JP5261261B2 - Liquid resin material supply method and apparatus used for compression resin sealing molding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid resin material supply method and a device, wherein a fixed amount of liquid resin material is efficiently supplied into a lower drag cavity of a resin mold when an electronic component is subjected to resin sealing molding. <P>SOLUTION: The liquid resin material supply device B(400) includes: a liquid resin material supply device body 402 detachably attached to an engagement attachment/detachment portion 401 provided on the side of a cope 804 of the resin mold; a cooling water conduit member 403 fitted in the body; a nozzle member 405 fitted in the cooling water conduit member and having a discharge hole portion 404 for liquid resin material; a valve member 407 for opening and closing a discharge hole portion, fitted in the nozzle member and having a liquid resin material flow passage 406; and an elastic pressing member 409 for closing the discharge hole portion 404 by engaging the discharge hole portion 404 of the nozzle member 405 with a valve 408 of the valve member 407. The liquid resin material supply device B is cooled to efficiently suppress thermosetting reaction on a thermosetting resin material (R) flowing in the valve member 407 and nozzle member 405. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a method for supplying a liquid resin material used for compression resin sealing molding for molding a small electronic component such as a semiconductor element with a resin material, and an improvement of a liquid resin material supplying apparatus using this method. In particular, the present invention relates to an improved liquid resin material that can be efficiently and quickly supplied into a compression resin sealing mold.

A liquid thermosetting resin material is supplied into the lower mold cavity of the compression resin sealing mold comprising both upper and lower molds, and the electronic components on the substrate are immersed in the liquid resin material. A so-called compression resin sealing molding (compression molding) method of an electronic component in which the electronic component is resin-sealed and molded by applying a predetermined heating action and a clamping pressure is employed. Usually, a dispenser is used to supply the liquid thermosetting resin material into the cavity.
For example, the dispenser main body is installed so that it can be moved back and forth between the upper and lower molds, and when the upper and lower molds are opened, the dispenser main body is inserted between the upper and lower molds, and the dispenser main body is moved from the tip nozzle of the dispenser. A fixed amount of liquid thermosetting resin material is discharged (see, for example, Patent Document 1).

JP 2003-165133 A (page 4, column 5, lines 7-14, FIG. 9, FIG. 11, etc.)

According to the configuration of the resin material supply apparatus using the dispenser disclosed in Patent Document 1, there are the following problems.
When a liquid thermosetting resin material is used as a material for resin-sealing an electronic component, for example, when a light emitting diode (LED chip) mounted on a semiconductor substrate is sealed with a silicone resin, Since there is a problem in resin molding that the liquid thermosetting resin material is cured in a short time, the operation of supplying the liquid thermosetting resin material into the lower mold cavity and the light emitting diode on the substrate in the lower mold cavity It is necessary to perform the operation of immersing in the liquid thermosetting resin material quickly and efficiently.
That is, when the supply operation of the liquid thermosetting resin material into the lower mold cavity is not performed quickly, the thermosetting reaction is promoted to become a high viscosity state, so that the liquid is applied to every corner in the lower mold cavity. The thermosetting resin material cannot be supplied uniformly, and as a result, a problem such as insufficient resin filling in the lower mold cavity occurs. In addition, if the light emitting diode is immersed in the liquid thermosetting resin material in a high viscosity state, the gold wire may be deformed or cut, and as a result, the resin is in a state of poor electrical connection. A serious adverse effect on the resin sealing molding that the sealing molding is performed occurs.
In addition, when using a large compression resin sealing molding device in which a plurality of cavities are provided between the upper and lower molds, and a substrate is loaded and set in each of these cavities, liquid thermosetting is performed in each cavity. The thermosetting resin material is supplied, but the thermosetting resin materials in the cavities at the time when all the resin material supply steps are finished have different viscosities. For this reason, the step of immersing the light-emitting diode in the liquid thermosetting resin material cannot be performed under uniform conditions, and as described above, the gold wire of the light-emitting diode immersed in the resin material is not used. Compressed resin seals for electronic parts with uniform, high quality and high reliability, such as deforming or cutting them to cause resin sealing molding with poor electrical connection. There is a serious problem in resin molding that it is impossible to efficiently and reliably mold a stop-molded product.
In the case of using a large compression resin sealing molding apparatus, for example, by simultaneously performing the supply operation of the liquid thermosetting resin material into each cavity, the liquid thermosetting resin material in each cavity is Viscosity can be made uniform. However, in this case, there is a problem that the overall apparatus structure is further complicated or the overall shape is further increased because it is necessary to increase the number of dispensers described above.

The present invention relates to a method for supplying a liquid resin material capable of efficiently supplying a certain amount of a liquid resin material to a mold for compression resin sealing molding of an electronic component while maintaining its fluidity, and a liquid resin material supply apparatus using this method Is intended to provide.
The present invention also provides a liquid resin material supply method and a liquid resin material supply device using this method, which can be preferably implemented by being incorporated in a compacted resin compression molding apparatus for electronic components. It is for the purpose.

Invention, said placing at least upper and lower mold sections (804, 808) substrate set cavity to resin-seal molding the lower mold 808 of the electronic component 832 comprising a substrate according to claim 1 for solving the problems described above The electronic component mounted on 811 is immersed in the liquid resin material supplied into the lower mold cavity 801 , and a predetermined heating action and pressure action are applied to the liquid resin material to resin-mold the electronic component. A liquid resin material supply method used for compression resin sealing molding of electronic parts,
The above resin-seal-molding mold 804 side, the liquid resin material discharge port portion 404 a nozzle member 405 having a liquid resin material flow path 406 wherein the liquid resin with a material discharge port portion 404 for opening and closing of the valve member 407 A liquid resin material comprising: a liquid resin material discharge port portion 404 of the nozzle member and a valve 408 of the valve member, and an elastic pushing member 409 for closing the liquid resin material discharge port portion 404 A liquid resin material supply device preparation step for preparing the supply device (B);
A liquid resin material inflow step of flowing a required amount of the liquid resin material into the liquid resin material flow path 406 of the liquid resin material supply apparatus (B) at a required pressure;
Due to the inflow pressure of the liquid resin material in the liquid resin material inflow step, the liquid resin material discharge port portion 404 of the nozzle member is moved toward the tip of the liquid resin material discharge port portion 404 against the elasticity of the elastic pushing member. A liquid resin material discharge port opening step that opens in a state of being moved to a position 804c projected from the mold surface 804a of the upper mold 804 for resin sealing molding ;
A liquid resin material discharge step of discharging the liquid resin material in the liquid resin material flow path 406 into the lower mold cavity from the liquid resin material discharge port portion 404 opened in the liquid resin material discharge port portion opening step;
A liquid resin material inflow pressure releasing step of releasing the inflow pressure to the liquid resin material in the liquid resin material flow path 406 after or simultaneously with the end of the liquid resin material discharge step;
A liquid resin material discharge port closing step for closing the liquid resin material discharge port portion 404 is performed after or simultaneously with the liquid resin material inflow pressure releasing step.

Further, in the invention according to claim 2 for solving the above-described problem , the liquid resin material flow path 406 is set in a reduced pressure state in the liquid resin material inflow pressure releasing step and the liquid of the nozzle member is set. By fitting the resin material discharge port 404 and the valve 408 of the valve member to close the liquid resin material discharge port 404, the liquid resin material discharge port 404 and the liquid resin material flow path path 406 are closed . A liquid resin material discharge preventing step for preventing the liquid resin material from being discharged is performed.

