JP2021118244A - Resin molding device and resin molding method - Google Patents

Abstract

To provide a resin molding device that improves the molding quality by supplying an appropriate amount of resin for each workpiece without generating dust and does not generate unnecessary resin in a molded product.SOLUTION: A resin molding device includes a sheet resin supply unit 14 that supplies a single-wafer sheet-like resin R, a sheet-shaped resin removing unit 18 removes a part of the sheet-shaped resin R supplied from the sheet-shaped resin supply unit 14, which is surplus with respect to the work W in which the mounting rate of an electronic component Wt exceeds a reference value, and a resin loader 4 that conveys an appropriate amount of sheet-shaped resin R removed by the sheet-shaped resin removing unit 18 to a mold 2.SELECTED DRAWING: Figure 1

Description

The present invention relates to a resin molding apparatus that supplies a required amount of sheet-like resin to a resin mold onto a work on which electronic components are mounted on a substrate and compression-molds the resin, and a resin molding method using the same.

There are roughly two molding methods, transfer molding and compression molding, as a method of resin molding a work on which a semiconductor chip or an electronic component is mounted using a thermosetting resin. In transfer molding, a resin melted by heating using a mini tablet (solid resin) is mainly filled in a cavity through a runner and a gate. Further, in compression molding, liquid resin, granular resin, and sheet resin are used, and at present, liquid resin and granular resin are often used from the viewpoint of cost and handling (see Patent Documents 1 and 2). The sheet-shaped resin is in the development stage and has not been mass-produced in the field of semiconductor molding equipment.

JP-A-2019-145550 JP-A-2010-179507

In recent years, the thickness of the package part (resin sealing part) has become thin, and especially when molding a work in which a semiconductor chip is wire-wired, the wire is thin and becomes a long wire at a narrow pitch, so transfer molding is performed. The compression molding of the lower cavity movable type, which involves almost no resin flow, has become the mainstream rather than the compression molding of the upper cavity movable type. The reason for this is that in transfer molding, the resin is pumped from the pot to the cavity, so that wire flow is likely to occur in the cavity due to the resin flow. There are two more types of compression molding. In the compression molding of the upper cavity movable type, resin is generally supplied on the work and set in the mold, so the wire of the semiconductor chip on the work interferes with the resin and deforms. It ends up. In the compression molding of the lower cavity movable type, such a problem may not easily occur because the wire enters the resin when the resin is supplied into the cavity in advance and melted. Further, even in the case of compression molding of the lower cavity movable type, there is an increasing need for compression molding using an appropriate amount of resin without excess resin, which uses 100% of the resin. The reason is that depending on the work, the semiconductor chip may not be mounted on the substrate due to a defect in the semiconductor chip mounting location, etc., and there is a difference in the semiconductor chip mounting amount for each work, and the resin supply amount is increased or decreased each time to supply an appropriate amount. There is a need. If molding is performed with a small amount of resin, filling defects will occur. Therefore, there is a method of molding by overflowing the surplus resin into the overflow cavity in anticipation of the surplus resin in advance, but when the resin is discharged across the substrate, a problem that vertical resin burrs are formed on the side surface of the substrate occurs. Further, although an overflow cavity may be provided on the substrate, it is necessary to provide a surplus resin region on the substrate, which increases the cost of the substrate.

Mold resins used for compression molding include powder resin, granular resin, liquid resin, etc., but powder resin is difficult to handle due to dust flying, and liquid resin is difficult to uniformly supply to the mold. Yes Molding difference is likely to occur. In some cases, resin is supplied onto a work or a film for molding outside the mold and transported to the mold at once, but it is difficult to handle because it is liquid. Therefore, at present, granular resins that are easy to supply in an appropriate amount and do not require the disposal cost of defective resins are widely used.
However, in the granule resin, the outer diameter of the granules is not uniform and some variations occur, so that it may be difficult to adjust a small amount of the appropriate amount. Further, since it is difficult to wind it flat in the cavity, it is XY-moved to the cavity while being dropped from the trough by applying vibration with a parts feeder and sprinkled flat. At this time, since the granule resin is vibrated, the resins rub against each other, so that dust is likely to fly and cannot be completely removed even if air suction or an ionizer is provided. If this dust adheres to the moving part and accumulates and solidifies, it may cause malfunction, and if it adheres to the substrate, it may cause dents.

The present invention has been made in view of the above circumstances, and provides a resin molding apparatus and a resin molding method that improve molding quality by supplying an appropriate amount of resin for each work without generating dust and do not generate unnecessary resin in a molded product. With the goal.

A resin molding device in which a workpiece on which electronic parts are mounted on a substrate and a mold resin are carried into a mold and are compression-molded. The sheet-shaped resin supplied from the above was removed by a sheet-shaped resin removing section that removes an excess amount of resin for a work whose mounting rate of electronic parts exceeds a standard value, and a sheet-shaped resin removing section. It is characterized by including a resin transporting portion for transporting an appropriate amount of sheet-shaped resin to a mold.
By using the above resin molding device, by supplying the sheet-shaped resin, it is possible to supply and transport the resin without generating dust, and the electronic component mounting rate exceeds the standard value. Since the excess amount of resin is removed, an appropriate amount of resin can be supplied for compression molding.

In the work, the lower limit of the mounting rate of the electronic components mounted on the substrate is set as the reference amount of the sheet-like resin that can be molded without removing the lower limit. , It is preferable to remove a part of the sheet-shaped resin by the amount in which the mounting rate of the electronic component is increased from the lower limit value.
As a result, it is possible to select non-defective work and defective work that can be molded according to the mounting rate of electronic components, and the mounting rate of electronic components mounted on the substrate is a sheet-like resin that can be molded without removing the lower limit. The amount of sheet-like resin to be removed is uniquely determined by setting the standard amount of resin, and the amount of resin can be finely adjusted by reducing the amount of resin by the amount that the mounting rate of electronic components increases from the lower limit. An appropriate amount of resin according to the work can be supplied.

The excess resin amount may be calculated from the result of measuring the electronic components mounted on the substrate to calculate the removed area.
Specifically, a weigh scale side portion for measuring the weight of the single-wafer sheet-shaped resin supplied from the sheet-shaped resin supply unit may be provided.
As a result, the weight of the sheet-like resin is accurately measured on the side of the weigh scale and converted into volume, and since the thickness of the sheet-like resin is constant, the removal area is calculated and one of the sheet-like resins. The part can be removed.

A resin molding device in which a workpiece on which electronic parts are mounted on a substrate and a mold resin are carried into a mold and are compression-molded. The sheet-shaped resin supplied from the above was removed by the sheet-shaped resin removing section for removing the excess resin volume for the work whose mounting rate of electronic parts exceeds the standard value, and the sheet-shaped resin removing section. It is characterized by including a resin transporting portion for transporting a sheet-shaped resin having an appropriate volume to a mold.
Also in this case, since the excess resin volume is removed for the work in which the mounting rate of the electronic components exceeds the reference value, an appropriate amount of resin can be supplied for compression molding.

In the work, the lower limit of the mounting rate of the electronic components mounted on the substrate is set as the reference volume of the sheet-like resin that can be formed without removing the lower limit, and when the mounting rate of the electronic components increases more than that, the sheet-shaped resin removing portion is , It is preferable to remove a part of the sheet-like resin only by the volume integral in which the mounting rate of the electronic component is increased from the lower limit value.
In this case as well, it is possible to select good and defective workpieces that can be molded according to the mounting rate of electronic components, and the mounting rate of electronic components mounted on the substrate is a sheet shape that can be molded without removing the lower limit. By setting the standard amount of resin, the amount of sheet resin to be removed is uniquely determined, and the sheet resin can be finely adjusted by reducing the amount of body integral when the mounting rate of electronic components increases from the lower limit. It is possible to supply an appropriate amount of resin according to each work.

