WO2020137386A1

WO2020137386A1 - Resin molding apparatus

Info

Publication number: WO2020137386A1
Application number: PCT/JP2019/047313
Authority: WO
Inventors: 一雄中村; 義晃西澤; 徳幸北島; 幸雄伊藤
Original assignee: アピックヤマダ株式会社
Priority date: 2018-12-27
Filing date: 2019-12-04
Publication date: 2020-07-02
Also published as: KR102340509B1; KR20200105720A; CN111867800B; TWI729625B; CN111867800A; JP7203414B2; TW202045334A; JP2020107700A

Abstract

The present invention addresses the problem of providing a resin molding apparatus capable of responding to a need for various products by joint use of a transfer molding device and a compression molding device without significant modification of the devices.　As a means of solving this problem, in a press part (C), an unmolded resin (R1) is supplied to a lower mold (16) without the use of a dedicated machine, the unmolded resin (R1) is pressure-fed to a cavity by a transfer molding device (13) and transfer molded, the unmolded resin (R1) supplied into the lower mold cavity is caused to overflow by a compression molding device (18), and any device used in the case of compression molding can be selected and used.

Description

Resin molding equipment

The present invention relates to a resin supply/extraction device that supplies pre-molding resin and takes out post-molding resin, a work transfer device that transfers a work before and after molding to/from a mold, and a resin molding device including these.

In recent years, work has become thinner and the cavity filled with mold resin has become thinner, while the resin mold area (work size) tends to expand. Further, from the viewpoint of increasing the speed of a semiconductor device, flip chip connection products in which a semiconductor chip (hereinafter abbreviated as a chip) is connected to a substrate by bumps without using wires are becoming more popular. Therefore, it is necessary to underfill mold the narrow gap between the chip and the substrate. There is also a need to expose the surface of the chip and mold it with resin because it is necessary to radiate the heat generated by the chip. As an example, a heat dissipation effect can be obtained by bonding a heat dissipation plate to the exposed surface. Further, in order to reduce the manufacturing cost, from a strip substrate type with a work size of 100×300 mm or less, an example in which a chip is connected to a substrate on which a wiring pattern is formed on a larger semiconductor wafer-shaped work Etc. Since there are many semiconductor manufacturing methods, thermoplastic tape is attached to a semiconductor wafer-shaped circular carrier, chips are further attached onto the tape, and the carrier and tape are peeled off after molding. There is also a so-called eWLB (embedded Wafer Level Ball Grid Array) which connects a rewiring layer to the terminal side of the chip later. In this case, in order to enhance the heat dissipation effect, there is a demand for exposing the back side of the chip for molding. That is, it is required to perform resin molding in which a chip is exposed with a work having the same circular carrier as a semiconductor wafer. In the future, due to further cost reduction requirements, it is expected that there will be a demand for chip exposure molding with a larger rectangular work that is larger than a circular work.

A so-called transfer molding device or compression molding device has been developed and put into practical use as a device that satisfies either one of the molding methods as shown in FIG. 20 (see Patent Document 1). A work supply unit 52, a resin supply unit 53, a press unit 54, a work storage unit 55, and the like are arranged so as to surround the movement range of the articulated robot 51 that carries the work. A compression molding device is provided in each of the plurality of press parts 54.
Further, the applicant has developed a compression molding apparatus for compression molding a wafer-shaped work and has disclosed JP-A-2012-114285 (see Patent Document 1) and JP-A-2014-222711 in which substrate type transfer molding and compression molding are integrated. Has been proposed (see Patent Document 2). However, there is no development record of an apparatus that integrates the compression molding and the transfer transfer molding of a wafer type work.

JP, 2012-114285, A JP, 2014-222711, A

If a new apparatus for transfer molding a wafer type work is developed, it will take time and cost. Also, in order to eliminate the heat capacity of the work, we would like to change to a chip-exposed wafer type product, but it is not realistic to put the compression molding device that is already in operation to sleep or to discard it, so the existing device is effective. There is a need to use and reuse.
Also, by using a wafer-type compression molding device and a transfer molding device together, it is possible to standardize the configuration of each component, such as the transfer of semiconductor wafers and resin materials, in units of units, reducing manufacturing costs and production time. It is expected to be shortened.
Further, since the wafer type compression molding apparatus is unitized, the compression molding press apparatus and the transfer molding press apparatus can be assembled in one unit. Therefore, two kinds of products can be selected by one device, which has an advantage that the clean room of the semiconductor manufacturing factory can be effectively used.

DISCLOSURE OF THE INVENTION The disclosures applied to some embodiments described below are made to solve the above problems, and an object thereof is to reduce the manufacturing cost by sharing the configuration of each component and each unit. We provide resin transfer devices and work transfer devices that can shorten the production time. By using these, you can meet a variety of product needs by using a transfer molding device and a compression molding device together without making major changes to the device. It is to provide a possible resin molding device.

The disclosure regarding some embodiments described below includes at least the following configurations.
That is, a work accommodating portion for accommodating a pre-molding work and a post-molding work, respectively, a cavity is formed in either the upper mold or the lower mold, the pre-molding resin is supplied to the lower mold, and the post-molding work and unnecessary resin are A plurality of press parts to be molded, a resin supply part that supplies the pre-molding resin, a resin processing part having a resin recovery part that recovers the unnecessary resin, and at least a pre-molding work is carried into the press part, and at least The present invention is characterized by further comprising: a transfer hand unit that carries out the post-forming work from the pressing unit, and an articulated robot that delivers the pre-forming work to the transfer hand unit and receives the post-forming work from the transfer hand unit.

According to the above configuration, even if the transfer molding device and the compression molding device are used together for the plurality of press parts, the work accommodating part, the resin processing part, and the transfer hand part can be shared, so that the device is not significantly modified. It is possible to provide a resin molding device that can meet various product needs. If necessary, the same product may be molded by repeating transfer molding and compression molding a plurality of times.
In particular, in the press part, the pre-molding resin was supplied into the lower mold pot without using a dedicated machine, and the pre-molding resin was pressure-fed into the cavity by transfer molding to mold it or was supplied into the lower mold cavity. Since any device can be selected and used when the pre-molding resin is fluidized by compression molding and overflowed to be molded, the versatility is high and the manufacturing cost can be reduced. Further, it can be applied to various works such as a semiconductor wafer, a panel-shaped substrate, and a rectangular substrate.

It is preferable that the carrying hand section carries in the pre-molding work and the pre-molding resin into the pressing section, and carries out the post-molding work and the unnecessary resin from the pressing section.
As a result, the pre-molding work is carried in and the post-molding work is carried out by the common carrying hand section regardless of the molding method, so that the apparatus configuration can be simplified and versatility can be enhanced.

The transfer hand part carries a pre-molding work into the press part, and a work loader for accommodating the post-molding work from the press part into the work accommodating part, and a pre-molding resin into the press part, and after molding. A resin loader for discharging the unnecessary resin from the press section may be provided.
In this case, when the work accommodating portion and the resin processing portion are separately arranged through the plurality of press portions, the work before and after molding is conveyed to the loader, and the resin before molding and the unnecessary resin after molding are conveyed to the unloader. As described above, the work and the resin supply/removal operation can be performed quickly. In particular, since the work accommodating portion and the resin processing portion are spaced from each other via the plurality of pressing portions, the influence of resin dust on the molding can be minimized.

It is preferable that the resin processing unit is provided with a resin transport tray that aligns and transports the pre-molding resin to be delivered to the transport hand unit, and an unnecessary resin recovery unit that recovers unnecessary resin.
As a result, the resin processing unit is provided with the resin carrying tray and the unnecessary resin storage unit, so that the supply of the pre-molding resin and the recovery of the unnecessary resin generated after the molding are made common regardless of the molding method, thus simplifying the apparatus configuration. It is possible to increase the versatility.

It is desirable that the resin transfer tray and the unnecessary resin recovery part reciprocate between a resin supply position by the resin processing part and a standby position of the transfer hand part that moves back and forth to the press part. As a result, the work supply to the transfer hand part and the supply of the resin before molding are transferred at the standby position of the transfer hand part, and the unnecessary resin can be quickly transferred from the transfer hand part after resin molding to the unnecessary resin recovery part. it can.

The unnecessary resin collecting unit may open and close the bottom shutter at a predetermined position to discard the unnecessary resin into a waste box.
Thus, when the transfer hand unit separates and transfers the molded work and the unnecessary resin, only the unnecessary resin can be collected and discarded separately from the work.

The work storage part and the resin processing part may be arranged separately on both sides via the pressing part.
As a result, the probability that the resin dust that is likely to be generated in the resin processing unit will adhere to the work is reduced, and the molding quality can be maintained at a high level.

The press section is provided with a bridging section which is arranged so as to overlap the work end section so as to be a moving passage for air or mold resin which is continuous with the cavity recess formed in either the upper mold or the lower mold, and the mold. A movable piece that is upwardly supported so as to be separated from the clamp surface when the mold is opened is provided. The movable piece is separated from the mold clamp surface in the mold open state and is held by the transfer hand section. The work holding portion is moved to the set position where the work end portion overlaps with the bridging portion, the work is delivered, and the movable piece is pushed down by the mold closing operation, and the work end portion is sandwiched by the bridging portion. It may be clamped.
As a result, the work held by the transfer hand unit is horizontally moved to the set position where the work is separated from the mold clamping surface and overlaps with the bridge of the movable piece, and the work is delivered. Even a shaped work can be positioned by the work holding part and transferred to the molding die.
Further, since the movable piece is pushed down by the mold closing operation and the work end portion is sandwiched and clamped by the bridging portion, it is possible to prevent the mold resin from wrapping around the work end surface.

The movable piece may be any one of a pot piece, a runner gate piece, and an air vent piece formed so that the bridge portion is connected to the cavity recess.
As a result, regardless of whether the molding die is for transfer molding or compression molding, accurate positioning is performed with respect to the molding die regardless of the work shape, and resin leakage does not occur at the end of the work. ..