Further, in the invention according to claim 3 for solving the above-mentioned problem, a substrate setting cavity is arranged in a lower mold 808 for resin sealing molding of an electronic component 832 composed of at least upper and lower molds (804, 808). The electronic component mounted on the substrate 811 is immersed in the liquid resin material supplied into the lower mold cavity 801 , and the liquid resin material is subjected to a predetermined heating action and pressure action so that the electronic component is resin-sealed. A liquid resin material supply device used in a compression resin sealing molding device for electronic parts to be molded,
The liquid resin material supply device (B) includes a liquid resin material supply device main body 402 that is detachably mounted on a fitting attachment / detachment portion 401 provided on the molding upper mold 804 side, and the liquid resin material supply A cooling water channel member 403 fitted in the apparatus main body 402 , a nozzle member 405 having a liquid resin material discharge port 404 fitted in the cooling water channel member 403 , and a liquid material fitted in the nozzle member the liquid resin material discharge port portion 404 for opening and closing of the valve member 407, the nozzle member of the liquid resin material discharge port portion 404 and the said liquid resin by a fitted and the valve 408 of the valve member comprising a resin material flow path 406 It is composed of an elastic pushing member 409 for closing the material discharge port 404 ,
When allowed to flow into the liquid resin material into the liquid resin material flow path 406 of the nozzle member 405, the liquid resin material discharge port 404 of the nozzle member 405 by the inflow pressure, anti the elasticity of the elastic pressing member 409 The liquid resin material discharge port portion 404 is provided so as to be opened in a state where the tip end portion is moved to a position 804c protruding from the mold surface 804a of the upper mold 804 for resin sealing molding. Features.

The invention according to claim 4 for solving the above-described problem is characterized in that a cooling water introduction / discharge portion 411 for connecting the cooling water pipe 410 is provided at the upper end portion of the liquid resin material supply device main body 402 described above. And

When the liquid resin material supply method and the liquid resin material supply device according to the present invention are used, the liquid resin material can be efficiently and rapidly supplied into the compression resin sealing mold.
That is, according to the present invention, a required pressure is applied to the liquid resin material in the liquid resin material flow path in the liquid resin material supply device, and the liquid resin material is discharged from the liquid resin material discharge port of the supply device. Therefore, even a highly viscous liquid resin material can be supplied into the lower mold cavity in the compression resin sealing mold while maintaining its fluidity.
Further, according to the present invention, the liquid resin material discharge port of the nozzle member is resin-sealed by the inflow pressure of the liquid resin material, and the tip of the liquid resin material discharge port is resisted by the elasticity of the elastic pushing member. Since it can be opened in a state where it is moved to a position protruding from the mold surface of the upper mold, the liquid resin material discharged downward from the liquid resin material discharge port is attached to the upper mold surface side. Can be surely prevented.
Further , according to the present invention, after discharging the liquid resin material in the liquid resin material flow path, in the liquid resin material inflow pressure releasing step, the flow path is depressurized and the liquid resin material discharge port portion of the nozzle member and by fitting a valve of the valve member by closing the liquid resin material discharge port portion, the liquid resin material from the liquid resin material discharge port portion can be prevented from discharging, so-called, the liquid resin material discharge port portion It is possible to reliably prevent the liquid leakage phenomenon from.
In addition, according to the present invention, a cooling action can be applied to the liquid resin material flowing in the liquid resin material flow path in the liquid resin material supply apparatus, so that the liquid thermosetting used for sealing molding of electronic components Use and handling of the conductive resin material becomes easy.
In addition, according to the present invention, since the shape of the liquid resin material supply device can be reduced in size, the liquid resin material supply device is preferably incorporated in a molding die in a compression resin sealing molding device for electronic parts. can do. Furthermore, since the shape of the liquid resin material supply device can be reduced as described above, the liquid resin material supply device can be suitably implemented by being incorporated in a small compression resin sealing molding device such as a so-called desktop type.

1 schematically shows the overall shape of an electronic component compression resin sealing and molding apparatus equipped with a liquid resin material supply device according to the present invention. FIG. 1 (1) is a schematic front view thereof, and FIG. It is a schematic plan view. The principal part of the fixed quantity conveyance apparatus for conveying and supplying a fixed quantity liquid resin material to the liquid resin material supply apparatus which concerns on this invention is shown, FIG.2 (1) is one in the A1-A1 line | wire of FIG.1 (2). FIG. 2 (2) is an enlarged front view showing a passage switching portion of the quantitative conveying device in an enlarged manner. Fig. 3 (1) is a longitudinal front view of the liquid resin material quantitative conveyance device corresponding to Fig. 2 (2), Fig. 3 (1) is an explanatory diagram for measuring the quantity of liquid resin material, and Fig. 3 (2) is the measured quantitative liquid. FIG. 3 (3) is an explanatory view when the resin material is conveyed and supplied to the liquid resin material supply apparatus side according to the present invention, and FIG. 3 (3) is a liquid resin material supply apparatus for collecting the liquid resin material stagnating in the passage switching section of the quantitative conveyance apparatus. It is explanatory drawing in the case of discharging to the side. FIG. 10 is a partially cutaway longitudinal front view showing another configuration example of the quantitative conveyance device corresponding to FIG. FIG. 5 (1) and FIG. 5 (2) show the structure of the liquid resin material supply device according to the present invention, and FIG. 5 (1) and FIG. FIG. 5 (3) and FIG. 5 (4) are partially cutaway enlarged vertical front views showing a state in which the liquid resin material discharge port portion in the apparatus is open. FIG. 6 (1) is a schematic central longitudinal sectional view showing a state in which the liquid resin material supply device according to the present invention is installed on the upper mold side in a compression resin sealing molding device for electronic parts. FIG. FIG. 6 (2) is an explanatory view showing, in an enlarged manner, a main part thereof, with a partially cut longitudinal front view showing a mold opening and a state in which the liquid resin material is supplied into the lower mold cavity. FIG. 7 is a schematic central longitudinal sectional view of the compression resin sealing molding apparatus corresponding to FIG. 6, and FIG. 7 (1) is a partially cut longitudinal front view when both the upper and lower molds of the molding apparatus are clamped, FIG. ) Is an explanatory view showing the main part in an enlarged manner.

  Next, embodiments of the present invention will be described with reference to the drawings.

First, with reference to FIG. 1 thru | or FIG. 3, the fixed quantity conveyance apparatus A for conveying and supplying a fixed quantity liquid resin material to the liquid resin material supply apparatus which concerns on this invention is explained in full detail.
In the above-described liquid resin material quantitative conveyance device A, the storage unit 100 for storing the liquid resin material 200 having fluidity and the liquid resin material 200 stored in the storage unit 100 are weighed to measure the fixed amount. The liquid resin material metering unit 300, the metered liquid resin material discharge unit 400 weighed by the metering unit 300, the compressed air supply unit 500 to the discharge unit 400, and FIG. As shown in the figure, a communication path 601 for connecting the storage unit 100 and the metering unit 300, or the metering unit 300 and the discharge unit 400, or the discharge unit 400 and the compressed air supply unit 500 in a communication state. And a passage switching unit 600 having the shape shown in FIG.

