CN210296364U - Intensifying type LED packaging structure - Google Patents
Intensifying type LED packaging structure Download PDFInfo
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- CN210296364U CN210296364U CN201921613688.5U CN201921613688U CN210296364U CN 210296364 U CN210296364 U CN 210296364U CN 201921613688 U CN201921613688 U CN 201921613688U CN 210296364 U CN210296364 U CN 210296364U
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Abstract
The utility model discloses a light intensifying type LED packaging structure, including packaging base, semiconductor chip, packaging film, fluorescent glue and enclose the frame membrane, be provided with the adhesive according to spacing distance on the packaging base, semiconductor chip is fixed in on this packaging base through this adhesive, the packaging film vertically runs through and is provided with at least one encapsulation groove corresponding this semiconductor chip, and this packaging film pressfitting is on this packaging base to make this semiconductor chip pass the encapsulation groove, enclose frame membrane framing packaging film, semiconductor chip upper surface, fluorescent glue instils into in enclosing the cavity that the frame membrane surrounded. The utility model has the advantages of simple and reasonable structure, design benefit through being provided with on the encapsulation base and enclosing the frame membrane, makes and encloses frame membrane frame encapsulation membrane, semiconductor chip upper surface, makes the fluorescent glue can not flow at will, improves the fluorescent glue centralization, further promotes mould pressing color lump yield.
Description
Technical Field
The utility model relates to the field of packaging technology, in particular to intensifying type LED packaging structure.
Background
An LED is a semiconductor diode that can convert electric energy into light energy, and its application in electronic display devices is extremely wide.
In the process of die pressing of the traditional LED packaging structure, the fluorescent glue is easy to flow during die pressing due to the flowability, so that the condition that the fluorescent glue flows unevenly is often caused, and the yield of the die pressing color blocks is low.
Disclosure of Invention
An object of the utility model is to the above-mentioned problem, provide a type of intensifying LED packaging structure.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted does:
the utility model provides a light-intensifying type LED packaging structure, includes packaging base, semiconductor chip, packaging film, fluorescent glue and encloses the frame membrane, be provided with the adhesive according to the interval distance on the packaging base, semiconductor chip is fixed in on this packaging base through this adhesive, the packaging film is provided with at least one encapsulation groove corresponding this semiconductor chip vertically to run through, and this packaging film pressfitting is on this packaging base to make this semiconductor chip pass the encapsulation groove, enclose the frame membrane frame packaging film, semiconductor chip upper surface, fluorescent glue drips into in enclosing the cavity that the frame membrane surrounded.
Preferably, the enclosure frame film is a yellow film.
Preferably, the yellow film is laminated and adhered to the packaging base and extends out of the upper surfaces of the packaging film and the semiconductor chip.
Preferably, the package base is a ceramic board.
Preferably, the packaging film is a white wall film.
Preferably, the thickness of the white wall film is consistent with that of the semiconductor chip, and the upper surface of the white wall film is flush with the upper surface of the semiconductor chip.
The utility model has the advantages that: the utility model has the advantages of simple and reasonable structure, design benefit through being provided with on the encapsulation base and enclosing the frame membrane, makes and encloses frame membrane frame encapsulation membrane, semiconductor chip upper surface, makes the fluorescent glue can not flow at will, improves the fluorescent glue centralization, further promotes mould pressing color lump yield.
The present invention will be further explained with reference to the drawings and the embodiments.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a top view of the middle frame film of the present invention.
Detailed Description
As shown in fig. 1 and fig. 2, in this embodiment, an enhanced LED package structure includes a package base 1, a semiconductor chip 2, a package film 3, a fluorescent glue 4, and a frame film 5, where an adhesive is disposed on the package base 1 at intervals, the semiconductor chip 2 is fixed on the package base 1 through the adhesive, the package film 3 is longitudinally provided with at least one package slot corresponding to the semiconductor chip 2, the package film 3 is pressed on the package base 1, the semiconductor chip 2 passes through the package slot, the frame film 5 frames the package film 3 and the upper surface of the semiconductor chip 2, and the fluorescent glue 4 is dropped into a cavity surrounded by the frame film 5.
Specifically, the package base 1 is provided with cross positioning portions on which an adhesive is dotted at intervals, and then the semiconductor chip 2 is placed on the cross positioning portions by a robot arm, bonded by the adhesive, and subjected to a reflow process.
In this embodiment, the enclosure film 5 is a yellow film. Specifically, the yellow film has the advantages of low cost and convenient use, and can be directly torn off after the die pressing is finished.
In this embodiment, the yellow film is laminated and adhered to the package base 1 and extends out of the package film 3 and the upper surface of the semiconductor chip 2. Specifically, a yellow film is adhered on the packaging film 3, and the yellow film of the packaging base 1 form a left frame and a right frame, so that fluorescent glue in the frames is more concentrated.
In this embodiment, the package base 1 is a ceramic board.
In this embodiment, the packaging film 3 is a white wall film. Specifically, the packaging film 3 is in a grid shape, the packaging film 3 is cut into a grid shape according to the position of the semiconductor chip 2 on the packaging base 1, a packaging groove is formed, then the packaging film is placed on the packaging base 1, the semiconductor chip 2 is placed in the packaging groove, the peripheral edge of the semiconductor chip 2 is attached to the inner wall of the packaging groove, no gap exists between the packaging film 3 and the semiconductor chip 2, the attaching degree is higher when the packaging film 3 and the semiconductor chip 2 are pressed, and the packaging film and the semiconductor chip are not easy to separate after being formed;
in addition, the encapsulating film 3 is processed into a lattice shape depending on the position of the semiconductor chip 2 at the time of first use; when the packaging film 3 is required to be used in subsequent processing, a plurality of packaging films 3 are produced in batches only according to the specification of the packaging film 3 used in the first processing, and then the produced packaging films 3 are directly used for die pressing, so that the packaging film is convenient and fast to use.
In this embodiment, the thickness of the white wall film is the same as that of the semiconductor chip 2, and the upper surface of the white wall film is flush with the upper surface of the semiconductor chip 2. Specifically, the upper surface of the white wall film and the upper surface of the semiconductor chip 2 are flush, so that the fluorescent glue can flow and distribute more uniformly.
The specific packaging method comprises the following steps:
s1, dispensing on the cross positioning part of the package base 1, sticking the semiconductor chip 2 on the package base 1, and performing reflow soldering process;
s2, pressing the packaging film 3 on the semiconductor chip 2 and the packaging base 1, and baking at 150 ℃;
s3, attaching the enclosure frame film 5 to the packaging base 1 and the packaging film 3 to form an enclosure frame;
s4, dropping fluorescent glue into the cavity surrounded by the surrounding frame film, performing press molding at the press temperature of 100-110 ℃ for 400 seconds, and baking the pressed product at 150 ℃ for 4 hours;
and S5, cooling, cutting, removing the enclosure frame film 5, and cutting into single lamp beads.
The utility model has the advantages of simple and reasonable structure, design benefit encloses frame membrane 5 through being provided with on encapsulation base 1, makes and encloses frame membrane 5 and frame encapsulation membrane 3, semiconductor chip 2 upper surface, makes the fluorescent glue can not flow at will, improves the fluorescent glue concentration nature, further promotes mould pressing color lump yield.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. The invention is not limited to the embodiments described herein, but is capable of other embodiments according to the invention, and may be used in various other applications, including, but not limited to, industrial. Therefore, the equivalent changes made according to the shape, structure and principle of the present invention should be covered in the protection scope of the present invention.
Claims (6)
1. The utility model provides a intensifying type LED packaging structure which characterized in that: including packaging base, semiconductor chip, packaging film, fluorescent glue and enclose the frame membrane, be provided with the adhesive according to the interval distance on the packaging base, semiconductor chip is fixed in on this packaging base through this adhesive, the packaging film vertically runs through to be provided with at least one encapsulation groove corresponding this semiconductor chip, and this packaging film pressfitting is on this packaging base to make this semiconductor chip pass the encapsulation groove, enclose the frame membrane frame packaging film, semiconductor chip upper surface, fluorescent glue drips into in enclosing the cavity that the frame membrane surrounded.
2. The light intensifying LED package structure as recited in claim 1, wherein the frame film is a yellow film.
3. The light enhancement type LED package structure of claim 2, wherein the yellow film is laminated and adhered to the package base and extends out of the upper surfaces of the package film and the semiconductor chip.
4. The light enhancing LED package structure of claim 1, wherein the package base is a ceramic board.
5. The light enhancing LED package structure of claim 1, wherein the package film is a white wall film.
6. The light-intensifying LED package structure as set forth in claim 5, wherein the thickness of the white wall film is substantially equal to the thickness of the semiconductor chip, and the upper surface of the white wall film is flush with the upper surface of the semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921613688.5U CN210296364U (en) | 2019-09-26 | 2019-09-26 | Intensifying type LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921613688.5U CN210296364U (en) | 2019-09-26 | 2019-09-26 | Intensifying type LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210296364U true CN210296364U (en) | 2020-04-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921613688.5U Active CN210296364U (en) | 2019-09-26 | 2019-09-26 | Intensifying type LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210296364U (en) |
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2019
- 2019-09-26 CN CN201921613688.5U patent/CN210296364U/en active Active
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Address after: No.3, Xincheng Avenue, Songshanhu, Dongguan, Guangdong 523000 Patentee after: Dongguan Zhongzhi Technology Co.,Ltd. Address before: No.3, Xincheng Avenue, Songshanhu, Dongguan, Guangdong 523000 Patentee before: DONGGUAN SINOWIN OPTO-ELECTRONIC Co.,Ltd. |