TWI673155B - Extrusion device, discharge method, resin molding device, and method for producing resin molded article - Google Patents

Abstract

The present invention shortens the time required for the discharge step of a fluid resin such as a liquid resin. A dispenser (15) as a discharge device includes a syringe (20), which is an accumulation portion that accumulates a liquid resin (32) as a fluid resin, and a mechanism including at least a piston (27), which is an extrusion liquid Mechanism for extruding resin (32); ejection part (17) connected to syringe (20) and ejecting liquid resin (32); tube (36) mounted on ejection part (17) and flexible Deformation; the holder (18) can move while holding the tube (36); and the control section (31) controls the amount of movement of the holder (18).

Description

Discharge device, discharge method, resin molding device, and method for manufacturing resin molded product

The present invention relates to a discharge device, a discharge method, a resin molding device, and a method for manufacturing a resin molded product, which discharge a fluid resin such as a liquid resin onto an object to be discharged.

Conventionally, a semiconductor resin mounted on a substrate is resin-sealed using a solid resin or a liquid resin such as a granular resin or a sheet resin. For example, in Patent Document 1, as a technology for resin sealing using a liquid resin, it is described that a dispenser using a liquid resin ejection device is used to discharge a liquid from a nozzle mounted on a tip of the dispenser to a substrate.状 材料。 Resin. In addition, as shown in FIGS. 3 to 6 of Patent Document 1, it is proposed to use a weight measuring device to measure the weight of the substrate before and after the liquid resin is ejected. The weight of the resin discharged can be calculated by measuring the weight of the substrate before and after the discharge. If the weight of the discharged resin is within the allowable range, the process proceeds to the next step. When the discharged resin weight deviates from the allowable value range, a corrected resin discharged amount (= target discharged resin weight-discharged resin weight) is calculated and additional discharge is performed. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-165133

[Problems to be Solved by the Invention] However, the ejection device disclosed in Patent Document 1 has the following problems. When a liquid resin is used, the liquid resin may sag from the discharge port of the nozzle at the time when the discharge of the liquid resin is stopped. In particular, when a liquid resin having a high viscosity is used, a drooping phenomenon is remarkably generated. The liquid resin in a drooping state hangs downward from the discharge port as a residual resin. In the case of a drooping phenomenon, wait for the residual resin to fall naturally until the drooping state is eliminated. Therefore, depending on the properties of the resin or the state of hardening progress, the drooping liquid elimination time may be longer, and therefore it takes a very long time until the liquid resin ejection step is completed. In order to measure the weight of the substrate after the liquid resin is discharged, it is necessary to wait until the liquid resin discharge step is completed. Therefore, it takes a very long time to determine whether the target resin weight has been discharged, and the productivity of the discharge device is significantly reduced.

An object of the present invention is to solve the above problems, and to provide a discharge device, a discharge method, a resin molding device, and a method for manufacturing a resin molded article that can shorten the time required for the discharge step of a liquid resin such as a liquid resin. [Technical means to solve the problem]

In order to solve the above problems, the discharge device of the present invention includes an accumulation portion that accumulates a flowable resin, an extrusion mechanism that extrudes the flowable resin, a discharge portion that is connected to the accumulation portion and discharges the flowable resin, and is mounted on the discharge portion. An elastically deformable tube, a holder capable of moving while holding the tube, and a control unit that controls the amount of movement of the holder.

In order to solve the problem, the ejection method of the present invention includes an extrusion step of extruding the fluid resin accumulated in the accumulation portion, thereby ejecting the flow from the elastically deformable tube mounted on the ejection portion connected to the accumulation portion. Resin; and a scooping step, which clamps the tube with a holder and moves the holder downward, thereby scooping out the residual resin remaining in the tube. In order to solve the problem, a resin molding apparatus according to the present invention includes the discharge device. In order to solve the problem, the method for producing a resin molded article of the present invention includes the step of performing resin molding in a state where the fluid resin discharged by the discharge method is supplied to a molding die. [Effect of the invention]

According to the present invention, it is possible to shorten the time required for the discharge step of a fluid resin such as a liquid resin.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any of the figures in this application document are schematically omitted for the purpose of easy understanding and are appropriately omitted or exaggerated. The same components are denoted by the same reference numerals, and descriptions thereof are appropriately omitted. In addition, in this application document, the term "liquid" means liquid and fluid at normal temperature, regardless of the level of fluidity, in other words, the degree of viscosity. The "resin-molded product" in this application document refers to a product including at least a resin-molded resin portion, and is an expression including a concept of a post-sealed substrate as described later. A wafer mounted on a substrate is formed by resin molding and resin sealing.

[Embodiment 1] (Configuration of Resin Molding Apparatus) The configuration of a resin molding apparatus according to a first embodiment of the present invention will be described with reference to FIG. 1. The resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using a compression molding method. The first embodiment shows, for example, a case where a substrate on which a semiconductor wafer is mounted is used as a target for resin molding, and a liquid resin, which is a fluid resin, is used as a resin material. The "substrate" includes general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, and lead frames.

The resin molding apparatus 1 includes, as constituent elements, a substrate supply / storage module 2, three molding modules 3A, a molding module 3B, a molding module 3C, and a resin supply module 4. The substrate supply / storage module 2, the forming module 3A, the forming module 3B, the forming module 3C, and the resin supplying module 4 as components can be attached to and detached from each other and can be replaced.

The substrate supply / storage module 2 is provided with a pre-sealed substrate supply unit 6 that supplies a pre-sealed substrate 5, a post-sealed substrate accommodation unit 8 that houses a post-sealed substrate 7, a substrate carrier for transferring the pre-sealed substrate 5 and post-sealed substrate 7 The placement section 9 and the substrate transfer mechanism 10 for transferring the pre-sealed substrate 5 and the post-sealed substrate 7. The predetermined position S1 is a position that stands by while the substrate transfer mechanism 10 is not operating.

Each forming module 3A, forming module 3B, and forming module 3C is provided with a lower mold 11 that can be raised and lowered and an upper mold (not shown, see (a) to FIG. 5 in FIG. 5) which is arranged to face the lower mold 11. (C)). The upper die and the lower die 11 together constitute a forming die. Each of the forming module 3A, the forming module 3B, and the forming module 3C has a mold clamping mechanism 12 (a circular portion shown by a two-dot chain line in the figure) for clamping and opening the upper and lower molds 11. The lower mold 11 is provided with a cavity 13 which is a space where a liquid resin as a resin material is supplied and hardened. The lower mold 11 is provided with a release film supply mechanism 14 for supplying a long release film. Although the configuration in which the cavity 13 is provided in the lower mold 11 has been described here, the cavity may be provided in the upper mold, or may be provided in both the upper mold and the lower mold.

The resin supply module 4 is provided with a dispenser 15 and a resin transfer mechanism 16 that is a discharge device that discharges liquid resin to a molding die (cavity 13). The dispenser 15 is provided with a discharge part 17 which discharges a liquid resin in a front-end | tip part. The ejector 17 is provided with a holder 18 that can clamp an elastically deformable tube mounted on the ejector 17 (see FIG. 2 (a), FIG. 2 (b) to FIG. 3 (A), (b) of Figure 3). The configuration of the dispenser 15, the ejection unit 17, and the holder 18 will be described later with reference to parts of FIG. 2 (a), FIG. 2 (b) to FIG. 3 (a), and FIG. 3 (b) For details. The predetermined position R1 is a position in which the resin conveying mechanism 16 (including the dispenser 15) is in a standby state in a state where it is not in operation.

The dispenser 15 shown in FIG. 1 is a one-liquid type dispenser using a liquid resin obtained by mixing a base agent and a hardener in advance. As the main agent, for example, a silicone resin or epoxy resin having thermosetting properties is used. It is also possible to use a two-liquid mixing type dispenser which mixes a main agent and a hardener when discharging a liquid resin.

The resin supply module 4 is provided with a control unit CTL that controls the operation of the resin molding apparatus 1. The control unit CTL controls the conveyance of the front substrate 5 and the back substrate 7, the conveyance of the dispenser 15, the discharge of the liquid resin, the heating of the mold, and the opening and closing of the mold. In other words, the control unit CTL controls each operation of the substrate supply / storage module 2, the molding module 3A, the molding module 3B, the molding module 3C, and the resin supply module 4.

The position of the arrangement control section CTL may be any position, and may be placed in at least one of the substrate supply / storage module 2, the molding module 3A, the molding module 3B, the molding module 3C, and the resin supply module 4. Placed outside each module. In addition, the control unit CTL may be configured in the form of a plurality of control units that are separated at least in part according to an operation to be controlled.

(Configuration of Dispenser) Referring to FIGS. 2 (a), 2 (b) to 3 (a), and 3 (b), the dots used in the resin molding apparatus 1 shown in FIG. 1 are referred to. The configuration of the melter 15 will be described. As shown in FIGS. 2 (a) and 2 (b), the dispenser 15 includes an extrusion mechanism 19 that extrudes a liquid resin, a syringe 20 that accumulates a liquid resin, and a syringe 20 that connects the syringe 20 and a nozzle. The connection part 21 and the nozzle 22 which discharges a liquid resin. The dispensing machine 15 is integrally formed by connecting the extrusion mechanism 19, the syringe 20, the connecting portion 21, and the nozzle 22. The syringe 20 or the nozzle 22 may be replaced with another syringe or a nozzle according to the respective application.