  The liquid resin material storage unit 100, the liquid resin material metering unit 300, and the metered liquid resin material discharge unit 400 are detachable from the main body of the metered transport device A, as will be described later. It is mounted so that

The passage switching unit 600 is disposed at the center of the insert plate 700.
As shown in FIG. 2 (2), the passage switching unit 600 includes a cylindrical mounting member 701 disposed in the front-rear direction in the figure, and a rotatable and densely (within the cylindrical mounting member). The branch valve member 602 fitted and the rotation control mechanism 603 such as a servo mechanism for controlling the rotation of the branch valve member to a predetermined rotation angle position (see FIG. 1 (2)) ) Is provided.
The cylindrical mounting member 701 is fixed to the insert plate 700 by an appropriate rotation stop member (not shown). Therefore, the cylindrical mounting member is prevented from rotating with respect to the insert plate 700. Is provided.
In addition, a communication port 702 with the reservoir 100 side is located at an upper position of the cylindrical mounting member 701 on the virtual same circumference line, a communication port 703 with the discharge unit 400 side is located at a lower position, and One side position (right side in the figure) has a communication port 704 with the measuring unit 300 side, and the other side position (left side in the figure) has a connection with the compressed air supply unit 500 side. A communication port 705 is formed.
Further, when the branch valve member 602 is rotated in response to an instruction from a control unit (not shown), as described above, the position of the communication path 601 formed in the branch valve member 602 is the storage unit 100 and the metering unit 300. Alternatively, the metering unit 300 and the discharge unit 400, or the discharge unit 400 and the compressed air supply unit 500 are connected in communication.

The liquid resin material reservoir 100 is mounted so as to be detachable from a connection hole 706 with an upper communication port 702 in a cylindrical mounting member 701 fitted to the insert plate 700.
In the illustrated example, a resin cylinder 101 having one end (upper end) opened is used, and the connection portion 101a at the other end (lower end) is closely fitted to the connection hole 706.
In a normal case, the cylinder 101 is held on the upper surface of the insert plate 700 via a cylinder guide 102 and a fixing member 103 of the cylinder guide. However, when replacing the cylinder 101, only the cylinder 101 is removed from the cylinder guide 102. It is provided so that it can be extracted.
The cylinder 101 is exemplified as a small one that can store a small amount of the liquid resin material 200 or an amount necessary for several times of measurement. 2 may be performed, for example, as shown in FIG. 2 (1), a liquid resin material storage tank 104 or the like may be directly attached to the upper end opening of the cylinder 101. A configuration may be adopted in which the upper end opening of the cylinder 101 and the liquid resin material container are connected in communication via an appropriate feed path (not shown).

The liquid resin material measuring unit 300 is mounted so as to be detachable from a mounting hole 707 provided to communicate with the communication port 704 in the cylindrical mounting member 701 fitted to the insert plate 700. ing.
In the illustrated example, a cylinder 301 whose one end (right end) is opened is used, and the connection portion 301a at the other end (left end) is closely fitted to the mounting hole 707.
The cylinder 301 is fixed to one end surface (right side surface) of the insert plate 700 via a fixing member 302. When replacing the cylinder 301, the cylinder 301 is removed by removing the fixing member 302. It is provided so that it can be extracted from.
Further, in this cylinder 301, a plunger 304 having a sealing member 303 made of elastic rubber or the like fixed at the tip (left end) portion is closely fitted.
Further, the plunger 304 is fitted in a state in which the plunger 304 can reciprocate (moves left and right) in the cylinder 301, and the reciprocating position of the plunger can be controlled via a reciprocating drive mechanism 305 such as a servo mechanism. Is provided.
The position control with respect to the plunger 304 measures the amount of liquid resin material sucked and transferred into the cylinder corresponding to the plunger movement stroke length for moving the plunger in the right direction in the figure, as will be described later. Therefore, the amount of the liquid resin material sucked and transferred into the cylinder 301 can be appropriately changed and selected by appropriately changing the moving stroke length of the plunger.
The tip shape of the sealing member 303 may be formed corresponding to the inner surface shape of the connecting portion 301a of the cylinder. When such a seal member is used, there is an advantage that the whole amount of the liquid resin material sucked and transferred into the 301 can be transferred to the outside of the cylinder.

Further, the liquid resin material supply device B according to the present invention is installed in the discharge portion 400 of the quantitative liquid resin material.
As shown in FIG. 5 (1), the liquid resin material supply device B includes a liquid resin material supply device main body 402 that is detachably attached to a fitting attachment / detachment portion 401 provided on the upper mold side. A cooling water channel member 403 fitted in the main body, a nozzle member 405 having a liquid resin material discharge port 404 fitted in the cooling water channel member, and a liquid resin fitted in the nozzle member the above-mentioned liquid resin material discharge port portion for opening and closing of the valve member 407 comprises a material flow path 406, the liquid resin material discharge port 404 and by a valve 408 is fitted in the valve member liquid resin material discharge port of the nozzle member And an elastic pushing member 409 for closing the portion 404.
In the normal state where the liquid resin material R does not flow into the liquid resin material flow path 406, the elasticity of the elastic pushing member 409 is as shown in FIGS. 5 (1) and 5 (2). The liquid resin material discharge port 404 is added in the direction in which the valve member 408 of the valve member is fitted (in the illustrated example, the direction in which the nozzle member 405 is pushed up). At this time, the tip end portion (lower end portion in the illustrated example) of the liquid resin material discharge port portion 404 moves (moves upward) to a position 804b retreating from the mold surface 804a of the molding upper mold 804 and moves to the mold. It is provided so as not to protrude from the surface, and is configured not to impede the substrate mounting action on the upper mold surface described later.
As shown in FIGS. 5 (3) and 5 (4), when the liquid resin material R flows into the liquid resin material flow path 406 of the nozzle member, the nozzle member 405 has an inflow pressure of the liquid resin material. by liquid resin material discharge port 404 of the nozzle member is pushed against the elasticity of the elastic pressing member 409 by opening the liquid resin material discharge port portion 404 (in the illustrated example, the nozzle member 405 Push down).
Since this time, the tip portion of the liquid resin material discharge port portion 404 mentioned above is provided so as to move to a position 804c protruded from the mold surface 804a of the molding upper die 804 (downward movement), liquid The liquid resin material R discharged downward from the resin material discharge port 404 does not adhere to the upper mold surface 804a side, and therefore the liquid resin material R can be efficiently supplied into the lower mold cavity. it can.
In addition, a cooling water W introduction / discharge portion 411 for connecting a cooling water pipe 410 is provided at an upper end portion of the liquid resin material supply apparatus main body 402.

  The liquid resin material supply device B described above is preferably incorporated in the mold component of the downsized desktop compression resin sealing molding device C (in the example shown, the upper mold portion for compression resin sealing molding). Can be implemented.

  The compressed air supply unit 500 includes a communication port 705 formed in the cylindrical mounting member 701, a connection hole 709 of the insert plate 700 formed so as to communicate with the communication port 705, and the connection hole 709 and the compression hole 709. A case is shown in which a compressed air supply path 501 and the like are connected in communication with an air tank (not shown) side.

  Hereinafter, the operation of conveying a fixed amount of the liquid resin material to the liquid resin material supply device B (400) by the above-described fixed amount transfer device A of the liquid resin material will be described.