The excess resin volume may be calculated from the result of measuring the electronic components mounted on the substrate to calculate the removed area.
Specifically, an imaging unit that captures the volume of the sheet-shaped resin supplied from the sheet-shaped resin supply unit may be provided.
As a result, by accurately measuring the area of the sheet-like resin imaged by the imaging unit, the thickness of the sheet-like resin is constant, so the removal area is calculated by calculation and a part of the sheet-like resin. Can be removed.

The sheet-shaped resin removing portion preferably divides the sheet-shaped resin into a plurality of pieces. As a result, in the case of the sheet-like resin from which the excess resin has been removed, the sheet-like resin divided into the areas where the electronic components are defective is supplied to minimize the flow of the resin and suppress the generation of voids. In the case of a sheet-like resin having no surplus resin, it is possible to prevent air from being entrained with the film surface by supplying the resin in a divided manner.

As the sheet-like resin, it is preferable to use a plate-like resin formed in a porous shape or a sheet-like resin having a large number of through holes.
As a result, it is possible to prevent the entrainment of air in the sheet-shaped resin supplied on the film and suppress the generation of voids.

This is a resin molding method in which a work on which electronic parts are mounted and a mold resin are carried into a mold and compression-molded, and a process of acquiring work information on the electronic part mounting rate for each work supplied from the work supply unit. From the work information, the process of calculating the amount of excess resin for a work whose mounting rate of electronic parts exceeds the standard value, and the mounting rate of electronic parts from the sheet-shaped resin supplied from the resin supply unit are the standard values. Includes a resin removing step of removing an excess amount of resin for a work exceeding the above, and a step of carrying the work and an appropriate amount of sheet-shaped resin into the mold and clamping and compressing them. It is characterized by.

According to the above resin molding method, work information regarding the electronic component mounting rate is acquired for each work supplied from the work supply unit, and the amount of resin that is surplus for the work in which the electronic component mounting rate exceeds the standard value is calculated. Then, in order to remove the excess amount of resin from the sheet-shaped resin supplied from the resin supply unit for the work whose mounting rate of electronic parts exceeds the standard value, an appropriate amount of resin is supplied to the mold for each work. It can be compression molded. Therefore, dust does not scatter when the resin is supplied, and an appropriate amount of resin can be supplied to each work to mold the resin, so that the molding quality is improved and unnecessary resin is not generated in the molded product.

It is preferable to include a weighing step of weighing the sheet-shaped resin supplied from the resin supply unit and weighing the sheet-shaped resin from which a part of the excess has been removed.
As a result, since it is possible to always mold with an appropriate amount of sheet-shaped resin, surplus resin is not discharged into the mold even if the sheet-shaped resin is used, so that the resin supply accuracy can be improved.

This is another resin molding method in which the work on which the electronic parts are mounted on the substrate and the mold resin are carried into the mold and compression-molded. The process of acquiring, the process of calculating the excess resin volume for a work whose mounting rate of electronic parts exceeds the standard value from the work information, and the step of mounting electronic parts from the sheet-shaped resin supplied from the resin supply unit. A resin removing step of removing the surplus body integral for a work whose rate exceeds the reference value, and a step of carrying the work and an appropriate amount of sheet-shaped resin into the mold and clamping them to perform compression molding. It is characterized by including.
According to the above resin molding method, by supplying the sheet-shaped resin, it is possible to supply and transport the resin without generating dust, and the electronic component mounting rate exceeds the standard value. Since the excess volume integral of the resin is removed, an appropriate amount of resin can be supplied for compression molding.

According to the present invention, it is possible to provide a resin molding apparatus and a resin molding method that improve molding quality by supplying an appropriate amount of resin to each work and molding the resin without generating dust, and do not generate unnecessary resin in the molded product. can.

It is a layout block diagram which shows an example of a compression molding apparatus. It is an enlarged layout block diagram of the resin supply device of FIG. FIG. 3A is a plan view of the sheet-shaped resin supply magazine shown in FIG. 1, and FIG. 3B is a side view thereof. It is a schematic diagram which shows the relationship between the chip mounting rate in the work of FIG. 1 and the removal amount in a sheet-like resin removal stage. It is a top view which shows the state of the sheet-like resin removal stage of FIG. It is explanatory drawing which shows the removal example of a sheet-like resin. It is explanatory drawing which shows the removal example by the different removal method of a sheet resin. It is explanatory drawing which shows the removal example by the further different removal method of a sheet resin. It is explanatory drawing which shows a different example of the removal part of a sheet-like resin. It is explanatory drawing which shows the layout in the cavity or the carrier where the sheet-like resin after removal is supplied. It is a layout block diagram of the resin molding apparatus for different workpieces. It is an enlarged layout block diagram of the resin supply apparatus which cuts out and partially removes a sheet-shaped resin roll.

(overall structure)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 describes the layout configuration of the resin molding apparatus according to the embodiment of the present invention with reference to FIG. The resin molding device exemplifies the lower cavity type compression molding device 1, and the work W is a strip-shaped strip substrate Wb on which electronic components Wt are mounted in a matrix, a semiconductor wafer, or a circular or rectangular carrier Wa. The case where the electronic component Wt is mounted in a matrix will be described as an example. Further, in all the drawings for explaining each embodiment, members having the same function may be designated by the same reference numerals, and the description of the repetition thereof may be omitted.

The compression molding apparatus 1 carries in and out the work W supplied from the work processing unit A (including the work supply unit and the work storage unit) to the mold 2 of the press unit C by the work transfer unit B, and carries out the resin supply unit D. A film F carries an appropriate amount of the sheet-shaped resin R from the (resin supply device) into the mold by the resin transport unit E. In the press unit C, the work W and an appropriate amount of the sheet-shaped resin R are carried into the mold die 2, and these are clamped and compression-molded. The work processing unit A mainly supplies the work W and stores the molded product Wp after the resin molding. The press unit C mainly performs processing into a molded product Wp by resin-molding the work W. The resin supply unit D mainly supplies the film F and the mold resin R, and disposes of the used film F after the resin molding to the film disposer G.

First, in the work W, which is a product to be molded, a plurality of electronic components Wt are mounted in a matrix on a substrate. More specifically, it is not limited to a resin substrate, a ceramic substrate, a metal substrate, and a substrate with wiring formed in a strip shape, but a plate-shaped member (strip-shaped strip) such as a carrier plate, a lead frame, and a wafer as a base material. Work) (hereinafter collectively referred to as "board"). Further, examples of the electronic component Wt include a semiconductor chip, a MEMS chip, a passive element, a heat radiating plate, a conductive member, a spacer, and the like. As will be described later, there may be an example of device modification that can be applied when a substrate having a rectangular shape or a circular shape is used. Further, the work W uses an adhesive tape having heat peelability and an ultraviolet curable resin that is cured by ultraviolet irradiation, in addition to having a plurality of electronic components Wt eluted and mounted on a substrate for flip chip mounting, wire bonding mounting, etc. The electronic component Wt may be attached.

On the other hand, as an example of the sheet-shaped resin R, a thermosetting resin (for example, a filler-containing epoxy resin or a silicone-based resin) is molded into a plate shape, a film shape, or a sheet shape, and even if it is locked. Even the rolled one may be in the form of a single leaf. Alternatively, when a long resin having one or both sides sandwiched between protective films is used, it is necessary to provide a means for peeling off the protective film. Further, the sheet-shaped resin may be porous as long as the density is constant. Here, the thin and uniform resin is referred to as a sheet-like resin.

Further, as an example of the film (release film) F, a film material having excellent heat resistance, ease of peeling, flexibility, and extensibility, for example, PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), etc. PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride and the like are preferably used. As the film F, for example, a strip-shaped film having a size required for forming the strip-shaped work W corresponding to the strip-shaped work W can be used.