The extrusion mechanism 19 includes a servo motor 23, a ball screw 24 rotated by the servo motor 23, a slider 25 mounted on a ball screw nut (not shown) and converting a rotary motion into a linear motion, and a A rod 26 having a front end and an insertion hole inside, and a piston 27 attached to the front end of the rod 26. The ball screw 24 is supported by a ball screw bearing 28. The slider 25 moves in the Y direction along, for example, a guide rail 29 provided on a base of the extrusion mechanism 19. When the servo motor 23 rotates, the piston 27 moves in the Y direction via the ball screw 24, the slider 25, and the rod 26, respectively.

The servo motor 23 is a motor that can control the rotation of the motor. The servo motor 23 has an encoder 30 that is a rotation detector that monitors the rotation of the motor. The encoder 30 detects a rotation angle and a rotation speed of the servo motor 23 and feeds it back to the control unit 31. The control unit 31 controls the rotation of the servo motor 23 based on a feedback signal from the encoder 30. By controlling the rotation of the servo motor 23, position control, speed control, torque control, and the like of the piston 27 can be performed with high accuracy. The control unit 31 may be incorporated in the control unit CTL of the resin molding apparatus 1 shown in FIG. 1, or may be provided independently of the control unit CTL.

The syringe 20 having the liquid resin 32 accumulated therein is connected to the extrusion mechanism 19 by a syringe mounting screw 33. The piston 27 is inserted into the syringe 20 so that the outer diameter of the piston 27 matches the inner diameter of the syringe 20. An O-ring (not shown) as a sealing material is attached around the piston 27. The movement amount (stroke amount) of the piston 27 is controlled by controlling the rotation of the servo motor 23. The discharge amount of the liquid resin 32 discharged from the dispenser 15 (the discharge portion 17) is set based on the product of the internal cross-sectional area of the syringe 20 and the movement amount of the piston 27. By replacing the syringe 20, the resin amount of the liquid resin 32 accumulated in the dispenser 15 can be arbitrarily set.

As shown in FIGS. 2 (b), 3 (a), and 3 (b), the discharge unit 17 includes a nozzle 22 having a discharge port 34, a joint 35 attached to the discharge port 34, and a sleeve. Elastically deformable tube 36 on the joint 35. As the material of the joint 35, for example, heat-resistant polyethylene, polypropylene, polyvinylidene fluoride (PolyVinylidene DiFluoride, PVDF), or the like is used. As the tube 36, for example, silicone rubber, fluorine rubber, and the like having flexibility and heat resistance are used.

As shown in FIG. 2 (a), FIG. 3 (a), and FIG. 3 (b), in the dispenser 15, two sides of the tube 36 are provided with clamps that can be moved while holding the tube 36.器 18。 18. The holder 18 includes a pair of roller support members 37 and a roller support member 38. The roller supporting member 37 is, for example, a rod-shaped member 37a along the Y direction, two rod-shaped members 37b connected to both ends of the rod-shaped member 37a and along the X-direction, and connected to each rod-shaped member 37b and It consists of two rod-shaped members 37c along the Z direction. Similarly, the drum support member 38 is composed of one rod-shaped member 38a along the Y direction, two rod-shaped members 38b connected to both ends of the rod-shaped member 38a and along the X direction, and each rod-shaped member 38b. The two rod-shaped members 38c connected to each other along the Z direction are configured.

A roller 39 and a roller 40 are rotatably mounted on the roller support member 37 and the roller support member 38 constituting the holder 18, respectively. That is, the drum 39 and the drum 40 are rotatably supported by the drum support member 37 and the drum support member 38, respectively. The roller 39 is placed on a rod-shaped member 37 a constituting the holder 18, moves in the X direction by the rod-shaped member 37 b, and moves in the Z-direction by the rod-shaped member 37 c. Similarly, the drum 40 is sleeved on the rod-shaped member 38a constituting the holder 18, moves in the X direction by the rod-shaped member 38b, and moves in the Z-direction by the rod-shaped member 38c.

As shown in FIGS. 3 (a) and 3 (b), the two rod-shaped members 37 c constituting the holder 18 are connected to the connection member 41. The connection member 41 is connected to a moving mechanism 42 that moves the roller supporting member 37 in the X direction, and is connected to a moving mechanism 43 that moves the roller supporting member 37 in the Z direction. Similarly, the two rod-shaped members 38 c constituting the holder 18 are connected to the connection member 44. The connection member 44 is connected to a moving mechanism 45 that moves the roller supporting member 38 in the X direction, and is connected to a moving mechanism 46 that moves the roller supporting member 38 in the Z direction.

The moving mechanism 42, the moving mechanism 43, the moving mechanism 45, and the moving mechanism 46 are constituted by a combination of a driving source and a transmission member. For example, as the moving mechanism, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a rod are used. In addition, the moving mechanism is not limited to the above-described configuration, and may be any configuration that can move the roller support member 37 and the roller support member 38 in the X direction and the Z direction, respectively.

As shown in FIG. 2 (a), FIG. 3 (a), and FIG. 3 (b), the liquid resin 32 accumulated in the syringe 20 is extruded by the piston 27, and is formed through the connecting portion 21 respectively. The resin passage 47, the discharge port 34 formed in the nozzle 22, and the tube 36 sleeved on the joint 35 are discharged downward from the discharge portion 17.

(Method for Discharging Liquid Resin and Method for Manufacturing Resin Molded Product) Hereinafter, the method for discharging the liquid resin and the method for producing the resin molded product will be described. Description of the action. After describing the discharge method using the dispenser 15, the manufacturing method of the resin molded product using the entire resin molding apparatus 1 is described.

(Method for ejecting liquid resin (extrusion step and extrusion step) Refer to FIG. 2 (a), FIG. 2 (b) to FIG. 4 (a), FIG. 4 (b), FIG. 4 (c) ), (D) of FIG. 4, the step of extruding the liquid resin 32 in the dispenser 15 and the step of removing the residual resin remaining in the tube 36 by the holder 18, that is, the step including the liquid resin The ejection method (extrusion step) of the extrusion step and the extrusion step will be described.

As shown in FIG. 2 (a), in the extrusion step, by rotating the servo motor 23, the piston 27 is moved in the −Y direction via the ball screw 24, the slider 25, and the rod 26. By moving the piston 27 in the -Y direction, the liquid resin 32 accumulated in the syringe 20 is squeezed, and the liquid resin 32 is squeezed in the -Y direction.

As shown in FIGS. 3 (a), 3 (b), and 4 (a), the liquid resin 32 extruded from the piston 27 passes from the discharge portion through the connection portion 21, the nozzle 22, and the tube 36, respectively. 17 (front end of the tube 36) and spit downward.

When the discharge of the dispenser 15 is started (the extrusion operation of the piston 27 is started), the liquid resin is discharged from the discharge portion 17 (the front end of the tube 36) toward the discharge object. The liquid resin 32 is pressed by the piston 27 to apply pressure to the liquid resin 32 in the syringe 20, and the resin pressure of the liquid resin 32 becomes high. Even if the discharge of the dispenser 15 is stopped (the extrusion operation of the piston 27 is stopped), the liquid resin 32 in the syringe 20 remains in a state where the resin pressure has become high. Until the resin pressure of the liquid resin 32 in the syringe 20 reaches the atmospheric pressure, the liquid resin is continuously ejected from the ejection unit 17 toward the ejection target due to the resin pressure of the liquid resin 32. As a so-called drooping phenomenon, the liquid resin hangs down from the ejection part 17 toward the ejection target (continuous ejection).

In order to easily understand the ejection step in the ejection step of the liquid resin, as shown in FIG. 4 (a), in a state immediately after the extrusion operation of the piston 27 is stopped, the syringe 20 is moved for convenience. The liquid resin accumulated therein is referred to as a liquid resin 32, the liquid resin remaining in the tube 36 is referred to as a residual resin 48, and the liquid resin dropped from the tip of the tube 36 is referred to as a liquid resin 49.

Referring to FIGS. 4 (a) to 4 (d), a scooping step is described, which uses the holder 18 provided in the discharge section 17 of the dispenser 15 to leave the inside of the tube 36. The residual resin 48 and the liquid resin 49 hanging from the front end of the tube 36 are scooped out, and the discharge is completed as soon as possible.

First, as shown in FIG. 4 (a), when the dispensing of the dispenser 15 is stopped (stopping the squeeze operation of the piston 27) and a drooping phenomenon occurs, for example, the squeeze operation of the piston 27 is stopped for 5 seconds. After the clock, the holder 18 is lowered to a predetermined position outside the tube 36. Specifically, the roller supporting member 37 and the roller supporting member 38 are lowered by using the moving mechanism 43 and the moving mechanism 46 (see FIG. 3 (b)), thereby stopping the roller 39 and the roller 40 at predetermined positions outside the tube 36. .

Next, as shown in FIG. 4 (b), the tube 36 is clamped from both sides by the clamper 18. Specifically, the roller supporting member 37 is moved in the -X direction using the moving mechanism 42 (see FIG. 3 (b)), and the roller supporting member 38 is moved to + X using the moving mechanism 45 (see FIG. 3 (b)). Move in the direction. Thereby, the tube 36 is clamped from both sides by the roller 39 and the roller 40, and the passage of the liquid resin (residual resin 48) in the tube 36 is blocked.

