CN110815707B

CN110815707B - Resin molding device and resin molding method

Info

Publication number: CN110815707B
Application number: CN201910734984.9A
Authority: CN
Inventors: 中村一雄; 西泽义晃; 北岛德幸; 伊藤幸雄
Original assignee: Apic Yamada Corp
Current assignee: Apic Yamada Corp
Priority date: 2018-08-10
Filing date: 2019-08-09
Publication date: 2024-03-26
Anticipated expiration: 2039-08-09
Also published as: JP2020026088A; JP7068094B2; KR20200018314A; CN110815707A; TW202012138A; TWI828702B

Abstract

The invention provides a workpiece conveying device, which can position and transfer a workpiece to a molding die by using a simple device structure. The workpiece conveying device (1) holding the workpiece (W) performs positioning of the conveying device main body (2) by means of a positioning part arranged on a die clamping surface of a molding die (6), and the workpiece holding part (3) moves along the horizontal direction relative to the conveying mechanism main body (2) which is in a state of holding the workpiece (W) and is positioned, so that the workpiece (W) is conveyed to the position by the workpiece holding part (3) in a state of being positioned at a position arranged on the surface of the die, and/or the formed workpiece (W) is taken out from the position by the workpiece holding part (3) and is conveyed out of the molding die.

Description

Resin molding device and resin molding method

Technical Field

The present invention relates to a workpiece carrying device for carrying in and out a workpiece before and after molding with respect to a molding die, a resin carrying device for carrying in and out a resin before and after molding with respect to a molding die, and a resin molding device having at least one of the above devices.

Background

In recent years, the thinning of workpieces has been advanced, and there is a trend in such a way that: the cavity to be filled with the molding resin becomes thin, and on the other hand, the resin molding area (workpiece size) is enlarged. Further, from the viewpoint of speeding up the semiconductor device, many such products have appeared: instead of connecting a semiconductor chip (hereinafter simply referred to as a chip) to a substrate by means of wires, the semiconductor chip is flip-chip connected to the substrate by means of terminal connection using bumps. Therefore, it is necessary to perform underfill molding for a narrow gap between the chip and the substrate. Further, since it is necessary to radiate heat emitted from the chip, there is also a need to perform resin molding with the chip surface exposed. As an example, the heat dissipation effect is obtained by bonding a heat dissipation plate to the exposed surface. Further, for the purpose of reducing the manufacturing cost, there are examples of a substrate in which a chip is connected to a larger semiconductor wafer-like work and a wiring pattern is formed, because the work is a tape-like substrate having a size of, for example, 100mm×300mm or less. In addition, there are many semiconductor manufacturing methods, and thus, there are the following methods, so-called eWLB (embedded Wafer Level Ball Grid Array), for example: a thermoplastic tape is stuck to a circular carrier in the shape of a semiconductor wafer, a chip is stuck to the tape, after molding, both the carrier and the tape are peeled off, and then a wiring layer is connected to the terminal side of the chip. In this case, in order to improve the heat dissipation effect, there is a demand for molding with the back surface side of the chip exposed. That is, resin molding is required in which the work is a carrier having the same shape as the semiconductor wafer, that is, a circular shape, and the chips are exposed. In addition, it is expected that, based on the demand for further cost reduction in the future, there is also a demand for chip exposure molding for square large-sized workpieces larger than round workpieces.

When the round work is carried into the mold and the transfer molding is performed with the outer peripheral edge portion of the work interposed therebetween, since the resin path (including the runner gate, the overflow gate, the vent portion, and the like) intersects with the end portion of the work, the mold resin is liable to leak from the end face, and in order to prevent the mold resin from winding around the end face of the work, it is necessary to align the end face of the work and the end face of the mold opposed thereto in advance, so that the possibility of occurrence of a gap is eliminated as much as possible.

However, since the workpiece is circular, it is difficult to position the workpiece as close to the die end face as possible. There is proposed a technique (patent document 1: japanese patent laid-open No. 2015-51557): an end face of a rectangular band-shaped substrate is pushed by a mold-side structure, and an end face on the opposite side of the end face is brought into contact with an end face of a housing insertion port, thereby aligning the end faces.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2015-51557

Disclosure of Invention

Problems to be solved by the invention

In the case of the die-exposed wafer type molding for flip-chip die bonding, since it is necessary to perform resin molding in a cavity region having a relatively small thickness and a relatively large area, and resin pressure cannot be increased by compression molding, transfer molding is recommended in order to perform molding with high resin pressure even in a relatively small region.