A resin molding device comprising a work transfer device for transferring a work and a resin to a press part, wherein a transfer device main body is positioned with respect to the mold by a positioning part provided on a mold clamping surface of the mold. It is characterized in that it is provided with a work holding part which is provided in the carrying device main body and holds a work before and after molding, and a resin holding part capable of holding the pre-molding resin supplied to the molding die.
With this, by the work holding unit and the resin holding unit provided in the transfer apparatus main body, the work before molding and the resin before molding are carried into the press unit and the work after molding is held and carried out, thereby By transferring the work and the resin to the press section using the same work transfer device, the device configuration can be simplified and versatility can be improved.

A resin molding device comprising a work transfer device for transferring a work and a resin to a press part, wherein a transfer device main body is positioned with respect to the mold by a positioning part provided on a mold clamping surface of the mold. A work holding unit provided in the main body of the transfer device for holding a work before and after molding, and a resin holding unit capable of respectively holding a pre-molding resin supplied to the molding die and an unnecessary resin after molding. The resin holding part is provided so as to be movable in the horizontal direction with respect to the transfer device main body positioned on the mold clamping surface.
As a result, by using the same work transfer device for both work transfer before and after molding and resin transfer, the installation area can be reduced and the device configuration can be made compact.

The resin holding part includes a first resin holding part that holds the pre-molding resin supplied to the press part and a second resin holding part that holds the unnecessary resin after molding, and is a carry-in/carry-out position of the carrying device main body. May be provided so as to be movable alternately.
In this case, the first resin holding part is moved to the carry-in/carry-out position in accordance with the carry-in of the work before molding to the press part, the mold carry-in operation of the resin before molding is executed, and the work-carry-out operation after molding is carried out. By moving the second resin holding portion to the carry-in/carry-out position and carrying out the carry-out operation of the unnecessary resin after molding, the work carrying device can be commonly used for carrying the resin before and after molding.

At least one lower pot-type transfer molding device may be assembled to the pressing unit.
As a result, it is possible to provide a resin molding device capable of meeting various product needs by using the transfer molding device and the compression molding device together in the press section.

What is claimed is: 1. A resin molding device comprising a resin processing unit having a resin supply unit for supplying pre-molding resin and a resin recovery unit for recovering unnecessary resin after molding, wherein the resin supply unit accommodates a plurality of pre-molding resins. A sub-tank and a parts feeder for feeding out a plurality of pre-molding resins supplied from the sub-tank in an aligned manner are provided, and a receiving plate for holding resin dust to the bottom and a plurality of pre-molding resins are supported on the bottom of the sub-tank. When the punching metals are stacked and the sub-tank is assembled on the parts feeder, the receiving plate is connected to the actuator, and by operating the actuator at a predetermined timing, the receiving plate and the punching metal are removed from the tank main body. The pre-molding resin is supplied to the parts feeder by being pulled out to open and close the bottom part of the sub tank.
As a result, the dust such as resin powder generated in the sub-tank containing the plurality of pre-molded resins is collected by the receiving plate through the through hole of the punching metal, so that the dust carried into the press section can be reduced. it can. Therefore, even if the resin supply device is arranged in the clean room, a clean use environment can be maintained.

It is possible to provide a resin transporting device and a work transporting device that can reduce the manufacturing cost and the production time by sharing the configuration of each component and each unit.
Further, by using these, it is possible to provide a resin molding apparatus that can meet a variety of product needs by using a transfer molding apparatus and a compression molding apparatus together without making a great change in the apparatus.

It is a plane layout drawing of a resin molding device. It is a front view of the resin processing part of FIG. It is a left side view of the resin processing part of FIG. 4A is a plan view of a sub-tank provided in the resin processing section of FIG. 1, FIG. 4B is a vertical sectional view of FIG. 4A, FIG. 4C is a right side view of FIG. 4A, and FIG. 4D is a state in which the bottom plate of FIG. 4B is open. It is a vertical sectional view. FIG. 5A is a plan view of the transport hand unit during the carry-in operation, and FIG. 5B is a plan view of the transport hand unit during the carry-out operation. 6A and 6B are cross-sectional explanatory views centering on the molding die of the transfer molding apparatus. 7A and 7B are a plan view and a cross-sectional view for explaining the reason why the work width adjustment is performed by the transport hand unit. 8A is a plan view of the upper mold, and FIG. 8B is a plan view of the lower mold. It is explanatory drawing which shows pot arrangement. 10A is a cross-sectional explanatory view of a resin molding device using a runner gate as a movable piece, and FIG. 10B is a cross-sectional explanatory view of a resin molding device using an air vent and a runner gate as a movable piece. It is sectional drawing of the resin molding apparatus for compression molding which used the air vent as the movable piece. FIG. 8 is a plan layout view of a resin molding device showing a modification example of FIG. 1. FIG. 6 is a plan layout view of a resin molding device according to another embodiment 1. FIG. 9 is a plan layout view of a resin molding device according to another embodiment 2. FIG. 15 is a plan layout diagram of a resin molding device according to a modification of FIG. 14. FIG. 8 is a plan layout view of a resin molding device according to another embodiment 3. FIG. 11 is a plan layout view of a resin molding device according to another Embodiment 4. FIG. 11 is a plan layout view of a resin molding device according to another Embodiment 5. FIG. 19A is a side view showing an example of an articulated robot, and FIG. 19B is an explanatory diagram of a robot hand. It is a plane layout view of a dedicated machine for compression molding apparatus.

Hereinafter, preferred embodiments of a resin supply device, a work transfer device, and a resin molding device including the same according to the present invention will be described in detail with reference to the accompanying drawings. The term “molding die” refers to the upper die and the lower die supported by the mold base, and excludes the die opening/closing mechanism (press device). Further, when referring to a resin molding device, a device including at least a molding die and a mold opening/closing mechanism (for example, a pressing device such as an electric motor and a screw shaft or a toggle link mechanism; not shown) for opening and closing the molding die, For automation, the device is provided with a resin transfer device or a work transfer device, and a work transfer device after molding. In the case of transfer molding, a transfer mechanism that operates a plunger inserted in the pot, and a decompression mechanism that forms a decompression space in the mold when the mold is closed are provided. Hereinafter, the structure of the molding die will be mainly described. Further, the work W is supposed to be resin-molded in a semiconductor wafer-shaped circular shape on which chips are mounted, but the shape is not particularly limited to a circular shape and may be a quadrangle or a rectangle. As for the molding die, the lower mold is described as an example in which the lower mold is movable and the upper mold is fixed, but the upper mold may be movable and the lower mold may be fixed, or both may be movable.

(Overall structure of resin molding device)
FIG. 1 is a plan layout view showing an embodiment of a resin molding device according to the present invention. The resin molding apparatus according to the present embodiment includes a work storage portion A that stores each of the pre-molding work W1 and the post-molding work W2, a resin supply portion B1 (resin supply device) that supplies the pre-molding resin R1, and is unnecessary after molding. A resin processing section B having a resin recovery section B2 for recovering the resin R2, a cavity is formed in either the upper mold or the lower mold, the pre-molding resin R1 is supplied to the lower mold, and the post-molding work W2 and unnecessary resin R2 are provided. And a press part C for molding, a work before molding and a resin before molding are carried into the press part C, at least a work W1 before molding is carried into the press part C, and at least a work W2 after molding is carried out from the press part C. A hand part D (work transfer device) and an articulated robot E that delivers a pre-forming work to the transfer hand part D and receives the post-forming work from the transfer hand part D are provided.

A processing unit such as an appearance inspection unit (cooling unit) F and a curing furnace G may be provided around the articulated robot E for performing each processing step. Further, a control unit H that controls the operation of these processing units is arranged. In this way, when each processing unit is arranged so as to surround the moving range of the multi-joint robot E, the moving distance is shortened, and the work and resin can be efficiently conveyed between the steps before and after the forming. The configuration of each unit will be specifically described below.

(Work storage part A)
In FIG. 1, as the work W, one in which semiconductor chips are arranged in a matrix on a semiconductor wafer is used. The work storage portion A is provided with a plurality of supply magazines 1a for supplying the pre-forming work W1 and a plurality of storage magazines 1b for storing the post-forming work W2. The work W may be a work W for E-WLP (eWLB) in which a semiconductor chip is held on a carrier plate. Further, the work W may be a resin substrate on which a semiconductor chip is mounted or a lead frame.
Further, the supply magazines 1a provided in two rows may store the works W of the same type or may store the works W of different types. The same applies to the storage magazine 1b. Further, the supply magazine 1a and the storage magazine 1b may be provided in each row, or each may be provided in three or more rows.

The transfer area where the articulated robot E moves and the work accommodating section A are blocked by the partition wall 1c. This is because the work W is stored in an environment that is not affected by dust or heat. The supply magazine 1a is supported by a known elevator mechanism so as to be able to move up and down. The elevator mechanism is configured to move up and down along a lift guide by a transfer unit (an endless transfer belt, a transfer chain, etc.) that is rotated by a drive source. Supply magazines 1a are mounted on the elevator mechanism in a two-tiered manner. Slits (concave grooves) are formed on both side walls of each supply magazine 1a so as to face each other, and a work W (semiconductor wafer) is inserted into and supported by the slits. The partition wall 1c is closed by a shutter that can be opened and closed near the elevated position of the elevator mechanism.

(Resin processing part B)
It has a resin supply section B1 for supplying pre-molding resin and a resin recovery section B2 for recovering unnecessary resin. First, the configuration of the resin supply unit B1 will be described. The resin supply part B1 supplies the pre-molding resin R1 supplied to the press part C. The sub tank 2 (storage container) stores a plurality of pre-molding resins R1 (for example, tablet resin). Below the sub tank 2, a parts feeder 3 (alignment section) is provided. The parts feeder 3 opens the bottom of the sub-tank 2 to receive a plurality of tablet resins R1 and applies vibration to align them.

