JP7468906B2 - Resin sealing equipment - Google Patents

Description

The present invention relates to a resin sealing device that preheats a workpiece having electronic components mounted on a plate-shaped member and supplies it to a sealing die.

When a workpiece having semiconductor chips, electronic components, etc. mounted on a plate-shaped member is sealed with a thermosetting resin, if it is carried into the sealing die at room temperature, the sealing die will be cooled by the workpiece, and it will take time to heat up to the molding temperature. There is also a risk that the workpiece will suddenly stretch or thermally deform, causing it to become uneven. There is also a risk that burring, which deforms the guide holes when the guide pins are inserted into the board guide holes of the strip board to transfer it from the loader hand to the die, will occur, or that wrinkles or undulations will occur in the board. For this reason, the workpiece is preheated before being carried into the sealing die.

For example, in a resin sealing device in which a workpiece is held in an upper die and resin is supplied to a cavity in a lower die for compression molding, a loader mechanism that transports the workpiece with the mounting surface of a semiconductor chip or the like facing downwards preheats the workpiece until it is immediately before it is handed over to the sealing die. Specifically, a device has been proposed in which a heater provided in the transport mechanism heats the pre-sealed substrate until it is handed over from the transfer table to the transfer mechanism, and a heater provided in the transfer mechanism heats the pre-sealed substrate from when it is received from the transport mechanism until it is handed over to the mold surface of the upper die (see Patent Document 1: JP 2012-33584 A).

JP 2012-33584 A

However, if the loader hand is constantly heated to preheat the workpiece between when the workpiece is supplied and when it is handed over to the upper die, as in Patent Document 1, positioning will be difficult due to thermal expansion caused by temperature fluctuations in the loader hand, and there is a risk that the workpiece may be damaged when attaching or detaching the workpiece using the loader hand, making the work difficult to perform. Therefore, a preheating mechanism that does not heat the loader hand as much as possible is desirable.

One possible preheat mechanism for this type of transfer molding is to provide a preheat unit in front of where the loader hand enters the sealing mold. With this type of preheat unit, when the type of workpiece changes, the workpiece holder of the preheat unit must be replaced. This preheat unit cannot be moved to the press section on the front side of the device, and is located behind the mechanism that reciprocates the loader when viewed from the rear side of the device, making it difficult to access from outside the device and making it difficult to replace replacement parts such as the workpiece holder.

The present invention was made in consideration of the above circumstances, and aims to provide a resin sealing device that can preheat the work before loading it into the sealing mold without impairing the function of the loader hand, and that can easily change the type of work.

The sealing mold has an upper mold that adsorbs and holds the work before molding, and a lower mold that has a cavity recess into which resin is supplied; a loader mechanism that is mounted with a loader hand that holds the work and moves back and forth in the X-axis direction while allowing the loader hand to advance and retreat toward the sealing mold in the Y-axis direction perpendicular to the X-axis direction; and a preheat mechanism that is provided in front of where the loader hand enters the sealing mold in the Y-axis direction from the loader mechanism, and holds the work handed over from the load hand and preheats it to a predetermined temperature, and the preheat mechanism is provided so that it can be pulled out in the Y-axis direction away from the sealing mold.
As a result, even if the type of workpiece is changed, the preheat mechanism can be pulled out in the Y-axis direction away from the sealing mold, intersecting the X-axis direction in which the loader mechanism reciprocates, making it easy to access from outside the device and to easily change the type.

The preheating mechanism may be configured such that a workpiece holding section for suction-holding the workpiece before molding is detachably attached to a heater body having a built-in heater.
This makes it possible to easily change the type of workpiece by simply replacing the workpiece holder, which is part of the preheating mechanism.

The workpiece holding section may be provided with a first suction circuit that suction-holds at least a central area of the workpiece, and a second suction circuit that suction-holds an area outside the central area of the workpiece.
As a result, when the workpiece is adsorbed and held by the workpiece holding section of the preheating mechanism, the central area of the workpiece is heated while being adsorbed, causing the workpiece to stretch, and then the outer area is adsorbed and held, so that even if the workpiece stretches between the central area and the outer area, wrinkles will not occur.

The preheating mechanism may be provided at the same height as the upper mold surface when the workpiece holding portion is opened.
As a result, the distance over which the loader hand receives the preheated, unformed workpiece from the preheat mechanism is the same as the distance over which the loader hand transfers the preheated, unformed workpiece to the upper mold surface, so that the workpiece can be supplied efficiently without impeding the operation of the loader hand which transports the workpiece into the sealing mold and without any wasted transfer operation.

The preheating mechanism may be fixed to each of the plurality of sealing molds on the front side in the Y axis direction where the loader hand enters.
As a result, the loader mechanism transfers the unmolded workpiece to the preheating mechanism for each sealing mold, eliminating the need for a single preheating mechanism to preheat the workpieces to be supplied to all of the sealing molds. This ensures that there is sufficient time for preheating, and prevents defects in the workpieces caused by sudden heating.

The loader hand may hold the workpiece before molding and transfer it to the preheating mechanism, then enter the opened sealing mold to receive and remove the molded product, and then enter the sealing mold again to transfer the workpiece that has completed preheating, and repeat the operation of removing the molded product.
This allows the pre-heating of the workpiece before molding and the removal of the molded product from the sealing mold to be carried out in parallel, thereby improving work efficiency.

The loader hand is provided with a supply hand for holding a workpiece before molding and a storage hand for holding a molded product, which can be raised and lowered.
This makes it possible to supply the workpiece before molding to the sealing mold and remove the molded product by the same forward and backward movement of the loader hand.

The present invention provides a resin sealing device that can preheat the work before loading it into the sealing mold without impairing the function of the loader hand, and can easily change the type of work.

FIG. 1 is a layout configuration diagram showing an example of a resin sealing apparatus. 2 is a perspective view of a preheating mechanism of the resin sealing apparatus of FIG. 1; FIG. FIG. 3 is an enlarged explanatory view of the preheating mechanism of FIG. 2 . 11A to 11C are explanatory views showing an operation of carrying a workpiece into a press unit of the resin sealing apparatus and an operation of carrying a molded product out of the press unit; 13A to 13C are explanatory diagrams of the operation of loading a workpiece and unloading a molded product by a loader hand according to another example.

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a layout diagram (plan view) showing an example of a resin sealing device 1 according to an embodiment of the present invention. For ease of explanation, the left-right direction of the resin sealing device 1 may be described as the X-axis direction, the front-rear direction as the Y-axis direction, and the up-down direction as the Z-axis direction using arrows in the figure. In addition, in all the figures used to explain each embodiment, components having the same function are given the same reference numerals, and repeated explanations may be omitted.

The resin sealing apparatus 1 of this embodiment is an example of a compression molding apparatus that holds the workpiece W (hereinafter simply referred to as "workpiece W") before molding in an upper mold, covers the lower mold surface including the cavity provided in the lower mold with a film (release film) F, supplies resin R, clamps the upper and lower molds, and immerses the workpiece W in the molten resin R to seal it with the resin.
First, the workpiece W has a configuration in which, for example, a plurality of electronic components are mounted in a matrix on a strip substrate. More specifically, examples of the strip substrate include a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, a plate-shaped member such as a wafer (a strip-shaped workpiece). Examples of the electronic components include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, a spacer, and the like.

Examples of the workpiece W with electronic components mounted on a strip substrate include workpieces mounted by flip chip mounting, wire bonding mounting, etc. Alternatively, in the case of a product in which a substrate (glass or metal carrier plate) is peeled off from a molded product Wp (workpiece W after molding) after resin sealing, a workpiece W with electronic components attached using a thermally peelable adhesive tape or an ultraviolet-curing resin that hardens when exposed to ultraviolet light is used.

On the other hand, an example of resin R is a granular thermosetting resin (e.g., an epoxy resin containing a filler). Note that the resin is not limited to the above state, and may be in other states (shapes), such as liquid, powder, cylinder, plate, sheet, etc.

As an example of the film F, a film material having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc., can be preferably used. As this film F, for example, a strip-shaped film corresponding to the workpiece W, which is a strip substrate, can be used.

Next, the layout configuration of the resin sealing apparatus 1 according to this embodiment will be described. As shown in FIG. 1, the resin sealing apparatus 1 mainly comprises a work processing unit 1A that mainly supplies the work W and stores the molded product Wp, a press unit 1B (press section) that resin seals the work W, and a dispensing unit 1C that mainly supplies the film F and resin R and stores (disposes of) the used film Fd after resin molding. Note that the resin sealing apparatus may be equipped with the work processing unit, press unit, and dispensing unit as an integrated unit.

In this embodiment, units such as a work processing unit 1A, a press unit 1B, and a dispensing unit 1C are assembled by connecting them side by side. As an example, the work processing unit 1A, multiple press units 1B, and a dispensing unit 1C are arranged side by side in that order from left to right in the X-axis direction. An arbitrary number of guide rails 1D (see FIG. 2) are laid in the X-axis direction between each unit. In addition, a first loader 3 that transports the work W and molded product Wp and a second loader 4 that transports the film F and resin R are provided so as to be able to reciprocate in the X-axis direction between predetermined units along the common guide rails 1D (see FIG. 2).

The press unit 1B is provided with a sealing mold 2 having an upper mold 2a that holds the workpiece W by suction and a lower mold 2b having a cavity recess 2c to which the resin R is supplied (see FIG. 4(b)). In this embodiment, two cavities are provided in the lower mold and two workpieces W are supplied to perform one resin sealing, and two molded products Wp are compressed and molded at the same time. The configuration shown in FIG. 1 is an example in which three press units 1B are installed, but only one press unit 1B may be installed, or two or four or more press units 1B may be installed in a linked configuration. It is also possible to install, for example, a unit that supplies resin R in a form different from that of the dispense unit 1C, or a unit that supplies a member to be resin sealed together with the workpiece W in the mold.

Next, the work processing unit 1A has multiple magazines 1a arranged therein. Workpieces W are taken out of the magazines 1a and placed on the supply rails 1b. The supply rails 1b guide the workpieces W in the Y-axis direction while supporting them laterally, avoiding the mounting positions of electronic components. The supply rails 1b are arranged in two rows in the X-axis direction so that two workpieces W can be placed side by side. When the workpieces W are supplied one by one, the supply rails 1b may have a movement mechanism (not shown) that can move in the X-axis direction. The supply pickup 1c simultaneously holds two workpieces W side by side on the two rows of supply rails 1b and transports them to the supply position.

The first storage pickup 1d is configured to be movable in the X-axis direction (left and right direction). This allows it to hold the molded product Wp delivered from the first loader 3 and transport it onto the second storage pickup 1e. The second storage pickup 1e simultaneously holds two molded products Wp delivered from the first storage pickup 1d and transports them to a storage rail (not shown), where the molded products Wp are stored in the magazine 1a that is stacked on top of the magazine 1a.

As shown in FIG. 1, the first loader 3 (loader mechanism) is equipped with a supply hand 3A that holds two workpieces W as a loader hand and a storage hand 3B that holds two molded products Wp, each of which can be raised and lowered. Various lifting mechanisms are used for the supply hand 3A and the storage hand 3B, but for example, they are provided so that they can be raised and lowered by an air cylinder. Instead of an air cylinder, they may be raised and lowered by a motor drive or a solenoid drive. This allows the supply of the workpiece W to the sealing mold 2 and the removal of the molded product Wp to be realized by the same forward and backward movement of the hand. The first holding parts 3a and 3b that hold the workpieces W and the second holding parts 3c and 3d that hold the molded products Wp are arranged in two rows and two columns corresponding to the cavity layout of the lower mold 2b. This allows the supply of the workpiece W by the supply hand 3A and the removal of the molded product Wp by the storage hand 3B to be realized in a single forward and backward movement in accordance with the mold layout of the press unit 1B.

The supply hand 3A holds the workpiece W with the electronic component mounting surface facing downward, and the storage hand 3B holds the molded product Wp with the package portion facing downward. The first loader 3 reciprocates in the X-axis direction in FIG. 1 while carrying the supply hand 3A and the storage hand 3B, and the supply hand 3A and the storage hand 3B are arranged to be able to advance and retreat in the Y-axis direction perpendicular to the X-axis direction toward the sealing mold 2 (from the rear side to the front side of the press unit 1B in FIG. 1).

A preheating mechanism 5 is provided on the Y-axis direction front side where the supply hand 3A and the storage hand 3B enter the sealing mold 2 from the first loader 3. The preheating mechanism 5 holds the workpiece W before it is carried into the mold and preheats it to a predetermined temperature. For example, if the molding temperature of the sealing mold 2 is 160° C. to 180° C., the preheating mechanism 5 preheats the workpiece W to 155° C. to 185° C. In this embodiment, the preheating mechanism 5 is fixedly provided for each press unit 1B.
As a result, the first loader 3 transfers the unmolded workpiece W to the preheating mechanism 5 for each sealing mold 2, so that a single preheating mechanism 5 does not have to preheat the workpieces W supplied to all of the sealing molds 2. This ensures that there is sufficient time for preheating, and prevents defects in the workpiece W caused by sudden heating.
The preheat mechanism 5 is provided at the same height as the upper mold surface when a workpiece holding portion 5c (described later) is opened.
As a result, the distance over which the preheated, unformed workpiece W is received by the supply hand 3 from the preheat mechanism 5 is the same as the distance over which the preheated, unformed workpiece W is transferred from the supply hand 3 to the upper mold surface, so that the workpiece W can be supplied efficiently without impeding the operation of the supply hand 3 which transports the workpiece W into the sealing mold 2 and without any waste in the transfer operation.
The preheat mechanism 5 does not have to be fixed to each press unit 1B, but may be provided movable in the X-axis and Y-axis directions, for example.

3, the preheat mechanism 5 has a heater body 5b containing a heater 5a and a workpiece holder 5c that suctions and holds the workpiece W. This allows easy product change by simply replacing the workpiece holder 5c, which is part of the preheat mechanism 5.
As the heater 5a, for example, an electric heating wire heater, a far infrared heater, etc. The workpiece holding portion 5c is provided with a plurality of guide pins (not shown) for guiding the outer shape of the workpiece W.

The workpiece holding section 5c is provided with a first suction circuit 5d for suction-holding at least the central area of the workpiece W in the longitudinal direction, and a second suction circuit 5e for suction-holding an area outside the central area of the workpiece W. The suction holes constituting the first suction circuit 5d and the second suction circuit 5e are arranged in a plurality of locations on the suction surface. The workpiece suction surface of the workpiece holding section 5c is provided with a pair of holding claws 5f on both sides that can lock the outer edge of the workpiece W and can be opened and closed at multiple locations. The pair of holding claws 5f are open on both sides before the workpiece W is suctioned, and close from both sides toward the center when the workpiece W is suctioned. The tips of the holding claws 5f are bent into an L-shape to prevent the workpiece W suctioned and held by the workpiece holding section 5c from falling.

3, the suction operation of the workpiece W to the workpiece holding portion 5c will be described. When the workpiece W is pressed against the workpiece holding portion 5c by the supply hand 3A, suction is started from the first suction circuit 5d to suction-hold the central area of the workpiece W (see pre-molded substrate W1 in FIG. 3). Then, suction is started from the second suction circuit 5e to suction-hold the outer area of the workpiece W from the central area (see pre-molded substrate W2 in FIG. 3).
As a result, when the workpiece W is adsorbed and held by the workpiece holding portion 5c of the preheat mechanism 5, the central area of the workpiece W in the longitudinal direction is heated while being adsorbed, causing the workpiece W to stretch, and then the outer area is adsorbed and held, so that even if the workpiece W stretches between the central area and the outer area, wrinkles will not occur.
On the other hand, if suction is started simultaneously from the first suction circuit 5d and the second suction circuit 5e, the workpiece W will be stretched due to preheating and held in a wavy state, which is likely to cause wrinkles, which is not preferable (see Figure 3: pre-molded substrate W3).
Furthermore, since the supply hand 3A only delivers the workpiece W to the workpiece holding portion 5c, the hand itself can be prevented from being heated and causing changes in dimensions as much as possible.

The first loader 3 holds the workpiece W in the supply hand 3A and transfers it to the preheat mechanism 5, then enters the opened sealing mold 2 to receive the molded product Wp in the storage hand 3B and removes it, and the supply hand 3A receives the workpiece W that has been preheated by the preheat mechanism 5, enters the sealing mold 2 again to transfer it, and then retreats from the sealing mold 2 to remove the molded product Wp that the storage hand 3B has received, repeating this operation.
This allows the preheating operation of the workpiece W and the removal operation of the molded product Wp from the sealing mold 2 to be performed in parallel, thereby improving work efficiency.

As shown in FIG. 2, each preheat mechanism 5 is provided so as to be withdrawn in a direction away from the sealing die 2 in the Y-axis direction intersecting the X-axis direction along which the first loader 3 reciprocates. Specifically, the heater body 5b incorporating the heater 5a is suspended and supported by a slide member 5g that is movable along the rail portion 6 via a suspension rod 5h. The suspension rod 5h is provided to pass through a long hole 6a provided in the bottom of the rail portion 6. A handle 5j is connected to the slide member 5g via a connecting rod 5i. When the handle 5j is gripped and pulled from the rear side of the device (the rear side in the Y-axis direction from the sealing die 2), the slide member 5g moves along the rail portion 6 in the Y-axis direction, and can be withdrawn across the top of the guide rail 1D along which the first loader 3 and the second loader 4 move, which are laid in the X-axis direction. The handle 5j may have a locking mechanism for fixing the position of the slide member 5g relative to the rail portion 6.
As a result, even if the type of workpiece W is changed, the preheat mechanism 5 can be pulled out in the Y-axis direction away from the sealing mold 2, intersecting the X-axis direction in which the first loader 3 reciprocates, making it easy to access from outside the device and to easily change the type.

In FIG. 1, the dispensing unit 1C is a unit that supplies the film F and the mold resin R. In this embodiment, a conveying tool 7 is used as a jig for holding and conveying the film F and the resin R when conveying them to the sealing mold 2. The conveying tool 7 without holding the film F and the resin R is placed on the preparation table 8 and is appropriately cleaned. The conveying tool pickup 9 holds the conveying tool 7 and conveys it between a plurality of predetermined positions (tables). The conveying tool pickup 9 holds the conveying tool 7 placed on the preparation table 8 and conveys it to the film table 10 and the resin drop table 11. On the film table 10, the film F unwound from the film roll 12, in which the long film F is wound in a roll shape, is cut into strips of a predetermined length and held. The two films F cut into strips are adsorbed and held on the underside of the conveying tool 7 and placed on the resin drop table 11 provided on the side of the film table 10. The dispenser 13 pours resin R into a resin injection hole in the conveyor 7 placed on the resin dropping table 11, and places (drops) the resin R onto the exposed film F.

The second loader 4 is equipped with a third holding section 4A and a fourth holding section 4B. The third holding section 4A receives the transport tool 7 placed on the resin drop table 11 on its underside and transports it to a predetermined holding position of the lower die 2b, and transports the transport tool 7, which has been released from holding the film F and mold resin R, onto the aforementioned preparation table 8. The fourth holding section 4B holds the used film Fd remaining on the lower die 2b after the resin-sealed molded product Wp is removed from the sealing die 2, and transports it to a predetermined position (film disposer 16 described below) for disposal.

Here, the flow of the operation of carrying the workpiece W into the press unit 1B and the operation of carrying the formed product Wp out will be described with reference to FIG.
4(a) is a plan view of the first loader 3 and a schematic diagram of the sealing mold 2 in plan view. The sealing mold 2 is assumed to have previously sealed the workpiece W with resin. Therefore, the upper mold 2a adsorbs and holds the molded product Wp (see FIG. 4(b)). Two supply hands 3A are provided on the front side of the first loader 3 in the forward and backward direction (Y-axis direction), and two storage hands 3B are provided on the rear side. The arrangement of the supply hands 3A and storage hands 3B corresponds to the transfer position or receiving position of the sealing mold 2 (upper mold 2a). In addition, the alignment of the supply hands 3A and storage hands 3B with the preheat mechanism 5 or upper mold 2a is realized by the concave-convex fit of lock blocks (not shown).

In FIG. 4(b), the first loader 3 holds the workpiece W supplied to the supply hand 3A by the supply pickup 1c shown in FIG. 1, moves in the X-axis direction toward the rear of the specified press unit 1B, and moves the loader hand (supply hand 3A and storage hand 3B) in the Y-axis direction toward the sealing mold 2. Then, the supply hand 3A is stopped at a position directly below the preheat mechanism 5, and the supply hand 3A is raised to transfer the workpiece W to the workpiece holding section 5c.

When the workpiece W supported by the supply hand 3A is brought close to the workpiece holding section 5c, the first suction circuit 5d is operated to suck and hold the central area of the workpiece W as shown in FIG. 3, and then the second suction circuit 5e is operated to suck and hold the area outside the central area of the workpiece W. This prevents deformation such as wavy or wrinkled workpiece W caused by the workpiece W stretching after sucking multiple points in the longitudinal direction at once, and allows the workpiece W to be preheated by sucking and holding while maintaining flatness. After the supply hand 3A delivers the workpiece W to the preheat mechanism 5, it descends and the first loader 3 enters the sealing mold 2. The molded product Wp is sucked and held by the upper mold 2a of the opened sealing mold 2.

4(c), the first loader 3 stops once the storage hand 3B has advanced to a position directly below the upper die 2a. At this time, the supply hand 3A is in a position extending beyond the sealing mold 2. The storage hand 3B is then raised to receive the molded product Wp from the upper die 2a. Specifically, suction of the storage hand 3B is started, and suction of the upper die 2a is released to receive the molded product Wp from the upper die 2a. After receiving the molded product Wp, the storage hand 3B is lowered.
In this way, by utilizing the preheating time of the workpiece W to remove the molded product Wp, the waiting time can be reduced as much as possible.

In FIG. 4(d), the first loader 3, holding the molded product Wp in the storage hand 3B, retreats from the sealing mold 2 and stops once the supply hand 3A moves to a position directly below the preheating mechanism 5. The supply hand 3A is then raised to receive the preheated workpiece W from the preheating mechanism 5. Specifically, the supply hand 3A starts suction and the suction of the workpiece holding section 5c is released (the suction of the first suction circuit 5d and the second suction circuit 5e is stopped) to receive the workpiece W from the workpiece holding section 5c. The supply hand 3A that has received the workpiece W is lowered. At this time, the storage hand 3B is suction-holding the molded product Wp that it received earlier.

In FIG. 4(e), the first loader 3 again enters the sealing mold 2 and stops once the supply hand 3A reaches a position directly below the upper mold 2a. At this time, the storage hand 3B is in a standby position in front of the sealing mold 2. The supply hand 3A is then raised to deliver the preheated workpiece W to the upper mold 2a. Specifically, suction of the upper mold 2a is started and suction of the supply hand 3A is released. After the workpiece W is delivered to the upper mold 2a, the supply hand 3A descends.

In Fig. 4(f), when the loader hands (supply hand 3A and storage hand 3B) move in the Y-axis direction away from the sealing mold 2, the first loader 3 moves in the X-axis direction along the guide rail 1D to the work processing unit 1A in Fig. 1. Then, the molded product Wp held by the storage hand 3B is delivered to the first storage pickup 1d, and the next work W is delivered to the supply hand 3A by the supply pickup 1c.
In addition, the second loader 4 enters the sealing mold 2 and removes the used film Fd remaining in the cavity recess 2c of the lower mold 2b in the sealing mold 2, held by the fourth holding part 4B, and the film F and resin R held by the third holding part 4A are supplied to the cavity recess 2c. Then, the lower mold 2b rises to close the mold, and the electronic components mounted on the workpiece W are resin-sealed while being immersed in the molten resin R in the cavity recess 2c. After retreating from the sealing mold 2, the second loader 4 moves in the X-axis direction along the guide rail 1D to the dispensing unit 1C shown in FIG. 1. Then, the conveying tool 7 held by the third holding part 4A is transferred onto the preparation table 8, and the used film Fd held by the fourth holding part 4B is disposed of in the film disposer 16, preparing for the next resin supply.

In FIG. 4(g), the first loader 3, which has received the workpiece W in the supply hand 3A by the supply pickup 1c in FIG. 1, moves again in the X-axis direction along the guide rail 1D to just before the press unit 1B. Then, the loader hand (supply hand 3A and storage hand 3B) moves in the Y-axis direction toward the sealing mold 2. Note that the sealing mold 2 opens when the resin sealing work is completed. Then, when the supply hand 3A moves to a position directly below the preheat mechanism 5, it is stopped and the workpiece W is handed over to the preheat mechanism 5, and the preheat operation and the removal operation of the molded product Wp are repeated as in FIG. 4(b) and subsequent steps.

As described above, even if the type of workpiece W is changed, the preheat mechanism 5 can be pulled out in the Y-axis direction away from the sealing mold 2, intersecting the X-axis direction in which the first loader 3 reciprocates, making it easy to access from outside the device and to easily change the type.
In addition, when the preheat mechanism 5 has a work holding portion 5c that adsorbs and holds the work W before molding and is removably attached to the heater main body 5b that has a built-in heater 5a, the type can be easily changed simply by replacing the work holding portion 5c, which is part of the preheat mechanism 5.
When the workpiece W is sucked and held by the workpiece holding part 5c of the preheating mechanism 5, the central area of the workpiece W is heated while being sucked and stretched, and then the outer area is sucked and held, so that even if the workpiece W stretches between the central area and the outer area, wrinkles are not generated.

The supply hand 3A holds the workpiece W and delivers it to the preheating mechanism 5, then enters the open sealing mold 2 where the storage hand 3B receives and removes the molded product Wp, and then enters the sealing mold 2 again to deliver the preheated workpiece W, after which the molded product Wp is removed. This operation is repeated, and the workpiece W preheating operation and the molded product Wp removal operation from the sealing mold 2 are performed in parallel, thereby improving work efficiency.

The above-mentioned resin sealing device has been described as handling two workpieces W, two films F and resin R, and two molded products Wp, but the device may be configured to handle one workpiece W, one film F and the mounted resin R, and one molded product Wp.

In addition, the first loader 3 has supply hands 3A and storage hands 3B arranged in two rows and two columns, one behind the other in the direction in which the sealing mold 2 advances and retreats, but the supply hands 3A and storage hands 3B may also be arranged stacked one on top of the other.
5(a), the first loader 3 is provided with a pair of openable and closable holders 3e for holding the workpiece W with its semiconductor chip mounting surface facing downward. A suction path for suction-holding is provided on the support surface of the first loader 3 for supporting the workpiece W or molded product Wp, and the holders 3e are also provided with a suction path for suction-holding the workpiece W. The pair of holders 3e may not be openable and closable, but may be provided to move up and down relative to the loader body.