Hereinafter, a schematic configuration of each part of the compression molding apparatus 1 shown in FIG. 1 will be described.
In this embodiment, two cavities 2a and 2b are provided in the lower mold of the mold mold 2, two workpieces W are arranged, and resin molding is performed collectively to obtain two molded products Wp at the same time. The molding apparatus 1 will be described as an example.
As shown in FIG. 1, the work processing unit A, the press unit C, and the resin supply unit D are arranged side by side in this order. An arbitrary number of guide rails (not shown) are provided in a straight line across the processing portions, and the work loader 3 (work transport portion B), the film F, and the sheet-like resin for transporting the work W and the like are provided. A resin loader 4 (resin transporting unit E) for transporting R or the like is provided so as to be movable between the processing units along an arbitrary guide rail. Since the work loader 3 not only carries in the work W or the like to the mold mold 2 but also carries out the molded product Wp from the mold mold 2, it also functions as an offloader.

By changing the configuration of each of the above units, the configuration mode of the compression molding apparatus 1 can be changed. For example, the configuration shown in FIG. 1 is an example in which three press units C are installed, but it is also possible to install only one press unit C, or to install two or four or more press units in combination. be. It is also possible to install other units. For example, it is possible to install a unit that supplies a mold resin R such as a tablet resin or a liquid resin different from the resin supply unit D, or a unit that supplies a member to be assembled with the work W in the mold (not shown). ..

(Work processing unit A)
In the work processing unit A, a supply magazine 5 in which a plurality of works W are stored and a storage magazine (not shown) in which a plurality of molded products Wp are stored are arranged so as to be vertically overlapped with each other. Each magazine is provided so as to be able to move up and down by an elevator mechanism (not shown). Known stack magazines, slit magazines, and the like are used for the supply magazine 5 and the storage magazine (not shown), and in the present embodiment, the work W and the molding are all in a state where the mounting surface of the electronic component is facing downward. Each item Wp is stored. From the viewpoint of protecting electronic components, it is preferable to use a slit magazine in which both ends of the work W are inserted into the recesses facing each other inside the magazine frame to hold the upper and lower work Ws apart from each other. Further, the work W can be supplied from a predetermined position by holding the supply magazine 5 and moving it up and down by an elevator mechanism (not shown). Similarly, by holding the storage magazine by an elevator mechanism (not shown) and moving it up and down, the molded product Wp can be stored at a predetermined position.

A supply rail 6 on which work W extruded one by one from the supply magazine 5 is placed is provided in front of the supply magazine 5 (upper side of FIG. 1). In the present embodiment, the relay rail 7 for passing the work W is provided between the supply magazine 5 and the supply rail 6, but this may be omitted. A known pusher or the like (not shown) is used to move the work W from the supply magazine 5 to the supply rail 6.

Here, the supply rail 6 supports the longitudinal side of the work W from below while avoiding the mounting position of the electronic component, and guides the work W laterally in the front-rear direction. Further, the supply rail 6 is provided with a moving mechanism (not shown) capable of moving the two workpieces W in the left-right direction side by side (6a, 6b in the figure) arranged side by side in the lateral direction. As a result, the work W taken out from the supply magazine 5 is placed in one row (for example, 6a), and then the supply rails 6a and 6b are moved in either the left or right predetermined direction (for example, the right direction), and then the supply rails 6a and 6b are moved to the next. Work W can be placed in the other row (for example, 6b).

A work measuring instrument 8 is provided below the supply rail 6. The work measuring instrument 8 measures the thickness of the work W from the lower surface side (the side on which the electronic component is mounted) with respect to the work W moving in the front-rear and left-right directions on the supply rail 6. Specifically, the work measuring instrument 8 has two thickness sensors that measure the thickness of each of the two works W on the two rows of supply rails 6a and 6b. As the thickness sensor, a laser displacement meter or a camera (monocular camera or compound eye camera) is used, and the thickness of the work W is measured based on these output data. The "thickness measurement" referred to here includes necessary measurements such as presence / absence of mounting of electronic components on the board, measurement of mounting height of electronic components, measurement of mounting position deviation, measurement of the number of mounted components, and the like. .. Based on the result of "thickness measurement" here, for example, the volume of the electronic component mounted on the work W is calculated from the presence or absence of the electronic component mounted and the mounting height, and the supply amount of the sheet-shaped resin R described later is calculated. By adjusting, the molding thickness of the molded product can be controlled with high accuracy. The work measuring instrument 8 is fixed and measurement is performed by moving the work W. However, the work measuring instrument 8 may be scanned back and forth and left and right while the work W is stationary for measurement. Further, it may have a configuration in which one thickness sensor is provided and two workpieces W are sequentially measured in a predetermined scan. Further, when the amount of electronic components mounted on the work W is separately input to the compression molding apparatus via the control unit, the work measuring unit 8 may be omitted.

The work measuring instrument 8 may be configured to read not only the thickness of the work W but also the identification information (for example, a two-dimensional code) attached to the work W. Further, a code reader capable of reading the two-dimensional code of the work W can be provided either above or below the relay rail 7. As the identification information of such a work W, for example, by assigning it as a serial number or a unique code, it is possible to identify which work W it is. Traceability can be enhanced by recording the identification information in association with the detailed conditions of the resin mold.

The work W placed on the supply rail 6 is held by the supply pickup 9 and conveyed to a predetermined position. As a mechanism for holding the work W, it has a known holding mechanism (for example, a structure having a holding claw to hold the work W, a structure having a suction hole communicating with a suction device, and the like). Illustrated). The supply pickup 9 is configured to be movable in the left-right and up-down directions. As a result, the work W mounted on the supply rail 6 is held and raised, so that the work W can be finally delivered to the work loader 3 described later. The supply pickup 9 has a configuration in which holding mechanisms are arranged side by side in the left-right direction at positions corresponding to the two workpieces W on the supply rails 6a and 6b. As a result, the two workpieces W on the two rows of supply rails 6a and 6b can be simultaneously held and conveyed in a state of being arranged in the left-right direction.

A work heater 10 for heating the work W from the lower surface side is provided between the supply magazine 5 and the supply rail 6, that is, at the position of the relay rail 7. A known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is provided on the upper surface of the work heater 10 (not shown). The work heater 10 is arranged above the supply rail 6 so as to be movable back and forth with respect to the lower surface side of the work W held by the supply pickup 9. As a result, by preheating the work W before it is carried into the mold 2 and heated, the elongation of the work W in the mold 2 is suppressed. The work heater 10 may be provided on the work loader 3 without being provided at the position of the relay rail 7.

The work loader 3 has a first holding portion 3A having two rows of left and right workpiece holding portions 3a and 3b on the front side (lower side of FIG. 1), and two rows of left and right molded product holding portions on the rear side (upper side of FIG. 1). It integrally has a second holding portion 3B having 3c and 3d. As a result, not only the device configuration can be simplified and miniaturized, but also the work W and the molded product Wp can be simultaneously conveyed by two at the same time, so that the process time can be shortened. The loader provided with the first holding portion 3A and the loader provided with the second holding portion 3B may be configured separately.

The work W conveyed by the supply pickup 9 is placed on the first holding portion 3A when the work W is moved to a position lateral to the supply rail 6 (for example, to the right in FIG. 1). When handing over the work W, the supply pickup 9 rises further on the supply rail 6 through the preheating process, and then moves to the right, so that the first holding portion located on the right side of the supply rail 6 Hand over to 3A. The first holding portion 3A includes two work holding portions 3a and 3b for holding the mounted work W. Each work holding portion has a known holding mechanism (for example, a structure having a holding claw for holding, a structure having a suction hole communicating with a suction device, and the like).

