KR101998942B1 - Resin molding apparatus and resin molding method - Google Patents

Abstract

The state in which the residual resin is left hanging on the discharge port of the resin discharge mechanism is eliminated in an early stage.
The resin molding apparatus includes a mold having a cavity formed on at least one of an upper mold and a lower mold and a resin ejection mechanism 18 for ejecting the fluid resin 29 to the object 17 to supply the fluid resin 29 to the cavity A resin removing mechanism 21 as a residual state releasing mechanism for forcibly resolving the remaining state of the residual resin 30 from the discharge port 20a of the resin discharging mechanism 18; And a mold clamping mechanism for clamping the mold to be clamped. The resin removing mechanism 21 includes a feeding mechanism 23 for feeding out the film-like member 22 to which the residual resin 30 is attached, a winding mechanism 24 for winding the film-like member 22, And disposing members (25, 26) for disposing the member (22) at the removal position of the residual resin (30).

Description

[0001] DESCRIPTION [0002] RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD [

The present invention relates to a method of manufacturing a semiconductor device in which chip-shaped electronic components (hereinafter referred to as " chips " as appropriate) such as transistors, integrated circuits (ICs), and light emitting diodes (LEDs) To a resin molding apparatus and a resin molding method, which are used for sealing, and the like. In the present application, the term " liquid phase " means a liquid phase at room temperature and has fluidity, regardless of the degree of fluidity, in other words, the degree of viscosity.

BACKGROUND ART Conventionally, a semiconductor chip (molded article) mounted on a substrate is resin-sealed using a liquid resin. In resin sealing using a liquid resin, a liquid resin is discharged from the nozzle provided at the tip of the dispenser to the workpiece by using a dispenser which is a liquid resin discharging mechanism (see Patent Document 1). As shown in Fig. 3 of Patent Document 1, it has been proposed to provide a liquid slack accommodation container below the nozzle of the dispenser. The droplet holding container is disposed under the nozzle so that the liquid resin adhered to the tip of the nozzle drops and does not contaminate the apparatus when the discharging operation of the liquid resin is temporarily stopped.

Japanese Patent Laid-Open No. 2007-111862

However, resin sealing using a liquid resin has the following problems. The types and viscosities of the liquid resin used in the resin sealing are various. There is a possibility that a thread draw phenomenon of the liquid resin may occur from the discharge port of the nozzle when a liquid resin having a high viscosity is used at the point of time when the discharge of the liquid resin is stopped. The thin liquid-like liquid resin is drawn down from the discharge port as residual resin not supplied to the discharge object. In the state in which the thread draw phenomenon occurs, the thin liquid thread-like liquid resin can not be received in the liquid slack receiving container, and the stand-by state is waited until the residual resin naturally falls on the discharge object and the thread draw state is eliminated. For example, in the case of the technique disclosed in Patent Document 1, even if the liquid slack receiving container is moved below the nozzle of the dispenser, the residual resin is dropped to the natural fall . Therefore, a considerable time is required until the liquid resin is supplied to the discharge object. In addition, depending on the flow of the air, the residual resin may scatter, adhere to other driving mechanisms or components, and may be contaminated.

It is an object of the present invention to provide a resin molding apparatus and a resin molding method capable of eliminating a state in which a residual resin is left hanging at a discharge port of a resin discharge mechanism in an early stage.

In order to solve the above problems, a resin molding apparatus according to the present invention is a resin molding apparatus comprising: a mold having a cavity formed on at least one of an upper mold and a lower mold opposed to each other; , A residual state releasing mechanism for forcibly eliminating the residual state of the residual resin from the discharge port of the resin discharging mechanism, and a mold clamping mechanism for clamping the mold with the fluid resin supplied to the cavity do.

Here, " forcibly solving the residual state of the residual resin from the discharge port of the resin discharging mechanism " means that the residual resin drained from the discharge port of the resin discharging mechanism does not wait for the residual resin to naturally fall, Removal of the residual resin, or reduction of the residual resin.

In order to solve the above problems, a resin molding apparatus according to the present invention is a resin molding apparatus comprising: a mold having a cavity formed on at least one of an upper mold and a lower mold opposed to each other; A resin removing mechanism which is inserted between the discharge port of the resin discharge mechanism and the discharge object to adhere and removes the residual resin remaining in the discharge port, and a mold clamping mechanism for clamping the mold, to which the fluid resin is supplied, Shaped fastening mechanism.

In order to solve the above problems, a resin molding apparatus according to the present invention is a resin molding apparatus comprising: a mold having a cavity formed on at least one of an upper mold and a lower mold opposed to each other; A clamping mechanism for resiliently deforming the tube in a state in which the residual resin of the fluid resin is connected from the tube to the object to be discharged to the object to be ejected, And a mold clamping mechanism for clamping the mold to which the resin is supplied.

In order to solve the above problems, a resin molding method according to the present invention is characterized in that, in order to supply a fluid resin to a cavity of a mold having a cavity formed on at least one of an upper mold and a lower mold opposed to each other, A resin discharging step of discharging resin using a resin discharging mechanism; a residual state releasing step of forcibly resolving a state in which the residual resin is stretched from the discharge port of the resin discharging mechanism; Type fastening process.

In order to solve the above problems, a resin molding method according to the present invention is characterized in that, in order to supply a fluid resin to a cavity of a mold having a cavity formed on at least one of an upper mold and a lower mold opposed to each other, A resin removing step of discharging the resin by using a resin discharging mechanism and a resin removing mechanism for removing and removing residual resin remaining on a discharge port of the resin discharging mechanism between a discharge port and an object to be discharged, And a mold clamping process for clamping the mold in which the fluid resin is supplied to the cavity.

In order to solve the above problems, a resin molding method according to the present invention is characterized in that, in order to supply a fluid resin to a cavity of a mold having a cavity formed on at least one of an upper mold and a lower mold opposed to each other, A resin discharging step of discharging the resin by using a resin discharging mechanism; and an elastic deformable tube provided at a discharge port of the resin discharging mechanism, in a state in which the residual resin of the fluid resin is connected from the tube to the discharging object, And a mold clamping step of clamping the mold to which the fluid resin is supplied to the cavity.

