JP4954171B2 - Compressed resin sealing molding method and apparatus for electronic parts - Google Patents

Description

  The present invention relates to a compression resin sealing molding method for sealing and molding a small electronic component such as a semiconductor element with a resin material and a compression resin sealing molding apparatus using this method. The overall structure of the stop molding device can be reduced in size and weight, and an efficient compression resin sealing molding operation can be performed even when a thermosetting resin material that is easily cured during resin molding is used. It relates to the improvement.

A compression resin sealing molding (compression molding) method is employed as one means for resin sealing molding of electronic components mounted on a substrate.
In this method, for example, a liquid thermosetting resin material is supplied into a lower mold cavity of a compression resin sealing mold composed of upper and lower molds, and an electronic component on a substrate is immersed in the liquid resin material. The electronic component is molded by resin sealing by applying predetermined heating and clamping pressure to the liquid resin material.
In this method, a dispenser is usually used to supply the liquid thermosetting resin material into the cavity of the lower mold. For example, the main body of the dispenser is installed so that it can be moved back and forth between the upper and lower molds, and when the upper and lower molds are opened, the dispenser main body enters between the upper and lower molds and from the tip nozzle of the dispenser. A fixed amount of liquid thermosetting resin material is discharged (see, for example, Patent Document 1).
JP 2003-165133 A (page 4, column 5, lines 7-14, FIG. 9, FIG. 11, etc.)

By the way, when a liquid thermosetting resin material is used as a molding material for resin-sealing electronic components, for example, a light-emitting diode (LED chip) mounted on a substrate is sealed with a silicone resin. When the resin material is cured in a short time, a process performed after the thermosetting resin material supplying process into the lower mold cavity, that is, the light emitting diode on the substrate is replaced with the resin material. There are cases where the step of immersing in the inside cannot be performed efficiently and in an appropriate state.
For example, when the thermosetting resin material supply process into the lower mold cavity is not performed quickly and properly, the thermosetting reaction of the resin material is promoted to become a high viscosity state. The resin material cannot be uniformly supplied to every corner, and if the light emitting diode is immersed in the thermosetting resin material in a high viscosity state, the gold wire may be deformed or cut. As a result, a serious adverse effect on the resin sealing molding occurs such that the resin sealing molding is performed in a state of poor electrical connection.
Further, when a thermosetting resin material is used, there are the following specific problems. That is, since the resin molded body immediately after being molded in the lower mold cavity is heated to the resin molding temperature and is still in a state of insufficient hardness at a high temperature, such a resin molded body is quickly removed from the lower mold cavity. When taken out, the resin molded body is warped or deformed, resulting in a molding failure product. For this reason, the resin molded body is taken out from the lower mold cavity after the temperature of the resin molded body is lowered. However, since it is necessary to set a long time in the process of taking out the resin molded body, the overall resin molding cycle time becomes longer due to this, resulting in a decrease in productivity. There is.
In addition, when using a large compression resin sealing molding device in which a plurality of cavities are provided between the upper and lower molds, and a substrate is loaded and set in each of these cavities, liquid thermosetting is performed in each cavity. The thermosetting resin material is supplied, but the thermosetting resin materials in the cavities at the time when all the resin material supply steps are finished have different viscosities. For this reason, the step of immersing the light-emitting diode in the liquid thermosetting resin material cannot be performed under uniform conditions, and as described above, the gold wire of the light-emitting diode immersed in the resin material is not used. Compressed resin for electronic parts with uniform, high quality and high reliability, because it causes serious problems such as deformation or cutting and resin sealing molding with poor electrical connection. There is a serious problem in resin molding that the sealed molded product cannot be efficiently and reliably molded.
In the case of using a large compression resin sealing molding apparatus, for example, the liquid thermosetting resin material in each cavity can be supplied by simultaneously performing the supply process of the liquid thermosetting resin material into each cavity. Viscosity can be made uniform. However, at this time, there is a problem that it is necessary to increase the number of the dispensers described above, and the overall apparatus structure is further complicated or the overall shape is further increased.

The present invention is intended to solve the above-described problems, and is a compression resin capable of efficiently and reliably forming a compression resin-sealed molded product of an electronic component having uniform, high quality, and high reliability. An object of the present invention is to provide a sealing molding method and a compression resin sealing molding apparatus using this method.
In addition, the present invention improves the overall structure of the compression resin sealing molding apparatus to reduce the size and weight of the apparatus, and uses a liquid thermosetting resin material that is easily cured during resin molding. It is an object of the present invention to provide a method and an apparatus capable of performing an efficient compression resin sealing molding operation even in such cases.

  According to a first aspect of the present invention for solving the above-described problem, an electronic component mounted on a substrate is immersed in a liquid resin material in a lower mold cavity for resin sealing molding, and a predetermined amount is added to the liquid resin material. An electronic component compression resin sealing molding method in which an electronic component on the substrate is resin-sealed and molded by applying a heating action and a pressurizing action, wherein a single substrate set cavity is disposed in the lower mold, and In addition, a gate nozzle for supplying a liquid resin material is disposed in the upper mold facing the lower mold, and the liquid resin material is supplied into the lower mold cavity disposed below the gate nozzle through the gate nozzle. The temperature control of the liquid resin material flowing in the gate nozzle and the temperature control of both the upper and lower molds are performed at the time of supplying the liquid resin material and the step of resin-sealing and molding the electronic components on the substrate. And butterflies.

  The invention according to claim 2 for solving the above-described problem is characterized in that the temperature management of the liquid resin material flowing in the gate nozzle and the temperature management of both the upper and lower molds are performed simultaneously.

  The invention according to claim 3 for solving the above-described problem is characterized in that the temperature management of the liquid resin material flowing in the gate nozzle and the temperature management of both the upper and lower molds are individually performed. .

  Moreover, the invention which concerns on Claim 4 for solving an above-mentioned subject suppresses the thermosetting reaction of the liquid thermosetting resin material which flows through the inside of this gate nozzle by providing the cooling means of the said gate nozzle. It is characterized by.

  Further, the invention according to claim 5 for solving the above-mentioned problem is that the cooling means is provided in each of the upper and lower molds, so that after the step of resin-sealing the electronic component on the substrate, The step of cooling the upper mold and / or the lower mold is performed.

  Further, the invention according to claim 6 for solving the above-described problem is that the liquid resin material is in a state where a film for releasing a molded product is stretched on the mold surface of the lower mold including at least the lower mold cavity portion. A supply step is performed.

  According to a seventh aspect of the invention for solving the above-described problem, an electronic component mounted on a substrate is immersed in a liquid resin material in a lower mold cavity for resin sealing molding, and the liquid resin material is An electronic component compression resin sealing molding apparatus for resin sealing molding of electronic components on the substrate by applying a predetermined heating action and pressurizing action, wherein at least an upper die and a lower die arranged in the vertical direction A compression resin sealing mold, and a gate nozzle for supplying a liquid resin material is disposed in the upper mold, and a single substrate set cavity is disposed in the lower mold. Further, the present invention is characterized in that a temperature management means for the liquid resin material flowing in the gate nozzle and both the upper and lower temperature management means are arranged.

  The invention according to claim 8 for solving the above-described problem is configured by disposing cooling means for suppressing a thermosetting reaction of the liquid thermosetting resin material flowing in the gate nozzle to the gate nozzle. It is characterized by that.

  The invention according to claim 9 for solving the above-described problem is characterized in that a cooling means is provided for each of the upper and lower molds.

  According to a tenth aspect of the present invention for solving the above-mentioned problem, a release film tensioning mechanism for tensioning a mold release film on a mold surface of the lower mold including at least the lower mold cavity. It is characterized by being arranged.

