JP6144085B2 - Molded product production apparatus and molded product production method - Google Patents

Description

The present invention relates to resin molding using a liquid resin (a resin which is liquid at normal temperature). In particular, the molded article production apparatus for forming a cured resin obtained by curing the liquid resin on a support, and it relates to a molded article produced how.

  Conventionally, resin sealing of electronic components using a transfer molding method as a resin molding technique has been widely performed. Resin sealing using the transfer mold method includes electronic components other than semiconductors, such as electronic components (integrated circuits (ICs) and light emitting diodes (LEDs)) mounted on lead frames and substrates. Since most of them are chip-shaped, they are hereinafter referred to as “chips” as appropriate.

  A method of resin-sealing a chip mounted on a substrate using a transfer mold method is performed as follows. In advance, the molds (upper mold and lower mold) in the resin molded part are heated to a molding temperature (for example, about 175 ° C.) by heating means, and the upper mold and the lower mold are opened. Next, using the material transport mechanism, the substrate on which the chip is mounted is supplied to a predetermined position of the lower mold, and the resin tablet is supplied into a pot provided at the predetermined position of the lower mold. The resin tablet is compressed into a solid form according to the shape and size of the pot so that it can be easily transported and stored. Next, the upper mold and the lower mold are clamped. At this time, the chip mounted on the substrate is accommodated in a cavity provided in at least one of the upper mold and the lower mold. Next, the resin tablet supplied into the lower pot is heated and melted. The molten resin (flowable resin) is pressed by the plunger and poured into the cavity. Subsequently, the fluid resin injected into the cavity is heated for a time required for curing, thereby molding the cured resin and sealing the chip mounted on the substrate.

  By the way, in a resin sealing device using a transfer mold method, a resin tablet made of a thermosetting resin is generally used as a resin material. A resin tablet is prepared by mixing a hardened agent, a filler (filler), an accelerator, a release agent, a flame retardant, a colorant, an additive and the like into a powdered epoxy resin as necessary, and compressing it into a cylindrical shape. Manufactured. A resin sealing apparatus using a transfer mold method has been developed as an apparatus for performing resin sealing by supplying a resin tablet into a pot provided at a predetermined position of a lower mold, and is now widely used. Therefore, the resin sealing device using the transfer mold method is based on using a resin tablet as a resin material.

  In recent years, with the progress of energy saving, the demand for LEDs with low power consumption as lighting fixtures is rapidly increasing. In IC resin sealing, a solid resin tablet is generally used as a resin material. On the other hand, in resin sealing of LEDs, a liquid resin that is thermosetting and transmits light is generally used as a resin material. However, since the resin sealing device using the transfer mold method is based on using a solid resin tablet as a resin material, resin sealing using a liquid resin has hardly been performed. Hereinafter, in the present application documents, the term “liquid resin” means a resin that is liquid at room temperature.

  As a resin sealing method using a liquid resin with a resin molding device using the transfer mold method, “After releasing the release film to the resin sealing surface and the pot part of the lower mold by air, a resin tablet is supplied to the pot. , (Substantially) as a sealing resin to be supplied to the pot, in addition to the resin molded into a tablet shape, (substantially) liquid resin (substantially) can be used "(for example, (See paragraph [0020] of Patent Document 1).

JP 2002-43345 A

  However, as shown in the above-mentioned patent document, the following problems occur when a “liquid resin” is used in a resin sealing apparatus using a transfer mold method. In a resin sealing apparatus using a transfer mold method, a mechanism for supplying a release film to the lower mold pot portion for air adsorption, a mechanism for supplying liquid resin and conveying it to a predetermined position on the lower mold, It is necessary to newly add a mechanism for supplying the liquid resin into the pot of the mold. As a method of supplying the liquid resin, it is conceivable to supply it into the lower mold pot using a dispenser or the like. However, adding a new mechanism for using liquid resin increases the size of the resin sealing device.

  In the resin sealing device disclosed in the above-mentioned patent document, the liquid resin supplied into the pot is injected into the cavity from the pot through resin passages such as a cal, a runner, and a gate. Also in the resin passage, the liquid resin is cured by heating to form a cured resin. The cured resin molded in the resin passage becomes an unnecessary resin unrelated to the product. Therefore, in the resin sealing device using the transfer mold method, unnecessary resin is molded in the resin passage, and thus a mechanism for cutting and discarding the unnecessary resin is required.

  As described above, in the resin sealing device using the liquid resin by the transfer molding method, it is necessary to add a mechanism for supplying and transporting the liquid resin in addition to the resin tablet supply mechanism and the transport mechanism. There is. Furthermore, since unnecessary resin is molded in the resin passage, the use efficiency of the resin is lowered, and a mechanism for cutting and discarding the unnecessary resin is required. Therefore, the configuration of the resin sealing device becomes very complicated, the device becomes large, and the productivity is deteriorated.

The present invention solves the above-described problems, and enables resin molding using a liquid resin by adopting a simple configuration in a molded product production apparatus. Furthermore, it is an object to provide a by reducing the amount of unwanted resin molded article manufacturing system that allows to improve the use efficiency of the resin material, and molded articles produced how.

  In order to solve the above problems, a molded product production apparatus according to the present invention includes a first molding die, a second molding die provided opposite to the first molding die, and a first molding. A cavity provided in one of the mold and the second mold, and a first drive mechanism for clamping the first mold and the second mold and opening the mold. And producing a molded article having a support disposed between the first mold and the second mold and a cured resin molded on the support by molding a cured resin in the cavity. An apparatus for producing a molded product, wherein a through path provided in the other mold of the first mold and the second mold is configured to be movable forward and backward with respect to one mold in the through path. An injection member provided, a resin flow path provided inside the injection member, and a first member provided on the support. An injection port provided at the tip of the injection member so as to overlap with the opening of the injection member, a second drive mechanism for moving the injection member back and forth, and a liquid resin made of a thermosetting resin A supply mechanism for supplying to the flow path; and a heating mechanism for heating the liquid resin injected into the cavity from the resin flow path via the injection port, and the first opening by advancing the injection member in the through path In a state where the injection port and the resin flow channel communicate with each other, a liquid resin is injected from the resin flow channel into the cavity via at least the injection port, and the liquid resin injected into the cavity is heated to form a cured resin. When the injection member is moved backward, the cured resin and the tip are separated, the molded product is used when producing the final product, and the first opening is provided in a portion that does not affect the function of the final product. And features.

  Moreover, the molded product production apparatus according to the present invention is characterized in that, in the molded product production apparatus described above, a cooling mechanism is provided inside the wall constituting the injection member and cools the liquid resin in the resin flow path. To do.