Then, as shown in FIG. 4 (c), the holder 18 (the drum 39, the drum 40) is used to hold the tube 36 from both sides, and the holder 18 is lowered by a predetermined stroke amount. Specifically, the roller supporting member 37 and the roller supporting member 38 are lowered using the moving mechanism 43 and the moving mechanism 46 (see FIG. 3 (b)). In a state where the tube 36 is held by the drum 39 and the drum 40, the drum 39 and the drum 40 are lowered while rotating. Thereby, the residual resin 48 remaining below the position where the tube 36 is held by the drum 39 and the drum 40 and the drool resin 49 hanging down from the front end of the tube 36 are forced out by the holder 18.

By using the liquid resin extruding step of the holder 18, for example, when a liquid resin with a low viscosity is used, the residual resin 48 remaining in the tube 36 and the secondary tube 36 can be lowered by lowering the holder 18 Almost all of the drool resin 49 hanging down from the front end is scooped out. When a liquid resin having a high viscosity is used, the string-shaped residual resin 50 may remain slightly as shown in FIG. 4 (c). However, the string-shaped residual resin 50 falls in a short time, so the time loss is not so great. The liquid resin can be ejected as early as possible by performing the liquid resin ejection step using the holder 18. The ejection step can be completed as described above.

In addition, after the state where the string-shaped residual resin 50 contacts the object to be discharged is eliminated, a dish-like resin receiving member may be disposed below the string-shaped residual resin 50, and the resin-receiving member may receive the string-shaped residual resin 50. In the state, the dispenser 15 is moved relatively to the object to be ejected as described later to avoid it.

Then, as shown in FIG. 4 (d), the holder 18 is moved away from the tube 36 and returned to the original position. Thereby, the tube 36 is released from the elastically deformed state, and returns to the initial state. As time passes, the inside of the tube 36 returns to the initial state filled with the liquid resin 32. In addition, a space in which the liquid resin 32 does not exist due to the surface tension of the liquid resin 32 may occur near the lower end portion of the tube 36.

(Manufacturing Method of Resin Molded Article) Referring to FIGS. 1 and 5 (a) to 5 (c), a resin molded product in a case where a semiconductor wafer mounted on a substrate is resin-sealed in the resin molding apparatus 1 is described. The manufacturing method will be described. The operation of the resin molding apparatus 1 will be described when a molding module 3B is used.

First, as shown in FIG. 1, with respect to the sealed front substrate 5 on which a plurality of semiconductor wafers 51 (see FIG. 5 (a)) is mounted, the side on which the semiconductor wafer 51 is mounted is the lower side, and the sealed front substrate 5 is removed from The substrate supply part 6 before sealing is sent out to the substrate mounting part 9. Then, the substrate transfer mechanism 10 is moved from the predetermined position S1 to the −Y direction to receive the pre-sealed substrate 5 from the substrate mounting portion 9. The substrate transfer mechanism 10 is returned to the predetermined position S1.

Then, for example, the substrate transfer mechanism 10 is moved to the + X direction to the predetermined position M1 of the forming module 3B. Next, in the forming module 3B, the substrate transfer mechanism 10 is moved in the -Y direction, and stopped at a predetermined position C1 above the lower mold 11. Then, the substrate transfer mechanism 10 is raised, and the sealed front substrate 5 is fixed to the mold surface of the upper mold 52 by suction, clamping, or the like (see FIG. 5 (a)). The upper die 52 and the lower die 11 together form a forming die 53. The substrate transfer mechanism 10 is returned to the predetermined position S1 of the substrate supply / storage module 2.

Next, in the molding module 3B, a long release film 54 (see FIG. 5 (a)) is supplied to the lower mold 11 from the release film supply mechanism 14. Then, the release film 54 is adsorbed along the mold surface of the cavity 13 by an adsorption mechanism (not shown) provided in the lower mold 11.

Then, the resin dispenser 15 is used to move the dispenser 15 to the −X direction to the predetermined position M1 of the molding module 3B. Next, in the molding module 3B, the resin transfer mechanism 16 is moved in the -Y direction to stop the dispenser 15 at a predetermined position C1 above the lower mold 11 (see (a) of FIG. 5).

As shown in FIG. 5 (a), the dispenser 15 is arranged at a predetermined position between the upper mold 52 and the lower mold 11 by the resin transfer mechanism 16. The liquid resin 32 is discharged from the discharge portion 17 provided at the front end of the dispenser 15 into the cavity 13. In this case, the cavity 13 of the lower mold 11 becomes an object to be ejected from the liquid resin 32. Residual resin 48 installed in the tube 36 in the discharge portion 17 and liquid resin 49 hanging down from the tip of the tube 36 are extracted by the gripper 18 (see FIGS. 4 (a) to 4 (d)) . The liquid resin can be discharged into the cavity 13 as early as possible through the discharge step. The resin transfer mechanism 16 is used to return the dispenser 15 to the predetermined position M1.

Then, as shown in FIG. 5 (b), the liquid resin 32 is heated and melted to generate a fluid resin 55 having a reduced viscosity. The lower mold 11 is raised using the mold clamping mechanism 12 (see FIG. 1), and the upper mold 52 and the lower mold 11 are clamped. By performing mold clamping, the semiconductor wafer 51 mounted on the sealed front substrate 5 is immersed in the fluid resin 55 generated in the cavity 13. At this time, a predetermined resin pressure may be applied to the fluid resin 55 in the cavity 13 using a cavity bottom member (not shown) provided in the lower mold 11.

In addition, during the mold clamping process, a vacuum suction mechanism (not shown) may be used to evacuate the inside of the mold cavity 13. Thereby, air remaining in the cavity 13 or air bubbles contained in the fluid resin 55 are discharged to the outside of the forming mold 53. The inside of the cavity 13 is set to a predetermined degree of vacuum.

Then, a heater (not shown) provided in the lower mold 11 is used to heat the fluid resin 55 for the time required to harden the fluid resin 55. The flowable resin 55 is cured to form a cured resin 56. Thereby, the semiconductor wafer 51 mounted on the sealing front substrate 5 is resin-sealed with the hardened resin 56 formed in accordance with the shape of the cavity 13. The resin molding step can be performed in this manner.

Then, as shown in FIG. 5 (c), after the flowable resin 55 is cured, the upper mold 52 and the lower mold 11 are opened using the mold clamping mechanism 12. A resin-sealed resin molded article 57 (sealed substrate 7) is fixed to the die surface of the upper die 52.

Next, the substrate transfer mechanism 10 is moved from the predetermined position S1 of the substrate supply / storage module 2 to the predetermined position C1 above the lower mold 11 to receive the sealed substrate 7. Then, the substrate transfer mechanism 10 is moved to transfer the sealed substrate 7 to the substrate mounting portion 9. The post-sealed substrate 7 is accommodated in the post-sealed substrate storage portion 8 from the substrate mounting portion 9. In this stage, resin sealing is completed.

In addition, the resin-molded product 57 (the sealed substrate 7) may cut a region where the semiconductor wafer 51 is mounted one by one, and the cut regions may become products. In addition, a part of the area on which the semiconductor wafer 51 is mounted may be cut, so that the part of the area becomes a product. Furthermore, the resin molded article 57 itself may be a single product.

(Effects and Effects) The dispenser 15 as the discharge device of the present embodiment is configured to include the following components: a syringe 20 that is an accumulation portion that accumulates a liquid resin 32 that is a fluid resin; and a mechanism that includes at least a piston 27 It is an extrusion mechanism for extruding the liquid resin 32; the ejection part 17 is connected to the syringe 20 and ejects the liquid resin 32; the tube 36 is installed on the ejection part 17 and can be elastically deformed; the holder 18 can be The gripping tube 36 moves; and the control section 31 controls the amount of movement of the gripper 18.

With such a configuration, the holder 36 can be used to hold the tube 36 mounted on the discharge portion 17 of the dispenser 15 and the holder 18 can be lowered. The residual resin 48 is forcibly scooped out. Thereby, the liquid resin can be discharged from the discharge part 17 of the dispenser 15 as early as possible. That is, the time required for the discharge step of a fluid resin such as a liquid resin can be shortened. Therefore, the productivity of the resin molded article manufactured by performing the discharge process of a fluid resin can be improved.

The discharge method according to this embodiment includes an extrusion step of extruding the liquid resin 32, which is a fluid resin accumulated in the syringe 20, which is an accumulation portion, thereby allowing elasticity to be attached to the discharge portion 17, which is connected to the syringe 20. The liquid resin 32 is ejected from the deformed tube 36; and an extruding step of holding the tube 36 by the holder 18 and moving the holder 18 downward, thereby removing the residual resin 48 remaining in the tube 36.

According to the method, the holder 36 can be used to hold the tube 36 mounted on the discharge portion 17 of the dispenser 15 and lower the holder 18, and the holder 18 can be used to remove residual resin remaining in the tube 36. 48 forced out. Thereby, the liquid resin can be discharged from the discharge part 17 of the dispenser 15 as early as possible. That is, the time required for the discharge step of a fluid resin such as a liquid resin can be shortened. Therefore, the productivity of the resin molded article manufactured by discharging a fluid resin can be improved.

According to this embodiment, an elastically deformable tube 36 is attached to the discharge portion 17 of the dispenser 15. Holders 18 are provided on both sides of the tube 36 and can be moved while holding the tube 36. Even if a drool occurs from the discharge portion 17 of the dispenser 15, the tube 36 can be held by the holder 18 and lowered by the holder 18, and the residual resin remaining in the tube 36 can be held by the holder 18 48 and drooping resin 49 hanging from the front end of the tube 36 are forced out.