As shown in FIG. 3, the tablet resins R1 arranged in a line by the parts feeder 3 are held by the opening/closing claws 4a of the tablet pickup 4 from the front side. The tablet pick-up 4 rotates 90° to make the tablet resin R1 in an upright posture, and opens the opening/closing claw 4a in the holding hole 5a of the resin carrying tray 5 which stands by below to insert the tablet resin R1 and hold it individually.
Further, in the present embodiment, the unnecessary resin recovery section 6 for recovering the unnecessary resin R2 is integrally provided side by side on the resin transport tray 5. As shown in FIG. 2, in the unnecessary resin recovery unit 6, the bottom shutter 6a is opened and closed at a predetermined position (near the resin supply position), and the unnecessary resin R2 is discarded through the chute 6b into the discard box 6c.

The resin transfer tray 5 and the unnecessary resin recovery unit 6 are provided so as to be capable of reciprocating along the resin transfer rail 7 provided below between the resin supply position 7a and the standby position 7b of the transfer hand unit D shown in FIG. ing. When the resin carrying tray 5 moves to the standby position 7b on the resin carrying rail 7, the pushing rod 5c provided in the tablet pushing mechanism 5b pushes up the tablet resin R1 from the bottom side of the holding hole 5a, and waits upward. It is delivered to the resin holding portion 12 (first resin holding portion 12a) of the carrying hand portion D to be carried.
The pre-forming work W1 is transferred from a robot hand E1 of the articulated robot E onto a lifter (elevation platform) not shown. The pre-forming work W1 supported by the lifter is held by the work holding portion 11 (chuck claw 11a) of the transfer hand portion D.

Here, an example of the sub tank 2 will be described with reference to FIG. As shown in FIGS. 4A to 4C, the tank body 2a, which is a rectangular container, and the lid 2b that closes the upper opening are formed. A handle 2c is provided on the lid 2b. The operator can refill the tablet resin R1 as appropriate by grasping the handle 2c and opening the lid 2b. Further, at the bottom of the sub-tank 2, a tray-shaped receiving plate 2d1 and a punching metal 2d2 in which a large number of through holes are provided in a metal plate are integrally stacked at a predetermined interval in the height direction to open and close. It is possible. This has a structure in which resin dust (dust such as resin powder) during resin transportation is received by a receiving plate 2d1 arranged below the punching metal 2d2. A hook 2d3 is provided on the side surface of the receiving plate 2d1. As shown in FIG. 1, one end of the opening/closing arm 2f is connected to the rod of the opening/closing actuator 2e (for example, a direct-acting motor or cylinder capable of opening/closing control). A connecting portion 2f1 is provided at the other end of the opening/closing arm 2f. The connecting portion 2f1 of the opening/closing arm 2f is connected to the hook 2d3 of the bottom plate 2d.

When the opening/closing actuator 2e is actuated, the cylinder rod extends and the opening/closing arm 2f also moves. Therefore, the receiving plate 2d1 locked to the hook 2d3 via the connecting portion 2f1 is located outside the tank body 2a as shown in FIG. 4D. Be drawn to. At this time, the plurality of tablet resins R1 placed on the punching metal 2d2 drop onto the parts feeder 3 below the bottom opening.
As a result, dust such as resin powder generated in the sub-tank 2 that stores a plurality of pre-molded resins R1 is collected in the receiving plate 2d1 through the through hole of the punching metal 2d2, and thus the dust generated in the resin transport tray 5 Can be reduced. Therefore, even if the resin supply device is arranged in the clean room, a clean use environment can be maintained.

In this embodiment, the tablet resin is supplied as the pre-molding resin R1, but the liquid resin supply part 8 may be provided if necessary. The liquid resin supply unit 8 is provided with two systems of dispense units 8c on both sides of a revolver type syringe supply unit 8b holding a plurality of syringes 8a rotatably. The liquid resin supply unit 8 can adjust the internal temperature and humidity for cooling and dehumidifying the resin. Further, a door is provided on the side surface of the device so that an operator can replace the syringe.

(Articulated robot E)
In FIG. 1, the articulated robot E holds the work W in the robot hand E1 and rotates and linearly moves to convey between the processes. The articulated robot E is composed of, for example, a vertical articulated robot that can move up and down by a foldable vertical link E3 and a horizontal articulated robot that can rotate and move the horizontal link E2 in a horizontal plane. .. A robot hand E1 is provided at the tip of the horizontal link E2. The rotation amount of each link is detected by an encoder provided in a servo motor (not shown) and feedback control is performed.

As described above, by adopting the configuration including the articulated robot E, the operation of moving the robot hand E1 to an arbitrary position in the vertical direction by the vertical link E3 and the operation of the robot hand at an arbitrary position in the horizontal direction by the horizontal link E2. The operation of moving the hand E1 can be performed in parallel. Therefore, the work W can be linearly transported between the processing units arranged so as to surround the moving range of the articulated robot E, and the time required to transport the work W to each processing unit can be minimized. it can. The articulated robot E may be configured such that the vertical link E3 is not used and the horizontal link E2 moves up and down in the vertical direction.

FIG. 19A shows an example of the articulated robot E. The articulated robot E is composed of a vertical articulated robot that can move up and down by a plurality of foldable vertical links E3 and a horizontal articulated robot that can rotate and move a plurality of horizontal links E2 in a horizontal plane. ing. A robot hand E1 is provided at the tip of the horizontal link E2. The two horizontal links E2 and the robot hand E1 are rotatably supported about

vertical shafts

21a, 21b and 21c, respectively. The rotation amount of each link is detected by an encoder provided in a servo motor (not shown) and feedback control is performed.

As described above, by adopting the configuration including the articulated robot E, the operation of moving the robot hand E1 to an arbitrary position in the vertical direction by the vertical link E3 and the operation of the robot hand at an arbitrary position in the horizontal direction by the horizontal link E2. The operation of moving the hand E1 can be performed in parallel. Therefore, the work W can be linearly transported between the processing units arranged so as to surround the moving range of the articulated robot E, and the time required to transport the work W to each processing unit can be minimized. it can. Therefore, the work W can be quickly conveyed to the next step in which the work W and the pre-molding resin R1 are carried into the press portion C and resin-molded, which can contribute to improvement of molding quality.

Further, as shown in FIG. 19B, the robot hand E1 is capable of holding the vicinity of the outer periphery of the work W while avoiding the center of the work W by dividing the tip into a forked shape. As shown in the figure, the robot hand E1 is provided with suction holes 22a capable of sucking the outer periphery of the work W and suction paths 22b communicating with the suction holes 22a at three positions on the tip side and the root side. The robot hand 1 is adapted to place a work W and to suck and hold the back surface thereof. The robot hand E1 may be of a type in which, in addition to suction-holding the work W, mechanical chucking is performed such that the work W is sandwiched by claws. Further, the robot hand E1 may be configured to be capable of reversing the work W by rotating about a horizontal axis instead of rotating about a vertical axis.

1 and 19A, the base portion E4 of the articulated robot E is provided so as to be capable of reciprocating along a plurality of linear motion guide rails 9. For example, a ball screw is connected to a nut provided on the base portion E4, and the articulated robot E reciprocates along the linear guide rail 9 by being driven to rotate forward and backward by a servo motor (not shown). Has become.

Note that instead of the articulated robot E, a configuration using a horizontal articulated robot, a vertical articulated robot, or a robot in which other types of robots and actuators are appropriately combined may be adopted. It is also possible to provide a plurality of articulated robots according to the number of press parts C.

In FIG. 1, an information reading unit (not shown) may be provided between the work storage unit A and the transport hand unit D. The information reading section is provided with a code information reading device and an aligner. The code information reading device reads an information code (QR code (registered trademark), bar code, etc.) about the product given to the work W. Corresponding to this information code, the control unit H provides the resin supply information (resin type, resin supply amount, supply time, etc.), molding conditions (press number, press temperature, press time, molding thickness, etc.), cure information ( Molding conditions such as cure temperature, cure time, and cooling information (cooling time) are stored. Based on the molding condition information corresponding to the information code read by the code information reading device, the work W being conveyed is subjected to the processing of each step described later. The articulated robot E transfers the work W, whose forming conditions have been read, to a lifter (not shown) for transferring to the transfer hand unit D.

(Transportation hand part D)
The transport hand section D carries the pre-molding work W1 and the pre-molding resin R1 into the pressing section C, and carries out the post-molding work W2 and the unnecessary resin R2 from the pressing section C. Hereinafter, an example of the transport hand unit D will be described.

The transfer device main body 10 is provided with a work holding part 11 that holds the outer peripheral end of the work at a plurality of places and holds it, and a resin holding part 12 that can hold the pre-molding resin R1 and the post-molding unnecessary resin R2, respectively. Positioning blocks 10a are provided at a plurality of locations on the carrier body 10, and as will be described later, the positioning block (lock block) provided on the mold clamping surface of the mold is used to perform positioning with respect to the mold clamping surface. It

Further, as shown in FIG. 5A, the work holding unit 11 opens and closes the chuck claws 11a at four positions at 90 degrees along the outer circumference of the work so as to hold a circular pre-work W1 (for example, a semiconductor wafer). It is possible. The chuck claws 11a are provided at four places, but the number is not limited as long as the chuck claws 11a can be stably sandwiched and conveyed. A notch W11 for positioning is provided on the outer periphery of the pre-molding work W1. In the work holding portion 11, a positioning pin 11b is engaged with the notch portion W11 to prevent the work W from rotating and positioning and holding the work W.