The two work holding portions 3a and 3b provided in the first holding portion 3A are arranged side by side in two rows in the left-right direction at positions corresponding to the two works W held by the supply pickup 9. That is, the work W can be held side by side with its longitudinal direction parallel to each other. As a result, the two workpieces W held side by side in the left-right direction by the supply pickup 9 can be simultaneously placed on the work holding portions 3a and 3b without being rearranged in the same arrangement and conveyed to the mold mold 2. can.

Further, the work loader 3 in which the work W is held by the first holding portion 3A is configured to be movable in the front-back, left-right, and up-down directions. By moving in the left-right direction, the work W can be conveyed from the work processing unit A to the press unit C. On the other hand, by moving in the front-rear direction, the work W can be conveyed from the outside of the mold mold 2 to the inside (that is, between the upper mold and the lower mold in the opened state). Further, by moving in the vertical direction, the work W can be conveyed (delivered) to a predetermined holding position of the upper mold inside the mold mold 2. As a modified example, instead of the configuration in which the first holding portion 3A moves left and right, a configuration in which the movement in the moving range is replaced by the supply pickup 9 can be considered. Further, instead of the configuration in which the first holding portion 3A moves up and down, it is conceivable to have a configuration in which the movement of the moving range is replaced by the mold opening / closing mechanism of the mold mold 2 (all not shown).

Next, the second holding portion 3B for transporting the molded product Wp from the mold mold 2 to a predetermined position outside the mold includes molded product holding portions 3c and 3d for holding the molded product Wp. Each molded product holding portion has a known holding mechanism (for example, a structure having a holding claw for holding, a structure having a suction hole communicating with a suction device, and the like). The second holding portion 3B has a configuration in which the molded product holding portions 3c and 3d are arranged side by side in the left-right direction at positions corresponding to the two molded product Wp held in the mold mold 2 after the resin molding. As a result, the two molded products Wp held side by side in the left-right direction by the mold mold 2 (upper mold) are placed on the molded product holding portions 3c and 3d at the same time without being rearranged in the same arrangement, and the mold mold is formed. It can be transported to the outside of the mold 2.

Further, the work processing unit A holds the molded product Wp placed on the second holding portion 3B and conveys the molded product Wp to a predetermined position, and the molded product held by the first storage pickup 11 and the first storage pickup 11. A second storage pickup 12 on which Wp is placed and conveyed to a predetermined position in the work processing unit is provided. In each case, as a mechanism for holding the molded product Wp, a known holding mechanism (for example, a structure having a holding claw for holding, a structure having a suction hole communicating with a suction device for suction, a mechanism for simply placing the molded product Wp, etc. ) (Not shown).

The first storage pickup 11 according to the present embodiment is configured to be movable in the left-right direction. As a result, the molded product Wp placed on the second holding portion 3B is held and conveyed onto the second storage pickup 12. Here, even if the molded product Wp is sandwiched between the first storage pickup 11 and the second storage pickup 12 and is kept on standby to be cooled while being flattened, the molded product Wp is prevented from warping or being distorted. good. In the first storage pickup 11, the holding mechanism is located at a position corresponding to the two molded products Wp mounted on the second holding portion 3B (two rows of molded product holding portions 3c, 3d) in the left-right direction. It has a structure in which two rows are arranged side by side. As a result, the two molded products Wp on the second holding portion 3B can be simultaneously held and conveyed in a state of being arranged in the left-right direction. The second storage pickup 12 is configured to be movable in the vertical direction. As a result, the molded product Wp placed on the second storage pickup 12 is held and conveyed onto a storage rail (not shown). The molded product Wp is pushed into the storage magazine from a storage rail (not shown) by a known pusher or the like (not shown) and stored.

Further, in the present embodiment, the supply pickup 9 conveys the work W to the first holding portion 3A in the left-right direction, and the storage pickup (first storage pickup 11) conveys the molded product Wp from the second holding portion 3B. The carrying-out paths in the left-right direction are set side by side in the front-rear direction. As a result, the loading operation of the work W by the supply pickup 9 and the loading operation of the molded product Wp by the storage pickup (first storage pickup 11) do not intersect or overlap with each other, so that the occurrence of waiting time can be suppressed. .. Therefore, since a plurality of operations can be performed in parallel and each operation can be performed efficiently, the processing can be facilitated and the process time can be shortened.

(Press unit)
The configuration of the press unit C included in the compression molding apparatus 1 will be described in detail. The press unit C is a mold having a pair of dies that are opened and closed (for example, a plurality of dies blocks made of alloy tool steel, a die plate, a die pillar, and other members are assembled). It has a mold 2. In the present embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold, and the other mold on the lower side is the lower mold. In the mold mold 2, the upper mold and the lower mold are brought close to each other and separated from each other to close and open the mold. That is, the vertical direction is the mold opening / closing direction.

The mold mold 2 is opened and closed by a known mold opening / closing mechanism (not shown). For example, the mold opening / closing mechanism includes a pair of platens, a plurality of connecting mechanisms (tie bars and pillars) on which the pair of platens are erected, a drive source (for example, an electric motor) for moving (elevating) the platens, and a drive transmission mechanism. (For example, a toggle link) and the like are provided (the drive mechanism is not shown).

Here, the mold mold 2 is arranged between a pair of platens of the mold opening / closing mechanism. In the present embodiment, the fixed upper mold is assembled to the fixed platen (platen fixed to the connecting mechanism), and the movable lower mold is assembled to the movable platen (platen that moves up and down along the connecting mechanism). ing. However, the present invention is not limited to this configuration, and the upper mold may be a movable type and the lower mold may be a fixed type, or both the upper mold and the lower mold may be a movable type.

The press unit C is an apparatus that uses a mold 2 to supply a work (object to be molded) W to perform compression molding. The mold mold 2 holds the work W in the upper mold, covers the cavities 2a and 2b provided in the lower mold with the film F, supplies the sheet-like resin R, and performs a clamping operation between the upper mold and the lower mold. , The work W is immersed in the molten mold resin R to mold the resin. In the device having a cavity in the upper mold, the sheet-like resin R is supplied onto the work W, set in the lower mold, and the upper mold cavity is covered with the film F to perform compression molding.

As another example of the press unit C, it is assumed that one cavity is provided in one lower die and one work W (for example, a circular semiconductor wafer, a square or rectangular substrate, or the like is used as the substrate). The compression molding apparatus 1 may be used to obtain one molded product by arranging the following and performing resin molding. In this case, the work W may be configured to process a wide work (large format work) wider than the work W as the strip work described above. As this wide work, a square, rectangular, or polygonal work W that is wider than the strip work, or a circular semiconductor wafer or work W as a carrier plate that is relatively wider in diameter (width) than the strip work is used. You may. In that case, instead of the work processing unit A described above, a transfer robot provided with a robot hand for taking out the work W from the supply magazine 5 or storing the molded product Wp in the storage magazine may be provided. ..

(Resin supply unit)
The configuration of the resin supply unit D (resin supply device) included in the compression molding device 1 will be described in detail together with the supply operation of the film F and the sheet-like resin R. As described above, the resin supply unit D is a unit that supplies the film F and the sheet-like resin R. In the present embodiment, when the film F and the sheet-shaped resin R are transported to the mold 2, a rectangular transport tool 20 is used as a jig for holding and transporting the film F and the sheet-shaped resin R. That is, by using this transport tool 20 as a jig, the sheet-shaped resin R is held and transported together with the film F by the resin loader 4. Further, the carrier 20 can hold the film F side by side with its longitudinal direction parallel to each other.