According to the first and seventh aspects of the present invention, a resin molding cavity for loading and setting a single substrate is disposed in the lower mold of the resin molding mold, and the lower mold is opposed to the lower mold. A gate nozzle for supplying the liquid resin material is disposed in the upper mold, and the liquid resin material can be immediately supplied through the gate nozzle into the lower mold cavity disposed below the gate nozzle. For this reason, it is possible to efficiently and reliably form a compression resin-sealed molded product of electronic parts with uniform, high quality and high reliability, and the overall structure and shape of the compression resin seal molding apparatus. Can be reduced in size and weight.
In addition, by performing temperature control of the liquid resin material flowing in the gate nozzle and temperature control of both the upper and lower molds, it is possible to perform efficient resin sealing molding adapted to the properties of the liquid resin material to be used.

  Further, according to the present invention according to claim 2 and claim 3, by performing the temperature management of the liquid resin material flowing in the gate nozzle and the temperature management of both the upper and lower molds simultaneously and / or individually, Resin sealing molding suitable for the properties of the liquid resin material can be performed.

  Further, according to the present invention according to claims 4 and 8, even when a thermosetting resin material is used as the resin material, the gate nozzle cooling means is provided, so that the fluid flows in the gate nozzle. Since the thermosetting reaction of the liquid thermosetting resin material to be performed can be suppressed, the thermosetting resin material can be quickly and efficiently supplied into the lower mold cavity while maintaining its fluidity.

  Further, according to the present invention according to claim 5 and claim 9, by providing the cooling means in both the upper and lower molds, for example, after the step of resin sealing molding of the electronic components on the substrate, for example, the lower mold By cooling, the shrinkage action of the resin-sealed molded product (resin molded body portion) in the lower mold cavity can be accelerated. In addition, since the hardness of the resin-sealed molded product is increased by cooling the resin-sealed molded product (resin molded body portion), the shape accuracy of the resin-sealed molded product during the molded product take-out process (during release) Is maintained, and the resin-encapsulated molded product can be efficiently prevented from warping or deformation. Therefore, since the start time of the molded product take-off process in which the resin-encapsulated molded product is released from the cavity and taken out to the outside can be advanced, the overall resin molding cycle time is shortened and high-efficiency production is achieved. Is possible. Furthermore, since this mold release action can be performed efficiently, it becomes possible to mold the resin in a fine shape.

  Further, according to the present invention according to claims 6 and 10, the resin sealing molding step in a state where a film for releasing a molded product is stretched on the mold surface of the lower mold including at least the lower mold cavity. Therefore, it is possible to prevent the resin material from adhering to the lower mold cavity surface. For this reason, it is possible to reliably perform the releasing action of the resin-sealed molded product, and it is possible to use a resin material having high adhesion to the cavity surface.

  Next, embodiments of the present invention will be described with reference to the drawings.

  1 to 3 show an outline of a compression resin sealing and molding apparatus for electronic parts according to the present invention. FIGS. 1 and 2 are schematic views of the overall configuration, and FIG. 3 is an enlarged view of a part thereof. It shows.

  A compression resin sealing molding apparatus shown in FIG. 1 includes a base 1 of the apparatus, tie bars 2 erected at four corners on the base, a fixing plate 3 provided at an upper end of the tie bar, and the fixing An upper mold plate 5 mounted on the lower part of the plate via an upper mold heat insulating plate 4, an upper mold 6 for compression resin sealing molding installed on the upper mold plate, and a tie bar at a position below the upper mold 2, a movable plate 7 fitted to the movable plate 7, a lower mold plate 9 mounted on the upper portion of the movable plate via a lower mold heat insulating plate 8, and a compression resin sealing molding mounted on the lower mold plate. The lower die 10 and the base plate 1 are provided so that the opposing surfaces of the upper and lower dies 6 and 10 can be joined or separated by moving the movable plate 7 up and down in the vertical direction. A mold opening / closing mechanism 11 by a servo motor or the like, and a liquid resin material (for example, (Cone resin and curing agent) container 12, liquid resin material weighing unit 13, liquid resin material mixing and conveying unit 14, and liquid resin material mixing and conveying unit 14 mounted on the upper mold plate 5. A gate nozzle 15 for supplying the required amount of the liquid resin material to a predetermined portion (lower mold cavity) of the lower mold 10 is configured.

Further, as will be described later, the upper mold plate 5 and the lower mold plate 9 are respectively provided with heaters for heating the upper mold 6 and the lower mold 10, and the upper mold plate 5 and the lower mold plate 9. Each of the upper and lower molds 6 and 10 and the gate nozzle 15 installed in each is provided with a dedicated cooling means. Therefore, these are configured as the temperature management means of the upper and lower molds 6 and 10 and the temperature management means of the gate nozzle 15.
Further, as shown in FIG. 2, a release film tensioning mechanism for tensioning a mold release film 16 on the mold surface of the lower mold 10 including at least the lower mold cavity surface on the upper surface of the movable plate 7. 17 is disposed. The release film tensioning mechanism 17 includes a release film supply roller 171 disposed on one side of the upper surface of the movable plate, a release film take-up roller 172 disposed on the other side, and rotationally driving the take-up roller. Motor 173 and a tension roller 174 for applying appropriate tension to the release film 16 so that the release film 16 stretched between the rollers 171 and 172 does not wrinkle or slack. Yes.
Further, as will be described later, the lower mold 10 is provided with a single resin molding cavity for loading and setting a small substrate, for example, a single square substrate having a side of about 50 to 70 mm. Thus, the size of the lower mold is reduced.
Furthermore, since such a small substrate mold is adopted and the structure of each component corresponding thereto is also miniaturized, the overall shape of the apparatus is miniaturized, so-called desktop compression resin sealing. It is configured as a stop forming device.

Next, a detailed description will be given of the relationship between the liquid resin material container 12, the metering unit 13, and the mixing and conveying unit 14.
As shown in an enlarged view in FIG. 3, the accommodating portion 12 includes an accommodating tank 121 made of a liquid resin material such as a silicone resin as a main agent and an accommodating tank 122 made of a liquid curing agent.
The metering unit 13 is provided with an on-off valve 131 and an on-off valve 132 that are opened and closed in response to a signal from the control unit 18, and one of the on-off valves 131 receives an open signal from the control unit 18. A predetermined amount of the liquid resin material in the open storage tank 121 is set so as to close after being injected into the mixing and conveying unit 14. Similarly, the other on-off valve 132 receives the open signal from the control unit 18 and opens and stores it. The liquid curing agent in the tank 122 is set to close after being injected into the mixing and conveying unit 14.
The mixing / conveying section 14 is provided so that both liquids can be mixed evenly by mixing the liquid resin material and the liquid curing agent injected through the both on-off valves 131 and 132. The mixing and conveying unit 14 is provided with an on-off valve 141 that is opened and closed in response to a signal from the control unit 18. When the on-off valve 141 is opened, both liquids (liquid thermosetting resin material R) mixed in the mixing and conveying unit 14 are smoothly conveyed to the gate nozzle 15 located below.
Reference numeral 19 denotes an operation panel unit of the apparatus.

  As a means for mixing both liquids injected into the mixing and conveying unit 14, an appropriate mixing mechanism such as a rotating blade 142 that mixes both liquids while stirring can be adopted. Any configuration may be used as long as necessary and sufficient mixing action is obtained in the conveyance path leading to the section.

What is indicated by a symbol A in FIG. 3 is compressed air.
This compressed air A introduces the compressed air into the mixing and conveying unit 14 at the end of the conveyance of both liquids as described above, so that the entire amount of the mixed liquids can be more reliably conveyed to the gate nozzle 15 side. belongs to.
In addition, the both-liquid conveyance process (namely, conveyance process of residual liquid thermosetting resin material) by such compressed air is for assisting the conveyance effect | action to the gate nozzle 15 side of both liquids, Therefore, Adopt as needed.
For the same purpose, compressed air is introduced into the metering unit 13 so that a part of the liquid resin material that is to remain in the metering unit is transported to the gate nozzle side (in the mixing and transporting unit 14). May be.

  4 to 6 illustrate the relationship between the upper mold plate 5 and the upper mold 6 and the gate nozzle 15 described above, which will be described in detail below.