  Moreover, the molded product production apparatus according to the present invention is provided in the above-described molded product production apparatus so as to be movable forward and backward with respect to the injection port in the resin flow channel, and shuts off the resin flow channel and the injection port in the advanced state. In addition, an opening / closing member that communicates the resin flow path and the injection port in the retracted state and an advance / retreat mechanism that moves the opening / closing member forward and backward are provided.

  Further, the molded product production apparatus according to the present invention has the second opening provided in the other molding die in the upper part of the through passage in the molded product production apparatus described above, and advances the injection member in the through path. As a result, the tip and the portion around the second opening are in contact with each other, and the first opening, the second opening, the injection port, and the resin flow channel communicate with each other, at least through the resin flow channel. The liquid resin is injected into the cavity.

  The molded product production apparatus according to the present invention is characterized in that, in the molded product production apparatus described above, the support is a circuit board on which a chip of an electronic component is mounted.

  In the molded product production apparatus according to the present invention, the liquid resin has translucency, and the cured resin molded on the adhesive sheet includes an assembly of optical components. Features.

  Further, the molded product production apparatus according to the present invention is characterized in that, in the molded product production apparatus described above, the injection member is exposed when the first mold and the second mold are close to each other. And

  In order to solve the above-mentioned problem, a molded product production method according to the present invention includes a support between a first mold and a second mold provided opposite to the first mold. In the cavity provided in any one of the step of placing, the step of clamping the first mold and the second mold, and the first mold and the second mold A step of injecting a liquid resin made of a thermosetting resin, a step of curing the liquid resin injected into the cavity and molding a cured resin on the support, a first mold and a second mold A mold opening method, and a step of taking out a molded product having a support and a cured resin, wherein the other molding die is a first molding die or a second molding die. A step of causing the injection member to enter the provided through passage, and a first opening provided on the support in the through passage. The step of advancing the injection member with respect to the first opening and the resin flow path provided inside the injection member are communicated with each other via an injection port provided at the tip of the injection member. And a step of separating the cured resin and the tip by retreating the injection member from the cured resin, and in the step of injecting the liquid resin, the liquid resin from the resin flow path to the cavity via the injection port In the step of injecting and molding the cured resin, the cured resin is molded by heating and curing the liquid resin injected into the cavity, and the molded product is used when producing the final product, and the first opening Is provided in a portion that does not affect the function of the final product.

  The molded product production method according to the present invention is characterized in that, in the above-described molded product production method, the step of injecting the liquid resin includes a step of cooling the liquid resin inside the injection member.

  Further, the molded product production method according to the present invention is the above-described molded product production method, in which the injection port and the resin flow channel are moved forward by moving an opening / closing member provided in the resin flow channel so as to be movable forward and backward. And the step of communicating is characterized in that at least the first opening and the resin flow path are communicated by retracting the opening / closing member.

  Further, the molded product production method according to the present invention includes the step of advancing the injection member with respect to the second opening provided in the other mold in the upper part of the through-passage in the molded product production method described above. In the communicating step, the first opening, the second opening, the inlet, and the resin flow path are communicated.

  The molded product production method according to the present invention is characterized in that, in the molded product production method described above, the support is a circuit board on which a chip of an electronic component is mounted.

  In the molded product production method according to the present invention, in the molded product production method described above, the liquid resin has translucency, and the cured resin molded on the adhesive sheet includes an assembly of optical components. Features.

  Further, the molded product production method according to the present invention includes the step of exposing the injection member in the above-described molded product production method in a state where the first mold and the second mold are brought close to each other. Features.

  In order to solve the above problems, a molded product according to the present invention includes a first mold, a second mold provided opposite to the first mold, and a first mold. A cured resin formed by curing a liquid resin made of a thermosetting resin and injected into the cavity using a cavity provided in one of the second molds; and A molded article comprising at least a support formed with a cured resin on one surface corresponding to the cavity, the first opening provided in the support, and the cured resin on the other surface side of the support Formed on the exposed portion, and a trace of separation of the distal end portion of the injection member and the cured resin by retreating the injection member that has injected the liquid resin into the cavity through at least the first opening. The molded product is the final product Is used to produce the first opening is characterized in that provided in the portion that does not affect the functionality of the final product.

  The molded product according to the present invention is characterized in that, in the molded product described above, the support is a circuit board on which a chip of an electronic component is mounted.

  The molded product according to the present invention is characterized in that, in the molded product described above, the liquid resin has translucency, and includes an assembly of optical components formed on a pressure-sensitive adhesive sheet and made of a cured resin.

  According to the present invention, in the molded product production apparatus, the injection member can be moved forward and backward in the through passage provided in the mold opposite to the cavity. A liquid resin made of a thermosetting resin is supplied to a resin flow path provided inside the injection member. Liquid resin is injected into the cavity from an injection port provided at the tip of the injection member via an opening provided in the support. By adopting this configuration, resin sealing with a reduced amount of unnecessary resin can be performed using a liquid resin.

  In the molded product production apparatus, the injection member is moved backward from the cured resin formed by heating the liquid resin injected into the cavity. This makes it possible to easily separate the cured resin and the tip portion of the injection member. So-called gate cut can be performed automatically. Therefore, a mechanism for cutting unnecessary resin from the molded product and a transport mechanism for discarding unnecessary resin are not required. Therefore, simplification of the molded product production apparatus and reduction of the apparatus area can be realized.

It is a front view which shows the outline | summary of the molded product production apparatus which concerns on this invention. In the molded product production apparatus which concerns on this invention, it is the schematic which shows the structure of the shaping | molding die, gate nozzle, and liquid resin supply mechanism in the case of resin-sealing the chip | tip of an electronic component. It is sectional drawing which shows the structure of the gate nozzle which used the air cylinder in the molded product production apparatus which concerns on this invention. FIG. 4 is an exploded view of the gate nozzle shown in FIG. 3. In the molded product production apparatus which concerns on this invention, it is sectional drawing which shows the structure of the gate nozzle using a spring (elastic member). It is principal part sectional drawing which shows the molded product production apparatus which concerns on this invention, and has shown the state before clamping. It is principal part sectional drawing which shows the molded product production apparatus which concerns on this invention, and has shown the state which is mold-tightening and inject | pouring liquid resin. It is principal part sectional drawing which shows the molded product production apparatus which concerns on this invention, and has shown the state which clamps and hardens liquid resin. It is principal part sectional drawing which shows the molded product production apparatus which concerns on this invention, and has shown the state which opened the mold and took out the molded product. (A), (b), (c) is sectional drawing which each shows the communication state of the gate in a gate nozzle, and the opening part of a support body in the molded article production apparatus which concerns on this invention. In the molded product production apparatus which concerns on this invention, it is the schematic which shows the structure of the shaping | molding die and gate nozzle in the case of resin-sealing an LED chip.