However, in the case of resin molding a workpiece of the so-called eWLB type by transfer molding, since many chips are mounted on the workpiece and near the end face of the circular cavity, it is necessary to avoid gaps and unfilled areas between the outer periphery of the workpiece and the chips and below the chips. Further, in order to maintain a good resin injection balance, it is desirable to widen the width of the gate as much as possible. However, since the work is circular, unlike a rectangular substrate having a flat end surface, the overhanging amount of the resin path formed by the accommodating unit disclosed in patent document 1 (based on the overlapping length of the accommodating unit from the work end to the cavity end) is excessively large. Further, since the workpiece is circular, even in the case where the edge aligning mechanism is provided on the die side and the end face of the workpiece is pushed by a plurality of moving means as in patent document 1, the end face is curved, and therefore, even if pushed, misalignment is likely to occur.

Solution for solving the problem

The present invention has been made in view of the above-described problems, and an object thereof is to provide a work transfer device and a resin transfer device capable of positioning and transferring a work and/or a resin to and from a molding die with a simple device configuration, and to provide a resin molding device capable of forming a flip-chip connected chip-exposed semiconductor product with high quality while avoiding the winding of the molding resin around the end face of the work regardless of the shape of the work.

The disclosure relating to the several technical aspects described below has at least the following structures.

That is, a workpiece conveying apparatus that performs at least one of an operation of conveying a workpiece into a mold and an operation of conveying a formed workpiece out of the mold, the workpiece conveying apparatus comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die holding surface of the molding die; and a workpiece holding portion provided to the conveying apparatus main body for holding the workpiece, the workpiece holding portion being provided to: the transfer device body, which has been positioned on the die holding surface, can be moved in the horizontal direction with the work held.

With the above configuration, in the workpiece conveying device in which the workpiece is held, the conveying device main body is positioned by the positioning portion provided on the mold clamping surface of the mold, and the workpiece holding portion is moved in the horizontal direction with respect to the conveying device main body in which the workpiece has been positioned, so that the workpiece can be carried into the placement position by the workpiece holding portion while being positioned at the placement position provided on the surface of the mold, and/or the formed workpiece can be taken out from the placement position by the workpiece holding portion, and the workpiece can be carried out from the mold.

A workpiece transfer apparatus for transferring a workpiece into a mold and transferring a formed workpiece out of the mold, the workpiece transfer apparatus comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die holding surface of the molding die; and a workpiece holding portion provided to the conveying apparatus main body for holding the workpiece, the workpiece holding portion being provided to: the transfer device body, which has been positioned on the die holding surface, can be moved in the horizontal direction with the work held.

With the above configuration, the work can be carried into the placement position provided on the surface of the mold by the work holding portion while being positioned at the placement position, and the formed work can be taken out from the placement position by the work holding portion and carried out from the mold.

A resin transfer device for transferring a molded resin into a mold and transferring a molded unnecessary resin out of the mold, the resin transfer device comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die holding surface of the molding die; and a resin holding portion provided in the conveying device main body and capable of holding the molding resin supplied to the molding die and the unnecessary resin after molding, the resin holding portion being provided: can move in the horizontal direction relative to the conveying device main body positioned on the mold clamping surface.

With the above configuration, the molding resin can be supplied to the placement position provided on the surface of the mold by the resin holding portion, and the unnecessary resin separated from the molded work can be removed from the molding mold by the resin holding portion.

A workpiece transfer apparatus for transferring a workpiece and a molding resin to a mold and removing a molded workpiece and a resin scrap from the mold, the workpiece transfer apparatus comprising: a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die holding surface of the molding die; a workpiece holding portion provided in the conveying device main body, for holding the workpiece; and a resin holding portion provided in the conveying device main body and capable of holding the molding resin supplied to the molding die and the unnecessary resin after molding, the resin holding portion being provided: the molding device includes a first resin holding portion for holding the molding resin supplied to the molding die, and a second resin holding portion for holding the unnecessary resin after molding, the first resin holding portion and the second resin holding portion being alternately movable to carry-in and carry-out positions of the carrying device main body.

With the above configuration, the work holding portion carries the work into the set position provided on the surface of the mold in a state of being positioned at the set position, and the work holding portion can take the formed work out of the set position and carry the work out of the mold, and the resin holding portion is moved alternately to the carry-in/out position of the carrying device main body by the first resin holding portion and the second resin holding portion, whereby the molded resin can be held by the first resin holding portion and supplied to the mold, and the unnecessary resin after the formation can be held by the second resin holding portion and carried out of the mold. Thus, the operation of carrying the workpiece and the resin into and out of the mold can be achieved simultaneously, and the device structure can be simplified.

The first resin holding portion and the second resin holding portion are provided as: the transfer device is configured to be movable in a horizontal direction with respect to a direction in which the molding die enters, and thus, when the work is transferred in, the first resin holding portion transfers the molding resin in, and when the work is transferred out, the second resin holding portion transfers the unnecessary resin out, so that the same work transfer device can be used to switch the operations. Therefore, the body of the conveying device body is not large in the direction of entering the mold, and can be compactly arranged.

Preferably, the first resin holding portion is capable of holding a molding resin in any one form of a sheet resin, a powdery resin, a granular resin, and a liquid resin, and the second resin holding portion is capable of adsorbing and holding a molded article return.

Thus, the molded resin in various forms can be carried in by the first resin holding portion, and the molded article return after molding can be carried out by the second resin holding portion.

In a resin molding apparatus in which a work and a molding resin carried in by any one of the above-described work carrying apparatuses are clamped by a first mold and a second mold of the molding mold and resin molding is performed, and the molded work and the unnecessary resin are carried out by the work carrying apparatuses, the resin molding apparatus has a movable unit having a bridge portion arranged so as to be capable of overlapping an end portion of the work so as to be connected to a cavity concave portion formed in any one of the first mold and the second mold, an air movement passage or a molding resin movement passage, and the movable unit is supported so as to: when the mold is opened, the movable unit moves upward to leave the mold clamping surface, and in the mold opened state, the movable unit leaves the mold clamping surface, so that the workpiece holding portion moves horizontally to a position where the workpiece held by the workpiece conveying device overlaps the bridge portion, and the workpiece is transferred, and then the movable unit is pressed down by the mold clamping operation, so that the end portion of the workpiece is clamped and clamped by the bridge portion.

In this way, the workpiece is transferred by horizontally moving the workpiece holding portion to the position where the workpiece held by the workpiece conveying device is away from the die holding surface and overlaps the bridge portion of the movable unit, and therefore, the workpiece can be positioned and transferred to the molding die by the workpiece holding portion, not only the rectangular workpiece, but also the circular workpiece.

Further, the movable unit can be pressed down by the mold clamping operation, and the end portion of the work can be clamped by the bridge portion, so that the molded resin can be prevented from winding around the end surface of the work.

The movable unit may be: the bridge portion is formed to be capable of connecting with any one of a containing unit, a runner gate unit, and a ventilation unit of the cavity concave portion.

Thus, regardless of whether the molding die is used for transfer molding or compression molding, and regardless of the shape of the work, the molding die can be accurately positioned, and leakage of resin to the end of the work can be prevented.

And a plurality of support pins provided at a position where the workpiece is transferred and which are capable of being moved back and forth relative to the die surface, wherein the workpiece conveying device moves to a position where the workpiece end face overlaps the movable unit and transfers the workpiece to the support pins at the protruding position.

Thus, when the workpiece is transferred to the molding die, the workpiece is not damaged by sliding relative to the die surface.

A resin molding method, in which a work and a molding resin are carried into a molding die having a first die and a second die by a work carrying device, the work and the molding resin are clamped to perform resin molding, and a molded work and a resin which is not useful are carried out from the molding die by the work carrying device, characterized in that the resin molding method comprises the steps of: aligning a handling device body with a mold clamping surface of the first mold of the molding molds of the open mold; a workpiece holding unit that is movably provided in the conveyance device main body and holds a workpiece, and is horizontally moved to a position where a movable unit is placed so as to overlap an end of the workpiece, wherein the movable unit is supported by: when the mold is opened, the movable unit is forced to separate from the mold clamping surface of the first mold; handing over the work piece and the molding resin from the work piece holding portion to the first mold clamping surface; clamping the molding die in a state in which the movable unit overlaps the end of the workpiece, and heating and curing the molding resin filled in the cavity concave portion; when the first die and the second die are opened, the movable unit is separated from the die clamping surface of the first die, so that the formed workpiece is separated from the useless resin; holding the work with the work carrying device and holding the unnecessary resin by suction; and carrying out the molded article and the unnecessary resin from the molding die by the work carrying device in a state in which the molded article and the unnecessary resin are held.

With the above resin molding method, the same work conveying apparatus can be used to hold the work and the molding resin, and to convey them into the molding die, and the molded work and the unnecessary resin can be conveyed out of the molding die in a state separated from each other, so that the apparatus structure can be simplified.

When the workpiece conveying device is carried into the molding die, the workpiece holding portion is horizontally moved to a position where the workpiece is spaced from the die holding surface and overlaps the bridge portion of the movable unit, and therefore the workpiece is transferred, and the workpiece can be positioned and transferred to the molding die by the workpiece holding portion, not only the rectangular workpiece, but also the circular workpiece. Further, the movable unit can be pressed down by the mold clamping operation, and the movable unit is clamped so as to overlap the end portion of the work, so that the molded resin can be prevented from winding around the end surface of the work.

ADVANTAGEOUS EFFECTS OF INVENTION

The present invention can provide a work conveying apparatus and a resin conveying apparatus capable of positioning and transferring a work and/or a resin to and from a molding die with a simple apparatus structure.

The present invention also provides a resin molding apparatus capable of avoiding the winding of a molding resin around the end face of a work regardless of the shape of the work and capable of forming a flip-chip connected chip-exposed semiconductor product with high quality.

Drawings

Fig. 1A and 1B are explanatory views of cross-sectional angles of supply of a work and a resin sheet centering on a molding die of a resin molding apparatus used for transfer molding.

Fig. 2A and 2B are explanatory views of a resin molding process showing a carrying-in operation of a work and a molding resin, which is continued from fig. 1A and 1B.

Fig. 3A and 3B are explanatory views of a resin molding process showing a carrying-in operation of a work and a molding resin, which is continued from fig. 2A and 2B.

Fig. 4A and 4B are explanatory views of a resin molding process showing a mold closing operation and a mold opening operation, which are continued from fig. 3A and 3B.

Fig. 5A and 5B are explanatory views showing a resin molding step of carrying out the molded article and the unnecessary resin, which are continued from fig. 4A and 4B.

Fig. 6 is an explanatory view showing a resin molding step of carrying out the molded article and the unnecessary resin, which is continued from fig. 5A and 5B.

Fig. 7A is a plan view for explaining the reason for the workpiece being set aside by the workpiece carrying device, and fig. 7B is a cross-sectional view for explaining the reason for the workpiece being set aside by the workpiece carrying device.

Fig. 8A is a plan view of the upper die, and fig. 8B is a plan view of the lower die.

Fig. 9 is an explanatory diagram showing an operation of positioning the workpiece with respect to the position of the accommodating portion.

Fig. 10A is a plan view of the workpiece conveying device during the carry-in operation, and fig. 10B is a plan view of the workpiece conveying device during the carry-out operation.

Fig. 11A is a cross-sectional view illustrating a resin molding apparatus having a runner gate as a movable unit, and fig. 11B is a cross-sectional view illustrating a resin molding apparatus having a vent and a runner gate as movable units.

Fig. 12 is a cross-sectional view of a resin molding device for compression molding in which a vent portion is a movable unit.

Detailed Description

Hereinafter, preferred embodiments of the workpiece conveying device, and the resin molding device and the resin molding method having the workpiece conveying device according to the present invention will be described in detail with reference to the accompanying drawings. When referred to as a mold, the term "mold" refers to an upper mold and a lower mold supported by a base, respectively, and refers to a portion not including a mold opening/closing mechanism (press device). When referred to as a resin molding apparatus, the term "resin molding apparatus" refers to an apparatus having at least a molding die and a die opening/closing mechanism (for example, an electric motor, a press apparatus such as a screw or a toggle mechanism; not shown) for opening/closing the molding die, and further refers to an apparatus having a resin carrying apparatus or a work carrying apparatus, and a work carrying apparatus capable of carrying out a molded work for automation. In the case of transfer molding, it is considered that the mold includes a transfer mechanism for operating a plunger inserted into a containing portion, a decompression mechanism for forming a decompression space in the mold after mold clamping, and the like. Next, a description will be given centering on the structure of the molding die. Moreover, it is assumed that: the work W is resin molded in a circular shape like a semiconductor wafer on which chips are mounted, but is not particularly limited to a circular shape, and may be square or rectangular. The molding die is described as an example in which the lower die is a movable die and the upper die is a fixed die, but the upper die may be a movable die, the lower die may be a fixed die, or both the upper die and the lower die may be movable dies.