As shown in FIGS. 3A and 3B, the sheet-shaped resin supply unit 14 includes a pair of supply magazines 15 on which single-wafer sheet-shaped resin R is laminated. As the sheet-shaped resin R, for example, a solid resin having a size of about 100 mm × 300 mm and previously molded into a plate shape is assumed. When a sheet-like resin with a protective film is used, it is laminated in the supply magazine 15 via the protective film, so a step of peeling the film is required. The resin with the protective film may be a semi-cured resin, a locked resin, or a rolled resin. A pair of left and right supply magazines 15 are provided, and are stacked so as to be able to move up and down by an elevator mechanism 16. The sheet-shaped resin R may be pushed out from the supply magazine 15 with a pusher and supplied to the sheet-shaped resin partial removal stage 18 (sheet-shaped resin removing portion), or may be sucked and supplied by a suction pad or the like. The pair of sheet-shaped resins R supplied from the sheet-shaped resin supply unit 14 to the tables 18a and 18b are removed from the excess resin according to the work W in which the amount of electronic components mounted is equal to or more than a predetermined value at the sheet-shaped resin partial removal stage 18. Remove.

A rectangular carrier 20 in a state where the film F and the sheet-like resin R are not held is placed on the preparation table 19, and appropriate cleaning is performed. For example, the transport tool 20 carried out from the mold mold 2 may have mold resin adhered to it, which may cause malfunction. Therefore, malfunction can be prevented by cleaning the surface including the through hole described later with a brush or a suction mechanism (both not shown).

The preparation table 19 holds a transport tool 20 and has a transport tool 20 including a transport tool pickup 21 that transports the transport tool 20 between a plurality of predetermined positions (tables). As a mechanism for holding the transport tool 20, a known holding mechanism (for example, , It has a structure of holding a holding claw and holding it, a structure of having a suction hole communicating with a suction device and sucking, etc.) (not shown). Alternatively, it is possible to adopt a configuration in which an uneven portion is provided on the outer peripheral portion of the conveying tool 20 and the uneven portion is hooked on a holding claw which is erected downward from the lower surface of the conveying tool pickup 21 to hold and convey the uneven portion. The carrier pickup 21 is configured to be movable in the front-rear direction, left-right direction, and up-down direction. As a result, the transport tool 20 placed on the preparation table 19 can be held and transported to the film table 22 and the resin supply table 25, which will be described later. The transport tool 20 has two rows of carry-in film holding portions for holding a pair of films F formed in a rectangular frame shape and cut into strips. At a position corresponding to each film F (position for holding each film F), a pair of resin injection holes 20a and 20b formed in through holes are provided so that each film F is exposed when viewed from the upper surface. The resin injection holes 20a and 20b are formed corresponding to the shape of the cavity recess described above. The resin is supplied to the mold 2 in a state where the sheet-shaped resin R is dropped into the resin input holes 20a and 20b of the transport tool 20 with the film F as the bottom.

The film table 22 is provided with a pair of film rolls 24a and 24b in which a long film F is wound into a roll. This makes it possible to simultaneously supply two films F having the same shape on the film table 22. The film table 22 is arranged above the film rolls 24a and 24b (obliquely upward in the present embodiment), and the film F unwound from the film rolls 24a and 24b is cut into strips of a predetermined length and held. Will be done. As an example, the film table 22 and the film rolls 24a and 24b are arranged so that the film is conveyed in the vertical direction, so that the installation area of the apparatus is reduced.

Further, the film rolls 24a and 24b may be fed to the film table 22 by sandwiching the end portions and pulling out the film rolls 24a and 24b, or by using a drive-type roller provided in front of the film table 22. Further, as a mechanism for cutting the long film F, a known film cutting mechanism 24c (for example, a fixed blade cutter, a heat melting cutter, etc.) is provided (not shown). Further, as a mechanism for holding the two films F, a known holding mechanism (for example, a configuration having a suction hole communicating with a suction device for suction, etc.) is provided (not shown). In the film table 22, the carrier 20 is superposed on the film F cut here.

A plurality of suction holes (not shown) for generating a suction force to hold the film F are provided around the resin input holes 20a and 20b of the transport tool 20. The suction holes are configured such that the suction force generated by the suction device (not shown) is transmitted through (communicate with) the suction holes (not shown) provided in the transport tool pickup 21. According to the above configuration, it is possible to hold the two films F in a state of being sucked side by side in the left-right direction on the lower surface of the transport tool 20 transported on the film table 22 by the transport tool pickup 21. The outer circumference of the film F may be sandwiched between the holding claws to hold the film F.

A resin supply table 25 is provided on the side (for example, the right side) of the film table 22. The resin supply table 25 has a known holding mechanism (for example, a configuration having holding claws for holding the carrier 20 mounted on the pair of films F, and a suction hole communicating with the suction device. It has a structure to hold and adsorb, etc.) (not shown).

Here, an example of the supply operation of the sheet-shaped resin R will be described. A pair of sheet-shaped resin R supplied from the sheet-shaped resin supply unit 14 is picked up by a resin pickup mechanism (not shown) and transferred to the measuring stage 26 (see arrow S1 in FIG. 2). The amount of resin Dd0 before supply is measured at the measuring stage 26. In the measuring stage 26, the tables constituting the measuring stage 26 may be divided (26a, 26b) so that the weight of each sheet-shaped resin R can be weighed (see FIG. 2). The sheet-shaped resin R after weighing is picked up again by the resin pick-up mechanism and transferred to the sheet-shaped resin partial removal stage 18 (see arrow S2 in FIG. 2).

The control unit of the resin supply unit D calculates the amount of resin Dd1 to be partially removed from the thickness information Dt of the work W obtained from the work measuring instrument 8. For example, based on the result of "thickness measurement", the volume of the electronic component Wt mounted in the work W is calculated from the presence / absence of the electronic component Wt and the mounting height, and the electron is calculated from the final package volume (cavity volume). The volume obtained by subtracting the volume of the component Wt is the volume of the resin required for molding. Further, since the volume of the resin required at the time of molding can be converted into the weight from the specific gravity of the resin, the amount of the resin required at the time of molding is calculated. When the data measured and calculated based on the thickness measurement result is larger than the reference electronic component Wt loading amount, the resin amount Dd1 to be removed by the increased weight is calculated. Further, the amount of resin Dd1 to be removed can be calculated as the area to be removed because the thickness of the sheet-shaped resin R is constant.
The sheet-shaped resin partial removal stage 18 moves or rotates each sheet-shaped resin R individually XY based on the data measured by the work measuring instrument 8 (see FIG. 1) in cooperation with the resin pick-up mechanism. A part of the sheet-shaped resin R (resin amount Dd1) is removed from the tables 18a and 18b.

The sheet resin R from which the excess resin has been partially removed is transferred to the weighing stage 26 again by the resin pick-up mechanism (see arrow S3 in FIG. 2). The measuring stage 26 measures the amount of resin Dd2 (actual supply amount Dd2) required for molding after partial removal.
After weighing, an appropriate amount of the sheet-shaped resin R partially removed is charged into the resin input holes 20a of the transport tool 20 placed on the film F placed on the resin supply table 25 by the resin pick-up mechanism. FIG. 2 (see arrow S4). The transport tool 20, the film F, and the sheet-shaped resin R placed on the resin supply table 25 are transported to the mold mold 2 (lower mold) by the resin loader 4 as described later.
In addition, the control unit adjusts a part of the sheet-shaped resin R (resin amount Dd1) from the molded product information (molded thickness of the molded product, etc.) for each work, or even if it is adjusted for each lot. good. As a result, the resin supply accuracy can be improved for each lot. Further, by associating and storing data such as the pre-supply resin amount Dd0, the removal amount Dd1, the actual supply amount Dd2, and the form of the removed sheet-like resin together with the work information Dw including the thickness information Dt of the work W. , It is possible to improve the molding quality by supplying an appropriate amount of resin to various workpieces W.

By using the resin supply unit D, by supplying the sheet-shaped resin R, it is possible to supply and transport the resin R without generating dust, and the amount of electronic components mounted is corresponding to the increase amount of electronic components of the non-defective work W having a predetermined value or more. Since the excess resin is cut and removed, an appropriate amount of resin can be supplied for compression molding.
In this case, the sheet-shaped resin R is not limited to the flat plate-shaped resin, but may be a plate-shaped resin formed in a porous shape, a plate-shaped resin provided with a large number of through holes, or a sheet-shaped resin. As a result, it is possible to prevent the entrainment of air in the sheet-shaped resin R supplied on the film F and suppress the generation of voids.

Further, in FIG. 4, the left side is the work W (a state in which the electronic component Wt is mounted on the substrate Wb) to be molded, the center is the sheet-like resin R supplied from the sheet-like resin supply unit 14, and the right side is a part. The sheet-like resin R after removal is used. The work W treats the mounting rate of the electronic component Wt mounted on the substrate Wb as 80% (an example of the lower limit value) as a reference amount of the sheet-like resin R that can be molded without the need for partial removal, and mounts the electronic component Wt. When the rate is higher than that, the sheet-shaped resin partial removal stage 18 removes the sheet-shaped resin R by the amount of increase in the mounting rate of the electronic component Wt. (The shaded area in the upper part of FIG. 4 indicates the removed area). The mounting rate of the electronic component Wt on the substrate Wb, which is the limit value of the non-defective product of the work W, is not limited to 80%, and may be more or less than that. For example, when the mounting rate of the electronic component Wt on the substrate Wb changes stably, the yield is reduced by increasing the mounting rate, which is the limit value, to 90% and 95%, thereby reducing the amount of the sheet-shaped resin R removed. Can be improved.

As a result, it is possible to sort out the good work W and the defective work W that can be molded, and the mounting rate of the electronic component Wt that can be mounted is 80%, which is the standard amount of the sheet-like resin R that can be molded without removing a part. The amount of the sheet-shaped resin R to be partially removed is uniquely determined by the above, and the amount of the resin can be reduced and finely adjusted by the increase in the mounting rate of the electronic component Wt. It is possible to supply an appropriate amount of resin. The mounting rate of the electronic component Wt on the substrate Wb of the work W is removed by the sheet-shaped resin partial removal stage 18 based on the data measured by the work measuring instrument 8 in the work processing unit A (measurement of the thickness of the work W). The amount is calculated. Alternatively, when the amount of the electronic component Wt mounted on the substrate Wb is stored in the control unit (not shown) of the apparatus main body in advance, the data is read out from the control unit to the sheet-shaped resin partial removal stage 18. The amount to be removed is calculated.

An example of the configuration of the sheet-shaped resin partial removal stage 18 will be described with reference to FIGS. 5A and 5B. The sheet-shaped resin R is supplied onto the tables 18a and 18b from the sheet-shaped resin supply unit 14, respectively, and the required amount of resin is removed by a removing device described later. The shaded area R1 indicates a range to be removed from the sheet-shaped resin R. In this way, when removing the short side and the long side of the sheet-shaped resin R, the table may be rotated 90 degrees as shown in FIGS. 5A and 5B, but the sheet-shaped resin pick-up mechanism or the removing mechanism side may be rotated. It may be rotated 90 degrees. Since the sheet-shaped resin R is made of a constant thickness, the tables 18a and 18b may be individually XY-driven to the removal position when the removal area to be the removal amount is calculated. (See Fig. 2).

The removing device may be a device that cuts using a dicer blade 27 as shown in FIG. 6A or a device that cuts using a laser or a water jet 28 as shown in FIG. 6B. As shown in FIG. 6C, any device may be used for cutting using the wire cut 29.

Further, as shown in FIG. 7A, the removing device may cut the sheet-shaped resin R by scanning the cutter blade 30, or may cut it with scissors (not shown). Alternatively, as shown in FIG. 7B, the cutter blade 30 may be moved up and down along the cutting line of the sheet-shaped resin R to push through the sheet-shaped resin R.
Further, as shown in FIG. 7C, after forming a shallow groove in the removal line by the cutter blades of FIGS. 7A and 7B, the sheet-shaped resin R is sandwiched by a pair of upper and lower clamps 31 and the cut portion is clamped by the movable clamp 31a. In the sandwiched state, as shown in FIG. 7D, the movable clamp 31a may be changed from the horizontal posture to the inclined posture and removed so as to break off the sheet-shaped resin R from the cutting line.

As shown in FIG. 8, the sheet-shaped resin R may be cut using the press device 32 as the removing device. While pressing the sheet-shaped resin R mounted on the die 32a with the stripper plate 32b, the sheet-shaped resin R may be sheared when the punch 32c is pushed down toward the die hole 32d. In this case, instead of moving the table, the sheet-shaped resin R side may be moved or rotated XY to adjust the removal position.

FIG. 9 is an explanatory view showing the morphology of the sheet-shaped resin R after partial removal in the sheet-shaped resin partial removal stage 18, in which the shaded area in the figure shows a region to be removed.
FIG. 9A illustrates the sheet-shaped resin R after removing the resin at the corners (four corners) of the strip-shaped sheet-shaped resin R. It is not always necessary to remove the corners at four places, and the corners may be removed at two places. FIG. 9B shows the strip-shaped sheet-shaped resin R with the long-side end and the short-side end removed in the XY directions. FIG. 9C shows a strip-shaped sheet-shaped resin R having a predetermined length removed from the right end portion in the longitudinal direction. In FIG. 9D, a part of the strip-shaped sheet-shaped resin R in the longitudinal direction is removed and divided into uniform lengths. Any form of removing the sheet-shaped resin R may be adopted.

10A to 10D are a schematic in which the sheet-shaped resin R partially removed in the form of FIGS. 9A to 9D is arranged in the cavity 2a (2b) or the resin injection holes 20a and 20b of the transport tool 20 before being charged into the cavity. It is a figure. The sheet-shaped resin R is positioned XY in the center of the cavity 2a (2b) so that the flow of the molten resin is reduced as much as possible in the resin input holes 20a and 20b of the cavity 2a (2b) or the carrier 20. It is preferable to adjust the movement and arrange it. Further, as shown in FIG. 10D, the divided sheet-shaped resin R shown in FIG. 9D is adjusted by XY movement of each sheet and supplied to the cavities 2a (2b) in an evenly arranged manner, whereby the resin can flow. It can be eliminated as much as possible.
The sheet-shaped resin partial removal stage 18 can divide the sheet-shaped resin R into a plurality of pieces regardless of whether or not the excess resin is removed.

Next, the configuration of the resin loader 4 will be described with reference to FIG. The resin loader 4 receives the transport tool 20 placed on the resin supply table 25 together with the film F and the sheet-shaped resin R at the transport tool holding portion 4a on the lower surface thereof, and after transporting the resin loader 4 to the mold mold 2 (lower mold). , Only the transport tool 20 is transported to the above-mentioned preparation table 19. The resin loader 4 has a known holding mechanism (for example, a configuration having holding claws for holding the transport tool 20, and a suction hole communicating with the suction device) as the transport tool holding portion 4a for holding the transport tool 20. It has a configuration, etc.). Further, the suction hole of the carrier 20 held at a predetermined position has a suction hole for generating (transmitting) a suction force by a communication suction device (not shown). As a result, while maintaining a state in which the two films F (states in which the sheet-shaped resin R is mounted) are arranged side by side in the left-right direction and adsorbed on the lower surface of the transport tool 20, the lower molds are held at predetermined holding positions (cavities 2a and 2b). Can be transported to the position where It should be noted that the lower surface of the transport tool 20 may have holding claws that sandwich and hold the outer circumferences of the two films F.

Further, the resin loader 4 holds a film (used film) F remaining in the lower mold after the resin-molded molded product Wp is taken out from the mold mold 2 (here, the upper mold), and is predetermined. It is provided with a carry-out film holding portion 4b for transporting the film to a position (film disposer G described later). The carry-out film holding unit 4b has a known holding mechanism for holding the used film F (for example, a structure having a suction hole communicating with a suction device and sucking the film).