In advance, the plunger 304 is moved to the left via the reciprocating drive mechanism 305 of the measuring unit 300, and the tip seal member 303 is moved to the left end in the cylinder 301 in advance.
In this state, the liquid resin material 200 is supplied and filled into the cylinder 101 of the reservoir 100.
In the illustrated example, a small cylinder 101 that stores a small amount of the liquid resin material 200 or an amount necessary for performing multiple measurements is shown. For example, the liquid resin material 200 is stored in the cylinder 101. By setting 200 to be continuously supplied and filled, the metering of the liquid resin material 200 can be repeated continuously.

Next, the branch valve member 602 is rotated via the rotation control mechanism 603 (see FIG. 1 (2)) of the passage switching section 600, and one side of the communication passage 601 in the branch valve member is turned to FIG. As shown in 1), by connecting to the upper communication port 702 of the cylindrical mounting member 701 fitted to the insert plate 700 and connecting the other side to the right lateral communication port 704 of the cylindrical mounting member, The cylinder 101 of the storage part and the cylinder 301 of the measuring part can be connected in communication.
In this state, the quantity of the liquid resin material can be measured by moving the plunger 304 to the right side to a position having a predetermined stroke length via the reciprocating drive mechanism 305 in the measuring unit 300. That is, the liquid resin material 200 in the reservoir cylinder 101 can be transferred into the measuring unit cylinder 301 by the suction force based on the negative pressure generated when the plunger 304 moves in the measuring unit cylinder 301. The liquid resin material is quantified and measured by measuring the volume of the liquid resin material accommodated in the communication path 601 of the branch valve member 602 and the communication port 704 of the cylindrical mounting member 701 and the plunger in the measuring unit cylinder 301. It can be determined by the sum of the volume of the liquid resin material that is sucked and transferred into the cylinder 301 by moving 304 to the right.
Since the volume of the liquid resin material accommodated in the communication path 601 and the communication port 704 is constant, for example, an amount obtained by subtracting the constant amount from the desired fixed amount can be transferred into the measuring unit cylinder 301. I can do it. Therefore, the movement position of the plunger 304 necessary for this may be set as the plunger movement stroke length. The plunger 304 is moved by the preset stroke length, and the liquid resin material 200 in the reservoir cylinder 101 is sucked and transferred into the measuring unit cylinder 301, whereby the communication path 601 and the communication port 704 and the measuring unit are measured. The measured quantity of liquid resin material is accommodated in the part cylinder 301.

Next, the measured quantitative liquid resin material is conveyed to the liquid resin material supply device B installed in the discharge unit 400 via the passage switching unit 600.
As shown in FIG. 3 (2), the branch valve member 602 of the passage switching unit 600 is rotated, and one side of the communication passage 601 in the branch valve member is connected to the right side communication port 704 of the cylindrical mounting member 701. The other side is connected to the lower communication port 703 of the cylindrical mounting member. At this time, the inside of the measuring portion cylinder 301 and the discharge portion 400 side are connected in communication, and the connecting portion 101a at the lower end of the storage portion cylinder 101 is securely closed by the branch valve member 602.
In this state, the fixed liquid resin material is conveyed to the liquid resin material supply device B of the discharge unit 400 by moving the plunger 304 to the original position on the left side through the reciprocating drive mechanism 305 in the measurement unit 300. Can do. That is, when the plunger 304 is moved back to the original left position, the fixed amount liquid resin material 201 in the measuring portion cylinder 301, the communication path 601 and the communication port 704 becomes the lower communication port 703 and the insert plate. The liquid resin material supply device B of the discharge unit 400 is introduced through the connection hole 708.
As will be described later, the quantitative liquid resin material introduced into the liquid resin material supply device B immediately flows down and is smoothly discharged downward from the liquid resin material discharge port (404), and also downward. The placed electronic component is efficiently and quickly supplied into the lower mold cavity (801) in the compression resin sealing molding apparatus C.

In the case where the above-described quantitative liquid resin material is conveyed to the liquid resin material supply device B, the seal member 303 at the plunger tip in the illustrated example is not fitted to the inner surface of the connection part 301a of the measuring unit cylinder 301. A part of the quantitative liquid resin material may remain in the connection portion 301a. Therefore, when it is necessary to transport the entire amount of the liquid resin material in the cylinder 301 including the liquid resin material remaining in the connection portion 301a to the supply device B side, for example, the tip shape of the seal member 303 is By forming it corresponding to the shape of the inner surface of the connecting part 301a of the cylinder, when the plunger 304 is moved back, the tip of the seal member 303 is fitted to the inner surface of the cylinder connecting part 301a. The liquid resin material inside may be positively discharged to the supply device B side.
Similarly, a part of the liquid resin material may remain in the right side communication port 704 as described above. For example, by inserting the tip of the seal member 303 into the communication port, This can be discharged to the supply device B side.

Next, compressed air 502 is supplied to the passage switching unit 600 and the supply device B, and the accumulated liquid resin material in the passage switching unit and the supply device is discharged into the lower mold cavity (801) below.
As shown in FIG. 3 (3), the branch valve member 602 of the passage switching unit 600 is rotated, and one side of the communication passage 601 in the branch valve member is connected to the lower communication port 703 of the cylindrical mounting member 701. The other side is connected to the left side communication port 705 of the cylindrical mounting member. At this time, the discharge unit 400 (supply device B) side and the compressed air supply unit 500 side are connected in communication, and the connecting portions 101a and 301a of both cylinders are reliably closed by the branch valve member 602. Become.
In this state, compressed air 502 is supplied into the connection hole 709 of the insert plate 700 through the compressed air supply path 501, so that the compressed air pressure causes the passage switching unit (communication path 601) and the lower communication port. 703 * Connection hole 708 * Liquid resin material to be accumulated in the discharge part 400 (supply apparatus B) can be reliably discharged into the lower mold cavity (801) in the compression resin sealing molding apparatus C below. .
Due to the air supply action of the compressed air 502, the liquid resin material is quantified or the liquid resin material to be accumulated in the passage switching unit 600 or the discharge unit 400 (supply device B) is put into the lower mold cavity (801). Since the discharge can be reliably performed, the inside of the passage switching unit 600 and the discharge unit 400 (supply device B) can be efficiently cleaned. For example, the liquid that stays in the passage switching unit and the discharge unit (supply device B) The so-called liquid leakage phenomenon in which the resin material leaks from the liquid resin material discharge port 404 of the nozzle member can be efficiently prevented.

In order to prevent a liquid leakage phenomenon from the liquid resin material discharge port 404 of the nozzle member, as described above, the liquid resin material R is stagnated in the passage switching unit 600 and the discharge unit 400 (supply device B). For example, in the state shown in FIG. 3 (2), that is, in the state where the inside of the measuring unit cylinder 301 and the discharge unit 400 are connected to each other via the branch valve member 602, the measuring unit The stagnant liquid resin material may be sucked into the discharge section 400 (supply device B) by moving the plunger 304 in the cylinder 301 to perform a pressure reducing action in the communication path 601.