  In the molded product production apparatus, a through path is provided in a mold opposite to the cavity. The injection member can be moved forward and backward in the through passage. A liquid resin made of a thermosetting resin is supplied to a resin flow path provided inside the injection member. Liquid resin is injected into the cavity from an injection port provided at the tip of the injection member via an opening provided in the support. A cured resin is formed by heating the injected liquid resin. The injection member is retracted from the cured resin to automatically separate the cured resin and the tip of the injection member.

  An embodiment of a molded product production apparatus according to the present invention will be described with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  FIG. 1 is a front view showing an outline of a molded product production apparatus according to the present invention. The molded product production apparatus 1 includes a base 2, tie bars 3 provided at four corners on the base 2, and a stationary platen 4 fixed to the upper end of the tie bar 3. An upper mold plate 6 and an upper mold 7 for resin molding are provided in the upper mold plate 6 through an upper mold heat insulating plate 5 at the lower part of the fixed platen 4. A movable plate 8 that can be moved up and down with respect to the tie bar 3 is located below the upper die 7. A lower mold 11 for molding is provided. The upper mold 7 and the lower mold 11 are provided opposite to each other, and together form a mold. The upper mold plate 6 and the lower mold plate 10 incorporate heaters (not shown) for heating the upper mold 7 and the lower mold 11. The upper mold plate 6 and the lower mold plate 10 are heated to about 175 ° C. The upper mold 7 and the lower mold 11 are configured so that they can be easily replaced in the upper mold plate 6 and the lower mold plate 10 according to the object to be sealed with resin.

  The mold clamping mechanism 12 is a mechanism that raises and lowers the movable platen 8 in order to perform mold clamping and mold opening. For example, the movable platen 8 is moved up and down by using a toggle mechanism. The upper plate 7 and the lower die 11 perform mold clamping and mold opening by moving the movable platen 8 up and down using the mold clamping mechanism 12. Here, a portion where the fixed platen 4, the upper mold heat insulating plate 5, the upper mold plate 6 and the upper mold 7 are integrally set is referred to as an upper mold setting portion 13. Similarly, a portion where the movable platen 8, the lower mold heat insulating plate 9, the lower mold plate 10 and the lower mold 11 are set is referred to as a lower mold setting unit 14. Performing mold clamping and mold opening with the upper mold 7 and the lower mold 11 means the same thing as performing mold clamping and mold opening with the upper mold setting section 13 and the lower mold setting section 14.

  The gate nozzle 15 is a movable nozzle provided so that the gate nozzle driving mechanism 16 can move up and down a through passage formed through the lower mold set portion 14. The gate nozzle 15 supplies the liquid resin to the cavity 17 provided in the upper die 7 in a state where the through passage communicating with the lower die set portion 14 is raised and stopped. Therefore, the gate nozzle 15 functions as an injection member that supplies liquid resin to the cavity 17. The gate nozzle 15 is configured to be lowered from the movable platen 8 until it is positioned below the movable platen 8 so that it can be easily attached to and detached from the movable platen 8. Further, in a state where the lower mold 11 is removed in order to replace the lower mold 11, the gate nozzle 15 can be lifted to be positioned above the lower mold plate 10 and can be attached and detached. The structure and mechanism of the gate nozzle 15 will be described in detail with reference to FIGS.

  In an actual molded product production apparatus, the upper mold 7 and the lower mold 11 are constituted by an outer part called a chase holder, an inner part called a chase, and a part provided with a cavity called a cavity block. Often done. In FIG. 1, these components are not shown.

  FIG. 2 is a schematic diagram showing the configuration of the mold, the gate nozzle 15 and the liquid resin supply mechanism in the molded product production apparatus 1 according to the present invention. In FIG. 2, the upper mold 7 is provided with a cavity 17 for resin molding. A lower mold set portion 14 (see FIG. 1) including the lower mold 11 includes a support body set section 18 on which a support body on which a chip of an electronic component is mounted, a through passage 19 for raising and lowering the gate nozzle 15, and Is provided. The gate nozzle 15 can be moved up and down by a gate nozzle drive mechanism 16 in a through passage 19 of a lower mold set portion 14 (see FIG. 1) including the lower mold 11.

  The release film 20 is supplied from a film supply roll, adjusted in direction and height by a plurality of rollers, and set at a predetermined position on the upper mold 7. The set release film 20 is covered and adsorbed in a cavity 17 provided in the upper mold 7.

  The support 22 on which the electronic component chip 21 is mounted is transported to a predetermined position of the lower mold 11 by the transport mechanism, and is disposed on the support set 18. The electrode of the chip 21 and the electrode of the support 22 are connected by a wire (not shown) such as a gold wire.

  Examples of the electronic component chip 21 include the following. First, a semiconductor chip such as an integrated circuit (IC) or a large-scale integrated circuit (LSI). Second, optical semiconductor chips such as light emitting diodes (LEDs), laser diodes (LDs), and optical sensors. Third, chips such as transistors, resistors, capacitors, inductors (coils), etc. The support 22 can be a support made of a circuit board on which a plurality of chips having the same specifications are mounted. Furthermore, it is possible to target a support made of a circuit board on which a plurality of chips of the same type are mounted. In addition, a support made of a circuit board on which a plurality of different types of chips are mounted can be targeted.

  Examples of the circuit board as the support 22 include the following. It consists of a lead frame made of a metal material, a printed circuit board such as a glass epoxy substrate, a ceramic substrate based on a ceramic material, a metal base substrate based on a metal material, and a resin film such as polyimide. Flexible substrate or the like.

  Hereinafter, a case where a semiconductor chip 21 is mounted on the support 22 as a chip of an electronic component will be described. The support 22 has an opening 23 for supplying the liquid resin from the gate nozzle 15 to the cavity 17 provided in the upper mold 7. The opening 23 can be formed at an arbitrary position of the support 22 so as to enable an optimal resin supply depending on an object to be resin-sealed. The liquid resin is supplied to the cavity 17 via the opening 23 from the back surface side of the support 22 arranged at a predetermined position of the lower mold 11.

  In the gate nozzle 15, a resin flow path 24 for flowing a liquid resin is formed inside, and a gate 25, which is an inlet for supplying the liquid resin to the cavity 17, is formed at the tip. A liquid resin is supplied from the gate 25 to the cavity 17 provided in the upper mold 7 through the opening 23 formed in the support 22. By opening and closing the gate 25, the resin flow path 24 and the cavity 17 can be communicated and blocked.

  The liquid resin is supplied from the liquid resin supply mechanism 26 to the gate nozzle 15. The gate nozzle 15 is provided with a liquid resin supply port 27. A thermosetting resin is used as the liquid resin. Examples of thermosetting resins include silicone resins and epoxy resins. A cooling mechanism for cooling the liquid resin is required in the gate nozzle 15 so that the liquid resin does not cause a curing reaction due to the influence of the ambient temperature. Therefore, a refrigerant supply mechanism 28 for supplying a cooling medium (refrigerant) to the gate nozzle 15 is provided in the molded product production apparatus 1.