According to this embodiment, there is no need to wait for the liquid resin remaining and hanging in the discharge portion 17 of the dispenser 15 to fall naturally, but to forcefully eject it using the holder 18. This can shorten the time for discharging the liquid resin. Therefore, the production efficiency of the dispenser 15 can be improved. In addition, the productivity of the resin molding apparatus 1 can be improved.

According to this embodiment, the residual resin 48 remaining in the tube 36 and the liquid resin 49 hanging from the front end of the tube 36 can be forced out by the holder 18, thereby shortening the time required for the ejection step. Thereby, it is possible to prevent the liquid resin 49 from being scattered to the component parts and the like around the cavity 13 which is an object to be ejected due to the liquid resin 49 being placed. Therefore, the resin molding device 1 can be prevented from being contaminated by the scattered resin. In addition, it is possible to prevent the scattered resin from being hardened and cause malfunction of the resin molding apparatus 1.

According to this embodiment, the holder 18 can be used to spit the liquid resin into the mold cavity 13 as soon as the liquid resin 49 is not left for a long time. Therefore, unevenness in distribution and thickness of the liquid resin supplied into the cavity 13 can be suppressed. This makes it possible to reduce variations in the resin thickness of the resin-molded resin-molded product 57. In addition, it is possible to reduce the occurrence of contour defects such as flow marks.

In the present embodiment, the case where the dispenser 18 stops the ejection operation (the piston 27 stops the extrusion operation), the holder 18 clamps the tube 36 and scoops out the residual resin 48 in the tube 36. Not limited to this, the operation of holding the tube 36 by the holder 18 may be performed while the piston 27 stops the extrusion operation, or the holding of the tube 36 by the holder 18 may be performed at a stage just before the piston 27 stops the extrusion operation. Actions.

In addition, in the present embodiment, the resin molding apparatus 1 has been described with a configuration including a substrate supply / storage module 2, three molding modules 3A, a molding module 3B, a molding module 3C, and a resin supply module 4. . However, the resin molding apparatus is not limited to the above-mentioned configuration, and it may be a device having at least a molding die, a discharging device for discharging liquid resin, and a mold clamping mechanism for clamping the molding die, and having a function of performing resin molding.

[Embodiment 2] (Modification 1 of Dispenser) The dispenser used in Embodiment 2 will be described with reference to FIGS. 6 (a) to 6 (b). The difference from Embodiment 1 is that the configuration of the holder is changed in the dispenser. The other configurations are the same as those of the first embodiment, and therefore the same components are denoted by the same reference numerals, and descriptions thereof will be omitted.

As shown in FIGS. 6 (a) to 6 (b), in the dispenser 58, holders 59 that can move and hold the tube 36 are provided on both sides of the tube 36. The holder 59 includes a pair of roller support members 60 and a roller support member 61. The drum support member 60 is formed by a rod-shaped member 60a along the Y direction, a rod-shaped member 60b connected to one end of the rod-shaped member 60a and along the X direction, and a rod-shaped member 60b connected to and along the Z It consists of one rod-shaped member 60c in the direction. Similarly, the drum support member 61 is composed of one rod-shaped member 61a along the Y direction, one rod-shaped member 61b connected to one end of the rod-shaped member 61a and along the X direction, and connected to the rod-shaped member 61b and It consists of one rod-shaped member 61c along the Z direction.

As in the first embodiment, a roller 39 and a roller 40 are rotatably attached to the roller supporting member 60 and the roller supporting member 61 constituting the holder 59, respectively. That is, the drum 39 and the drum 40 are rotatably supported by the drum support member 60 and the drum support member 61, respectively. The drum 39 is sleeved on the rod-shaped member 60 a constituting the holder 59, moves in the X direction by the rod-shaped member 60 b, and moves in the Z-direction by the rod-shaped member 60 c. Similarly, the drum 40 is sleeved on the rod-shaped member 61a constituting the holder 59, moves in the X direction by the rod-shaped member 61b, and moves in the Z-direction by the rod-shaped member 61c.

One rod-shaped member 60 c constituting the holder 59 is connected to the connection member 62. The connecting member 62 is connected to a moving mechanism 42 that moves the roller supporting member 60 in the X direction, and is connected to a moving mechanism 43 that moves the roller supporting member 60 in the Z direction. Similarly, one rod-shaped member 61 c constituting the holder 59 is connected to the connection member 63. The connecting member 63 is connected to a moving mechanism 45 that moves the roller supporting member 61 in the X direction, and is connected to a moving mechanism 46 that moves the roller supporting member 61 in the Z direction.

The operation of holding the tube 36 from both sides by the holder 59 and lowering the drum 39 and the drum 40 while rotating is the same as that of the first embodiment. Therefore, similarly to the first embodiment, the residual resin 48 remaining in the tube 36 can be forced out by the holder 59. Thereby, the liquid resin can be discharged from the discharge part 17 of the dispenser 58 as early as possible.

According to this embodiment, in the dispenser 58, the roller support member 60 and the roller support member 61 constituting the holder 59 are constituted by a rod-shaped member 60a, a rod-shaped member 60b, a rod-shaped member 60c, and a rod-shaped member, respectively. 61a, a rod-shaped member 61b, and a rod-shaped member 61c. Therefore, the configuration of the holder 59 can be further simplified, and the cost of the dispenser 58 can be reduced.

In the present embodiment, in the dispenser 58, the roller support member 60 and the roller support member 61 (specifically, the roller 39 and the roller 40) constituting the holder 59 are arranged in parallel and are clamped from both sides The constitution of the tube 36. Not limited to this, for example, the tube 36 may be held by a roller supporting member (roller) that is centered on the fulcrum and opened to both sides like scissors. By setting it as such a structure, operation | movement of a holder can be made simple, and the movement mechanism of a holder can be simplified further.

[Embodiment 3] (Modification 2 of Dispenser) A dispenser used in Embodiment 3 will be described with reference to FIGS. 7 (a) to 7 (c). The difference from Embodiment 1 is that in the dispenser, a holder is provided with a roller support member and a roller on one side, and a fixing plate fixed to the discharge portion is provided on the other side. The other configurations are the same as those of the first embodiment, and therefore the same components are denoted by the same reference numerals, and descriptions thereof will be omitted.

As shown in FIGS. 7 (a) to 7 (c), in the dispenser 64, the discharge unit 65 includes a nozzle 22 having a discharge port 34, a joint 35 attached to the discharge port 34, and a sleeve. An elastically deformable tube 36 on the joint 35 and a fixing plate 66 fixed on the nozzle 22. The fixing plate 66 and the tube 36 are arranged in contact with the discharge portion 65.

A holder 67 is provided on the opposite side of the fixed plate 66 to move the tube 36. The gripper 67 is configured using the same roller support member as the roller support member 37 shown in the first embodiment. The roller supporting member 37 is composed of one rod-shaped member 37a along the Y direction, two rod-shaped members 37b connected to both ends of the rod-shaped member 37a and along the X-direction, and connected to each of the rod-shaped members 37b. It is constituted by two rod-shaped members 37c facing the Z direction. It is also considered that the fixing plate 66 functions as a holder.

A roller 39 is rotatably mounted on a roller supporting member 37 constituting the holder 67. That is, the drum 39 is rotatably supported by the drum support member 37. The roller 39 is sleeved on the rod-shaped member 37a constituting the holder 67, moves in the X direction by the rod-shaped member 37b, and moves in the Z-direction by the rod-shaped member 37c. The configuration and operation of the connection member 41, the moving mechanism 42, and the moving mechanism 43 are the same as those of the first embodiment, and therefore description thereof is omitted.

Referring to FIG. 7 (c), a procedure for removing the residual resin remaining in the tube 36 by the holder 67 will be described. First, the holder 67 is lowered to a predetermined position outside the tube 36 using the moving mechanism 43. Then, the holder 67 is moved in the −X direction using the moving mechanism 42, and the tube 36 is held by the holder 67 (the drum 39) and the fixing plate 66. Next, the holder 67 is lowered while the tube 36 is held by the holder 67 and the fixing plate 66. Thereby, the remaining resin and the drooping liquid resin hanging from the front end of the tube 36 are forcibly scooped out by the roller 39 from the position where the tube 36 is held downward.

According to the present embodiment, in the dispenser 64, the fixing plate 66 is fixed to the discharge portion 65, and a holder 67 capable of holding and moving the tube 36 is provided on the opposite side of the fixing plate 66. By holding the tube 36 with the fixing plate 66 and the holder 67 and lowering the drum 39 while rotating, the holder 67 can be used to force out the residual resin remaining in the tube 36. Thereby, the liquid resin can be discharged from the discharge part 65 of the dispenser 64 as early as possible.

According to this embodiment, the dispenser 64 is provided with a fixed plate 66 and a holder 67 that can move and hold the tube 36 in the discharge portion 65. Since the holder 67 is provided only on one side, the number of moving mechanisms can be reduced by half compared to the first embodiment. Therefore, the configuration of the clamping mechanism including the holder can be further simplified, and the cost of the dispenser 64 can be further reduced.

[Embodiment 4] In Embodiment 4, the configuration in which the control unit controls the amount of movement of the holder in response to the remaining amount of the fluid resin in the accumulation unit will be described. In addition, a method of controlling the amount of movement of the holder in accordance with the remaining amount of the fluid resin in the accumulation portion in the scooping step will be described.