4 (1) shows the upper die plate 5, the upper die 6 and the gate nozzle 15 portion, and FIG. 4 (2) shows the bottom (lower surface) portion thereof.
The upper mold 6 is fitted in a recess 51 provided on the bottom surface side of the upper mold plate 5, but the upper mold is mounted so as to be removable from the recess (a state in which it can be easily detached). ing. The upper mold is fixed in the recess through the fixing pins 61 and is mounted at a predetermined position on the upper mold plate 5 by the positioning pins 62. Further, the upper die 6 is applied with an elastic projection output by an elastic member 63 for pushing the fastening pin 61 downward, and therefore the upper die is biased so as to be separated downward from the inner surface of the recess 51. This is a so-called floating structure.
For this reason, it is normally set so that a gap S of about 1 mm is provided between the upper mold 6 and the inner surface of the recess 51.
In addition, a cartridge heater 52 for heating the upper mold is installed in the upper mold plate 5 so that the upper mold plate 5 is constantly heated. However, the above-described gap between the upper mold 6 and the recess 51 is described above. Since the gap S is provided, the heating action on the upper mold is efficiently suppressed by the air heat insulation action by the gap.
A cooling water passage 64 for cooling the upper die is disposed in the upper die 6, and a cooling water introduction / discharge pipe 65 connected to a water supply / drainage pump (not shown) is connected to the cooling water passage. Has been. Therefore, the cooling water can be introduced into the cooling water channel 64 of the upper mold through the introduction / discharge pipe 65 by operating the water supply / drainage pump when the upper mold 6 is cooled, and conversely, when the upper mold 6 is heated. It is provided so that the cooling water in the upper mold cooling water channel 64 can be discharged to the outside of the upper mold 6 through the introduction / discharge pipe 65.
Reference numeral 66 denotes a pilot pin that protrudes from the bottom surface of the upper die 6.
Reference numeral 67 denotes an air intake hole formed in the bottom surface of the upper mold 6, and the air intake hole is provided so as to communicate with the inside of the recess 51 as shown in FIG. 6 (2). .
In order to perform heating and cooling operations on the upper mold 6 more efficiently and quickly, for example, the upper mold is preferably formed of a copper-based material having high thermal conductivity.

Further, a seal member 53 for blocking outside air is disposed on the bottom surface of the upper mold plate 5 which is the outer periphery of the upper mold 6, and this seal member 53 is used for clamping the upper and lower molds 6 and 10 which will be described later. In some cases, when both mold surfaces are joined, the outer periphery of the upper and lower molds can be sealed (see FIG. 6 (1)).
Further, the upper mold plate 5 is provided with an intake passage 54 for connecting the sealing range by the sealing member 53 to the outside and for reducing the pressure of the sealing range.
Further, the upper mold plate 5 is provided with an intake passage 55 for connecting the inside of the recess 51 (gap S) to the outside (see FIG. 6 (2)). Further, the intake passage 55 is connected in communication with a vacuum motor (not shown) disposed outside, so that the inside of the recess 51 (gap S) can be decompressed by operating the vacuum motor. Is provided.
As described above, the gap S is usually provided between the upper mold 6 and the recess 51 of the upper mold plate 5 as described above, but the recess is formed by a vacuum motor (not shown). When the pressure inside 51 (gap S) is reduced, the upper mold 6 fitted in the recess rises against the downward elastic projection output by the elastic member 63 and is joined to the inner surface of the recess. It is provided so that. Therefore, the mechanism for joining the upper die 6 and the inner surface of the recess 51 of the upper die plate is to apply a heating action by heat conduction from the cartridge heater 52 for heating the upper die provided on the upper die plate 5 to the upper die. This constitutes the upper mold heating mechanism.
Reference numeral 56 denotes an upper mold guide pin.

As described above, the gate nozzle 15 mounted on the upper mold plate 5 is used to quickly supply the required amount of the liquid resin material conveyed from the liquid resin material mixing and conveying section into the lower mold cavity. . In addition, the gate nozzle 15 is detachably mounted on the vertical fitting / removal portion provided at the center of the upper mold heat insulating plate 4 and the upper mold plate 5 described above.
That is, as shown in FIG. 5 (1), the main body 151 of the gate nozzle is placed in the fitting / removal portion 57 in the vertical direction provided at the center of the upper mold heat insulating plate 4 and the upper mold plate 5 via the seal member 152. The lower end nozzle portion 153 of the gate nozzle main body 151 is fitted into the vertical opening 68 formed at the center of the upper die 6 so that it does not protrude downward from the bottom surface of the upper die. Is provided.
A cooling water introduction / discharge portion 154 at the upper end of the gate nozzle main body projects from the upper surface portion of the upper mold heat insulating plate 4, and a cooling water pipe 154 a is connected to the cooling water introduction / discharge portion.
In addition, a sleeve-like cooling water channel member 155 for circulating and circulating the cooling water is closely and integrally fitted in the gate nozzle main body 151.
In addition, a nozzle tip 156 for discharging the liquid resin material is fitted in the center of the cooling water channel member 155 in a detachable state. The nozzle tip 156 is formed in a shape that narrows downward, and prevents the liquid resin material flowing inside the nozzle tip 156 from adhering to the inner surface of the nozzle tip and causing clogging. For this purpose, it is made of a material having water repellency.
Further, a holding member 157 for securely holding the nozzle chip in the cooling water channel member 155 is fixed to the upper end portion of the nozzle chip 156 in a detachable state. Further, when the nozzle tip 156 is held in the cooling water channel member 155 via the holding member 157, the communication hole 157a formed in the central portion of the holding member and the liquid resin material discharge hole 156a of the nozzle chip are connected in communication. It is provided to be. When the liquid resin material R is conveyed into the communication hole 157a of the holding member, the liquid resin material is smoothly guided to the liquid resin material discharge hole 156a side of the nozzle tip 156 and immediately from the liquid resin material discharge hole. It is provided to be discharged downward. Further, the lower end portion of the nozzle tip 156 held in the cooling water channel member 155 is closely fitted to the inner surface of the nozzle portion 153 of the gate nozzle body, and is provided so as not to protrude downward from the nozzle portion 153. Yes.
Further, the gate nozzle 15 is detachably attached to the fitting attachment / detachment portion 57, and the nozzle tip 156 and the holding member 157 are provided with a cooling water channel member 155 as shown in FIG. 5 (2). It is installed in a detachable state with respect to.
In this way, by installing the gate nozzle 15 in a detachable and detachable state, for example, it is possible to select and employ a nozzle chip that is suitable for the properties of the resin material used before the resin molding operation. In addition, it is possible to efficiently clean and replace the nozzle tips after the resin molding operation. In particular, when a thermosetting resin material is used, for example, a part of the resin material adheres to the inner surface of the liquid resin material discharge hole 156a or the communication hole 157a and is cured, so that the nozzle tip or the like cannot be used. In such a case, it is preferable that a quick response such as cleaning or replacement is possible.

Further, as shown in FIG. 6 (1), when the upper and lower molds 6 and 10 are clamped, the sealing range (outside air blocking space) by the seal member 53 and the vacuum motor (not shown) arranged outside are as follows. As described above, the communication connection is established via the intake passage 54. Therefore, by operating the vacuum motor, the sealing range by the sealing member 53 can be reduced.
Further, as shown in FIG. 6 (2), a vacuum motor (not shown) disposed outside the intake hole 67 formed in the bottom surface of the upper die 6 and in the recess 51 (gap S) of the upper die plate 5 and outside. Is connected through the intake passage 55 as described above, and therefore, by operating the vacuum motor, the intake hole 67 and the recess 51 (gap S) of the upper mold plate and the intake passage 55 Can be depressurized. Therefore, as will be described later, the rectangular substrate 20 can be supplied and set to the bottom surface of the upper die 6 by the suction action of the intake holes 67 based on this reduced pressure. At this time, since the square substrate 20 is positioned via the pilot pins 66 protruding from the bottom surface of the upper die 6, the square substrate becomes the bottom surface of the upper die 6 by this adsorption action and positioning action. It is surely mounted at a predetermined position.
Further, the adsorption action of the square substrate 20 and the pressure reducing action of the sealing range by the sealing member 53 can be performed separately and independently.