Further, the work holding unit 11 is provided so as to be movable in at least one of the X direction and the Y direction orthogonal to each other with respect to the transport apparatus main body 10. In the present embodiment, the work holding unit 11 is a loading/unloading position (see FIG. 5A) and a delivery position (see FIG. 5B) along the longitudinal direction of the transfer device body 10 by a linear motion mechanism including an air cylinder and a linear motion guide mechanism. It is provided so that it can reciprocate between and. The delivery position is a position where the work center of the transfer device main body 10 and the work center of the lower mold overlap. The carry-in/carry-out position is a position offset from the transfer position to a position where the work end does not hit the bridge portion 16e1 of the pot piece 16e described later when the work W moves up and down as described later. In the present embodiment, a mechanism for moving the work between the carry-in/carry-out position and the delivery position is provided in the carrier device main body 10. However, a known method of moving the work with a die (for example, Japanese Patent Laid-Open No. 2015-051557) is used. When used, the transfer device body 10 does not require a work moving mechanism.
Further, a cleaning brush 10b is provided on the leading side of the carrying device body 10 in the mold entry direction. When the cleaning brush 10b is operated, the mold surface can be cleaned when the transport hand part D moves back and forth in the mold. The cleaning brush has a function of sucking unnecessary resin and the like scraped off by the suction duct.

According to the above configuration, the transport hand unit D holding the pre-molding work W1 and the pre-molding resin R1 positions the transport device body 10 by the positioning unit provided on the mold clamping surface of the molding die, and the work holding unit. By moving 11 in at least one of the XY directions (horizontal direction), the pre-molding work W1 and the pre-molding resin R1 are aligned and supplied to the molding die by the work carrying-in operation of the transfer hand unit D. You can

In FIGS. 5A and 5B, the carrier body 10 is provided with a resin holder 12 along with the workpiece holder 11. The resin holding portion 12 includes a first resin holding portion 12a that holds the pre-molding resin R1 supplied to the molding die and a second resin holding portion 12b that holds the post-molding unnecessary resin R2. It is provided so as to be alternately movable to the carry-in/carry-out position (pot hole 16e2). In this embodiment, the first resin holding portion 12a is provided with a cylindrical storage portion 12a1 for holding a solid resin (tablet resin) and a shutter 12a2 for opening and closing the bottom portion thereof. Further, the second resin holding portion 12b is provided with a suction pad 12b1. The suction pad 12b1 is sucked with air by a suction device (not shown) to suck and hold the unnecessary resin R2 after resin molding. The unnecessary resin R2 may be sucked by the suction pad 12b1, but may be gripped by the chucking claw mechanism.

The first resin holding portion 12a and the second resin holding portion 12b are in a direction orthogonal to a direction in which the carrier body 10 is loaded/unloaded (a pot-corresponding position) with respect to an approach direction with respect to the mold (short direction of the carrier body 10). : Y direction). It should be noted that it may be provided so as to be movable in the longitudinal direction (X direction) of the carrier device body 10. Accordingly, during the work loading operation (see FIG. 5B), the pre-molding resin R1 (tablet resin) is loaded into the mold by the first resin holding portion 12a, and during the work unloading operation (see FIG. 5A). The unloading operation of the unnecessary resin R2 (molded product cull) from the mold by the second resin holding portion 12b can be switched and performed.

According to the above configuration, the work holding unit 11 can hold the work W before and after molding, and the resin holding unit 12 includes the first resin holding unit 12a that holds the pre-molding resin R1 supplied to the molding die. Since the second resin holding portion 12b for holding the unnecessary resin R2 (molded product cull) after molding and the carrying-in/carrying-out position (pot hole 16e2: see FIG. 6A) of the carrying device body 10 are alternately provided. The work and the resin before and after molding can be carried in and out by the same work carrier.

The first resin holding portion 12a may hold a pre-molding resin R1 selected from powdery resin, granular resin, and liquid resin in addition to the solid resin. Accordingly, the resin can be carried in and out together with the work W by the common carrying hand section D regardless of which form the resin is used. In the case of liquid resin, it may be a syringe.

(Press section C)
Next, the configuration of the press section C will be described with reference to FIGS. 6 to 11.
In the press section C, a cavity is formed in either the upper mold or the lower mold, the pre-molding resin R1 is supplied to the lower mold, and the post-molding work W2 and the unnecessary resin R2 are molded. Hereinafter, as an example, a case where an upper mold cavity, a lower mold pot type transfer molding device, and a lower mold cavity type compression molding device are assembled side by side in the press section C will be described.

The configuration of the upper mold cavity and lower mold pot type transfer molding device 13 provided in the press section C will be described with reference to FIGS. 6A and 6B. The mold opening/closing mechanism is omitted, and the structure of the molding die 14 will be mainly described. The molding die 14 clamps the pre-molding work W1 and the pre-molding resin R1 carried in from the above-mentioned transfer hand section D by the upper mold 15 and the lower mold 16 to perform transfer molding, and the post-molding work W2 after molding and The unnecessary resin R2 is carried out by the carrying hand section D.

First, the configuration of the upper mold 15 will be described. In FIG. 6A, the upper mold base 15a has an upper mold block 15b suspended and supported in an annular shape along the outer peripheral edge of the upper mold base 15a. An upper die lock block 15c for positioning with the lower die 16 is provided on the lower end surface of the upper die block 15b so as to project therefrom. As shown in FIG. 8A, upper die lock blocks 15c (convex blocks) are arranged on the two pairs of opposing sides of the upper die block 15b on the center line passing through the center of the work W. The lock block does not necessarily have to be arranged on the center line passing through the center of the work W, but may be provided on at least each side.
In the upper mold space surrounded by the upper mold block 15b, a rectangular upper mold clamper 15d and a circular upper mold cavity piece 15e are suspended and supported by the upper mold base 15a via coil springs 15f. (See FIGS. 6A and 8A). An upper die cavity recess 15n is formed by the upper die cavity piece 15e (cavity bottom portion) and the upper die clamper 15d (cavity side portion) surrounding the upper die cavity piece 15e.

An upper die cull 15g and an upper die runner gate 15h connected to this are engraved on the clamp surface (lower end surface) of the upper die clamper 15d so as to be connected to the upper die cavity recess 15n. Further, a plurality of upper mold air vent grooves 15i connected to the upper mold cavity recess 15n are engraved on the opposite side of the work from the upper mold runner gate 15h through the upper mold cavity recess 15n of the upper mold clamper 15d. A shutoff pin 15j is openably and closably attached to each upper die air vent groove 15i. The shut-off pin 15j is assembled in the upper mold base 15a in a state of being urged downward via a coil spring 15k. As a result, the tip (lower end surface) of the shutoff pin 15j is supported at a position substantially flush with the groove bottom portion of the upper die air vent groove 15i.

Also, the release film 17 is suction-held and covered by a suction hole (not shown) on the upper mold clamping surface including the upper mold cavity concave portion 15n and the resin path connected thereto. This is because when the surface of the semiconductor chip T mounted on the work W is exposed and molded, it is necessary to cover the surface with the release film 17 suction-held in the upper mold cavity recess 15n. The release film 17 may be either a long film continuous in a long shape between reels or a sheet film cut according to the size of the upper mold clamping surface. The release film 17 has a heat resistance of about 50 μm, is easily peeled from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP film, A single-layer or multi-layer film containing fluorine-impregnated glass cloth, polypropylene film, polyvinylidene chloride as a main component is preferably used.

Next, the structure of the lower mold 16 will be described.
The lower mold base (not shown in FIG. 6A) has a lower mold block 16a annularly supported along the outer peripheral edge thereof. A lower die lock block 16b (two pairs of rectangular parallelepiped blocks or one concave die block) for positioning with the upper die 15 is provided on the upper end surface of the lower die block 16a. As shown in FIG. 8B, recesses 16c of the lower die lock block 16b are arranged on opposite sides of the lower die block 16a on the center line passing through the center of the work W. The lock block does not necessarily have to be arranged on the center line passing through the center of the work W, but may be provided on at least each side. If the upper die lock block 15c and the lower die lock block 16b are engaged with each other as a set, the It can be placed anywhere. Therefore, the upper die lock block 15c is engaged with the recess 16c of the lower die lock block 16b, and the upper die 15 and the lower die 16 are aligned and clamped.

A sealing material 16d is annularly fitted on the clamp surface of the lower mold block 16a. The lower mold block 16a contacts the clamping surface of the opposing upper mold block 15b to seal the space inside the mold. On the lower die block 16a, a pot piece 16e (movable piece) is urged upward by a coil spring 16s with respect to the lower die base when the die is open, and is floatingly supported. An upper end of the pot piece 16e is composed of a flat mold parting surface and a bridge portion 16e1 and a pot hole 16e2 is formed substantially in the center. The pot hole 16e2 has a cylindrical shape into which the pre-molding resin R1 (for example, tablet resin) is loaded, and the plunger 16f is vertically movable in the pot hole 16e2. The pot hole 16e2 is not limited to one place, and a plurality of pot holes 16e2 may be arranged as shown in FIG. 9, for example.

Also, a circular work support block 16g is supported and fixed to the lower mold base in the mold space surrounded by the lower mold block 16a. The upper end surface of the work support block 16g is supported so that its height is lower than that of the surrounding lower die block 16a by a height corresponding to the plate thickness of the work W. As a result, the work W is placed in the set recess 16h formed by the work support block 16g and the lower die block 16a surrounding the work support block 16g. The set concave portion 16h can also serve as positioning for mounting the work W, but by setting the positioning pin 16t (see FIG. 8B) corresponding to the V notch for positioning provided on the work W upright from the lower mold 16, The setting part does not necessarily have to be a recess.

Further, as shown in FIGS. 7A and 7B, a bridging portion 16e1 is formed at the upper end of the pot piece 16e so as to overlap the upper end of the work W placed in the set recess 16h in an overhanging manner. The bridging portion 16e1 is provided at a position facing the upper runner gate 15h, and is formed in a wedge shape so that the outer peripheral edge portion is thinner than the pot side. As a result, the pre-molding resin R1 passes through between the bridge portion 16e1 which is the upper end surface of the pot piece 16e and the upper die runner gate 15h and is filled in the upper die cavity recess 15n, and therefore passes through the end portion of the work W. No resin leakage occurs by straddling. Although the runner and the gate groove forming the upper die runner gate 15h are provided on the upper die side in this example, they may be provided on the bridge portion 16e1 side or on both sides. Since the boundary between the upper mold runner gate 15h and the upper mold cavity recess 15n is a gate, the cross-sectional shape is tapered so that a gate break described later can be easily performed.

Further, as shown in FIG. 8B, the work W (semiconductor wafer) has a large number of chips T arranged in the vicinity of a circular end portion. Since the mold area is thin and has a large area, it is necessary to secure the injection balance of the resin so that the unfilled area of the pre-molding resin R1 does not occur in the gap between the chips T in the horizontal direction or the gap below the chips T. Therefore, in consideration of the filling property of the pre-molding resin R1, it is desired to secure the runner gate width G (see FIG. 7A) on the tip end side (the gate on the connection side of the cavity and the runner) that is connected to the cavity as much as possible. It has a taper shape in which the width G is increased toward. When the pot piece 16e is overlapped on the circular work W in a plan view, the overhang amount L of the bridge portion 16e1 (the length of the overlap from the work overlapping end portion of the pot piece 16e to the work outer peripheral end portion: see FIG. 7B) is obtained. growing. Therefore, when the upper and lower molds are closed, a resin path is formed between the upper end surface of the pot piece 16e and the upper mold runner gate 15h.

Further, the bridging portion 16e1 of the pot piece 16e is separated from the lower mold clamping surface in the mold open state (see FIG. 6A), and the work end face held by the transport hand portion D is below the bridging portion 16e1 and is a set recess. After being positioned at 16h, the bridging portion 16e1 is overlapped so as to overlap the outer peripheral end of the work, and the work W is clamped in the molding die 14. In this way, the work W is positioned not only by the die structure but also by the transfer hand portion D. Since the work W is particularly circular, it is possible to move the moving piece and the like like the conventional width-shifting mechanism for a rectangular substrate. Even if an attempt is made to push the end of the work to the pot side by using, the work W is large and therefore the movement amount (overhang amount L of the cross-linking portion 16e1) is large, and the displacement and the rotation of the work W are likely to occur. is there. The lower die 16 may be provided with a positioning pin 16t corresponding to a V notch for positioning provided on the work W to perform rotation prevention and positioning (see FIG. 8B).

In FIG. 6A, the work supporting block 16g is provided with suction holes 16i for holding the work W placed in the set recess 16h at a plurality of positions. The suction holes 16i are connected to a suction device (not shown). Further, a plurality of support pins 16j that can move through the work support block 16g are provided. The support pin 16j is provided so as to be movable between a position where the tip end of the pin projects from the bottom of the set recess 16h and a position where the tip end of the pin retracts into the work support block 16g. When the work W held by the transfer hand portion D is transferred to the set recess 16h, the work W is received by the support pin 16j by protruding the pin tips of the plurality of support pins 16j from the set recess 16h. Passed. As a result, when the work W is positioned in the molding die, it is not damaged by sliding on the die surface. The support pin 16j may be omitted.

Also, a suction hole 16k is provided at a position radially inside the sealing material 16d of the lower mold block 16a and facing the upper mold overflow cavity 15r (see FIGS. 8A and 8B). The suction hole 16k is connected to a suction device (not shown). While the work W is clamped in the molding die 14, air is sucked through the suction holes 16k, so that the air remaining in the upper mold cavity concave portion 15n is discharged through the upper mold air vent groove 15i and resin-molded. To prevent the occurrence of.

According to the above configuration, when the work W held by the transfer hand section D is carried into the molding die 14, the work W is positioned in a state in which the work end surface is slid to a position overlapping with the bridging portion 16e1 of the pot piece 16e. Since it is delivered to the lower mold 16 (set recess 16h), the positioning of the work W is performed accurately with respect to the molding die 14 regardless of the shape of the work W, and resin leakage does not occur at the end of the work.

FIG. 10A is a cross-sectional explanatory view of a transfer molding apparatus including a movable lower runner gate piece 16n (movable piece) in which the pot is fixed instead of the pot piece 16e as a movable piece in another embodiment. The same members as those in the above-described embodiment are designated by the same reference numerals, and the description thereof is incorporated. Since the configurations of the transport hand unit D and the upper mold 15 are the same, the configuration of the lower mold 16 will be mainly described.
A cylindrical fixed pot 16m is assembled to the lower mold block 16a of the lower mold 16, and a plunger 16f is inserted therein. Further, a lower die runner gate piece 16n is provided between the pot 16m and the set recess 16h so as to be able to move up and down. The lower die runner gate piece 16n is connected and supported to the upper end of an elevating rod 16p penetrating the lower die block 16a. The lower die runner gate piece 16n is urged upward by a coil spring (not shown) when the die is opened.

A resin path is formed between the upper mold cull 15g and the upper mold runner gate 15h, which face each other on the upper surface of the lower mold runner gate piece 16n. In particular, the surface facing the upper runner gate 15h is formed with a bridge portion 16n1 which is arranged to overlap the upper end portion of the work W placed in the set recess 16h in an overhang shape. Both ends of the bridge portion 16n1 are formed in a wedge shape so that the outer peripheral end portion connected to the upper mold cavity recess 15n and the outer peripheral end portion connected to the pot 16m have a thinner plate thickness.

FIG. 10B is a cross-sectional explanatory view of a resin molding apparatus further including a lower die bridge air vent piece 16q which is connected to the upper die cavity recess and the upper die air vent groove as a movable piece in FIG. 10A. A cylindrical fixed pot 16m is assembled to the lower mold block 16a of the lower mold 16, and a plunger 16f is inserted therein. A lower die runner gate piece 16n is provided so as to be able to move up and down between the pot 16m of the lower die block 16a and the set recess 16h. The lower die runner gate piece 16n is connected and supported to the upper end of an elevating rod 16p penetrating the lower die block 16a. The lower die runner gate piece 16n is urged upward by a coil spring (not shown) when the die is opened.

A resin path is formed between the upper mold cull 15g and the upper mold runner gate 15h, which face each other on the upper surface of the lower mold runner gate piece 16n. In particular, a surface facing the upper runner gate 15h is formed with a bridge portion 16n1 which is arranged to overlap the upper end of the work W placed in the set recess 16h in an overhang shape. Both ends of the bridge portion 16n1 are formed in a wedge shape so that the outer peripheral end portion connected to the upper mold cavity recess 15n and the outer peripheral end portion connected to the pot 16m have a thinner plate thickness.

Further, the upper die clamper 15d is engraved with an upper die bridge air vent groove 15m that connects to the upper die cavity recess 15n and the upper die air vent groove 15i. A lower die bridge air vent piece 16q (movable piece) is provided to be movable up and down at a position facing the upper die air vent groove 15m of the lower die block 16a. The lower die bridge air vent piece 16q is connected and supported to the upper end of an elevating rod 16p that penetrates the lower die block 16a. The lower die bridge air vent piece 16q is urged upward by a coil spring or the like (not shown) when the die is opened. The upper surface of the lower die bridge air vent piece 16q forms an air vent path with the opposing upper die bridge air vent groove 15m. In particular, a bridge portion 16q1 is formed on the upper end portion of the work W placed in the set recess 16h so as to be overlapped in an overhang shape. The bridging portion 16q1 is formed in a wedge shape at both ends such that the outer peripheral end portion connected to the upper mold cavity recess 15n and the upper mold overflow cavity 15r side end portion have thinner plate thicknesses.
In this way, in the configuration in which the lower die runner gate piece 16n and the lower die bridge air vent piece 16q are arranged on both sides of the set recess 16h, the work holding portion 11 of the carrying hand portion D is arranged in the lateral direction of the carrying device body 10. The workpiece W and the set recess 16h are positioned and the workpiece W is transferred by sliding (in the direction perpendicular to the paper surface of FIG. 10B).

Next, an example of a lower mold cavity type compression molding device 18 provided in the press section C along with the transfer molding device 13 will be described. The compression molding apparatus shown in FIG. 11 has a configuration in which the configuration of the lower die 16 in the configuration of the molding die 14 of FIG. 10B is replaced with the upper die 15 and the transport hand portion D is inverted. That is, the configuration of the upper mold 15′ of FIG. 11 is the inversion of the configuration of the lower mold 16 of FIG. 10B, and the reference numeral is attached with ′. The structure of the lower mold 16' is different in that it is surrounded by the lower mold base 16a' and the lower mold block 16b'. Hereinafter, different configurations will be described.

In the lower mold 16', a lower mold block 16b' is annularly supported along the outer peripheral edge of the lower mold base 16a'. On the upper end surface of the lower mold block 16b', a lower mold lock block (not shown) for positioning with the upper mold 15' is projected.
In the lower mold space surrounded by the lower mold block 16b', an annular lower mold clamper 16d' is floatingly supported by the lower mold base 16a' via a coil spring 16f'. Further, the lower mold cavity piece 16e' is supported and fixed to the lower mold base 16a' by being surrounded by the lower mold clamper 16d'. A lower mold cavity recess 16r is formed by the lower mold cavity piece 16e' (cavity bottom portion) and the lower mold clamper 16d' (cavity side portion) surrounding the lower mold cavity piece 16e'.

The lower mold bridge air vent groove 16m' connected to the lower mold cavity recess 16r is engraved on the clamp surface (upper surface) of the lower mold clamper 16d'. A plurality of lower mold air vent grooves 16i' are further connected to the lower mold bridge air vent grooves 16m'. A shutoff pin 16j' is openably and closably attached to each lower die air vent groove 16i'. The shutoff pin 16j' is assembled in the lower mold base 16a' in a state of being urged upward through the coil spring 16k'. As a result, the tip (upper end surface) of the shut-off pin 16j' is supported at a position substantially flush with the groove bottom of the lower die air vent groove 16i'. The release film 17 is preferably suction-held on the lower mold clamping surface including the lower mold cavity recess 16r.

While the work W is held in the work holding unit 11, the transfer hand unit D enters the molding die 14 (left-right direction of the paper surface of FIG. 11) and sucks and holds it in the set recess 15h′ of the upper mold 15′. The work holding unit 11 slides in the lateral direction of the transfer device main body 10 (perpendicular to the paper surface of FIG. 11) and is superposed on the outer peripheral end of the work W so that the upper bridge air vent pieces 15q′ each overhang. And is carried in the direction perpendicular to the paper surface of FIG. The work holding unit 11 may not only hold the work W by the chuck claws 11a, but may also press the work W against the set recess 15h' to suck and hold the work W. Since a resin residue may adhere to the surface of the upper bridge air vent piece 15q' in the transfer hand section D, a cleaning mechanism is not necessary, but it is preferable.

The pre-molding resin R1 (for example, granular resin, powdery resin, liquid resin, etc.) may be supplied to the lower mold cavity recess 16r by the transfer hand portion D (resin holding portion 12) or another resin. Only the resin R1 before molding may be carried by the carrying device, or only the unnecessary resin R2 after molding may be taken out by another resin carrying device. In the compression molding, when the unnecessary resin R2 after molding is not allowed to flow into the overflow cavity, the work W and the resin are taken out integrally. Further, although the lower mold cavity compression molding mold is taken as an example, in the case of the upper mold cavity compression molding mold, even if the pre-molding resin R1 is placed on the work and is simultaneously carried into the mold by the transfer hand portion D. good. Further, it may be a mold in which the upper and lower cavity recesses are formed.

Here, an example of the molding operation of the resin molding apparatus will be described with reference to FIG. First, the sub-tank 2 is filled with the tablet resin R1 in advance. Since the sub-tank 2 is not compatible with a clean room, an operator brings the sub-tank 2 in the outer box (exterior box) with the sub-tank 2 into the resin molding device. Open the resin supply door of the resin molding device, take out the sub tank 2 from the outer box, and mount it on the parts feeder 3. At this time, when the sub tank 2 is mounted on the parts feeder 3, the hook 2d3 of the bottom plate 2d is automatically connected to the connecting portion 2f1 of the opening/closing arm 2f. As an example of an automatic connection method, when the sub tank 2 is set by sliding it laterally on the parts feeder 3, the hook 2d3 of the sub tank 2 and the connecting portion (hook) 2f1 on the opening/closing actuator 2e side are engaged with each other. When the resin supply door of the resin molding device is closed after the connection and the switch of the resin supply unit B1 is turned on, the opening/closing actuator 2e operates and the bottom plate 2d of the tank body 2a slides, so that the tablet placed on the punching metal 2d2. The resin R1 drops onto the parts feeder 3. Since the tablet resin R1 is smoothly supplied into the parts feeder 3, the bottom plate 2d is controlled to be opened/closed at a predetermined timing according to the falling state in the parts feeder 3. Since the tablet resin R1 is dropped after closing the resin supply door of the resin molding device, dust does not come out or is hard to come out of the resin molding device. After that, the parts feeder 3 vibrates the tablet resin R1 to align them in a line, and the front side tablet resin R1 is gripped by the opening/closing claws 4a of the tablet pickup 4 and rotated 90° to stand upright on the resin transport tray 5. It is inserted and held in the holding hole 5a.
When the tablet resin R1 is loaded on the resin transport tray 5, the resin transport tray 5 moves from the resin supply position 7a on the resin transport rail 7 to the standby position 7b of the transport hand unit D that waits on the front side of the press unit C. (See Figure 2).

The pre-molding work W1 is held by the robot hand E1 of the articulated robot E from the supply magazine 1a and placed on the lifter (not shown) at the standby position of the transport hand unit D on the front side of the press unit C. .. The transport hand unit D is held by the robot hand E1 of the robot E by the lifter and placed on the lifter (not shown) at the standby position of the transport hand unit D on the front side of the press unit C. The lifter supporting the pre-molding work W1 rises, and the transport hand part D at the standby position is gripped by the chuck claw 11a of the work holding part 11 from the lifter and the pre-molding work W1 is delivered.
The pre-molding resin R1 held by the resin transport tray 5 that has moved to the standby position 7b is transferred to the resin holding portion 12 (first resin holding portion 12a) by operating the tablet pushing mechanism 5b. Specifically, the push-up rod 5c pushes up the tablet resin R1 from the bottom of the holding hole 5a to store it in the cylindrical storage portion 12a1 and closes the shutter 12a2 so that the tablet resin R1 is delivered to the first resin holding portion 12a. (See FIG. 5B).

The transfer hand section D holds the pre-molding work W1 and the pre-molding resin R1 and carries them into the press section C. For example, the transfer molding apparatus 13 is opened, the pre-molding work W1 is set in the lower mold 16, and the pre-molding resin R1 is loaded into the pot hole 16e2 (see FIG. 6B). Alternatively, the pre-molding work W1 is set in the upper mold 15 by entering the mold-opened compression molding device 18, and the pre-molding resin R1 is supplied to the lower mold cavity recess 16r (see FIG. 11). When the transport hand unit D is retracted from the molding die 14, the mold is closed and transfer molding or compression molding is performed.

When the mold die 14 is opened after resin molding, for example, in the transfer molding apparatus 13, the pot piece 16e is separated from the lower die block 16a by the bias of the coil spring 16s (see FIG. 8B). Moving. The pot piece 16e is not limited to the coil spring 16s and may be moved upward by a cylinder or a motor that can be separately driven. The work W remains adsorbed and held in the set recess 16h. As a result, the unnecessary resin R2 (molded product Cull) on the pot piece 16e is gate-breaked and separated from the molded product (workpiece W2 after molding) and rises. Since the release film 17 is adsorbed and held on the clamp surface of the upper mold 15, it is easily separated from the resin. The gate break when the lower die runner gate piece 16n and the lower die bridge air vent piece 16q are provided is similarly performed.

The transfer hand part D enters the mold die 14 where the mold is opened, the work holding part 11 holds the work W2 after molding, and the second resin holding part 12b sucks and holds the unnecessary resin R2 (molded product cull). Then, it is carried out from the molding die 14. It should be noted that when the transport hand portion D enters the molding die 14, the position of the second resin holding portion 12b is assumed to be switched from the state of FIG. 5B to the state of FIG. 5A.

When the transport hand section D returns to the standby position, the molded work W2 is transferred from the work holding section 11 to the lifter again, and the unnecessary resin R2 sucked and held by the second resin holding section 12b (suction pad 12b1) is sucked. Is released and dropped to the unnecessary resin collecting section 6 arranged immediately below (see FIG. 2).
The resin transport tray 5 returns along the resin transport rail 7 from the standby position 7b to the resin supply position 7a in preparation for the next resin transport. At this time, the bottom shutter 6a of the unnecessary resin recovery unit 6 is opened and the unnecessary resin R2 (molded product cull) is discarded in the discard box 6c via the chute 6b.
Further, the molded work W2 transferred to the lifter is conveyed to the work accommodating portion A while being adsorbed and held by the robot hand E1 of the articulated robot E shown in FIG. 1, and accommodated in the accommodating magazine 1b. Hereinafter, the same operation is repeated.

According to the above-mentioned configuration, even if the transfer molding device 13 and the compression molding device 18 are used together in the press part C, the work accommodating part A, the resin processing part B, the transfer hand part D, etc. can be used in common, so that the size of the device is greatly increased. It is possible to provide a resin molding device that can meet various product needs without modification. If necessary, the same product may be molded by repeating transfer molding and compression molding a plurality of times.
In particular, in the press section C, the pre-molding resin R1 is supplied into the lower mold pot without using a dedicated machine, and the pre-molding resin R1 is pressure-fed into the cavity by transfer molding to mold, or the lower mold cavity recess 16r. Since any device can be selected and used when the pre-molding resin R1 supplied therein is fluidized by compression molding and overflowed to mold, the versatility is high and the manufacturing cost can be reduced. The work W can correspond to various works such as a semiconductor wafer and a rectangular substrate.

(Modification)
In the above-described embodiment, the case where one pot is provided in the lower mold 16 in the transfer molding apparatus 13 has been described, but a plurality of pots (for example, a plurality of rows and a plurality of columns) may be provided as shown in FIG.
Further, in the press section C, the case where the transfer molding device 13 and the compression molding device 18 are used together is illustrated, but as shown in FIG. 12, a plurality of units may be the transfer molding device 13 or the compression molding device 18.

(Other Example 1)
Although the above-described transport hand unit D only reciprocates in the front-rear direction with respect to the press unit C, a configuration that reciprocates in the left-right direction may be added. In the following, the same members as those in the above-described embodiment will be denoted by the same reference numerals, and the description will be cited, and different configurations will be mainly described.
In FIG. 13, the supply magazine 1a containing the pre-molding work W1 and the storage magazine 1b containing the post-molding work W2 are arranged on both sides via the plurality of press parts C. Further, the resin processing section B is provided on the supply magazine 1a side, and a supply side articulated robot E (the robot hand E1 and the base section E4 are shown) and a storage side articulated robot E are provided respectively. The transport hand section D carries in the pre-molding work W1 and the pre-molding resin R1 into the molding die 14 provided in the pressing section C, and carries out the post-molding work W2 and the unnecessary resin R2 from the molding die 14. It has become. In the transfer hand section D, the linear guide rails 19 can be separated and connected between the units from the work supply side (supply magazine 1a and resin supply section B1) across the plurality of press sections C to the work storage side (storage magazine 1b). It has been laid. A sub tank 2, a parts feeder 3, a tablet pickup 4 (not shown), and a tablet lifting mechanism 5b are provided in the resin supply unit B1 on the lower side of the gantry (indicated by a dotted line in FIG. 13) to operate the robot hand E1. It is provided in a position where it will not be affected. When the pre-molding resin R1 is pushed up from under the gantry, the transfer hand section D stands by and is delivered, so that the resin transfer tray 5 and the unnecessary resin recovery section 6 are unnecessary. A chute 6b for discarding the unnecessary resin R2 and a discard box 6c are provided as the resin recovery section B2.

In the transfer hand part D, the pre-molding work W1 is delivered from the supply side articulated robot E to the work holding part 11 on the work supply side, and the pre-molding resin R1 (tablet resin) is received by the tablet pick-up 4 to the resin holding part 12. It is supposed to be handed over. The transport hand part D holds the pre-molding work W1 and the pre-molding resin R1 and moves to the predetermined press part C (for example, the transfer molding device 13) in the left-right direction along the linear guide rail 19. Then, the transport hand portion D moves in the front-rear direction and enters the mold die 14 that has opened the mold to carry in the pre-molding work W1 and the pre-molding resin R1.

After the molding, the work W2 and the unnecessary resin R2 are subjected to the gate break at the same time when the mold 14 is opened. Then, the transport hand portion D enters the molding die 14 to hold the work W2 after molding and the unnecessary resin R2. The transfer hand unit D moves to the work storage side along the linear guide rail 19 and transfers the post-forming work W2 to the storage side articulated robot E. After that, the unnecessary resin R2 may be moved to the work supply side along the linear guide rail 19 while holding the unnecessary resin R2, and the adsorption of the unnecessary resin R2 may be released immediately above the chute 6b to be discarded in the discard box 6c.
As a result, the pre-molding work W1 and the pre-molding resin R1 can be carried in and the post-molding work W2 and the unnecessary resin R2 can be carried out by the common carrying hand section D regardless of the transfer or compression molding method. Versatility can be improved.

(Other Example 2)
As shown in FIG. 14, the transfer hand section D includes a loader D1 that carries in the pre-molding work W1 and the pre-molding resin R1 into the press section C, and an unloader that carries out the post-molding work W2 and unnecessary resin R2 from the press section C. D2 may be provided. The supply magazine 1a containing the pre-molding work W1 and the storage magazine 1b containing the post-molding work W2 are arranged on both sides via the plurality of press parts C. The resin processing unit B is provided on the supply magazine 1a side, and is provided with a supply-side articulated robot E (a robot hand E1 and a base E4 are shown) and a storage-side articulated robot E, respectively.

A linear guide rail 19 is laid so as to be separable from the work supply side (supply magazine 1a and resin processing section B) across the plurality of press sections C across the work storage side (storage magazine 1b). The loader D1 carries in the pre-molding work W1 and the pre-molding resin R1 into the molding die 14 provided in the press section C, and the unloader D2 carries out the post-molding work W2 and the unnecessary resin R2 from the molding die 14. It is supposed to do.
The resin supply section B1 is provided with a sub tank 2, a parts feeder 3, a tablet pickup 4 (not shown), and a tablet lifting mechanism 5b on the underside of the gantry, but the resin transport tray 5 and the unnecessary resin recovery section 6 are It becomes unnecessary. A chute 6b for discarding the unnecessary resin R2 and a discard box 6c are provided as a resin recovery part B2 on the work storage side.

In the loader D1, the pre-molding work W1 is transferred from the supply side articulated robot E to the work holding part 11 on the work supply side, and the pre-molding resin R1 (tablet resin) is transferred to the resin holding part 12 by the tablet pickup 4. It is like this. The loader D1 holds the pre-molding work W1 and the pre-molding resin R1 and moves leftward and rightward along the linear guide rails 19 to a predetermined press part C (for example, the transfer molding device 13). Then, the transport hand portion D moves in the front-rear direction and enters the mold die 14 that has opened the mold to carry in the pre-molding work W1 and the pre-molding resin R1.

After the molding, the work W2 and the unnecessary resin R2 are subjected to the gate break at the same time when the mold 14 is opened. Then, the unloader D2 enters the molding die 14 and holds the work W2 after molding and the unnecessary resin R2. The unloader D2 moves to the work storage side along the linear guide rail 19 and transfers the molded work W2 to the storage side articulated robot E. After that, the unnecessary resin R2 may be moved to the work storage side along the linear guide rail 19 while holding the unnecessary resin R2, and the adsorption of the unnecessary resin R2 may be released immediately above the chute 6b to be discarded in the discard box 6c.
In this case, since the transfer hand unit D is divided into the loader D1 and the unloader D2, the productivity is improved.

In the above-described embodiment, the gate break is performed in the molding die 14 at the timing of opening the molding die 14 after molding. However, the one in which the post-molding work W2 and the unnecessary resin R2 are integrated is used. The gate may be carried out from the mold 14 and outside the mold. For example, in FIG. 15, a gate break unit 20 is provided on the work storage side where the storage magazine 1b is provided.
In this case, since the bridging portion straddling the work W is not required in the molding die 14, the work holding portion 11 is set when the pre-forming work W1 is set in the die and when the post-forming work W2 is taken out from the die. No need to move.

The unloader D2 conveys the work W2 after molding and the work in which the unnecessary resin R2 is integrated from the molding die 14 to the gate break unit 20, and performs a gate break to separate the work W2 after molding and the unnecessary resin R2. The molded work W2 is held by the storage-side articulated robot E from the gate break unit 20 and stored in the storage magazine 1b. Further, the unnecessary resin R2 may be collected in the unnecessary resin collecting section provided directly below the gate break section 20.
In this case, since it is not necessary to use the movable piece (pot piece 16e, lower die runner gate piece 16n, lower die bridge air vent piece 16q, etc.) to provide the bridging portion, the mold structure can be simplified.

(Other Example 3)
As shown in FIG. 16, the transfer hand section D includes a loader D1 that carries the pre-molding work W1 and the pre-molding resin R1 into the press section C, and an unloader that carries out the post-molding work W2 and the unnecessary resin R2 from the press section C. The point of having D2 is the same as that of FIG. The supply magazine 1a containing the pre-molding work W1 and the storage magazine 1b containing the post-molding work W2 are arranged on both sides via the plurality of press parts C. Further, of the resin processing section B, the resin supply section B1 (sub-tank 2, parts feeder 3, tablet pickup 4) is provided under the platform on the side of the supply magazine 1a, and the resin recovery section B2 (chute 6b, waste box 6c) is stored. It is provided on the magazine 1b side. Further, a supply side articulated robot E (a robot hand E1 and a base portion E4 are shown) and a storage side articulated robot E are respectively provided. Although not shown, the tablet pushing-up mechanism 5b is arranged on the front side of each press section C.

A linear guide rail 19 is laid so as to be separable from the work supply side (supply magazine 1a and resin supply section B1) across the work storage side (storage magazine 1b and resin recovery section B2) with a plurality of press sections C sandwiched therebetween. Further, a resin transfer rail 7 that movably supports the resin transfer tray 5 and the unnecessary resin recovery unit 6 is also laid so that the units can be separated and connected from the work supply side to the work storage side across the plurality of press parts C. ..

The loader D1 carries in the pre-molding work W1 and the pre-molding resin R1 into the molding die 14 provided in the press section C, and the unloader D2 carries out the post-molding work W2 and the unnecessary resin R2 from the molding die 14. It is supposed to do.
The loader D1 receives the pre-forming work W1 from the supply side articulated robot E and moves to the front side of a predetermined press section C. Further, the resin transport tray 5 holds the pre-molding resin R1 (tablet resin) by the tablet pickup 4 and moves along the resin transport rail 7 to the front side of the press section C where the loader D1 stands by. Then, the tablet lifting mechanism 5b (not shown) transfers the tablet resin R1 to the loader D1. The loader D1 holds the pre-molding work W1 and the pre-molding resin R1 and carries them into the press section C.

The unloader D2 enters the press section C after molding, receives the gate-breaked post-molding work W2 and the unnecessary resin R2, and carries them out to the front side of the press section C. The unnecessary resin R2 (molded product cull) is recovered by the unnecessary resin recovery unit 6 provided integrally with the resin transport tray 5 by releasing the suction of the unloader D2. The unloader D2 moves to the work storage side while holding only the molded work W2 and transfers the molded work W2 to the storage-side articulated robot E, and the molded work W2 is stored in the storage magazine 1b. In addition, the unnecessary resin recovery unit 6 containing the unnecessary resin R2 moves to the work storage side along the resin transport rail 7, opens the bottom shutter 6a, and discards the unnecessary resin R2 into the waste box 6c via the chute 6b. To be done. In this embodiment, the resin carrying tray 5 and the unnecessary resin collecting section 6 are integrated, but they may be separate bodies, or may be independently movable. Although the gate break of the work W2 after molding is performed inside the mold, it may be performed outside the mold.

(Other Example 4)
In this embodiment, the work accommodating portion A and the resin processing portion B are separately arranged on both sides via a plurality of pressing portions C. As shown in FIG. 17, the transfer hand section D includes a work loader D3 that transfers the pre-molding work W1 and the post-molding work W2, and a resin loader D4 that transfers the pre-molding resin R1 and the post-molding unnecessary resin R2. There is. The work storage portion A is provided with a supply magazine 1a that stores the pre-molding work W1, a storage magazine 1b that stores the post-molding work W2, and an articulated robot E that takes out the pre-molding work W1 and stores the post-molding work W2. Has been. Further, the resin processing section B is provided with a resin supply section B1 and a resin recovery section B2. That is, the sub tank 2, the parts feeder 3, the tablet pickup 4 (not shown), a resin supply unit B1 including the tablet lifting mechanism 5b, and the resin recovery unit B2 including the chute 6b and the waste box 6c are provided.

A linear guide rail 19 is laid so as to be separable from the work accommodating section A across the plurality of press sections C and across the resin processing section B. The work loader D3 receives the pre-molding work W1 from the supply magazine 1a from the articulated robot E, carries the work W1 into the mold die 14 provided in the press section C, and molds the mold die 14 opened. The rear work W2 is taken out and delivered to the multi-joint robot E, and the multi-joint robot E stores the molded work W2 in the storage magazine 1b.

