JP6989409B2 - Resin molding device and resin molding method - Google Patents

Description

The present invention relates to a resin molding apparatus and a resin molding method for resin-molding a work in which an electronic component is mounted on a base material.

As a method of manufacturing electronic devices such as semiconductor devices by resin molding, workpieces with a large number of electronic components mounted on a base material are collectively resin-molded, and the molded products are diced into individual pieces to form individual electronic devices. How to do it is known. One such resin molding method is a compression molding method.

In the compression molding method, as a general rule, a predetermined amount of resin is supplied to a mold region (cavity) provided in a mold mold provided with an upper mold and a lower mold, and a work is placed in the mold region, and the work is placed on the upper mold region. This is a method of resin molding by clamping the mold and the lower mold. At this time, when a mold mold having a cavity provided in the upper mold is used, it is generally performed that a resin having a high viscosity is collectively supplied to the center position on the work and molded. In this case, in order to fill the cavity with the resin supplied on the work, it is necessary to flow the mold resin to the end of the cavity, so that a flow mark may occur.

On the other hand, when a mold mold having a cavity in the lower mold is used, the mold surface including the cavity is covered with a film to supply the mold resin with an uniform thickness, and the work held in the upper mold is melted into the mold resin. It is generally practiced to immerse and mold the resin. For example, the devices described in Patent Document 1 (Japanese Patent Laid-Open No. 2010-247429), Patent Document 2 (Japanese Patent Laid-Open No. 2004-148621), Patent Document 3 (Japanese Patent Laid-Open No. 2017-024398) and the like are disclosed. ..

Japanese Unexamined Patent Publication No. 2010-247429 Japanese Unexamined Patent Publication No. 2004-148621 Japanese Unexamined Patent Publication No. 2017-024398

In the conventional compression molding type resin molding apparatus exemplified in the above patent documents, in the case of a configuration having a cavity in the upper mold of the mold, the mold resin is conveyed in a state of being mounted on one work. However, since it can be resin-molded, there is an advantage that the device configuration and process can be simplified. However, in the case of a configuration having a cavity in the lower mold of the mold, it is necessary to carry in the required number of films (release films) and mold resin after carrying in the work. There was a problem that the configuration and the process became complicated.

As described above, in particular, in a resin molding apparatus having a cavity in the lower mold, there is a demand for an apparatus capable of efficiently supplying a film and a molding resin and simplifying a configuration and a process. rice field.

INDUSTRIAL APPLICABILITY The present invention has been made in view of the above circumstances, and is a resin molding apparatus and a resin mold capable of efficiently supplying a film and a molding resin used for a resin mold, and simplifying a configuration and a process. The purpose is to provide a method.

The present invention solves the above-mentioned problems by means of a solution as described below as an embodiment.

The resin molding apparatus according to the present invention includes a mold mold having an upper mold for holding a workpiece on which an electronic component is mounted on a base material and a lower mold having a cavity recess in which the mold resin is supplied via a film. A resin molding device that resin-molds the work into a molded product using the film. A through hole corresponding to the shape of the cavity recess is formed, and the mold resin is held in the through hole to hold the film. A transport tool, which is a jig for transporting together, a first table in which the film unwound from a film roll and cut to a predetermined length is held, and the cut film and the transport tool are combined, and a lower surface side. A second table configured to be movable by placing the transporter in a state where the film is held, and the first table holding the transporter in a state where the film is held on the lower surface side. It is a requirement to include a transport tool pickup for transporting from the second table to the second table, and a dispenser for charging the mold resin inside the through hole in the transport tool placed on the second table.

According to this, the transporter holds the film and the mold resin by realizing a configuration in which the first table used for supplying the film and the second table used for supplying the mold resin are separately provided. It is possible to perform processes such as film preparation and mold resin preparation, which are necessary in parallel. Therefore, it is possible to significantly reduce the process time as compared with the conventional apparatus in which they are performed by the same table.

Further, the transport tool has two rows of film holding portions as the through holes so that the two films can be held side by side in the left-right direction, and each of the film holding portions is made of a resin corresponding to each of the films. It is preferable to have a charging hole. According to this, it is possible to hold two films on which the mold resin is mounted and transfer them to the mold by using one transport tool. Therefore, it is possible to significantly reduce the process time by using one transport tool as compared with the conventional apparatus for transporting films one by one.

Further, it is preferable that the first table and the film roll are arranged side by side in a layered manner in the vertical direction. According to this, it is possible to reduce the installation area of the device as compared with the conventional device in which each configuration is arranged in a plane.

Further, it is preferable to further include a resin heater for heating from the upper surface side of the conveyor in a state where the film and the mold resin are held. According to this, it is possible to liquefy the mounting surface by heating immediately after the mold resin is mounted on the film. Therefore, especially when a granular or powdered mold resin is used, dust (resin) It is possible to prevent the generation of fine powder, etc.) and suppress the generation of product defects.

Further, the transport tool includes a cleaning step of cleaning the transport tool, a film setting step of combining the film with the transport tool, and a resin dropping step of dropping the mold resin onto the transport tool combined with the film. It is preferable that the mold mold is provided with a plurality of processes in which the film and the resin supply step of supplying the mold resin are processed in different steps. According to this, by circulating each transport tool in each process for resin molding, the waiting time of the transport tool in each process can be shortened, and the productivity can be improved.

Further, the resin molding method according to the present invention is a resin molding method for performing resin molding using the resin molding device, wherein a plurality of the transport tools are provided, and a cleaning step for cleaning the transport tools. A film setting step of combining the film with the transport tool, a resin dropping step of dropping the mold resin into the transport tool combined with the film, and a resin supplying the film and the mold resin to the mold mold. It is a requirement that the plurality of conveyors are processed in different processes between the supply process and the supply process. According to this, by circulating each transport tool in each process for resin molding, the waiting time of the transport tool in each process can be shortened, and the productivity can be improved.

According to the present invention, it is possible to provide two or more cavities in one lower mold, arrange a work in each cavity, and simultaneously mold the resin. In particular, since the film and the mold resin used for the resin mold can be efficiently supplied, the process time can be shortened as compared with the conventional apparatus. In addition, it becomes possible to simplify the device configuration and the process.

It is a top view which shows the example of the resin molding apparatus which concerns on embodiment of this invention. It is a left side view of the II-II position of FIG. It is a top view which shows the example of the supply rail of the resin molding apparatus of FIG. It is a top view which shows the example of the storage rail of the resin molding apparatus of FIG. It is a left side view of the VV position of FIG. It is a left side view of the VI-VI position of FIG. It is a left side view of the VII-VII position of FIG. It is a front view of the position VIII-VIII of FIG. It is a top view which shows the example of the conveyor of the resin molding apparatus of FIG. It is a top view which shows the example of the mold mold of the resin molding apparatus of FIG. It is operation explanatory drawing of the resin molding apparatus which concerns on embodiment of this invention. It is operation explanatory drawing following FIG. It is operation explanatory drawing following FIG. It is an operation explanatory diagram following FIG. It is an operation explanatory diagram following FIG. It is an operation explanatory diagram following FIG. It is operation explanatory drawing following FIG. It is operation explanatory drawing following FIG. It is an operation explanatory diagram following FIG. It is an operation explanatory diagram following FIG. It is operation explanatory drawing following FIG. It is an operation explanatory diagram following FIG. It is an operation explanatory diagram following FIG. 22. It is an operation explanatory diagram following FIG. It is an operation explanatory diagram following FIG. It is operation explanatory drawing following FIG. It is an operation explanatory diagram following FIG. It is a top view which shows the modification of the resin molding apparatus which concerns on embodiment of this invention. It is a block chart which shows the example of the control structure which concerns on embodiment of this invention. It is a flowchart which shows the example of the resin supply operation which concerns on embodiment of this invention.

(overall structure)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view (plan view) showing an example of the resin molding device 1 according to the embodiment of the present invention. 2 to 10 are schematic views showing details of each configuration of the resin molding apparatus 1. For convenience of explanation, the front-back, left-right, and up-down directions of the resin molding apparatus 1 may be described by arrows in the drawings. Further, in all the drawings for explaining each embodiment, members having the same function may be designated by the same reference numerals, and the description thereof may be omitted.

The resin molding apparatus 1 according to the present embodiment is an apparatus for performing resin molding of a work (object to be molded) W by using a mold mold 202 including an upper mold 204 and a lower mold 206. Hereinafter, as the resin molding device 1, the work W is held by the upper mold 204, and the cavity 208 (including a part of the mold surface 206a) provided in the lower mold 206 is covered with the film (release film) F to cover the mold resin R. Will be described as a main example of a compression molding apparatus in which the work W is immersed in the molten mold resin R to perform a clamping operation between the upper die 204 and the lower die 206 to mold the resin. The shape of the cavity 208 is defined by the cavity recess 209 recessed in a predetermined shape on the upper surface of the lower mold 206, and the mold resin R is supplied via the film F to enable compression molding.

First, the work W to be molded has a configuration in which a plurality of electronic components Wb are mounted in a matrix on a base material Wa. More specifically, as an example of the base material Wa, a plate-shaped member (strip-shaped strip work) such as a resin substrate, a ceramics substrate, a metal substrate, a carrier plate, a lead frame, and a wafer formed in a strip shape can be mentioned. Be done. Further, examples of the electronic component Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, a spacer and the like. As will be described later, an example of device modification that can be applied when a square-shaped or circular-shaped base material is used as the base material Wa can be considered.

As an example of the method of mounting the electronic component Wb on the base material Wa, there is a mounting method by flip chip mounting, wire bonding mounting, or the like. Alternatively, in the case of a configuration in which the base material (carrier plate made of glass or metal) Wa is peeled off from the molded product after resin molding, an adhesive tape having heat peelability or an ultraviolet curable resin that is cured by ultraviolet irradiation is used. There is also a method of pasting the electronic component Wb.

On the other hand, as an example of the mold resin R, a granular thermosetting resin (for example, a filler-containing epoxy resin) is used. The state is not limited to the above, and may be in other states (shapes) such as liquid, powder, columnar, plate, and sheet.

Further, as an example of the film F, a film material having excellent heat resistance, peelability, flexibility and extensibility, for example, PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, etc. Fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used. As the film F, for example, a strip-shaped strip film corresponding to the strip-shaped work W can be used.

Subsequently, the outline of the resin molding apparatus 1 according to the present embodiment will be described. As shown in FIG. 1, the resin molding apparatus 1 mainly performs the supply of the work W and the storage of the molded product Wp after the resin molding, and the work W is resin-molded into the molded product Wp. The main configuration includes a press unit 100B that mainly performs processing, a dispense unit 100C that mainly supplies (discards) the used film Fd after resin molding, and supplies the film F and the mold resin R. In this embodiment, a compression molding type resin molding apparatus is provided in which two cavities are provided in one lower mold, two workpieces W are arranged, and resin molding is performed collectively to obtain two molded products Wp at the same time. Will be described as an example.

