JP2019145548A - Resin mold device and resin mold method - Google Patents

Abstract

To effectively supply a film and a mold resin.SOLUTION: A resin mold device 1 comprises: a conveying tool 400 that is a fixture holding a mold resin R in penetration holes 400a and 400b formed in accordance with a form of a cavity concave part 209 of a lower type 206, and conveying it with a film F; a first table 308 in which the film F cut in a prescribed length by being unreeled from a film role 306 is held, and the cut film F and the conveying tool 400 are combined; a second table 310 movably configured so as to mount the conveying tool 400 in a state where the film F is held on a lower surface; a conveying tool pickup 304 that holds the conveying tool 400 in the state where the film F is held on the lower surface side, and is conveyed to the second table 310 from the first table 308; and a dispenser 312 for injecting the mold resin R in an inner side of the penetration holes 400a and 400b in the conveying tool 400 mounted on the second table 310.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molding apparatus and a resin molding method for resin-molding a workpiece having an electronic component mounted on a base material.

  As a method of manufacturing an electronic device such as a semiconductor device by resin molding, a workpiece in which a large number of electronic components are mounted on a base material is collectively resin molded, and the molded product is diced into individual pieces. How to do is known. One such resin mold method is a compression molding method.

  In general, the compression molding method consists of supplying a predetermined amount of resin to a mold region (cavity) provided in a mold mold including an upper die and a lower die, and placing a workpiece in the mold region, This is a resin molding method by clamping with a mold and a lower mold. At this time, in the case of using a mold die having a cavity in the upper die, generally, a high viscosity resin is collectively supplied to the center position on the work for forming. In this case, in order to fill the resin supplied onto the workpiece into the cavity, it is necessary to cause the mold resin to flow to the end of the cavity, which may cause a flow mark.

  On the other hand, when using a mold having a cavity in the lower mold, the mold surface including the cavity is covered with a film, and the mold resin is supplied with an even thickness, and the workpiece held in the upper mold is melted into the molten mold resin. It is common practice to immerse and resin mold. For example, devices described in Patent Document 1 (Japanese Patent Laid-Open No. 2010-247429), Patent Document 2 (Japanese Patent Laid-Open No. 2004-148621), Patent Document 3 (Japanese Patent Laid-Open No. 2017-024398), and the like are disclosed. .

JP 2010-247429 A JP 2004-148621 A Japanese Patent Laid-Open No. 2017-024398

  In the conventional compression molding type resin mold apparatus exemplified in the above-mentioned patent document, etc., in the case of a configuration having a cavity in the upper mold of the mold, the mold resin is transported in a state of being mounted on one workpiece. And since it can be resin-molded, there exists an advantage which can simplify an apparatus structure and a process. However, in the case of a structure having a cavity in the lower mold of the mold, it is necessary to carry in as many films (release film) and mold resin as necessary after the work is loaded. There was a problem that the configuration and the process became complicated.

  Thus, in particular, in a resin mold apparatus having a cavity in the lower mold, an apparatus capable of efficiently supplying a film and a mold resin and capable of simplifying the configuration and the process is desired. It was.

  The present invention has been made in view of the above circumstances, and can efficiently supply a film and a mold resin used for a resin mold, and can simplify a configuration and a process, and a resin mold It aims to provide a method.

  The present invention solves the above-mentioned problem by means of solving as described below as an embodiment.

  A resin mold apparatus according to the present invention includes a mold having an upper mold for holding a workpiece having an electronic component mounted on a substrate, and a lower mold in which a cavity concave portion to which mold resin is supplied via a film is formed. A resin molding apparatus that molds the workpiece into a molded product, wherein a through hole corresponding to the shape of the cavity recess is formed, and the mold resin is held in the through hole to hold the film A first table in which the transporting tool, which is a jig transported together, the film that is fed from a film roll and cut to a predetermined length is held, and the cut film and the transporting tool are combined; A second table configured to be movable by placing the transfer device in a state where the film is held on the film, and the film in a state where the film is held on the lower surface side. A transport tool pickup that holds the transport tool and transports it from the first table to the second table, and a dispenser that throws the mold resin into the inside of the through hole in the transport tool placed on the second table It is a requirement to have.

  According to this, by realizing the structure which provides the 1st table used for supply of a film, and the 2nd table used for supply of mold resin separately, a film and mold resin are hold | maintained at a conveyance tool. It becomes possible to carry out processes such as film preparation and mold resin preparation which are necessary at the time. Therefore, the process time can be greatly reduced as compared with the conventional apparatus in which they are performed using the same table.

  In addition, the transport tool has two rows of film holding portions so as to hold the two films side by side in the left-right direction as the through hole, and a resin corresponding to each film in each of the film holding portions. It is preferable to have a charging hole. According to this, it becomes possible to hold | maintain the two films each mounted with mold resin with one conveyance tool, and to convey to a mold die. Therefore, the process time can be greatly shortened as compared with the conventional apparatus that transports the film one by one with one transport tool.

  Moreover, it is preferable that the said 1st table and the said film roll are arranged in parallel by the hierarchical direction in the up-down direction. According to this, it becomes possible to reduce the installation area of an apparatus compared with the conventional apparatus with which each structure is arranged in parallel in plane.

  Moreover, it is preferable to further provide a resin heater that heats from the upper surface side of the transporting tool in a state where the film and the mold resin are held. According to this, since the mounting surface can be liquefied by heating immediately after the molding resin is mounted on the film, particularly when granular or powder molding resin is used, dust (resin It is possible to prevent the occurrence of product defects by preventing the occurrence of fine powder and the like.

  The transport tool includes a cleaning process for cleaning the transport tool, a film setting process for combining the film with the transport tool, a resin dropping process for dropping the mold resin onto the transport tool combined with the film, It is preferable that a plurality of processing is performed in different steps of the film and the resin supply step of supplying the mold resin to the mold. According to this, by circulating each conveyance tool in each process for resin molding, the waiting time of the conveyance tool in each process can be shortened, and productivity can be improved.

  Further, the resin molding method according to the present invention is a resin molding method for performing resin molding using the resin molding apparatus, wherein a plurality of the transport tools are provided, and a cleaning step for cleaning the transport tools A film setting process for combining the film with the transport tool, a resin dropping process for dropping the mold resin onto the transport tool combined with the film, and a resin for supplying the film and the mold resin to the mold It is a requirement that the plurality of transport tools be processed in different steps between the supply step and the supply step. According to this, by circulating each conveyance tool in each process for resin molding, the waiting time of the conveyance tool in each process can be shortened, and productivity can be improved.

  According to the present invention, it is possible to realize a configuration in which two or more cavities are provided in one lower mold and a workpiece is placed in each cavity and resin molding is performed simultaneously. In particular, since it is possible to efficiently supply the film and the mold resin used for the resin mold, the process time can be shortened compared with the conventional apparatus. Moreover, it becomes possible to simplify an apparatus structure and a process.

It is a top view which shows the example of the resin mold apparatus which concerns on embodiment of this invention. It is a left view of the II-II position of FIG. It is a top view which shows the example of the supply rail of the resin mold apparatus of FIG. It is a top view which shows the example of the storage rail of the resin mold apparatus of FIG. It is a left view of the VV position of FIG. It is a left view of the VI-VI position of FIG. It is a left view of the VII-VII position of FIG. It is a front view of the VIII-VIII position of FIG. It is a top view which shows the example of the conveyance tool of the resin mold apparatus of FIG. It is a top view which shows the example of the mold metal mold | die of the resin mold apparatus of FIG. It is operation | movement explanatory drawing of the resin mold apparatus which concerns on embodiment of this invention. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. FIG. 23 is an operation explanatory diagram following FIG. 22. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is operation | movement explanatory drawing following FIG. It is a top view which shows the modification of the resin mold apparatus which concerns on embodiment of this invention. It is a block chart which shows the example of the control structure which concerns on embodiment of this invention. It is a flowchart which shows the example of the resin supply operation | movement which concerns on embodiment of this invention.

(overall structure)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view (plan view) showing an example of a resin mold device 1 according to an embodiment of the present invention. 2 to 10 are schematic views showing details of each component of the resin molding apparatus 1. FIG. For convenience of explanation, the front and rear, left and right, and up and down directions in the resin molding apparatus 1 may be described with arrows in the drawing. In all the drawings for explaining each embodiment, members having the same function are denoted by the same reference numerals, and repeated description thereof may be omitted.

  The resin molding apparatus 1 according to the present embodiment is an apparatus that performs resin molding of a workpiece (molded product) W using a molding die 202 including an upper mold 204 and a lower mold 206. Hereinafter, as the resin molding apparatus 1, the workpiece W is held by the upper mold 204, and the cavity 208 (including a part of the mold surface 206 a) provided in the lower mold 206 is covered with a film (release film) F so as to mold resin R A compression molding apparatus that performs the clamping operation of the upper mold 204 and the lower mold 206, immerses the workpiece W in the molten mold resin R, and performs resin molding will be described as a main example. The shape of the cavity 208 is defined by a cavity recess 209 that is recessed into a predetermined shape on the upper surface of the lower mold 206, and compression molding is possible by supplying the mold resin R through the film F.

  First, the workpiece W to be formed has a configuration in which a plurality of electronic components Wb are mounted in a matrix on the substrate Wa. More specifically, examples of the substrate Wa include plate-shaped members (strip-shaped strip work) such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers formed in a strip shape. It is done. Examples of the electronic component Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, a spacer, and the like. In addition, as will be described later, there can be considered an apparatus modification example that can cope with a case where a substrate having a square shape or a circular shape is used.

  As an example of a method for mounting the electronic component Wb on the substrate Wa, there is a mounting method such as flip chip mounting or wire bonding mounting. Alternatively, in the case of a configuration in which the base material (glass or metal carrier plate) Wa is peeled from the molded product after resin molding, a heat-peelable adhesive tape or an ultraviolet curable resin that is cured by ultraviolet irradiation is used. There is also a method of attaching the electronic component Wb.

  On the other hand, as an example of the mold resin R, a granular thermosetting resin (for example, a filler-containing epoxy resin) is used. In addition, it is not limited to said state, Other states (shape), such as liquid form, powder form, column shape, plate shape, sheet form, may be sufficient.

  Examples of the film F include film materials excellent in heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, Fluorine impregnated glass cloth, polypropylene, polyvinyl chloride, etc. are preferably used. As this film F, the strip-shaped strip film corresponding to the strip-shaped workpiece | work W can be used, for example.

  Then, the outline | summary of the resin mold apparatus 1 which concerns on this embodiment is demonstrated. As shown in FIG. 1, the resin molding apparatus 1 includes a workpiece processing unit 100A that mainly supplies a workpiece W and stores a molded product Wp after resin molding, and molds the workpiece W into a molded product Wp. A press unit 100B that mainly performs processing, a dispense unit 100C that mainly performs supply of the film F and the mold resin R, and storage (disposal) of the used film Fd after resin molding are provided as main components. In the present embodiment, a compression molding type resin mold apparatus is provided in which two cavities are provided in one lower mold and two workpieces W are arranged and resin molding is performed collectively, and two molded products Wp are simultaneously obtained. Will be described as an example.