According to the present invention, it is possible to eliminate the residual state of the residual resin at the discharge port of the resin discharge mechanism in an early stage.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a plan view showing an outline of an apparatus in the resin molding apparatus of Embodiment 1. FIG.
2 (a) to 2 (c) are schematic sectional views showing a process in which the dispenser discharges the liquid resin in the first embodiment.
3 (a) to 3 (c) are schematic cross-sectional views showing a process of removing the residual resin remaining in the discharge port of the dispenser in the first embodiment.
4 (a) to 4 (d) are schematic cross-sectional views showing a process of resin sealing a chip mounted on a substrate in Embodiment 1.
5 (a) to 5 (c) are schematic sectional views showing a process in which the dispenser discharges the liquid resin in the second embodiment.
6A to 6C are schematic cross-sectional views showing a process of removing the residual resin remaining in the discharge port of the dispenser in the second embodiment.
7A to 7C are schematic cross-sectional views showing a process of reducing the residual resin extruded from the tube of the dispenser in the third embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any drawings in this application document are drawn schematically so as to be easily omitted or appropriately exaggerated. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

[Embodiment 1]

(Configuration of resin molding apparatus)

The configuration of the resin molding apparatus according to the present invention will be described with reference to Fig. The resin molding apparatus 1 shown in Fig. 1 is a resin molding apparatus using a compression molding method. There is shown an example in which a liquid resin which is a fluid resin is used as the resin material.

The resin sealing apparatus 1 includes a substrate supply and storage module 2, three molding modules 3A, 3B and 3C and a resin supply module 4 as constituent elements. The substrate supply and storage module 2 as a component, the molding modules 3A, 3B and 3C and the resin supply module 4 can be detached from each other and exchanged with each other.

The substrate supply and storage module 2 is provided with a pre-sealing substrate supply part 6 for supplying the pre-sealing substrate 5, a sealed substrate storage part 8 for housing the sealed substrate 7, A substrate loading section 9 for transferring the substrate 5 and the sealed substrate 7 and a substrate transport mechanism 10 for transporting the substrate 5 before the sealing and the substrate 7 after sealing are provided. The predetermined position S1 is a stand-by position in a state in which the substrate transport mechanism 10 does not operate.

Each of the molding modules 3A, 3B and 3C is provided with a lower mold 11 capable of ascending and descending and an upper mold (not shown, see Fig. 4) arranged opposite to the lower mold 11. Both the upper mold and the lower mold 11 constitute a molding die. Each of the molding modules 3A, 3B and 3C has a mold clamping mechanism 12 for clamping and releasing the upper mold and the lower mold 11 (a portion indicated by chain double-dashed lines in the figure). A cavity 13 is formed in the lower die 11, which is a space in which the liquid resin is supplied and cured. Here, the structure in which the cavity 13 is formed in the lower mold 11 is described, but the cavity may be formed in the upper mold, or both the upper mold and the lower mold.

The resin supply module 4 is provided with a release film supply mechanism 15 for supplying a release film to the table 14 and the table 14. On the release film supplied to the table 14, a resin receiving frame 16 is loaded. The releasing film and the resin receiving frame 16 are integrally formed to constitute the resin accommodating portion 17 for accommodating the liquid resin as the liquid resin. The resin supply module 4 is provided with a dispenser 18 as a resin discharge mechanism for discharging the liquid resin into the resin storage portion 17 and a resin transfer mechanism 19 for transferring the resin storage portion 17. The dispenser 18 is provided with a resin discharge portion 20 for discharging the liquid resin to the tip portion. The predetermined position M1 is a stand-by position in a state in which the resin conveying mechanism 19 does not operate. In this embodiment, at least the release film serves as a discharge object from which the liquid resin is discharged.

The release film feed mechanism 15 may be a release film feed mechanism for supplying a release film of a long shape (roll shape) to the table 14 or a release film feed mechanism for supplying a release film, Is used.

The dispenser 18 shown in Fig. 1 is a one-liquid type dispenser using a liquid resin in which a mixture of a subject and a curing agent is mixed in advance. As a subject, for example, a silicone resin or an epoxy resin having a thermosetting property is used. It is also possible to use a two-liquid mixing type dispenser which uses a mixture of a base and a curing agent when discharging the liquid resin.

The resin supply module 4 is provided with a resin removing mechanism 21 for removing residual resin remaining after the dispenser 18 has stopped discharging the liquid resin from the resin discharging portion 20 (See Figs. 2 to 3). As will be described later, the resin removing mechanism 21 is a resin removing mechanism for removing and removing the residual resin on the film-like member.

The control unit CTL controls the discharge of the liquid resin, the removal of the residual resin, the transport of the substrate 5 before the sealing and the sealing substrate 7, the heating of the molding die, and the opening and closing of the molding die. In other words, the control unit CTL controls each operation in the substrate supply / storage module 2, the molding modules 3A, 3B, and 3C, and the resin supply module 4.

The control unit CTL may be disposed at any position or may be disposed in at least one of the substrate supply and storage module 2, the molding modules 3A, 3B and 3C and the resin supply module 4, It may be disposed outside. In addition, the control unit CTL may be configured as a plurality of control units that at least partly separate according to the operation to be controlled.

(Structure of resin removing mechanism)

A resin removing mechanism 21 used in the resin molding apparatus 1 will be described with reference to Fig. 2, the resin removing mechanism 21 transports the film-shaped member 22 having a long shape, for example, between the dispenser 18 and the resin containing portion 17, Is a resin removing mechanism that removes and removes the residual resin that has fallen downward from the discharging portion (20) to the film-like member (22).

2, the resin removing mechanism 21 includes a feeding mechanism 23 for feeding the film-like member 22 wound around the reel between the dispenser 18 and the resin containing portion 17, And a winding mechanism (24) for winding the film-like member (22) with resin on the reel. By controlling the torque of a motor (not shown) provided in the feeding mechanism 23 and the torque of a motor (not shown) provided in the winding mechanism 24, the moving direction of the film-like member 22 And the film-like member 22 is fed out of the feeding mechanism 23 while applying an appropriate tension (tension) to the direction indicated by the broken line in Fig.

The delivery mechanism 23 is provided with a delivery roller 25 for applying a tension to the film-like member 22 delivered from the delivery mechanism 23. [ The winding mechanism 24 is provided with a winding roller 26 for applying tension to the film-like member 22 to which the residual resin is attached. The feed roller 25 and the winding roller 26 function as a conveying roller for applying tension to the film-like member 22 and for conveying the film-like member 22, respectively.

By setting the position where the delivery roller 25 and the winding roller 26 are arranged, an area for attaching the residual resin to the film-like member 22 is set. 2 shows a case in which the winding roller 26 is disposed above and behind the feed roller 25 in the advancing direction (X direction) of the film-like member 22 fed out from the feeding mechanism 23 . In this case, a region of the film-like member 22 having an inclination is formed between the feed-out roller 25 and the take-up roller 26. The region of the film-like member 22 having this inclination becomes the attachment region 22a of the residual resin for attaching the residual resin. Therefore, the feed roller 25 and the take-up roller 26 each have a function as an arrangement member for determining the attachment region 22a of the residual resin in order to remove the residual resin.

The film-like member 22 disposed between the feed roller 25 and the take-up roller 26 becomes the attachment region 22a of the residual resin to which the residual resin adheres. The inclination of the attachment region 22a of the residual resin can be adjusted by adjusting the height position, distance, and the like of the feed roller 26 and the take-up roller 25. [ The film-like member 22 disposed between the feeding mechanism 23 and the feed-out roller 25 and the film-like member 22 disposed between the winding mechanism 24 and the winding roller 26 each have a slope Or may be arranged horizontally. The position where the delivery roller 25 and the winding roller 26 are disposed may be a position where tension can be applied to the film-like member 22 to carry it.

The resin removing mechanism 21 has a moving mechanism (not shown) that moves in the horizontal direction (X direction and Y direction) and the vertical direction (Z direction). The moving mechanism can adjust the height position of the resin removing mechanism 21 so that the residual resin adhering area 22a for attaching the residual resin between the resin discharging part 20 of the dispenser 18 and the resin containing part 17 ) Can be set.

As the film-like member 22, for example, a material having properties such as heat resistance, flexibility, and stretchability is used. Depending on the kind of the liquid resin, a material having properties such as lipophilicity, hydrophilicity, and porosity can be selected. It is preferable that the film-like member 22 uses a material in which the residual resin adhered does not slip off from the film-like member 22. The film-like member 22 includes not only a film-like member but also a narrow tape-like member, regardless of the size, such as width, thickness, and the like.

(Operation of resin removing mechanism)

The operation of the resin removing mechanism 21 for removing the residual resin will be described with reference to Figs. 2 to 3. Fig. As shown in Fig. 2 (a), the dispenser 18 and the resin removing mechanism 21 each stand by at a predetermined position.

First, a long release film 27, for example, is fed to the table 14 from the release film feed mechanism 15 (see Fig. 1) and cut to a predetermined size. Next, the resin receiving frame 16 having the through holes 28 is placed on the release film 27. Then, In this state, the release film 27 and the resin receiving frame 16 are integrally formed to constitute the resin containing portion 17 that receives the liquid resin.

Next, as shown in Fig. 2 (b), the dispenser 18 is moved to a predetermined position above the resin containing portion 17 by using a moving mechanism (not shown). Next, the liquid resin 29 is discharged from the resin discharging portion 20 (discharge port 20a) of the dispenser 18 toward the resin containing portion 17. The liquid resin 29 is discharged to the through hole 28 of the resin containing portion 17. The discharge of the dispenser 18 is stopped when the predetermined liquid resin 29 is discharged. In this case, the resin containing portion 17 whose bottom surface is constituted by the release film 27 becomes an object to be discharged.

As shown in Fig. 2 (c), depending on the viscosity of the liquid resin 29 at the point of time when the discharge of the liquid resin 29 by the dispenser 18 is stopped, . That is, the liquid resin 29 is drained downward from the discharge port 20a of the dispenser 18 and remains as the residual resin 30 at the discharge port 20a. The residual resin 30 may not be connected to the case where the residual resin 30 is stretched from the discharge port 20a and connected to the liquid resin 29 supplied to the resin accommodating portion 17. [ The present embodiment shows an operation of removing the residual resin 30 by using the resin removing mechanism 21 when the residual resin 30 remains in the discharge port 20a of the dispenser 18. [

Next, the resin removing mechanism 21 is moved above the resin containing portion 17 by using a moving mechanism (not shown). The leading end of the resin removing mechanism 21 on the delivery roller 25 side is inserted between the discharge port 20a of the dispenser 18 and the release film 27 by moving the resin removing mechanism 21 in the X direction, Is brought into contact with the residual resin (30). In this case, the film-like member 22 wound around the feed roller 25 of the resin removing mechanism 21 is brought into contact with the residual resin 30.

3 (a), the resin removing mechanism 21 is further moved in the X direction to move a part of the residual resin 30 on the attachment region 22a of the film-like member 22 . The resin removing mechanism 21 is further moved in the X direction so that the feed roller 25 is placed on the residual resin 30 and the residual resin 30 is wound on the feed roller 25. The residual resin 30 is separated from the surface of the liquid resin 29 supplied to the resin containing portion 17 and the discharge port 20a of the dispenser 18. [ The residual resin 30 separated from the discharge port 20a of the dispenser 18 drops onto the attachment region 22a of the film-like member 22. In this state, most of the residual resin 30 is adhered onto the attachment region 22a of the film-like member 22. [

3 (b), the film-like member 22 is wound around the winding mechanism 24 by making the torque of the winding mechanism 24 larger than the torque of the delivery mechanism 23. By winding the film-like member 22, the attachment region 22a of the film-like member 22 is conveyed from the feed-out roller 25 toward the take-up roller 26 (in the direction of the arrow in the drawing). Therefore, the residual resin 30 attached on the attachment region 22a moves together with the film-like member 22 in the direction (-X direction) of the winding mechanism 24 and is wound by the winding mechanism 24 do. In this way, the residual resin 30 stretched from the resin discharge portion 20 (discharge port 20a) of the dispenser 18 can be removed by the resin removing mechanism 21. [

Next, as shown in Fig. 3 (c), the resin removing mechanism 21 is returned to its original position after the residual resin 30 is wound by the winding mechanism 24. [ Next, the dispenser 18 is returned to its original position. In this state, a predetermined amount of the liquid resin 29 is supplied to the resin accommodating portion 17. In this manner, the state in which the residual resin 30 slackens and remains on the resin discharge portion 20 (discharge port 20a) of the dispenser 18 can be quickly eliminated.

In addition, the leading end (the film-like member 22 wound around the feed roller 25) of the resin removing mechanism 21 is brought into contact with the residual resin 30 and the film-shaped member 22 ).

(Operation of resin molding apparatus)

With reference to Figs. 1 to 4, an operation of resin-sealing a chip mounted on a substrate in the resin molding apparatus 1 will be described. A case of using the molding module 3B as the operation of the resin molding apparatus 1 will be described.

First, the unsealed substrate 5 on which the chip 31 (see Fig. 4A) is mounted is placed on the lower side of the chip 31, The substrate 5 is sent to the substrate loading section 9 before sealing. Next, the substrate transport mechanism 10 is moved in the -Y direction from the predetermined position S1 to receive the substrate 5 before sealing from the substrate stacking section 9. Then, The substrate transport mechanism 10 is returned to the predetermined position S1.

Next, the substrate transport mechanism 10 is moved in the + X direction to a predetermined position P1 of the forming module 3B, for example. Next, in the forming module 3B, the substrate transport mechanism 10 is moved in the -Y direction to stop at a predetermined position C1 above the lower die 11. Then, Next, the substrate transport mechanism 10 is raised to fix the unsealed substrate 5 to the mold surface of the upper mold 32 by suction, clamping, or the like (see Fig. 4 (a)). The substrate transport mechanism 10 is returned to the predetermined position S1 of the substrate supply / storage module 2. Then,

Next, in the material supply module 4, the long release film 27 is supplied from the release film supply mechanism 15 to the table 14 (see Fig. 2 (a)). Next, the release film 27 is sucked to the table 14, and the release film 27 is cut to a predetermined size. Next, the resin receiving frame 16 having the through holes 28 is placed on the release film 27. Then,

Next, the resin receiving frame 16 having the through holes 28 is placed on the release film 27. Then, In this state, the release film 27 and the resin receiving frame 16 are integrated to function as the resin accommodating portion 17 for accommodating the liquid resin 29.

Next, the dispenser 18 is moved in the -X direction to stop at a predetermined position above the resin containing portion 17. A predetermined amount of the liquid resin 29 is discharged from the resin discharging portion 20 of the dispenser 18 to the resin receiving portion 17 (see Fig. 2 (b)).

The residual resin 30 is removed using the resin removing mechanism 21 when the residual resin 30 remains at the time when the dispenser 18 stops discharging the liquid resin 29. [ The resin removing mechanism 21 is moved in the X direction to attach the residual resin 30 onto the attachment region 22a of the film-like member 22 (see Fig. 2 (c), Fig. 3 ).

The residual resin 30 attached on the attachment region 22a of the film-like member 22 is wound up by the winding mechanism 24 (see Fig. 3 (b)). In this state, the residual resin 30 is removed by the resin removing mechanism 21. In the resin accommodating portion 17, a liquid resin 29 obtained by subtracting the residual resin amount from the discharged liquid resin is supplied. The resin removing mechanism 21 is returned to its original position. And returns the dispenser 18 to its original position (see Fig. 3 (c)).

Next, the resin conveying mechanism 19 is moved in the -Y direction from the predetermined position M1, and the resin receiving portion 17 mounted on the table 14 is received. The resin transport mechanism 19 is returned to the predetermined position M1.

Next, the resin transport mechanism 19 is moved in the -X direction to the predetermined position P1 of the forming module 3B. Next, in the forming module 3B, the resin transporting mechanism 10 is moved in the -Y direction to stop at a predetermined position C1 above the lower die 11.

4 (a), the resin receiving portion 17 is arranged at a predetermined position between the upper mold 32 and the lower mold 11 by the resin conveying mechanism 10. In the resin accommodating portion 17, the liquid resin 29 is supplied to the through hole 28 closed by the resin containing frame 16 and the release film 27. Next, the resin conveying mechanism 10 is lowered to load the resin accommodating portion 17 on the lower mold 11. As shown in Fig. The resin transport mechanism 19 is returned to the predetermined position M1.

Next, as shown in Fig. 4 (b), in the molding module 3B, the release film 27 is held by the suction mechanism (not shown) provided on the lower mold 11, Adsorbed along the mold surface. As a result, the release film 27 and the liquid resin 29 are collectively supplied to the cavity 13.

Next, as shown in Fig. 4 (c), the lower mold 11 is raised by the mold clamping mechanism 12 (see Fig. 1), and the upper mold 32 and the lower mold 11 are clamped. The chip 31 mounted on the unsealed substrate 5 is immersed in the liquid resin 29 supplied to the cavity 13. At this time, a predetermined resin pressure can be applied to the liquid resin 29 in the cavity 13 by using a cavity bottom surface member (not shown) formed in the lower mold 11. [

Further, in the mold clamping process, the inside of the cavity 13 may be sucked by using a vacuum exhaust mechanism (not shown). As a result, air remaining in the cavity 13, bubbles contained in the liquid resin 29, and the like are discharged to the outside of the mold. Incidentally, the cavity 13 is set at a predetermined degree of vacuum.

Next, the liquid resin 29 is heated for a time necessary for curing the liquid resin 29 by using a heater (not shown) provided in the lower die 11. [ The liquid resin (29) is cured to form the cured resin (33). Thus, the chips 31 mounted on the pre-sealing substrate 5 are resin-sealed with the molded resin 33 corresponding to the shape of the cavity 13. [

4 (d), the upper mold 32 and the lower mold 11 are opened by using the mold clamping mechanism 12 after the liquid resin 29 is cured. A resin-sealed molded product 34 (a sealed substrate 7) is fixed to the mold surface of the upper mold 32.

Next, the substrate transport mechanism 10 is moved from the predetermined position S1 of the substrate supply / storage module 2 to a predetermined position C1 above the lower die 11 to receive the sealed substrate 7. Then, Next, the substrate transport mechanism 10 is moved to transfer the sealed substrate 7 to the substrate stacking section 9. Then, The sealed substrate 7 is stored in the sealed substrate storage portion 8 from the substrate loading portion 9. [ In this step, resin sealing is completed.

In the resin molding apparatus 1, the control unit CTL controls the supply of the mold release film 27, the dispenser 18, the liquid resin 29, The movement of the resin transfer mechanism 19, the operation of the clamping and opening of the upper mold 32 and the lower mold 11, and the storage of the sealed substrate 7 are controlled.

(Action effect)

The dispenser 18 which is a resin discharging mechanism for discharging the liquid resin 29 to the resin accommodating portion 17 as an object to be discharged is provided in order to supply the liquid resin 29 which is a fluid resin to the cavity 13 And a resin removing mechanism 21 for attaching and removing the residual resin 30 remaining on the discharge port 20a of the dispenser 18. That is, the resin removing mechanism 21 is used as the residual state removing mechanism for forcibly solving the residual state of the residual resin 30 from the discharge opening 20a of the dispenser 13.

