JPS6057636A - Injector for liquid resin - Google Patents

Abstract

PURPOSE:To prevent a leakage to the outside at the separation of a liquid resin in a nose nozzle by providing an expansion mechanism in which the internal volume of an injection path for a filling resin formed in an injection nozzle is provided with variability. CONSTITUTION:When an injection port nozzle 2 is pushed against an injection port for a mold, a head section flange 8 in the nozzle 2 contracts a rear-section compression spring 12 in the nozzle 2. A rear-section Si rubber tube 14 brought into contact with a nose joint 13 is compressed and deformed through the nose joint at the same time, and the internal volume of an injection path A for a liquid resin in the nozzle 2 is reduced. The liquid resin is fed from a resin feeding port under the state, and the liquid resin is injected into the mold. The pressing is released after a fixed time after an injection, and the nozzle 2 is retreated from the mold. Since the flange 8 is restored by the spring 12 on the retreat while the rubber tube 14 is also restored, the internal volume of the path A is increased, thus returning the liquid resin in a noze nozzle 7 into the nozzle 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a resin injection device for sealing a semiconductor element in a liquid resin, and particularly to an improvement of an injection port nozzle thereof.

[Prior art]

1 and 2 show a conventional liquid resin injection device of this type. In these figures, 1 is a mold for sealing a semiconductor element in a predetermined shape in liquid resin, and 2 is a liquid resin injection device. 5. Inject the resin with the inlet nozzle. A back end is formed from a nozzle holder 6 and a tip nozzle 7 which are screwed together at the tip thereof. 3 is a liquid resin supply pipe attached to the inlet nozzle 2, and 4 is this liquid resin supply pipe (171 fat supply vibe 3).
This is the resin supply port for the resin.

In the above configuration, in order to seal the semiconductor element in the liquid resin, the half-six-body element is first housed, and after the mold 1 is clamped, the inlet nozzle 2 is moved into the mold 1 by an appropriate driving source. is pressed against the injection port. Next, liquid resin supply pipe 3
Liquid resin is pressurized and supplied from the resin supply port 4, and is injected into the mold 1 from the tip nozzle 7 through the injection port nozzle 2'lt. After injection, the pressure is further increased, and after a certain period of time, the pressure is stopped and the injection port 7 nozzle 2 is moved into the mold 1 by the drive source.
move further back.

The conventional liquid resin injection device is configured as described above, so when the injection nozzle 2 retreats from the mold 1, the liquid resin under pressure inside the injection nozzle 2 is released from the tip nozzle 1. Leak outside.

For this reason, the liquid resin adheres to the surface of the tip nozzle I, which may cause poor contact with the injection port of the mold 1 during the next sealing Vc.
Alternatively, there was a drawback that the residual resin hardened within the discharge port of the tip nozzle 7. 1 [Summary of the Invention] The present invention is an attempt to eliminate the drawbacks of the conventional ones as described above, and it is possible to make the internal volume of the filling resin injection passage formed in the injection port nozzle variable. By providing a telescopic mechanism, 1. When the liquid resin is separated from the tip nozzle, it is returned to the inside of the inlet nozzle to prevent leakage to the outside.

(Embodiment of the Invention) An embodiment of the invention will be described below with reference to FIGS. 1 and 3. That is, the appearance of the resin injection device is similar to the conventional one shown in FIG. However, ■− in Figure 1
The internal structure of the inlet nozzle 2 is completely different from taVc in FIG.
In the figure, the same reference numerals as in FIG.
4) As shown, the fl is held between the two. 1ii
i A compression spring 12 positioned between the outer sleeve 9 and the concentric vibe 10 at a rear flange fitted to the rear end of the outer sleeve 9 and the concentric vibe 10 is connected between the head flange 8 and the compression spring 12. 13 and 14 are inserted between the head flange 8 and the rear fluff 11, with a distal joint and a rear solicon comb tube that are slidable within the concentric vibe 10.

Tip nozzle 12 Head flank 8 and rear flange 11
A liquid resin injection passage A is formed in the center of these, and in particular, the internal volume to this injection passage can be expanded and contracted 4 (!
It is now an inn.

Next, a description will be given of the operation of resin sealing a semiconductor element using the liquid resin injection apparatus of the present invention, which is formed by ic n'z as described above. In other words, after the mold 1 is closed after housing the semiconductor device, the injection port nozzle 2 is
is pressed against the injection port of the mold 1. In such a case, the head flange 8 contracts the compression spring 12 at the rear thereof, and at the same time compresses and deforms the rear silicone rubber tube 14 which is in contact with the head flange 8 via the tip joint 13, thereby opening the inlet nozzle 2.
Reduce the internal volume of liquid resin into the injection passage.

In this state, liquid resin is supplied from the resin supply port 4, and is injected into the mold 1 from the liquid resin supply pipe 3 through the injection port nozzle 2.

After injection, the liquid resin Vc is further pressurized Jl, and after a certain period of time, this pressurization is released, and the inlet nozzle 2 is retreated from the mold 1 by the cooling/heating drive. During this retreat, the head flange') 8 is restored by the compression spring 12, and the rear silicone rubber tube 14 is also restored at the same time, so that the internal volume of the liquid resin into the injection passage in the injection port nozzle 2 increases. lc)L, Therefore, the liquid resin in the tip nozzle 1 is returned to the inlet nozzle 2.

〔Effect of the invention〕

As explained above, the liquid resin injection device of the present invention is
Pressing the inlet nozzle against the mold.

A telescoping mechanism is provided that changes the internal volume of the liquid resin injection passage in the injection port nozzle by utilizing separation and movement, so the internal volume of the injection passage increases when the injection port nozzle retreats. This allows you to easily eliminate the liquid resin leakage and hardening phenomenon at the discharge port of the tip nozzle.
1 has the advantage of making it possible to improve the bone motion rate of the device.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a conventional liquid resin injection device, and FIG. 2 is a perspective view showing a conventional liquid resin injection device. f, - Partially enlarged sectional view showing a conventional injection port nozzle; FIG. 3 is an enlarged sectional view taken along line 1--1 in FIG. 1; In the figure, 1 is a mold, 2 is an inlet nozzle, 7 is a tip nozzle,
A is the injection passage. In addition, the same symbols in the figures are the same -1
: or the corresponding part. Agent Masuo Oiwa (2 others)

Claims (1)

[Claims] In a liquid resin injection device equipped with an injection port nozzle for injecting liquid resin into a mold for resin-sealing a semiconductor element, the inner volume of the filling resin injection passage formed in the injection port nozzle is determined by the injection of the resin. A 5K expansion/contraction mechanism is provided that decreases the amount when the tip nozzle is pressed against the mold, and automatically restores and increases when the external pressing force on the tip nozzle is released when injection of the resin into the mold is completed. A liquid resin injection device characterized in that: