TWI643310B - A method for fabricating a substrate-less package and application thereof - Google Patents

Abstract

The invention provides a method for preparing a substrate-free package and an application thereof, the method comprising: providing a first release film; placing a plurality of objects on the first release film; covering a chemical in the plurality of objects a surface; providing a second release film on a plane having the groove of the mold; performing a compression molding process to mold the chemical and the plurality of objects; and removing the mold, A release film and a second release film provide a substrateless package.

Description

Method for preparing package without substrate and application thereof

The invention relates to a preparation method of a substrate-free package and an application thereof, in particular to a light-emitting device without a substrate.

The substrate is a carrier for carrying components such as a chip, a light-emitting diode, and a circuit in a conventional packaging process. With the thin design of various electronic components and the lighting industry's requirements for improving luminous efficiency, the conventional packaging method has been unable to achieve relevant Technical specifications.

The etching process is included in the wafer or semiconductor process, and Patent No. I387067 discloses a substrateless chip packaging method in which the metal substrate is removed by etching to obtain a thin film without a substrate, but the etching method uses a strong acid. Such as hydrofluoric acid and other compounds, so this method will create a risk of environmental protection, and can not be applied to the packaging process of objects that are incompatible with strong acid.

In the lighting industry, lighting fixtures have higher and higher requirements for luminous performance, and the traditional LED package not only limits the specifications of the light-emitting components, but also is not conducive to heat dissipation. In addition, the requirements of the design and configuration of the lamps are still required. Wait, and The former LED package technology cannot overcome the above technical bottleneck.

In summary, in today's packaging industry, it is important to develop an environmentally friendly non-substrate packaging technology that does not use an etching process, and that the packaging technology can be applied to the manufacturing technology of a substrate-free illuminating device. Question.

In view of the above-mentioned background of the invention, in order to meet the requirements of the industry, the present invention provides a method for preparing a package without a substrate to solve the above-mentioned insurmountable problems and achieve the industrially desired purpose.

An object of the present invention is to provide a method for preparing a substrate-free package, the method comprising: providing a first release film; placing a plurality of objects on the first release film, the object comprising a wafer, a wafer , a illuminant, a semiconductor, a passive component, an electrode, and a circuit line; covering a surface of a plurality of objects on a chemical object; providing a mold; placing a second release film on a plane having the groove of the mold; a molding process of molding the chemical and the plurality of objects by pressing the first release film and the second release film by the mold; and removing the mold, the first release film, and the second The release film provides a substrate-free package.

In one embodiment, the first release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the chemical substance includes: silicone rubber, epoxy Resin, fluorescent glue, conductive paste and any liquid formable material.

In one embodiment, the second release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the operating temperature of the stamping process described above is between 60 and 200 °C.

In one embodiment, the mold operating pressure of the stamping process described above is between 4 and 12 tons.

In one embodiment, the substrateless package includes: a substrateless chip package, a substrateless wafer package, a substrateless light emitting package, a substrateless semiconductor package, and a substrateless passive component package. Body, substrateless electrode package and circuitless circuit package.

In a preferred embodiment, the illuminant is a light emitting diode.

Another object of the present invention is to provide a method for fabricating a substrate-free light-emitting device, the method comprising: providing a first release film; placing a plurality of light-emitting diodes on the first release film; covering a chemical a surface of the plurality of light-emitting diodes; providing a mold; placing a second release film on a plane having the groove of the mold; performing a compression molding process, and pressing the first release type by the mold The film and the second release film shape the chemical and the plurality of light-emitting diodes described above; and remove the mold, the first release film and the second release film to obtain a substrate-free light-emitting device Set.

In one embodiment, the first release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the above chemical comprises: silicone, epoxy resin, conductive paste, and any liquid formable material.

In one embodiment, the second release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the operating temperature of the stamping process described above is between 60 and 200 °C.

In one embodiment, the mold operating pressure of the stamping process described above is between 4 and 12 tons.

In one embodiment, the light-emitting luminance of the above-mentioned substrate-free light-emitting device is greater than 150 lumens (lm).

In one embodiment, the above-described substrateless illumination device is used to change the illumination angle of an object.

In an embodiment, the light-emitting device of the above-mentioned substrate-free light-emitting device has an illumination angle of between 5 and 180 degrees.

According to the method for preparing a substrate-free package and a substrate-free light-emitting device provided by the present invention, an important technical feature of the above method is to use a release film as a temporary carrier substrate of the package, since the release film can be easily removed from The material property of the substrate removed on the surface of the object, so that the substrate-free package preparation method of the present invention can prepare a substrate-free package without a conventional complicated and environmentally friendly etching process. Furthermore, the groove on the mold used in the method for preparing the substrateless package of the present invention can be of any shape and size, and therefore, the design of the mold groove can be made according to the needs of the industry. A substrate-less package of shape and size that is difficult to achieve with conventional packaging methods. When the method of the present invention is applied to the preparation of a substrate-free illuminating device, the illuminating brightness of the substrateless illuminating device is increased by more than 20% compared with the conventional illuminating device, and at the same time, because it can be designed into different shapes of illuminating devices, it can be achieved. By arbitrarily controlling or changing the angle of illumination, it can solve the problem that the illumination angle of the prior art cannot be changed and the brightness of the illumination is low, and is widely used in the lighting industry.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. In order to thoroughly understand the present invention, detailed steps and compositions thereof will be set forth in the following description. Obviously, the practice of the invention is not limited to the specific details that are apparent to those skilled in the art. On the other hand, well-known components or steps are not described in detail to avoid unnecessarily limiting the invention. The preferred embodiments of the present invention will be described in detail below, but the present invention may be widely practiced in other embodiments, and the scope of the present invention is not limited. The scope of the patents that follow will prevail.

According to a first embodiment of the present invention, the present invention provides a method for preparing a substrate-free package, the method comprising: providing a first release film; placing a plurality of objects on the first release film, the object Including a wafer, a wafer, an illuminant, a semiconductor, a passive component, an electrode, and a circuit line; covering a surface of a plurality of objects on a chemical; providing a mold; placing a plane on a plane having a groove of any shape a second release film; performing a compression molding process by pressing the first release film and the second release film to mold the chemical and the plurality of objects; and removing the mold, The first release film and the second release film are provided with a substrateless package.

In one embodiment, the first release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the above chemical comprises: tannin extract, epoxy resin, fluorescent glue, conductive paste and any liquid formable material.

In one embodiment, the second release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the operating temperature of the stamping process described above is between 60 and 200 °C.

In an embodiment, the mold operating pressure of the above-mentioned stamping program It is between 4-12 tons.

In one embodiment, the substrateless package includes: a substrateless chip package, a substrateless wafer package, a substrateless light emitting package, a substrateless semiconductor package, and a substrateless passive component package. Body, substrateless electrode package and circuitless circuit package.

In a preferred embodiment, the illuminant is a light emitting diode.

In a specific example, the configuration of each element used in the preparation method of the present invention is as shown in the first figure. According to the second figure, the method steps of the present invention are as follows: a first release film 11 is provided, and the first release film 11 is attached or placed on the plane of any hard material, and the object 2 to be packaged is placed in the first Above the release film 11, the object 2 comprises a wafer, a wafer, an illuminant, a semiconductor, a passive component, an electrode and a circuit line; and a chemical 3 is disposed on the object 2, the chemical 3 comprising silicone, epoxy The resin, the fluorescent glue and the conductive adhesive are selected according to the material to be encapsulated on the object; a mold 4 is provided, and the groove on the mold 4 can be any shape and size; the plane having the groove in the mold 4 A second release film 12 is placed thereon, and the first release film 11 on which the object 3 is placed on the surface and the mold 4 on which the second release film 12 is placed are combined to perform a molding process to form the chemical 3 and the object 2, and press The molding process is carried out under vacuum in a state where the temperature is 60 ° C and the operating pressure of the mold is 5 tons; the formed package is then removed from the mold 4, the first release film and the second release type. The substrate-free package of the present invention is obtained after the film.

According to a second embodiment of the present invention, there is provided a method for fabricating a substrate-free light-emitting device, the method comprising: providing a first release film; placing a plurality of light-emitting diodes on the first release film Covering a chemical on the surface of the plurality of light-emitting diodes; providing a mold; placing a second release film on a plane having the groove of the mold; performing a compression molding process by pressing the mold The first release film and the second release film shape the chemical and the plurality of light emitting diodes described above; and remove the mold, the first release film and the second release film to obtain a substrateless illumination Device.

In one embodiment, the first release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the above chemical comprises: silicone, epoxy resin, conductive paste, and any liquid formable material.

In one embodiment, the second release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof.

In one embodiment, the operating temperature of the stamping process described above is between 60 and 200 °C.

In one embodiment, the mold operating pressure of the stamping process described above is between 4 and 12 tons.

In an embodiment, the illuminating device of the above-mentioned substrate-free illuminating device The brightness is greater than 150 lumens (lm).

In one embodiment, the above-described substrateless illumination device is used to change the illumination angle of an object.

In an embodiment, the light-emitting device of the above-mentioned substrate-free light-emitting device has an illumination angle of between 5 and 180 degrees.

In a specific example, a first release film is provided. The first release film is attached or placed on a plane of any hard material, and the light emitting diode to be packaged is placed on the first release film; A silicone or epoxy resin or conductive paste is provided on the light emitting diode to provide a mold, and the groove on the mold can be any shape and size, and a second release film is placed on the surface of the mold having the groove. The first release film on which the light-emitting diode is placed on the surface and the mold on which the second release film is placed are combined and subjected to a molding process to form a silicone resin or an epoxy resin or a conductive paste and a light-emitting diode, and a molding process is performed. In the state of vacuum, the operating temperature is 50 ° C, the operating pressure of the mold is 8 tons; after the molded package is removed, the mold, the first release film and the second release film are obtained without the invention. A light-emitting device without a substrate.