In FIG. 5(b), the workpiece W held by the first loader 3 is delivered to the preheat mechanism 5 with the pair of holding parts 3e open, and the first loader 3 enters the open sealing mold 2 and receives the molded product Wp. As shown in FIG. 5(c), the first loader 3 retreats to a position directly below the preheat mechanism 5, closes the pair of holding parts 3e, and receives the preheated workpiece W on top of the molded product Wp via the pair of holding parts 3e. Then, as shown in FIG. 5(d), the first loader 3 again enters the sealing mold 2 and delivers the workpiece W held on the pair of holding parts 3e to the upper mold 2a. After this, as shown in FIG. 5(e), the first loader 3 may transport the molded product Wp from the sealing mold 2 and store it. The first loader 3 transports the molded product Wp with the pair of holding parts 3e open on both sides, moves in the X-axis direction to the work processing unit 1A shown in FIG. 1, and delivers the molded product Wp to the first storage pickup 1d.

This allows the size of the first loader 3 to be reduced compared to when the supply hand 3A and storage hand 3B of the first loader 3 are arranged side-by-side in a plane.

W Work Wp Molded product F Film R Resin 1 Resin sealing device 1A Work processing unit 1B Press unit 1C Dispensing unit 1D Guide rail 1a Magazine 1b Supply rail 1c Supply pickup 1d First storage pickup 1e Second storage pickup 2 Sealing mold 2a Upper mold 2b Lower mold 2c Cavity recess 3 First loader 3A Supply hand 3B Storage hand 3a, 3b First holding part 3c, 3d Second holding part 3e Holding part 4 Second loader 4A Third holding part 4B Fourth holding part 5 Preheat mechanism 5a Heater 5b Heater body 5c Work holding part 5d First suction circuit 5e Second suction circuit 5f Holding claw 5g Slide member 5h Suspension rod 5i Connecting rod 5j Handle 6 Rail part 7 Conveyor 8 Preparation table 9 Conveyor pickup 10 Film table 11 Resin drop table 12 Film roll 13 Dispenser 16 Film disposer

Claims (7)

a sealing die having an upper die for suction-holding a work before molding and a lower die having a cavity recess into which resin is supplied;
a loader mechanism having a loader hand for holding the workpiece and configured to reciprocate in an X-axis direction and to be capable of advancing and retreating toward the sealing mold in a Y-axis direction perpendicular to the X-axis direction;
a preheating mechanism that is provided on the front side of the loader hand that enters the sealing mold in the Y-axis direction from the loader mechanism and holds the work transferred from the loader hand and preheats it to a predetermined temperature;
The resin sealing device according to the present invention, wherein the preheating mechanism is provided so as to be removable in a direction away from the sealing mold in a Y-axis direction. The resin sealing device according to claim 1, wherein the preheat mechanism is a heater body having a built-in heater and a workpiece holding part that adsorbs and holds the workpiece before molding, which is removably attached to the heater body. The resin sealing device according to claim 2, wherein the workpiece holding section is provided with a first suction circuit that suction-holds at least the central area of the workpiece and a second suction circuit that suction-holds the area outside the central area of the workpiece. The resin sealing device according to claim 2 or 3, wherein the preheat mechanism is provided at the same height as the upper mold surface when the workpiece holding portion is opened. The resin sealing device according to claim 1 or 2, wherein the preheat mechanism is fixed to each of the multiple sealing molds on the front side in the direction of entry of the loader hand. The resin sealing device according to claim 1 or 2, in which the loader hand holds the work before molding, delivers it to the preheating mechanism, enters the opened sealing mold, receives the molded product, and removes it, then enters the sealing mold again to deliver the work that has been preheated, and then repeats the operation of removing the molded product. The resin sealing device according to claim 1 or 2, wherein the loader hand is provided with a supply hand for holding the work before molding and a storage hand for holding the molded product, which can be raised and lowered.

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