The resin loader 4 according to the present embodiment is configured to be movable in the front-rear direction, left-right direction, and up-down direction. The movement in the left-right direction enables an operation of transporting the transport tool 20 (a state in which two films F on which the sheet-shaped resin R is mounted) is transported from the resin supply table 25 to the press unit C. Further, by moving in the front-rear direction, the conveyor 20 (a state in which two films F on which the sheet-shaped resin R is mounted is held) is moved from the outside to the inside of the mold mold 2 (that is, in a state where the mold is opened). The operation of transporting (between the mold and the lower mold) becomes possible.

Further, the carry-out film holding portion 4b is arranged side by side in the left-right direction at positions corresponding to the two cavities 2a and 2b of the mold mold 2 (lower mold). As a result, it becomes possible to simultaneously hold and convey the two used films F arranged side by side in the left-right direction by the mold mold 2 (lower mold) after the resin molding.

Further, since the resin loader 4 is integrally provided with the transport tool holding portion 4a and the carry-out film holding portion 4b, the resin loader 4 is configured to be movable in the front-rear direction, the left-right direction, and the up-down direction. As a result, not only the device configuration can be simplified and miniaturized, but also the film F on which the sheet-shaped resin R is mounted and the used film F can be simultaneously transported two by two, so that the process time can be realized. Can also be shortened. As a modification, a resin loader provided with the transport tool holding portion 4a and the carry-out film holding portion 4b separately may be provided.

The film disposer G is formed in a box shape with an upper portion (upper surface portion) open. As a result, when the carry-out film holding portion 4b that conveys the used film F reaches a position directly above the film disposer G, the used film F is released from the carry-out film holding portion 4b to release the used film. It is possible to drop F and store it in the film disposer G.

According to the above configuration, an appropriate amount of sheet-shaped resin R can be conveyed from the resin supply unit D (resin supply device) to the mold die 2 according to the amount of electronic components mounted on each work W for compression molding. Therefore, dust does not scatter when the resin is supplied, and an appropriate amount of resin can be supplied to each work W for molding, so that the molding quality can be improved and unnecessary resin may be generated in the molded product. It disappears.

The case where the resin supply unit D (resin supply device) described above supplies an appropriate amount of the sheet-like resin R to the strip type substrate Wb for compression molding has been described, but as shown in FIG. 11, the circular semiconductor wafer Wa An apparatus may be used for compression molding by supplying an appropriate amount of the sheet-shaped resin R to the wafer.

In this case, the compression molding apparatus 1 may be configured to provide one cavity in one lower mold in the press unit C and arrange one work W for compression molding to obtain one molded product Wp. .. In this case, as the film F supplied from the film roll 24d to the film table 22 and cut by the film cutting mechanism 24c, a wide film wider than the film F as the strip film described above is used. As this wide film, it is easy to use a square or rectangular sheet-fed film F having a width wider than that of a strip film. However, as the wide film, a sheet-fed film F cut out in a round shape may be used as long as it is wider than the strip film. Further, the carrier 20 supplied by the preparation table 19 is preferably used if it has a rectangular outer shape and a resin input hole (round hole) 20c is provided in the central portion.

Further, as shown in FIG. 11, the sheet-shaped resin supply unit 14 includes a single supply magazine 15 in which, for example, a disk-shaped resin R is laminated. The sheet-shaped resin R does not necessarily have to be a disk. The supply magazine 15 is provided so as to be able to move up and down by an elevator mechanism 16.

The disk-shaped sheet-shaped resin R supplied from the sheet-shaped resin supply unit 14 is picked up by a resin pickup mechanism (not shown) and transferred to the measuring stage 26 (see arrow S1 in FIG. 11). The amount of resin Dd0 before supply is measured at the measuring stage 26.
The sheet-shaped resin R after weighing is picked up again by the resin pick-up mechanism and transferred to the sheet-shaped resin partial removal stage 18 (see arrow S2 in FIG. 11).
The control unit of the resin supply unit D calculates the amount of resin Dd1 to be partially removed from the thickness information Dt of the work W obtained from the work measuring instrument 8. In the sheet-shaped resin partial removal stage 18, since the thickness of the sheet-shaped resin R is constant based on the calculated resin amount Dd1, the removal position is calculated and a part (resin amount Dd1) is removed.
The sheet resin R from which the excess resin has been partially removed is transferred to the weighing stage 26 again by the resin pick-up mechanism (see arrow S3 in FIG. 2). The measuring stage 26 measures the amount of resin Dd2 (actual supply amount Dd2) required for molding after partial removal.
After weighing, an appropriate amount of the sheet-shaped resin R is charged into the resin input hole 20c of the transport tool 20 placed on the film F placed on the resin supply table 25 by the resin pickup mechanism (see arrow S4 in FIG. 11). ..

As the removing device, as described above, a dicer blade 27 (FIG. 6A), a laser beam or a water jet 28 (FIG. 6B), a wire cut 29 (FIG. 6C), a cutter blade 30 (FIG. 7), and a pressing device are used. Any method may be used, such as the one using 32 (FIG. 8). Further, as for the removal form of the sheet-shaped resin R in the sheet-shaped resin partial removal stage 18, for example, in the case of a disk-shaped resin, the arc portion (diagonal line portion R1) may be removed every 90 degrees, for example (diagonal line portion R1). (See FIG. 11), the outer circumference may be removed evenly to a small diameter. The sheet-shaped resin partial removal stage 18 can divide the sheet-shaped resin R into a plurality of pieces regardless of whether or not the excess resin is removed.

Further, the resin loader 4 (see FIG. 1) moves to the resin supply table 25 on the lower surface thereof, receives the carrier 20 placed on the resin supply table 25 together with the film F and the sheet-shaped resin R, and molds the metal. The configuration for transporting the mold 2 (lower mold) to a predetermined holding position is the same. The resin loader 4 has a known holding mechanism (for example, a structure having a holding claw to hold the carrier, a structure having a suction hole communicating with the suction device, and sucking the resin loader 4) as a carrier holding portion 4a for holding the carrier 20. Etc.). Further, the suction hole of the carrier 20 held at a predetermined position has a suction hole for generating (transmitting) a suction force by a communication suction device (not shown). The lower surface of the transport tool 20 may have a holding claw that holds the outer circumference of the wide film F by sandwiching it.

Further, the resin loader 4 holds a film (used film) F remaining in the lower mold after the resin-molded molded product Wp is taken out from the mold mold 2 (here, the upper mold), and is predetermined. The same applies to the fact that the carry-out film holding portion 4b for transporting the film to the position (film disposer G described later) is provided. The carry-out film holding unit 4b has a known holding mechanism for holding the used film F (for example, a structure having a suction hole communicating with a suction device and sucking the film).

Further, a film table 22 capable of switching between the strip film shown in FIG. 1 and the wide film shown in FIG. 11 may be provided. In this case, the sheet-shaped resin supply unit 14 also needs to switch the supply magazine 15 to switch between the strip-shaped resin and the disk-shaped resin. Further, the form of the carrier 20 prepared in the preparation stage 19 also needs to be switched between the strip substrate type and the semiconductor wafer type.

Further, as a configuration of the compression molding apparatus 1, the resin supply unit D provided on one side of the press unit C is configured to exclusively supply the sheet-shaped resin R according to the amount of electronic components mounted to the mold die 2. There may be. In this case, it is preferable that the press unit C is provided with a film transfer device, and the film covering the cavity surface is carried in and out.

The work of this embodiment is described as a strip type and a circular type, but the work may be a large-sized rectangular (square) shape. In this case, the sheet-shaped resin R is also square, and partial removal is the same as the strip work. If necessary, it may be removed from the four corners or sides, and if necessary, it may be divided. Further, as shown in FIG. 12, if one sheet-shaped resin R is not enough for the resin input hole 20a or the cavity 2a of the transport tool 20, a plurality of sheet-shaped resin Rs may be supplied in layers.