In the embodiment, a case where a plurality of objects to be ejected are ejected, in other words, a case where a series of extrusion steps and an ejection step are repeated a plurality of times will be described. Here, it is a structure which controls the movement amount which moves a holder according to the remaining amount of the fluid resin in an accumulation | storage part by a control part. In addition, a method is provided in which the accumulation amount of the flowable resin in the accumulation portion is an amount corresponding to a plurality of ejection objects, and the movement amount of the gripper by the control portion is for at least two of the plurality of ejection objects. But different.

(Comparative Example) Prior to the description of the present embodiment, as a comparative example, variations in the amount of resin discharged from a conventional dispenser will be described.

In a conventional dispenser, if the amount of resin discharged after a certain period of time has elapsed from the start of discharge, the amount of resin discharged onto the object to be discharged differs depending on the resin amount of the liquid resin in the syringe.

The phenomenon will be described with reference to FIGS. 8 (A) to 8 (C). As shown in FIGS. 8A to 8C, the pipe 36 and the holder 18 are not provided in the conventional dispenser. FIG. 8 (A) shows a state where the resin amount of the liquid resin 32 remaining in the syringe 20 is larger than that in other cases, and FIG. 8 (B) shows the liquid resin 32 remaining in the syringe 20 The value of the amount of resin is relatively moderate compared to other cases, and FIG. 8 (C) shows a state where the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is small compared to other cases.

In FIGS. 8 (A) to 8 (C), the piston 27 is squeezed out with the same amount of movement, and the liquid resin 32 in the syringe 20 is discharged from the discharge port of the discharge portion 17, and if sufficient Over time, the amount of resin corresponding to the amount of movement of the piston 27 is discharged.

However, after the extrusion operation of the piston 27 is stopped, the amount of resin discharged after a relatively short period of time is investigated. As a result, for example, in the case of FIGS. 8 (A) to 8 (C), (A) is the smallest. , (C) is the most, (B) is between (A) and (C).

This phenomenon is examined as follows. For example, in any of the states of FIGS. 8 (A) to 8 (C), if the piston 27 is extruded by the same amount of movement, the liquid resin 32 in the syringe 20 is compressed, and the syringe 20 is compressed. Internal stress. The stress is reduced by discharging the liquid resin 32 from the discharge port of the discharge portion 17. Even if the extrusion operation of the piston 27 is stopped, the liquid resin 32 is intended to be restored from the compressed state, so the resin is continuously discharged from the discharge portion 17.

Here, the time until the compressed liquid resin 32 is reduced, that is, the time until the stress in the syringe 20 is eliminated due to the extrusion operation of the piston 27 depends on the amount of the resin of the liquid resin 32 remaining in the syringe 20 . Regarding the time, for example, in the case of (A) to (C) of FIG. 8, (A) is the longest, (C) is the shortest, and (B) is between (A) and (C).

Therefore, the resin amount of the liquid resin 32 discharged from the discharge port of the discharge unit 17 within a certain period of time from the start of the extrusion operation of the piston 27 to the time before the stress in the syringe 20 caused by the operation disappears. It also depends on the resin amount of the liquid resin 32 remaining in the syringe 20. Regarding the amount of resin discharged in a certain period of time, for example, in the case of (A) to (C) of FIG. 8, (A) is the smallest, (C) is the largest, and (B) is (A) and ( C) between.

As described above, when the conventional dispenser of the comparative example is used, even if the amount of movement of the piston 27 caused by the extrusion operation of the piston 27 is set to be constant, the actual amount of resin discharged depends on the syringe. The balance of the liquid resin 32 in 20. In addition, it was found that it takes a considerable time to spit out the set discharge amount (weight) due to the occurrence of a dripping phenomenon. As described above, when a conventional dispenser is used, it takes a long time until a set amount of liquid resin is discharged, which becomes a problem.

(Preliminary Experiment) Next, as a preliminary experiment, refer to FIGS. 9 (A), 9 (B), 9 (C) to 10 (a), 10 (b), and 10 (c). For example, a method is described in which, using the dispenser 15 shown in FIG. 1, even when the resin amount of the liquid resin 32 remaining in the syringe 20 is changed, the set value is set from the ejection unit 17. Spit out a certain amount as soon as possible.

As shown in Embodiment 1, by holding the tube 36 mounted on the discharge portion 17 of the dispenser 15 with the holder 18 and lowering the holder 18, the holder 18 can be used to remove the remaining The residual resin 48 and the drool resin 49 hanging from the front end of the tube 36 are forcibly scooped out.

However, as explained with reference to FIGS. 8 (A) to 8 (C), it can be seen that the discharge amount of the liquid resin discharged from the discharge section 17 of the dispenser depends on the liquid resin remaining in the syringe 20. Amount of resin of 32. In this embodiment, a method for controlling the position where the tube 36 is held by the holder 18 and the position where the holder 18 is moved in accordance with the resin amount of the liquid resin 32 remaining in the syringe 20 will be described. With the stroke amount, the set constant discharge amount is discharged from the discharge portion 17 as soon as possible.

As shown in FIGS. 9 (A), 9 (B), 9 (C) to 10 (a), 10 (b), and 10 (c), for example, in the dispenser 15 In the state (A) in which the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is larger compared to other cases (A), the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is different from other cases The state (B) is relatively moderate, and the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is smaller than that in the other cases (C), respectively, and adjusted to lower the holder 18 The position where the tube 36 is clamped, and the stroke amount for moving the clamper 18. 9 (A) to 9 (C) correspond to Figs. 8 (A) to 8 (C), respectively.

As shown in FIG. 10 (a), in a state (A) in which the resin amount of the liquid resin 32 remaining in the syringe 20 is larger than that in other cases (A), the holder 18 is lowered to P1 Position and clamp tube 36. In this state, the holder 18 is lowered from the position of P1 to the position of P4 at the lower end of the pipe 36 by a predetermined stroke amount L1, and the residual resin 48 remaining in the pipe 36 and The drooping liquid resin 49 hanging down from the front end is forcibly scooped out.

Similarly, as shown in FIG. 10 (b), in the state (B) where the resin amount of the liquid resin 32 remaining in the syringe 20 is medium compared to other cases (B), the holder 18 is made Lower to position P2 and clamp tube 36. In this state, the holder 18 is lowered from the position of P2 to the position of P4 at the lower end of the tube 36 by a predetermined stroke amount L2, and the residual resin 48 in the tube 36 and the front end of the slave tube 36 are removed by the holder 18 The hanging down liquid resin 49 is forced out. In this case, the relationship between the stroke amount L2 and the stroke amount L1 for lowering the gripper 18 becomes L2 <L1.

Similarly, as shown in FIG. 10 (c), in a state (C) in which the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is smaller than in other cases, the holder 18 is made Lower to position P3 and clamp tube 36. In this state, the holder 18 is lowered from the position of P3 to the position of P4 at the lower end of the tube 36 by a predetermined stroke amount L3, and the residual resin 48 in the tube 36 and the leading end of the tube 36 are removed by the holder 18 The hanging down liquid resin 49 is forced out. In this case, the relationship between the stroke amount L3, the stroke amount L2, and the stroke amount L1 which lowers the gripper 18 becomes L3 <L2 <L1.

Here, it is preferable that the lowering stop position P4 of the holder 18 in the state of holding the tube 36 is the same, and the stroke where the holder 18 is held by the holder 18 is changed, thereby moving the holder 18.量变。 Volume change. By setting in this way, it is possible to reduce unevenness in the state after the ejection operation, and to perform a stable ejection step. Therefore, the predetermined discharge amount (weight) can be discharged from the discharge unit 17 of the dispenser 15 as early as possible. Thereby, even if the resin amount of the liquid resin 32 remaining in the syringe 20 is changed, it is possible to spit a certain discharge amount as early as possible.

(Apparatus Configuration) In this embodiment, any of the above-described Embodiments 1 to 3 may be adopted. Here, the case of using the dispenser 15 of Embodiment 1 will be described in correspondence with the explanation of preliminary experiments.

The device configuration differs from the first embodiment in that the control unit 31 (see FIGS. 2 (a) and 2 (b)) corresponds to the liquid resin 32 that is the fluid resin in the syringe 20 that is the storage unit. The remaining amount is used to control the amount of movement to move the holder 18. Furthermore, it is also different from the first embodiment in the following points: the accumulated amount of the liquid resin 32 in the syringe 20 is an amount corresponding to a plurality of objects to be ejected, and the amount of movement of the holder 18 by the control unit 31 is It differs for at least two of a plurality of ejection objects.

(Discharging Method of Liquid Resin) The discharging method of the liquid resin is different from the first embodiment in that, for example, the liquid resin 32 corresponding to the syringe 20 is set in advance experimentally as in the preliminary experiment described above. The amount of movement by which the holder 18 is moved.

When the ejection step is performed on a plurality of objects to be ejected, for example, as in the preliminary experiment, as shown in FIGS. 9 (A), 9 (B), and 9 (C) to 10 (A) ), (B), and (C) corresponding to each other and spit out to different discharge objects.

Since the liquid resin 32 is ejected from a plurality of objects to be ejected, the extrusion step and the ejection step of the liquid resin 32 are repeated multiple times. At this time, for example, as in the preliminary experiment, it corresponds to FIGS. 9 (A), 9 (B), and 9 (C) to 10 (A), (B), and (C). , And the stroke amount of the holder 18 in the multiple ejection steps is different.