  In this embodiment, units such as the work processing unit 100A, the press unit 100B, and the dispensing unit 100C are connected and assembled. As an example, the work processing unit 100A, the press unit 100B, and the dispensing unit 100C are arranged in parallel in that order from the left in the left-right direction. An arbitrary number of guide rails (not shown) are provided in a straight line across the units, and transport the first loader (first transport unit) 210 that transports the workpiece W and the like, and the film F and the like. A second loader (second transport unit) 212 is provided so as to be movable between predetermined units along an arbitrary guide rail. Note that these loaders 210 and 212 also function as offloaders because they perform not only the operation of loading the workpiece W or the like into the mold mold 202 but also the operation of unloading the molded product Wp from the mold mold 202, for example.

  Therefore, the structural aspect of the resin mold apparatus 1 can be changed by changing the structure of the unit. For example, the configuration shown in FIG. 1 is an example in which three press units 100B are installed. However, a resin molding apparatus (not shown) in which only one press unit 100B is installed, or two or more press units 100B are connected and installed. ). It is also possible to install other units. For example, a unit that supplies a mold resin R different from the dispense unit 100C and a unit that supplies a member to be assembled with the workpiece W in a mold can be installed (not shown).

(Work processing unit)
Next, the operation of conveying the workpiece W and the molded product Wp will be described in detail mainly with respect to the configuration of the workpiece processing unit 100A included in the resin mold apparatus 1.

  First, the workpiece processing unit 100A includes a supply magazine elevator 103 that moves up and down a supply magazine 102 that stores a plurality of workpieces W, and a storage magazine elevator 113 that moves up and down a storage magazine 112 that stores a plurality of molded products Wp. ing. The storage magazine elevator 113 is arranged at a different position in the vertical direction with respect to the supply magazine elevator 103. For example, these elevators 103 and 113 can be arranged side by side in the vertical direction in an overlapping state in plan view. Here, as the supply magazine 102 and the storage magazine 112, a known stack magazine, slit magazine, or the like is used. In this embodiment, the work W and the molding are performed with the mounting surface of the electronic component Wb facing downward. The articles Wp are stored respectively. From the viewpoint of protecting the electronic component Wb, it is preferable to hold the workpieces W apart by using a slit magazine that inserts and holds the workpieces W in concave portions facing each other inside the magazine frame. The supply magazine elevator 103 is configured to be able to take out the workpiece W from a predetermined position by holding the supply magazine 102 and moving up and down. The storage magazine elevator 113 is configured to be able to store the molded product Wp at a predetermined position by holding the storage magazine 112 and moving up and down.

  Next, the work processing unit 100 </ b> A includes a supply rail 104 that is disposed in front of the supply magazine 102 and on which the work W taken out from the supply magazine 102 is placed. In the present embodiment, the relay rail 106 that allows the workpiece W to pass therethrough is provided between the supply magazine 102 and the supply rail 104, but this may be omitted. A known pusher or the like (not shown) is used to move the workpiece W from the supply magazine 102 onto the supply rail 104.

  Here, the supply rail 104 supports the longitudinal side of the workpiece W from below, avoiding the mounting position of the electronic component Wb, and guides the workpiece W in the front-rear direction. Further, the supply rail 104 is configured in two rows (104A and 104B in the figure) so that two workpieces W can be placed side by side in the lateral direction, and is movable in the left-right direction. It has a moving mechanism (not shown). Thereby, after placing the workpieces W taken out from the supply magazine 102 in one row (for example, 104A), the supply rails 104A and 104B are moved in one of the left and right predetermined directions (for example, the right direction), It becomes possible to place the next workpiece W on the other row (for example, 104B).

  Next, the workpiece processing unit 100A is disposed below the supply rail 104 and is configured to be movable in the front-rear and left-right directions. A workpiece measuring instrument 114 that measures the thickness of the workpiece W from the mounting surface side) is provided. The workpiece measuring instrument 114 is composed of a laser displacement meter and a camera (monocular camera or compound eye camera), and measures the thickness of the workpiece W based on these output data. Note that the “thickness measurement” referred to here requires the presence / absence of mounting of the electronic component Wb on the substrate Wa, measurement of the mounting height of the electronic component Wb, measurement of mounting displacement, measurement of the number of mounting, and the like. Includes measurements. Based on the result of the “thickness measurement”, the volume of the electronic component Wb mounted on the workpiece W is calculated from, for example, whether or not the electronic component Wb is mounted and the mounting height, and the supply amount of the mold resin R is adjusted. As a result, the molding thickness of the molded product can be controlled with high accuracy.

  Here, the workpiece measuring instrument 114 has two thickness sensors 114a and 114b that measure the thicknesses of the two workpieces W on the two rows of supply rails 104A and 104B. As an example, the thickness sensor 114a is disposed at a position corresponding to the work W in the right row, and the thickness sensor 114b is disposed at a position corresponding to the work W in the left row. As a result, it is possible to simultaneously scan the same corresponding position of each workpiece W, and it is possible to measure two workpieces W in one scan with the shortest scanning distance and scanning time. Therefore, the process time can be greatly shortened. As the measurement operation of the workpiece W in one scan, the workpiece W is moved along a pattern formed by lines connecting adjacent ends of straight lines that divide the workpiece W vertically or horizontally into n (n is an integer of 2 or more). What is necessary is just to measure the workpiece | work W at predetermined intervals, moving W with respect to the thickness sensors 114a and 114b. Thereby, the thickness of the base material Wa in the workpiece | work W, the height of the electronic component Wb, etc. can be arbitrarily measured by "one scanning operation | movement (one scanning)" along a predetermined pattern. Further, in the configuration of the present embodiment, the scanning operation (movement in the front-rear and left-right directions) is performed by the mechanism of the movement operation in the left-right direction of the supply rails 104A and 104B for placing the work W, and the work measuring instrument 114 It can be implemented with a simple configuration by a mechanism for moving in the front-rear direction.

  As a modification, in the measurement operation of the workpiece W in one scan, the camera as the thickness sensors 114a and 114b captures a predetermined width all at once by the movement in the front-rear direction, and the thickness of the entire surface of the workpiece W is measured. May be measured. Further, the scanning operation may be performed by moving the workpiece measuring instrument 114 forward, backward, left and right. Moreover, it is good also as a structure which has one thickness sensor and measures two workpiece | work W in order by predetermined 1 scan (not shown).

  In addition, the workpiece measuring instrument 114 preferably measures the thickness of the workpiece W from the lower surface side with respect to the workpiece W on the supply rail 104 in relation to the workpiece W supply operation described later. The thickness of the workpiece W may be measured from the upper surface side. In this case, the work measuring instrument 114 can be provided on either or both of the upper and lower sides of the relay rail 106 through which the work W passes. Note that the workpiece measuring instrument 114 may read not only the thickness of the workpiece W but also identification information (for example, a two-dimensional code) attached to the workpiece W. In addition, a code reader 115 capable of reading the two-dimensional code of the workpiece W can be provided either above or below the relay rail 106. As such work W identification information, for example, it is possible to identify which work W it is by adding it as a serial number or a code that does not overlap. By recording the detailed information of the resin mold in association with this identification information, a process for improving traceability as described later becomes possible.

  Next, the workpiece processing unit 100A includes a supply pickup 120 that holds the workpiece W placed on the supply rail 104 and conveys the workpiece W to a predetermined position. In addition, as a mechanism for holding the workpiece W, a known holding mechanism (for example, a structure having a holding claw and a holding structure, a structure having a suction hole communicating with a suction device, and the like) is provided ( Not shown). A known mechanism such as a vacuum pump is used for the suction device (the same applies hereinafter). Here, the supply pickup 120 is configured to be movable in the left and right and up and down directions. As a result, the workpiece W placed on the supply rail 104 is held and moved up to be finally transported (supplied) to the first holding unit 210A described later.

  Further, the supply pickup 120 according to the present embodiment has a configuration in which the holding mechanism is arranged in two rows in the left-right direction at positions corresponding to the two workpieces W on the two rows of supply rails 104A and 104B. ing. As a result, the two workpieces W on the two rows of supply rails 104A and 104B can be simultaneously held and transported while being arranged in the left-right direction. In other words, the workpieces W can be held side by side with their longitudinal directions parallel.

  Next, the workpiece processing unit 100A includes a workpiece heater 116 that heats the workpiece W from the lower surface side. Here, as a configuration for heating the workpiece W, a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is disposed on the upper surface of the workpiece heater 116 (not shown). Thereby, the workpiece W is preheated before being carried into the mold 202 and heated, so that the elongation of the workpiece W in the mold 202 is suppressed. As a modification, a configuration without the work heater 116 is also conceivable. In this case, a heater can be provided in the first holding unit 210A (first loader 210).

  The work heater 116 according to the present embodiment is disposed so as to be movable forward and backward with respect to the lower surface side of the work W held by the supply pickup 120 above the supply rail 104 (see FIG. 2). In other words, it can be said that the work heater 116 is disposed so as to be movable between a position outside the outer periphery of the work W and a position directly below the lower surface of the work W. Thereby, it becomes possible to perform the preheating process which heats the workpiece | work W before resin molding is performed. When the work heater 116 is moved to a position immediately below the lower surface of the work W, the supply pickup 120 holding the work W is moved downward to bring the work W close to the work heater 116. Thus, more efficient heating is possible.

  The work heater 116 according to the present embodiment has a configuration in which the above heating mechanism is arranged in two rows in the left-right direction at positions corresponding to the two works W held by the supply pickup 120. As a result, the two workpieces W held side by side by the supply pickup 120 can be heated simultaneously and evenly.

  In this way, it is possible to realize a configuration in which the workpiece W held by the supply pickup is heated (preheating step) by the workpiece heater 116 above the supply rail 104, that is, while moving in the vertical direction by the supply pickup. Therefore, the installation area of the apparatus can be greatly reduced as compared with the conventional apparatus in which the respective components are arranged side by side in a plane.

  Next, the first loader 210 that cooperates with each mechanism of the workpiece processing unit 100A includes a first holding unit 210A that conveys the workpiece W to a predetermined holding position of the upper mold 204 on the upper surface thereof. The workpiece W conveyed by the supply pickup 120 when it moves to a position on the side (as an example, the right side) with respect to the supply rail 104 is placed on the first holding unit 210A. When delivering the workpiece W, the supply pickup 120 further rises through a preheating process on the supply rail 104 and then moves to the right, so that the first holding unit located on the right side of the supply rail 104 It moves to a position where it can be handed over to 210A. The first holding unit 210A is a workpiece holding unit that holds the placed workpiece W, and is a known holding mechanism (for example, a holding structure having a holding claw and a suction hole that communicates with a suction device). (In the figure, reference numerals 210a and 210b).

  In the present embodiment, the workpiece holding units 210a and 210b are arranged in two rows in the left-right direction at positions corresponding to the two workpieces W held by the supply pickup 120. That is, the workpieces W can be held side by side with their longitudinal directions parallel. As a result, the two workpieces W held side by side in the left-right direction by the supply pickup 120 can be placed at the same time without being rearranged in the same arrangement, held side by side in the left-right direction, and transported.

  Further, the first loader 210 holding the workpiece W by the first holding unit 210A is configured to be movable in the front-rear direction, the left-right direction, and the up-down direction. By moving in the left-right direction, the workpiece W can be conveyed from the workpiece processing unit 100A to the press unit 100B. On the other hand, the workpiece W can be transferred from the outside to the inside of the mold die 202 (that is, between the upper die 204 and the lower die 206 with the die opened) by the movement in the front-rear direction. Furthermore, the workpiece W can be transferred (delivered) to a predetermined holding position of the upper mold 204 inside the mold 202 by moving in the vertical direction. As a modification, instead of the configuration in which the first holding unit 210A moves left and right, a configuration in which the movement of the moving range is replaced by the supply pickup 120 may be considered. Further, instead of the configuration in which the first holding unit 210A moves up and down, a configuration in which the movement of the moving range is replaced by a mold opening / closing mechanism of the mold die 202 (all not shown) may be considered.

  Next, on the upper surface of the first loader 210, the molded product Wp molded with resin is removed from the mold die 202 (here, the upper die 204) and placed, and the molded product Wp is placed on the mold die. A second holding unit 210 </ b> B is provided to convey to a predetermined position outside 202. The second holding unit 210B has a known holding mechanism (for example, a holding structure having a holding claw and a suction hole communicating with a suction device) as a molded product holding unit for holding the placed molded product Wp. (In the figure, reference numerals 210c and 210d).

  Further, in the second holding unit 210B according to the present embodiment, the above-described molded product holding units 210c and 210d correspond to the two molded products Wp held by the mold die 202 (upper die 204) after resin molding. In addition, two rows are arranged in parallel in the left-right direction. That is, the molded product Wp can be held side by side with its longitudinal direction parallel. As a result, the two molded products Wp held side by side in the left-right direction by the mold die 202 (upper die 204) are simultaneously placed without rearranging in the same arrangement, held side by side in the left-right direction, and transported. It becomes possible.

  Here, in the present embodiment, the second holding unit 210 </ b> B and the first holding unit 210 </ b> A are integrally configured as the first loader 210. As an example, the first loader 210 includes a first holding part 210A having two left and right rows of workpiece holding parts 210a and 210b on the front side, and has two left and right rows of molded article holding parts 210c and 210d on the rear side. A second holding unit 210B is provided. Therefore, the first holding unit 210A and the second holding unit 210B are configured to be movable in the front-rear, left-right, and up-down directions integrally as the first loader 210. Thereby, not only can the apparatus configuration be simplified and reduced in size, but also a configuration in which two workpieces W and a molded product Wp are simultaneously conveyed two by two can be realized, so that the process time can be shortened.

  As a modification, a loader provided with the second holding unit 210B may be configured separately from the loader provided with the first holding unit 210A (not shown). In that case, a movable configuration may be used as in the case of the first holding unit 210A.

  Next, the workpiece processing unit 100A includes a first storage pickup 122 that holds the molded product Wp placed on the second holding unit 210B and conveys it to a predetermined position. Further, the workpiece processing unit 100A includes a second storage pickup 124 on which the molded product Wp held by the first storage pickup 122 is placed and conveyed to a predetermined position in the unit. In any case, as a mechanism for holding the molded product Wp, a publicly known holding mechanism (for example, a holding structure having a holding claw, a holding structure having a suction hole communicating with a suction device, a simply mounting mechanism, etc.) ) (Not shown).

  Here, the first storage pickup 122 according to the present embodiment is configured to be movable in the left-right direction. Accordingly, the molded product Wp placed on the second holding unit 210B can be held and transported onto the second storage pickup 124. Here, in the delivery between the first storage pickup 122 and the second storage pickup 124, the molded product Wp is sandwiched and waited to be cooled while being flattened to prevent warping or distortion of the molded product Wp. Good. In addition, as a modification of the first storage pickup 122, it may be configured to be movable not only in the left-right direction but also in the up-down direction. Thereby, the structure which abbreviate | omits the moving mechanism of the up-down direction of the 2nd holding | maintenance part 210B is realizable.

  In the first storage pickup 122 according to the present embodiment, the holding mechanism described above corresponds to two molded products Wp placed on the second holding unit 210B (two rows of molded product holding units 210c and 210d). In this position, two rows are arranged in parallel in the left-right direction. As a result, the two molded products Wp on the second holding unit 210B can be simultaneously held and conveyed while being arranged in the left-right direction.

  In the present embodiment, the supply pickup 120 transports the workpiece W to the first holding unit 210A in the left-right direction, and the storage pickup (first storage pickup 122) transports the molded product Wp from the second holding unit 210B. The left and right carry-out paths are set side by side in the front-rear direction. Thereby, since the carrying-in operation of the workpiece W by the supply pickup 120 and the carrying-out operation of the molded product Wp by the storage pickup (first storage pickup 122) do not intersect or overlap, the occurrence of waiting time can be suppressed. . Accordingly, a plurality of operations can be performed in parallel and each operation can be performed efficiently, so that the processing can be facilitated and the process time can be shortened.

  On the other hand, the second storage pickup 124 according to the present embodiment is configured to be movable in the vertical direction. As a result, the molded product Wp placed on the second storage pickup 124 can be held and conveyed onto the storage rail 108 described later.

  Further, the second storage pickup 124 according to the present embodiment has a configuration in which the above-described holding mechanism is arranged in two rows in the left-right direction at positions corresponding to the two molded products Wp held by the first storage pickup 122. It has become. As a result, the two molded products Wp held by the first storage pickup 122 can be simultaneously held and transported while being arranged in the left-right direction.

  In the present embodiment, the two storage pickups (the first storage pickup 122 and the second storage pickup 124) are provided as described above. However, as a modified example, the storage pickup can be moved in the horizontal and vertical directions. It is good also as a structure provided with one accommodation pick-up (not shown). As a result, the molded product Wp placed on the second holding unit 210B can be held and directly conveyed onto the storage rail 108.

  Next, the workpiece processing unit 100A is provided below the workpiece measuring instrument 114, and includes a storage rail 108 on which the molded product Wp conveyed by the storage pickup (here, the second storage pickup 124) is placed. ing. The molded product Wp placed on the storage rail 108 passes (slides) on the storage rail 108 and is stored in the storage magazine 112.

  In the present embodiment, the relay rail 110 that allows the molded product Wp to pass therethrough is provided between the storage rail 108 and the storage magazine 112, but this may be omitted. A known pusher or the like (not shown) is used to move the molded product Wp from the storage rail 108 to the storage magazine 112.

  Here, the storage rail 108 avoids the mounting position of the electronic component Wb, supports the longitudinal side of the molded product Wp from below, and guides the workpiece W laterally. Further, the storage rail 108 is configured in two rows (108A and 108B in the figure) so that two molded products Wp can be placed side by side in the lateral direction, and can be moved in the left-right direction. A moving mechanism (not shown). As a result, the two molded products Wp held by the storage pickup (here, the second storage pickup 124) are simultaneously placed in a state of being arranged in the left-right direction, and then the molded products Wp are sequentially directed to the storage magazine 112. Can be moved. For example, the molded product Wp on one row (for example, 108B) is moved toward the storage magazine 112, and then the storage rails 108A and 108B are moved in either the left or right predetermined direction (for example, the left direction). It is possible to move the molded product Wp on this row (for example, 108A) toward the storage magazine 112.

  Next, the workpiece processing unit 100A is disposed below the storage rail 108, and inspects the molded product Wp from the lower surface side (the mounting surface side of the electronic component Wb) with respect to the molded product Wp on the storage rail 108. A product measuring instrument 118 is provided. As an example, the molded product measuring instrument 118 can be disposed at a lower position when the storage rails 108A and 108B are in a predetermined position when the molded product Wp is moved toward the storage magazine 112. The molded product measuring instrument 118 is composed of a laser displacement meter and a camera (monocular camera or compound eye camera). The molded product measuring instrument 118 uses a method such as comparison with reference values based on these output data or pattern matching. It is used for measuring the thickness and detecting defects in the appearance of the molded part of the molded product Wp. Note that “below the storage rail” includes the lower portion of the relay rail when the relay rail 110 is provided. The “inspection” here refers to the measurement of the thickness of the resin-molded portion (resin-molded portion) on the substrate Wa, the appearance of the resin mold (exposed wire), and the defects (such as defective filling) of the resin mold. The necessary measurements are included. Based on the result of the “inspection” here, for example, by adjusting the supply amount of the mold resin R based on the difference between the actual thickness of the resin molded portion and the target thickness value, the molding thickness of the molded product Wp is adjusted. May be controlled with high accuracy.

  In the molded product measuring instrument 118 according to the present embodiment, one thickness sensor 118a is fixed and disposed. Thereby, it becomes possible to measure the thickness of a predetermined position (for example, the center position or the outer peripheral position of the resin molded portion) of the molded product Wp passing over the storage rail 108.

  As described above, in this embodiment, the supply rail 104, the work measuring instrument 114, the storage rail 108, and the molded product measuring instrument 118 are arranged in parallel in the vertical direction, and are arranged in a hierarchical order in that order from the top. It has a configuration (including offsets in the front-rear and left-right directions) arranged side by side. In addition, the supply magazine elevator 103 and the storage magazine elevator 113 are also arranged at different positions in the vertical direction and arranged in a hierarchical manner in that order from the top. According to these, the installation area of the apparatus can be greatly reduced as compared with the conventional apparatus in which the respective components are arranged side by side in a plane.

  Further, during the vertical movement by the second storage pickup 124, for example, it is possible to realize a configuration in which the heat radiation process of the molded product Wp is performed while being sandwiched and flattened in the delivery between the first storage pickup 122 and the second storage pickup 124, for example. Further, it is not necessary to provide a separate heat dissipation unit, and the installation area of the apparatus can be reduced.

  Further, according to the above configuration, from the state where, for example, two strip-shaped workpieces W are placed on the supply rail 104 to the state where two processed products Wp are placed on the storage rail 108. These steps can be performed in a state where two workpieces W or two molded products Wp are arranged in the left-right direction. For this reason, it is possible to significantly reduce the process time as compared with the conventional apparatus in which a process that sequentially takes a part of the process is included in the middle and a process that takes a part of time is included.

  Furthermore, according to the above-described configuration, the movement of the workpiece W and the molded product Wp is performed in all the processes from when the workpiece W is taken out from the supply magazine 102 until it is processed into the molded product Wp and stored in the storage magazine 112. In this case, it is possible to realize a configuration in which the direction of the workpiece W and the molded product Wp (the direction of holding and placing) is moved in the front-rear, left-right, and up-down directions without changing. Therefore, the process time can be shortened and the apparatus configuration can be simplified as compared with the conventional apparatus in which the orientation of the workpiece W and the molded product Wp is changed during the process.

  As a modification of the resin mold apparatus 1 described above, one cavity is provided in one lower mold and one workpiece W (for example, a circular wafer, a square, a rectangular substrate, or the like is used as the base material Wa). May be configured, and may be configured as a resin molding apparatus 2 (see FIG. 28) of a compression molding system that performs resin molding by placing a resin mold. In this case, the workpiece W can be configured to process a wide workpiece (large format workpiece) wider than the workpiece W as the strip workpiece described above. As the wide workpiece, a square, rectangular or polygonal workpiece W wider than the strip workpiece, a circular wafer having a diameter (width) relatively wider than the strip workpiece, or a workpiece W as a carrier plate is used. Also good. In that case, it replaces with work processing unit 100A, and the composition like the following work processing units 500A can be considered.

  As an example, the workpiece processing unit 500A includes a robot hand 504 that takes out the workpiece W from the supply magazine in place of the supply rail 104 and the storage rail 108 described above, or stores the molded product Wp in the storage magazine. A transfer robot may be provided. Here, for the robot hand 504, a mechanism having a suction mechanism on a fork-shaped member corresponding to the shape of the workpiece W at the tip of a known multi-indirect robot or the like can be used. In addition, it is good also as a structure provided with a some robot hand (not shown).

  In the first holding unit 210A, the two rows of workpiece holding units 210a and 210b and the wide workpiece holding unit 506 holding one workpiece W (wide workpiece) can be replaced and installed. Can do. Further, in the second holding unit 210B, the two rows of molded product holding units 210c and 210d described above, and a wide molded product holding unit 508 that holds one molded product Wp (a molded product Wp corresponding to the wide workpiece W), It can be set as the structure which can be installed by replacing.

  In this way, for a configuration that can be switched between a strip workpiece and a wide workpiece, for example, the first holding unit 210A can hold two workpieces W, which are two strip workpieces, in parallel in the longitudinal direction. It is conceivable that the configuration having the two rows of workpiece holding portions 210a and 210b and the configuration having one workpiece holding portion 506 holding the workpiece W, which is one wide workpiece, can be replaced with each other. Further, the second holding portion 210B has two rows of molded product holding portions 210c and 210d so that two molded products Wp obtained by processing the workpiece W, which is a strip work, can be held side by side in parallel with the longitudinal direction thereof. It is conceivable that the configuration and the configuration having one workpiece holding portion 508 that holds one molded product Wp obtained by processing one workpiece W can be replaced. By adopting such a configuration, the workpiece W and the molded product Wp can be transported by replacing the first holding unit 210A and the second holding unit 210B with a simple configuration, regardless of whether the workpiece W is a strip workpiece or a wide workpiece. Possible configurations can be obtained.

(Press unit)
Then, the structure of the press unit 100B with which the resin mold apparatus 1 is provided is demonstrated in detail.

  First, the press unit 100B includes a mold having a pair of molds that are opened and closed (for example, a plurality of mold blocks made of alloy tool steel, a mold plate, a mold pillar, and other members are assembled). A mold 202 is provided. In the present embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 204 and the other mold on the lower side is the lower mold 206. The mold 202 is closed and opened when the upper mold 204 and the lower mold 206 approach and separate from each other. That is, the vertical direction is the mold opening / closing direction.

  The mold 202 is opened and closed by a known mold opening / closing mechanism (not shown). For example, the mold opening / closing mechanism includes a pair of platens, a plurality of connecting mechanisms (tie bars and pillars) on which the pair of platens are installed, a drive source (for example, an electric motor) and a drive transmission mechanism that move (lift) the platen. (For example, a toggle link) and the like (all of the driving mechanisms are not shown).

  Here, the mold die 202 is disposed between a pair of platens of the mold opening / closing mechanism. In the present embodiment, an upper mold 204 that is a fixed mold is assembled to a fixed platen (a platen that is fixed to a coupling mechanism), and a lower mold 206 that is a movable mold is a movable platen (a platen that moves up and down along the coupling mechanism). It is assembled. However, the configuration is not limited to this, and the upper mold 204 may be a movable mold and the lower mold 206 may be a fixed mold, or both the upper mold 204 and the lower mold 206 may be movable.

  Next, the lower mold 206 of the mold 202 will be specifically described. The lower mold 206 includes a lower plate 224, a cavity piece 226, a clamper 228, and the like, and these are assembled (see FIG. 10).

  Here, the cavity piece 226 is fixedly assembled to the upper surface of the lower plate 224 (the surface on the upper mold 204 side). The clamper 228 is formed in an annular shape so as to surround the cavity piece 226, and is assembled adjacent to the cavity piece 226 so as to be separated (floating) from the upper surface of the lower plate 224.

  In the present embodiment, the lower mold 206 has a cavity 208 that is recessed from the mold surface (parting surface) 206 a, but the cavity piece 226 forms the back (bottom) of the cavity 208, and the clamper 228 is on the cavity 208 side. Parts. In other words, a cavity recess 209 that is recessed into a predetermined shape is formed by the upper surface of the cavity piece 226 and the inner peripheral wall surface of the clamper 228.

  In the present embodiment, as shown in FIG. 21 and the like, a configuration is provided in which two cavities 208 are arranged side by side in the left-right direction (in the figure, reference numerals 208A and 208B), and cavities corresponding to each of them are provided. The pieces 226A and 226B are provided. As a result, two films F (portions on which the mold resin R is mounted) can be simultaneously accommodated in the cavities 208A and 208B, respectively. Accordingly, since it is possible to realize a configuration in which two workpieces W are simultaneously resin-molded, the process time can be shortened. In addition, the lower mold 206 is provided with a plate thickness adjusting mechanism that allows the clamper 228 to be lifted and lowered separately for each of the cavities 208A and 208B and that the upper mold 204 absorbs the plate thickness difference between the two workpieces W with an elastic body. It is good also as a structure. According to this, even if there is a difference in thickness between the two workpieces W to be compression-molded at the same time, the molding can be performed while reducing the influence of the variation in the supply of the resin amount without causing an inclination. In the present embodiment, the mold members are arranged so that the cavities 208A and 208B are arranged side by side in the left-right direction. For this reason, the cavity pieces 226A, 226B and the clamper 228 constituting the cavities 208A, 208B are separated into left and right chase structures, and maintenance is performed by individually inserting and removing the cavities 208A, 208B in the front-rear direction of the apparatus. Can do.

  Here, a suction groove (not shown) is provided on the mold surface of the upper mold 204 facing the clamper 228, and this communicates with a suction device (not shown). Further, by providing a seal structure that surrounds them, it is possible to deaerate the cavity 208 while the mold is closed by driving the suction device to reduce the pressure.

  Further, the mold die 202 includes a film suction mechanism that sucks the film F from the mold surface 206 a side of the lower die 206. As an example, the film suction mechanism communicates with a suction device (not shown) via suction paths 230a and 230b disposed through the clamper 228. Specifically, one end of the suction paths 230 a and 230 b communicates with the mold surface 206 a of the lower mold 206 and the other end is connected to a suction device disposed outside the lower mold 206. Accordingly, the suction device is driven to suck the film F from the suction paths 230 a and 230 b, and the film F can be adsorbed and held on the mold surface 206 a including the inner surface of the cavity 208. More specifically, the film F can be sucked from the suction path 230b, and the film F can be adsorbed and held on the mold surface 206a outside the cavity 208, and the film F is sucked from the suction path 230a. The film F can be adsorbed and held on the mold surface 206a on the inner surface of the cavity 208 (the mold surface of the cavity recess 209).

  Thus, by providing the film F that covers the inner surface of the cavity 208 and the mold surface 206a (part) of the lower mold 206, the portion of the mold resin R on the lower surface of the molded product Wp can be easily peeled off. Therefore, the molded product Wp can be easily taken out from the mold 202.

  Further, the mold 202 includes a biasing member (for example, a spring such as a coil spring) 232 between the lower plate 224 and the clamper 228. A clamper 228 is movably assembled to the lower plate 224 via the urging member 232. Thereby, the cavity piece 226 is surrounded by the clamper 228, and the cavity piece 226 and the clamper 228 can reciprocate relatively in the mold opening / closing direction. In this way, in the lower mold 206, the cavity piece 226 is fixedly held with respect to the lower plate 224, while being held apart (floating) via the biasing member 232 so that the clamper 228 can move. The At this time, the gap between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the cavity piece 226 is secured with a predetermined dimension. Therefore, the clamper 228 can be moved smoothly.

  The gap is included in the suction path 230a of the film suction mechanism described above, and sucks the film F at the boundary between the cavity piece 226 and the clamper 228 (the corner portion of the cavity 208). For this reason, the film suction mechanism includes a seal member 234 (for example, an O-ring). The seal member 234 is provided between the cavity piece 226 and the clamper 228 (lower part) so as to seal the gap as the suction path 230a so as not to leak air.

  The lower mold 206 includes a heater (for example, a heating wire heater), an auxiliary heater (for example, a heating wire heater), a temperature sensor, a control unit, a power source, and the like (all not shown). Done. As an example, the heater of the lower mold 206 is built in the lower plate 224 and a mold base (not shown) that accommodates these, and mainly applies heat to the entire lower mold 206 and the workpiece W. The lower mold 206 is adjusted to a predetermined temperature (for example, 120 ° C. to 180 ° C.) and heated by the heater of the lower mold 206.

  Next, the upper mold 204 of the mold die 202 will be specifically described. The upper mold 204 includes an upper plate 222, a cavity plate 236, and the like, and these are assembled. Here, the cavity plate 236 is fixedly assembled to the lower surface of the upper plate 222 (surface on the lower mold 206 side).

  The upper mold 204 includes a heater (for example, a heating wire heater), a temperature sensor, a control unit, a power source and the like (all not shown), and performs heating and control thereof. As an example, the heater of the upper mold 204 is built in the upper plate 222 and mainly applies heat to the entire upper mold 204 and the mold resin R. The upper mold 204 is adjusted to a predetermined temperature (for example, 120 ° C. to 180 ° C.) and heated by the heater of the upper mold 204.

  Furthermore, the upper mold 204 includes a workpiece holding mechanism 240 that holds the workpiece W at a predetermined position on the lower surface of the cavity plate 236. As an example, the work holding mechanism 240 communicates with a suction device (not shown) via a suction path 240 a disposed in the cavity plate 236. Specifically, one end of the suction path 240 a leads to the mold surface 204 a of the upper mold 204, and the other end is connected to a suction device disposed outside the upper mold 204. As a result, the suction device is driven to suck the workpiece W from the suction path 240a, and the workpiece W can be sucked and held on the mold surface 204a (here, the lower surface of the cavity plate 236). Moreover, it is good also as a structure which has the holding nail | claw which clamps the outer periphery of the workpiece | work W in parallel with the structure provided with the suction path 240a.

  In the present embodiment, as shown in FIG. 21 and the like, a configuration is provided in which two workpiece holding mechanisms 240 are arranged side by side in the left-right direction (reference numerals 240A and 240B in the figure). As a result, the two workpieces W can be simultaneously held by the workpiece holding mechanisms 240A and 240B, respectively. Accordingly, since it is possible to realize a configuration in which two workpieces W are simultaneously resin-molded, the process time can be shortened. As the above-described plate pressure adjusting mechanism, the cavity plate 236 that holds the workpiece W can be moved up and down separately for each of the cavities 208A and 208B, so that the difference in thickness between the two workpieces W that are simultaneously compression-molded can be reduced. Even if it exists, you may enable it to shape | mold, without producing an inclination.

  As described above, as a modification of the resin mold apparatus 1 described above, a compression-molding type resin in which one cavity is provided in one lower mold and one workpiece W is arranged to perform resin molding to obtain one molded product. You may comprise like the molding apparatus 2 (refer FIG. 28). In that case, it replaces with the press unit 100B and the structure like the following press units 500B can be considered.

  As an example, the press unit 500B includes a cavity 208 that accommodates the mold resin through one film in the lower mold 206, instead of the two rows of cavities 208A and 208B that accommodate the two films and the mold resin. What is necessary is just composition. Furthermore, in the upper mold 204, the workpiece holding mechanisms 240A and 240B that hold the two workpieces described above may be configured to be used as the workpiece holding mechanism 240 that holds one workpiece W together.

(Dispensing unit)
Subsequently, the operation of supplying the film F and the mold resin R will be described in detail mainly with respect to the configuration of the dispense unit 100 </ b> C included in the resin mold apparatus 1.

  As described above, the dispensing unit 100C is a unit that supplies the film F and the mold resin R and the like. In the present embodiment, when the film F and the mold resin R are transported to the mold 202, the transport tool 400 is used as a jig for holding and transporting the film F and the mold resin R. That is, by using the transport tool 400 as a jig, the mold resin R is held and transported together with the film F. Moreover, the conveyance tool 400 can arrange | position and hold | maintain the film F in parallel with the longitudinal direction (it mentions later for details).

  The dispensing unit 100C includes a preparation table 302 on which a transport tool 400 that does not hold the film F and the mold resin R is placed and appropriate cleaning is performed. For example, the conveyance tool 400 carried out from the mold die 202 may cause a malfunction due to adhesion of the mold resin R. Therefore, malfunctions can be prevented by cleaning the surface including a through-hole described later with a brush or a suction mechanism (both not shown).

  Next, a transport tool pickup 304 that holds the transport tool 400 and transports the transport tool between a plurality of predetermined positions (tables) is provided. In addition, as a mechanism for holding the transport tool 400, a known holding mechanism (for example, a configuration having a holding claw and a holding mechanism, a configuration having a suction hole communicating with a suction device, and the like) is provided. (Not shown). For example, it is possible to adopt a configuration in which an uneven portion is provided on the outer peripheral portion of the transport device 400 and the uneven portion is hooked and held by a holding claw erected downward from the lower surface of the transport device pickup 304.

  Here, the transport tool pickup 304 is configured to be movable in the front-rear direction, the left-right direction, and the up-down direction. As a result, the transport tool 400 placed on the preparation table 302 can be held and transported to a film table 308 and a resin dropping table 310 described later.

  Next, the dispensing unit 100 </ b> C has a film roll 306 in which a long film F is wound in a roll shape at a position behind the preparation table 302, and above the film roll 306 (in the present embodiment, obliquely above). And a film table (first table) 308 on which the film F fed from the film roll 306 is cut and held in a strip shape having a predetermined length.

  As an example, the film table 308 and the film roll 306 have a configuration (including an offset in the front-rear and left-right directions) arranged in a layered order from the top in the vertical direction. As a result, the installation area of the apparatus can be reduced as compared with the conventional apparatus in which the respective components are arranged side by side in a plane.

  In the present embodiment, as the film roll 306, two film rolls 306A and 306B are arranged side by side in the left-right direction. Thereby, it becomes possible to simultaneously supply two films F having the same shape on the film table 308. Here, the film rolls 306A and 306B may be supported and installed by the central axis 307a, and supported and installed from below by a plurality of rollers 307b provided at intervals smaller than the outer shape of the film rolls 306A and 306B. Also good. In this case, by setting the film rolls 306A and 306B to be supported by the roller 307b from below, the two film rolls 306A and 306B arranged side by side can be easily replaced without requiring the central shaft 307a to be inserted and removed. Further, the film roll 306 may be sent to the film table 308 by sandwiching and pulling out the end portion or by a driving roller provided in front of the film table 308.

  On the other hand, the film table 308 has a known cutting mechanism (for example, a fixed blade cutter, a hot melt cutter, etc.) as a mechanism for cutting the long film F (not shown). Further, as a mechanism for holding the two films F, a known holding mechanism (for example, a structure having a suction hole communicating with a suction device and adsorbing, etc.) is provided (not shown). In the film table 308, the film F cut here and the transporting tool 400 are combined.

  Here, as shown in FIG. 9, the transport tool 400 according to the present embodiment has a substantially flat shape formed in a plane in which the upper surface and the lower surface are parallel, and holds the film F in the center portion. There are two rows of carry-in film holders (400A and 400B in the figure). Further, in each of the carry-in film holding portions 400A and 400B, a resin formed in a through hole so that each film F is exposed when viewed from above at a position corresponding to each film F (position holding each film F). Input holes 400a and 400b are provided. The resin charging holes 400a and 400b are formed corresponding to the shape of the cavity recess 209 described above, so that when the mold resin R is dropped and held in the resin charging holes 400a and 400b, the mold is properly molded. Resin R can be prepared.

  Further, a plurality of first suction holes 400c for generating a suction force and holding the film are disposed around the resin charging holes 400a and 400b. The first suction hole 400c is communicated via a second suction hole 212b provided in a third holding part 212A described later or a third suction hole (not shown) provided in a transport tool pickup 304 described later. ), A suction force generated by a suction device (not shown) is transmitted. According to the above configuration, the two films F can be held in a state where they are sucked side by side in the left-right direction on the lower surface of the transport tool 400 transported onto the film table 308 by the transport tool pickup 304. In addition, it is good also as a structure which pinches | interposes and hold | maintains the outer periphery of the film F with a holding nail | claw.

  Next, a transport tool 400 (two on the lower surface) that is disposed laterally (as an example, to the right) with respect to the film table 308 and is movable in the front-rear and left-right directions and transported by the transport tool pickup 304. Resin dropping table (second table) 310 on which a film F is held). The resin dropping table 310 is a known holding mechanism (for example, a holding structure having a holding claw and a suction hole communicating with a suction device) as a mechanism for holding the transporting device 400 placed thereon. (Not shown).

  Further, a dispenser 312 is provided at a position higher than the resin dropping table 310 on the side (as an example, on the right side) with the resin dropping table 310 interposed therebetween with respect to the film table 308. The dispenser 312 throws the mold resin R into the resin throwing holes 400a and 400b in the transporting tool 400 placed on the resin dropping table 310, and the film is exposed on the exposed film F (inside the resin throwing holes 400a and 400b). Mount (drop) the mold resin R. The dispenser 312 includes, for example, a hopper 312a for storing the mold resin R, a weight meter 312b for measuring the weight of the dropped resin, and a trough 312c to which the measured mold resin R is sent out by a vibration feeder (not shown). And a nozzle 312d for regulating the dropping position of the mold resin R sent out and dropped from the trough 312c.

  Here, the resin dropping table 310 according to the present embodiment is configured to be movable in the front-rear and left-right directions (illustrated at three positions in FIG. 1). By the movement in the left-right direction, the transport tool 400 placed on the resin dropping table 310 with the film F being held can be moved forward and backward in the downward direction of the dispenser 312. As a result, the transport tool 400 can be moved between an intermediate position between the dispenser 312 and the film table 308 and a position directly below the nozzle 312d of the dispenser 312. Further, the transport tool 400 in a state where the film F on which the mold resin R is mounted is held by the movement in the front-rear direction is transported to a predetermined position (a position where the transport tool 400 is held by a third holding unit 212A described later). It becomes possible. As a modified example, a configuration in which the movement of the movement range is replaced by the dispenser 312 instead of the configuration in which the resin dropping table 310 moves left and right is also conceivable. In addition, instead of the configuration in which the resin dropping table 310 moves back and forth, a configuration in which the movement of the moving range is replaced by a third holding unit 212A (described later) (all not shown) may be considered.

  In addition, while the resin dropping table 310 is moved along a predetermined path in the front-rear and left-right directions, the mold resin R is sent from the two nozzles 312d to the resin charging holes 400a and 400b, thereby being exposed in the resin charging holes 400a and 400b. It becomes possible to spread the mold resin R on the film F with a predetermined thickness evenly. Thereby, it becomes possible to prevent the occurrence of defective products due to the unevenness of the mold resin R on the film F.

  Here, the dispenser 312 according to the present embodiment includes two nozzles 312d that respectively inject mold resin into the two rows of resin injection holes 400a and 400b in the transport tool 400. As an example, one nozzle 312d is disposed at a position corresponding to the right resin charging hole 400a, and the other nozzle 312d is disposed at a position corresponding to the left resin charging hole 400b. In other words, the distance between the centers of the two nozzles 312d and the distance between the centers of the resin injection holes 400a and 400b are configured to be the same. As a result, it is possible to feed the mold resin R while passing through the same corresponding positions of the respective resin loading holes 400a and 400b at the same time, and on the two films F in one path with the shortest moving distance and moving time. It becomes possible to spread the mold resin R. Therefore, the process time can be greatly shortened. In addition, as a modification, it is good also as a structure which has one nozzle and spreads the mold resin R in order on the two films F by predetermined one path | route (not shown).

  Next, a resin heater 314 is provided to heat the mold resin R by heating from the upper surface side of the transport device 400 in a state where the film F on which the mold resin R is mounted is held. In addition, as a structure which heats the conveyance tool 400 (mold resin R), the well-known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is arrange | positioned on the lower surface of the resin heater 314 (not shown). Thereby, it becomes possible to heat simultaneously the mold resin R hold | maintained in the state mounted on the two films F by the conveyance tool 400. FIG.

  Here, the resin heater 314 according to the present embodiment is transported by a third holding unit 212A (described later) from a position on the moving path of the resin dropping table 310, more specifically, directly below the nozzle 312d of the dispenser 312. It is arranged in the middle of the path while moving to the position where 400 is held. Thereby, it becomes possible to perform the process of heating the mold resin R immediately after the mold resin R is put on the film F held on the conveying tool 400 by the nozzle 312d of the dispenser 312. Therefore, in particular, when a resin such as a granule or a powder is used as the mold resin R, the powder resin or the like positioned on the surface is heated and melted and integrated immediately by heating immediately after mounting on the film F. be able to. Accordingly, it is possible to prevent the generation of dust (resin fine powder, etc.) and to prevent the occurrence of malfunctions and product defects due to the diffusion of dust in the apparatus.

  A supply resin measuring device 315 that measures the appearance of the mold resin R dropped and supplied onto the film F in the resin charging holes 400a and 400b may be provided at positions before and after the resin heater 314. This supply resin inspection device 315 is provided with a camera (monocular camera or compound eye camera) above the movement path of the resin dropping table 310, so that the thickness of the dropped mold resin R using these output values and captured images is used. And can be used to record shapes. Accordingly, for example, by storing data by associating actual information with the molding thickness of the molded product Wp, an operator can compare these and select the dropping condition of the mold resin R. it can. Thereby, the traceability regarding supply of mold resin R is ensured, and molding quality can be maintained.

  Next, the second loader 212 that cooperates with each mechanism of the dispensing unit 100C includes a third holding portion 212A. The third holding portion 212A receives the conveying tool 400 placed on the resin dropping table 310 on its lower surface, conveys it to the predetermined holding position of the lower mold 206, and releases the holding of the film F and the mold resin R. The transported tool 400 is transported onto the preparation table 302 described above. The third holding part 212A has a known holding mechanism (for example, a structure having a holding claw and a suction hole communicating with a suction device) as a transporting tool holding part 212a that holds the transporting tool 400. And so on). Furthermore, it has the 2nd suction hole 212b arrange | positioned in the position connected to the 1st suction hole 400c of the conveyance tool 400 hold | maintained in a predetermined position, and generate | occur | produces (transmits) the suction force by a suction device (not shown). Yes. As a result, the predetermined holding position of the lower mold 206 (with the cavity 208 disposed) is maintained while maintaining the state in which the two films F (each with the mold resin R mounted thereon) are arranged side by side and adsorbed on the lower surface of the transport device 400. It is possible to transport to a set position). Note that the third holding portion 212 </ b> A may have a holding claw that holds and holds the outer periphery of the two films F on the lower surface of the transport tool 400.

  Here, the second loader 212 including the third holding unit 212A according to the present embodiment is configured to be movable in the front-rear, left-right, and up-down directions. By the movement in the left-right direction, it is possible to perform an operation of transporting the transport tool 400 (the state in which the two films F on which the mold resin R is respectively mounted) is held from the dispense unit 100C to the press unit 100B. Further, by moving in the front-rear direction, the conveying tool 400 (the state in which the two films F each mounted with the mold resin R are held) is moved from the outside to the inside of the mold die 202 (that is, the upper mold in a state where the mold is opened). 204) and the lower mold 206 can be transported.

  Furthermore, the conveyance tool 400 (two films F each mounted with the mold resin R are placed on the resin dropping table 310 by moving in the vertical direction (in some cases, the movement in the front-rear direction or the horizontal direction may be combined). The operation of holding the held state) becomes possible. In this case, the holding of the two films F on which the mold resin R is mounted is released while holding the transporting tool 400 at a predetermined holding position of the lower mold 206 (position where the cavity 208 is disposed), and two cavities are released. It is also possible to place each of them on a one-to-one basis 208A and 208B (including part of the mold surface 206a). Furthermore, the operation of placing the transporting device 400 in a state where the holding of the film F and the mold resin R is released on the preparation table 302 is also possible. As a modified example, a configuration in which a part of the moving range of the third holding unit 212A is replaced by the movement of another mechanism (the resin dropping table 310, the lower mold 206, etc.) (not shown) may be considered.

  Next, the second loader 212 holds the film (used film) Fd remaining in the lower mold 206 after the resin-molded molded product Wp is taken out of the mold 202 (here, the upper mold 204). And the 4th holding | maintenance part 212B conveyed to the predetermined position (after-mentioned film disposer 316) is provided. In addition, the 4th holding | maintenance part 212B has a well-known holding | maintenance mechanism (For example, the structure which adsorb | sucks with the suction hole connected to a suction device etc.) as a carrying-out film holding part holding the used film Fd. (In the figure, reference numerals 212c and 212d).

  In addition, the fourth holding unit 212B according to the present embodiment has the carry-out film holding units 212c and 212d in the left-right direction at positions corresponding to the two cavities 208A and 208B of the mold 202 (lower mold 206). Two rows are arranged side by side. That is, the film F can be held side by side with its longitudinal direction parallel. Thus, the two used films Fd held side by side in the left-right direction by the mold die 202 (lower mold 206) after resin molding can be simultaneously held in the left-right direction and conveyed.

  Here, in the present embodiment, the fourth holding unit 212 </ b> B and the third holding unit 212 </ b> A are integrally configured as the second loader 212. As an example, the second loader 212 is provided with a third holding part 212A having a transporting tool holding part 212a on the front side, and a fourth holding part 212B having two left and right unloading film holding parts 212c and 212d on the rear side. Is arranged. Therefore, the third holding part 212A and the fourth holding part 212B are configured to be movable in the front-rear, left-right, and up-down directions integrally as the second loader 212. As a result, not only simplification and downsizing of the apparatus configuration can be realized, but also a configuration in which both the film F on which the mold resin R is mounted and the used film Fd can be simultaneously transported two by two can be realized. Shortening is also possible.

  As a modification, it is also conceivable to configure the loader provided with the fourth holding part 212B separately from the loader provided with the third holding part 212A (not shown). In that case, a movable configuration may be used similarly to the third holding unit 212A.

  Next, the dispensing unit 100C includes a film disposer 316 that stores the used film Fd conveyed by the fourth holding unit 212B. As an example, the film disposer 316 is formed in a box shape having an upper portion (upper surface portion) opened. Thus, when the fourth holding unit 212B that transports the used film Fd reaches the position immediately above the film disposer 316, the transport operation of the fourth holding unit 212B is stopped and the holding of the used film Fd is released. As a result, the used film Fd can be dropped and stored in the film disposer 316.

  As described above, according to the configuration according to the present embodiment, two strip-shaped workpieces W are supplied, and the operation of taking out two molded products Wp after processing (resin molding) can be efficiently performed. It is possible to realize a device that can be used. In particular, when two cavities 208A and 208B are provided in one lower mold and two workpieces W are disposed and collectively resin-molded, the state in which the mold resin R is mounted on the two films F is maintained. However, it can be transferred to the cavities 208A and 208B of the lower mold 206. Therefore, compared with the conventional apparatus, productivity can be significantly improved while suppressing the complexity of the process and the apparatus structure. Furthermore, compared to a configuration in which two cavities 208A and 208B are provided in one lower mold 206 and two workpieces W are arranged to cover all with one (one) film F, the amount of film used can be reduced. It is also possible to plan.

  In addition, since the film table 308 used for supplying the film F and the resin dropping table 310 used for supplying the mold resin R can be provided as separate components and processed in parallel, The process time can be shortened compared to the apparatus.

  As described above, as a modification of the resin mold apparatus 1 described above, a compression-molding type resin in which one cavity is provided in one lower mold and one workpiece W is arranged to perform resin molding to obtain one molded product. You may comprise like the molding apparatus 2 (refer FIG. 28). In this case, as the film F, a wide film wider than the film F as the above-described strip film can be used. As this wide film, it is easy to use a square-shaped or rectangular sheet-shaped film F that is wider than a strip film. However, as the wide film, a sheet-fed film F cut into a round shape may be used as long as it is wider than the strip film. In that case, instead of the dispensing unit 100C, a configuration such as the following dispensing unit 500C is conceivable.

  As an example, the dispensing unit 500 </ b> C can be installed by replacing the two rows of carry-in film holding units 400 </ b> A and 400 </ b> B of the transport tool 400 and the large carry-in film holding unit 516 that holds one film F (wide film). What is necessary is just composition. Further, the two rows of carry-out film holding portions 212c and 212d described above may be configured to be able to suck and hold the used film Fd that is two strip films or the used film Fd that is one wide film. Good.

  As described above, with regard to a configuration that can be used by switching between the strip film and the wide film, for example, the third holding unit 212A holds the transport tool holding the two types of transport tools 400 for strip and wide in common. It can be considered to have a configuration including the portion 212a. As the first transport tool 400 held by the transport tool holding section 212a, two rows of carry-in film holding sections 400A so that two films F, which are strip films, can be held side by side with their longitudinal directions parallel to each other. , 400 </ b> B. As the 2nd conveyance tool 400 hold | maintained at the conveyance tool holding | maintenance part 212a, the conveyance tool holding | maintenance which hold | maintains the conveyance tool 400 which has one carrying-in film holding part 516 holding the film F which is one wide film in common is carried out. It can be considered to have a configuration including the portion 212a.

  By adopting such a configuration, depending on whether the workpiece W to be processed into the molded product Wp is a strip workpiece or a wide workpiece W, different transport tools 400 are provided by the common transport tool holding section 212a. Since it can hold | maintain and can carry in the film F with the mold resin R, it can be set as the structure which can supply the film F by simple switching.

  In addition, regarding the configuration that can be used by switching between the strip film and the wide film, the fourth holding unit 212B holds the used film Fd that is two strip films side by side in the left-right direction with their longitudinal directions parallel to each other. A carry-out film holding part 212c in which a plurality of adsorbing parts for adsorbing and holding the used film Fd are arranged in an area overlapping one strip area and a wide area holding the used film Fd which is one wide film. , 212d. In this case, for example, because the positions to be sucked overlap, even if the used film Fd is a strip film for a strip work by using the same suction portion, the used film Fd is a single wide film. Can be adsorbed and held.

  According to this, even when the used film Fd, which is a strip film, is held, or when the used film Fd, which is a wide film, is held by suction, it is adsorbed at a position where the used film Fd can be held. Since the portion is arranged, it is possible to carry out the used film Fd of either the strip film or the wide film without replacing the structure.

(Resin mold operation)
Subsequently, an operation of performing resin molding using the resin molding apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS. 5 to 27 with a focus on operations of the press unit 100B and the dispense unit 100C.

  First, the transport tool pick-up 304 holds the transport tool 400 (the state in which the film F and the mold resin R are not held) that has been cleaned on the preparation table 302, and onto the film table 308 as shown in FIG. Be transported. In this case, the conveyance tool 400 can be conveyed while being held by the holding claws of the conveyance tool pickup 304. On the other hand, the two films F fed from the two film rolls 306A and 306B are each cut into strips having a predetermined length and held on the film table 308.

  Next, as shown in FIG. 12, the lower surface of the transport tool 400 is brought into contact with the two films F on the film table 308 by moving (lowering) the transport tool pickup 304 downward.

  Next, as shown in FIG. 13, a suction force is generated in the first suction hole 400 c of the transport tool 400 via the transport tool pickup 304, and the two films F are adsorbed and held on the lower surface of the transport tool 400. In this state, the conveyance tool pickup 304 is moved (raised) upward.

  Next, as shown in FIG. 14, by moving the transport tool pickup 304 to the side (right side), the transport tool 400 held by the transport tool pickup 304 (the state in which two films F are held). Is conveyed onto the resin dropping table 310.

  Next, as shown in FIG. 15, the two films F on the lower surface of the transport tool 400 are brought into contact with the resin dropping table 310 by moving (lowering) the transport tool pickup 304 downward. In this state, the holding of the transfer tool 400 by the holding mechanism of the transfer tool pickup 304 is released (stopped), and the transfer tool 400 (the state holding the two films F) is placed on the resin dropping table 310. . Thereby, the transport tool pickup 304 holds the transport tool 400 with the film F held on the lower surface side, and a series of operations of transporting from the film table 308 to the resin dropping table 310 is completed.

  Next, by moving the resin dropping table 310 to the side (right side), as shown in FIG. 16, the transfer tool 400 (two films F) placed on the resin dropping table 310 is held. State) is conveyed to a position immediately below the nozzle 312d of the dispenser 312.

  Next, as shown in FIG. 17, using two nozzles 312d, the mold resin R is simultaneously poured into the two rows of resin charging holes 400a and 400b in the transport tool 400. At this time, by measuring the thickness of the workpiece W, the amount of the mold resin R dropped and supplied into the resin injection holes 400a and 400b can be adjusted. The amount of R can be optimized. For example, the mold resin R dropped from the two nozzles 312d is separately measured on the dispenser 312 side, and when a prescribed amount of the mold resin R corresponding to one of the nozzles 312d is dropped, the mold resin R is dropped. On the other hand, the dropping operation is continued until a specified amount of mold resin is dropped.

  Further, when dropping the mold resin R from the two nozzles 312d, the resin dropping table 310 on which the conveying tool 400 is mounted is moved along an arbitrary pattern. As a result, the mold resin R is supplied to a corresponding pattern (a pattern obtained by rotating the above-mentioned arbitrary pattern by 180 degrees) in each of the resin injection holes 400a and 400b. Here, by moving the resin dropping table 310 along a pattern without a gap, the mold resin R is spread on the two films F with a predetermined thickness without any deviation. For example, the resin dropping table 310 is moved along a pattern composed of straight lines connecting adjacent ends of straight lines that divide the resin charging holes 400a and 400b vertically or horizontally into n (n is an integer of 2 or more). As a result, the mold resin R can be supplied uniformly in the entire resin injection holes 400a and 400b. It should be noted that the “straight line” here does not necessarily have an equal interval, and may be bent in the middle.

  Next, by moving the resin dropping table 310 forward, the transfer tool 400 placed on the resin dropping table 310 is transferred while passing through a position directly below the resin heater 314 as shown in FIG. Is done. Thereby, the mold resin R on the film F held by the transport tool 400 is heated. Next, by moving the resin dropping table 310 further forward, as shown in FIG. 19, the transfer tool 400 placed on the resin drop table 310 is moved to a predetermined position (the transfer tool 400 by the third holding portion 212A). To the position where the holding is performed).

  Next, from the state shown in FIG. 19, the lower surface of the third holding part 212 </ b> A is brought into contact with the transport tool 400 on the resin dropping table 310 by moving (lowering) the third holding part 212 </ b> A downward. Next, the third holding unit holds the transport tool 400 with a holding claw. Further, a suction force is generated in the first suction hole 400 c of the transport tool 400 via the third holding part 212 </ b> A, and the two films F are adsorbed on the lower surface of the transport tool 400. While maintaining this state, the transport tool 400 is held by the third holding portion 212A, and the transport tool pickup 304 is moved (raised) upward as shown in FIG.

  Next, by moving the second loader 212, as shown in FIG. 21, the conveying tool 400 held by the third holding portion 212A is moved from the outside to the inside of the mold die 202 (that is, the die is opened). The upper mold 204 and the lower mold 206). On the other hand, prior to the conveyance tool 400 being conveyed to the mold die 202, the two workpieces W held by the first holding unit 210 </ b> A of the first loader 210 are carried into the upper die 204. In this case, first, the first loader 210 moves backward (enters) toward the inner side of the mold, and the molded product Wp formed by resin molding is first performed from the upper mold 204 by the second holding portion 210B. Receive (see FIG. 5). Next, the first loader 210 moves forward inside the mold, and the two workpieces W held by the holding portion 210 </ b> A are delivered to the upper die 204. As a result, as shown in FIG. 21, the two workpieces W carried by the first holding unit 210 </ b> A are held by the upper mold 204, and the workpiece W is sufficiently heated before the conveyance tool 400 is conveyed. Will be.

  Further, prior to the conveyance tool 400 being conveyed to the mold die 202, the used film Fd is held by the fourth holding portion 212 </ b> B of the second loader 212 and is carried out from the lower die 206. In this case, first, the second loader 212 moves backward (enters) toward the inside of the mold, and the used film Fd used when the resin molding is first performed and held by the lower mold 206 is held fourth. Adsorbed and received by the unit 212B (see FIG. 6). Thereby, the conveyance tool 400 can be carried into the mold die 202.

  Next, as shown in FIG. 22, by moving (lowering) the third holding portion 212 </ b> A downward, the two films F (the state in which the mold resin R is mounted) on the lower surface of the transport tool 400 are moved to the lower mold 206. Abutted on top. At this time, each film F (portion on which the mold resin R is mounted) is placed so as to be accommodated in the cavities 208A and 208B.

  Next, the suction force from the first suction hole 400c of the transport tool 400 generated via the third holding part 212A is stopped, and two films F (mold resin R are mounted from the transport tool 400) ) Is released. At this time, the outer edge portion of each film F is placed on the mold surface 206a outside the cavities 208A and 208B so as to hang over one end portion of the suction path 230b. Here, the film F is sucked from the suction path 230b, and the film F is sucked and held on the mold surface 206a outside the cavity 208. Next, by sucking the film F from the suction path 230a, as shown in FIG. 23, the film F is adsorbed and held on the mold surface 206a on the inner surface of the cavity 208 (the mold surface of the cavity recess 209). Thereby, the mold resin R is supplied into the cavity 208 (on the cavity recess 209) through the film F.

  Next, by moving the third holding part 212A, the transport tool 400 is taken out as shown in FIG. At this time, the conveyance tool 400 (the state in which the film F and the mold resin R are not held) held by the third holding part 212A is moved from the inside of the mold die 202 to the outside (that is, when the mold is opened). It is taken out from between the mold 204 and the lower mold 206 to the outside, and is conveyed onto the preparation table 302. Here, the carrier 400 is cleaned and can be reused.

  Next, as shown in FIG. 25, the mold 202 is closed, and the two workpieces W are clamped by the upper mold 204 and the lower mold 206.

  Next, as shown in FIG. 26, the mold pieces R are heated and pressed against the two workpieces W by raising the cavity pieces 226A and 226B of the cavities 208A and 208B relatively, thereby thermosetting. At the same time, resin molding (compression molding) is performed. Thereby, two molded articles Wp are formed.

  Next, as shown in FIG. 27, the mold 202 is opened. At this time, the molded product Wp and the used film Fd are separated, and the two molded products Wp are held in the upper mold 204, and the two used films Fd are held in the lower mold 206. In this state, as described above, each of the molded product Wp and the used film Fd is taken out and transported to complete a set of molding operations.

  In addition, about the mold operation as mentioned above, it is preferable to perform each process in parallel using the some conveyance tool 400 for the efficiency improvement of operation | movement. In this case, it is preferable that the resin mold apparatus 1 includes a plurality of transport tools 400 and the transport tool 400 is circulated in each process described above. That is, a cleaning process for cleaning the transport tool 400 with the preparation table 302, a film setting process for combining the film F with the transport tool 400, a resin dropping process for dropping the mold resin R onto the transport tool 400 combined with the film F, and a mold The operation of each part is controlled by the resin molding apparatus 1 so that the plurality of transfer tools 400 are processed in different processes between the film F and the resin supply process for supplying the mold resin R to the mold 202. What is necessary is just to control a control part (not shown).

  Thereby, the waiting time of the conveyance tool 400 in each process can be shortened, and productivity can be improved. For example, the process of supplying the mold resin R to the film F, which is likely to take time in a normal case, and other processes are performed in parallel, so that the process in the apparatus can be performed efficiently, and the productivity Can be increased.

  In addition, the operation | movement in the case of performing resin molding using the resin mold apparatus 2 which is a modification is basically the same as the operation in the case of performing resin molding using the resin mold apparatus 1 described above. In this case, the apparatus configuration is such that one workpiece W, one film F (and mounting) are respectively provided for two workpieces W, two films F (and mounted mold resin R), and two molded products Wp. The molded resin R) may be made to correspond to one molded product Wp.

  As described above, according to the resin molding apparatus and the resin molding method according to the present invention, the mechanisms for supplying, storing, measuring the thickness, and conveying the workpiece and the molded product are arranged hierarchically in the vertical direction. It is possible to realize the configuration. Therefore, the installation area can be reduced as compared with the conventional apparatus.

  In addition, a configuration in which two workpieces and molded products are arranged and processed can be realized, and two cavities are provided in one lower mold, and a workpiece is placed in each cavity and resin molding is performed simultaneously. Can be achieved. In this way, it is possible to simultaneously transport two workpieces and molded products, two films and a mold resin at the same time, and it is possible to resin mold two workpieces at the same time. It can be greatly shortened. In addition, the apparatus configuration and the process can be simplified.

  The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the present invention. In particular, a compression molding type resin mold apparatus having a cavity in a lower mold has been described as an example, but application to a configuration in which a cavity is provided in an upper mold is also possible.

  In addition, in the overall operation of the resin mold apparatus described above, the resin mold is sequentially performed while performing the resin supply control as described below, thereby maintaining the molding quality (uniform molding thickness) in compression molding. The supply of the important resin may be made uniform.

(Resin supply control)
Hereinafter, the configuration and operation for resin supply control in the present embodiment will be described in detail with reference to the drawings. FIG. 29 is a block chart showing an example of a control configuration of the resin mold device according to the embodiment of the present invention. The control unit CTR is configured by a CPU or the like, and performs supply control of the mold resin R in cooperation with the respective units in the work processing unit 100A and the dispensing unit 100C described above. In addition, the control unit CTR performs display control of the display unit DIS used for the operator's operation, receives input from the input unit INP, and reads and stores necessary information from the storage unit MEM.

  FIG. 30 is a flowchart showing an example of a resin supply operation of the resin mold device according to the embodiment of the present invention. The operations described here correspond to a set of operations (a series of operations) necessary for resin molding of one workpiece W. Further, in the actual resin molding apparatus 1, each operation is performed in parallel on the plurality of workpieces W, and therefore, a necessary time portion of these series of operations is partially overlapped with a time axis. It will go on.

  In the resin supply operation shown in the figure, the control unit CTR first acquires the molding condition information Dc from the storage unit MEM (step S1). Here, the control unit CTR reads, as the molding condition information Dc, from the storage unit MEM, for example, the molding thickness (target value) of the resin portion in the molded product Wp and the pattern for dropping the mold resin R in the transport tool 400. . This mold resin R dropping pattern is stored as an operation control pattern of the resin dropping table 310, but not only the movement position of the resin dropping table 310 constituted by the movement destination points, but also between each point. The moving speed of the resin dropping table 310 is also included. Further, the drop pattern of the mold resin R includes the speed (drop amount per time) at which the mold resin R is dropped from the nozzle 312d.

  On the other hand, the control unit CTR acquires the workpiece information Dw of the workpiece W to be resin-molded from now on (step S2). Here, in the work processing unit 100A, the code reader 115 reads the two-dimensional code attached to the work W taken out from the supply magazine 102 and outputs the code to the control unit CTR, so that the control unit CTR performs the processing for each work W. Work information Dw (for example, serial number) is acquired. Next, the control unit CTR acquires the thickness information Dt (step S3). Here, the workpiece measuring instrument 114 measures the thickness of the workpiece W (details are described above) and outputs the workpiece W to the control unit CTR, so that the control unit CTR has the thickness of the base material Wa and the electronic component Wb in each workpiece W, and the like. Thickness information Dt is acquired.

  Subsequently, the control unit CTR outputs the resin supply setting information Dd1 (step S4). Here, the control unit CTR calculates the amount (weight) of the mold resin R dropped and supplied from the dispenser 312. This is because the electronic component Wb obtained by measuring the thickness of the workpiece W from the volume of the cavity 208 at the time of molding obtained from the molding thickness of the resin portion as a target value and the outer shape (shape in plan view) of the cavity 208. It can be calculated from the volume obtained by subtracting the volume and the specific gravity of the molded resin R after molding (cured state). Next, the control unit CTR outputs the previously read mold resin R dropping pattern together with the calculated value to the dispenser 312 as the resin supply setting information Dd1.

  Subsequently, the dispenser 312 drops the mold resin R into the resin injection holes 400a and 400b on the film F based on the resin supply setting information Dd1. Here, in the dispenser 312, a predetermined amount of the mold resin R is measured by the weight scale 312 b, is sent out by vibration through the trough 312 c, and dropped from the nozzle 312 d. In such a molding resin R dropping operation, it may be difficult to always uniformly drop the molding resin R from the dispenser 312.

  For example, in the hopper 312a in which the mold resin R is stored by the dispenser 312, the size of the grains contained in the upper side and the lower side is likely to be different, and the grain size of the mold resin R changes depending on the timing of dropping. Can happen. In addition, since the delivery speed varies depending on the particle size of the mold resin R when it is sent out on the trough 312c by the vibration feeder, even if it is operated to drop with the same drop pattern, the actually dropped mold resin R is made uniform. It can be difficult. For this reason, in the dispenser 312, there may be a case where the mold resin R is not dropped according to the resin supply setting information Dd1 (the weight of the supplied mold resin R) output from the control unit CTR. On the other hand, when the dispenser 312 outputs the actual supply amount information Dd2 as the amount (weight) of the actually supplied mold resin R to the control unit CTR, the control unit CTR acquires the actual supply amount information Dd2 ( Step S5).

  Then, control part CTR acquires supply resin shape information Dr (Step S6). Here, the supply resin tester 315 measures the appearance of the mold resin R dropped on the film F. For example, the camera as the supply resin inspector 315 images the mold resin R mounted on the film F in the transport tool 400 placed on the resin drop table 310, and controls the captured image as the supply resin shape information Dr. Output to the unit CTR.

  Next, the control unit CTR acquires the molded product information Dp (step S7). Here, the molded product measuring instrument 118 measures the thickness of the molded product Wp for the molded product Wp molded with the mold resin R prepared as described above. Subsequently, by outputting this measurement value to the control unit CTR, the control unit CTR acquires the molded product information Dp as the thickness of the (resin molded part) in each molded product Wp.

  Subsequently, the control unit CTR associates the plurality of pieces of information acquired as described above with the work information Dw as acquisition information related to the resin mold of one work W and stores it in the storage unit MEM (step S8). By storing the acquired information in the storage unit MEM, the operator confirms the state of the resin mold actually performed in the apparatus using the display unit DIS, and makes necessary changes from the input unit INP. It can also be used for quality control and the like. Note that as the resin supply control, traceability may be ensured by performing only the above steps.

  When performing further control within the apparatus, the control unit CTR determines whether or not the resin supply is appropriate using the information acquired as described above (step S9). Here, for example, the control unit CTR compares the molding condition information Dc as the target value of the molding thickness of the resin portion with the molding product information Dp as the thickness of the (resin molding portion) in the molded product Wp. According to this, when the difference between the target value and the actual thickness of the molded product Wp exceeds a predetermined value (allowable value), it can be determined that the resin supply is not appropriate.

  Subsequently, the control unit CTR adjusts the resin supply setting information Dd1 for the next workpiece W (step S10). Here, for example, when calculating the weight of the mold resin R dropped and supplied from the dispenser 312, the mold resin supplied depending on whether the difference between the target value and the thickness of the molded product Wp is a positive value or a negative value. By setting the correction value for correcting the weight of R to be positive or negative, the subsequent forming thickness of the workpiece W can be brought close to the target value.

  As another example of the operation of step 9, the control unit CTR, for example, the resin supply setting information Dd1 as the weight of the supplied mold resin R and the actual supply amount information Dd2 as the amount (weight) of the actually supplied mold resin. And compare. According to this, when the difference between the set value and the actual value exceeds a predetermined value (allowable value), it is determined that the resin supply is not appropriate. In this case, in step 10, the control unit CTR can increase or decrease the amount of the mold resin R that is weighed and dropped by the weight scale 312b to be supplied for the subsequent work W.

  As another example of the operation of step 9, the control unit CTR determines whether or not the resin supply is appropriate based on the supply resin shape information Dr that is a captured image of the mold resin R mounted on the film F, for example. to decide. Here, the captured image of the mold resin R is divided into predetermined sections (n rows and m columns), and a variation is calculated by comparing the sections in the captured image, and whether or not the resin supply is appropriate based on the variation. Judging. For example, the distribution of the color and brightness (the product of the color density and the number of pixels) of the image constituting each section is acquired, and based on the magnitude of the variation in the resin drop amount expressed as the color density for each section To determine whether the resin supply is appropriate.

  For example, in the case of a black epoxy resin generally used for a resin mold, if the amount of the mold resin R supplied in a predetermined section increases, the mold resin R becomes dense and the gap between the mold resins R is small. Become. In this case, since the film F (for example, milky white) located under the mold resin R is difficult to appear, the image approaches the color (black) of the mold resin R. For this reason, for example, when the mold resin R is dropped evenly, a section where a lot of film F is captured and the color of the image is light and a section where the film F is not captured and the color of the image is dark are mixed. Will do. As described above, when the density of the image is greatly different in each section (when the variation is large), it is determined that the resin supply is inappropriate. In this case, in step 10, instructions relating to the resin supply in the subsequent workpiece W are adjusted. For example, the control unit CTR decreases the moving speed of the resin dropping table 310 or increases the dropping speed of the mold resin R from the nozzle 312d so that more mold resin R is dropped in the section where the image becomes thin. You can make it. On the other hand, the control unit CTR increases the moving speed of the resin dropping table 310 or decreases the dropping speed of the mold resin R from the nozzle 312d so as to reduce the mold resin R dropped in the section where the image is dark. can do.

  As described above, the control unit CTR performs the operation of adjusting the resin supply setting information Dd1 of the next workpiece W based on the acquired information, thereby uniformly supplying the mold resin R that is important for maintaining the quality in compression molding. It can be made.

  In the above description, the characteristics of each unit in the molding apparatus have been described. However, this is a unit that performs processing and processing on a common workpiece, and the configuration and operation performed in any unit are the same in other units. There is no problem. Further, in the present application, the functions of these units have individual effects even in unit units, and encompass the invention as a single unit. For example, in the dispensing unit, it is possible to prepare a combination of a film and a transporting tool and supplying a mold resin. For this reason, even if a dispensing unit and a press unit are separately prepared and used, the same effect may be obtained.

  In the above description, an example in which two workpieces W, which are strip workpieces, are transported and molded in the molding apparatus 1 in a state where their longitudinal directions are arranged in parallel has been mainly described. However, a configuration may be adopted in which three workpieces W, which are strip workpieces, are transported and molded in the molding apparatus 1 in a state in which their longitudinal directions are arranged in parallel. In addition, considering the convenience of exchanging molds, an example in which the workpiece W, which is a strip workpiece, is transported and molded in the molding apparatus 1 in a state where the workpieces W are arranged in parallel in the longitudinal direction of the apparatus, has been mainly described. However, it is good also as a structure which conveys and shape | molds in the molding apparatus 1 in the state which arranged this workpiece | work W so that it might become parallel to the left-right direction of an apparatus. In this case, if the supply magazine elevator 103 and the storage magazine elevator 113 are arranged on the left side of the work processing unit 100A, the work W can be efficiently conveyed without rotating the direction of the work W.

  Moreover, although the example which cut | disconnects and prepares the strip or wide film F from a roll film was demonstrated above, the mold metal which does not use the film F about what is not related to the film F by invention of embodiment mentioned above. It can also be carried out when compression molding using the mold 202 is performed. In this case, a dedicated conveying tool that conveys only the mold resin R is used. Moreover, it is good also as a structure using the exclusive conveyance tool which installs a roll film in the press units 100B and 500B, supplies the film F, and conveys only the mold resin R, without using the strip or the wide film F. In this transporting tool, the lower part of the position where the mold resin R is accommodated can be opened and closed, so that the mold resin R can be transported in the closed state and supplied to the cavity 208 in the open state.

1, 2 Resin molding apparatus 100A, 500A Work processing unit 100B, 500B Press unit 100C, 500C Dispense unit 103 Supply magazine elevator 104, 104A, 104B Supply rail 108, 108A, 108B Storage rail 113 Storage magazine elevator 114 Work measuring instrument 116 Work Heater 118 Molded product measuring instrument 120 Supply pickup 122 First storage pickup 124 Second storage pickup 202 Mold die 204 Upper die 206 Lower die 210 First loader (first transport unit)
212 Second loader (second transport unit)
302 Preparation table 304 Carrier pick-up 306, 306A, 306B Film roll 308 Film table (first table)
310 Resin drop table (second table)
312 Dispenser 314 Resin heater 400 Transporter F Film Fd Used film R Mold resin W Work Wp Molded product

Claims (6)

The workpiece is resin-molded using a mold that includes an upper mold that holds a workpiece on which electronic components are mounted on a base material, and a lower mold in which a cavity recess to which mold resin is supplied via a film is formed. A resin molding device for processing into a molded product,
A through-hole corresponding to the shape of the cavity concave portion is formed;
A first table in which the film fed from a film roll and cut to a predetermined length is held, and the cut film and the transport device are combined;
A second table configured to be movable by placing the transport tool in a state where the film is held on the lower surface side;
A transport pickup that holds the transport tool in a state where the film is held on the lower surface side and transports the transport tool from the first table to the second table;
A resin mold apparatus comprising: a dispenser that puts the mold resin into the inside of the through hole in the transporting tool placed on the second table. The carrier has two rows of film holding portions so as to hold the two films side by side in the left-right direction as the through-holes, and has a resin insertion hole corresponding to each film in each of the film holding portions. The resin molding apparatus according to claim 1. 3. The resin mold apparatus according to claim 1, wherein the first table and the film roll are arranged side by side in a hierarchical manner in the vertical direction. The resin mold apparatus according to claim 1, further comprising a resin heater that heats the film and the mold resin from an upper surface side of the transport tool. The carrier is
A cleaning process for cleaning the transport tool, a film setting process for combining the film with the transport tool, a resin dropping process for dropping the mold resin onto the transport tool combined with the film, and the film on the mold 5. A resin molding apparatus according to claim 1, wherein a plurality of processes are performed in different steps of a resin supply step for supplying the mold resin and a resin supply step for supplying the mold resin. A resin molding method for performing resin molding using the resin molding apparatus according to any one of claims 1 to 5,
A plurality of the conveying tools are provided,
A cleaning process for cleaning the transport tool, a film setting process for combining the film with the transport tool, a resin dropping process for dropping the mold resin onto the transport tool combined with the film, and the film on the mold And a resin supply process for supplying the mold resin, wherein the plurality of conveying tools are processed in different processes.

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