In this embodiment, the resin removing mechanism 21 includes a feeding mechanism 23 for feeding out the film-like member 22 to which the residual resin 30 is attached, and a winding mechanism 22 for winding the film- And a feed roller 25 and a take-up roller 26, which are arrangements for disposing the film-like member 22 at a position where the residual resin 30 is removed.

With such a configuration, the residual resin 30 remaining on the discharge port 20a of the dispenser 18 can be attached to the resin removing mechanism 21 and removed. Therefore, the state in which the residual resin 30 slackens and remains in the discharge port 20a of the dispenser 18 can be quickly eliminated.

More specifically, according to the present embodiment, the resin removing mechanism 21 includes a feeding mechanism 23 for feeding the film-like member 22 between the dispenser 18 and the resin containing portion 17, And a winding mechanism (24) for winding up the film-like member (22) to which the film-like member (30) is attached. The delivery mechanism 23 has a delivery roller 25. The winding mechanism (24) has a winding roller (26). The film-like member 22 disposed between the feed roller 25 and the winding roller 26 becomes the attachment region 22a of the residual resin 30 to which the residual resin 30 is attached. Therefore, the feed roller 25 and the take-up roller 26 each function as a placement member for determining the attachment region 22a of the residual resin 30.

The residual resin 30 is separated from the discharge port 20a of the dispenser 18 by bringing the tip end of the resin removing mechanism 21 into contact with the residual resin 30. [ As a result, the residual resin 30 is adhered to the attachment region 22a of the film-like member 22. The residual resin 30 and the film-like member 22 are both wound by the winding mechanism 24. Therefore, the residual resin 30 remaining on the discharge port 20a of the dispenser 18 can be attached to the resin removing mechanism 21 and removed.

According to the present embodiment, the residual resin 30 remaining in the discharge port 20a of the dispenser 18 does not wait for the spontaneous drop of the residual resin 30 into the resin containing portion 17, (30) is removed. Thus, the time for supplying the liquid resin 29 to the resin containing portion 17 can be shortened. Therefore, the productivity of the resin-sealing apparatus 1 can be improved.

According to the present embodiment, the residual resin 30 is removed by the resin removing mechanism 21, instead of waiting for the residual resin 30 to spontaneously fall into the resin containing portion 17. Therefore, it is possible to prevent the residual resin 30 remaining on the discharge port 20a of the dispenser 18 from being scattered by the flow of air, adhering to other driving mechanisms, constituent members, or the like and being contaminated.

According to the present embodiment, the residual resin 30 remaining on the discharge port 20a of the dispenser 18 is removed by the resin removing mechanism 21. [ Therefore, the supply amount of the liquid resin 29 to be supplied to the resin accommodating portion 17 can be set as large as the resin amount corresponding to the residual resin 30 in advance, and the liquid resin 29 can be discharged. As a result, a predetermined amount of the liquid resin 29 can be stably supplied to the resin accommodating portion 17.

In the present embodiment, the take-up roller 26 is disposed above the rear portion of the feed roller 25. The present invention is not limited to this, and the winding roller 26 may be arranged above the feeding roller 25. In this case, the film-like member 22 disposed between the winding mechanism 24 and the winding roller 26 becomes an attachment region of the residual resin 30. The film-like member 22 to be the attachment region may be inclined or horizontally arranged.

In the present embodiment, the feed roller 25 and the take-up roller 26 are provided as an arrangement member for determining the attachment region 22a of the residual resin 30, respectively. Only one of the feed roller 25 and the take-up roller 26 may be provided as a placement roller for determining the attachment region of the residual resin 30. In this case, the film-like member 22 disposed between the winding mechanism 24 and the placement roller becomes the attachment region of the residual resin 30. [ The film-like member 22 to be the attachment region may be inclined or horizontally arranged.

In this embodiment, a rotatable roller such as a feed roller 25 or a takeup roller 26 is used as a disposing member for determining an attachment region of the residual resin 30. The present invention is not limited to this, and a rod-like member or a cylindrical member may be used as the arrangement member. The arrangement member may be any member capable of transporting the film-like member 22.

In the present embodiment, as the winding mechanism 24, a winding mechanism for winding the film-like member 22 with the residual resin 30 on the reel is used. The present invention is not limited to this, and as the winding mechanism 24, a winding mechanism including a cylindrical winding roll and a rolling roller may be used. In this case, the residual resin 30 attached to the film-like member 22 can be wound on the winding roll in a thin state by the rolling roller.

In this embodiment, a delivery mechanism 23 for delivering the film-shaped member 22 wound on the reel before use, a winding mechanism 24 for winding the film-shaped member 22 with the residual resin 30 on the reel, ) Was used. A sensor for detecting the presence of the film-like member 22 may be provided on the feeding mechanism 23 and the winding mechanism 24, respectively. Thus, the use situation of the film-like member 22 can be detected. The warning may be issued when the film-like member 22 is short, when the film-like member 22 is full, or the like.

In the present embodiment, the residual resin 30 remaining on the discharge port 20a of the dispenser 18 is removed by the resin removing mechanism 21. [ It is also possible that a part of the residual resin 30 falls down in the process of removing the residual resin 30 and the receiving container for receiving the residual resin may be provided below the resin removing mechanism 21 . As a result, it is possible to prevent a part of the residual resin from dropping into the resin accommodating portion 17 or sticking to the constituent member or the like to be contaminated.

The surface of the film-like member 22 to which the residual resin 30 is adhered is subjected to surface roughening or surface patterning so that the residual resin 30 adhering to the film- Or the like may be performed.

In the present embodiment, three molding modules 3A, 3B and 3C are arranged in the X direction between the substrate supply / storage module 2 and the resin supply module 4, respectively. The substrate supply / storage module 2 and the resin supply module 4 may be provided as one module, and one molding module 3A may be mounted in the module in the X direction. Further, another molding module 3B may be mounted on the molding module 3A. By these, the molding modules 3A, 3B, ... can be increased or decreased corresponding to the production mode or the production amount. Therefore, the configuration of the resin molding apparatus 1 can be optimized, and productivity can be improved.

In the present embodiment, as the resin molding apparatus 1, the configuration including the substrate supply / storage module 2, the three molding modules 3A, 3B, and 3C, and the resin supply module 4 . The resin molding apparatus is not limited to this structure and may be any apparatus having a function of performing resin molding by including at least a molding die, a resin discharging mechanism for discharging the fluid resin, and a mold clamping mechanism for clamping the molding die .