In the present embodiment, units such as the work processing unit 100A, the press unit 100B, and the dispense unit 100C are connected and assembled. As an example, the work processing unit 100A, the press unit 100B, and the dispense unit 100C are arranged side by side in the left-right direction from the left. An arbitrary number of guide rails (not shown) are provided in a straight line across the units, and the first loader (first transport unit) 210 for transporting the work W and the like and the film F and the like are conveyed. A second loader (second transport unit) 212 is provided so as to be movable between predetermined units along an arbitrary guide rail. Since these loaders 210 and 212 not only carry in the work W and the like to the mold die 202 but also carry out the molded product Wp from the mold die 202, they also function as offloaders.

Therefore, the configuration of the resin molding device 1 can be changed by changing the configuration of the unit. For example, the configuration shown in FIG. 1 is an example in which three press units 100B are installed, but a resin molding device (not shown) in which only one press unit 100B is installed, or two or four or more press units are connected and installed. ) Can also be configured. It is also possible to install other units. For example, it is possible to install a unit that supplies a mold resin R different from the dispense unit 100C, or a unit that supplies a member to be assembled with the work W in the mold (not shown).

(Work processing unit)
Subsequently, the configuration of the work processing unit 100A included in the resin molding apparatus 1 will be mainly described, and the transfer operation of the work W and the molded product Wp will be described in detail.

The work processing unit 100A first includes a supply magazine elevator 103 for raising and lowering a supply magazine 102 in which a plurality of work Ws are stored, and a storage magazine elevator 113 for raising and lowering a storage magazine 112 in which a plurality of molded products Wp are stored. ing. The storage magazine elevator 113 is arranged at different positions in the vertical direction with respect to the supply magazine elevator 103. For example, these elevators 103 and 113 can be arranged in a hierarchical manner in the vertical direction with overlapping in a plan view. Here, known stack magazines, slit magazines, and the like are used for the supply magazine 102 and the storage magazine 112, and in the present embodiment, the work W and the molding are all in a state where the mounting surface of the electronic component Wb faces downward. Each item Wp is stored. From the viewpoint of protecting the electronic components Wb, it is preferable to use a slit magazine for inserting and holding the work W into the recesses facing each other inside the magazine frame to hold the work W apart from each other. Further, the supply magazine elevator 103 is configured so that the work W can be taken out from a predetermined position by holding the supply magazine 102 and moving it up and down. The storage magazine elevator 113 is configured to be able to store the molded product Wp at a predetermined position by holding the storage magazine 112 and moving it up and down.

Next, the work processing unit 100A is provided in front of the supply magazine 102 and includes a supply rail 104 on which the work W taken out from the supply magazine 102 is placed. In the present embodiment, the relay rail 106 for passing the work W is provided between the supply magazine 102 and the supply rail 104, but this may be omitted. A known pusher or the like (not shown) is used to move the work W from the supply magazine 102 to the supply rail 104.

Here, the supply rail 104 supports the longitudinal side of the work W from below while avoiding the mounting position of the electronic component Wb, and guides the work W laterally in the front-rear direction. Further, the supply rail 104 is configured in two rows (104A and 104B in the figure) so that the two workpieces W can be placed side by side in the lateral direction in the lateral direction, and can be moved in the lateral direction. It has a moving mechanism (not shown). As a result, the work W taken out from the supply magazine 102 is placed in one row (for example, 104A), and then the supply rails 104A and 104B are moved in either the left or right predetermined direction (for example, the right direction). The next work W can be placed in the other column (for example, 104B).

Next, the work processing unit 100A is arranged below the supply rail 104 and is configured to be movable in the front-rear and left-right directions, and is configured to be movable on the lower surface side (electronic component Wb) with respect to the work W on the supply rail 104. It is equipped with a work measuring instrument 114 that measures the thickness of the work W from the mounting surface side). The work measuring instrument 114 is composed of a laser displacement meter and a camera (monocular camera or compound eye camera), and measures the thickness of the work W based on these output data. The "thickness measurement" referred to here requires measurement of whether or not the electronic component Wb is mounted on the base material Wa, measurement of the mounting height of the electronic component Wb, measurement of the mounting position shift, measurement of the number of mounted components, and the like. Measurements are included. Based on the result of "thickness measurement" here, for example, the volume of the electronic component Wb mounted on the work W is calculated from the presence / absence of mounting of the electronic component Wb and the mounting height, and the supply amount of the mold resin R is adjusted. By doing so, it becomes possible to control the molding thickness of the molded product with high accuracy.

Here, the work measuring instrument 114 has two thickness sensors 114a and 114b for measuring the thickness of each of the two works W on the two rows of supply rails 104A and 104B. As an example, the thickness sensor 114a is arranged at a position corresponding to the work W in the right column, and the thickness sensor 114b is arranged at a position corresponding to the work W in the left column. As a result, it is possible to scan the same corresponding position of each work W at the same time, and it is possible to measure two work Ws in one scan with the shortest scanning distance and scanning time. Therefore, the process time can be significantly reduced. As a measurement operation of the work W in one scan, the work W is divided vertically or horizontally into n (n is an integer of 2 or more), and the work is formed along a pattern composed of lines connecting adjacent ends of a straight line. The work W may be measured at predetermined intervals while moving W with respect to the thickness sensors 114a and 114b. Thereby, the thickness of the base material Wa and the height of the electronic component Wb in the work W can be arbitrarily measured by "one scanning operation (one scanning)" along a predetermined pattern. Further, in the configuration of the present embodiment, the scanning operation (movement in the front-back and left-right directions) is performed by the mechanism of the left-right movement operation of the supply rails 104A and 104B for mounting the work W and the work measuring instrument 114. It can be carried out with a simple configuration by the mechanism of the movement operation in the front-back direction.

As a modification, in the measurement operation of the work W in one scan, the cameras as the thickness sensors 114a and 114b collectively capture a predetermined width by moving in the front-rear direction once, and the thickness of the entire surface of the work W is taken. May be measured. Further, the scanning operation may be performed by moving the work measuring instrument 114 back and forth and left and right. Further, it may have a configuration in which one thickness sensor is provided and two workpieces W are sequentially measured in a predetermined scan (not shown).

Further, the work measuring instrument 114 preferably measures the thickness of the work W from the lower surface side with respect to the work W on the supply rail 104 in relation to the supply operation of the work W described later. The thickness of the work W may be measured from the upper surface side. In this case, the work measuring instrument 114 may be provided on either or both of the upper and lower sides of the relay rail 106 through which the work W is passed. The work measuring instrument 114 may be configured to read not only the thickness of the work W but also the identification information (for example, a two-dimensional code) attached to the work W. Further, a code reader 115 capable of reading the two-dimensional code of the work W can be provided either above or below the relay rail 106. As the identification information of such a work W, for example, by attaching it as a serial number or a unique code, it is possible to identify which work W it is. By associating this identification information with the detailed conditions of the resin mold and recording it, a process for enhancing traceability as described later becomes possible.

Next, the work processing unit 100A includes a supply pickup 120 that holds the work W mounted on the supply rail 104 and conveys it to a predetermined position. As a mechanism for holding the work W, it has a known holding mechanism (for example, a structure having a holding claw to hold the work W, a structure having a suction hole communicating with a suction device, and the like). Not shown). A known mechanism such as a vacuum pump is used for the suction device (the same applies hereinafter). Here, the supply pickup 120 is configured to be movable in the left-right and up-down directions. As a result, the work W mounted on the supply rail 104 is held and raised, so that the work W can be finally conveyed (supplied) to the first holding portion 210A described later.

Further, the supply pickup 120 according to the present embodiment has a configuration in which the above holding mechanisms are arranged side by side in two rows in the left-right direction at positions corresponding to two workpieces W on the two rows of supply rails 104A and 104B. ing. This makes it possible to simultaneously hold and transport the two workpieces W on the two rows of supply rails 104A and 104B in a state of being arranged in the left-right direction. In other words, the work W can be held side by side with its longitudinal direction parallel to each other.

Next, the work processing unit 100A includes a work heater 116 that heats the work W from the lower surface side. Here, as a configuration for heating the work W, a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is provided on the upper surface of the work heater 116 (not shown). As a result, by preheating the work W before it is carried into the mold mold 202 and heated, the elongation of the work W in the mold mold 202 is suppressed. As a modification, a configuration without a work heater 116 can be considered. In this case, a heater can be provided in the first holding portion 210A (first loader 210).

The work heater 116 according to the present embodiment is arranged so as to be movable back and forth with respect to the lower surface side of the work W held by the supply pickup 120 above the supply rail 104 (see FIG. 2). In other words, it can be said that the work heater 116 is movably arranged between a position outside the outer circumference of the work W and a position directly below the lower surface of the work W. This makes it possible to perform a preheating step of heating the work W before the resin molding is performed. When the work heater 116 is moved to a position directly below the lower surface of the work W, the supply pickup 120 holding the work W is moved downward to bring the work W closer to the work heater 116. This enables more efficient heating.

The work heater 116 according to the present embodiment has a configuration in which the above heating mechanism is arranged in two rows in the left-right direction at positions corresponding to the two work W held by the supply pickup 120. As a result, the two work W held side by side in the left-right direction by the supply pickup 120 can be heated evenly at the same time.

As described above, it is possible to realize a configuration in which the work W held by the supply pickup is heated (preheating step) by the work heater 116 above the supply rail 104, that is, while the work W is being moved in the vertical direction by the supply pickup. Therefore, it is possible to significantly reduce the installation area of the device as compared with the conventional device in which each configuration is arranged in a plane.

Next, the first loader 210 that cooperates with each mechanism of the work processing unit 100A is provided with a first holding portion 210A on the upper surface thereof that conveys the work W to a predetermined holding position of the upper die 204. The work W conveyed by the supply pickup 120 is placed on the first holding portion 210A when the work W is moved to a position lateral to the supply rail 104 (for example, to the right). When the work W is delivered, the supply pickup 120 rises further on the supply rail 104 through the preheating process, and then moves to the right, so that the first holding portion located on the right side of the supply rail 104 Move to a position where it can be delivered to 210A. The first holding portion 210A has a known holding mechanism (for example, a configuration having a holding claw to hold the work W, and a suction hole communicating with a suction device) as a work holding portion for holding the mounted work W. (In the figure, reference numerals 210a, 210b).

In the present embodiment, the work holding portions 210a and 210b are arranged side by side in two rows in the left-right direction at positions corresponding to the two works W held by the supply pickup 120. That is, the works W can be held side by side with their longitudinal directions parallel to each other. As a result, the two work Ws held side by side in the left-right direction by the supply pickup 120 can be placed at the same time without being rearranged in the same arrangement, held side by side in the left-right direction, and conveyed.