  The refrigerant is supplied from the refrigerant supply mechanism 28 to the refrigerant supply port 29 provided in the gate nozzle 15 and discharged from the refrigerant discharge port 30. In the gate nozzle 15, a refrigerant flow path for flowing the refrigerant is formed outside the wall of the resin flow path 24 through which the liquid resin flows. The liquid resin flowing in the resin flow path 24 is cooled by the refrigerant flowing in the refrigerant flow path. The refrigerant can be either liquid or gas, and any liquid or gas having a cooling effect can be used. From the viewpoint of cost and workability, it is desirable to use a safe, inexpensive and easy-to-handle refrigerant such as water and air.

  The liquid resin supply mechanism 26 includes a tank 31 for storing a liquid resin main agent and a tank 32 for storing a curing agent. The two liquids supplied at a constant rate from the tank 31 containing the main agent and the tank 32 containing the curing agent are mixed in the mixing tank 33. Necessary materials such as a catalyst are added to the liquid resin as necessary. The mixing ratio of the main agent and the curing agent is adjusted according to the object to be resin-sealed, and the viscosity of the liquid resin is optimized. The optimally mixed liquid resin is supplied from the mixing tank 33 to the liquid resin supply port 27 of the gate nozzle 15. The liquid resin is supplied to the gate nozzle 15 by controlling the resin viscosity, the resin amount, the resin pressure, the injection speed, and the like by a control unit (not shown) that controls the supply of the liquid resin. It is also possible to add a function of monitoring and feeding back the resin pressure of the liquid resin supplied to the gate nozzle 15.

  Here, the case where the main agent and the curing agent are stored in separate tanks at room temperature, two liquids are mixed in actual use, and the liquid resin is supplied from the mixing tank 33 to the gate nozzle 15 is shown. . Instead of this, a supply mechanism may be used in which a liquid resin previously mixed with the main agent and the curing agent to form one liquid is supplied to the gate nozzle 15.

  FIG. 3 is a cross-sectional view showing the structure of the gate nozzle 15 using an air cylinder in the molded product production apparatus 1 according to the present invention. FIG. 3 shows a state in which the gate 25 is opened by the air cylinder. Inside the gate nozzle 15 is formed a resin flow path 24 through which the liquid resin supplied from the liquid resin supply port 27 flows. A refrigerant flow path 35 through which a refrigerant flows is formed outside the wall 34 of the resin flow path 24, in other words, inside the wall of the gate nozzle 15. The refrigerant is supplied from the refrigerant supply port 29, flows through a spiral refrigerant flow channel 35 formed outside the wall 34 of the resin flow channel 24, and is discharged from the refrigerant discharge port 30. The gate nozzle 15 may be provided with an external cooling jacket. In this case, the gate nozzle 15 and the cooling jacket together function as an injection member.

  A piston rod (piston rod) 37 that is moved up and down by an air cylinder 36 is provided in the resin flow path 24. The piston rod 37 is formed so that the tip end portion is gradually narrowed, and the gate 25 is opened and closed by the tip portion of the piston rod 37. When the piston rod 37 is raised, the gate 25 is closed by the piston rod 37. When the piston rod 37 is lowered, the gate 25 is in an open state (see FIG. 3). Therefore, the gate 25 of the gate nozzle 15 can be opened and closed by moving the piston rod 37 up and down. By opening and closing the gate 25, the liquid resin can be supplied from the gate nozzle 15 to the cavity 17 (see FIG. 2) provided in the upper mold 7, and the supply can be stopped.

  In FIG. 1, the gate nozzle 15 is affected by radiant heat from a heater (not shown) built in the lower mold plate 10. As shown in FIG. 3, a helical coolant channel 35 is formed outside the wall 34 of the resin channel 24. The liquid resin supplied to the gate nozzle 15 is cooled by the refrigerant flowing through the refrigerant flow path 35 so that the curing reaction does not proceed with the radiant heat from the heater. The liquid resin supplied to the resin flow path 24 in the gate nozzle 15 is cooled to such an extent that no curing reaction occurs due to the radiant heat from the heater built in the lower mold plate 10.

  FIG. 4 is an exploded view of the gate nozzle 15 shown in FIG. The gate nozzle 15 is composed of members such as a gate nozzle main body portion 38, a tip portion 39, a resin passage portion 40, and a piston rod 37. First, the gate nozzle main body portion 38 and the tip end portion 39 are combined, and the resin passage portion 40 is incorporated therein. Further, a piston rod 37 is incorporated in the resin passage portion 40. In this way, the gate nozzle 15 can be easily assembled. Conversely, the gate nozzle 15 can be easily disassembled. Accordingly, disassembly and assembly of the gate nozzle 15 can be simplified, and cleaning and maintenance of the gate nozzle 15 itself can be facilitated.

  Further, as shown in FIG. 1, the gate nozzle 15 is provided so as to move up and down in a through passage 19 formed by communicating the lower mold set portion 14. In addition, for example, when the movable platen 8 is raised and the upper die 7 and the lower die 11 are close to each other (including a state where the die is clamped), the gate nozzle 15 can be lowered until the gate nozzle 15 is located below the movable platen 8. Therefore, the gate nozzle 15 can be easily detached from the movable platen 8. Furthermore, the gate nozzle 15 is composed of members such as a gate nozzle main body portion 38, a tip portion 39, a resin passage portion 40, and a piston rod 37, and can be easily disassembled and assembled. In the molded product production apparatus 1, the gate nozzle 15 can be easily detached from the movable platen 8, and the gate nozzle 15 can be easily disassembled and assembled. Therefore, maintenance of the molded product production apparatus 1 can be facilitated, and workability can be improved.

  FIG. 5 is a cross-sectional view showing the structure of the gate nozzle 15 using a spring (elastic member) in the molded product production apparatus 1 according to the present invention. FIG. 5 shows a configuration in which a spring 41 is used instead of the air cylinder 36 as a gate opening / closing mechanism in the gate nozzle 15. FIG. 5 shows a state where the piston rod 37 is pushed up by the spring 41 and the gate 25 is closed. When the resin pressure of the liquid resin supplied from the liquid resin supply port 27 is low, the piston rod 37 is pushed up by the pressing force of the spring 41 and the gate 25 is closed. When the resin pressure of the liquid resin increases and becomes a resin pressure higher than the pressing force of the spring 41, the piston rod 37 is pushed down by the resin pressure and the gate 25 is opened. When the gate 25 is opened, the liquid resin is injected into the cavity 17 (see FIG. 2) provided in the upper mold 7. When the filling of the cavity 17 is completed and the resin pressure is lowered, the pressing force of the spring 41 becomes higher than the resin pressure, and the spring 41 pushes up the piston rod 37 and closes the gate 25. When the spring 41 is used, the gate 25 can be opened and closed by the resin pressure of the liquid resin.