The storage unit 100 may be provided with an appropriate liquid resin material pressurizing and transferring means for pressurizing and transferring the liquid resin material 200 stored in the storage unit to the measuring unit 300 side. Good. By using this liquid resin material pressure transfer means in combination, the transfer action toward the measuring section cylinder 301 can be efficiently assisted.
Specifically, for example, a plunger for pressurizing the liquid resin material is closely fitted in the storage portion cylinder 101, and the pressurizing plunger is made to follow the suction transfer action by the measuring portion plunger 304, or the What is necessary is just to set and comprise so that the liquid resin material 200 in the storage part cylinder 101 may be pressurized, cooperating with a suction transfer action.
Further, for example, as shown in FIG. 4, the outer periphery of the reservoir cylinder 101 is sealed with a sealing case member 105, and the compressed air 502 of the compressed air supply unit 500 is supplied into the case member. In addition, the liquid resin material 200 in the reservoir cylinder 101 may be set and configured to be pressurized by the compressed air 502.
Further, the sealing case member 105 may be provided so as to be freely opened and closed. For example, when the liquid resin material 200 is supplied to the reservoir 100, the case member 105 may be opened and closed. Further, the liquid resin material 200 may be directly supplied into the reservoir cylinder 101 via an appropriate feeding path 106.
When such a pressure transfer means is additionally provided, the liquid resin material can be efficiently transferred to the weighing unit cylinder 301 side. For example, the liquid resin material having high viscosity or low fluidity is metered and supplied. Even in such a case, it is possible to respond quickly and appropriately.

Further, depending on the properties of the liquid resin material to be weighed, a temperature management process of the liquid resin material for cooling or heating the liquid resin material may be performed.
That is, the fluidity of the liquid resin material to be measured is increased at all stages of storage of the liquid resin material, quantitative measurement of the liquid resin material, discharge of the quantitative liquid resin material, and discharge of the retained liquid resin material. Therefore, the liquid resin material may be heated to an appropriate temperature.
Further, when the liquid resin material to be weighed is a liquid resin material whose curing is promoted even at room temperature, such as a liquid thermosetting resin material, all or some of the above-described stages In this case, the liquid resin material may be cooled to an appropriate temperature.
It should be noted that such temperature control of the liquid resin material is performed by controlling all or a part of the liquid resin material storage part, the liquid resin material measuring part, the quantitative liquid resin material discharge part, and the compressed air supply part. This can be easily carried out by providing an appropriate heating mechanism or cooling mechanism for the liquid resin material at the site.

Next, with reference to FIG.6 and FIG.7, the outline | summary of the compression resin sealing molding by the compression resin sealing molding apparatus C of the electronic component provided with the liquid resin material supply apparatus B which concerns on this invention is demonstrated.
As shown in FIG. 1 (1), the above-mentioned compression resin sealing molding apparatus C is provided with a base 800 of the apparatus, tie bars 802 erected at four corners on the base, and a fixing plate at the upper end of the tie bar. A mold heat insulating plate (not shown) and an upper mold 804 for compression resin sealing molding mounted via an upper mold plate 803; a movable plate 805 fitted to a tie bar 802 at a position below the upper mold 804; The lower mold plate 807 mounted on the upper part of the plate via the lower mold heat insulating plate 806, the lower mold 808 for compression resin sealing molding installed on the lower mold plate, and the movable plate 805 are moved up and down. Thus, it is composed of a mold opening / closing mechanism 809 and the like by a servo motor or the like provided so that the opposing surfaces of the upper and lower molds (804, 808) can be joined and separated.

The upper mold plate 803 and the lower mold plate 807 are respectively provided with heaters for heating the upper mold 804 and the lower mold 808, and the upper and lower plates mounted on the upper mold plate 803 and the lower mold plate 807 Both types (804, 808) are provided with dedicated cooling means.
In addition, an appropriate release film tensioning device is provided in which a film 810 (see FIG. 6 (1)) for releasing a molded product is stretched on the mold surface of the lower mold 808 including the lower mold cavity surface on the upper surface of the movable plate 805. A mechanism (not shown) is provided.
The lower mold 808 has a single resin molding cavity 801 for loading and setting a small substrate, for example, a single substrate of a square substrate 811 (see FIG. 7A) having a side of about 50 to 70 mm. Accordingly, the molding die is reduced in size and the structure of each component corresponding thereto is also reduced, so that a so-called desktop compression resin sealing molding apparatus is configured.

The upper die 804 is detachably mounted on a recess 812 provided on the bottom surface side of the upper die plate 803.
Further, the upper mold is fixed in the recess through the fixing pin 813 and a downward pressing force is applied by the elastic projection output by the elastic member 814. Therefore, the upper mold 804 is recessed. It has a so-called floating structure that is urged away from the inner surface of 812 downward.
The upper die 804 is normally provided with a gap S of about 1 mm between the inner surface of the recess 812.
In addition, a cartridge heater 815 for heating the upper mold is installed in the upper mold plate 803 so that the upper mold plate 803 is constantly heated. Normally, the gap S between the upper mold 804 and the recess 812 is used. The heating action on the upper mold is efficiently suppressed by the air heat insulation action by the.
A cooling water passage 816 for cooling the upper die is disposed in the upper die 804, and a cooling water introduction / discharge pipe 817 connected to a water supply / drainage pump (not shown) is connected to the cooling water passage. Has been. Therefore, when the upper mold 804 is cooled, cooling water can be introduced into the cooling water channel 816 of the upper mold through the introduction / discharge pipe 817 by operating the water supply / drainage pump. Conversely, when the upper mold 804 is heated, The cooling water in the upper mold cooling water channel 816 is provided through the introduction / discharge pipe 817 so as to be discharged to the outside of the upper mold 804.
Reference numeral 818 denotes a pilot pin projecting from the bottom surface of the upper die 804, and reference numeral 819 denotes an intake hole formed in the bottom surface of the upper die 804, which is provided so as to communicate with the inside of the recess 812.
In order to perform heating and cooling operations on the upper mold 804 more efficiently and quickly, for example, it is preferable to form the upper mold from a copper-based material having a high thermal conductivity.

In addition, a seal member 820 is disposed on the bottom surface of the upper mold plate 803 which is the outer periphery of the upper mold 804, and the seal member 820 is formed on both mold surfaces when the upper and lower molds (804/808) are clamped. Is provided so that the outer periphery of both the upper and lower molds can be sealed when they are joined.
In addition, the upper plate 803 is provided with an intake passage 822 for connecting the seal range by the seal member 820 to the outside and for reducing the pressure of the seal range.
Further, the upper mold plate 803 is provided with an intake passage 821 that connects the inside of the recess 812 and the outside. Further, the intake passage 821 is connected in communication with a vacuum motor (not shown) disposed outside, and is provided so that the inside of the recess 812 can be decompressed by operating the vacuum motor.
When the pressure in the recess 812 is reduced by a vacuum motor, the upper mold 804 fitted in the recess rises against the elasticity of the elastic member 814 and is joined to the inner surface of the recess. Is provided. Therefore, the mechanism for joining the upper die 804 and the inner surface of the recess 812 is an upper die for applying a heating action by heat conduction from the upper die heating cartridge heater 815 provided on the upper die plate 803 to the upper die. A heating mechanism is configured. Reference numeral 823 denotes an upper guide pin.

Further, when the upper and lower molds (804 and 808) are clamped, the seal range by the seal member 820 and the vacuum motor disposed outside are connected in communication via the intake passage 822. Therefore, by operating the vacuum motor, the sealing range by the seal member 820 can be reduced.
In addition, an intake hole 819 provided in the bottom surface of the upper die 804 and a vacuum motor disposed inside and outside the recess 812 of the upper die plate are connected to each other via an intake passage 821 to operate the vacuum motor. As a result, the pressure in the suction hole 819 and the recess 812 of the upper mold plate and the suction passage 821 can be reduced.
Therefore, the square substrate 811 can be supplied and set on the bottom surface of the upper die 804 by the suction action of the intake holes 819 based on this reduced pressure. At this time, since the square substrate 811 is positioned via the pilot pins 818 projecting from the bottom surface of the upper die 804, the square substrate becomes the bottom surface of the upper die 804 by this adsorption action and positioning action. It is surely mounted at a predetermined position.
Note that the adsorption action of the square substrate 811 and the pressure reduction action of the seal range by the seal member 820 can be performed separately and independently.