Further, the first loader 210 in which the work W is held by the first holding portion 210A is configured to be movable in the front-back, left-right, and up-down directions. By moving in the left-right direction, the work W can be transported from the work processing unit 100A to the press unit 100B. On the other hand, by moving in the front-rear direction, the work W can be conveyed from the outside to the inside of the mold mold 202 (that is, between the upper mold 204 and the lower mold 206 in the opened state). Further, by moving in the vertical direction, the work W can be conveyed (delivered) to a predetermined holding position of the upper mold 204 inside the mold mold 202. As a modification, it is conceivable that the supply pickup 120 replaces the movement of the moving range instead of the configuration in which the first holding portion 210A moves left and right. Further, instead of the configuration in which the first holding portion 210A moves up and down, it is conceivable to have a configuration in which the movement of the moving range is replaced by the mold opening / closing mechanism of the mold mold 202 (all not shown).

Next, on the upper surface of the first loader 210, the resin-molded molded product Wp is removed from the mold mold 202 (here, the upper mold 204) and placed, and the molded product Wp is placed in the mold mold. It is provided with a second holding portion 210B for transporting to a predetermined position outside the 202. The second holding portion 210B has a known holding mechanism (for example, a configuration having a holding claw to hold the molded product Wp, and a suction hole communicating with the suction device) as a molded product holding portion for holding the mounted molded product Wp. (In the figure, reference numerals 210c, 210d).

Further, the second holding portion 210B according to the present embodiment has a position corresponding to the two molded product Wp in which the molded product holding portions 210c and 210d are held in the mold mold 202 (upper mold 204) after resin molding. In addition, it has a structure in which two rows are arranged side by side in the left-right direction. That is, the molded products Wp can be held side by side with their longitudinal directions parallel to each other. As a result, the two molded products Wp held side by side in the left-right direction by the mold mold 202 (upper mold 204) are placed at the same time without being rearranged in the same arrangement, held side by side in the left-right direction, and conveyed. It becomes possible.

Here, in the present embodiment, the second holding portion 210B and the above-mentioned first holding portion 210A are integrally configured as the first loader 210. As an example, the first loader 210 is provided with a first holding portion 210A having two rows of left and right workpiece holding portions 210a and 210b on the front side, and has two rows of left and right molded product holding portions 210c and 210d on the rear side. A second holding portion 210B is arranged. Therefore, the first holding portion 210A and the second holding portion 210B are configured to be integrally movable as the first loader 210 in the front-back, left-right, and up-down directions. As a result, not only the device configuration can be simplified and miniaturized, but also the work W and the molded product Wp can be simultaneously conveyed by two at the same time, so that the process time can be shortened.

As a modification, it is conceivable that the loader provided with the second holding portion 210B is configured separately from the loader provided with the first holding portion 210A (not shown). In that case, it may be configured to be movable in the same manner as the first holding portion 210A described above.

Next, the work processing unit 100A includes a first storage pickup 122 that holds the molded product Wp placed on the second holding portion 210B and conveys it to a predetermined position. Further, the work processing unit 100A includes a second storage pickup 124 on which the molded product Wp held by the first storage pickup 122 is placed and conveyed to a predetermined position in the unit. In each case, as a mechanism for holding the molded product Wp, a known holding mechanism (for example, a structure having a holding claw for holding, a structure having a suction hole communicating with a suction device for suction, a mechanism for simply placing the molded product Wp, etc. ) (Not shown).

Here, the first storage pickup 122 according to the present embodiment is configured to be movable in the left-right direction. As a result, it becomes possible to hold the molded product Wp placed on the second holding portion 210B and convey it onto the second storage pickup 124. Here, even if the molded product Wp is sandwiched between the first storage pickup 122 and the second storage pickup 124 and is kept on standby to be cooled while being flattened, the molded product Wp is prevented from warping or being distorted. good. As a modification of the first storage pickup 122, it may be configured to be movable not only in the left-right direction but also in the up-down direction. As a result, it is possible to realize a configuration in which the vertical movement mechanism of the second holding portion 210B is omitted.

Further, in the first storage pickup 122 according to the present embodiment, the above-mentioned holding mechanism corresponds to two molded products Wp mounted on the second holding portion 210B (two rows of molded product holding portions 210c, 210d). It has a structure in which two rows are arranged side by side in the left-right direction at the position where it is to be installed. This makes it possible to simultaneously hold and transport the two molded products Wp on the second holding portion 210B in a state of being arranged in the left-right direction.

Further, in the present embodiment, the supply pickup 120 conveys the work W to the first holding portion 210A in the left-right direction, and the storage pickup (first storage pickup 122) conveys the molded product Wp from the second holding portion 210B. The carrying-out routes in the left-right direction are set side by side in the front-rear direction. As a result, the loading operation of the work W by the supply pickup 120 and the loading operation of the molded product Wp by the storage pickup (first storage pickup 122) do not intersect or overlap with each other, so that the occurrence of waiting time can be suppressed. .. Therefore, since a plurality of operations can be performed in parallel and each operation can be performed efficiently, the processing can be facilitated and the process time can be shortened.

On the other hand, the second storage pickup 124 according to the present embodiment is configured to be movable in the vertical direction. This makes it possible to hold the molded product Wp mounted on the second storage pickup 124 and transport it onto the storage rail 108 described later.

Further, the second storage pickup 124 according to the present embodiment has a configuration in which the holding mechanism is arranged in two rows in the left-right direction at positions corresponding to the two molded products Wp held by the first storage pickup 122. It has become. As a result, the two molded products Wp held by the first storage pickup 122 can be simultaneously held and conveyed in a state of being arranged side by side in the left-right direction.

In this embodiment, the configuration is provided with two storage pickups (first storage pickup 122 and second storage pickup 124) as described above, but as a modification, one that can be moved in the left-right and up-down directions. It may be configured to include two storage pickups (not shown). As a result, the molded product Wp placed on the second holding portion 210B can be held and directly transported onto the storage rail 108.

Next, the work processing unit 100A is provided below the work measuring instrument 114 and includes a storage rail 108 on which the molded product Wp conveyed by the storage pickup (here, the second storage pickup 124) is placed. ing. The molded product Wp placed on the storage rail 108 passes on the storage rail 108 (slide movement) and is stored in the storage magazine 112.

In the present embodiment, the relay rail 110 for passing the molded product Wp is provided between the storage rail 108 and the storage magazine 112, but this may be omitted. A known pusher or the like (not shown) is used to move the molded product Wp from the storage rail 108 to the storage magazine 112.

Here, the storage rail 108 supports the longitudinal side of the molded product Wp from below while avoiding the mounting position of the electronic component Wb, and guides the work W sideways. Further, the storage rail 108 is configured in two rows (108A and 108B in the figure) so that the two molded products Wp can be placed side by side in the lateral direction in the lateral direction, and can be moved in the lateral direction. It has a moving mechanism (not shown). As a result, the two molded products Wp held in the storage pickup (here, the second storage pickup 124) are placed simultaneously in a state of being arranged side by side in the left-right direction, and then the molded products Wp are sequentially directed to the storage magazine 112. Can be moved. For example, the molded product Wp on one row (for example, 108B) is moved toward the storage magazine 112, and then the storage rails 108A and 108B are moved in either the left or right predetermined direction (for example, the left direction), and the other. It is possible to move the molded product Wp on the row (for example, 108A) toward the storage magazine 112.

Next, the work processing unit 100A is arranged below the storage rail 108, and is molded to inspect the molded product Wp from the lower surface side (mounting surface side of the electronic component Wb) with respect to the molded product Wp on the storage rail 108. It is equipped with an article measuring instrument 118. As an example, the molded product measuring instrument 118 can be arranged at a lower position when the storage rails 108A and 108B are in predetermined positions when the molded product Wp is moved toward the storage magazine 112. This molded product measuring instrument 118 is composed of a laser displacement meter and a camera (monocular camera or compound eye camera), and uses a method such as comparison with a reference value based on these output data and pattern matching to obtain a molded product Wp. It is used to measure the thickness and detect defects in the appearance of the molded part of the molded product Wp. The "lower part of the storage rail" includes the lower part of the relay rail when the relay rail 110 is provided. In addition, the "inspection" referred to here is the measurement of the thickness of the resin-molded portion (resin-molded portion) on the base material Wa, the appearance of the resin mold (exposed wire), and the defect of the resin mold (filling defect, etc.). , Etc., necessary measurements are included. Based on the result of the "inspection" here, for example, the supply amount of the mold resin R is adjusted based on the difference between the actual thickness of the resin molded portion and the target thickness value, and the molding thickness of the molded product Wp is adjusted. May be able to be controlled with high precision.

One thickness sensor 118a is fixedly arranged in the molded product measuring instrument 118 according to the present embodiment. This makes it possible to measure the thickness of the molded product Wp passing over the storage rail 108 at a predetermined position (for example, the center position or the outer peripheral position of the resin molded portion).

As described above, in the present embodiment, the supply rail 104, the work measuring instrument 114, the storage rail 108, and the molded product measuring instrument 118 are juxtaposed in the vertical direction so as to overlap each other, and are arranged in layers in that order from the top. It has a structure in which they are installed side by side (including offsets in the front-back and left-right directions). At the same time, the supply magazine elevator 103 and the storage magazine elevator 113 are also arranged at different positions in the vertical direction, and have a configuration in which they are arranged in layers in that order from the top. According to these, it is possible to significantly reduce the installation area of the device as compared with the conventional device in which each configuration is arranged in a plane.

Further, it is possible to realize a configuration in which the heat dissipation process of the molded product Wp is performed while being sandwiched and flattened in the transfer between the first storage pickup 122 and the second storage pickup 124, for example, while the second storage pickup 124 is moving in the vertical direction. It is not necessary to provide a separate heat dissipation unit, and the installation area of the device can be reduced.

Further, according to the above configuration, for example, from a state in which two strip-shaped workpieces W are placed on the supply rail 104 to a state in which two processed molded products Wp are placed on the storage rail 108. All of the above steps can be performed in a state where two workpieces W or molded products Wp are arranged side by side in the left-right direction. For this reason, it is possible to significantly reduce the process time as compared with the conventional apparatus in which the process of sequentially performing the processes one by one is included in the process, which partially includes the process of taking time.

Further, according to the above configuration, the work W and the molded product Wp are moved in the entire process from the removal of the work W from the supply magazine 102 to the processing into the molded product Wp and the storage in the storage magazine 112. At that time, it is possible to realize a configuration in which the work W and the molded product Wp are moved in the front-back, left-right, and up-down directions without changing the orientation (holding, mounting orientation) at all. Therefore, the process time can be shortened and the device configuration can be simplified as compared with the conventional device in which the directions of the work W and the molded product Wp are changed during the process.

As a modification of the above resin molding apparatus 1, when one cavity is provided in one lower mold and one work W (for example, a circular wafer, a square, a rectangular substrate, or the like is used as the base material Wa). Is assumed), and resin molding may be performed to obtain one molded product, as in the compression molding type resin molding device 2 (see FIG. 28). In this case, the work W can be configured to process a wide work (large format work) having a wider width than the work W as the strip work described above. As this wide work, a square, rectangular, or polygonal work W that is wider than the strip work, or a circular wafer or carrier plate W that has a relatively wider diameter (width) than the strip work is used. May be good. In that case, instead of the work processing unit 100A, the following configuration such as the work processing unit 500A can be considered.