The size of the substrateless light-emitting device obtained in the above specific example is 2.8 mm * 2.8 mm, the height is 1.5 mm, the light-emitting angle is 30 degrees, the light-emitting brightness is 156 lumens (lm), and the brightness is increased by 30%.

In summary, according to the method for preparing a substrate-free package and a substrate-free light-emitting device provided by the present invention, an important technical feature of the above method is The use of the release film as the temporary carrier substrate of the package, since the release film has the property of being easily removable from the surface of the object, the substrate-free package preparation method of the present invention does not need to be traditionally complicated and not environmentally friendly. The etch process can be used to prepare a substrate-free package. Furthermore, the groove on the mold used in the method for preparing the substrateless package of the present invention can be of any shape and size, and therefore, the design of the mold groove can be made according to the needs of the industry. A substrate-less package of shape and size that is difficult to achieve with conventional packaging methods. When the method of the present invention is applied to the preparation of a substrate-free illuminating device, the illuminating brightness of the substrateless illuminating device is increased by more than 20% compared with the conventional illuminating device, and at the same time, because it can be designed into different shapes of illuminating devices, it can be achieved. Arbitrarily controlling or changing the angle of illumination, it can solve the problem that the existing technology can not change the illumination angle and the brightness of the illumination is widely used in the lighting industry.

The present invention has been described by way of example only, and the scope of the invention is not to be construed as limited by the scope of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

1 is a schematic diagram showing the configuration of each element according to a specific example of the first embodiment of the present invention; and FIG. 2 is a flow chart showing the steps of the preparation method of the specific example of the first embodiment of the present invention; The semi-finished product of the substrate-free light-emitting device prepared by the preparation method of the present invention; the fourth figure is the finished product of the substrate-free light-emitting device prepared according to the preparation method of the present invention; A finished image of a single substrateless light-emitting device made according to the preparation method of the present invention; and a sixth figure is a single substrateless light-emitting device manufactured according to the preparation method of the present invention. Finished back view.

Claims (17)

A method for preparing a substrate-free package, the method comprising: providing a first release film; placing a plurality of objects on the first release film, the wafer comprising a wafer, a wafer, an illuminant, a semiconductor, and a passive a component, an electrode, and a circuit line; covering a surface of a plurality of objects on a chemical; providing a mold; placing a second release film on a plane having the groove of the mold; performing a compression molding process by the Pressing the first release film and the second release film to form the chemical and the plurality of objects; and removing the mold, the first release film and the second release film to obtain a substrateless The package. The method for preparing a substrate-free package according to claim 1, wherein the first release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof. The method for preparing a substrate-free package according to claim 1, wherein the chemical comprises: tannin extract, epoxy resin, fluorescent glue, conductive paste and any liquid formable material. The method for preparing a substrate-free package according to claim 1, wherein the second release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof. The method for preparing a substrate-free package according to claim 1, wherein the operating temperature of the above-mentioned stamping program is between 60 and 200 °C. The method for preparing a substrate-free package according to claim 1, wherein the mold operating pressure of the above-mentioned stamping program is between 4 and 12 tons. The method for preparing a substrate-free package according to the first aspect of the invention, wherein the substrate-free package comprises: a substrate-free chip package, a substrate-free wafer package, and a substrate-free light-emitting package. A semiconductor package without a substrate, a passive device package without a substrate, an electrode package without a substrate, and a circuit package without a substrate. The method for preparing a substrate-free package according to claim 1, wherein the illuminant is a light-emitting diode. A method for preparing a substrate-free light-emitting device, the method comprising: providing a first release film; placing a plurality of light-emitting diodes on the first release film; covering a chemical in the plurality of light-emitting diodes a surface of the body; providing a mold; placing a second release film on a plane having the groove of the mold; performing a compression molding process by pressing the first release film and the second release film by the mold The chemical and the plurality of light emitting diodes are formed; and the mold, the first release film and the second release film are removed to obtain a substrateless light-emitting device. The method for preparing a substrate-free light-emitting device according to claim 9, wherein the first release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof. The method for preparing a substrate-free light-emitting device according to claim 9 of the patent application scope, The above chemicals include: tannin extract, epoxy resin, conductive paste and any liquid formable material. The method for preparing a substrate-free light-emitting device according to claim 9, wherein the second release film is selected from the group consisting of a fluorine-containing film, an acrylic film, a silicone film, and any combination thereof. The method for preparing a substrate-less light-emitting device according to claim 9, wherein the operating temperature of the above-mentioned stamping program is between 60 and 200 °C. . The method for preparing a substrate-less light-emitting device according to claim 9, wherein the mold operating pressure of the above-mentioned stamping program is between 4 and 12 tons. The method for fabricating a substrate-less light-emitting device according to claim 9, wherein the light-emitting luminance of the substrate-free light-emitting device is greater than 150 lumens (lm). The method for fabricating a substrateless light-emitting device according to claim 9, wherein the substrate-free light-emitting device is used to change an illumination angle of an object. The method for fabricating a substrate-less light-emitting device according to claim 9, wherein the substrate-less light-emitting device has an illumination angle of between 5 and 180 degrees.