A floating plate 824 is installed on the upper surface of the lower mold plate 807.
Further, an elastic member 825 is interposed between the lower mold plate 807 and the floating plate 824, and the elasticity of the elastic member 825 is applied as a pressing force in a direction that separates the two in the vertical direction.
A lower mold 808 is fitted on the upper surface portion of the lower mold plate 807.
The lower mold 808 is fitted in a mounting hole 826 provided in the central portion of the floating plate 824 so as to be vertically slidable, and the outer peripheral surface of the lower mold and the inner peripheral surface of the mounting hole. A gap S for intake is formed between the two. Further, the lower die 808 is fixed to the mounting hole 826 via the fixing pin 827, and an elastic projection output in the direction of pushing the fixing pin 827 upward is applied by the elasticity of the elastic member 828. The lower mold has a so-called floating structure that is urged away from the upper surface of the lower mold plate 807, and is usually about 1 mm between the lower mold 808 and the upper surface of the lower mold plate 807. The gap S is set.
In addition, a cartridge heater 829 for heating the lower mold 808 is installed in the lower mold plate 807. Normally, the air insulation action by the gap S between the lower mold 808 and the upper surface of the lower mold plate 807 is provided. Thus, the heating action on the lower mold is efficiently suppressed.
In addition, a cooling water passage 830 for cooling the lower die is disposed in the lower die 808, and a cooling water introduction / discharge pipe 831 connected to a water supply / drainage pump (not shown) is connected to the cooling water passage. Has been. Therefore, when the lower mold 808 is cooled, cooling water can be introduced into the lower mold cooling water channel 830 through the introduction / discharge pipe 831 by operating the water supply / drainage pump. Conversely, when the lower mold 808 is heated, The cooling water in the lower mold cooling water channel 830 is provided to be discharged to the outside of the lower mold 808 through the introduction / discharge pipe 831.
In order to heat and cool the lower mold 808 efficiently and quickly, it is preferable to form the lower mold with a copper-based material having a high thermal conductivity.

The lower die 808 is fitted in the mounting hole 826 of the floating plate 824 so as to be vertically slidable, and a gap S is provided between the lower die 808 and the upper surface of the lower die plate 807. In addition, both the lower mold plate 807 and the floating plate 824 are fitted via a seal member 833.
Further, the lower mold plate 807 is provided with an intake passage 834 for connecting the mounting hole 826 and the gap S to the outside, and this intake passage 834 is further provided with a vacuum motor (not shown) provided outside. It is connected to the communication. Accordingly, the mounting hole 826 and the gap S can be decompressed by operating the vacuum motor.
Further, when the pressure in the mounting hole 826 and the gap S is reduced by the vacuum motor, the lower mold 808 fitted in the mounting hole 826 is opposed to the elastic projection output by the elastic member 828. It is provided so as to descend to the upper surface of 807 and to be joined to the upper surface. Therefore, the mechanism for joining the lower mold 808 and the lower mold plate 807 constitutes a lower mold heating mechanism for applying a heating action by heat conduction from the cartridge heater 829 of the lower mold plate 807 to the lower mold.

  Next, the compression resin sealing molding operation by this compression resin sealing molding apparatus C will be described.

First, the cooling water W is introduced and circulated into the upper mold 804 and the lower mold 808 in the liquid resin material supply apparatus B and the compression resin sealing molding apparatus C, respectively, so that the upper mold plate 803 and the lower mold are cooled. The plate 807 is heated to the resin molding temperature by applying a heating action by the cartridge heaters 815 and 829.
At this time, the gap S is held between the upper and lower mold plates (803, 807) and the upper and lower molds (804, 808). Both types of heating action are efficiently suppressed.
In this state, as shown in FIG. 6 (1), both the upper and lower molds (804, 808) are opened and separated from the mold surface of the lower mold 808 via a release film stretching mechanism (not shown). Supply mold film 810.

Next, as described above, the quantitative resin transport device A is used to measure the liquid resin material 200 in the storage unit 100 and transfer the quantitative liquid resin material to the supply device B, and the passage switching unit 600 and the supply device B. Compressed air 502 is supplied to discharge the accumulated liquid resin material to supply the whole amount of the fixed liquid resin material and the accumulated liquid resin material into the lower mold cavity 801 of the compressed resin sealing molding apparatus C. .
At this time, as shown in FIGS. 5 (3) and 5 (4), when the liquid resin material R flows into the liquid resin material flow path 406 of the nozzle member 405, the nozzle member 405 to become a depressing against the liquid resin material discharge port 404 of the nozzle member to the elasticity of the elastic pressing member 409 by the inflow pressure, the tip upper-die molding of the liquid resin material discharge port portion 404 described above In this state, the 804 protrudes from the mold surface 804a to the protruding position 804c.
Accordingly, the liquid resin material R discharged downward from the liquid resin material discharge port 404 is efficiently supplied into the lower mold cavity 801 without adhering to the upper mold surface 804a. Further, even if the liquid resin material R has a high viscosity, for example, the liquid resin material may cause problems such as the liquid resin material solidifying into resin droplets at the liquid resin material discharge port 404 due to the cohesive force or surface tension. Can be prevented. Furthermore, it is possible to prevent the harmful effects of such liquid-like resin material to inhibit the resin discharge action from when attributed to harden the resin dropwise the liquid resin material discharge port portion in the liquid resin material discharge port portion 404 There is an advantage called.

As described above, the quantitative liquid resin material supplied from the supply device B into the lower mold cavity 801 is supplied into the lower mold cavity 801 through the release film 810 stretched on the mold surface of the lower mold 808. Will be.
At this time, since the cooling water W is introduced into the liquid resin material supply device main body 402 and the cooling water channel member 403 of the supply device B, the liquid resin flows in and flows down from above the liquid resin material flow channel 406. The liquid resin material R discharged downward from the material discharge port 404 can be cooled.
Therefore, for example, when the liquid resin material R is a thermosetting resin material, the thermosetting reaction can be efficiently suppressed. Therefore, even if the thermosetting resin material is supplied into the lower mold cavity 801. The fluidity is maintained, and the fluid flows smoothly in the lower mold cavity and is uniformly supplied and filled to every corner.

Next, as shown in FIG. 7, the rectangular substrate 811 is supplied and set at a predetermined position on the bottom surface of the upper mold 804, and the movable plate 805 is raised to seal the seal member 820 on the upper surface of the floating plate 824 and the bottom surface of the upper mold plate 803. The first mold clamping is performed.
The supply set of the square substrate 811 has an adsorption action from the suction hole by operating a vacuum motor (not shown) to depressurize the recess 812 of the upper mold plate and the upper mold suction hole 819 communicating with the recess 812. And the position of the pilot pin 818 projecting from the bottom of the upper die, the main body of the square substrate 811 is attracted to a predetermined position on the bottom surface of the upper die, and the electronic component 832 mounted on the opposite surface is lowered. It is performed by adsorbing in the state of the side.
Further, at the time of the first mold clamping, since the outer periphery of the lower mold cavity 801 between the mold surfaces of the upper and lower molds (804, 808) is sealed by the seal member 820, the outside air is blocked. .
At this time, the bottom surface of the square substrate 811 is not joined to the upper surface of the floating plate 824, and is therefore included in the air and the liquid resin material R within the sealing range by the pressure reducing action in the lower mold cavity 801. It is possible to perform pressure reduction between the upper and lower mold surfaces for efficiently and forcibly discharging bubbles and the like to the outside.