  With reference to FIG. 6 to FIG. 9, in the molded product production apparatus 1 according to the present invention, operations from mold opening to mold clamping, then liquid resin injection to resin curing, and molded product removal. explain.

  FIG. 6 shows the mold opened state before resin sealing in the molded product production apparatus 1. First, the release film 20 that covers the cavity 17 provided in the upper mold 7 is set at a predetermined position. The support 22 on which the electronic component chip 21 is mounted is transported to a predetermined position of the lower mold 11 by the transport mechanism. The gate nozzle 15 is lowered by the gate nozzle drive mechanism 16 to a position away from the mold surface in the support body setting portion 18. The piston rod 37 is raised by the air cylinder 36, and in this state, the gate 25 at the tip of the gate nozzle 15 is closed. The liquid resin supplied to the gate nozzle 15 is cooled by the refrigerant flowing outside the wall 34 of the resin flow path 24 (see FIG. 3). Next, the release film 20 is adsorbed to adhere to the inner surface of the cavity 17. Next, the support body 22 is disposed on the support body setting portion 18 of the lower mold 11. Next, the movable platen 8 is raised by the mold clamping mechanism 12 to clamp the upper mold 7 and the lower mold 11 (see FIG. 1).

  FIG. 7 shows a state in which liquid resin is injected from the gate nozzle 15 into the cavity 17 immediately after the upper mold 7 and the lower mold 11 are clamped. The gate nozzle 15 is raised to a predetermined position of the opening 23 of the support 22 by the gate nozzle driving mechanism 16. Next, the piston rod 37 is lowered by the air cylinder 36. In this state, the gate 25 at the tip of the gate nozzle 15 is opened. Next, liquid resin is injected into the gate nozzle 15 from the liquid resin injection port 27. The pressurized liquid resin is injected from the gate 25 into the cavity 17 through the opening 23 in the support 22.

  FIG. 8 shows a state in which the liquid resin injected into the cavity 17 shown in FIG. 7 is cured. When the operation of injecting the liquid resin into the cavity 17 is completed, the piston rod 37 is raised by the air cylinder 36 and the gate 25 is closed. By closing the gate 25, injection of the resin seal into the cavity 17 is stopped. The cured resin 42 is formed by heating and curing the liquid resin for a predetermined time. Through the steps so far, the chip 21 mounted on the support 22 is resin-sealed with the cured resin 42.

  FIG. 9 shows a state where the upper mold 7 and the lower mold 11 are opened, and the molded product 43 sealed with resin is taken out. After the resin sealing is completed, the gate nozzle 15 is lowered to a predetermined position by the gate nozzle driving mechanism 16 with the gate 25 closed. By lowering the gate nozzle 15, a so-called gate cut for automatically separating the cured resin 42 in the molded product 43 and the vicinity of the gate 25 in the gate nozzle 15 is automatically performed. Next, the upper mold 7 and the lower mold 11 are opened. Next, the molded product 43 is pushed up by an ejector pin (not shown), and the molded product 43 is taken out. The molded product 43 has a trace 44 (exaggeratedly drawn) when the vicinity of the gate 25 is separated from the cured resin 42. Thereafter, if necessary, the molded product 43 is divided into one or more chips 21 as a unit. Thereby, the electronic device which is the final product is completed.

  10 (a), (b), and (c) show the openings (23, 23) formed in the gate 25 of the gate nozzle 15 and the support (22, 22A, 22B) in the molded product production apparatus 1 according to the present invention. 23A and 23B) are cross-sectional views each showing a communication state. For example, the diameter of the tip of the gate nozzle 15 is designed to be about 5 mm to 15 mm, and the diameter of the gate 25 for injecting the liquid resin is designed to be about 0.3 mm to 1.0 mm. The openings (23, 23A, 23B) of the support (22, 22A, 22B) are larger than the diameter of the gate 25 and are opened to about 1 mm to 3 mm. The diameter of the tip of the gate nozzle 15 and the diameter of the gate 25 are optimally designed in accordance with the object to be sealed with resin, the viscosity of the liquid resin, and the like.

  FIG. 10A shows a case where the through passage 19 in the lower mold 11 is opened with the same diameter from the upper surface to the lower surface. The gate nozzle 15 is raised in the through passage 19, and the tip of the gate nozzle 15 and the periphery of the opening 23 in the support 22 (the lower surface of the support 22) are brought into close contact with each other. As a result, the gate 25, the opening 23, and the cavity 17 communicate with each other. Therefore, the liquid resin can be injected from the resin flow path 24 into the cavity 17.

  FIG. 10B shows a case where an opening 45A is provided in the lower mold 11A on the upper surface side of the through passage 19A formed in the lower mold 11A. The opening 45A opens to the same size as the opening 23A formed in the support 22A. In the through passage 19A, the gate nozzle 15 is raised, and the tip of the gate nozzle 15 and the periphery of the opening 45A in the lower die 11A (the lower surface of the protruding portion in the lower die 11A) are brought into close contact with each other. As a result, the gate 25, the opening 45A, the opening 23A, and the cavity 17 communicate with each other. Therefore, the liquid resin can be injected from the resin flow path 24 into the cavity 17.

  FIG. 10C shows a case where a step is provided in the opening 23B of the support 22B. An opening 45B is formed on the upper surface side of the through passage 19B at a position higher than the surface of the lower mold 11B. The opening 23B has such a diameter that the protruding portion of the lower mold 11B including the opening 45B is inserted at a predetermined position from the back surface side of the support 22B. The opening 45B opens to the same size as the opening 23B formed in the support 22B. The gate nozzle 15 is raised in the through passage 19B, and the tip of the gate nozzle 15 and the periphery of the opening 45B in the lower mold 11B (the lower surface of the projecting portion in the lower mold 11B) are brought into close contact with each other. As a result, the gate 25, the opening 45B, the opening 23B, and the cavity 17 communicate with each other. Therefore, the liquid resin can be injected from the resin flow path 24 into the cavity 17.

  10A, 10B, and 10C, the gate 25 and the cavity 17 are provided with openings 23, 23A, 23B and lower molds 11A, 11B formed in the supports 22, 22A, 22B. Communicating via the openings 45A, 45B formed in. Therefore, the liquid resin can be injected from the resin flow path 24 into the cavity 17. Further, the tip of the gate nozzle 15 is in close contact with the periphery of the opening 23 formed in the support 22 or the periphery of the openings 45A and 45B formed in the lower molds 11A and 11B. As a result, the liquid resin can be prevented from leaking from the cavity 17 into the gaps between the through passages 19, 19 A, 19 B formed in the lower molds 11, 11 A, 11 B and the gate nozzle 15.