Here, when the amount of resin to be discharged is controlled with high accuracy, the stroke amount of the holder 18 may be different for each object to be discharged, that is, for each discharge step. If the control of the amount of discharged resin does not require precision, it is not necessary to make the stroke amount of the gripper 18 different for each object to be ejected, that is, for each ejection step. The stroke amount of the holder 18 may be different.

The method for manufacturing a resin molded product is basically the same as that of the first embodiment, and a plurality of ejection steps corresponding to a plurality of ejection objects may be performed as described herein. In this case, the number of times the resin molding step is performed may be the same as the number of objects to be ejected or the number of times of performing the ejection step.

In this embodiment, the amount of movement of the holder is controlled in accordance with the remaining amount of the fluid resin in the syringe, which is the accumulation portion. Furthermore, the accumulation amount, that is, the remaining amount of the fluid resin in the syringe, which is the accumulation portion, is an amount corresponding to a plurality of objects to be ejected. At least two are different.

In addition, in the present embodiment, the movement amount of the gripper is controlled in accordance with the remaining amount of the fluid resin in the syringe, which is the accumulation portion, in the extraction step. Furthermore, the extrusion step and the extrusion step are repeated a plurality of times, and the amount of movement of the gripper is made different for at least two of the multiple extrusion steps.

More specifically, according to this embodiment, the tube 36 that is elastically deformable is attached to the discharge portion 17 of the dispenser 15, and the holders 18 that are capable of holding and moving the tube 36 are provided on both sides of the tube 36. According to the resin amount of the liquid resin 32 remaining in the syringe 20, the positions P1, P2, and P3 of the clamper 18 to clamp the tube 36 and the stroke amount L1 and stroke amount L2 of the holder 18 are respectively controlled. Stroke amount L3. Thereby, even if the resin amount of the liquid resin 32 remaining in the syringe 20 changes, a certain liquid resin can be discharged from the discharge part 17. Therefore, it is possible to spit a certain amount of the liquid resin from the discharge portion 17 as early as possible without depending on the resin amount of the liquid resin 32 remaining in the syringe 20. That is, it is possible to shorten the time required for the discharge step of a fluid resin such as a liquid resin, and it is possible to achieve a high precision of the discharge amount of the fluid resin. Therefore, it is possible to improve the productivity and quality stability of the resin molded article produced by discharging the fluid resin.

In this embodiment, the resin amount of the liquid resin 32 remaining in the syringe 20 is divided into three stages (A), (B), and (C), and the clamper 18 is controlled to be divided into three stages. The position P1, the position P2, the position P3 of the tube 36, and the stroke amount L1, the stroke amount L2, and the stroke amount L3 to move the gripper 18. Not limited to this, the resin amount of the liquid resin 32 remaining in the syringe 20 may be more finely divided according to the accumulation amount of the liquid resin accumulated in the syringe 20, so that the holders 18 may be more finely controlled, respectively. The position of the pinch tube 36 and the stroke amount to move the holder 18.

In addition, the diameter and length of the tube 36 mounted on the discharge portion 17 of the dispenser 15 can be arbitrarily set. If the diameter of the tube 36 is large, the liquid resin can be discharged as soon as possible. By reducing the diameter of the tube 36 and extending the length of the tube 36 to increase the stroke amount for moving the holder 18, the volume of the tube 36 to be crushed can be controlled with higher accuracy. Therefore, the discharge amount of the liquid resin to be discharged can be controlled more accurately. Regarding the diameter and length of the tube 36, productivity can be optimized in consideration of the viscosity, the discharge amount, and the like of the liquid resin.

[Embodiment 5] A configuration of a resin molding apparatus and a method of manufacturing a resin molded product according to Embodiment 5 will be described with reference to Figs. 11 to 14 (a), 14 (c), and 14 (c). The difference from the resin molding apparatus 1 of Embodiment 1 is that the object for resin molding is a circular wafer; and the liquid resin is discharged onto the discharge target, and the liquid is supplied from the discharge target to the molding die. Resin. The other configurations and operations are the same as those of the first embodiment, and therefore the same components are denoted by the same reference numerals and descriptions thereof will be omitted.

(Configuration of Resin Molding Apparatus) The configuration of the resin molding apparatus according to the fifth embodiment will be described with reference to FIG. 11. As shown in FIG. 11, the resin molding apparatus 68 includes, as constituent elements, a wafer supply / storage module 69, three molding modules 3A, a molding module 3B, a molding module 3C, and a resin supply module 4. The wafer supply / storage module 69, the forming module 3A, the forming module 3B, the forming module 3C, and the resin supplying module 4 as components can be attached to and detached from each other with respect to other components, and can be replaced.

The wafer supply / storage module 69 is provided with a pre-sealed wafer supply section 71 that supplies a pre-sealed wafer 70, a post-sealed wafer storage section 73 that houses the post-sealed wafer 72, a pre-sealed wafer 70, and A wafer mounting portion 74 of the sealed wafer 72 and a wafer transfer mechanism 75 that transfers the sealed wafer 70 and the sealed wafer 72. The pre-sealed wafer includes, for example, a wafer in which a plurality of semiconductor wafers are mounted on a wafer that becomes a support member, a wafer that has completed the pre-semiconductor step (diffusion step and wiring step), and a pre-semiconductor step that has been completed. A rewiring wafer is formed on the wafer.

Each forming module 3A, forming module 3B, and forming module 3C is provided with a lower mold 11 that can be raised and lowered, and an upper mold 52 that is disposed to face the lower mold 11 (refer to (a) to FIG. 14 to ( c)). The upper die 52 and the lower die 11 together form a forming die 53. Each of the forming modules 3A, 3B, and 3C includes a clamping mechanism 12 (a circular portion indicated by a two-dot chain line in the figure) for clamping and opening the upper mold 52 and the lower mold 11. The lower mold 11 is provided with a circular cavity 76 which is a space to which a liquid resin is supplied and cured.

The resin supply module 4 is provided with a stage 77 and a release film supply mechanism 78 that supplies a release film to the stage 77 (see FIGS. 12 (a) to 12 (d)). A resin accommodating frame 79 having a circular through-hole is placed on the release film supplied to the stage 77. The release film is integrally formed with the resin storage frame 79 to form a resin storage section (refer to FIGS. 12 (a) to 12 (d)). The resin storage section stores the resin from the dispenser 15 (see FIG. 2 (a)). ), Liquid resin discharged in (b)) of FIG. 2. The resin supply module 4 is provided with a dispenser 15 that discharges liquid resin to the resin storage section, a moving mechanism 80 that moves the dispenser 15, and a resin transport mechanism 81 that transports the resin storage section. The dispenser 15 is the same as the dispenser shown in the first embodiment. As in the first embodiment, a holder 18 is provided in the discharge portion 17 of the dispenser 15. In the present embodiment, the release film or the resin storage portion placed on the platform 77 is an object to be discharged from the liquid resin.

Regarding the release film supply mechanism 78, a release film supply mechanism that supplies a long (roll-shaped) release film to the stage 77, or a release film that supplies a cut film that is cut into short strips to the stage 77 is used. Film supply mechanism.

The wafer supply / storage module 69 is provided with a control unit CTL that controls the operation of the resin molding apparatus 68. The control unit CTL controls the conveyance of the pre-sealed wafer 70 and the post-sealed wafer 72, the movement of the dispenser 15 and the discharge of the liquid resin, the heating of the molding die, the opening and closing of the molding die, and the like.

(Manufacturing Method of Resin Molded Article) Refer to FIGS. 12 (a), 12 (b), 12 (c), 12 (d) to 14 (a), 14 (b) (C) of FIG. 14 illustrates a method of ejecting a liquid resin into a resin container (release film) as an ejection target, and supplying the liquid resin ejected into the resin container to the molding. Mold to produce a resin molded product.

First, as shown in FIG. 12 (a), for example, a long release film 82 is supplied from a release film supply mechanism 78 (see FIG. 11) to a stage 77 and cut into a predetermined size. Then, a resin storage frame 79 having a circular through-hole 83 is placed on the release film 82. In this state, the release film 82 and the resin storage frame 79 are integrated to constitute a resin storage portion 84 that stores a liquid resin. Then, the dispenser 15 is moved to a predetermined position above the resin containing section 84 using the moving mechanism 80. In this case, the case where the dispenser 15 is moved above the resin storage portion 84 using the moving mechanism 80 is shown, but the stage 77 may be moved below the dispenser 15. It suffices that the configuration is such that the dispenser 15 and the resin storage portion 84 are relatively moved.

Then, as shown in FIG. 12 (b), the liquid resin 85 is discharged from the resin discharge section 17 (tube 36) of the dispenser 15 to the resin storage section 84 (release film 82). The liquid resin 85 is discharged into a through-hole 83 included in the resin storage portion 84. Regarding the pattern shape of the discharged liquid resin 85, for example, as shown in FIG. 13 (a), it is preferable to discharge the liquid resin 85 in a spiral pattern shape corresponding to the circular through-holes 83. In this case, the liquid resin 85 is discharged in a spiral shape from the central portion to the outer peripheral portion. Conversely, the liquid resin 85 may be discharged spirally from the outer peripheral portion to the central portion.