Next, or simultaneously with the supply set of the square substrate 811 described above, the upper die 804 is heated by the cartridge heater 815 to heat the upper die to the resin molding temperature.
The heating of the upper mold 804 reduces the pressure in the gap S between the upper mold and the inner surface of the recess 812, raises the upper mold against the elastic projection output of the elastic member 814, and the upper mold concave. It is performed by applying a heating action by heat conduction from the cartridge heater 815 to the upper mold 804 by joining to the inner surface of the place 812.
In addition, after this upper mold heating, or simultaneously with this, the water supply / drainage pump (not shown) is operated to drain the cooling water W in the upper mold cooling water channel 816 to the outside through the introduction / discharge pipe 817. The mold can be heated more quickly.

When the liquid resin material R is supplied into the lower mold cavity 801, the release film 810 is supplied to the mold surface of the lower mold 808, and the lower mold 808 is heated to the resin molding temperature. . The lower mold 808 is heated by operating a vacuum motor (not shown) to reduce the pressure in the mounting hole 826 and the gap S between the lower mold 808 and the upper surface of the lower mold plate 807 from the intake passage 834. The lower die 808 is lowered against the elastic projection output of the elastic member 828 and joined to the upper surface of the lower die plate 807, so that the lower die 808 is heated by heat conduction from the cartridge heater 829.
In addition, after this lower mold heating, or simultaneously with this, the water supply / drainage pump (not shown) is operated to drain the cooling water W in the lower mold cooling water channel 830 to the outside through the introduction / discharge pipe 831. The mold can be heated more quickly.
Further, the pressure reducing action in the mounting hole 826 and the gap S during the heating of the lower mold is such that the gap S formed in the fitting portion between the lower mold 808 and the mounting hole 826 is shown in FIG. This also acts as a suction force for forcibly sucking the release film 810 from the bottom and fitting it onto the surface of the lower mold cavity 801.

Next, by further raising the movable plate 805, second mold clamping is performed to join the upper surface of the floating plate 824 and the bottom surface of the square substrate 811.
At the time of the second mold clamping, the pressure reducing action within the above-mentioned sealing range is performed, and the electronic component 832 on the bottom surface of the square substrate is immersed in the liquid resin material R in the lower mold cavity 801.

Next, a third mold clamping is performed in which the lower mold plate 807 is further raised against the elastic projection output of the elastic member 825.
At the time of the third mold clamping, the liquid resin material R in the lower mold cavity 801 is compressed by raising the lower mold plate 807 and the lower mold 808.
Accordingly, at this time, the electronic component 832 on the bottom surface of the square substrate is immersed in the liquid resin material R in the lower mold cavity 801 and is gradually pressurized and a predetermined compressive force is applied to the liquid resin material R. It will be sealed.

Next, a first mold opening for setting an air insulation gap S between the upper mold 804 and the upper mold heating cartridge heater 815 and between the lower mold 808 and the lower mold heating cartridge heater 829 is performed. At the same time, when the first mold is opened, the upper mold 804 and the lower mold 808 are cooled.
When both the upper and lower molds (804/808) are cooled, the vacuum mold (not shown) is stopped and the decompression state in the mounting hole 826 is released. The lower die 807 is raised from the surface of the lower die plate 807 to raise the lower die so that the gap S is maintained between the lower die and the lower die plate. Similarly, the operation of the vacuum motor is stopped and the upper die is stopped. By releasing the reduced pressure state in the recess 812 of the plate 803, the upper die 804 is lowered by the elastic projection output of the elastic member 814, and the upper die is lowered to hold the gap S between the upper die and the upper die plate. I do. The air insulation action by the gap S can efficiently suppress the heating action by heat conduction from the upper and lower plate sides of the upper and lower molds, that is, the cartridge heaters (815 and 829).
Further, the lower mold 808 is forcibly cooled by operating a water supply / drainage pump (not shown) and supplying and circulating cooling water W through the introduction / discharge pipe 831 into the lower mold cooling water channel 830. The upper mold 804 is forcibly cooled by supplying and circulating the cooling water W into the upper mold cooling water channel 816 through the introduction / discharge pipe 817. This makes it possible to perform forced and rapid cooling of the upper and lower molds (804 and 808).
Maintaining the gap S between the upper and lower molds (804, 808) and the upper and lower plates (803, 807) by stopping the vacuum motor, and forcing the upper and lower molds (804, 808) by operating the water supply / drainage pump By cooling, both the upper and lower molds can be quickly and reliably cooled.
Further, when the upper die 804 is lowered by releasing the above-described reduced pressure state, the reduced pressure state in the intake hole 819 on the bottom surface of the upper die is also released and the adsorption action to the square substrate 811 is eliminated, so that the removal of the square substrate is eliminated. Becomes easy.

  If the upper and lower molds are further opened after the first mold opening, the floating plate 824 is raised relative to the lower mold plate 807 by the elastic projection output of the elastic member 825. The ascending action of the floating plate 824 works as a molded product releasing action for releasing the compressed resin sealing molded body (not shown) on the bottom of the square substrate from the lower mold cavity 801.

Next, the movable plate 805 is lowered to separate the upper and lower molds (804, 808), and the second mold opening is performed to return the upper and lower molds to the original mold opening position (see FIG. 6). In addition, the square substrate 811 (compressed resin sealing molded product) in which the compressed resin sealing molded body is integrated is taken out from the lower mold cavity 801 where the release film 810 is stretched.
Note that when the above-mentioned compressed resin sealing molded body is released from the lower mold cavity 801, both the upper and lower molds (804, 808) are rapidly cooled. In response, it shrinks and is easily released from the lower mold cavity. That is, since the hardness of the compression resin sealing molded body is increased by cooling the compression resin sealing molded body, the shape accuracy of the compression resin sealing molded body is maintained at the time of the mold release. It is possible to efficiently prevent problems such as warpage and deformation in the sealed molded body.
Therefore, it is possible to take out this compressed resin-sealed molded product to the outside immediately after the upper and lower molds (804, 808) have been opened, so the overall resin molding cycle time is shortened and high efficiency is achieved. Production can be promoted.

  As described above, in the configuration of the present embodiment, the liquid resin material supply device B according to the present invention is combined with the small-sized liquid resin material quantitative conveyance device A and the small compression resin sealing molding device C. Therefore, it is possible not only to efficiently and reliably form a compression resin-sealed molded product of electronic parts with uniform, high quality and high reliability, but also the overall structure of the compression resin sealing molding device. Since the shape can be reduced in size and weight, it can be suitably implemented as a so-called desktop type electronic component compression resin sealing molding apparatus.