  Next, the lower mold plate 9 and the lower mold 10 shown in FIGS. 7 and 8 will be described in detail.

FIG. 7 (1) shows the upper surfaces of the lower mold plate 9 and the lower mold 10 portion, and FIG. 7 (2) shows a schematic central longitudinal sectional view of the lower mold plate 9 and the lower mold 10 portion.
A floating plate 91 is installed on the upper surface of the lower mold plate 9. Further, an elastic member 92 is interposed between the lower mold plate 9 and the floating plate 91, and the elasticity of the elastic member 92 is applied as a pressing force in a direction that separates the two in the vertical direction.
A lower mold 10 is fitted on the upper surface of the lower mold plate 9.
The lower mold 10 is fitted in a mounting slidable state in a mounting hole 93 provided at the center of the floating plate 91, and the outer peripheral surface of the lower mold and the inner peripheral surface of the mounting hole. Is formed with an intake air gap S1 (see FIG. 10 (2)). Further, the lower mold 10 is fixed to the mounting hole 93 via the fixing pin 101 and is mounted at a predetermined position of the mounting hole 93 by the positioning pin 102. Further, the lower mold 10 is applied with an elastic projection output in the direction in which the fastening pin 101 is pushed upward by the elasticity of the elastic member 103. Therefore, the lower mold is attached so as to be separated from the upper surface of the lower mold plate 9. This is a so-called floating structure.
For this reason, it is normally set so that a gap S of about 1 mm is provided between the lower mold 10 and the upper surface of the lower mold plate 9.
In addition, a cartridge heater 94 for heating the lower mold 10 is installed in the lower mold plate 9. Normally, the gap described above is provided between the lower mold 10 and the upper surface of the lower mold plate 9. Since S is provided, the heating action on the lower mold is efficiently suppressed by the air heat insulation action by the gap.
A cooling water passage 104 for cooling the lower die is disposed in the lower die 10, and a cooling water introduction / discharge pipe 105 connected to a water supply / drainage pump (not shown) is connected to the cooling water passage. Has been. Therefore, the cooling water can be introduced into the cooling water passage 104 of the lower die through the introduction / discharge pipe 105 by operating the water supply / drainage pump when the lower die 10 is cooled, and conversely, when the lower die 10 is heated. The cooling water in the lower mold cooling water channel 104 is provided to be discharged to the outside of the lower mold 10 through the introduction / discharge pipe 105.
Reference numeral 106 denotes the shape of the resin molded body, that is, the resin molding surface (lower mold cavity surface) formed corresponding to the shape surface for compression resin sealing molding of the electronic component 20a mounted on the square substrate 20. The outline is illustrated. Reference numeral 107 denotes a lower mold guide pin.
In order to perform heating and cooling operations on the lower mold 10 efficiently and quickly, the lower mold is preferably formed of a copper-based material having a high thermal conductivity.

Further, as described above, the lower mold 10 is fitted in the mounting hole 93 of the floating plate 91 so as to be vertically slidable, and a gap S is provided between the lower mold 10 and the upper surface of the lower mold plate 9. In addition, the lower mold plate 9 and the floating plate 91 are fitted through a seal member 95.
Further, the lower mold plate 9 is provided with an intake passage 108 for connecting the attachment hole 93 and the gap S to the outside, and this intake passage 108 is further provided with a vacuum motor (not shown) provided outside. It is connected to the communication. Accordingly, the mounting hole 93 and the gap S can be decompressed by operating the vacuum motor.
Furthermore, as described above, the gap S is provided between the lower mold 10 and the upper surface of the lower mold plate 9 at normal times. However, the mounting hole 93 and the gap S are formed by the vacuum motor. When the inside is depressurized, the lower mold 10 fitted in the mounting hole 93 descends to the upper surface of the lower lower mold plate 9 against the upward elastic projection output by the elastic member 103 described above. It is provided so that it may be joined. Therefore, the mechanism for joining the lower mold 10 and the lower mold plate 9 is the lower mold heating for applying a heating action by heat conduction from the lower mold heating cartridge heater 94 provided on the lower mold plate 9 to the lower mold. The mechanism is configured.

Next, the apparatus for mounting the release film on the lower mold cavity surface shown in FIGS. 10 to 12 will be described in detail.
This release film mounting apparatus is used by being attached to a compression resin sealing molding apparatus for electronic parts, and includes a release film mounting member 21 on the lower mold cavity surface (resin molding surface 106), and the release film mounting. A reciprocating drive mechanism (not shown) for reciprocating the member between the upper mold 6 and the lower mold 10 of the resin-sealing molding mold so as to freely move back and forth (movable back and forth in the horizontal direction); The release film mounting member 21 forcibly supports the peripheral portion corresponding to the outer peripheral edge of the lower mold cavity in the release film 16 stretched on the lower mold cavity surface (resin molding surface 106). Compressed air A1 is applied to a suction hole 211, an intake passage 210a in which the suction hole 211 and a vacuum tank (not shown) are connected in communication, and a release film in a state of being supported by the suction hole 211. A compressed air ejection hole 210b to supply the compressed air supply path 210c is provided which is connected in communication between the compressed air ejection holes and the compression air tank (not shown) side.
The suction hole 211 is provided on the bottom surface side of the release film mounting member 21 and is disposed at a virtual circular peripheral portion corresponding to the outer peripheral portion of the lower mold cavity portion.
Further, the compressed air ejection hole 210b is opened at the center of the virtual circular peripheral portion.

The operation based on the configuration of the above embodiment will be described in detail below.
First, with reference to FIG. 3, the liquid thermosetting resin material transport and supply operation for transporting and supplying the liquid thermosetting resin material into the gate nozzle 15 mounted on the upper mold plate will be described.
The controller 18 of the operation panel 19 is operated to open both the open / close valves 131 and 132, thereby measuring the required amounts of the liquid resin material (main agent) and the liquid curing agent in the storage tanks 121 and 122 and mixing them downward. While inject | pouring in the conveyance part 14, both this on-off valve is closed after that (liquid resin material measurement process).
Next, a liquid thermosetting resin is obtained by uniformly mixing both the liquid resin material (main agent) and the liquid curing agent injected into the mixing and conveying unit 14 through an appropriate mixing mechanism such as the rotary blade 142. Material R is produced (mixing step of both liquids).
Next, the controller 18 is operated to open the on-off valve 141 of the mixing and conveying unit 14 so that the liquid thermosetting resin material R in the mixing and conveying unit 14 is smoothly conveyed to the gate nozzle 15 side in the lower position (liquid state). Thermosetting resin material conveyance process).
The liquid thermosetting resin material R conveyed into the gate nozzle 15 flows down and flows, and is immediately discharged and supplied into the lower mold cavity located below (liquid thermosetting resin material supplying step). .
As described above, the liquid thermosetting resin material R in the mixing / conveying section is introduced by introducing the compressed air A into the mixing / conveying section 14 at the end of the discharge / supplying process of the liquid thermosetting resin material R. Can be more reliably conveyed to the gate nozzle 15 side. In addition, the liquid thermosetting resin material R that is to remain in the mixing and conveying portion can thereby be conveyed to the gate nozzle 15 side (residual liquid resin material conveying step).

  Next, the case where the electronic component 20a mounted on the square substrate 20 is resin-sealed with the liquid thermosetting resin material R conveyed into the gate nozzle 15 will be described.

First, as shown in FIG. 9, the upper mold 6, the lower mold 10 and the gate nozzle 15 of the resin sealing molding apparatus are cooled by introducing the cooling water C, and the upper mold plate of the apparatus. 5 and the lower mold plate 9 are heated to the resin molding temperature under the heating action of the cartridge heaters 52 and 94.
At this time, since the gap S described above is held between the upper mold plate 5 and the upper mold 6 and between the lower mold plate 9 and the lower mold 10, the upper mold and the upper mold The heating action by the cartridge heater is not positively applied to the lower mold, and therefore the heating action on the upper and lower molds is effectively suppressed.
The liquid thermosetting resin material R described above is transported to the gate nozzle 15 and supplied to the lower cavity surface (resin molding surface 106) below while maintaining its fluidity. . For this reason, the cooling process of the gate nozzle 15 is continuously performed for the purpose of preventing the thermosetting reaction of the liquid thermosetting resin material from being accelerated by the heating action from the upper mold plate 5 side.
In the above-described state, as shown in FIG. 9, first, a mold opening process is performed in which the movable plate 7 is lowered to separate the upper and lower molds 6 and 10 from each other.

  After the mold opening process, a mold release film supply process is performed in which the mold release film tensioning mechanism 17 (see FIG. 2) is operated to supply the mold release film 16 to the surface of the lower mold 10.

After the release film supplying step, a release film mounting step for mounting the release film 16 on the surface of the lower mold 10 is performed.
In this release film mounting process, as shown in FIG. 10 (1), a release film mounting member 21 is inserted between the upper and lower molds 6 and 10, and as shown in FIG. The bottom surface of the film mounting member 21 is lowered to a position approaching the upper surface of the release film 16 described above or to a position where it is joined thereto.
Further, as shown in FIGS. 11 (1) and (2), predetermined portions of the release film 16 stretched from the suction hole 211 provided on the bottom surface of the release film mounting member 21 to the lower mold 10 surface are provided. Forcibly sucked to support 211a.
As described above, the suction hole 211 is disposed at a virtual circular peripheral portion corresponding to the outer peripheral portion of the lower mold cavity (resin molding surface 106), and accordingly, the suction hole 211 is stretched on the lower mold 10 surface. The periphery of the lower mold cavity in the provided release film 16 is supported in a sucked state.
In the above-described state, as shown in FIGS. 12 (1) and (2), the lower mold cavity (while the mold release film 16 is inflated by supplying compressed air A1 to the mold release film 16 supported by the suction support 211a. Fit 211b can be formed on the resin molding surface 106).
The compressed air A1 is supplied by being supplied to the central portion of the release film 16 supported by the suction support 211a from the compressed air ejection hole 210b provided at the central portion of the virtual circular peripheral portion. At this time, the pressure for blowing the compressed air A1 can be arbitrarily selected. To explain one example, for example, by blowing compressed air of a minute air pressure (slight pressure) from the compressed air ejection hole 210b, the release film is gradually inflated and fitted to conform to the shape of the lower mold cavity surface. Can do.
In addition, the action of causing the release film to fit 211b on the surface of the lower mold cavity (resin molding surface 106) is efficiently performed in combination with the pressure reducing action in the lower mold heating process described later.

Next, or simultaneously with the mold release film mounting process, a lower mold heating process is performed in which the lower mold 10 is heated by the cartridge heater 94 to heat the lower mold to the resin molding temperature.
In the lower mold heating step, as shown in FIGS. 12 (1) and (2), a vacuum motor (not shown) is operated to attach the mounting hole 93, the lower mold 10 and the lower mold plate 9 from the intake passage 108. By reducing the pressure in the gap S between the lower mold 10 and the upper surface of the lower mold plate 10, the lower mold 10 descends against the elastic output of the elastic member 103 and is joined to the upper surface of the lower mold plate 9. As a result, the lower mold 10 is heated by the heat conduction from the lower mold plate 9 side, that is, from the cartridge heater 94, so that the lower mold can be heated to the resin molding temperature.
In addition, at the same time as or simultaneously with the lower mold heating step, a water supply / drainage pump (not shown) is operated to force the cooling water C in the lower mold cooling water passage 104 to the outside through the introduction / discharge pipe 105. The lower mold heating process can be performed more quickly by performing the process of draining the lower mold cooling water to be drained.
Further, when the lower mold is formed of a copper-based material having a high thermal conductivity, the lower mold heating process can be performed more rapidly.
In addition, the pressure reducing action in the mounting hole 93 and the gap S described above in the lower mold heating step is configured in a fitting portion between the lower mold 10 and the mounting hole 93 as shown in FIG. Since this also acts as a suction force 22 for forcibly sucking the release film 16 from the gap S1, the action of causing the release film to fit onto the lower mold cavity (resin molding surface 106) 211b is the above-described release film mounting. Combined with the action, it is performed efficiently.

  Next, after the end of the release film mounting step, a release film mounting member retraction step is performed in which the release film mounting member 21 is retracted from between the upper and lower molds 6 and 10 to the outside.

Next, as shown in FIGS. 13 (1) and (2), a liquid thermosetting resin is passed through the gate nozzle 15 into the lower mold cavity (resin molding surface 106) in a state where the release film 16 is stretched. A liquid resin material supply step for supplying the material R is performed.
In the liquid resin material supplying step, as described above, the control unit 18 is operated to open the on-off valve 141 of the mixing and conveying unit 14 so that the liquid thermosetting resin material R in the mixing and conveying unit is located at the lower position. Although the liquid thermosetting resin material R is conveyed to the side 15, the liquid thermosetting resin material R is immediately flown through the through hole 157 a of the holding member in the gate nozzle and the liquid resin material discharge hole 156 a of the nozzle tip (smoothly flows in the gate nozzle 15. It is discharged into the lower mold cavity (106) below. At this time, the liquid thermosetting resin material R is cooled and constantly flows and circulates in the cooling water channel member 155 (see FIG. 5) until it is transported to the upper communication hole 157a and discharged from the lower discharge hole 156a. Since the water C is forcibly cooled, the thermosetting reaction of the liquid thermosetting resin material is efficiently suppressed.
Further, since the thermosetting reaction of the liquid thermosetting resin material R is suppressed as described above, the liquid thermosetting resin material R supplied into the lower mold cavity (106) maintains its fluidity. Therefore, it smoothly flows in the lower mold cavity (106) and is uniformly supplied to every corner of the lower mold cavity (106). At this time, the liquid thermosetting resin material R in the cooled state is heated by the heating action of the heated lower mold 10, and this temperature raising action causes the liquid thermosetting resin material to have a low viscosity. On the contrary, there is an advantage that the liquid thermosetting resin material can be smoothly and uniformly supplied to every corner of the lower mold cavity (106). .

Next, or simultaneously with the end of the liquid resin material supply step, the liquid thermosetting resin material R that is decompressed in the gate nozzle 15 and remains in the gate nozzle is replaced with the nozzle portion 153 (liquid resin material). A liquid resin material leakage prevention process is performed to prevent leakage from the discharge holes 156a).
As described above, the liquid thermosetting resin material R is discharged into the lower lower mold cavity (106) immediately after being conveyed to the gate nozzle 15 side. A part of the thermosetting resin material does not remain.
Therefore, this liquid resin material leakage prevention step may be employed as necessary. For example, when a part of the liquid thermosetting resin material remains in the gate nozzle 15 for some reason, if it falls and hardens on the mold surface of the lower mold 10, the upper and lower molds are clamped. Since problems such as inhibiting the action occur, the liquid resin material leakage prevention step can be employed for the purpose of preventing such adverse effects.

Next, as shown in FIG. 14, a substrate mounting member 23 supporting a square substrate 20 is inserted between the upper and lower molds 6 and 10, and the substrate mounting member 23 is raised to raise the square substrate. A substrate supply setting process is performed in which the substrate 6 is set at a predetermined position on the bottom surface of the mold 6.
As described above (refer to FIG. 6 (2)), the supply set of the square substrate 20 to the bottom surface of the upper die is operated in the recess 51 of the upper die plate 5 by operating a vacuum motor (not shown). Due to the suction action from the suction hole by reducing the pressure of the suction hole 67 of the upper mold 6 that communicates, and the positioning action by the pilot pin 66 protruding from the bottom face of the upper mold 6, a predetermined This is done by reliably adsorbing to the position. At this time, as shown schematically in FIG. 6 (2), the square substrate 20 is set so that the substrate body is adsorbed to the bottom surface of the upper mold 6 and the mounting surface of the electronic component 20a is on the bottom surface side. Has been.