  In any of the cases shown in FIGS. 10A, 10B, and 10C, after the liquid resin is cured and the resin sealing is completed, the gate nozzle 15 can be lowered to a predetermined position (FIG. 9). reference). By lowering the gate nozzle 15, it is possible to automatically perform a gate cut that separates the cured resin 42 in the molded product 43 from the vicinity of the gate 25 at the tip of the gate nozzle 15.

  FIG. 11 is a schematic diagram showing a configuration of a molding die and a gate nozzle when an LED chip is sealed with a resin as a chip in the molded product production apparatus 1 according to the present invention. When the LED chip is resin-sealed, an individual cavity 17B for LED is further provided in the entire cavity 17A provided in the upper mold 7A corresponding to the position and number of the LED chips 21A mounted on the support 22. It may be provided and sealed with resin. That is, by providing the individual cavities 17B in the entire cavity 17A, the resin sealing of the LED main body portion and the molding of the lens portion can be performed collectively in the same process. Therefore, it is possible to simultaneously reduce the number of processes and prevent the lens portion from shifting when manufacturing an LED product, and it is possible to reduce the manufacturing cost and improve the performance of the LED product. Except for the configuration of the entire cavity 17A and the individual cavity 17B provided in the upper die 7A, the configuration is exactly the same as the configuration of the molded product production apparatus 1 shown in FIG. 2, and the same effect as in the case of resin-molding the semiconductor chip 21 Needless to say.

  The molded product production apparatus 1 according to the present invention can not only resin-seal the semiconductor or optical semiconductor chip 21 mounted on the support 22 but also resin-mold the assembly of optical components. . Examples of the assembly of optical components include the following. These are an assembly of convex lenses, an assembly of Fresnel lenses, an assembly of optical prisms, an assembly of reflective members (reflectors) for LEDs, and the like. In this case, an adhesive film may be used as the support. By using an adhesive film, an assembly of optical components can be affixed to an object at once.

  Moreover, the aggregate | assembly of a convex lens can be shape | molded collectively using the molded product production apparatus 1 which concerns on the support body 22 with which the reflector and the LED chip were mounted | worn. In addition, the support 22 on which the reflector and the LED chip are mounted and the aggregate of the convex lenses can be bonded together. The molded product production apparatus 1 according to the present invention enables resin molding using a liquid resin, and can easily perform resin molding even with an assembly of optical components.

  In the molded product production apparatus 1 according to the present embodiment, the gate nozzle 15 is provided in the lower mold setting portion 14 (see FIG. 1), and the liquid resin is supplied from the gate nozzle 15 to the cavity 17 provided in the upper mold 7 to be supported. The case where the chip 21 attached to the body 22 is resin-sealed has been described. Instead of this, it goes without saying that the same effect can be obtained when the gate nozzle 15 is provided in the upper die set portion 13 (see FIG. 1) and the cavity 17 is provided in the lower die 11.

  In the present embodiment, the case where the electronic component chip 21 mounted on the support 22 is resin-sealed has been described. In the present invention, not only the semiconductor chip 21 and the LED chip 21A mounted on the support 22 are resin-sealed, but also a molded product that does not include an electronic component chip, such as an assembly of optical components, is resin-molded. Also applies. Furthermore, the present invention is applied not only when resin articles are used for molding semiconductor products and optical component assemblies, but also when plastic articles, rubber products, etc. are resin molded.

  As described so far, in the molded product production apparatus 1 according to the present invention, the gate nozzle 15 provided in the lower mold set unit 14 is used to pass the upper part 23 through the opening 23 formed in the support 22. Liquid resin can be directly injected into the cavity 17 provided in the mold 7 and sealed with resin (see FIGS. 1 and 2). Therefore, according to the present invention, there is no need to provide resin passages such as cals, runners, and gates, which are necessary in the resin sealing device using the transfer mold method. That is, since it is not necessary to form a resin passage communicating with the cavity 17, the amount of unnecessary resin can be reduced and the use efficiency of the resin material can be greatly improved.

  In addition, the gate nozzle 15 is lowered in the through passage 19 to automatically perform a gate cut for separating the vicinity of the gate 25 from the cured resin 42 in the molded product 43 (see FIG. 9). This eliminates the need for a mechanism (degate mechanism) that cuts the unnecessary part (unnecessary resin) of the cured resin in the resin passage, which was required when using a resin molding apparatus using the transfer molding method, from the molded product. Become. Furthermore, since the unnecessary resin is not molded, a transport mechanism for discarding the unnecessary resin becomes unnecessary. Therefore, the configuration of the molded product production apparatus 1 can be simplified and the area of the apparatus can be reduced, and the apparatus can be reduced in size and cost.

  Further, an opening 23 is formed at an arbitrary position of the support 22 arranged in the lower mold 11 in accordance with an object to be sealed with resin, the size of the support 22, and the like, and the opening 23 is formed from the back side of the support 22. The liquid resin can be injected into the cavity 17 provided in the upper mold 7 via the above. Therefore, effective liquid resin can be injected according to the object to be sealed with resin. By preventing molding defects and wire flow in the cavity 17, it is possible to improve product quality and yield.

  Further, the gate nozzle 15 is provided in the lower mold setting unit 14 or the upper mold setting unit 13, and moves up and down in the through path of the lower mold setting unit 14 or the upper mold setting unit 13. In addition, the gate nozzle 15 can be exposed from the movable platen 8 or the fixed platen 4 at a position below the movable platen 8 or above the fixed platen 4. Therefore, the gate nozzle 15 can be easily detached from the molded product production apparatus 1. Further, the gate nozzle 15 is configured by assembling members constituting the gate nozzle main body 38, the tip 39, the resin passage 40, the piston rod 37, and the like (see FIG. 4). Therefore, the gate nozzle 15 can be easily attached / detached, disassembled, and assembled, and maintenance and the like can be easily performed, so that workability can be improved.

  In addition, since a conventional resin molding apparatus using a transfer mold method uses a resin tablet, it is very difficult to perform resin sealing using a liquid resin like an LED. On the other hand, the molded product production apparatus 1 according to the present invention can facilitate the resin molding using the liquid resin by adopting the configuration in which the gate nozzle 15 is provided. Therefore, according to the present invention, a molded product production apparatus having a simple configuration can be used to perform resin molding using liquid resin for products in all fields including semiconductor products.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