The pattern shape of the discharged liquid resin 85 is not limited to a spiral pattern shape. In addition, it may be concentric circles, scattered dots, and the like, and may be arbitrarily set in accordance with the shape of the through-holes 83 included in the resin accommodation portion 84. The liquid resin 85 preferably has a pattern shape that is arranged as evenly as possible in the resin storage portion 84.

Then, as shown in FIG. 12 (c), after the dispensing of the dispenser 15 is stopped (the extrusion operation of the piston 27 is stopped), the tube attached to the ejection portion 17 of the dispenser 15 is clamped by the holder 18. The residual resin 48 in 36 and the liquid resin 49 hanging down from the tip of the tube 36 are scooped out (see FIGS. 4 (a) to 4 (d)). A liquid resin 85 discharged in a spiral shape is disposed on the release film 82 (see FIG. 13 (a)). In this case, the resin accommodating portion 84 having the bottom surface formed of the release film 82 becomes an ejection target.

Next, as shown in FIG. 12 (d), the release film 82 is adsorbed on the resin storage frame 79 through an adsorption groove (not shown) provided on the bottom surface of the resin storage frame 79. Using the resin transfer mechanism 81, the resin storage portion 84 in a state where the resin storage frame 79, the release film 82, and the liquid resin 85 discharged in a spiral shape are integrated is lifted off the platform 77.

Then, as shown in FIG. 14 (a), using the wafer transfer mechanism 75 (see FIG. 11), the pre-sealed wafer 70 on which the semiconductor wafer 86 is mounted is fixed to the mold of the upper mold 52 by suction, clamping, or the like. surface. Then, using the resin transfer mechanism 81, the resin containing portion 84 is transferred to a predetermined position between the upper mold 52 and the lower mold 11. In the resin storage portion 84, the liquid resin 85 is stored in a through-hole 83 closed by the resin storage frame 79 and the release film 82. Next, the resin conveying mechanism 81 is lowered, and the resin accommodating portion 84 is placed on the lower mold 11. In this state, the spiral liquid resin 85 discharged onto the release film 82 is disposed above the cavity 76.

Then, as shown in FIG. 14B, the release film 82 is adsorbed along the mold surface of the cavity 76 by an adsorption mechanism (not shown) provided in the lower mold 11. Thereby, the release film 82 is supplied to the cavity 76 together with the liquid resin 85. Then, the liquid resin 85 is heated and melted using a heater (not shown) provided in the lower mold 11 to generate a fluid resin 87 having a reduced viscosity.

Then, as shown in FIG. 14C, the lower mold 11 is raised by the mold clamping mechanism 12 (see FIG. 11), and the upper mold 52 and the lower mold 11 are clamped. By performing mold clamping, the semiconductor wafer 86 mounted on the pre-sealing wafer 70 is immersed in the fluid resin 87.

Then, the heater provided in the lower mold 11 is used to cure the fluid resin 87 to form a cured resin 88. Thereby, the semiconductor wafer 86 mounted on the pre-sealing wafer 70 is resin-sealed with a hardening resin 88 formed in accordance with the shape of the cavity 76. In this stage, a resin-molded resin molded product 89 (sealed wafer 72) is manufactured. The resin-molded product 89 is stored in the sealed wafer storage portion 73 (see FIG. 11) using the wafer transfer mechanism 75 (see FIG. 11).

According to this embodiment, an elastically deformable tube 36 is attached to the discharge portion 17 of the dispenser 15. Holders 18 are provided on both sides of the tube 36 and can be moved while holding the tube 36. By holding the tube 36 with the holder 18 and lowering the holder 18, the holder 18 can be used to force out the residual resin remaining in the tube 36 and the drooping liquid resin hanging from the front end of the tube 36.

According to this embodiment, the liquid resin 85 is ejected to the resin storage portion 84 (release film 82) as an ejection object, and the liquid resin 85 stored in the resin storage portion 84 is supplied to the cavity provided in the lower mold 11. 76 performs resin molding. Since the liquid resin 85 is not directly discharged into the cavity 76, the liquid resin 85 discharged onto the release film 82 is not affected by heat from a heater provided in the molding die. Therefore, it is possible to suppress the liquid resin 85 from starting to harden while the liquid resin 85 is being discharged onto the release film 82. Thereby, unevenness in curing of the liquid resin 85 discharged onto the release film 82 can be suppressed, and unevenness in resin thickness of the resin molded product can be reduced.

In each embodiment, a liquid resin is discharged from a discharge unit provided in a dispenser to a discharge target. In the first embodiment, a mode in which the liquid resin 32 is discharged into the cavity 13 using the cavity 13 provided in the lower mold 11 as a discharge target has been described. In the fifth embodiment, a mode in which the liquid resin 85 is ejected to the release film 82 with the release film 82 (resin storage portion 84) placed on the stage 77 as a discharge target has been described.

Regarding the ejection target, in addition to a cavity or a release film, liquid resin can be ejected to a substrate on which a semiconductor wafer is mounted, a wafer on which a semiconductor wafer is mounted, or a wafer on which a pre-semiconductor step has been completed. In these cases, the object to be ejected through the liquid resin is supplied to a molding die to perform resin molding. The liquid resin is melted in a cavity provided in a molding die, and is hardened according to the shape of the cavity.

In each embodiment, a one-liquid type dispenser using a liquid resin produced by mixing a base agent and a hardener in advance is shown. It is not limited to this, and when using a two-liquid mixing type dispenser which mixes a main agent and a hardener in a dispenser at the time of actual use, the same effect as each embodiment is exhibited.

In each embodiment, the resin molding apparatus used for resin-sealing a semiconductor wafer, and the manufacturing method of a resin molded article are demonstrated. The object for resin sealing may be a semiconductor wafer such as an integrated circuit (IC), a transistor, a non-semiconductor wafer that does not use a semiconductor, or a wafer group in which a semiconductor wafer and a non-semiconductor wafer are mixed. The present invention can be applied when resin-sealing one or more wafers mounted on a substrate, a wafer, or the like with a hardened resin.

In addition, the present invention is not limited to the case of resin-sealing electronic components, and when optical components such as lenses, reflectors, light guide plates, and optical modules, and other resin molded products are manufactured by resin molding.

As described above, the discharge device according to the embodiment is configured to include a storage section that accumulates a flowable resin, an extrusion mechanism for extruding the flowable resin, and a discharge section that is connected to the storage section and discharges a flowable resin An elastically deformable tube mounted on the discharge portion, a holder capable of moving while holding the tube, and a control portion that controls the amount of movement of the holder.

According to the above configuration, the elastically deformable tube mounted on the discharge portion of the discharge device can be clamped by the holder and the holder can be lowered, and the residual resin remaining in the tube can be decanted by the holder. Therefore, the time required for the discharge step of the fluid resin such as a liquid resin can be shortened, and the productivity of the resin molded article produced by discharging the fluid resin can be improved.

Furthermore, the discharge device according to the above embodiment is configured to have a configuration in which the control unit controls a movement amount to move the gripper in accordance with the remaining amount of the fluid resin in the accumulation unit.

According to the said structure, even if the remaining amount of the fluid resin remaining in the accumulation part changes, a certain fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the flowable resin, and to improve the quality stability of the resin molded product produced by discharging the flowable resin.

Furthermore, the discharge device according to the above embodiment is configured such that the accumulation amount of the flowable resin in the accumulation portion is an amount corresponding to a plurality of discharge objects, and the amount of movement of the gripper caused by the control portion is more At least two of the objects to be ejected differ.

According to the said structure, even if the remainder of the fluid resin in an accumulation | storage part changes, a certain fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the flowable resin, and to improve the quality stability of the resin molded product produced by discharging the flowable resin.

Furthermore, the ejection device according to the embodiment is configured to include a first driving mechanism that moves the holder in the horizontal direction and a second driving mechanism that moves the holder in the vertical direction.

According to the configuration, the tube can be held by the holder using the first driving mechanism. The second driving mechanism can be used to move the gripper by a predetermined amount. Therefore, the holder can be used to scoop out the residual resin remaining in the tube.

Furthermore, the discharge device of the above embodiment is configured to have a structure in which the holder includes a rotating drum, and when the holder is holding the tube, the roller is lowered while rotating, and the residual resin remaining in the tube is scooped out. .

According to the configuration, the residual resin remaining in the tube can be scooped out by rotating while the drum is lowered.

The resin molding apparatus of the said embodiment is set as the structure provided with any of the said discharge apparatus.

According to this configuration, the time required for the discharge step of the fluid resin such as a liquid resin can be shortened, and the productivity of the resin molded article produced by discharging the fluid resin can be improved.

The discharge method according to the embodiment includes an extrusion step of extruding the fluid resin accumulated in the accumulation portion, thereby ejecting the fluid resin from an elastically deformable tube attached to the discharge portion connected to the accumulation portion; and In the extruding step, the tube is clamped by the holder and the holder is moved downward, thereby removing the residual resin remaining in the tube.

According to the method, the holder can be used to spit out the fluid resin as soon as possible. Therefore, the time required for the discharge step of the fluid resin such as a liquid resin can be shortened, and the productivity of the resin molded article produced by discharging the fluid resin can be improved.

Furthermore, in the ejection method of the embodiment, in the ejection step, the amount of movement of the gripper is controlled in accordance with the remaining amount of the fluid resin in the accumulation portion.

According to this method, even if the remaining amount of the fluid resin remaining in the accumulation portion changes, a certain fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the flowable resin, and to improve the quality stability of the resin molded product produced by discharging the flowable resin.