Next, or simultaneously with the substrate supply and setting process, an upper mold heating process is performed in which the upper mold 6 is heated by the cartridge heater 52 to heat the upper mold to the resin molding temperature.
In the upper mold heating step, the pressure in the gap S between the upper mold 6 and the inner surface of the recess 51 is reduced, so that the upper mold 6 has an elastic projection output of the elastic member 63 as shown in FIG. It rises against and is joined to the inner surface of the upper mold recess. As a result, the upper die 6 is heated by heat conduction from the cartridge heater 52 to heat the upper die to the resin molding temperature.
Note that the pump (not shown) is operated next to or simultaneously with the upper mold heating step to forcibly drain the cooling water C in the upper mold cooling water channel 64 to the outside through the introduction / discharge pipe 65. By performing the draining process of the upper mold cooling water, the upper mold heating process can be performed more quickly.
Further, when the upper mold is formed of a copper-based material having a high thermal conductivity, the upper mold heating process can be performed more rapidly.

Next, as shown in FIG. 15, the first mold that raises the movable plate 7 by the mold opening / closing mechanism 11 (see FIG. 1) and joins the upper surface of the floating plate 91 and the seal member 53 on the bottom surface of the upper mold plate 5. Perform the fastening process.
In the first mold clamping process, the outer periphery of the lower mold cavity portion between the mold surfaces of the upper and lower molds 6 and 10 is reliably sealed by the seal member 53, so that the outside air is blocked.
At this time, the bottom surface of the square substrate 20 is not joined to the upper surface of the floating plate 91.
Therefore, the air in the sealed range and the bubbles contained in the liquid thermosetting resin material R are efficiently and forcibly discharged to the outside by the pressure reducing action in the lower mold cavity (106). A decompression step between the mold surfaces can be performed.

Next, as shown in FIG. 16, a second mold clamping step of further raising the movable plate 7 by the mold opening / closing mechanism 11 (see FIG. 1) to join the upper surface of the floating plate 91 and the bottom surface of the square substrate 20. I do.
In this second mold clamping step, the pressure reducing action within the above-mentioned sealing range is performed, and the electronic component 20a on the bottom surface of the square substrate is immersed in the liquid thermosetting resin material R in the lower mold cavity (106). Immerse parts.
In addition, the immersion process of this electronic component can also be performed at the time of the compression resin sealing molding process of the liquid thermosetting resin material R mentioned later.

Next, as shown in FIG. 17, the third mold for raising the lower mold plate 9 against the elastic projection output of the elastic member 92 by further raising the movable plate 7 by the mold opening / closing mechanism 11 (see FIG. 1). Perform the tightening process.
In the third mold clamping process, a compression resin sealing molding process of a liquid thermosetting resin material is performed in which the lower mold plate 9 and the lower mold 10 are raised to compress the liquid thermosetting resin material R in the lower mold cavity. It will be.
At this time, the electronic component 20a on the bottom surface of the square substrate is immersed in the liquid thermosetting resin material R in the rising lower mold cavity and is gradually pressurized and a predetermined compressive force is applied. It is encapsulated with a liquid thermosetting resin material. Therefore, the dipping process of the electronic component described above can be performed prior to the compression resin sealing molding process.

Next, a first mold opening step for setting an air insulation gap S between the upper mold 6 and the upper mold heating cartridge heater 52 and the lower mold 10 and the lower mold heating cartridge heater 94 is performed. In addition, an upper mold cooling process and a lower mold cooling process for cooling the upper mold 6 and the lower mold 10 are performed during the first mold opening process.
In the both upper and lower mold cooling processes, as shown in FIGS. 18 (1) and (2), the operation of the vacuum motor (not shown) is stopped and the reduced pressure state in the mounting hole 93 is released. The lower die 10 is raised from the surface of the lower die plate 9 by the elastic projection output of the member 103, and the lower die is raised to hold the gap S between the lower die and the lower die plate. By stopping the operation of the vacuum motor (not shown) and releasing the reduced pressure state in the recess 51 of the upper mold plate, the upper mold 6 is moved in the recess 51 of the upper mold plate by the elastic output of the elastic member 63. The upper mold is lowered so that the gap S is maintained between the upper mold and the upper mold plate. Due to the air insulation action by the gap S, the heating action by heat conduction from the upper and lower plates 5 and 9 side, that is, from the cartridge heaters 52 and 94 with respect to the upper and lower molds 6 and 10 can be efficiently suppressed.
Furthermore, the lower mold 10 is forcibly cooled by operating a water supply / drainage pump (not shown) to supply and circulate the cooling water C through the introduction / discharge pipe 105 into the lower mold cooling water channel 104. The upper mold 6 is forcibly cooled by operating the water supply / drainage pump and supplying and circulating the cooling water C into the upper mold cooling water passage 64 through the introduction / discharge pipe 65. As a result, forced and rapid cooling of the upper and lower molds 6 and 10 can be performed.
By maintaining the gap S between the upper and lower molds 6 and 10 and the upper and lower plates 5 and 9 by stopping the operation of the vacuum motor and forcibly cooling the upper and lower molds 6 and 10 by operating the water supply / drainage pump, The mold cooling process can be performed quickly and reliably. When the upper and lower molds 6 and 10 are formed of a copper-based material having a high thermal conductivity, the cooling process for the upper and lower molds 6 and 10 can be performed more quickly and reliably.
Further, when the upper die 6 is lowered by the release of the above-described reduced pressure state, the reduced pressure state in the intake hole 67 on the bottom surface of the upper die is also released and the adsorption action to the square substrate 20 is eliminated, so that the square substrate is removed. Becomes easy.
FIG. 18 (3) shows a state in which the upper and lower molds 6 and 10 are further opened after the first mold opening step. At this time, the floating plate 91 is raised relative to the lower mold 10 by the elastic projection output of the elastic member 92. Therefore, the ascending action of the floating plate 91 functions as a molded product releasing action for releasing the compressed resin-sealed molded body R1 on the bottom surface of the square substrate from the lower mold cavity (106).

  Next, as shown in FIG. 19, a second mold opening process is performed in which the upper and lower molds 6 and 10 are returned to their original positions by lowering the movable plate 7 and separating the upper and lower molds 6 and 10 from each other.

Next, a molded product take-out step is performed in which a compressed resin-sealed molded product of an electronic component is taken out from the lower mold cavity (resin molding surface 106) portion on which the release film 16 is stretched.
In the molded product take-out step, as shown in FIG. 19, a molded product take-out member 24 is inserted between the upper and lower molds 6 and 10, and the molded product take-out member 24 is lowered to lower the bottom of the molded product take-out member. The square substrate 20 is sucked and supported by the suction tool 241 provided on the surface. Further, in this state, the molded product take-out member 24 is raised to release the compressed resin-sealed molded body R1 of the electronic component integrated with the square substrate 20 from the lower mold cavity (resin molding surface 106), As shown in FIG. 20, the molded product take-out member 24 is moved backward to take out the compressed resin-sealed molded product of the electronic component, that is, the square substrate 20 integrated with the compressed resin-sealed molded product R1 to the outside. be able to.
When the compressed resin sealing molded body R1 is released from the lower mold cavity (resin molding surface 106), the upper and lower molds 6 and 10 are rapidly cooled by the cooling process. Tries to shrink under this cooling action. As a result, the compressed resin-sealed molded body is easily released from the lower mold cavity (resin molding surface 106). That is, by cooling the compression resin-sealed molded body R1, the hardness of the compressed resin-sealed molded body increases, so that the shape accuracy of the compressed resin-sealed molded body is maintained at the time of releasing the mold, and as a result, It is possible to efficiently prevent the occurrence of defects such as warpage and deformation in the compressed resin sealed molded body.
Therefore, it is possible to start the molded product take-out process immediately after the mold opening process of the upper and lower molds 6 and 10, so that the overall resin molding cycle time is shortened and high-efficiency production is achieved. Is possible.
When the square substrate 20 is sucked and supported by the suction tool 241 of the molded product takeout member 24, for example, the lower mold plate 9 side is lifted and the square substrate 20 is sucked by the suction tool 241 of the molded product takeout member. It is also possible to adopt the reverse procedure of the above-mentioned that it is supported.