DESCRIPTION OF SYMBOLS 1 Molded product production apparatus 2 Base 3 Tie bar 4 Fixed board 5 Upper mold heat insulating board 6 Upper mold plate 7, 7A Upper mold (one mold)
8 Movable platen 9 Lower mold insulation plate 10 Lower mold plate 11, 11A, 11B Lower mold (the other mold)
12 Clamping mechanism (first drive mechanism)
13 Upper mold setting part 14 Lower mold setting part 15 Gate nozzle (member for injection)
16 Gate nozzle drive mechanism (second drive mechanism)
17 Cavity 17A Overall Cavity 17B Individual Cavity 18 Support Body Set Portion 19, 19A, 19B Through Path 20 Release Film 21 Chip 21A LED Chip 22, 22A, 22B Support Body 23, 23A, 23B Opening (First Opening)
24 Resin channel 25 Gate (inlet)
26 Liquid resin supply mechanism 27 Liquid resin supply port 28 Refrigerant supply mechanism 29 Refrigerant supply port 30 Refrigerant discharge port 31 Main agent storage tank 32 Hardener storage tank 33 Mixing tank 34 Wall 35 Refrigerant flow path 36 Air cylinder (advance / retreat mechanism)
37 Piston rod (member for opening and closing)
38 Gate nozzle body 39 Tip 40 Resin passage 41 Spring 42 Cured resin 43 Molded product 44 Trace 45A, 45B Opening (second opening)

Claims (12)

