in each of the rotating bodies in the parallel flow path and a rotation plate connected to the rotation shaft. In the resin molding apparatus described in Claim 3,
The rotating plate is a pulley;
The interlocking mechanism includes a belt that connects the pulleys corresponding to the plurality of rotating bodies,
Each said rotary body is a resin molding apparatus which is a cylindrical member which has the helical groove | channel where the direction was equal. In the resin molding apparatus described in Claim 3,
The rotating plate is a first gear;
The first gears corresponding to the adjacent rotating bodies are arranged so as to mesh with each other,
The said adjacent rotary body is a resin molding apparatus which is a cylindrical member which has the helical groove | channel where the direction is mutually opposite. In the resin molding apparatus described in Claim 3,
The rotating plate is a first gear;
The interlocking mechanism includes a second gear disposed so as to mesh with both of the first gears corresponding to the adjacent rotating bodies,
Each said rotary body is a resin molding apparatus which is a cylindrical member which has the helical groove | channel where the direction was equal. In the resin molding apparatus as described in any one of Claims 1-6,
A resin molding apparatus comprising a rotation mechanism that applies a rotational force to the rotating body. In the resin molding apparatus according to claim 1,
Comprising at least one molding module having the molding die and the clamping mechanism;
A resin molding apparatus in which the one molding module and another molding module can be attached and detached. A resin discharge step of discharging the flowable resin to supply the flowable resin to the cavity using a mold in which a cavity is provided in at least one of an upper mold and a lower mold disposed to face each other;
A clamping step of clamping the molding die supplied with the flowable resin,
In the resin discharge step, the flowable resin is respectively rotated by rotating a rotating body disposed in each of the branch flow paths branched between the inflow port and the discharge port of the flowable resin. A resin molding method in which the rotating body is passed. In the resin molding method according to claim 9,
The branch channel is branched into two so as to extend in opposite directions in one axis,
The two rotating bodies are cylindrical members having spiral grooves whose directions are opposite to each other. The two rotating bodies are rotated by using a rotating shaft common to the two rotating bodies corresponding to the branch flow path. A resin molding method that rotates in conjunction with the body. In the resin molding method according to claim 9,
The branch flow path includes a plurality of parallel flow paths arranged in parallel,
The rotating body is disposed in each of the parallel flow paths,
A resin molding method in which a rotating plate connected to a rotating shaft provided in each of the rotating bodies in the parallel flow path is rotated in conjunction with each other. A flow path member having a branch flow path branched between the inlet and the outlet of the flowable material;
A rotating body that is disposed in each of the branch flow paths and is rotatable with the passage of the flowable material;
A fluidity material discharge device comprising: an interlocking mechanism for interlockingly rotating each of the rotating bodies arranged in the branch flow path. In the discharge apparatus of the fluid material described in Claim 12,
The branch channel is branched into two so as to extend in opposite directions in one axis,
The interlocking mechanism is a rotating shaft common to the two rotating bodies corresponding to the branch flow path,
The two rotating bodies are fluid material discharge devices, which are cylindrical members having spiral grooves whose directions are opposite to each other. In the discharge apparatus of the fluid material described in Claim 12,
The branch flow path includes a plurality of parallel flow paths arranged in parallel,
The rotating body is disposed in each of the parallel flow paths,
The interlocking mechanism is a fluid material discharging apparatus including a rotation shaft provided in each of the rotating bodies in the parallel flow path and a rotating plate connected to the rotation shaft.

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