FIG. 12 illustrates a resin supply unit D (resin supply device) provided in a resin molding device for cutting out and partially removing sheet-shaped resin rolls 17a and 17b around which a long sheet-shaped resin R is wound. .. In this embodiment, the sheet-shaped resin R is supplied in a roll shape together with the protective film, and the sheet-shaped resin R is pulled out while winding the protective film with a winder (not shown) and drawn out so as to obtain the required amount of resin described above. The amount is adjusted and the sheet-like resin cutting mechanism 17c cuts the film. The required amount of resin may be the reference amount of the sheet-like resin R that can be molded without removing 80% of the mounting rate of the above-mentioned electronic parts, or even if it is more than that depending on the mounting rate, the reference amount is set below. You may. The amount of the sheet-like resin R after cutting is calculated in the sheet-like resin partial removal stage 18 based on the data measured by the work measuring instrument 8 (measurement of the thickness of the work W) in the same manner as in the above-described embodiment, and the sheet is formed. A part of the resin R is removed.

In this embodiment, compression molding with a movable lower cavity is taken as an example, but compression molding with a movable upper cavity can be performed by removing a part of the supplied sheet-shaped resin R according to the work and then supplying it to a mold for molding. It can also be used for molding. Further, in this embodiment, the weight before and after the removal of the sheet-shaped resin R is measured, but it is not always necessary to measure the weight. Since the thickness of the sheet-shaped resin R is constant, the camera is used instead of the measuring stage 26. An imaging stage may be provided. In this case, the volume of the sheet resin R can be obtained from the area of the sheet resin R before removal taken by the camera. As a result of the thickness measurement, the appropriate volume of the resin is obtained, the excess removal volume is calculated by subtracting the appropriate volume from the volume of the sheet resin R, and the removal area is obtained from the removal volume to determine the removal position. You can do it. In this case, as an example, as described above, the mounting rate of the electronic component may be 80% (lower limit value) as the reference volume of the sheet-shaped resin R that can be molded without removal.

A Work processing unit B Work transfer unit C Press unit D Resin supply unit E Resin transfer unit F Film G Film disposer W Work Wp Molded product Wb Substrate Wt Electronic parts Wa Semiconductor wafer R Sheet-like resin 1 Compression molding device 2 Mold mold 2a , 2b Cavity 3 Work loader 3A 1st holding part 3B 2nd holding part 3a, 3b Work holding part 3c, 3d Molded product holding part 4 Resin loader 4a Transporter holding part 4b Carrying out film holding part 5,15 Supply magazine 6,6a , 6b Supply rail 7 Relay rail 8 Work measuring instrument 9 Supply pickup 10 Work heater 11 1st storage pickup 12 2nd storage pickup 14 Sheet-shaped resin supply unit 16 Elevator mechanism 17a, 17b Sheet-shaped resin roll 17c Sheet-shaped resin cutting mechanism 18 Sheet-shaped resin partial removal stage 18a, 18b Table 18b Resin guide 19 Preparation table 20 Transport tool 20a, 20b, 20c Resin input hole 21 Transport tool pickup 22 Film table 23 Resin drop table 24a, 24b, 24d Film roll 24c Film cutting mechanism 25 Resin supply table 26 Weighing stage 27 Dicer blade 28 Laser light (or water jet) 29 Wire cut 30 Cutter blade 31 Clamp 31a Movable clamp 32 Press device 32a Die 32b Stripper plate 32c Punch 32d Die hole

Claims (13)

A resin molding device in which a workpiece on which electronic components are mounted on a substrate and a mold resin are carried into a mold and are compression-molded.
The sheet-shaped resin supply unit that supplies the sheet-shaped resin and
A sheet-shaped resin removing unit that removes the excess amount of resin from the single-wafered sheet-shaped resin supplied from the sheet-shaped resin supply unit for a work whose mounting rate of electronic components exceeds a reference value.
A resin molding apparatus including a resin transporting section for transporting an appropriate amount of sheet-shaped resin removed by the sheet-shaped resin removing section to a mold. In the work, the lower limit of the mounting rate of the electronic components mounted on the substrate is set as a reference amount of the sheet-like resin that can be molded without removing the lower limit, and when the mounting rate of the electronic components increases more than that, the sheet-shaped resin removing portion is subjected to. The resin molding apparatus according to claim 1, wherein a part of the sheet-shaped resin is removed by an amount in which the mounting rate of electronic components is increased from the lower limit value. The resin molding apparatus according to claim 1 or 2, wherein the amount of the excess resin is calculated from the result of measuring the electronic components mounted on the substrate to calculate the removed area. The resin molding apparatus according to any one of claims 1 to 3, wherein a weigh scale side portion for measuring the weight of the single-wafer sheet-shaped resin supplied from the sheet-shaped resin supply unit is provided. A resin molding device in which a workpiece on which electronic components are mounted on a substrate and a mold resin are carried into a mold and are compression-molded.
The sheet-shaped resin supply unit that supplies the sheet-shaped resin and
A sheet-shaped resin removing unit that removes excess resin volume from a single-wafer sheet-shaped resin supplied from the sheet-shaped resin supply unit to a work whose mounting rate of electronic components exceeds a reference value.
A resin molding apparatus including a resin transporting section for transporting an appropriate volume of sheet-shaped resin removed by the sheet-shaped resin removing section to a mold. In the work, the lower limit of the mounting rate of the electronic components mounted on the substrate is set as the reference volume of the sheet-like resin that can be formed without removing the lower limit, and when the mounting rate of the electronic components increases more than that, the sheet-shaped resin removing portion is The resin molding apparatus according to claim 5, wherein a part of the sheet-shaped resin is removed only by the volume in which the mounting rate of electronic components is increased from the lower limit value. The resin molding apparatus according to claim 5 or 6, wherein the excess resin volume is calculated from the result of measuring the electronic components mounted on the substrate to calculate the removed area. The resin molding apparatus according to any one of claims 5 to 7, wherein an imaging unit for imaging the volume of the sheet-shaped resin supplied from the sheet-shaped resin supply unit is provided. The resin molding apparatus according to any one of claims 1 to 8, wherein the sheet-shaped resin removing unit divides the sheet-shaped resin into a plurality of pieces. The resin molding apparatus according to any one of claims 1 to 9, wherein the sheet-shaped resin is a plate-shaped resin formed in a porous shape or a sheet-shaped resin having a large number of through holes. This is a resin molding method in which a workpiece and mold resin on which electronic components are mounted on a substrate are carried into a mold and compression-molded.
The process of acquiring work information related to the electronic component mounting rate for each work supplied from the work supply unit, and
From the work information, a process of calculating the amount of excess resin for a work whose mounting rate of electronic components exceeds the reference value, and
A resin removal process that removes excess resin from the sheet-shaped resin supplied from the resin supply unit for workpieces whose mounting rate of electronic components exceeds the standard value.
A resin molding method comprising a step of carrying the work and an appropriate amount of sheet-shaped resin into the mold mold, clamping them, and compression molding them. The resin molding method according to claim 11, further comprising a weighing step of weighing the sheet-shaped resin supplied from the resin supply unit and weighing the sheet-shaped resin from which a part of the excess has been removed. This is a resin molding method in which a workpiece and mold resin on which electronic components are mounted on a substrate are carried into a mold and compression-molded.
The process of acquiring work information related to the electronic component mounting rate for each work supplied from the work supply unit, and
From the work information, a process of calculating the excess resin volume for a work in which the mounting rate of electronic components exceeds the reference value, and
A resin removal process that removes the surplus volume integral from the sheet-shaped resin supplied from the resin supply unit for workpieces whose mounting rate of electronic components exceeds the standard value.
A resin molding method comprising a step of carrying the work and an appropriate amount of sheet-shaped resin into the mold mold, clamping them, and compression molding them.

Images