As an example, the work processing unit 500A includes a robot hand 504 that takes out the work W from the supply magazine or stores the molded product Wp in the storage magazine instead of the supply rail 104 and the storage rail 108 described above. A transfer robot may be provided. Here, for the robot hand 504, a mechanism such as a known multi-indirect robot having a fork-shaped member corresponding to the shape of the work W at the tip thereof and a suction mechanism can be used. It should be noted that the configuration may include a plurality of robot hands (not shown).

Further, in the first holding portion 210A, the above-mentioned two rows of work holding portions 210a and 210b and the wide work holding portion 506 for holding one work W (wide work) can be replaced and installed. Can be done. Further, in the second holding portion 210B, the above-mentioned two rows of molded product holding portions 210c and 210d, and a wide molded product holding portion 508 that holds one molded product Wp (molded product Wp corresponding to the wide work W). Can be replaced with a configuration that can be installed.

As for the configuration in which the strip work and the wide work can be switched in this way, for example, the first holding portion 210A can hold the work W, which is two strip works, side by side in parallel in the longitudinal direction. , A configuration having two rows of work holding portions 210a and 210b and a configuration having one work holding portion 506 for holding the work W which is one wide work can be considered to be replaceable. Further, the second holding portion 210B has two rows of molded product holding portions 210c and 210d so that the two molded product Wp obtained by processing the work W, which is a strip work, can be held side by side in parallel in the longitudinal direction thereof. It is conceivable that the configuration and the configuration having one work holding portion 508 for holding one molded product Wp obtained by processing this one work W can be replaced with each other. With such a configuration, the work W and the molded product Wp can be conveyed by replacing the simple configuration of the first holding portion 210A and the second holding portion 210B regardless of whether the work W is a strip work or a wide work. It can be configured as possible.

(Press unit)
Subsequently, the configuration of the press unit 100B included in the resin molding apparatus 1 will be described in detail.

The press unit 100B is a mold having a pair of dies to be opened and closed (for example, a plurality of dies made of alloy tool steel, a die plate, a die pillar, and other members are assembled). It is equipped with a mold 202. In the present embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 204, and the other mold on the lower side is the lower mold 206. The mold mold 202 is closed and opened by the upper mold 204 and the lower mold 206 approaching and separating from each other. That is, the vertical direction is the mold opening / closing direction.

The mold mold 202 is opened and closed by a known mold opening / closing mechanism (not shown). For example, the mold opening / closing mechanism includes a pair of platens, a plurality of connecting mechanisms (tie bars and pillars) on which the pair of platens are erected, a drive source (for example, an electric motor) and a drive transmission mechanism for moving (elevating) the platens. (For example, a toggle link) and the like are provided (the drive mechanism is not shown).

Here, the mold mold 202 is arranged between a pair of platens of the mold opening / closing mechanism. In the present embodiment, the upper mold 204, which is a fixed type, is assembled to a fixed platen (a platen fixed to a connecting mechanism), and the lower mold 206, which is a movable type, is attached to a movable platen (a platen that moves up and down along the connecting mechanism). It is assembled. However, the present invention is not limited to this configuration, and the upper die 204 may be a movable type and the lower die 206 may be a fixed type, or both the upper die 204 and the lower die 206 may be a movable type.

Next, the lower mold 206 of the mold mold 202 will be specifically described. The lower mold 206 includes a lower plate 224, a cavity piece 226, a clamper 228, and the like, and is configured by assembling these (see FIG. 10).

Here, the cavity piece 226 is fixedly assembled to the upper surface (the surface on the upper mold 204 side) of the lower plate 224. The clamper 228 is configured in an annular shape so as to surround the cavity piece 226, and is assembled adjacent to the cavity piece 226 and separated (floating) from the upper surface of the lower plate 224.

In the present embodiment, the lower mold 206 has a cavity 208 recessed from the mold surface (parting surface) 206a, but the cavity piece 226 constitutes the inner part (bottom) of the cavity 208, and the clamper 228 is on the side of the cavity 208. Make up the part. In other words, the upper surface of the cavity piece 226 and the inner peripheral wall surface of the clamper 228 form a cavity recess 209 recessed in a predetermined shape.

In this embodiment, as shown in FIG. 21 and the like, two cavities 208 are arranged side by side in the left-right direction (reference numerals 208A and 208B in the figure), and cavities corresponding to each are provided. It is equipped with pieces 226A and 226B. This makes it possible to simultaneously accommodate the two films F (the portion on which the mold resin R is mounted) in the cavities 208A and 208B, respectively. Therefore, it is possible to realize a configuration in which two work Ws are simultaneously resin-molded, so that the process time can be shortened. In the lower mold 206, the clamper 228 can be raised and lowered separately for each of the cavities 208A and 208B, and the upper mold 204 is provided with a plate thickness adjusting mechanism that absorbs the plate thickness difference between the two workpieces W with an elastic body. It may be configured as a new type. According to this, even if there is a difference in the thickness of the two workpieces W to be compression-molded at the same time, the molding can be performed while reducing the influence of the supply variation of the resin amount without causing the inclination. In this embodiment, the mold members are arranged so that the cavities 208A and 208B are arranged side by side in the left-right direction. Therefore, the cavity pieces 226A and 226B constituting the cavities 208A and 208B and the clamper 228 are separately left and right as a chase structure, and maintenance is performed by individually inserting and removing them from the base accommodating them in the front-rear direction of the device. Can be done.

Here, a suction groove (not shown) is provided on the mold surface of the upper mold 204 facing the clamper 228, and this communicates with the suction device (not shown). Further, by providing a seal structure surrounding them, it is possible to degas the inside of the cavity 208 in a closed state by driving the suction device to reduce the pressure.

Further, the mold mold 202 includes a film suction mechanism that sucks the film F from the mold surface 206a side of the lower mold 206. As an example, this film suction mechanism communicates with a suction device (not shown) via suction paths 230a and 230b arranged so as to penetrate the clamper 228. Specifically, one end of the suction paths 230a and 230b is connected to the mold surface 206a of the lower mold 206, and the other end is connected to a suction device arranged outside the lower mold 206. As a result, the suction device can be driven to suck the film F from the suction paths 230a and 230b, and the film F can be sucked and held on the mold surface 206a including the inner surface of the cavity 208. More specifically, the film F can be sucked from the suction path 230b, and the film F can be sucked and held on the mold surface 206a outside the cavity 208, and the film F can be sucked from the suction path 230a. The film F can be attracted to and held on the mold surface 206a on the inner surface of the cavity 208 (the mold surface of the cavity recess 209).

By providing the film F that covers the inner surface of the cavity 208 and the mold surface 206a (part) of the lower mold 206 in this way, the portion of the mold resin R on the lower surface of the molded product Wp can be easily peeled off. Therefore, the molded product Wp can be easily taken out from the mold mold 202.

Further, the mold mold 202 includes an urging member (for example, a spring such as a coil spring) 232 between the lower plate 224 and the clamper 228. A clamper 228 is movably assembled to the lower plate 224 via the urging member 232. As a result, the cavity piece 226 is surrounded by the clamper 228, and the cavity piece 226 and the clamper 228 can reciprocate relatively in the mold opening / closing direction. As described above, in the lower mold 206, the cavity piece 226 is fixedly held with respect to the lower plate 224, while the clamper 228 is separated (floating) and held via the urging member 232 so as to be movable. To. At this time, the gap between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the cavity piece 226 is secured with a predetermined dimension. Therefore, the clamper 228 can be smoothly moved.

By the way, the above-mentioned gap is included in the suction path 230a of the above-mentioned film suction mechanism, and the film F is sucked at the boundary between the cavity piece 226 and the clamper 228 (the corner portion of the cavity 208). Therefore, the film suction mechanism includes a sealing member 234 (for example, an O-ring). The seal member 234 is provided between the cavity piece 226 and the clamper 228 (lower part) so that the above gap serves as a suction path 230a so that air does not leak, and seals the member 234.

Further, the lower mold 206 includes a heater (for example, a heating wire heater), an auxiliary heater (for example, a heating wire heater), a temperature sensor, a control unit, a power supply, etc. (all not shown), and can be used for heating and control thereof. Will be done. As an example, the heater of the lower mold 206 is built in the lower plate 224 and the mold base (not shown) accommodating them, and mainly heats the entire lower mold 206 and the work W. The heater of the lower mold 206 adjusts the lower mold 206 to a predetermined temperature (for example, 120 ° C. to 180 ° C.) and heats the lower mold 206.

Next, the upper mold 204 of the mold mold 202 will be specifically described. The upper mold 204 includes an upper plate 222, a cavity plate 236, and the like, and is configured by assembling these. Here, the cavity plate 236 is fixedly assembled to the lower surface of the upper plate 222 (the surface on the lower mold 206 side).

Further, the upper die 204 includes a heater (for example, a heating wire heater), a temperature sensor, a control unit, a power supply, and the like (all not shown), and heating and control thereof are performed. As an example, the heater of the upper mold 204 is built in the upper plate 222 and mainly applies heat to the entire upper mold 204 and the mold resin R. The heater of the upper mold 204 adjusts the upper mold 204 to a predetermined temperature (for example, 120 ° C. to 180 ° C.) and heats the upper mold 204.

Further, the upper die 204 is provided with a work holding mechanism 240 that holds the work W in a predetermined position on the lower surface of the cavity plate 236. As an example, the work holding mechanism 240 communicates with a suction device (not shown) via a suction path 240a arranged in the cavity plate 236. Specifically, one end of the suction path 240a is connected to the mold surface 204a of the upper mold 204, and the other end is connected to a suction device disposed outside the upper mold 204. As a result, the suction device can be driven to suck the work W from the suction path 240a, and the work W can be sucked and held on the mold surface 204a (here, the lower surface of the cavity plate 236). Further, it may be configured to have a holding claw for sandwiching the outer periphery of the work W in parallel with the configuration including the suction path 240a.

In this embodiment, as shown in FIG. 21 and the like, two work holding mechanisms 240 are arranged side by side in the left-right direction (reference numerals 240A and 240B in the figure). This makes it possible to simultaneously hold the two works W by the work holding mechanisms 240A and 240B, respectively. Therefore, it is possible to realize a configuration in which two work Ws are simultaneously resin-molded, so that the process time can be shortened. As the above-mentioned plate pressure adjusting mechanism, the cavity plate 236 holding the work W is divided into the cavities 208A and 208B so that they can be raised and lowered separately, so that the difference in the thickness of the two work Ws to be compression-molded at the same time can be reduced. Even if there is, it may be possible to mold without causing inclination.

As described above, as a modification of the above resin molding device 1, a compression molding type resin is obtained by providing one cavity in one lower mold and arranging one work W to perform resin molding to obtain one molded product. It may be configured as in the mold device 2 (see FIG. 28). In that case, instead of the press unit 100B, the following configuration such as the press unit 500B can be considered.

As an example, in the lower mold 206, the press unit 500B includes a cavity 208 for accommodating the mold resin via one film instead of the two rows of cavities 208A and 208B for accommodating the two films and the mold resin described above. It may be configured. Further, in the upper mold 204, the work holding mechanisms 240A and 240B for holding the above-mentioned two works may be configured to be used together as the work holding mechanism 240 for holding one work W.

(Dispens unit)
Subsequently, the configuration of the dispense unit 100C included in the resin molding apparatus 1 will be mainly described, and the supply operation of the film F and the molding resin R will be described in detail.

As described above, the dispense unit 100C is a unit that supplies the film F, the mold resin R, and the like. In the present embodiment, when the film F and the mold resin R are transported to the mold mold 202, the transport tool 400 is used as a jig for holding and transporting the film F and the mold resin R. That is, by using this transport tool 400 as a jig, the mold resin R can be held and transported together with the film F. Further, the carrier 400 can hold the films F side by side in parallel in the longitudinal direction (details will be described later).

The dispense unit 100C first includes a preparation table 302 on which the transporter 400 in a state where the film F and the mold resin R are not held is placed and appropriate cleaning is performed. For example, the transport tool 400 carried out from the mold mold 202 may have the mold resin R adhered to it and cause a malfunction. Therefore, it is possible to prevent malfunction by cleaning the surface including the through hole described later with a brush or a suction mechanism (not shown).

Next, a transport tool pickup 304 that holds the transport tool 400 and transports the transport tool 400 between a plurality of predetermined positions (tables) is provided. As a mechanism for holding the carrier 400, it has a known holding mechanism (for example, a structure having a holding claw for holding, a structure having a suction hole communicating with a suction device, and the like). (Not shown). For example, it is possible to adopt a configuration in which an uneven portion is provided on the outer peripheral portion of the transport tool 400, and the uneven portion is hooked on a holding claw that is erected downward from the lower surface of the transport tool pickup 304 to hold and transport the uneven portion.

Here, the carrier pickup 304 is configured to be movable in the front-back, left-right, and up-down directions. This makes it possible to hold the transport tool 400 placed on the preparation table 302 and transport it to the film table 308 and the resin dropping table 310, which will be described later.

Next, the dispense unit 100C has a film roll 306 in which a long film F is wound in a roll shape and an upper part of the film roll 306 (obliquely upward in the present embodiment) at a position behind the preparation table 302. The film F is provided with a film table (first table) 308 which is arranged in a film roll 306 and is cut and held in a strip shape having a predetermined length.

As an example, the film table 308 and the film roll 306 have a configuration (including an offset in the front-back and left-right directions) in which the film table 308 and the film roll 306 are arranged in a layered manner in that order from the top in the vertical direction. This makes it possible to reduce the installation area of the device as compared with the conventional device in which each configuration is arranged in a plane.

In the present embodiment, as the film roll 306, two film rolls 306A and 306B are arranged side by side in the left-right direction. This makes it possible to simultaneously supply two films F having the same shape on the film table 308. Here, the film rolls 306A and 306B may be supported and installed by the central shaft 307a thereof, or may be supported and installed from below by a plurality of rollers 307b provided at intervals smaller than the outer shape of the film rolls 306A and 306B. May be good. In this case, by supporting the film rolls 306A and 306B from below with the rollers 307b, the two film rolls 306A and 306B arranged side by side can be easily replaced without the need for inserting and removing the central shaft 307a. Further, the film roll 306 may be fed to the film table 308 by a configuration in which an end portion is sandwiched and pulled out, or a configuration in which a drive-type roller provided in front of the film table 308 is used to feed the film roll 306.

On the other hand, the film table 308 has a known cutting mechanism (for example, a fixed blade cutter, a heat melting cutter, etc.) as a mechanism for cutting the long film F (not shown). Further, as a mechanism for holding the two films F, a known holding mechanism (for example, a configuration having a suction hole communicating with a suction device for suction, etc.) is provided (not shown). In the film table 308, the film F cut here and the carrier 400 are combined.

Here, as shown in FIG. 9, the conveyor 400 according to the present embodiment has a substantially flat plate-like shape formed in a plane in which the upper surface and the lower surface are parallel to each other, and holds the film F in the central portion. It has two rows of carry-in film holding portions (400A and 400B in the figure). Further, in each of the carry-in film holding portions 400A and 400B, a resin formed in a through hole so that each film F is exposed when viewed from the upper surface at a position corresponding to each film F (a position for holding each film F). Input holes 400a and 400b are arranged. The resin injection holes 400a and 400b are formed corresponding to the shape of the cavity recess 209 described above, so that when the mold resin R is dropped and held in the resin injection holes 400a and 400b, the mold resin R is molded in an appropriate state. The resin R can be prepared.

Further, a plurality of first suction holes 400c for generating a suction force to hold the film are arranged around the resin injection holes 400a and 400b. The first suction hole 400c communicates with the second suction hole 212b provided in the third holding portion 212A described later and the third suction hole (not shown) provided in the transport tool pickup 304 described later. ), The suction force generated by the suction device (not shown) is transmitted. According to the above configuration, it is possible to hold the two films F in a state of being sucked side by side in the left-right direction on the lower surface of the transport tool 400 transported on the film table 308 by the transport tool pickup 304. The outer periphery of the film F may be sandwiched between the holding claws to hold the film F.

Next, the transport tool 400 (two on the lower surface) which is arranged laterally (for example, to the right) with respect to the film table 308 and is configured to be movable in the front-back and left-right directions and is conveyed by the transport tool pickup 304. A resin dropping table (second table) 310 on which the film F is held) is provided. The resin dropping table 310 has a known holding mechanism (for example, a configuration having holding claws for holding the carrier 400, and a suction hole communicating with the suction device) as a mechanism for holding the mounted transport tool 400. Has a configuration, etc. (not shown).

Further, the dispenser 312 is provided on the side (for example, on the right side) of the film table 308 so as to sandwich the resin dropping table 310 in between, and at a position higher than the resin dropping table 310. The dispenser 312 puts the mold resin R into the resin charging holes 400a and 400b of the transporter 400 placed on the resin dropping table 310, and puts the mold resin R on the exposed film F (inside the resin charging holes 400a and 400b). The mold resin R is mounted (dropped). The dispenser 312 includes, for example, a hopper 312a for storing the mold resin R, a weighing scale 312b for measuring the weight of the dropped resin, and a trough 312c for which the measured mold resin R is sent out by a vibration feeder (not shown). , A nozzle 312d that regulates the dropping position of the mold resin R sent out from the trough 312c and dropped.

Here, the resin dropping table 310 according to the present embodiment is configured to be movable in the front-rear direction and the left-right direction (shown at three positions in FIG. 1). By moving in the left-right direction, the carrier 400 placed on the resin dropping table 310 can be moved back and forth below the dispenser 312 while the film F is held. This makes it possible to move the carrier 400 between the intermediate position between the dispenser 312 and the film table 308 and the position directly below the nozzle 312d of the dispenser 312. Further, by moving in the front-rear direction, the transport tool 400 in a state where the film F on which the mold resin R is held is held is transported to a predetermined position (a position where the transport tool 400 is held by the third holding portion 212A described later). Is possible. As a modification, instead of the configuration in which the resin dropping table 310 moves left and right, a configuration in which the movement of the moving range is replaced by the dispenser 312 may be considered. Further, instead of the configuration in which the resin dropping table 310 moves back and forth, it is conceivable to have a configuration in which the movement of the moving range is replaced by the third holding portion 212A (described later) (neither is shown).

Further, the mold resin R is sent out from the two nozzles 312d to the resin charging holes 400a and 400b while moving the resin dropping table 310 in predetermined paths in the front-back and left-right directions, so that the mold resin R is exposed in the resin charging holes 400a and 400b. The mold resin R can be spread evenly on the film F with a predetermined thickness. This makes it possible to prevent the generation of defective products due to the bias of the mold resin R on the film F.

Here, the dispenser 312 according to the present embodiment has two nozzles 312d for charging the mold resin into the two rows of resin charging holes 400a and 400b in the transport tool 400, respectively. As an example, one nozzle 312d is arranged at a position corresponding to the resin charging hole 400a on the right side, and the other nozzle 312d is arranged at a position corresponding to the resin charging hole 400b on the left side. In other words, the distance between the centers of the two nozzles 312d and the distance between the centers of the resin input holes 400a and 400b are configured to be the same. As a result, the mold resin R can be charged while passing through the same corresponding positions of the respective resin charging holes 400a and 400b at the same time, and the moving distance and the moving time can be minimized on two films F in one path. It is possible to spread the mold resin R. Therefore, the process time can be significantly reduced. As a modification, a configuration in which one nozzle is provided and the mold resin R is sequentially spread on two films F in a predetermined path may be used (not shown).

Next, a resin heater 314 for heating the mold resin R by heating from the upper surface side of the transporter 400 in a state where the film F on which the mold resin R is mounted is held is provided. As a configuration for heating the carrier 400 (mold resin R), a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is provided on the lower surface of the resin heater 314 (not shown). This makes it possible to simultaneously heat the mold resin R held on the two films F by the transport tool 400.

Here, the resin heater 314 according to the present embodiment is transported by a third holding portion 212A, which will be described later, from a position on the moving path of the resin dropping table 310, more specifically, directly under the nozzle 312d of the dispenser 312. It is arranged in the middle of the path while moving to the position where the holding of 400 is performed. This makes it possible to perform a step of heating the mold resin R immediately after the mold resin R is charged onto the film F held by the conveyor 400 by the nozzle 312d of the dispenser 312. Therefore, in particular, when a resin such as granules or powder is used as the mold resin R, the resin such as powder located on the surface is heated and melted and integrated by heating immediately after mounting on the film F. be able to. This makes it possible to prevent the generation of dust (fine powder of resin, etc.) and prevent the generation of malfunctions and product defects due to the diffusion of dust in the apparatus.

A supply resin measuring instrument 315 may be provided at positions before and after the resin heater 314 to measure the appearance of the mold resin R dropped and supplied onto the film F in the resin input holes 400a and 400b. The supply resin inspection device 315 is provided with a camera (monocular camera or compound eye camera) above the moving path of the resin dropping table 310, and the thickness of the dropped mold resin R is used by using these output values and captured images. It can be used to record the shape and shape. Thereby, for example, by associating the actual information with the molding thickness of the molded product Wp and saving the data, the operator can compare these and select the drop condition of the mold resin R. can. As a result, traceability regarding the supply of the mold resin R can be ensured, and the molding quality can be maintained.

Next, the second loader 212 that cooperates with each mechanism of the dispense unit 100C includes a third holding portion 212A. The third holding portion 212A receives the carrier 400 placed on the resin dropping table 310 on its lower surface, conveys it to a predetermined holding position of the lower mold 206, and releases the holding of the film F and the mold resin R. The transported tool 400 is transported onto the above-mentioned preparation table 302. The third holding portion 212A has a known holding mechanism (for example, a configuration having a holding claw to hold the transport tool 400, and a suction hole communicating with the suction device) as the transport tool holding portion 212a for holding the transport tool 400. It has a structure that adsorbs, etc.). Further, it has a second suction hole 212b that is arranged at a position communicating with the first suction hole 400c of the transport tool 400 to be held at a predetermined position and generates (transmits) suction force by a suction device (not shown). There is. As a result, while maintaining the state in which the two films F (each in which the mold resin R is mounted) are arranged side by side in the left-right direction and adsorbed on the lower surface of the transport tool 400, the predetermined holding position (cavity 208 is arranged) of the lower mold 206 is arranged. It is possible to transport to the installed position). The third holding portion 212A may have a holding claw that sandwiches and holds the outer circumferences of the two films F on the lower surface of the carrier 400.

Here, the second loader 212 provided with the third holding portion 212A according to the present embodiment is configured to be movable in the front-back, left-right, and up-down directions. The movement in the left-right direction enables an operation of transporting the transport tool 400 (a state in which two films F on which the mold resin R is mounted) is transported from the dispense unit 100C to the press unit 100B. Further, by moving in the front-rear direction, the conveyor 400 (a state in which the two films F on which the mold resin R is mounted is held) is moved from the outside to the inside of the mold mold 202 (that is, the upper mold in a state where the mold is opened). The operation of transporting (between 204 and the lower die 206) becomes possible.

Further, by moving in the vertical direction (in some cases, the movement in the front-back direction or the movement in the left-right direction may be combined), the conveyor 400 (two films F on which the mold resin R is mounted) placed on the resin dropping table 310 is formed. The operation of holding the held state) becomes possible. In this case, while holding the carrier 400 at the predetermined holding position (position where the cavity 208 is arranged) of the lower mold 206, the holding of the two films F on which the mold resin R is mounted is released, and the holding of the two cavities is released. It is also possible to place (one-to-one) on each of 208A and 208B (including a part of the mold surface 206a). Further, it is also possible to place the carrier 400 in a state where the holding of the film F and the mold resin R is released on the above-mentioned preparation table 302. As a modification, it is conceivable that a part of the moving range of the third holding portion 212A is replaced by moving another mechanism (resin dropping table 310, lower mold 206, etc.) (not shown).

Next, the second loader 212 holds the film (used film) Fd that remains in the lower mold 206 after the resin-molded molded product Wp is taken out from the mold mold 202 (here, the upper mold 204). A fourth holding portion 212B is provided for transporting the film to a predetermined position (film disposer 316 described later). The fourth holding portion 212B has a known holding mechanism (for example, a configuration having a suction hole communicating with a suction device for suction, etc.) as a carry-out film holding portion for holding the used film Fd. (In the figure, reference numerals 212c, 212d).

Further, in the fourth holding portion 212B according to the present embodiment, the carry-out film holding portions 212c and 212d are located at positions corresponding to the two cavities 208A and 208B of the mold mold 202 (lower mold 206) in the left-right direction. It has a structure in which two rows are arranged side by side. That is, the films F can be held side by side with their longitudinal directions parallel to each other. This makes it possible to simultaneously hold and convey two used films Fd arranged side by side in the left-right direction by the mold mold 202 (lower mold 206) after resin molding.

Here, in the present embodiment, the fourth holding portion 212B and the above-mentioned third holding portion 212A are integrally configured as the second loader 212. As an example, the second loader 212 has a third holding portion 212A having a transporter holding portion 212a on the front side, and a fourth holding portion 212B having two rows of left and right carry-out film holding portions 212c and 212d on the rear side. Are arranged. Therefore, the third holding portion 212A and the fourth holding portion 212B are configured to be integrally movable as the second loader 212 in the front-back, left-right, and up-down directions. This not only makes it possible to simplify and reduce the size of the device configuration, but also realizes a configuration in which two films F and two used films Fd on which the mold resin R is mounted are simultaneously conveyed, so that the process time can be reduced. It can also be shortened.

As a modification, it is conceivable that the loader provided with the fourth holding portion 212B is configured separately from the loader provided with the third holding portion 212A (not shown). In that case, the configuration may be movable in the same manner as the above-mentioned third holding portion 212A.

Next, the dispense unit 100C includes a film disposer 316 in which the used film Fd conveyed by the fourth holding portion 212B is stored. As an example, the film disposer 316 is formed in a box shape with an upper portion (upper surface portion) open. As a result, when the fourth holding portion 212B that conveys the used film Fd reaches the position directly above the film disposer 316, the conveying operation of the fourth holding portion 212B is stopped and the holding of the used film Fd is released. This makes it possible to drop the used film Fd and store it in the film disposer 316.

As described above, according to the configuration according to the present embodiment, it is possible to efficiently perform the operation of supplying two strip-shaped workpieces W and taking out two molded products Wp after processing (resin molding). It is possible to realize a device that can be used. In particular, when two cavities 208A and 208B are provided in one lower mold and two work Ws are arranged and resin-molded together, the state in which the mold resin R is mounted on each of the two films F is maintained. However, it can be conveyed to the cavities 208A and 208B of the lower mold 206. Therefore, as compared with the conventional device, it is possible to significantly improve the productivity while suppressing the complexity of the process and the device structure. Further, the amount of film used can be reduced as compared with the configuration in which two cavities 208A and 208B are provided in one lower mold 206 and two work Ws are arranged and covered with one (one sheet) film F. It is also possible to plan.

Further, since the film table 308 used for supplying the film F and the resin dropping table 310 used for supplying the mold resin R are provided as separate configurations, the processing can be performed in parallel. It is possible to shorten the process time as compared with the device.

As described above, as a modification of the above resin molding device 1, a compression molding type resin is obtained by providing one cavity in one lower mold and arranging one work W to perform resin molding to obtain one molded product. It may be configured as in the mold device 2 (see FIG. 28). In this case, as the film F, a wide film having a width wider than that of the film F as the strip film described above can be used. As this wide film, it is easy to use a square or rectangular sheet-fed film F having a width wider than that of a strip film. However, as the wide film, a sheet-fed film F cut out in a round shape may be used as long as it is wider than the strip film. In that case, instead of the dispense unit 100C, the following configuration such as the dispense unit 500C can be considered.

As an example, the dispense unit 500C can be installed by replacing the two rows of carry-in film holding portions 400A and 400B of the above-mentioned carrier 400 with the large carry-in film holding portion 516 that holds one film F (wide film). It may be configured. Further, if the above-mentioned two rows of carry-out film holding portions 212c and 212d are configured to be able to adsorb and hold both the used film Fd, which is two strip films, and the used film Fd, which is one wide film. good.

As for the configuration in which the strip film and the wide film can be switched and used in this way, for example, the third holding portion 212A holds the transport tool 400 for commonly holding the two types of transport tools 400 for the strip film and the wide film. It is conceivable that the configuration has a portion 212a. As the first carrier 400 held by the carrier holding section 212a, two rows of carry-in film holding sections 400A are used so that two films F, which are strip films, can be held side by side with their longitudinal directions parallel to each other. , 400B, one strip film carrier 400. As the second carrier 400 held by the carrier holding section 212a, the carrier holding that commonly holds the carrier 400 having one carry-in film holding section 516 that holds the film F which is one wide film. It is conceivable that the configuration has a portion 212a.

With such a configuration, different transport tools 400 are provided by the common transport tool holding portion 212a depending on whether the work W to be processed into the molded product Wp is a strip work or a wide work. Since the film F can be carried in together with the mold resin R while being held, the film F can be supplied by simple switching.

Further, regarding the configuration that can be used by switching between the strip film and the wide film, the fourth holding portion 212B holds the used film Fd, which is two strip films, side by side in the left-right direction with their longitudinal directions parallel to each other. A carry-out film holding portion 212c in which a plurality of suction portions for adsorbing and holding the used film Fd are arranged in an overlapping region between one strip region and a wide region for holding the used film Fd, which is one wide film. , 212d can be configured. In this case, for example, since the positions to be adsorbed overlap each other, even if the used film Fd is a strip film for a strip work, the used film Fd is one wide film by using the same adsorbing portion. Even if it can be adsorbed and held.

According to this, whether the used film Fd which is a strip film is held or the used film Fd which is a wide film is adsorbed and held, the used film Fd is adsorbed to a position where the used film Fd can be held. By arranging the portions, it is possible to carry out the used film Fd of both the strip film and the wide film without replacing the configuration.

(Resin mold operation)
Subsequently, the operation of performing resin molding using the resin molding device 1 according to the embodiment of the present invention will be described with reference to FIGS. 5 to 27, focusing on the operations of the press unit 100B and the dispense unit 100C.

First, the transport tool pickup 304 holds the transport tool 400 (state in which the film F and the mold resin R are not held) cleaned on the preparation table 302, and moves onto the film table 308 as shown in FIG. Be transported. In this case, the transport tool 400 can be transported while being held by the holding claw of the transport tool pickup 304. On the other hand, the two films F unwound from the two film rolls 306A and 306B are each cut into strips of a predetermined length and held on the film table 308.

Next, as shown in FIG. 12, by moving (lowering) the transport tool pickup 304 downward, the lower surface of the transport tool 400 is brought into contact with the two films F on the film table 308.

Next, as shown in FIG. 13, a suction force is generated in the first suction hole 400c of the transport tool 400 via the transport tool pickup 304 to attract and hold the two films F on the lower surface of the transport tool 400. In this state, the carrier pickup 304 is moved (raised) upward.

Next, as shown in FIG. 14, by moving the transport tool pickup 304 sideways (to the right), the transport tool 400 held by the transport tool pickup 304 (state in which two films F are held). Is transported onto the resin dropping table 310.

Next, as shown in FIG. 15, by moving (lowering) the transport tool pickup 304 downward, the two films F on the lower surface of the transport tool 400 are brought into contact with the resin dropping table 310. In that state, the holding of the transporting tool 400 by the holding mechanism of the transporting tool pickup 304 is released (stopped), and the transporting tool 400 (state in which the two films F are held) is placed on the resin dropping table 310. .. As a result, the transport tool pickup 304 holds the transport tool 400 in a state where the film F is held on the lower surface side, and a series of operations of transporting the film F from the film table 308 to the resin dropping table 310 is completed.

Next, by moving the resin dropping table 310 sideways (to the right), as shown in FIG. 16, the carrier 400 (holding two films F) placed on the resin dropping table 310 is held. The state) is conveyed to a position directly below the nozzle 312d of the dispenser 312.

Next, as shown in FIG. 17, the mold resin R is simultaneously charged into the insides of the two rows of resin charging holes 400a and 400b in the transport tool 400 by using the two nozzles 312d. At this time, by measuring the thickness of the work W, the amount of the mold resin R dropped and supplied into each of the resin input holes 400a and 400b can be adjusted, so that the mold resin supplied to the cavity 208 can be adjusted. The amount of R can be optimized. For example, the mold resin R dropped from the two nozzles 312d is measured separately on the dispenser 312 side, and when the specified amount of the mold resin R corresponding to one of the nozzles 312d is dropped, the mold resin R is dropped. It stops, and on the other hand, the dropping operation is continued until a specified amount of mold resin is dropped.

Further, when the mold resin R is dropped from the two nozzles 312d, the resin dropping table 310 on which the carrier 400 is mounted is moved along an arbitrary pattern. As a result, the mold resin R is supplied to the corresponding pattern (the pattern obtained by rotating the above-mentioned arbitrary pattern by 180 degrees) in each of the resin input holes 400a and 400b. Here, by moving the resin dropping table 310 along a pattern without gaps, the mold resin R is spread evenly on the two films F with a predetermined thickness. For example, the resin dropping table 310 is moved along a pattern composed of straight lines connecting adjacent ends of straight lines that divide the resin charging holes 400a and 400b into n vertically or horizontally (n is an integer of 2 or more). As a result, the mold resin R can be evenly supplied in the entire resin charging holes 400a and 400b. It should be noted that the "straight line" referred to here does not necessarily have to be evenly spaced, and may be bent in the middle.

Next, by moving the resin dropping table 310 forward, as shown in FIG. 18, the conveying tool 400 placed on the resin dropping table 310 is conveyed while passing through a position directly under the resin heater 314. Will be done. As a result, the mold resin R on the film F held by the carrier 400 is heated. Next, by further moving the resin dropping table 310 forward, as shown in FIG. 19, the carrier 400 placed on the resin dropping table 310 is placed in a predetermined position (the carrier 400 by the third holding portion 212A). Is transported to the position where the holding is performed).

Next, by moving (lowering) the third holding portion 212A downward from the state shown in FIG. 19, the lower surface of the third holding portion 212A is brought into contact with the carrier 400 on the resin dropping table 310. Next, the third holding portion holds the transport tool 400 with the holding claws. Further, a suction force is generated in the first suction hole 400c of the transport tool 400 via the third holding portion 212A, and the two films F are attracted to the lower surface of the transport tool 400. While maintaining this state, the transport tool 400 is held by the third holding portion 212A, and as shown in FIG. 20, the third holding portion 212A and the transport tool 400 are moved (raised) upward.

Next, by moving the second loader 212, as shown in FIG. 21, the carrier 400 held by the third holding portion 212A is in a state of being opened from the outside to the inside of the mold mold 202 (that is, the mold is opened). (Between the upper die 204 and the lower die 206). On the other hand, two workpieces W held by the first holding portion 210A of the first loader 210 are carried into the upper mold 204 prior to the conveying tool 400 being conveyed to the mold mold 202. At this time, first, the first loader 210 moves backward (enters) toward the inside of the mold mold, and the molded product Wp that is first resin-molded and molded by the second holding portion 210B is taken from the upper mold 204. Receive (see Figure 5). Next, the first loader 210 advances inside the mold mold, and the two work Ws held by the holding portion 210A are delivered to the upper mold 204. As a result, as shown in FIG. 21, the two work W carried in by the first holding portion 210A are held in the upper mold 204, and the work W is sufficiently heated before the carrying tool 400 is carried. Will be done.

Further, prior to the conveying tool 400 being conveyed to the mold mold 202, the used film Fd is held by the fourth holding portion 212B of the second loader 212 and is carried out from the lower mold 206. At this time, first, the second loader 212 moves backward (enters) toward the inside of the mold mold, and holds the used film Fd used for resin molding first and held in the lower mold 206 for the fourth time. It is adsorbed and received by the portion 212B (see FIG. 6). As a result, the transport tool 400 can be carried into the mold mold 202.

Next, as shown in FIG. 22, by moving (lowering) the third holding portion 212A downward, the two films F (state in which the mold resin R is mounted) on the lower surface of the carrier 400 are placed on the lower mold 206. Abut on top. At this time, each film F (the portion on which the mold resin R is mounted) is placed so as to fit in the cavities 208A and 208B.

Next, the suction force generated from the first suction hole 400c of the transport tool 400 generated through the third holding portion 212A is stopped, and the two films F (mold resin R are mounted) from the transport tool 400. ) Is released. At this time, the outer edge portion of each film F is placed so as to hang on one end of the suction path 230b on the mold surface 206a outside the cavities 208A and 208B, respectively. Here, the film F is sucked from the suction path 230b, and the film F is sucked and held on the mold surface 206a outside the cavity 208. Next, by sucking the film F from the suction path 230a, as shown in FIG. 23, the film F is attracted to and held on the mold surface 206a on the inner surface of the cavity 208 (the mold surface of the cavity recess 209). As a result, the mold resin R is supplied into the cavity 208 (on the cavity recess 209) via the film F.

Next, by moving the third holding portion 212A, the transport tool 400 is taken out as shown in FIG. 24. At this time, the conveyor 400 (a state in which the film F and the mold resin R are not held) held by the third holding portion 212A is moved from the inside to the outside of the mold mold 202 (that is, in a state where the mold is opened). It is taken out (outside between the mold 204 and the lower mold 206) and transported onto the preparation table 302. Here, the carrier 400 is cleaned and can be reused.

Next, as shown in FIG. 25, the mold mold 202 is closed, and the two work Ws are clamped by the upper mold 204 and the lower mold 206.

Next, as shown in FIG. 26, by relatively raising the cavity pieces 226A and 226B of the cavities 208A and 208B, the mold resin R is heated and pressed against the two work Ws to be thermally cured. At the same time, resin molding (compression molding) is performed. As a result, two molded products Wp are formed.

Next, as shown in FIG. 27, the mold opening of the mold mold 202 is performed. At this time, the molded product Wp and the used film Fd are separated, and the upper mold 204 holds the two molded products Wp, and the lower mold 206 holds the two used films Fd. In this state, as described above, each of the molded product Wp and the used film Fd is taken out and conveyed to complete a set of molding operations.

Regarding the molding operation as described above, it is preferable to perform each step in parallel by using a plurality of conveyors 400 in order to improve the efficiency of the operation. In this case, it is preferable that the inside of the resin molding device 1 is provided with a plurality of transport tools 400, and the transport tools 400 are circulated in each of the above-mentioned steps. That is, a cleaning step of cleaning the transport tool 400 on the preparation table 302, a film setting step of combining the transport tool 400 with the film F, a resin dropping step of dropping the mold resin R onto the transport tool 400 combined with the film F, and a mold. The resin mold device 1 controls the operation of each part so that the plurality of conveyors 400 are processed in different processes between the resin supply process of supplying the film F and the mold resin R to the mold 202. The control unit (not shown) may be controlled.

As a result, the waiting time of the carrier 400 in each process can be shortened, and the productivity can be improved. For example, by performing the process of supplying the mold resin R to the film F, which tends to take a long time in a normal case, and another process in parallel, the process in the apparatus can be efficiently performed, and the productivity can be improved. Can be enhanced.

The operation when the resin molding is performed using the resin molding device 2 which is a modification is basically the same as the operation when the resin molding is performed using the resin molding device 1 described above. In that case, one work W and one film F (and mounting) are provided for the two workpieces W, the two films F (and the mounted mold resin R), and the two molded products Wp, respectively. The molded resin R) may be compatible with one molded product Wp.

As described above, according to the resin molding apparatus and the resin molding method according to the present invention, mechanisms for supplying, storing, measuring the thickness, transporting, etc. of the work and the molded product are arranged hierarchically in the vertical direction. It is possible to realize the configuration to be achieved. Therefore, it is possible to reduce the installation area as compared with the conventional device.

In addition, a configuration in which two workpieces and molded products are processed and conveyed side by side, and a configuration in which two cavities are provided in one lower mold and the workpieces are arranged in each cavity and resin-molded at the same time are realized. Can be planned. In this way, it is possible to simultaneously convey two workpieces and molded products, as well as two films and two mold resins, and at the same time, it is possible to simultaneously resin-mold two workpieces, so that the process time is shorter than that of the conventional device. It can be shortened significantly. In addition, it is possible to simplify the device configuration and process.

The present invention is not limited to the embodiments described above, and can be variously modified without departing from the present invention. In particular, although the compression molding type resin molding apparatus having a cavity in the lower mold has been described as an example, it can also be applied to a configuration in which the upper mold has a cavity.

Further, in the overall operation of the resin molding apparatus described above, by sequentially performing resin molding while performing the resin supply control as described below, it is possible to maintain the molding quality (uniform molding thickness) in compression molding. You may try to make the supply of the important resin uniform.

(Resin supply control)
Hereinafter, the configuration and operation for resin supply control in the present embodiment will be described in detail with reference to the drawings. FIG. 29 is a block chart showing an example of a control configuration of the resin molding apparatus according to the embodiment of the present invention. The control unit CTR is composed of a CPU or the like, and cooperates with each unit in the work processing unit 100A and the dispense unit 100C described above to control the supply of the mold resin R. Further, the control unit CTR controls the display of the display unit DIS used for the operation of the operator, receives the input from the input unit INP, and reads and stores the necessary information from the storage unit MEM.

FIG. 30 is a flowchart showing an example of the resin supply operation of the resin molding apparatus according to the embodiment of the present invention. The operation described here corresponds to a set of operations (a series of operations) required for resin molding for one work W. Further, in the actual resin molding apparatus 1, each operation is performed in parallel on a plurality of work Ws, so that the necessary part of these series of operations partially overlaps the time axis. It will proceed above.

In the resin supply operation shown in the figure, first, the control unit CTR acquires the molding condition information Dc from the storage unit MEM (step S1). Here, the control unit CTR reads, for example, the molding thickness (target value) of the resin portion in the molded product Wp and the pattern of dropping the mold resin R in the carrier 400 from the storage unit MEM as the molding condition information Dc. .. The dropping pattern of the mold resin R is stored as an operation control pattern of the resin dropping table 310, but it is not only the moving position of the resin dropping table 310 composed of the moving destination points, but also between each point. The moving speed of the resin dropping table 310 is also included. Further, the dropping pattern of the mold resin R also includes the speed (dropping amount per hour) of dropping the mold resin R from the nozzle 312d.

On the other hand, the control unit CTR acquires the work information Dw of the work W to be resin-molded from now on (step S2). Here, in the work processing unit 100A, the code reader 115 reads the two-dimensional code attached to the work W taken out from the supply magazine 102 and outputs the two-dimensional code to the control unit CTR so that the control unit CTR describes each work W. Acquire work information Dw (for example, serial number). Next, the control unit CTR acquires the thickness information Dt (step S3). Here, the work measuring instrument 114 measures the thickness of the work W (details are described above) and outputs it to the control unit CTR so that the control unit CTR measures the thickness of the base material Wa and the electronic component Wb in each work W, etc. The thickness information Dt as is acquired.

Subsequently, the control unit CTR outputs the resin supply setting information Dd1 (step S4). Here, the control unit CTR calculates the amount (weight) of the mold resin R dropped and supplied from the dispenser 312. This is the electronic component Wb obtained by measuring the thickness of the work W from the volume of the cavity 208 at the time of molding obtained from the molding thickness of the resin portion as the target value and the outer shape (shape in a plan view) of the cavity 208. It can be calculated by the volume obtained by subtracting the volume and the specific gravity of the molded resin R after molding (cured state). Next, the control unit CTR outputs the previously read-out drop pattern of the mold resin R to the dispenser 312 as the resin supply setting information Dd1 together with this calculated value.

Subsequently, the dispenser 312 drops the mold resin R inside the resin input holes 400a and 400b on the film F based on the resin supply setting information Dd1. Here, in the dispenser 312, a predetermined amount of the mold resin R is weighed by the weighing scale 312b, sent out by vibration through the trough 312c, and dropped from the nozzle 312d. In such a dropping operation of the mold resin R, it may be difficult to always and uniformly drop the mold resin R from the dispenser 312.

For example, in the hopper 312a that stores the mold resin R in the dispenser 312, the size of the particles contained in the upper side and the lower side tends to be different inside the hopper 312a, and the particle size of the mold resin R changes depending on the timing of dropping. Can occur. Further, since the feeding speed differs depending on the particle size of the mold resin R when it is fed on the trough 312c by the vibration feeder, the mold resin R actually dropped is made uniform even if it is operated to be dropped with the same dropping pattern. Can be difficult. Therefore, in the dispenser 312, the mold resin R may not be dropped according to the resin supply setting information Dd1 (weight of the molded resin R to be supplied) output from the control unit CTR. On the other hand, when the dispenser 312 outputs the actual supply amount information Dd2 as the amount (weight) of the actually supplied mold resin R to the control unit CTR, the control unit CTR acquires the actual supply amount information Dd2 ( Step S5).

Subsequently, the control unit CTR acquires the supply resin shape information Dr (step S6). Here, the supply resin inspection device 315 measures the appearance of the mold resin R dropped on the film F. For example, a camera as a supply resin inspection device 315 captures an image of a mold resin R mounted on a film F in a transport tool 400 placed on a resin drop table 310, and controls the captured image as a supply resin shape information Dr. Output to the unit CTR.

Next, the control unit CTR acquires the molded product information Dp (step S7). Here, the molded product measuring instrument 118 measures the thickness of the molded product Wp for the molded product Wp resin-molded using the molded resin R prepared as described above. Subsequently, by outputting this measured value to the control unit CTR, the control unit CTR acquires the molded product information Dp as the thickness of the (resin molded portion) in each molded product Wp.

Subsequently, the control unit CTR links the plurality of information acquired as described above to the work information Dw as acquired information regarding the resin mold of one work W and stores the information in the storage unit MEM (step S8). By saving the information acquired in this way in the storage unit MEM, the operator can confirm the state of the resin mold actually performed in the device using the display unit DIS, and make necessary changes from the input unit INP. It can also be used for quality control, etc. by sending it to the host system of the manufacturing factory. As the resin supply control, traceability may be ensured by performing only the above steps.

When further control is carried out in the apparatus, the control unit CTR determines whether or not the resin supply is appropriate by using the information acquired as described above (step S9). Here, the control unit CTR compares, for example, the molding condition information Dc as the target value of the molding thickness of the resin portion and the molded product information Dp as the thickness of the (resin molded portion) in the molded product Wp. According to this, when the difference between the target value and the actual thickness of the molded product Wp exceeds a predetermined value (allowable value), it can be determined that the resin supply is not appropriate.

Subsequently, the control unit CTR adjusts the resin supply setting information Dd1 of the next work W (step S10). Here, for example, when calculating the weight of the mold resin R dropped and supplied from the dispenser 312, the mold resin to be supplied depends on whether the difference between the above-mentioned target value and the thickness of the molded product Wp is a positive value or a negative value. By setting the correction value for correcting the weight of R in the opposite direction, the subsequent forming thickness of the work W can be brought closer to the target value.

As another example of the operation of step 9, the control unit CTR has, for example, the resin supply setting information Dd1 as the weight of the molded resin R to be supplied and the actual supply amount information Dd2 as the amount (weight) of the actually supplied mold resin. And compare. According to this, when the difference between the set value and the actual value exceeds a predetermined value (allowable value), it is determined that the resin supply is not appropriate. In this case, in step 10, the control unit CTR can increase or decrease the amount of the mold resin R weighed and dropped by the weighing scale 312b in order to supply it for the subsequent work W.

As another example of the operation of step 9, the control unit CTR determines whether or not the resin supply is appropriate based on, for example, the supplied resin shape information Dr which is an image of the molded resin R mounted on the film F. to decide. Here, the captured image of the mold resin R is divided into predetermined sections (n rows and m columns), the variations in the captured images are compared to calculate the variation, and whether or not the resin supply is appropriate based on this variation. To judge. For example, the distribution of color and luminance (product of color density and number of pixels) of the image constituting each section is acquired, and it is based on the magnitude of variation in the amount of resin dropped, which is expressed as the color density of each section. To determine whether the resin supply is appropriate.

For example, in the case of a black epoxy resin generally used for a resin mold, if the amount of the mold resin R supplied in a predetermined section is large, the mold resin R becomes dense and the gap between the mold resins R is small. Become. In this case, the film F (for example, milky white) located under the mold resin R is difficult to be captured, so that the image approaches the color (black) of the mold resin R. Therefore, for example, when the mold resin R is dropped unevenly, a section in which a large amount of the film F is captured and the color of the image is lightened and a section in which the film F is not captured and the color of the image is darkened are mixed. Will be done. In this way, when the darkness of the image is significantly different in each section (when the variation is large), it is determined that the resin supply is inappropriate. In this case, in step 10, the instructions relating to the resin supply in the subsequent work W are adjusted. For example, the control unit CTR reduces the moving speed of the resin dropping table 310 or increases the dropping speed of the mold resin R from the nozzle 312d so that more mold resin R is dropped in the section where the image is thinned. Can be made to. On the other hand, the control unit CTR speeds up the moving speed of the resin dropping table 310 or lowers the dropping speed of the mold resin R from the nozzle 312d so as to reduce the mold resin R dropped in the section where the image is darkened. can do.

As described above, the control unit CTR performs an operation of adjusting the resin supply setting information Dd1 of the next work W based on the acquired information, so that the supply of the mold resin R, which is important for maintaining the quality in compression molding, is uniform. Can be transformed into.

In the above, the features of each unit in the molding device have been explained, but it is a unit that processes and processes common workpieces, and the configuration and operation performed in one of the units are the same in the other units. It doesn't matter. Further, in the present application, the functions of these units have individual effects even in a unit unit, and include the invention as a single unit. For example, in the dispense unit, a film and a carrier can be combined and supplied with a mold resin. Therefore, the same effect may be obtained even if the dispense unit and the press unit are separately prepared and used.

Further, in the above, an example in which two workpieces W, which are strip workpieces, are conveyed and molded in the molding apparatus 1 in a state where the two workpieces W are arranged in parallel in the longitudinal direction thereof has been mainly described. However, the three work Ws, which are strip works, may be conveyed and molded in the mold device 1 in a state where the three works W are arranged in parallel in the longitudinal direction thereof. Further, in consideration of the convenience of mold replacement, an example in which work W, which is a strip work, is conveyed and molded in the mold device 1 in a state of being arranged so as to be parallel to the front-rear direction of the device has been mainly described. However, the work W may be conveyed and molded in the mold device 1 in a state of being arranged so as to be parallel to the left-right direction of the device. In this case, if the supply magazine elevator 103 and the storage magazine elevator 113 are arranged on the left side of the work processing unit 100A, the work W can be efficiently conveyed without being rotated.

Further, in the above, an example in which a strip or a wide film F is cut from a roll film, prepared and conveyed has been described, but in the invention of the above-described embodiment, which is not related to the film F, a mold metal without using the film F It can also be carried out when performing compression molding using the mold 202. In this case, a dedicated transport tool for transporting only the mold resin R is used. Further, instead of using the strip or the wide film F, the roll film may be installed in the press units 100B and 500B to supply the film F, and a dedicated transport tool for transporting only the mold resin R may be used. In this carrier, the mold resin R can be conveyed in the closed state and supplied to the cavity 208 in the open state by making it possible to open and close the lower part of the position where the mold resin R is accommodated.

1, 2 Resin mold device 100A, 500A Work processing unit 100B, 500B Press unit 100C, 500C Dispens unit 103 Supply magazine elevator 104, 104A, 104B Supply rail 108, 108A, 108B Storage rail 113 Storage magazine elevator 114 Work measuring instrument 116 Work Heater 118 Molded product measuring instrument 120 Supply pickup 122 1st storage pickup 124 2nd storage pickup 202 Mold mold 204 Upper mold 206 Lower mold 210 1st loader (1st transport unit)
212 2nd loader (2nd transport section)
302 Preparation table 304 Transporter pickup 306, 306A, 306B Film roll 308 Film table (first table)
310 Resin drop table (second table)
312 Dispenser 314 Resin Heater 400 Conveyor F Film Fd Used Film R Mold Resin W Work Wp Molded Product

Claims (6)

The work is resin-molded using a mold having an upper mold for holding a work on which electronic components are mounted on a base material and a lower mold having a cavity recess in which a mold resin is supplied via a film. It is a resin molding device that processes into molded products.
A transfer tool that is a jig in which a through hole corresponding to the shape of the cavity recess is formed, and the mold resin is held in the through hole and conveyed together with the film.
A first table in which the film unwound from the film roll and cut to a predetermined length is held, and the cut film and the carrier are combined,
A second table configured to be movable by placing the carrier in a state where the film is held on the lower surface side, and
A transport tool pickup that holds the transport tool in a state where the film is held on the lower surface side and transports the transport tool from the first table to the second table.
A resin molding apparatus comprising: a dispenser for charging the mold resin into the inside of the through hole in the transport tool placed on the second table. The transport tool has two rows of film holding portions as the through holes so that the two films can be held side by side in the left-right direction, and each of the film holding portions has a resin input hole corresponding to each of the films. The resin molding apparatus according to claim 1. The resin molding apparatus according to claim 1 or 2, wherein the first table and the film roll are arranged in a layered manner in the vertical direction. The resin molding apparatus according to any one of claims 1 to 3, further comprising a resin heater for heating from the upper surface side of the conveyor in a state where the film and the molding resin are held. The carrier is
A cleaning step of cleaning the transport tool, a film setting step of combining the film with the transport tool, a resin dropping step of dropping the mold resin onto the transport tool combined with the film, and the film on the mold mold. The resin molding apparatus according to any one of claims 1 to 4, wherein a plurality of processes are provided in which the treatment is performed in a different step from the resin supply step of supplying the mold resin. A resin molding method for performing resin molding using the resin molding apparatus according to any one of claims 1 to 5.
A plurality of the above-mentioned conveyors are provided.
A cleaning step for cleaning the transport tool, a film setting step for combining the film with the transport tool, a resin dropping step for dropping the mold resin onto the transport tool combined with the film, and the film on the mold mold. A resin molding method, characterized in that the plurality of conveyors are processed in different steps between the process of supplying the mold resin and the process of supplying the resin.

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