Furthermore, in the ejection method of the embodiment, the extrusion step and the ejection step are repeated a plurality of times, and the amount of movement of the gripper is made different for at least two of the plural ejection steps.

According to this method, even if the remaining amount of the fluid resin in the accumulation portion changes, a certain amount of the fluid resin can be discharged. Therefore, it is possible to increase the accuracy of the discharge amount of the flowable resin, and to improve the quality stability of the resin molded product produced by discharging the flowable resin.

The method for manufacturing a resin molded article according to the above embodiment includes a clamping step of clamping the molding die in a state where the fluid resin discharged by any of the above-mentioned discharge methods is supplied to the molding die.

According to this method, a resin molded article can be stably produced, and productivity can be improved.

The present invention is not limited to each of the embodiments described above, and may be arbitrarily and appropriately combined, changed, or selectively adopted as needed within a range not departing from the gist of the present invention.

1. 68‧‧‧ resin molding device

2‧‧‧ substrate supply / containment module

3A, 3B, 3C‧‧‧forming module

4‧‧‧Resin supply module

5‧‧‧Sealed front substrate

6‧‧‧Sealed front substrate supply unit

7‧‧‧sealed substrate

8‧‧‧Sealed substrate receiving section

9‧‧‧ Substrate mounting section

10‧‧‧ substrate transfer mechanism

11‧‧‧ lower mold

12‧‧‧ clamping mechanism

13, 76‧‧‧ cavity (spit out the object)

14‧‧‧Release film supply mechanism

15, 58, 64 ‧ ‧ ‧ Dispenser (discharge device)

16‧‧‧Resin transfer mechanism

17, 65‧‧‧ Spit

18, 59, 67‧‧‧ holder

19‧‧‧Extrusion mechanism

20‧‧‧ Syringe (accumulation section)

21‧‧‧Connection Department

22‧‧‧Nozzle

23‧‧‧Servo Motor

24‧‧‧ Ball Screw

25‧‧‧ Slider

26‧‧‧shot

27‧‧‧Piston (extrusion mechanism)

28‧‧‧ Ball Screw Bearing

29‧‧‧rail

30‧‧‧ Encoder

31‧‧‧Control Department

32, 85‧‧‧Liquid resin (fluid resin)

33‧‧‧Screw

34‧‧‧ Spit Out

35‧‧‧ connector

36‧‧‧ tube

37, 38‧‧‧ Drum support member

37a, 37b, 37c, 38a, 38b, 38c

39, 40‧‧‧ roller

41, 44‧‧‧ connecting members

42, 45‧‧‧ mobile mechanism (first mobile mechanism)

43, 46‧‧‧ mobile mechanism (second mobile mechanism)

47‧‧‧resin pathway

48‧‧‧ residual resin

49‧‧‧ liquid resin

50‧‧‧ Brushed Residual Resin

51, 86‧‧‧Semiconductor wafer

52‧‧‧Mould

53‧‧‧Forming mold

54‧‧‧Release film

55, 87‧‧‧ fluid resin

56, 88‧‧‧hardened resin

57, 89‧‧‧ resin molded products

60, 61‧‧‧ roller support member

60a, 60b, 60c, 61a, 61b, 61c ‧‧‧ rod-shaped members

62, 63‧‧‧ connecting members

66‧‧‧Fixing plate

69‧‧‧ Wafer Supply / Containment Module

70‧‧‧ Wafer before sealing

71‧‧‧ Wafer supply section before sealing

72‧‧‧Sealed wafer

73‧‧‧Sealed wafer receiving section

74‧‧‧ Wafer mounting section

75‧‧‧wafer transfer mechanism

77‧‧‧platform

78‧‧‧Release film supply mechanism

79‧‧‧ resin container

80‧‧‧ mobile agency

81‧‧‧resin transfer mechanism

82‧‧‧Release film (spit out the object)

83‧‧‧through hole

84‧‧‧Resin storage section (discharge object)

S1, R1, M1, C1‧‧‧

CTL‧‧‧Control Department

A, B, C ‧‧‧ state of liquid resin in syringe

P1, P2, P3, P4‧‧‧ position

L1, L2, L3‧‧‧‧ Stroke (movement)

FIG. 1 is a plan view showing the outline of the apparatus of the resin molding apparatus according to the first embodiment. FIG. 2 (a) is a schematic plan view of a dispenser used in the resin molding apparatus shown in FIG. 1, and FIG. 2 (b) is an enlarged view of a discharge portion shown in FIG. 2 (a). Fig. 3 (a) is a cross-sectional view taken along the line A-A of the dispenser shown in Figs. 2 (a) and 2 (b), and Fig. 3 (b) is a cross-sectional view taken along the line B-B. 4 (a) to 4 (d) show the operation of discharging the liquid resin by using the dispenser shown in Figs. 2 (a) and 2 (b), and the residual resin in the tube is decanted. A schematic cross-sectional view of the operation. FIGS. 5 (a) to 5 (c) are schematic cross-sectional views showing the steps of resin molding using the resin molding apparatus shown in FIG. 1. FIGS. 6 (a) to 6 (b) are schematic cross-sectional views showing a modification of the dispenser used in the second embodiment. FIGS. 7 (a) to 7 (c) are schematic cross-sectional views showing a modification and operation of a dispenser used in the third embodiment. 8 (A) to 8 (C) are schematic diagrams showing the resin amounts of the liquid resin remaining in the syringe in the conventional dispenser, respectively. FIGS. 9 (A) to 9 (C) are schematic diagrams each showing the resin amount of the liquid resin remaining in the syringe of the dispenser of the present invention in the fourth embodiment. FIGS. 10 (a) to 10 (c) show that the dispenser shown in the first embodiment is used in the fourth embodiment, and the holder is moved in accordance with the resin amount of the liquid resin remaining in the syringe. Sketch of the stroke amount. FIG. 11 is a plan view showing an outline of the apparatus of the resin molding apparatus according to the fifth embodiment. FIGS. 12 (a) to 12 (d) are schematic cross-sectional views showing a procedure for ejecting a liquid resin onto a release film using the resin molding apparatus shown in FIG. 11. FIGS. 13 (a) and 13 (b) are schematic views showing the state of the liquid resin discharged onto the release film, FIG. 13 (a) is a plan view, and FIG. 13 (b) is a CC line cross section. Illustration. FIGS. 14 (a) to 14 (c) are steps for supplying a liquid resin on the release film shown in FIGS. 13 (a) and 13 (b) to a molding die and performing resin molding. A schematic cross-sectional view.

Claims (11)

A discharge device, comprising: an accumulation part for accumulating fluid resin; an extrusion mechanism for extruding the fluid resin; an ejection part connected to the accumulation part and ejecting the fluid resin; a tube installed in the The discharge part is elastically deformable; a gripper can grip the tube and move; and a control part controls the amount of movement of the gripper and the accumulation amount of the fluid resin in the accumulation part In order to correspond to the amounts of the plurality of discharge objects, the movement amount of the gripper by the control unit is different for at least two of the plurality of discharge objects. A discharge device, comprising: an accumulation part for accumulating fluid resin; an extrusion mechanism for extruding the fluid resin; an ejection part connected to the accumulation part and ejecting the fluid resin; a tube installed in the The discharge part is elastically deformable; the holder can hold the tube and move; the first drive mechanism moves the holder in the horizontal direction; and the second drive mechanism makes the clamp The holder moves in the vertical direction. A discharge device, comprising: an accumulation part for accumulating fluid resin; an extrusion mechanism for extruding the fluid resin; an ejection part connected to the accumulation part and ejecting the fluid resin; a tube installed in the The ejection portion is elastically deformable; and a clamper can move the tube by holding the tube, and the clipper has a rotating drum, and the tube is held in a state where the tube is held by the clipper The roller descends while rotating, thereby removing the residual resin remaining in the tube. A discharge device, comprising: an accumulation part for accumulating fluid resin; an extrusion mechanism for extruding the fluid resin; an ejection part connected to the accumulation part and ejecting the fluid resin; a tube installed in the The discharge part is elastically deformable; and the gripper moves downward while gripping the tube, and ejects the residual resin remaining in the tube. The discharge device according to item 4 of the patent application scope further includes a control unit that controls the amount of movement of the gripper. The discharge device according to item 5 of the patent application range, wherein the control section controls the amount of movement to move the gripper in accordance with the remaining amount of the fluid resin in the accumulation section. A resin molding apparatus provided with the discharge device according to any one of claims 1 to 6. A discharge method including an extrusion step of squeezing out the fluid resin accumulated in the accumulation part, thereby ejecting the fluid resin from an elastically deformable tube mounted on the discharge part connected to the accumulation part And the pinch-out step, the gripper is used to grip the tube and the gripper is moved downward, thereby removing the residual resin remaining in the tube. The ejection method according to item 8 of the patent application range, wherein in the ejection step, the amount of movement of the gripper is controlled in accordance with the remaining amount of the fluid resin in the accumulation portion. The discharge method according to item 8 or 9 of the patent application scope, wherein the extrusion step and the ejection step are repeated multiple times, and the at least two of the multiple ejection steps are caused The amount of movement of the gripper is different. A method for manufacturing a resin molded product, including the step of supplying the fluid resin discharged by the discharge method described in any one of patent application items 8 to 10 to a molding die Next, resin molding is performed.