KR101950894B1

KR101950894B1 - Resin molding apparatus

Info

Publication number: KR101950894B1
Application number: KR1020147015227A
Authority: KR
Inventors: 마사히코 후지사와; 히데토시 오야; 신이치 아사히
Original assignee: 아피쿠 야마다 가부시키가이샤
Priority date: 2011-11-08
Filing date: 2012-10-29
Publication date: 2019-04-22
Also published as: TWI593541B; JP5731009B2; SG11201402077UA; JP5926417B2; JP2015128908A; KR20140092381A; JPWO2013069496A1; TW201318810A; CN103930252B; WO2013069496A1; CN103930252A

Abstract

And to reduce defective molding such as non-filling. The base resin portion 27a made of the granular resin 27 is formed on the work W and the granular resin 27 having the base resin portion 27a formed on the base resin portion 27a And a small-sized granular resin 27 is used to form the used resin portion 27b. The upper mold 43 and the lower mold 44 are brought into close contact with the work W mounted on the lower mold 44 so that the upper mold 43 is brought into contact with the used resin portion 27b, A resin is spread over the base resin portion 27a and the inside of the cavity 45 is filled with resin.

Description

RESIN MOLDING APPARATUS

The present invention relates to a resin-sealing apparatus (resin mold apparatus), and more particularly to a resin-sealing apparatus (resin mold apparatus) which uses a granular resin (referred to as granular resin in the present application) To an effective technique applied to a sealing device.

Japanese Patent Application Laid-Open No. 2009-234000 (Patent Document 1) discloses a technique capable of supplying a granular resin to a resin supply source. This technique is to supply a granular resin using a shooter that extends in the vertical direction and a diffuser that is located in the shooter and diffuses the resin (diffusion method).

Japanese Patent Application Laid-Open No. 2009-234000

One of the resin-sealing apparatuses provided with a resin supply unit is a system in which a granular resin is fed and supplied to one surface of a work (supplied portion) in a resin supply unit and the work is conveyed to the press unit, And a resin sealing portion is formed on the work.

As one method of supplying the resin to the resin supplying portion, there is a method of opening the shutter to open the granular resin held in a cylindrical holder whose bottom portion is closed by a shutter, and feeding the granular resin to the work (open method). Another resin supplying method is a method in which a resin-loaded portion or a table on which a work is mounted is moved in the X and Y directions by feeding a granular resin through a resin dropping portion to the work, A granule resin is fed and fed (writing method). There is also a method of manually feeding the granular resin to the work.

Even if the granular resin is fed by dropping on one side of the work so as to be evenly spread by using an open system, a lighting system, a diffusion system, or the like, unevenness is actually formed on the deposition surface because of the discharge of the granular resin. Specifically, for example, even if the granular resin is supplied in a uniform thickness to the workpiece on which the electronic components are mounted in a matrix form, irregularities arise in the surface of the supplied resin due to the arrangement of the electronic components. When the resin-fed workpiece is compression-molded as described above, an air pocket is generated between the mold and the workpiece, and air can not be sufficiently discharged. As a result, molding defects such as unfilled You can also think of.

An object of the present invention is to provide a technique capable of reducing defective molding of a molded product. These and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

Outline of representative ones of inventions disclosed in the present application will be briefly described as follows.

A resin-sealing apparatus according to an embodiment of the present invention is provided with a resin supply portion for supplying and supplying a granular resin to a work, and a press portion having a pair of molds for clamping and hardening the work supplied with the granular resin . Wherein the resin supply portion includes a resin dropping portion for dropping the granular resin into the workpiece, a workpiece mounting portion on which the workpiece is mounted and disposed immediately below the resin dropping portion, and at least one of the resin dropping portion and the workpiece mounting portion is moved And a drive mechanism for driving the motor.

Here, the resin supply section may include: a first storage section for storing the granular resin; a second storage section for temporarily storing the granular resin from the first storage section in a smaller size than the first storage section; And a weighing machine mounted on the workpiece mounting part for measuring the amount of the granular resin to be discharged in a state in which the workpiece is mounted on the workpiece mounting part. The resin supply portion is configured such that the first storage portion is fixed and the resin discharge portion is moved by the drive mechanism together with the second storage portion and the workpiece mount portion is fixed.

According to this, the movable portion including the resin drop portion can be made lighter and smaller, and the movement of the resin drop portion is smooth. In addition, it is possible to correct an error between a delivery amount measured by the weighing scale and a delivery scheduled amount. These are connected to reducing defective molding such as uncharged.

Alternatively, the resin supply portion is configured such that the resin receiving portion is fixed, and the workpiece mounting portion is moved by the drive mechanism.

According to this, it is possible to accurately supply the granular resin to the predetermined position in the horizontal plane of the work W at a predetermined position. This leads to reduction of defective molding such as non-filling.

Further, in the resin-sealing apparatus, the base resin portion is formed by lighting by continuously blowing the granular resin onto the work from the resin supply portion while moving the workpiece mount portion relative to the resin supply portion by the drive mechanism, The resin is supplied to the central portion of the base resin portion so as to form a middle (high) resin portion having a height higher than that of the base resin portion.

According to this, even when the surface of the base resin part has irregularities, the resin melted from the used resin part can flow on the surface of the base resin part to fill the irregularities. Therefore, defective molding such as unfilled can be reduced.

The resin-sealing apparatus further includes a preheating section which is provided in a conveyance path of the work from the resin supply section to the press section and preheats the workpiece supplied with the granular resin to a temperature lower than the molding temperature.

According to this, air between the granular resin can be reduced by the melted resin. That is, it is possible to prevent air from being entrained inside the resin sealing portion at the time of molding. This leads to reduction of defective molding such as non-filling.

And a cooling section which is provided in the conveyance path of the work from the preheating section to the press section and cools the preheated work.

According to this, even when the granular resin is heated by the preheating portion, shortening of the gel time until molding can be suppressed. That is, the fluidity of the resin can be ensured at the time of molding. Therefore, even if there is unevenness on the surface of the basic resin part, the resin melted from the used resin part flows over the surface of the base resin part to fill the unevenness. This can reduce defective molding such as non-filling.

Effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows. According to the resin sealing apparatus according to the embodiment of the present invention, defective molding of a molded product can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a layout diagram of each part constituting a resin-sealing apparatus according to Embodiment 1 of the present invention. Fig.
Fig. 2 is a cross-sectional view of the resin supply unit of the resin-sealing apparatus shown in Fig. 1 during operation. Fig.
Fig. 3 is a plan view of a work for explaining the operation of the resin supply unit shown in Fig. 2. Fig.
Fig. 4 is a cross-sectional view of the work after resin supply by the resin supply unit shown in Fig. 2; Fig.
Fig. 5 is a cross-sectional view of the resin supplying section following Fig. 2 during operation. Fig.
6 is a plan view of a work for explaining the operation of the resin supply unit shown in Fig.
7 is a cross-sectional view of the work after resin supply by the resin supply unit shown in Fig.
Fig. 8 is a cross-sectional view of the preheating section of the resin sealing apparatus shown in Fig. 1 during operation. Fig.
Fig. 9 is a cross-sectional view of the cooling section of the resin-sealing apparatus shown in Fig. 1 during operation. Fig.
10 is a cross-sectional view of the press section of the resin-sealing apparatus shown in Fig. 1 during operation.
Fig. 11 is a cross-sectional view of the press section following the operation of Fig. 10; Fig.
Fig. 12 is a cross-sectional view of the press section following the operation of Fig. 11 during operation. Fig.
Fig. 13 is a cross-sectional view of the press section following the operation of Fig. 12; Fig.
Fig. 14 is a cross-sectional view of the press section following the operation of Fig. 13; Fig.
15 is a cross-sectional view of the resin supply unit of the resin-sealing apparatus according to the second embodiment of the present invention during operation thereof.
Fig. 16 is a cross-sectional view of the resin supplying section following Fig. 15 during operation. Fig.
Fig. 17 is a cross-sectional view of the resin supplying section following Fig. 16 during operation. Fig.
Fig. 18 is a cross-sectional view of the resin supplying section following Fig. 17 during operation. Fig.
Fig. 19 is a side view of one blade in the resin supply portion of the resin-sealing apparatus according to Embodiment 3 of the present invention. Fig.
20 is a side view of another blade in the resin supply portion of the resin-sealing apparatus according to Embodiment 3 of the present invention.
21 is a cross-sectional view of the preheating section of the resin-sealing apparatus according to the fourth embodiment of the present invention during operation.
Fig. 22 is a cross-sectional view of the cooling section of the resin-sealing apparatus according to the fourth embodiment of the present invention during operation. Fig.
23 (a) to 23 (f) are views for explaining a modification of the operation of the resin supply unit.
24 (a) to 24 (g) are views for explaining a modification of the work.
25 is a view for explaining a modification of the operation control system of the resin supply unit.
26 is a view for explaining a modification of the resin supply portion.

In the following embodiments, a plurality of sections and the like are described as necessary when they are required. In principle, they are not related to each other, and one of them is a modification of some or all of the other, There is a relationship. Therefore, in the entire drawings, members having the same functions are denoted by the same reference numerals, and repetitive description thereof will be omitted. In addition, the constituent elements shown in the embodiments are not necessarily essential in the present invention. Further, the number (including the number, the numerical value, the amount, the range, etc.) of the constituent elements is not limited to the specific number except for the case where it is specifically stated or the case is clearly limited to a specific number in principle, It may be more or less than a certain number. When referring to the shape of a component or the like, the shape or the like substantially including the shape or the like is to be included, unless otherwise specifically stated or in the case where it is considered that the principle is not apparent in principle.

(Embodiment 1)

First, the outline of the resin-sealing apparatus 1 will be described with reference to Fig. The resin sealing apparatus 1 is provided with a work and resin supply section A, a work storage section B, a molding processing section C and a preliminary processing section D. A plurality of (two in FIG. 1) molding processing sections C and one preliminary processing section D are arranged side by side between the work and resin supply section A and the work storage section B in the resin- Is installed. In the resin sealing apparatus 1, the work W is transferred to the work / resin supply unit 3 via the transfer hands 4 and 5 (loader and unloader) which are moved on the transfer rail 2 over the respective sections, (A), the preliminary processing section (D), the molding processing section (C), and the work storage section (B). In the present embodiment, the pretreatment section D is provided. However, in the case where the pretreatment section D is not provided, the molding processing section C may be formed at the position of the pretreatment section D. In addition, the number of the molding processing portions C can be appropriately increased or decreased according to the processing capability of each portion.

The work W is an electronic part (for example, a semiconductor chip) mounted on a rectangular substrate (for example, a wiring board). In this work (W), after the molding process, the electronic part is sealed by the resin sealing part. The resin used as the resin sealing portion is a thermosetting resin (epoxy resin, silicone resin or the like), and the resin composition (filler such as silica, alumina, release agent, coloring agent, etc.) is adjusted to a predetermined content. In addition, the shape of the resin is a small resin having a size of granular resin or powdery resin (hereinafter referred to as granular resin).

The work and resin supply section A includes a supply magazine 6, an alignment section 7, a supply table 8, a thickness measurement section 11, and a resin supply section 12. The work W is transported in the order of the supply magazine 6, the alignment section 7, the supply table 8, the thickness measurement section 11 and the resin supply section 12 in the work and resin supply section A.

More specifically, the work W housed in the supply magazine 6 is uniformly arranged in a predetermined direction in the aligning section 7 by a not-shown conveying mechanism, 8). The work W fed to the feed table 8 is conveyed to the thickness measuring section 11 by the conveyance hand 4 (loader) moving on the conveyance rail 2.

The thickness measuring section 11 measures the thickness of the workpiece W before molding so as to adjust the supply amount (delivery amount) of the granular resin to the workpiece W. The thickness measuring section 11 is provided with a table 13 on which a workpiece W from the supply table 8 is mounted, a transport rail 14 pierced from the transport rail 2 side to the resin supply section 12 side, (15).

The measuring section 15 is provided with an optical type ranging device such as a laser displacement gauge for measuring the state (for example, shortage) and height of the electronic component or the thickness of the substrate. The work W is moved on the conveying rail 14 while being mounted on the table 13 and the thickness is measured by the measuring unit 15 and conveyed to the front side of the resin supply unit 12. [ For example, the measuring unit 15 is configured to be able to adjust the amount of resin supplied from the resin supply unit 12 to increase or decrease in accordance with the number and thickness of electronic components mounted.

The resin supply unit 12 (dispenser) supplies (drops) the granular resin onto the work W. In the resin supply unit 12, a quantity of granular resin determined by referring to the data obtained by the thickness measuring unit 11 or the like is supplied so as to be deposited on the work W. The resin supply unit 12 will be described later in detail.

As described above, the work W on which the granular resin is deposited in the work and resin supplying section A is conveyed to the pretreatment section D by a conveying mechanism (not shown). The preliminary processing section D is provided with a preheating section 16, a cooling section 17, and a table 18. In the preliminary processing section D, the work W is transported in the order of the preheating section 16, the cooling section 17, and the table 18 in a state where the granular resin is supplied by the resin supply section 12.

The preheating section 16 preheats the workpiece W to a temperature lower than the molding temperature of the heater included in the molding processing section C. The preheating section 16 is installed in the conveyance path of the work W from the resin supply section 12 to the molding processing section C. [ The preheating section 16 will be described later in detail. The preheated workpiece W is transported to the cooling section 17 by a transport mechanism (not shown).

The cooling section (17) cools the work (W) heated by the preheating section (16). The cooling section 17 is installed in the conveyance path of the work W from the preheating section 16 to the forming processing section C. [ The cooling unit 17 will be described later in detail. The cooled workpiece W is transported to the table 18 by a transport mechanism (not shown).

As described above, the work W subjected to the preliminary processing in the preliminary processing section D is transported to one of the molding processing sections C by the transport hand 4. The molding processing section C is provided with a press section 21 (mold mechanism). Here, in the molding processing unit C, the conveying hands 4 and 5 are expanded and contracted from the conveying rail 2 side to the press portion 21. The transfer hand 4 (loader) is used to carry the work W into the press section 21 and the transfer hand 5 (unloader) is used to transfer the work W from the press section 21 It is used for carrying out.

The press section 21 clamps the workpiece W fed with the granular resin with a pair of molds, and encapsulates the resin by heating and curing the granular resin in the cavity. The press section 21 will be described later in detail.

As described above, the resin-sealed workpiece W in the molding processing section C is transported to the workpiece storage section B by the transporting hand 5. The workpiece storage section B includes a thickness measuring section 22 and a storage magazine 23. In the workpiece storage section B, the workpiece W (molded article) is transported in the order of the thickness measuring section 22 and the storage magazine 23 in that order.

The thickness measuring section 22 is the same as the thickness measuring section 11 such as the table 24, the transporting rail 25 and the measuring section 26 for adjusting the supply amount (delivery amount) of the granular resin to the work W And the thickness of the work W after the molding is measured.

Further, in the resin supply unit 12, a quantity of granular resin determined by reference to the data obtained by the thickness measuring unit 22 is supplied so as to be deposited on the work W. For example, feedback control is performed so as to increase or decrease the amount of granular resin delivered in the resin feeding section A in accordance with the difference from the predetermined value of the thickness data at the resin-sealed region measured by the measuring section 26.

The work W (molded product) is moved on the conveying rail 25 while being mounted on the table 24, the thickness is measured by the measuring unit 26, and the work W is conveyed to and stored in the storage magazine 23. A resin sealing portion (molded product) is formed in the work W by the resin sealing apparatus 1 as described above.

Next, the resin supply unit 12 (dispenser) will be described in detail with reference to Figs. 2 to 7. Fig. The resin supply unit 12 includes a first supply step of depositing and supplying a granular resin 27 in the form of a surface to the work W and a second supply step of depositing the granular resin 27 in a point shape 2 supply step is performed. By the first and second supplying steps, the resin supplying section 12 supplies the granulated resin 27 corresponding to the amount of resin sealing once to the work W. In the work W, a plurality of electronic components 29 are arranged in a matrix and mounted on a square (rectangular) substrate 28 in a plan view. Alternatively, a configuration may be employed in which a plurality of electronic components 29 are sealed in a matrix (a workpiece W).

The resin supply portion 12 has a resin drop portion 32 (for example, a trough) for dropping the granular resin 27 from the tip end thereof to the work W. When the resin dropping section 32 is, for example, trough, the granular resin 27 supplied from the hopper is received by the trough, and the trough is vibrated by the electronic feeder to send the granular resin 27 to the tip end side of the trough, The granular resin 27 is dropped from the tip of the trough to the wafers W.

The resin supply section 12 includes an XY driving stage 31 (workpiece mounting section) which is movable in the XY directions by mounting the workpiece W in a fixed state, And the XY driving mechanism 33 (scanning mechanism) for supporting the XY driving mechanism. In the XY driving mechanism 33, a slider 35 slides on the X-axis rail 34 in the X direction by a driving source (not shown), and the slider 36 on the Y- Lt; / RTI > In the resin supply section 12, the stage 31 is provided so as to be movable in the X and Y directions, while the resin drop section 32 is fixed.

The resin supply portion 12 is provided with a scattering prevention frame 37 having an opening 37a formed therein to prevent scattering when the granular resin 27 is dropped from the front end of the resin dropping portion 32 to the work W, Lt; / RTI > The scattering prevention frame 37 is disposed opposite to the stage 31 and moves in the XY directions in cooperation with the stage 31. [ The granular resin 27 is dropped in the frame of the scatter preventing frame 37, that is, in the opening 37a (see Figs. 2 and 5). It is possible to prevent the granular resin 27 from being scattered by the inner wall of the opening 37a of the scattering prevention frame 37 even if the granular resin 27 falls down from the resin dropping section 32 to the work W. [

As described above, in the resin supply unit 12 constituted as described above, the first supply step supplies most (e.g., 90% or more) of the entire amount of the granular resin 27 to the work W as the first resin drop do. The first supplying step is a step of supplying the granular resin 27 from the tip end of the resin dropping section 32 to the work W (see Fig. 2) (See Fig. 3), and the base resin portion 27a is formed on the work W by lighting (see Fig. 4). That is, most of the granular resin 27 in the supply amount is sprinkled in the predetermined area of the work W without spitting.

An example of the discharge of the granular resin 27 by the discharge section 32 will be described. The resin dropping section 32 is formed in the rectangular opening 37a as viewed in plan view and extends from one corner A to the adjacent corner B as shown by the arrow in Fig. Direction). Then, the resin dropping section 32 moves from the corner B to the adjacent corner C by a predetermined distance along the edge (Y direction) of the opening 37a, and then moves along the X direction to the side AD. Then, the resin dropping portion 32 moves along the edge (Y direction) of the opening portion 37a by a predetermined distance to the corner portion D, and then moves along the X direction to the side BC. By repeating this operation, the granular resin 27 is supplied to the entire surface. That is, by the lighting method, the resin dropping section 32 drops and feeds the granular resin 27 onto the work W so as to stand up from the corner A to the opposite corner C,

The resin dropping section 32 drops a predetermined amount of the granular resin 27 per unit time onto the work W and moves the stage 31 on which the work W is mounted by a predetermined amount per unit time in the XY direction , The granular resin 27 is deposited on one surface of the work W in a uniform thickness. The thickness of the granular resin 27 may be adjusted by adjusting the moving speed of the stage 31.

In the present embodiment, since the scattering prevention frame 37 is disposed as shown in Fig. 2, among the plurality of electronic components 29 mounted in the form of a matrix on the substrate 28, A part of the resin 29 is covered with the granular resin 27 and the inside of the electronic component 29 is covered with the granular resin 27 (base resin part 27a). That is, the peripheral region of the mounting region in which the plurality of electronic components 29 are mounted is not covered with the granular resin 27. It is possible to suppress the spread of the granular resin 27 by the electronic component 29 on the outer heat (outer row) side by not supplying the granular resin 27 to the outside of the outer peripheral electronic component 29, It is possible to prevent the granular resin 27 from coming off and to prevent the granular resin 27 from sticking to the mold at the time of molding. The opening 37a of the scattering prevention frame 37 is formed in an optimal plane so that the granular resin 27 is not scattered to the region on the outer peripheral side and the region on the outer peripheral side is covered with the granular resin 27 It is also avoided.

In the resin supplying section 12, the second supplying step is a step of supplying the remaining amount (for example, 10% or less) obtained by subtracting the amount of the first resin feeding out of the entire amount of the granular resin 27 to the work W, . In this second supplying step, the granular resin 27 is dropped to the center of the work W from the tip end of the resin dropping section 32 to the work W without moving the stage 31 6), and a used resin portion 27b is formed on the base resin portion 27a (see Fig. 7).

In this manner, while the stage 31 (workpiece mounting portion) is relatively scanned with respect to the resin dropping portion 32 by the XY driving mechanism 33 (scanning mechanism) The resin is fed so as to form the base resin portion 27a by the continuous blowing of the resin 27. [ In addition, resin is supplied to the center of the base resin portion 27a so as to form a used resin portion 27b having a higher height than the base resin portion 27a.

According to this, the granular resin 27 can be accurately and simply supplied to the predetermined position in the horizontal plane of the work W at a predetermined supply amount. That is, it is difficult to precisely control the supply amount on the front surface only by supplying the thickness uniformly as the base resin portion 27a. However, after supplying the base resin portion 27a with a predetermined accuracy as the supply amount of the basic resin portion 27a, The supply amount can be adjusted easily, and the supply amount as a whole can be accurately controlled.

Next, the preheating section 16 will be described in detail with reference to Fig. The preheating section 16 includes a table 38 on which the work W is mounted, a heater 39, and a box body surrounding the table 38 and the heater 39 to increase the thermal efficiency and prevent external heating I have. The heater 39 is made of, for example, an infrared heater. Further, in order to further increase the thermal efficiency, a heater may be incorporated in the table 38, and the table 38 may also be heated. In this case, the adsorption mechanism may be incorporated in the table 38 to facilitate transfer of heat from the table 38.

In the preheating part 16, the work W on which the basic resin part 27a and the used resin part 27b are formed is mounted on the table 38 and heated to a temperature lower than the molding temperature by the heat from the heater 39 The work W is preliminarily heated. As a result, the granular resin 27 melts and the particles adhere to each other on the surface, so that scattering of the powder from the granular resin 27 at the time of transportation and the like can be prevented. Further, since the granular resin 27 is melted and the spaces between the resins are dense, the thicknesses of the basic resin portion 27a and the used resin portion 27b are reduced, and the resin is easily heated.

Next, the cooling unit 17 will be described in detail with reference to Fig. The cooling section 17 has a table 41 on which a work W is mounted, an air blower 42 and a box body surrounding the table 41 and the air blower 42 to increase the cooling efficiency. Further, in order to further increase the cooling efficiency, the cooler may be built in the table 41 and cooled from the table 41 side. In this case, a suction mechanism may be incorporated in the table 41 to facilitate transfer of heat from the table 41. When the workpiece W heated by the preheating section 16 is naturally cooled, the workpiece W may be directly conveyed from the preheating section 16 to the table 18 (see FIG. 1).

According to this cooling section 17, even if the granular resin 27 is heated by the preheating section 16, the moldability and handling property in the press section can be improved and the reduction of the gel time until molding can be suppressed can do. That is, the fluidity of the resin can be ensured at the time of molding.

Even when the granular resin 27 is heated by the preheating section 16, the time difference (time difference) for conveying the work W from the preliminary processing section D to any one of the press sections 21 Can be suppressed. That is, the cured state of the resin supplied to the work W in each press section 21 can be made uniform.

Next, the press section 21 will be described in detail with reference to Figs. 10 to 14. Fig. The press section 21 clamps the workpiece W fed with the granular resin 27 and thermally cures the granular resin 27 in the cavity 45 (simply referred to as a cavity) And has a pair of molds (mold mechanisms) that form a portion 27c (see Fig. 14). The pair of dies includes a heater 43 (not shown), and a pair of upper molds 43 (not shown) capable of being brought into contact with and disengaged from each other by a known elevating mechanism (for example, a toggle mechanism) And the other lower mold 44. As shown in Fig. Here, the upper die 43 is fixed and the lower die 44 is movable.

The upper mold 43 is provided with a cavity 46 fixed to the upper mold base (not shown) and fitted to the upper mold clamp 46 47). The cavity opening 46 is formed of a mold block having a planar shape (for example, a square shape) matching the shape of the resin sealing portion 27c to be formed on the work W. The upper mold clamper 47 is formed of a cylindrical mold block having a through-hole for surrounding the cavity orifice 46. An air vent (not shown) is formed on the clamp surface 43a of the upper type clamper 47.

In the upper mold 43, the bottom surface of the cavity 45 is formed as a flat surface (bottom surface) of the cavity sphere 46, and the side surface of the cavity 45 has a through- And is formed as an inner wall surface. That is, the cavity recess 45 (cavity) is formed in the upper mold 43. On the clamp surface 43a of the upper die 43, a release film 48 is stretched.

The lower die 44 has a lower type clamper 51 which is fixed to the lower die base (not shown) and is engaged. The lower clamper 51 is formed of a mold block having a planar shape for mounting the work W.

In this lower type clamper 51, a suction hole 52 for suctioning the mounted workpiece W is formed. The suction holes 52 are connected to, for example, a suction mechanism including a compressor. When the work W is mounted on the lower mold 44, the suction mechanism adsorbs the work W, thereby improving the heating efficiency from the lower mold 44. [

Further, the lower mold clamper 51 is provided with a pressure-reducing hole 53 for reducing the pressure in the cavity 45 at the time of clamping. The pressure-decreasing hole 53 is connected to a pressure-reducing mechanism including, for example, a vacuum pump. The flow of the resin in the reduced pressure cavity 45 prevents the air from being entrained inside the resin sealing portion at the time of molding. A seal member 54 (for example, an O-ring) is provided to form a closed space (airtight space) in the outer periphery of the lower clamper 51 (a portion contacting the upper clamper 47).

Next, the operation of the press section 21 will be described in detail. As shown in Fig. 10, a workpiece W is supplied to a pair of molds that have been opened. Here, the work W is a state of the article to be molded before the resin sealing portion is formed. The workpiece W is transferred from the table 18 of the preliminary processing section D into the pair of molds by the loader 4 and then sucked by the suction holes 52 in the lower mold 44 to be mounted thereon.

The surface of the work W (substrate 28) on which the electronic component 29 is mounted, that is, the surface to which the granular resin 27 is fed is set to the upper mold 43 side and the opposite surface is set to the clamp And is mounted on the lower mold 44 in contact with the surface 44a. The work W is mounted on the lower mold 44 by aligning the cavity recess 45 formed in the upper mold 43 with the supplied granular resin 27. [

10, the release film 48 is sucked and held on the clamp surface 43a of the upper die 43. As shown in Fig. Here, the cavity 46 constituting the bottom portion of the cavity 45 is at a retreat position relative to the position (molding position) of the cavity bottom at the time of resin curing. 10, the release film 48 is adsorbed on the upper mold 43 so as to follow the shape of the cavity 45. As shown in Fig.

Subsequently, after the transfer hand 4 is retracted from the inside of the pair of dies, the upper die 43 and the lower die 44 are brought close to each other, as shown in Figs. 11 and 12. The pair of dies is heated at a temperature (molding temperature) at which the granular resin 27 is melted by a heater (not shown). Because of this. The upper mold part 43 is brought into contact with the used resin part 27b formed on the work W and the granular resin 27 of the used resin part 27b is melted. When the seal member 54 provided on the clamp surface 44a of the lower die 44 starts to come into contact with the clamp surface 43a of the upper die 43 via the release film 48, (45) is cut off from the outside, and a closed space is formed while being degassed.

Next, as shown in Figs. 13 and 14, the resin melted from the used resin portion 27b is spread over the base resin portion 27a to fill the cavity 45 with resin. Concretely, the upper mold 43 and the lower mold 44 are brought closer to each other and the upper mold clamper 47 is pressed against the spring to push back the lower mold so that the lower surface of the cavity 46 comes to the molding position from the retracted position, 45) becomes shallow. At this time, the lower surface of the cavity orifice 46 presses the molten resin to unfold it. According to this, even if the height of the surface of the base resin portion 27a is different depending on the thickness of the electronic component 29, for example, even if the surface is irregular, the resin melted from the used resin portion 27b And flow on the surface of the base resin portion 27a. That is, according to the resin-sealing apparatus 1, defective molding of the molded article (resin sealing portion 27c) due to unfilled air pockets or the like can be reduced.

In this state, the upper clamp 43 is returned and the clamping operation is completed with the work W held by the clamp surface 43a of the upper mold 43 and the clamp surface 44a of the lower mold 44 do. At this time, the electronic parts 29 of the work W are covered with the resin 27 in the cavity 45. [ Subsequently, the resin 27 is pressure-retained in the cavity 45 by a predetermined resin pressure and cured by heating. In this manner, in the press section 21 of the resin-sealing apparatus 1, the work W can be resin-sealed to form the resin-sealed section 27c.

Thereafter, the upper mold 43 and the lower mold 44 are separated from each other to mold the pair of molds, and the resin-sealed workpiece W is released from the upper mold 43 and the lower mold 44, The work W (molded article) is taken out by the loader 5. [

As described above, in the resin supplying section 12, the base resin section 27a made of the granular resin 27 is formed on the work W in the first supplying step, and the base resin section 27a is formed in the base resin section The second resin part 27b made of the granular resin 27 in a smaller amount than the granular resin 27 in which the basic resin part 27a is formed is formed on the first resin part 27a. Thus, the resin flow on the work W is reduced at the time of molding by covering the entire work W with the base resin portion 27a, and the resin flow on the base resin portion 27a is reduced on the used resin portion 27b of the granular resin 27, the force applied to the electronic component 29 by the resin flow is reduced. Further, when the electronic component 29 is electrically connected to the substrate 28 by the bonding wire, the wire flow can be prevented by forming the base resin portion 27a, and the molding quality of the molded product can be improved.

In the resin supplying section 12, a used resin section 27b is formed on the central portion of the basic resin section 27a in the second supplying step. Therefore, molten resin 27 from the used resin portion 27b can be made to flow from the central portion of the base resin portion 27a toward the outer peripheral portion of the press portion 21. For example, even when the work W has a rectangular shape in plan view, the resin 27 melted to the four corners at the time of molding can be made evenly. Therefore, defective molding such as unfilled portions can be reduced at the corners of the molded article.

(Embodiment 2)

In the first embodiment, the case where the scattering prevention frame is provided in the resin supplying section, and the granular resin fed into the work from the tip of the resin dropping section is deposited in a predetermined amount without scattering has been described. In the present embodiment, a case where a predetermined amount of granular resin is deposited on a work without a scattering-preventing frame will be described. In addition, the description overlapping with the first embodiment may be omitted.

The resin supply unit 12A (dispenser) in the present embodiment will be described with reference to Figs. 1 and 15 to 18. Fig. The resin supply section 12A is provided in the work / resin supply section A in the same manner as the resin supply section 12 of the first embodiment.

The resin supply section 12A is provided with a first supply step of depositing and supplying the granular resin 27 in the form of a plane to the work W and the second supply step of supplying the granular resin 27 to the work W, And a second supplying step of depositing the resin in the form of a point and supplying the resin. By the first and second supplying steps, the resin supplying portion 12A supplies the granulated resin 27 corresponding to the amount of the resin sealing to the work W one time. Further, in the work W, a plurality of electronic components 29 are mounted on a substrate 28 in a short (rectangular) shape in plan view.

The resin supply section 12A includes an XYZ drive stage 31A on which the work W is mounted and movable in the XYZ direction and an XYZ drive mechanism 33A that supports the stage 31A movably in the XYZ direction And a weight sensor 57 for measuring the weight of the work W (including the weight of the resin supplied to the work W).

In the stage 31A, a through hole 31a is formed in the center portion in the thickness direction. Therefore, the stage 31A sucks and holds the work W at the outer peripheral portion. That is, the stage 31A passes through except the portion for holding the outer periphery of the work W. The weight sensor 57 measures the weight of the work W while passing through the through hole 31a of the stage 31A.

In the XYZ drive mechanism 33A, the slider 35 slides on the X-axis rail 34 in the X direction by a drive source (not shown), and the slider 36 slides on the Y- . A Z-axis rail 55 is provided on the slider 36, and the slider 56 slides in the Z-direction on the Z-axis rail 55. In the resin supply section 12A, the stage 31A is provided movably in the X, Y and Z directions, while the resin drop section 32A is fixed.

The resin supply section 12A has a resin discharge section 32A (for example, a shooter) for discharging the granular resin 27 from the tip end to the work W. When the resin discharge portion 32A is, for example, a shooter, the granular resin 27 supplied from the hopper is received by the trough, the trough is vibrated by the electronic feeder to send the granular resin 27 to the tip end side of the trough, The resin 27 is dropped from the tip end of the trough to the work W via the shooter. It is possible to supply (write) the granular resin 27 more precisely to a predetermined position at a predetermined supply amount into the horizontal plane of the work W by making the tip end of the resin discharge section 32A small in diameter using the shooter. Therefore, the supply amount can be adjusted more precisely for each part. In addition, since the shooter extending and projecting downward is supplied close to the work W, the base resin portion 27a made of the granular resin 27 can be used without using the scattering prevention frame 37 used in Embodiment 1, And the used resin portion 27b can be easily formed.

15, the stage 31A is lowered to mount the work W on the weight sensor 57, and the work W is mounted on the workpiece W. In this way, (W) is measured. Subsequently, the slider 56 is raised in the Z-axis direction to transfer the workpiece W from the weight sensor 57 to the table 31A.

Subsequently, the granular resin is supplied (dropped) onto the work W based on the resin supply information (resin supply amount). In the resin supply section 12A, as the first supply step, most of the entire supply amount of the granular resin 27 to the workpiece W (for example, 90%) is supplied as the first resin discharge. In this first supply step, the granular resin 27 is fed and supplied to the work W from the tip end of the resin drop portion 32A (see Fig. 16), and the stage 31A is moved in the horizontal plane of the work W And the base resin portion 27a is formed on the work W (see Fig. 17). That is, most of the granular resin 27 of the predetermined supply amount is sprinkled in the predetermined area of the work W.

Then, in the resin supplying section 12A, the second supplying step is a step of supplying the remaining amount (for example, 10%) obtained by subtracting the first resin feeding amount of the granular resin 27 to the work W minus the first resin feeding amount, It is supplied as drop. In this second supplying step, the granular resin 27 is fed and supplied to the work W from the tip end of the resin dropping section 32A without moving the stage 31A, Thereby forming a resin portion 27b (see Fig. 18).

In this manner, after the granular resin 27 is supplied in a specified amount onto the work W, the stage 31A is moved to a predetermined position, and again the granular resin 27 is supplied to the weight sensor 57 And the weight of the work W is measured. The difference between this measured value and the previous measured value is the supply amount of the granular resin 27 actually supplied onto the work W. On the basis of this supply amount, when the amount is still insufficient, the remaining granular resin 27 is supplied precisely. Therefore, in the resin supplying section 12A, the granular resin 27 can be reliably supplied to the workpiece W at a desired supply amount at all times. Therefore, according to the resin-sealing apparatus 1 having the resin supply portion 12A of the present embodiment, defective molding of a molded product due to unfilled or the like can be reduced.

(Embodiment 3)

In the first embodiment, the upper mold and the lower mold are brought close to each other with respect to the work placed on the lower mold, so that the upper mold is brought into contact with the used resin portion and the molten resin is spread over the base resin portion to fill the cavity . Thus, even when the surface of the base resin portion has irregularities, the resin melted from the used resin portion can flow on the surface of the base resin portion so as to fill the irregularities even if the surface of the base resin portion is not uniform. In this embodiment, a case will be described in which the surface of the base resin portion is evenly trimmed by using a blade in order to further reduce the unevenness of the surface of the base resin portion. In addition, the description overlapping with the first embodiment may be omitted.

Fig. 19 shows the blade 58 in the present embodiment. The resin supply portion 12 has such a blade 58 and is used to evenly trim the granular resin 27 supplied to the work W. The blade 58 is formed by bending a part of the rod-shaped plate member. Concretely, the blade 58 is provided with a parallel portion 58a which is parallel to the supply surface of the work W to which the resin is supplied, and a curved portion 58b which rises from the central portion of the parallel portion 58a.

For example, the granular resin 27 is fed and supplied to the work W from the resin feed portion 32A without moving the stage 31A as in the second feeding step in the above-described embodiment, The granular resin 27 supplied on the work W can be uniformly formed by the blade 58 rotated by the rotary shaft 59 in the resin supplying portion 12 after the granular resin 27 is supplied in a high- have. That is, the base resin portion 27a is uniformly arranged in the parallel portion 58a, and the used resin portion 27b is maintained in the bent portion 58b.

In this way, the surface of the portion corresponding to the basic resin portion 27a can be made even and the shape of the used resin portion 27b can be formed. Therefore, the surface of the portion corresponding to the basic resin portion 27a can be made to flow molten resin from the used resin portion 27b to the surface of the resin portion 27b without any unevenness. Accordingly, it is possible to reduce the number of air pockets to a minimum, thereby reducing the defective molding such as unfilled.

The blade 58A is not limited to the blade 58, but may be a blade 58A as shown in Fig. The blade 58A is formed by cutting a part of the bar-shaped plate member. Concretely, the blade 58A is tilted (angle?) By about several degrees with respect to the supply surface of the work W to which the resin is supplied so as to rise to the rotary shaft 59 side.

For example, after the process described with reference to Fig. 5, the granular resin 27 supplied on the work W is made even by the blade 58A rotated by the rotating shaft 59 in the resin supply unit 12. [ That is, the granular resin 27 is uniformly arranged on the work W so as to have a conical shape. Therefore, the molten resin can be made to flow from the top of the cone to the even surface at the time of molding. Therefore, it is possible to reduce the defective molding such as unfilled by the air pocket while flowing the void from the center toward the outside.

(Fourth Embodiment)

In the first embodiment, the case where the processing is performed in the preheating section and the cooling section while the resin is deposited on the work has been described. In this embodiment, a case is described in which the resin deposited on a work is shaped and processed in the preheating section and the cooling section.

As shown in Fig. 21, the preheating section 16A includes a preheating top mold 61 and a preheating lower mold 62, which are built in a preheating heater (not shown) And has a box body surrounding the upper mold 61 and the lower mold 62. [ The preheating portion 16A aligns the recessed portion 61a formed in the upper mold 61 with the used resin portion 27b made of the granular resin 27 and applies the resin to the work W mounted on the lower mold 62, The upper mold 61 and the lower mold 62 are brought close to each other so that the upper mold 61 is brought into contact with (pressed) from the side of the used resin portion 27b to melt the granular resin 27.

The recessed portion 61a of the preheating portion 16A can leave the secondary resin portion 27b and directly heat the entire electronic component from the upper side without stressing the central electronic component. Further, the base resin portion 27a can be flat-shaped by the mold surface 61b of the preheating portion 16A. According to such a preheating portion 16A, it is possible to heat quickly and reduce the thickness to facilitate heating. Further, the air between the granular resin 27 can be extruded and reduced by the molten resin.

The concave portion 61a and the mold surface 61b of the upper mold 61 may be subjected to a Teflon (registered trademark) process or a process of adsorbing the mold release film to prevent the resin from sticking to the mold .

22, the cooling section 17A includes a cooling upper mold 63 and a cooling lower mold 64, which are built in a cooling cooler (not shown) and arranged so as to be in contact with each other, And a box body surrounding the upper mold 63 and the lower mold 64 for heightening. The cooling section 17A aligns the recessed portion 63a formed in the upper mold 63 with the used resin portion 27b formed of the granular resin 27 and applies a heat treatment to the work W mounted on the lower mold 64, The upper mold 63 and the lower mold 64 are brought close to each other so that the upper mold 63 is brought into contact with (pressed) from the side of the used resin portion 27b to cool the work W. The concave portion 63a of the cooling upper mold 63 and the concave portion 61a of the preheating upper mold 61 have the same shape.

The concave portion 63a of the cooling portion 17A can be cooled quickly by directly cooling the upper portion of the used resin portion 27b while maintaining the shape of the pre-heated portion 27b heated by the preheating portion 16A. Therefore, it is possible to suppress shortening of the gel time until molding.

While the present invention has been described in detail with reference to the embodiment thereof, it is needless to say that the present invention is not limited to the above embodiment, and various modifications are possible without departing from the gist of the present invention.

For example, in the first embodiment, the case where the first and second resin delivering operations are performed by the lighting method using the resin delivering section has been described. However, the present invention is not limited thereto, and the first and second resin discharging operations may be performed by an opening method using a holder and a shutter, or a diffusion method using a shooter and a diffusion body. That is, in the resin supplying section, if the base resin section made of the granular resin is formed on the workpiece by the first resin feeding and the used resin section made of the granular resin can be formed on the base resin section by the second resin delivery , The method of resin release is not considered. Therefore, the first and second resin deliveries may be combined with a lighting method, an open method, and a diffusion method.

Even in such a case, defective molding of the molded article can be reduced in the same way. However, in the case of using the diffusion method or the open method, two sets of members such as a shooter and a holder are required to match the first and second resin dropping areas (that is, the area of the basic resin part and the area of the used resin part) do. In this respect, in the lighting method, even when the first and second resin discharging operations are performed, one resin discharging portion can be used, so that the number of components of the resin sealing apparatus (resin supplying portion) can be suppressed.

For example, in the first embodiment, the second resin discharge for forming the used resin portion is applied to one portion (central portion) of the portion to be fed with respect to the portion to be fed (workpiece) As shown in Fig. However, the present invention is not limited thereto, and the second resin may be discharged at a plurality of locations (for example, at two locations in the longitudinal direction of the portion to be fed) with respect to a rectangular work in plan view.

It is conceivable that the resin may not even reach the corner of the portion to be fed at the time of molding even if the second feeding of the resin is performed at one place of the central portion in a rectangular shape (in particular, a monolithic shape) viewed from the plane. On the other hand, by performing the second resin discharge at a plurality of locations, the resin can be evenly distributed from the top to the corner of the rectangular-shaped portion to be fed in plan view. Therefore, defective molding of a molded product such as unfilled can be reduced.

For example, in the first embodiment, the case where the shape viewed from the plane of the portion to be fed (work) has a rectangular shape has been described. However, the present invention is not limited to this, and may be a polygonal shape including a rectangular shape as viewed from a plane, or a circular shape. Even if a part to be fed is different in shape from a plane, if the first resin part is formed by the first resin feeding and the second resin part is formed by the second resin feeding, the defective molding of the molded article can be reduced likewise .

For example, in the first embodiment, a case where a substrate on which an electronic component is mounted is used as a part to be supplied (work). However, the present invention is not limited thereto, and a wafer, a carrier stage, a single-roll type film or a roll-type film may be applied as a fed portion. Even if the object to be supplied is different, if the first resin discharge is performed to form the basic resin portion and the second resin discharge is performed to form the second resin portion, the defective molding of the molded article can be similarly reduced.

For example, in the first embodiment, all of the electronic components on the heat-resistant side among the plurality of electronic components mounted in the form of a matrix on the substrate are covered with the granular resin, and the electronic components on the outside- The case of covering with the resin has been described. The present invention is not limited to this, and all the electronic parts on the outside heat side may be covered with the granular resin. This is because all the electronic parts are finally covered with the granular resin as a molded product.

For example, in the first embodiment, the case where the preheating section and the cooling section are provided in the preliminary processing section has been described. The present invention is not limited to this, and a cooling unit may not be provided in the preliminary processing unit. Thus, by preheating the work, it is possible to reduce the temperature at which the temperature should be raised to the molding temperature when the resin sealing portion is formed by heating and curing the granular resin in the cavity of the press portion. Further, by preheating the work, the whole work is heated, so that heat conduction is easy at the time of molding. Therefore, in the processing performed by the resin-sealing apparatus, the processing time by the press section that takes the longest time can be shortened, and the manufacturing cost of the molded article can be reduced.

For example, various types of patterns as shown in Figs. 23 (a) to 23 (f) can be considered as the lighting for discharging the granular resin from the resin discharge portion into the work surface. Figs. 23 (a) to 23 (c) show a pattern for a rectangular work in plan view, and Figs. 23 (d) to 23 (f) show patterns for circular work in plan view. 23 (a) and 23 (d) are patterns obtained by repeating one-directional scanning and scanning the entire surface. 23 (b) and 23 (e) are patterns in which the entire surface is scanned so as to concentrically form a scan similar to the work shape at the center of the work. 23 (c) and 23 (f) are patterns obtained by scanning the entire surface so as to form a whirl with the center of the work as the center so as to conform to the work shape.

23 (b), 23 (c), 23 (e), and 23 (f), when it is desired to uniformly supply a predetermined amount of the granular resin into the work surface, for example, The granular resin may be supplied to the outer peripheral portion at a constant delivery rate and the constant scanning rate and the granular resin may be supplied at the central portion by adjusting the delivery amount and the scanning speed with respect to the central portion. 23 (b), 23 (c), 23 (e), and 23 (f), in a case where it is desired to supply a used resin portion in the central portion of the work, The granular resin may be supplied to the outer peripheral portion at a constant delivery rate and at a constant scanning rate and the granular resin may be supplied at the central portion by adjusting the delivery amount and the scanning speed with respect to the central portion.

For example, as a work to be applied to the resin-sealing apparatus according to the present invention, various kinds of work (shown by broken lines shows an outer shape after sealing) as shown in Figs. 24 (a) to 24 (g) can be considered. 24 (a) is a work in which a plurality of bumps are mounted on a wafer. 24 (b) is a work in which a plurality of semiconductor chips or a laminated chip of TSV (Through Silicon Via) is mounted on a wafer. 24 (c) is a work in which a plurality of water-receiving chips (semiconductor chips) are mounted on a wafer (substrate). 24 (d) is a work in which a plurality of MEMS (Micro Electro Mechanical Systems) chips are mounted on a wafer. 24 (e) is a work in which a plurality of semiconductor chips and bumps or vias are mounted on an interposer substrate. 24 (f) is a work in which a plurality of laminated chips and vias are mounted on a substrate. Fig. 24 (g) is a work in which a plurality of semiconductor chips are fixed to a carrier (e.g., stainless steel, glass, or wafer) with a release sheet such as a heat peeling sheet interposed therebetween. The resin may be supplied to these in a shape similar to that of the package shown by the broken line in the same drawing.

For example, as the operation control system of the resin supply unit, a configuration as shown in Fig. 25 can be considered. In this configuration, a resin sealing device including a PC (Personal Computer) having an input section, a control section, a transmitting section and a display section, and a receiver section, a control section, a storage section, and a table (stage) driver is communicably connected. A drive control pattern is created on the PC side for each pattern ID, and is transmitted to the resin sealing apparatus and stored. On the resin sealing apparatus side, a pattern ID is set for each product (work), and the pattern ID is read to supply the resin so as to be a desired pattern (actual supply pattern). Since the speed is not stable at the time of starting the table, a dummy pattern may be included in the drive control pattern, and the resin may be supplied after the movement speed of the table becomes constant.

For example, in the first embodiment, the case where the resin receiving section is fixed and the workpiece mounting section is moved (scanned) has been described. However, the present invention is not limited to this case, and the case where the resin delivery portion is moved (scanned) and the workpiece mounting portion is fixed may be used. In this case, when the granular resin is supplied with good accuracy, the resin dropping portion and the movable portion around the resin dropping portion are enlarged, and the resin dropping portion is scanned in the XY directions with respect to the workpiece loading portion, .

Hereinafter, a description will be given with reference to Fig. 26 of a technique capable of supplying granular resin with good accuracy even when the workpiece mounting portion is fixed and the resin discharge portion is moved. Fig. 26 is a view for explaining a modification of the resin supply unit 12 (hereinafter referred to as a resin supply unit 12B). When the granular resin is dropped from the tip of the trough 102 (the position indicated by the broken line) to the work W, the stage 110 (workpiece mounting portion) is disposed immediately below the tip of the trough 102.

The resin supply section 12B includes a movable section 100 for holding and moving the granular resin in an amount equal to or more than the amount required for at least one molding of the mold and delivering the granular resin to the work W and supplying the granular resin to the movable section And a fixed first storage portion 101 (fixed portion) for supplying the first storage portion 101 to the first storage portion 101. [ The resin supply portion 12B is provided on the table 110 (workpiece mounting portion) and measures the weight of the granular resin to be dropped onto the workpiece W in a state where the workpiece W is mounted, in other words, And a weighing machine 111 for measuring the amount of unloading.

The moving part 100 includes a trough 102 (resin dropping part) for dropping the granular resin from the tip end to the work W and a trough 102 for feeding the granular resin to the tip end side of the trough 102 by vibrating the trough 102 An electronic feeder 103 and a second storage section 104 (resin holding section) for temporarily holding (holding) a granulated resin to be sent to the trough 102 at least for one molding of the work W . The movable part 100 is suspended by the driving mechanism 105 and is movable in the X, Y, and Z directions. Further, when the total amount of the granular resin held by measuring the weight or the volume of the granular resin to be held is smaller than the amount required for one molding of the mold, the movable part 100 moves to the fixing part side to receive the granular resin . The amount of the granular resin stored in the second storage portion 104 may be smaller than one time of molding the work W. In this case, partial supply to the work W is repeated, (W) can be performed.

The first storage portion 101 is provided with a hopper 107 for storing a granular resin which is supplemented by an operator and used for forming a plurality of workpieces and the movable portion 100 is moved to a predetermined position close to the first storage portion 101 The granular resin is supplied to the second storage portion 104. [0064]

The resin supply section 12B can reduce the weight and size of the movable section 100 including the trough 102 and the periphery thereof so that the movement of the trough 102 is smooth and the drive mechanism 105 can be downsized. In addition, it is possible to correct the error between the delivery amount measured by the weight system 111 and the delivery scheduled amount. These are connected to reducing defective molding such as uncharged.

Next, the resin supplying step (resin delivering step) using the resin supplying part 12B will be described. In this resin supplying step, for example, by using a flat trough 102 having a flat bottom surface, a uniform amount of granular resin is dropped in a widthwise direction while being moved at a constant speed, The granular resin can be dropped.

Specifically, the granular resin is fed back and forth in the longitudinal direction of the trough 102 while the granular resin is being fed, thereby causing the granular resin to be dropped on the work W to a width corresponding to the width of the trough 102, The granular resin is supplied to the entire surface of the work by repeating the operation of moving the movable part 100 to a predetermined dropping start position capable of dropping to the area adjacent to the dropped area first (see FIG. 23 (a) ).

As a result, the granular resin is fed to the strip-shaped region of one row by one discharging operation, so that the granular resin is uniformly supplied to the region where the strip-shaped regions are arranged. In this case, the supply amount per one line of the area is measured by the weighing machine 111, and the amount of the discharge in the next area is adjusted so as to correct the error with the predetermined amount, The error can be reduced as much as possible.

Further, a single strip-shaped area formed by one discharging operation may be partially or wholly overlapped. For example, when the granular resin is dropped between the semiconductor chips mounted in a matrix on the work W, the strip-shaped regions are dropped so as to form repeatedly, whereby compared with the case where the granular resin is dropped onto the chip You can also increase the supply. Therefore, it is possible to reduce the unevenness of the upper surface of the granular resin dropped on the work W, thereby reducing the resin flow in the compression molding, thereby improving the molding quality. Also, by supplying the granular resin so that the strip-shaped regions overlap, it is possible to supply the same thickness or change the thickness partially by repeating the discharging operation while shifting the strip-shaped region by a half of the width.

According to such a constitution, only the movable part 100 holding a small amount of granular resin is driven, thereby preventing the apparatus from becoming large in size and preventing scattering from the granular resin on the work W, It is possible to perform the discharging operation without giving the discharging operation. In addition, even if the partially dropped granular resin is scattered, the drive mechanism 105 disposed above the trough 102 and the second storage portion 104 is not soiled, and the maintenance property can be improved.

Further, it is preferable that the troughs 102 having different widths can be replaced with each other depending on the size of the workpiece W. In this case, a narrow trough 102 is used in the large work W while a narrow trough 102 is used in the small work W to reduce the number of the drop operations when the work W becomes large It is possible to shorten the time required for the dropping, or make it easier to drop the drop according to the shape to be dropped, and to cope with the work W accordingly.

The resin supply unit 12B may be used to supply the resin as described in the first embodiment. Concretely speaking, by the lighting in which the granular resin is continuously fed onto the work W from the tip of the trough 102 while relatively moving the trough 102 relative to the table 110 by the driving mechanism 105, A resin part may be formed, and a used resin part may be formed at the center part.

Claims

A resin supply portion for feeding the granular resin to the supplied portion for feeding,
A conveying hand for conveying the to-be-fed section, and a press section having a pair of molds in which a cavity is formed,
The resin supply portion
A trough for discharging the granular resin to the supply portion,
A portion to be fed, which is mounted directly below the trough,
A driving mechanism for moving the trough,
A first storage section for storing the granular resin,
Wherein the granulated resin is temporarily stored in the first storage portion when the granulated resin is smaller than the first storage portion and is moved to a predetermined position close to the first storage portion to temporarily store the granulated resin from the first storage portion, A second storage section for supplying the resin,
And a weighing machine that is provided in the portion to be fed and measures the amount of the granulated resin to be fed in a state in which the portion to be fed is mounted,
Wherein the resin supply portion is configured such that the first storage portion is fixed and the trough is moved by the driving mechanism together with the second storage portion and the target portion to be fed is fixed and the trough is moved to form a desired pattern Supplying the granular resin to the portion to be fed, wherein the carrying hand carries and feeds the portion to be fed supplied with the granular resin into the pair of the molds,
Wherein the press section clamps the supplied portion fed with the granular resin with the pair of molds and thermally cures the granular resin in the cavity to perform resin sealing.

The method according to claim 1,
The basic resin portion is formed by lighting the continuous portion of the granular resin to be fed onto the portion to be fed from the trough while moving the portion to be fed portion relative to the trough by the drive mechanism, And resin supply is performed so as to form a used resin portion higher in height than the base resin portion.

The method according to claim 1,
Feeding the resin to the entire surface of the portion to be fed by repeating an operation of feeding the resin into the strip portion in a strip shape when the trough is moved back and forth in the longitudinal direction of the trough, Device.

The method of claim 3,
Wherein the resin supply operation is repeated while the supply amount in the previous drop operation is measured by the weight scale and the supply amount in the next drop operation is adjusted so as to correct the error of the predetermined supply amount.

5. The method according to any one of claims 1 to 4,
And a preheating unit provided in a conveyance path of the portion to be fed from the resin supply unit to the press unit and preheating the object to be fed supplied with the granular resin to a temperature lower than the molding temperature. .

6. The method of claim 5,
And a cooling section which is provided in the conveying path of the portion to be fed from the preheating section to the press section and which cools the preheated fed section.

A resin feeding device for feeding granular resin to a fed portion to feed the same,
A trough for discharging the granular resin to the supply portion,
A portion to be fed, which is mounted directly below the trough,
A driving mechanism for moving the trough,
A first storage section for storing the granular resin,
Wherein the granulated resin is temporarily stored in the first storage portion when the granulated resin is smaller than the first storage portion and is moved to a predetermined position close to the first storage portion to temporarily store the granulated resin from the first storage portion, A second storage section for supplying the resin,
And a weighing machine which is installed in the part to be fed part and measures the amount of the granule resin to be discharged in a state in which the part to be fed is mounted,
The resin supply portion is configured such that the first storage portion is fixed and the trough is moved by the drive mechanism together with the second storage portion and the target portion to be fed is fixed and the trough is moved to form a desired pattern And supplies the granular resin to the portion to be fed.

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