In addition, since the liquid resin material can be discharged from the liquid resin material discharge port by applying a required pressure to the liquid resin material in the liquid resin material flow path in the liquid resin material supply apparatus B, Even if it is a liquid resin material, it can be supplied into the lower mold cavity in the compression resin sealing mold while maintaining its fluidity.
Also, the liquid resin material discharge port portion of the nozzle member due to the inflow pressure of the liquid resin material, and the tip of the liquid resin material discharge port portion against the elasticity of the elastic pushing member, the mold surface of the upper mold for resin sealing molding Since it can be opened in a state where it has been moved to a position protruding from the liquid resin material, the liquid resin material discharged downward from the liquid resin material discharge port portion can be reliably prevented from adhering to the upper mold surface side. can do.
Further, in the liquid resin material inflow pressure releasing step, the flow path is depressurized and the liquid resin material discharge port of the nozzle member and the valve of the valve member are fitted to close the liquid resin material discharge port. Since the liquid resin material can be prevented from being discharged from the liquid resin material discharge port, the so-called liquid leakage phenomenon from the liquid resin material discharge port can be reliably prevented.
In addition, since a cooling action can be applied to the liquid resin material flowing in the liquid resin material flow path in the liquid resin material supply device, the use of the liquid thermosetting resin material used for sealing molding of electronic components and Handling becomes easy.

  The present invention is not limited to the above-described embodiments, and can be carried out by arbitrarily changing or selecting as necessary within a range not departing from the gist of the present invention.

  Since the present invention can be applied to a compression resin sealing molding apparatus for electronic parts having a reduced size and weight, it can be applied as a simple or table-top compression resin sealing molding apparatus.

A Liquid resin material quantitative conveyance device B Liquid resin material supply device C Compression resin sealing molding device R Liquid resin material S Gap W Cooling water
100 Reservoir
101 Plastic cylinder
101a Tip connection site
102 Cylinder guide
103 Fixing member
104 Containment tank
105 Case material for sealing
200 Liquid resin material
300 Weighing unit
301 Plastic cylinder
301a Connection site
302 Fixing member
303 Seal member
304 Plunger
305 Reciprocating drive mechanism
400 Discharge unit
401 Fitting / removal part
402 Liquid resin material supply unit
403 Cooling channel member
404 Liquid resin material discharge port
405 Nozzle member
406 Flow path of liquid resin material
407 Valve member
408 valve
409 Elastic push member
410 Cooling water pipe
411 Cooling water inlet / outlet
500 Compressed air supply section
501 Air supply route
502 Compressed air
600 Passage switching part
601 communication path
602 Branch valve member
603 Rotation control mechanism
700 Insert plate
701 Cylindrical mounting member
702 Upper communication port
703 Lower communication port
704 Right side communication port
705 left side communication port
706 Connection hole
707 Mounting hole
708 connection hole
709 connection hole
800 base
801 Lower mold cavity
802 tie bar
803 Upper plate
804 Upper mold for compression resin sealing molding
804a Upper mold surface
804b Retreat position from upper mold surface
804c Projection position from upper mold surface
805 Movable plate
806 Lower insulation board
807 Lower mold plate
808 Lower mold for compression resin molding
Model 809 opening / closing mechanism
810 Mold release film
811 square substrate
812 recess
813 Fastening pin
814 Elastic member
815 Cartridge heater
816 Upper cooling water channel
817 Introductory exhaust pipe
818 pilot pin
819 Air intake vent
820 Seal material
821 Air intake passage
822 Intake passage
823 Upper guide pin
824 floating plate
825 Elastic member
826 Mounting hole
827 Fastening pin
828 Elastic member
829 Cartridge heater
830 Lower cooling water channel
831 Inlet / exhaust pipe
832 Electronic components
833 Seal material
834 Air intake passage

Claims (4)

A substrate setting cavity is disposed in a lower mold for resin sealing molding of an electronic component comprising at least upper and lower molds, and an electronic component mounted on the substrate is immersed in the liquid resin material supplied into the lower mold cavity. A liquid resin material supply method used for compression resin sealing molding of electronic parts, in which a predetermined heating action and pressurizing action are applied to the liquid resin material to resin-mold the electronic parts,
A nozzle member having a liquid resin material discharge port on the upper side of the resin sealing molding; a valve member for opening and closing the liquid resin material discharge port having a liquid resin material flow path; and Liquid resin material supply device for preparing a liquid resin material supply device comprising an elastic pushing member for fitting a liquid resin material discharge port portion and a valve of the valve member to close the liquid resin material discharge port portion A preparation process;
A liquid resin material inflow step of flowing a required amount of the liquid resin material at a required pressure into the liquid resin material flow path of the liquid resin material supply device;
In the liquid resin material inflow step, the liquid resin material discharge port portion of the nozzle member is caused by the inflow pressure of the liquid resin material , and the tip portion of the liquid resin material discharge port portion is opposed to the elasticity of the elastic pushing member. A liquid resin material discharge port opening step that is opened in a state of being moved to a position protruding from the mold surface of the upper mold for sealing molding ;
A liquid resin material discharge step of discharging the liquid resin material in the liquid resin material flow path into the lower mold cavity from the liquid resin material discharge port portion opened in the liquid resin material discharge port opening step;
A liquid resin material inflow pressure releasing step of releasing the inflow pressure to the liquid resin material in the liquid resin material flow path after or simultaneously with the liquid resin material discharge step;
A compression of an electronic component, characterized by performing a liquid resin material discharge port closing step for closing the liquid resin material discharge port after or simultaneously with the liquid resin material inflow pressure releasing step Liquid resin material supply method used for resin sealing molding. In the liquid resin material inflow pressure releasing step , the liquid resin material flow path is set in a reduced pressure state, and the liquid resin material discharge port of the nozzle member and the valve of the valve member are fitted together to form the liquid. A liquid resin material discharge preventing step for preventing the liquid resin material in the flow path of the liquid resin material from being discharged from the liquid resin material discharge port portion by closing the resin material discharge port portion is performed. Item 2. The liquid resin material supply method according to Item 1. A substrate setting cavity is disposed in a lower mold for resin sealing molding of an electronic component comprising at least upper and lower molds, and an electronic component mounted on the substrate is immersed in the liquid resin material supplied into the lower mold cavity. A liquid resin material supply device for use in an electronic component compression resin sealing molding device that applies a predetermined heating action and pressurizing action to the liquid resin material to resin-mold the electronic component,
The liquid resin material supply device includes a liquid resin material supply device body that is detachably mounted on a fitting attachment / detachment portion provided on the molding upper mold side, and a liquid resin material supply device body that fits inside the liquid resin material supply device body. a cooling water passage member was charged, the cooling water channel members nozzle member provided with a liquid resin material discharge port portion which is fitted into the liquid resin material discharge failure with a liquid resin material flow path is fitted to the nozzle member A valve member for opening and closing the outlet, and an elastic pushing member for closing the liquid resin material discharge port by fitting the liquid resin material discharge port of the nozzle member and the valve of the valve member. And
When allowed to flow into the liquid resin material into the liquid resin material flow path of the nozzle member, the liquid resin material discharge port portion of the nozzle member by the inflow pressure, the liquid resin against the elasticity of the elastic pressing member A compressed resin seal for an electronic component, wherein the material discharge port portion is provided so as to be opened in a state of being moved to a position protruding from a mold surface of the upper mold for resin sealing molding. A liquid resin material supply device used in a stationary molding device.   4. The liquid resin material supply device according to claim 3, wherein a cooling water introduction / discharge portion for connecting a cooling water pipe is provided at an upper end portion of the liquid resin material supply device main body.

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