The resin loader D4 receives the pre-molding resin R1 (tablet resin) from the tablet lifting mechanism 5b at the first resin holding portion 12a (see FIG. 5B) and the molding die 14 (pot, cavity concave portion) provided in the press portion C. Etc.). Further, the resin loader D4 adsorbs and holds the unnecessary resin R2 after molding from the opened mold die 14 by the second resin holding portion 12b (see FIG. 5A) and moves it to the resin recovery portion B2 to move the unnecessary resin. When the adsorption of R2 is released, it is discarded into the discard box 6c via the chute 6b.

As a result, the probability that the resin dust that is likely to be generated in the resin processing unit B will adhere to the work W that is supplied and stored from the work storage unit A is reduced, and the molding quality can be maintained at a high level.
The resin is not limited to the tablet resin and may be a granular resin or a powder resin. The release film 17 may be a long film, a single-wafer film, or may be omitted. Further, the upper mold cavity may be covered with a release film or the lower mold cavity may be covered with a release film. Further, the arrangement of the tablet pushing-up mechanism 5b, the chute 6b, and the waste box 6c does not necessarily have to be the same as the switching interval between the first resin holding portion 12a and the second resin holding portion 12b.

(Other Example 5)
FIG. 18 is similar to FIG. 17 in that the work storage portion A and the resin processing portion B are separately arranged on both sides via a plurality of press portions C, but the common transfer hand portion D is not formed before molding. The work W1 and the pre-molding resin R1 are carried into the press section C, and the post-molding work W2 and the unnecessary resin R2 after molding are carried out from the press section.

A linear guide rail 19 is laid so as to be separable from the work accommodating section A across the plurality of press sections C and across the resin processing section B. Further, a resin transport rail 7 is laid so as to be separable from the resin processing section B to the pressing section C. The resin transfer tray 5 and the unnecessary resin recovery unit 6 are provided so as to be movable on the resin transfer rail 7.

The transfer hand section D receives the pre-forming work W1 from the supply magazine 1a by the articulated robot E to the work holding section 11, moves to the front side of the predetermined press section C, and stands by. The pre-molding resin R1 (tablet resin) is held by the resin transport tray 5 and moves to the front side of the predetermined press part C. The tablet resin R1 is pushed up by the tablet pushing-up mechanism 5b (not shown) and delivered to the resin holding portion 12 (first resin holding portion 12a). The transport hand section D enters the mold die 14 that has been opened, and carries in the pre-molding work W1 and the pre-molding resin R1.

After the resin molding, when the mold die 14 is opened, the transfer hand part D enters in a state where the post-molding work W2 and the unnecessary resin R2 are in a gate break state, and the post-molding work W2 is held by the work holding part 11 and is unnecessary. The resin R2 is held by the resin holding portion 12 (second resin holding portion 12b) and carried out to the front side of the press portion C. At this time, since the unnecessary resin collecting section 6 is standing by immediately below the transport hand section D, the suction of the second resin holding section 12b is released and the unnecessary resin R2 (molded product cull) is collected. The unnecessary resin recovery unit 6 moves to the resin processing unit B along the resin transport rail 7 to open the bottom shutter 6a and discards the unnecessary resin R2 into the discard box 6c via the chute 6b. Further, the transport hand part D moves to the work storage part A while holding the post-forming work W2, transfers the post-forming work W2 to the articulated robot E, and stores it in the storage magazine 1b.
In this case, since the transfer hand section D exclusively transfers the work W and the resin is exclusively transferred by the resin transfer tray 5 and the unnecessary resin recovery section 6, the productivity is higher than that in FIG.

Although the transport hand unit D has the common configuration shown in FIGS. 5A and 5B, the work supply and storage and the resin supply and recovery may be separately provided.
Further, although the press section C is provided with a plurality of transfer molding devices 13, the transfer molding device 13 and the compression molding device 18 may be used together.

Although each of the above-described embodiments has been described using the transfer molding apparatus for the upper mold cavity lower mold pot using the wafer-shaped work W, it may be a lower mold cavity lower mold pot transfer molding apparatus. Further, the transfer molding device for the upper mold cavity and the lower mold pot may double as the upper mold cavity type compression device.
The work W may be a large-sized panel having a rectangular shape (square, rectangular, etc.) in addition to the wafer shape (circular shape).
The mold resin may be a granular resin, a powder resin, a liquid resin, etc. other than the tablet resin.
The release film may be a long film or a sheet film and is designed to cover the upper or lower clamp surface, but the films may be provided on the upper and lower sides.
In the molding die, the cavity is provided in the upper die and the work is set in the lower die, but the cavity may be provided in the lower die and the work may be set in the upper die. Moreover, a cavity may be provided in the upper mold and the lower mold.
Further, although the unnecessary resin R2 is mainly described by exemplifying a molded product cull, in the case of compression molding, a bridge runner gate formed by a movable piece provided at a position where the resin in the cavity overflows, Unwanted resin generated by a bridge air vent or the like may be used.
Further, although the gate break is performed at the timing when the mold is opened, the gate break may be performed outside the mold as shown in FIG. In this case, a normal gate engraved on the mold clamping surface may be used instead of the bridge gate using the movable piece.

Claims

A work accommodating portion for accommodating a pre-molding work and a post-molding work,
A cavity is formed in either the upper mold or the lower mold, a resin before molding is supplied to the lower mold, and a work part after molding and a press part for molding unnecessary resin,
A resin supply unit that supplies the pre-molding resin, and a resin processing unit that has a resin recovery unit that recovers the unnecessary resin,
At least a pre-molding work is carried into the press part, and at least a carrying hand part that carries out the post-molding work from the press part,
A resin molding apparatus comprising: a multi-joint robot that delivers a pre-molding work to the transfer hand unit and receives the post-molding work from the transfer hand unit.
The resin molding apparatus according to claim 1, wherein the transfer hand section carries in a pre-molding work and a pre-molding resin into the pressing section, and carries out the post-molding work and unnecessary resin from the pressing section.
The transfer hand part carries a pre-molding work into the press part, and a work loader for accommodating the post-molding work from the press part into the work accommodating part, and a pre-molding resin into the press part, and after molding. The resin molding apparatus according to claim 1, further comprising a resin loader that carries out unnecessary resin from the press section.
The resin processing section is provided with a resin transport tray for aligning and transporting the pre-molding resin to be delivered to the transport hand section, and an unnecessary resin recovery section for recovering unnecessary resin. The resin molding device according to any one of claims.
The resin molding apparatus according to claim 4, wherein the resin transport tray and the unnecessary resin recovery unit reciprocate between a resin supply position by the resin processing unit and a standby position of the transport hand unit that moves back and forth to the press unit. ..
5. The resin molding apparatus according to claim 4, wherein the unnecessary resin collecting unit opens and closes the bottom shutter at a predetermined position to discard the unnecessary resin into a waste box.
The resin molding apparatus according to any one of claims 1 to 6, wherein the work accommodating portion and the resin processing portion are separately arranged on both sides via the pressing portion.
In the press section,
A bridge portion is provided so as to be overlapped with a work end portion so as to be a moving passage of air or mold resin which is continuous with a cavity recess formed in either the upper mold or the lower mold, and a metal is attached to a mold clamping surface. Equipped with a movable piece that is supported upward so as to separate when the mold is opened,
The movable piece is separated from the mold clamp surface in the mold open state, and the work is transferred by moving the work holding part to a set position where the end of the work held by the transfer hand overlaps the bridge part. The resin molding apparatus according to any one of claims 1 to 7, wherein the movable piece is pushed down by a mold closing operation, and the work end is sandwiched and clamped by the bridging portion.
The resin molding apparatus according to claim 8, wherein the movable piece is any one of a pot piece, a runner gate piece, and an air vent piece formed so that the bridge portion is connected to the cavity recess.
A resin molding device having a work transfer device for transferring a work and a resin to a press section,
A carrier device main body that is positioned with respect to the mold by a positioning portion provided on the mold clamp surface of the mold.
A resin mold, comprising: a work holding part, which is provided in the carrier body and holds a work before and after molding; and a resin holding part capable of holding a pre-molding resin supplied to the molding die. apparatus.
A resin molding device having a work transfer device for transferring a work and a resin to a press section,
A carrier device main body that is positioned with respect to the mold by a positioning portion provided on the mold clamp surface of the mold.
A work holding portion provided in the main body of the transfer device for holding a work before and after molding, and a resin holding portion capable of respectively holding a pre-molding resin supplied to the molding die and an unnecessary resin after molding,
The resin molding device, wherein the resin holding part is provided so as to be movable in the horizontal direction with respect to the transfer device main body positioned on the mold clamping surface.
The resin holding part includes a first resin holding part that holds a pre-molding resin supplied to the press part and a second resin holding part that holds an unnecessary resin after molding to a loading/unloading position of the carrying device body. The resin molding device according to claim 11, wherein the resin molding device is provided so as to be movable alternately.
The resin molding device according to any one of claims 1 to 12, wherein at least one lower pot type transfer molding device is assembled in the pressing portion.
A resin molding device comprising a resin processing unit having a resin supply unit for supplying resin before molding and a resin recovery unit for recovering unnecessary resin after molding,
The resin supply unit includes a sub-tank that stores a plurality of pre-molding resins, and a parts feeder that aligns and sends out the plurality of pre-molding resins supplied from the sub-tank,
At the bottom of the sub-tank, a receiving plate that holds the resin dust to the bottom and a punching metal that supports a plurality of pre-molded resins are arranged above the receiving plate.
When the sub tank is assembled on the parts feeder, the receiving plate is connected to the actuator, and by operating the actuator at a predetermined timing, the receiving plate and the punching metal are pulled out of the tank body to open and close the bottom of the sub tank. By doing so, the resin before molding is supplied to the parts feeder.