[Embodiment 2]

(Structure of resin removing mechanism)

Another embodiment of the resin removing mechanism used in the resin molding apparatus 1 will be described with reference to Fig. The difference from Embodiment 1 is that a rotating body is used instead of a film-like member as a member for removing the residual resin 30. [ Structures other than the resin removing mechanism are exactly the same as those in the first embodiment, and thus description thereof is omitted.

5, the resin removing mechanism 35 includes a rotating body 36 for winding and winding the residual resin 30, a rotating mechanism 37 for rotating the rotating body 36 , And a container 38 for containing the residual resin 30. The container 30 is provided with a container 30, As the rotating body 36, for example, a rotating body having a circular sectional shape is used. The accommodating container 38 is provided with a sputer-like member 39 for dropping the residual resin 30 into the container 38. The sputer-like member 39 may be provided so that its tip is slightly spaced from the surface of the rotating body 36, or the tip end thereof is in contact with the surface of the rotating body 36. The sputtering member 39 is formed of plastic, rubber, metal plate or the like. The spatter-like member 39 prevents the residual resin 30 wound on the rotating body 36 from continuing to rotate in a state where it is attached to the rotating body 36. The spatula-like member 39 also prevents the residual resin 30 attached to the rotating body 36 from stretching from the rotating body 36. As the material of the sputer-like member 39, a flexible plastic, a metal plate, or the like may be used, particularly when the tip is in contact with the rotating body 36.

The resin removing mechanism 35 has a moving mechanism (not shown) that moves in the horizontal direction (X direction and Y direction) and the vertical direction (Z direction). The rotating mechanism 36 for attaching the residual resin 30 between the resin discharge portion 20 of the dispenser 18 and the resin containing portion 17 by adjusting the height position of the resin removing mechanism 35 ) Can be set.

(Operation of resin removing mechanism)

The operation of the resin removing mechanism 35 to remove the residual resin 30 will be described with reference to Figs. 5 to 6. Fig. The liquid resin 29 is discharged from the resin discharge portion 20 (discharge port 20a) of the dispenser 18 to the resin containing portion 17 as shown in Figs. 5 (a) and 5 (b) Are completely the same as those in the first embodiment, and thus the description thereof will be omitted.

As shown in Fig. 5 (c), at the point of time when the discharge of the liquid resin 29 by the dispenser 18 is stopped, the discharge port 20a of the dispenser 18 is moved downward The liquid resin 29 is stretched and remains as the residual resin 30.

Next, the resin removing mechanism 35 is moved to above the resin containing portion 17 by using a moving mechanism (not shown) so that the rotating body 36 is brought into contact with the residual resin 30. Next,

Next, as shown in Fig. 6 (a), the resin removing mechanism 35 is moved again in the X direction, and the rotating body 36 is rotated counterclockwise using the rotating mechanism 37 . The residual resin (30) is wound by the rotating body (36). The residual resin 30 is separated from the surface of the liquid resin 29 supplied to the resin accommodating portion 17 and the discharge port 20a of the dispenser 18. [ The residual resin 30 separated from the discharge port 20a of the dispenser 18 falls onto the rotating body 36. [ The dropped residual resin 30 is wound by the rotating body 36 in a state of being attached on the rotating body 36.

Next, as shown in Fig. 6 (b), the residual resin 30 wound around the rotating body 36 is brought into contact with the spatula-like member 39. Then, as shown in Fig. The provision of the sputtering member 39 prevents the residual resin 30 from rotating together with the rotating body 36 in a state of being attached to the rotating body 36. [ Therefore, the sputter-like member 39 prevents the residual resin 30 from rotating together with the rotating body 36, and drops the residual resin 30 downward. The residual resin 30 is separated into the receiving container 38 by the sputtering member 39 and the residual resin 30 is received in the receiving container 38. [ In this way, the residual resin 30 stretched from the resin discharging portion 20 (discharge port 20a) of the dispenser 18 can be attached to the resin removing mechanism 35 and removed.

6 (c), the resin removing mechanism 35 is returned to its original position after the residual resin 30 is housed in the container 38. Next, as shown in Fig. Next, the dispenser 18 is returned to its original position. In this state, a predetermined amount of the liquid resin 29 is supplied to the resin accommodating portion 17.

(Action effect)

The dispenser 18 which is a resin discharging mechanism for discharging the liquid resin 29 to the resin accommodating portion 17 as an object to be discharged is provided in order to supply the liquid resin 29 which is a fluid resin to the cavity 13 , And a resin removing mechanism (35) for attaching and removing residual resin (30) remaining on the discharge port (20a) of the dispenser (18). That is, the resin removing mechanism 35 is used as the residual state removing mechanism for forcibly solving the residual state of the residual resin 30 from the discharge opening 20a of the dispenser 13.

The resin removing mechanism 35 includes a rotating body 36 for attaching the residual resin 30, a rotating mechanism 37 for rotating the rotating body 36, a rotating body 36 for rotating the rotating body 36, And a container 38 for containing the residual resin 30 adhered to the housing 30.

With this configuration, the residual resin 30 remaining on the discharge port 20a of the dispenser 18 can be attached to the resin removing mechanism 35 and removed. Therefore, the state in which the residual resin 30 slackens and remains in the discharge port 20a of the dispenser 18 can be quickly eliminated.

More specifically, according to the present embodiment, the resin removing mechanism 35 includes a rotating body 36 for winding and winding the residual resin 30, a rotating mechanism 37 for rotating the rotating body 36, , And a receiving container (38) for receiving the residual resin (30). A spatter-like member 39 for dropping the residual resin 30 into the container 38 is provided in the container 38.

The rotating body 36 provided in the resin removing mechanism 35 is rotated in contact with the residual resin 30 to separate the residual resin 30 from the discharge port 20a of the dispenser 18. [ Thereby, the residual resin 30 is dropped onto the rotating body 36. The dropped residual resin 30 is taken up by the rotating body 36 and the residual resin 30 is accommodated in the receiving container 38 by the spatula-like member 39. Therefore, the residual resin 30 extending from the discharge port 20a of the dispenser 18 can be attached to the resin removing mechanism 35 and removed.

According to the present embodiment, the residual resin 30 remaining in the discharge port 20a of the dispenser 18 does not wait for the spontaneous drop of the residual resin 30 into the resin containing portion 17, (30) is removed. Thus, the time for supplying the liquid resin 29 to the resin containing portion 17 can be shortened. Therefore, the productivity of the resin-sealing apparatus 1 can be improved.