  After each of the above steps is completed, the next molding operation is started. At the end of the retraction operation of the molded product extraction member 24 in the above-described molded product extraction step or simultaneously with the retraction operation, FIG. As shown in FIG. 20, a release film supply step of operating the release film stretching mechanism 17 (see FIG. 2) to supply a new release film 16 to the surface of the lower mold 10 may be performed.

Since the embodiment as described above is adopted, it is possible to efficiently and reliably form a compression resin-sealed molded product of an electronic component with uniform, high quality and high reliability, and also with a compression resin seal The overall structure and shape of the molding apparatus can be reduced in size and weight. For this reason, the compression resin sealing molding apparatus for electronic components according to the present invention can be implemented as a so-called desktop molding apparatus.
In addition, it is possible to perform resin sealing molding adapted to the properties of the liquid resin material, and to supply the thermosetting resin material into the lower mold cavity while maintaining the fluidity of the thermosetting resin material. It can be done efficiently. Furthermore, since the hardness of the thermosetting resin molding can be increased by the cooling action, the resin sealing molding action can be efficiently performed, and the action of releasing the molded product from the lower mold cavity is efficiently performed. Therefore, it is possible to shorten the overall resin molding cycle time and achieve high-efficiency production.
Further, by using the release film, it is possible to prevent the resin material from adhering to the lower mold cavity surface, so that the mold release action of the resin-sealed molded product can be surely performed, and the adhesive force to the cavity surface is reduced. It becomes possible to use a strong resin material.
Furthermore, since the mold can be reduced in size, it has excellent practical effects such as an improvement in the effective utilization rate (yield) of the release film.

  The present invention is not limited to the above-described embodiments, and can be carried out by arbitrarily changing or selecting as necessary within a range not departing from the gist of the present invention.

In the transport and supply process of the liquid thermosetting resin material in the previous embodiment, a case is described in which a predetermined amount of both the main agent and the curing agent liquid is measured, and both liquids are mixed and transported to the gate nozzle 15 side. When using one liquid resin material, or when using a powder / granular resin material, it is possible to employ a configuration in which a predetermined amount of the measured resin material can be immediately conveyed and supplied to the gate nozzle 15 side. it can.
In this case, since the resin material conveyed to the gate nozzle 15 is immediately supplied from the gate nozzle 15 into the lower mold cavity (resin molding surface 106) below, the predetermined heating action on the resin material is the lower This can be done in the mold cavity.

Further, as the mixing means for both liquids in the mixing and conveying unit 14 of Example 1, other appropriate mixing mechanism configurations can be adopted, but in the conveying path from the measuring unit 13 to the gate nozzle 15 unit. Any structure having a necessary and sufficient mixing action may be used.
For example, the above-described transport path of the resin material is formed by forming a spiral transport groove portion that gently descends, a reciprocating transport groove portion, a meandering transport groove portion, or the like (not shown). By setting the length of the liquid resin to be long, the two liquids are mixed evenly and efficiently before the liquid resin material that has been weighed flows through the transport path and is transported to the gate nozzle 15 side. Can do.
Adopting such a spiral conveying groove or a reciprocating / meandering conveying groove as the configuration / shape of the conveying path can shorten the vertical length of the apparatus (lower the apparatus height). This is useful as a problem solving means for reducing the overall shape.

As the resin material to be used, in addition to the case where the electronic component is compression-sealed and molded using a thermosetting resin material such as a silicone resin as in Example 1, other thermosetting resin materials may be used. Is possible.
Furthermore, it is also possible to use a thermoplastic resin material, which can be suitably applied according to the properties of the resin material used.

  Further, in the first embodiment, the case where the liquid resin material is supplied to the surface of the lower mold cavity (106) covered with the release film 16 has been described. However, a normal resin seal that does not use such a release film 16 is used. The present invention can be similarly applied to the case of the stationary molding method and apparatus.

In the first embodiment, the case where the release film mounting member 21, the substrate mounting member 23, and the molded product takeout member 24 are separately installed and used has been described. However, each of these functions is used as one common work body. By providing all of the above, the overall device structure can be further reduced in size and simplified, and workability and productivity can be improved.
For example, one shared work body W shown in FIGS. 21 (1) and (2) has the same functions as the functions of the release film mounting member 21, the substrate mounting member 23, and the molded product takeout member 24 described above. Is provided.
That is, the release film mounting mechanism for supplying the release film 16 to the lower mold cavity surface (resin molding surface 106) and mounting the release film 16 on the lower mold cavity surface, and the square substrate 20 before resin sealing molding are provided. A substrate supply mechanism for supplying the surface of the upper mold 6 and a molded product take-out mechanism for taking out the resin-molded square substrate 20 from the lower mold cavity surface to the outside are disposed.
Therefore, in this case, in the release film mounting process, the substrate supply process, and the molded product take-out process by each of the above mechanisms, a single shared work body W can be used without requiring separate and dedicated members. It becomes possible.
Therefore, by adopting such a structure of one common work body W, the apparatus can be simplified or simplified and the apparatus can be miniaturized. It is beneficial.
In addition, the same code | symbol is attached | subjected about the same component as the component mentioned above in order to avoid duplication of description.
In FIG. 21 (2), reference numeral 231 indicates a substrate accommodating portion for accommodating the rectangular substrate 20 when the rectangular substrate 20 is conveyed and supplied. The shape of the substrate accommodating portion 231 is as follows. It can be appropriately changed corresponding to other different substrate shapes.

  In addition, the electronic component compression resin sealing molding apparatus according to the present invention can be implemented as a desktop molding apparatus because the overall apparatus shape can be reduced in size and weight and can be implemented as a table-type molding apparatus. When a small amount of each type of resin-sealed molded product is to be produced, in the supply set of the square substrate 20 to the lower mold cavity (resin molding surface 106) and the operation of taking out the resin-sealed molded product, Instead of the arrangement / configuration of the mounting member 23 and the molded product take-out member 24, for example, an automatic machine such as an inloader mechanism or an unloader mechanism is adopted by using a normal loading frame (not shown) having a simple configuration. It is possible to adopt a configuration in which is omitted.

  Since the present invention can be applied to a compression resin sealing molding apparatus for electronic parts having a reduced size and weight, it can also be applied to other desktop compression resin sealing molding fields.