A first mold, and a second mold provided opposite to the first mold,
A cavity provided in one of the first mold and the second mold;
A first drive mechanism that clamps the first mold and the second mold and opens the mold;
A molding having a support disposed between the first mold and the second mold by molding a cured resin in the cavity and the cured resin molded on the support. A molded product production apparatus for producing a product,
A through passage provided in the other mold of the first mold and the second mold;
An injection member provided so as to be capable of advancing and retreating with respect to the one mold in the penetration path;
A resin flow path provided inside the injection member;
An injection port provided at the tip of the injection member so as to overlap the first opening provided in the support in plan view;
A second drive mechanism for advancing and retracting the injection member;
A supply mechanism for supplying a liquid resin containing a thermosetting resin to the resin flow path;
A cooling mechanism which is provided inside a wall constituting the injection member and cools the liquid resin in the resin flow path;
The resin flow path is provided so as to be movable forward and backward with respect to the injection port, shuts off the resin flow channel and the injection port in the advanced state, and disconnects the resin flow channel and the injection port in the retracted state. An openable and closable member,
An advancing and retracting mechanism for advancing and retracting the opening and closing member;
A heating mechanism for heating the liquid resin injected into the cavity from the resin flow path via the injection port,
By advancing the injection member in the through passage, the tip of the injection member is pressed against the periphery of the first opening provided in the support member, and the support member is provided with the The periphery of the first opening and the tip of the injection member are brought into close contact with each other, and the first opening, the injection port, and the resin flow path are in communication with each other,
The liquid resin is injected from the resin flow path into the cavity via at least the injection port,
The liquid resin injected into the cavity is heated to form the cured resin,
The cured resin and the tip portion are separated by retreating the injection member from the cured resin,
The molded product is used in producing the final product,
The molded product producing apparatus according to claim 1, wherein the first opening is provided in a portion that does not affect the function of the final product. A first mold, and a second mold provided opposite to the first mold,
A cavity provided in one of the first mold and the second mold;
A first drive mechanism that clamps the first mold and the second mold and opens the mold;
A molding having a support disposed between the first mold and the second mold by molding a cured resin in the cavity and the cured resin molded on the support. A molded product production apparatus for producing a product,
A through passage provided in the other mold of the first mold and the second mold;
A second opening provided on the side of the through hole in the other mold on which the support is disposed;
An injection member provided so as to be capable of advancing and retreating with respect to the one mold in the penetration path;
A resin flow path provided inside the injection member;
An injection port provided at the tip of the injection member so as to overlap the first opening provided in the support in plan view;
A second drive mechanism for advancing and retracting the injection member;
A supply mechanism for supplying a liquid resin containing a thermosetting resin to the resin flow path;
A cooling mechanism which is provided inside a wall constituting the injection member and cools the liquid resin in the resin flow path;
The resin flow path is provided so as to be movable forward and backward with respect to the injection port, shuts off the resin flow channel and the injection port in the advanced state, and disconnects the resin flow channel and the injection port in the retracted state. An openable and closable member,
An advancing and retracting mechanism for advancing and retracting the opening and closing member;
A heating mechanism for heating the liquid resin injected into the cavity from the resin flow path via the injection port,
By advancing the injection member in the through passage, the tip of the injection member is pressed against the periphery of the second opening provided in the other mold, and the other mold is The vicinity of the provided second opening and the tip of the injection member are brought into close contact with each other, and the first opening, the second opening, the injection port, and the resin flow channel are in communication with each other. ,
The liquid resin is injected from the resin flow path into the cavity via at least the injection port,
The liquid resin injected into the cavity is heated to form the cured resin,
The cured resin and the tip portion are separated by retreating the injection member from the cured resin,
The molded product is used in producing the final product,
The molded product producing apparatus according to claim 1, wherein the first opening is provided in a portion that does not affect the function of the final product. A first mold, and a second mold provided opposite to the first mold,
A cavity provided in one of the first mold and the second mold;
A first drive mechanism that clamps the first mold and the second mold and opens the mold;
A molding having a support disposed between the first mold and the second mold by molding a cured resin in the cavity and the cured resin molded on the support. A molded product production apparatus for producing a product,
A through passage provided in the other mold of the first mold and the second mold;
An injection member provided so as to be capable of advancing and retreating with respect to the one mold in the penetration path;
A resin flow path provided inside the injection member;
An injection port provided at the tip of the injection member so as to overlap the first opening provided in the support in plan view;
A second drive mechanism for advancing and retracting the injection member;
A supply mechanism for supplying a liquid resin containing a thermosetting resin to the resin flow path;
A cooling mechanism which is provided inside a wall constituting the injection member and cools the liquid resin in the resin flow path;
The resin flow path is provided so as to be movable forward and backward with respect to the injection port, shuts off the resin flow channel and the injection port in the advanced state, and disconnects the resin flow channel and the injection port in the retracted state. An openable and closable member,
An elastic member for advancing and retracting the opening and closing member;
A heating mechanism for heating the liquid resin injected into the cavity from the resin flow path via the injection port,
When the injection member is advanced in the through passage, and the supply mechanism applies resin pressure to the liquid resin, the elastic member is elastically deformed, and the opening / closing member is retracted from the injection port. The first opening, the inlet and the resin flow path are in communication with each other,
The liquid resin is injected from the resin flow path into the cavity via at least the injection port,
The liquid resin injected into the cavity is heated to form the cured resin,
The cured resin and the tip portion are separated by retreating the injection member from the cured resin,
The molded product is used in producing the final product,
The molded product producing apparatus according to claim 1, wherein the first opening is provided in a portion that does not affect the function of the final product. In the molded product production apparatus according to any one of claims 1 to 3,
  The support is a circuit board on which electronic component chips are mounted.
Production equipment. In the molded product production apparatus according to any one of claims 1 to 3,
The liquid resin has translucency,
  The cured resin molded on the support includes an assembly of optical components.
Molded product production equipment. In the molded product production apparatus according to any one of claims 1 to 3,
  In a state where the first mold and the second mold are close to each other, the injection port provided at the tip of the injection member is the first mold or the second mold. Is a movable platen or a state exposed from the fixed platen. A support is provided between the first mold and the second mold provided opposite to the first mold.
A step of arranging, a step of clamping the first mold and the second mold, and the first
The cavity formed in one of the mold and the second mold is heated in the cavity.
A step of injecting a liquid resin containing a curable resin, and the liquid tree injected into the cavity
A step of curing fat to form a cured resin on the support, the first mold and the first
A step of opening the mold of 2 and a molded product having the support and the cured resin is taken out.
A method for producing a molded article comprising the steps of:
  A through path provided in the other mold of the first mold and the second mold, and an injection provided so as to be able to advance and retreat with respect to the one mold in the through path A member, a resin flow path provided inside the injection member, and a first opening provided in the support so as to overlap with the first opening provided in the distal end portion of the injection member. And the resin flow path is provided so as to be able to advance and retreat with respect to the injection port, shuts off the resin flow path and the injection port in the advanced state, and Preparing an opening / closing member communicating with the inlet;
  The step of causing the injection member to enter the through passage provided in the other mold of the first mold and the second mold;
  A step of advancing the injection member with respect to the first opening provided in the support in the through path;
The tip of the injection member is pressed against the periphery of the first opening provided in the support member, and the periphery of the first opening provided in the support member and the tip of the injection member A step of closely contacting the part;
  Communicating the first opening and the resin flow path provided inside the injection member via the injection port provided at the tip of the injection member;
  Retracting the injection member from the cured resin to retreat the cured resin and the tip
And a step of separating
  In the step of communicating, at least the first opening and the resin flow path are communicated by retracting the opening / closing member,
  In the step of injecting the liquid resin, the cavity is passed from the resin flow path through the injection port.
Inject the liquid resin into the tee,
  Furthermore, the step of injecting the liquid resin comprises a step of cooling the liquid resin inside the injection member,
  In the step of molding the cured resin, the liquid resin injected into the cavity is heated.
And molding the cured resin by curing,
  The molded product is used in producing the final product,
  The first opening is provided in a portion that does not affect the function of the final product.
Molded product production method. A support is provided between the first mold and the second mold provided opposite to the first mold.
A step of arranging, a step of clamping the first mold and the second mold, and the first
The cavity formed in one of the mold and the second mold is heated in the cavity.
A step of injecting a liquid resin containing a curable resin, and the liquid tree injected into the cavity
A step of curing fat to form a cured resin on the support, the first mold and the first
A step of opening the mold of 2 and a molded product having the support and the cured resin is taken out.
A method for producing a molded article comprising the steps of:
  Of the first mold and the second mold, the through path provided in the other mold, and the side of the through path in the other mold provided on the side where the support is disposed A second opening, an injection member provided so as to be able to advance and retreat with respect to the one mold in the through passage, a resin flow path provided inside the injection member, and the support An injection port provided at a distal end portion of the injection member so as to overlap with the provided first opening in plan view, and provided so as to be movable forward and backward with respect to the injection port in the resin flow path, Preparing an opening / closing member that shuts off the resin flow path and the injection port in the advanced state and communicates the resin flow path and the injection port in the retracted state;
  The step of causing the injection member to enter the through passage provided in the other mold of the first mold and the second mold;
  A step of advancing the injection member with respect to the first opening provided in the support in the through path;
The tip of the injection member is pressed against the periphery of the second opening provided in the other mold, and the periphery of the second opening provided in the other mold and the injection A step of closely contacting the tip of the member;
  The first opening, the second opening, and the resin flow path provided in the injection member are communicated with each other via the injection port provided in the distal end portion of the injection member. Process,
  Retracting the injection member from the cured resin to retreat the cured resin and the tip
And a step of separating
  In the step of communicating, at least the first opening and the resin flow path are communicated by retracting the opening / closing member,
  In the step of injecting the liquid resin, the cavity is passed from the resin flow path through the injection port.
Inject the liquid resin into the tee,
  Furthermore, the step of injecting the liquid resin comprises a step of cooling the liquid resin inside the injection member,
  In the step of molding the cured resin, the liquid resin injected into the cavity is heated.
And molding the cured resin by curing,
  The molded product is used in producing the final product,
  The first opening is provided in a portion that does not affect the function of the final product.
Molded product production method. A support is provided between the first mold and the second mold provided opposite to the first mold.
A step of arranging, a step of clamping the first mold and the second mold, and the first
The cavity formed in one of the mold and the second mold is heated in the cavity.
A step of injecting a liquid resin containing a curable resin, a step of curing the liquid resin injected into the cavity to form a cured resin on the support, the first mold and the second A method of producing a molded product comprising:
  A through path provided in the other mold of the first mold and the second mold, and an injection provided so as to be able to advance and retreat with respect to the one mold in the through path A member, a resin flow path provided inside the injection member, and a first opening provided in the support so as to overlap with the first opening provided in the distal end portion of the injection member. And the resin flow path is provided so as to be able to advance and retreat with respect to the injection port, shuts off the resin flow path and the injection port in the advanced state, and Preparing an opening / closing member that communicates with the inlet, and an elastic member that advances and retracts the opening / closing member;
  The step of causing the injection member to enter the through passage provided in the other mold of the first mold and the second mold;
  A step of advancing the injection member with respect to the first opening provided in the support in the through path;
  Communicating the first opening and the resin flow path provided inside the injection member via the injection port provided at the tip of the injection member;
  Retracting the injection member from the cured resin to retreat the cured resin and the tip
And a step of separating
In the step of communicating, the supply mechanism applies a resin pressure to the liquid resin and elastically deforms the elastic member, whereby the opening / closing member is retracted, and at least the first opening and the resin flow path are connected. Communicate
  In the step of injecting the liquid resin, the cavity is passed from the resin flow path through the injection port.
Inject the liquid resin into the tee,
  Furthermore, the step of injecting the liquid resin comprises a step of cooling the liquid resin inside the injection member,
  In the step of molding the cured resin, the liquid resin injected into the cavity is heated.
And molding the cured resin by curing,
  The molded product is used in producing the final product,
  The first opening is provided in a portion that does not affect the function of the final product.
Molded product production method. In the molded article production method according to any one of claims 7 to 9,
  The support is a circuit board on which electronic component chips are mounted.
Production method. In the molded article production method according to any one of claims 7 to 9,
  The liquid resin has translucency,
  The cured resin molded on the support includes an assembly of optical components.
Molded product production method. In the molded article production method according to any one of claims 7 to 9,
  In a state where the first molding die and the second molding die are brought close to each other, the injection port provided at the distal end portion of the injection member is used as the first molding die or the second molding die. A method for producing a molded product, comprising a step of exposing a movable plate or a fixed plate to which a mold is fixed.

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