According to the present embodiment, the residual resin 30 is removed by the resin removing mechanism 35, instead of waiting for the residual resin 30 to spontaneously fall into the resin containing portion 17. Therefore, it is possible to prevent the residual resin 30 remaining on the discharge port 20a of the dispenser 18 from being scattered by the flow of air, adhering to other driving mechanisms, constituent members, or the like and being contaminated.

According to the present embodiment, the residual resin 30 remaining on the discharge port 20a of the dispenser 18 is removed by the resin removing mechanism 35. [ Therefore, the supply amount of the liquid resin 29 to be supplied to the resin accommodating portion 17 can be set as large as the resin amount corresponding to the residual resin 30 in advance, and the liquid resin 29 can be discharged. As a result, a predetermined amount of the liquid resin 29 can be stably supplied to the resin accommodating portion 17.

In this embodiment, a rotating body having a circular cross-sectional shape is used as the rotating body 36 to which the residual resin 30 is attached and wound. The present invention is not limited to this, and a rotating body having a polygonal cross-sectional shape such as a triangular, square, or hexagonal shape may be used, or the flat plate member may be rotated.

[Embodiment 3]

(Configuration of Resin Discharge Tube)

Referring to Fig. 7, the resin discharge tube used in the dispenser 18 which is the resin discharge mechanism will be described.

7, a tube 40 capable of being elastically deformed is provided on the lower surface of the resin discharge portion 20 of the dispenser 18 via a joint (not shown). The liquid resin is discharged downward from the tip of the tube 40. [ The tube 40 can be detachably attached to the resin discharging portion 20 via a joint and can be exchanged. The tubes 40 having different inner diameters or shapes may be selected and used corresponding to products or applications. As the tube 40, for example, a tube made of silicone rubber or the like is used. The tube 40 may be made of a material capable of elastic deformation.

At the periphery of the tube 40, a clamping mechanism 41 for pushing the flow path of the tube 40 is provided. The flow path of the tube 40 can be narrowed by the clamp mechanism 41. [ In addition, the flow path of the tube 40 can be completely closed by the clamp mechanism 41. [ By using the clamp mechanism 41, the flow rate of the liquid resin discharged from the tube 40 can be adjusted.

(Operation of Resin Discharge Tube)

7, the operation of the dispenser 18 to discharge the liquid resin from the tube 40 provided in the resin discharging portion 20 will be described.

7 (a), in the dispenser 18, the liquid resin 42 is discharged from the tip of the tube 40 provided in the resin discharge portion 20 toward the discharge object. When the liquid resin 42 having a high viscosity is used, the liquid resin 42 discharged from the tube 40 at the point of time when the discharge of the liquid resin 42 is stopped is stopped by the supply resin 42a And the remaining resin 42b remaining in the discharge port of the tube 40 are connected. In this state, when the resin pressure of the liquid resin 42 stored in the reservoir portion (not shown) of the dispenser 18 is larger than the atmospheric pressure, the liquid resin 42 is discharged from the tube 40 .

The flow path of the tube 40 is pushed down by using the clamp mechanism 41 in a state in which the liquid resin 42 is extruded from the tube 40 as shown in Figure 7 (b). The flow path of the tube 40 is narrowed by the clamp mechanism 41. As a result, the flow rate of the residual resin 42b extruded from the tube 40 can be reduced.

Next, as shown in Fig. 7 (c), the clamp mechanism 41 is returned to its original state. The resin amount of the residual resin 42b remaining in the discharge port of the tube 40 is reduced because the flow rate of the residual resin 42b extruded from the tube 40 is reduced by using the clamp mechanism 41. [ By using the clamp mechanism 41, the resin amount of the residual resin 42b remaining in the discharge port of the tube 40 can be reduced.

Further, the flow path of the tube 40 can be completely closed by using the clamping mechanism 41. In this case, the liquid resin 42 extruded from the tube 40 can be completely blocked by the resin pressure.

(Action effect)

In this embodiment, a configuration including a tube 40 that is provided on the resin discharge portion 20 of the dispenser 18 as a resin discharge mechanism and is elastically deformable, and a clamp mechanism 41 that elastically deforms the tube 40 by sandwiching the tube 40 . That is, the tube 40 and the clamping mechanism 41 are used as a residual state dissolving mechanism for forcibly solving the residual state of the residual resin 30 from the discharge port 20a of the dispenser 13.

With this configuration, the resin amount of the residual resin 42b remaining in the discharge port of the tube 40 provided in the dispenser 18 can be reduced. Therefore, the state in which the residual resin 30 slackens and remains in the discharge port 20a of the dispenser 18 can be quickly eliminated.

According to the present embodiment, a clamping mechanism 41 is provided in the dispenser 18 and around the tube 40 to press the flow path of the tube 40 to crush it. The flow path of the tube 40 can be narrowed by the clamp mechanism 41. [ Therefore, the flow rate of the residual resin 42b extruded from the tube 40 can be reduced, and the resin amount of the residual resin 42b remaining in the discharge port of the tube 40 can be reduced.

The resin discharging tube 40 and the clamping mechanism 41 used in the present embodiment and the resin removing mechanism 21 used in the first embodiment or the resin removing mechanism 35 used in the second embodiment may be used in combination .

In each of the embodiments, the resin containing portion 17, which is formed by integrating the resin containing frame 16 and the release film 27, is used as the discharge target, and the liquid resin 29 is supplied to the resin receiving portion 17, As shown in Fig. In addition to the resin accommodating portion 17, the discharge object may be any of the following.

First, the discharge object is a cavity formed in a lower one of the cavities formed on at least one of the upper and lower molds arranged opposite to each other. In this case, the liquid resin 29 as the fluid resin is discharged to the cavity formed in the lower mold, and hardened inside the cavity.

Secondly, the discharge object is a space including a top surface of the substrate and a space including a chip mounted on the top surface of the substrate. The liquid resin 29 is discharged so as to cover the chip mounted on the upper surface of the substrate. In this case, it is preferable that electrical connection between the chip and the substrate is performed by the flip chip.

Thirdly, the discharge object is a space including the upper surface of a semiconductor substrate such as a silicon wafer. The liquid resin 29 is discharged so as to cover functional parts such as a semiconductor circuit formed on the semiconductor substrate. In this case, it is preferable that a projecting electrode (bump) is formed on the upper surface of the semiconductor substrate.