It is a front view which shows the outline | summary of the compression resin sealing molding apparatus of the electronic component which concerns on this invention. It is a partially cutaway front view of the shaping | molding apparatus corresponding to FIG. FIG. 2 is a partially cutaway enlarged front view of the molding apparatus corresponding to FIG. 1. 4 shows the upper plate portion of the molding apparatus corresponding to FIG. 1, FIG. 4 (1) is a schematic central longitudinal sectional view of the upper die plate and the upper die and the gate nozzle portion, and FIG. 4 (2) is the upper die plate portion. FIG. FIG. 5 (1) is an enlarged view of the gate nozzle portion and an explanatory diagram of its cooling action, and FIG. 5 (2) is an exploded view of the gate nozzle. FIG. 6 (1) is an explanatory view of the pressure reducing action when the upper and lower molds are clamped, and FIG. 6 (2) is an explanatory view of the substrate adsorbing action on the upper mold. Fig. 7 shows a lower plate portion of the molding apparatus corresponding to Fig. 1, Fig. 7 (1) is a schematic plan view of the lower mold plate portion, and Fig. 7 (2) is a schematic central longitudinal section of the lower mold plate and the lower mold portion. FIG. FIG. 8 (1) is an explanatory view of the cooling action in the lower mold, and FIG. 8 (2) is an explanatory view of the pressure reducing action in the lower mold, corresponding to FIG. 1 is a schematic central longitudinal sectional view showing the upper mold plate and lower mold plate portion of the molding apparatus corresponding to FIG. 1, showing the upper and lower molds in the open state, and the step of supplying the release film between the upper and lower molds. It is explanatory drawing. FIG. 10A is a schematic longitudinal sectional view corresponding to FIG. 9, and FIG. 10A is an explanatory view of the release film mounting process on the lower mold cavity surface, and FIG. 10B is an enlarged view of the main part thereof. FIG. 11 (1) shows a state in which the release film is adsorbed by the release film mounting member, and FIG. 11 (2) is an enlarged view of the main part thereof. FIG. 12 (1) shows a state in which compressed air is blown by the release film mounting member, and FIG. 12 (2) is an enlarged view of the main part thereof. FIG. 13 (1) is an explanatory view of the liquid resin material supplying process to the lower mold cavity surface, and FIG. 12 (2) is an enlarged view of the main part thereof. FIG. 10 is a schematic vertical cross-sectional view corresponding to FIG. 9, illustrating a substrate mounting process on the upper mold surface. FIG. 15 (1) shows a first mold clamping state in which a seal range for blocking outside air between the upper and lower molds is set by joining the upper and lower molds. FIG. 15 (2) is an enlarged view of the main part. FIG. 16 (1) shows a second mold clamping state in which the substrate set on the upper mold and the lower mold surface are joined, and FIG. 16 (2) shows the second mold clamping state corresponding to FIG. It is an enlarged view of the principal part. FIG. 17 (1) shows a third mold-clamping state in which the liquid resin material in the lower mold cavity is compressed, and FIG. 17 (2) shows the main part thereof. It is an enlarged view. FIG. 18 (1) is a schematic longitudinal sectional view corresponding to FIG. 9, and FIG. 18 (1) shows a first mold opening in which an air insulation gap is set between the upper mold and the upper mold heater and between the lower mold and the lower mold heater. 18 (2) is an enlarged view of the main part, and FIG. 18 (3) is an explanatory view of the releasing action of the substrate. It is a schematic center longitudinal cross-sectional view corresponding to FIG. 9, and is explanatory drawing of the taking-out process of a compression resin molded product. It is a schematic center longitudinal cross-sectional view corresponding to FIG. 9, and is explanatory drawing of the taking-out process of a compression resin molded product, and the following mold release film supply process. FIG. 21 (1) shows another embodiment of the mold release film mounting member, the substrate mounting member, and the molded product take-out member, corresponding to FIG. Is an enlarged view of the main part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 2 Tie bar 3 Fixing plate 4 Upper mold heat insulation board 5 Upper mold plate 51 Recess 52 Cartridge heater 53 Seal member for shutting off outside air 54 Intake passage 55 Intake passage 56 Upper mold guide pin 57 Fitting / removal part 6 Upper mold 61 Stop Contact pin 62 Positioning pin 63 Elastic member 64 Cooling channel 65 Cooling water introduction / discharge pipe 66 Pilot pin 67 Air intake hole 68 Center opening of upper die 7 Movable plate 8 Lower die heat insulating plate 9 Lower die plate 91 Floating plate 92 Elastic member 93 Mounting hole 94 Cartridge heater 95 Seal member 10 Lower mold 101 Fastening pin 102 Positioning pin 103 Elastic member 104 Cooling water channel 105 Cooling water introduction / discharge pipe 106 Resin molding surface (lower mold cavity surface)
107 Lower mold guide pin 108 Intake passage 11 Mold opening / closing mechanism 12 Liquid resin material storage 121 Liquid resin material storage tank 122 Liquid curing agent storage tank 13 Liquid resin material metering section 131 Open / close valve 132 Open / close valve 14 Liquid resin material Mixing and transporting part 141 Open / close valve 142 Rotating blade 15 Gate nozzle 151 Gate nozzle body 152 Seal member 153 Lower end nozzle part 154 Cooling water introduction / discharge part 154a Cooling water pipe 155 Cooling water channel member 156 Nozzle tip 156a Liquid resin material discharge hole 157 Holding member 157a Communication hole 16 Release film 17 Release film stretching mechanism 171 Release film supply roller 172 Release film take-up roller 173 Motor 174 Tension roller 18 Control unit 19 Operation panel unit 20 Square substrate 20a Electronic component 21 Release Film mounting member 210a Intake path 210b Compressed air ejection hole 210c Compressed air supply path 211 Suction hole 211a Suction support 211b Fit 22 Suction force 23 Substrate mounting member 231 Substrate housing part 24 Molded product extraction member 241 Adsorber A Compressed air A1 Compressed air C Cooling water R Liquid thermosetting resin material R1 Compression resin encapsulated molded body S Gap S1 Gap
W Shared work body

Claims (10)

The electronic component mounted on the substrate is immersed in the liquid resin material in the lower mold cavity for resin sealing molding, and a predetermined heating action and pressurizing action are applied to the liquid resin material to dispose the electronic component on the board. It is a compression resin sealing molding method for electronic parts to be resin sealing molded,
A single substrate setting cavity is disposed in the lower mold, and a gate nozzle for supplying a liquid resin material is disposed in the upper mold facing the lower mold, and the liquid resin material is disposed in the gate nozzle. The liquid resin material that flows in the gate nozzle at the time of supplying the liquid resin material to be supplied into the lower mold cavity disposed below the gate nozzle and at the time of resin sealing molding the electronic component on the substrate And a temperature control of both the upper and lower molds.   2. The method for compressing and molding an electronic component according to claim 1, wherein the temperature management of the liquid resin material flowing in the gate nozzle and the temperature management of the upper and lower molds are simultaneously performed.   The method for compressing and sealing an electronic component according to claim 1, wherein the temperature management of the liquid resin material flowing in the gate nozzle and the temperature management of the upper and lower molds are individually performed.   2. The compression resin sealing molding of an electronic component according to claim 1, wherein a cooling means for the gate nozzle is provided to suppress a thermosetting reaction of the liquid thermosetting resin material flowing in the gate nozzle. Method.   By providing a cooling means for each of the upper and lower molds, a step of cooling the upper mold and / or the lower mold is performed after the step of resin-sealing and molding the electronic components on the substrate. The compression resin sealing molding method of the electronic component of Claim 1.   2. The electronic component according to claim 1, wherein the liquid resin material supplying step is performed in a state where a film for releasing a molded product is stretched on a mold surface of the lower mold including at least the lower mold cavity portion. Compression resin sealing molding method. The electronic component mounted on the substrate is immersed in the liquid resin material in the lower mold cavity for resin sealing molding, and a predetermined heating action and pressurizing action are applied to the liquid resin material to dispose the electronic component on the board. It is a compression resin sealing molding device for electronic parts to be resin sealing molded,
A compression resin sealing mold comprising at least an upper mold and a lower mold facing each other in the vertical direction is provided, and a gate nozzle for supplying a liquid resin material is disposed in the upper mold. A single substrate setting cavity is arranged in the lower mold, and further, a temperature management means for the liquid resin material flowing in the gate nozzle and the temperature management means for both the upper and lower molds are arranged. A compression resin sealing molding apparatus for electronic parts.   8. The compressed resin seal for an electronic component according to claim 7, wherein a cooling means for suppressing a thermosetting reaction of the liquid thermosetting resin material flowing in the gate nozzle is disposed in the gate nozzle. Stop forming device.   8. The compression resin sealing molding apparatus for electronic parts according to claim 7, wherein a cooling means is provided for each of the upper and lower molds.   8. A release film tensioning mechanism for tensioning a film for releasing a molded product is disposed on a mold surface of the lower mold including at least the lower mold cavity. Compressed resin sealing molding equipment for electronic parts.

Images