Fourth, the discharge object is a space including the upper surface of the film to be finally accommodated in the cavity of the molding die. In this case, the discharge object is, for example, a recess formed by recessing the film. The liquid resin 29 is discharged to the concave portion formed by recessing the film. The purpose of this film is to improve the releasability, to transfer the shape of the irregularities on the surface of the film, and to transfer the pattern previously formed on the film. The liquid resin 29 accommodated in the concave portion of the film is transported together with the film using an appropriate transport mechanism and finally supplied to the cavity of the mold.

In all of the first to fourth cases, the liquid resin 29 discharged to the discharge object is finally supplied into the cavity of the molding die, and hardened inside the cavity.

In both of the first to fourth cases, in the resin molding apparatus 1, the resin removing mechanism 21 or the resin removing mechanism 35 is provided adjacent to the place where the discharge object is disposed.

In each of the embodiments, a dispenser 18 of a one-liquid type using a liquid resin 29 produced by mixing a subject and a curing agent in advance is shown. The present invention is not limited to this. Even when a dispenser of a two-liquid mixing type in which a dispenser is used with a mixture of a main body and a curing agent is actually used, the same effects as those of the respective embodiments are exhibited.

In each of the embodiments, the resin molding apparatus and the resin molding method used when resin sealing the semiconductor chip have been described. The object to be resin-sealed may be a semiconductor chip such as an IC or a transistor, a non-semiconductor chip that does not use a semiconductor, or a chip group in which a semiconductor chip and a non-semiconductor chip are mixed. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a lead frame, a printed board, and a ceramics substrate is resin-sealed with a cured resin.

Incidentally, the present invention is not limited to the case where the electronic parts are resin-sealed, but the present invention can be applied to the case where the optical parts such as a lens, a reflector (reflector), a light guide plate, an optical module, have.

The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, changed, or selected as necessary within the scope of the present invention.

1: resin molding device
2: Board supply / storage module
3A, 3B, 3C: Molding module
4: Resin supply module
5: Pre-sealing substrate
6: substrate before sealing
7: Sealed substrate
8: Sealed substrate storage part
9:
10: substrate transport mechanism
11: Lower mold (molding type)
12: Mold fastening mechanism
13: Cavity
14: Table
15: release film feeding mechanism
16: Resin receiving frame
17: Resin receiving portion (discharge object)
18: Dispenser (resin discharge mechanism)
19: resin conveying mechanism
20: Resin discharging portion
20a:
21, 35: Resin removing mechanism (residual state removing mechanism)
22: Film-like member
22a: attachment area
23:
24:
25: Feed roller (arrangement member)
26: Retraction roller (arrangement member)
27: Release film (discharge object)
28: Through hole
29: liquid resin (liquid resin)
30: Residual resin
31: Chip
32: Upper mold (molding type)
33: Cured resin
34: Molded product
36: Rotating body
37: Rotation mechanism
38: receptacle container
39: Sputtering member
40: Tube (residual state resolution mechanism)
41: Clamping mechanism (residual state removing mechanism)
42: liquid resin (liquid resin)
42a: Supply Resin
42b: Residual resin
S1, M1, P1, C1:

Claims (10)

A molding die having a cavity formed on at least one of an upper mold and a lower mold disposed so as to face each other,
A resin discharge mechanism for discharging the fluid resin to the discharge object to supply the fluid resin to the cavity;
A residual state releasing mechanism for releasing the residual resin from the discharge port of the resin discharging mechanism and remaining in the vertical direction by forcibly removing the residual resin by moving the residual resin in a direction different from the vertical direction,
And a mold clamping mechanism for clamping the mold with the fluid resin supplied to the cavity. A molding die having a cavity formed on at least one of an upper mold and a lower mold disposed so as to face each other,
A resin discharge mechanism for discharging the fluid resin to the discharge object to supply the fluid resin to the cavity;
A resin removing mechanism which is inserted between a discharge port of the resin discharge mechanism and the discharge object and which extends in the vertical direction from the discharge port to adhere the remaining resin to move and remove the remaining resin in a direction different from the vertical direction,
And a mold clamping mechanism for clamping the mold with the fluid resin supplied to the cavity. 3. The method of claim 2,
The resin removing mechanism includes:
A delivery mechanism for delivering a film-like member to which the residual resin is adhered,
A winding mechanism for winding the film-shaped member,
And an arrangement member for arranging the film-like member at a removal position of the residual resin. The method of claim 3,
And the winding mechanism includes a rolling roller for rolling the residual resin. 3. The method of claim 2,
The resin removing mechanism includes:
A rotating body for attaching the residual resin,
A rotating mechanism for rotating the rotating body,
And a receiving container for receiving the residual resin adhered to the rotating body. 6. The method of claim 5,
Wherein the cross-sectional shape of the rotating body is circular or polygonal. 3. The method according to claim 1 or 2,
An elastically deformable tube provided at a discharge port of the resin discharge mechanism,
And a clamping mechanism for elastically deforming the tube in a state in which the residual resin of the fluid resin is connected from the tube to the discharge object. A resin discharging step of discharging the fluid resin to an object to be discharged using a resin discharging mechanism so as to supply the fluid resin to the cavity of the forming die having a cavity formed on at least one of the upper and lower dies arranged opposite to each other;
A residual state releasing step of releasing the remaining resin from the discharge port of the resin discharging mechanism by remaining in the vertical direction by forcibly removing the residual resin by moving the residual resin in a direction different from the vertical direction;
And a mold clamping step of clamping the molding die supplied with the fluid resin into the cavity. A resin discharging step of discharging the fluid resin to an object to be discharged using a resin discharging mechanism so as to supply the fluid resin to the cavity of the forming die having a cavity formed on at least one of the upper and lower dies arranged opposite to each other;
A resin removing mechanism which is arranged to extend from the discharge port of the resin discharging mechanism in the vertical direction to adhere and remove the remaining resin is inserted between the discharge port and the discharging object to move and remove the residual resin in a direction different from the vertical direction A resin removing step,
And a mold clamping step of clamping the molding die supplied with the fluid resin into the cavity. 10. The method according to claim 8 or 9,
And a clamping step of elastically deforming the elastically deformable tube provided at the discharge port of the resin discharging mechanism by clamping the residual resin of the fluid resin from the tube to the discharging object with a clamping mechanism Molding method.

Images