First, an example of a work conveying apparatus 1 is described with reference to fig. 1B, 10A and 10B, and the work conveying apparatus 1 is applied to a resin molding apparatus, conveys a work and a molding resin to a molding die, and conveys a molded work and a unnecessary resin from the molding die.

The conveying device main body 2 is provided with a work holding portion 3 for holding a work by sandwiching the work peripheral end portion at a plurality of positions of the work peripheral end portion, and a resin holding portion 4 capable of holding the molded resin R1 and the unnecessary resin R2 after molding, respectively. The positioning blocks 2a are provided at a plurality of positions of the conveying device main body 2, and as described later, positioning with respect to the mold clamping surface can be achieved by positioning portions (locking blocks) provided on the mold clamping surface of the molding mold.

As shown in fig. 10A, in order to be able to hold a circular workpiece W, the workpiece holding portion 3 is provided with openable and closable jaws 3a at four places along the outer periphery of the workpiece so as to be arranged at 90 degrees. In addition, although the gripping claws are provided around, the number is not limited as long as stable gripping and carrying can be ensured. A notch W1 for positioning is provided on the outer periphery of the circular workpiece W. The workpiece holding portion 3 holds the workpiece W by stopping rotation and positioning the workpiece W by engaging the positioning pin 3b with the notch portion W1.

Further, the work holding portion 3 is provided with: can move relative to the conveying device main body 2 in at least one of the X direction and the Y direction orthogonal to each other. In the present embodiment, the work holding portion 3 is provided as: the transfer device can reciprocate between a carry-in/carry-out position (see fig. 10A) and a delivery position (see fig. 10B) along the longitudinal direction of the transfer device body 2 by means of a cylinder and a linear motion mechanism incorporating a linear motion guide mechanism. The delivery position is a position where the workpiece center of the transfer apparatus main body 2 coincides with the workpiece center of the lower die 8. The carry-in and carry-out position means a position where: as will be described later, when the workpiece W moves up and down, the workpiece W is deviated from the delivery position to a position where the workpiece end does not touch the bridge portion 8e1 of the accommodating unit 8 e.

A cleaning brush 2b is provided on the leading side of the conveying device body 2 in the mold entering direction. When the cleaning brush 2b is operated, the surface of the mold can be cleaned when the workpiece conveying device 1 advances and retreats relative to the mold.

With the above-described configuration, the workpiece conveying device 1 holding the workpiece W and the molding resin R1 can position the conveying device body 2 by the positioning portion provided on the mold clamping surface of the molding mold, and the workpiece holding portion 3 is moved in at least one direction (horizontal direction) of the X-Y directions, so that the workpiece W and the molding resin R1 can be supplied to the molding mold in a state aligned with the molding mold by the workpiece carrying-in operation of the workpiece conveying device 1.

As shown in fig. 10A and 10B, the conveyance device body 2 is provided with a resin holding portion 4 so as to be parallel to the work holding portion 3. The resin holding portion 4 is provided with: the first resin holding portion 4a for holding the molding resin R1 supplied to the molding die and the second resin holding portion 4b for holding the unnecessary resin R2 after molding are alternately movable to the carry-in/out position (the accommodating hole 8e 2) of the carrying device body 2. In the present embodiment, the first resin holding portion 4a is provided therein; a cylindrical housing portion 4a1 for holding a solid resin (sheet resin); and an opening/closing portion 4a2 for opening/closing the bottom of the tubular housing portion 4a 1. The second resin holding portion 4b is provided with a suction cup 4b1. Suction is performed by a suction device, not shown, to suction and hold the resin-molded unnecessary resin R2 by the suction cup 4b1. The unnecessary resin R2 may be sucked by the suction cup 4b1, but may be gripped by a gripper mechanism.

The first resin holding portion 4a and the second resin holding portion 4b are provided as: the movable part can move in a direction (short side direction of the carrying device body 2: Y direction) perpendicular to the direction of entry of the molding die to the carrying in/out position (position corresponding to the accommodating part) of the carrying device body 2. Also, it may be configured that: can move in the longitudinal direction (X direction) of the conveying device main body 2. In this way, the carrying-in operation of carrying the molding resin R1 (sheet-like resin) into the mold by the first resin holding portion 4a can be performed at the time of the work carrying-in operation (see fig. 10B), and the carrying-out operation of carrying the unnecessary resin R1 (molded article return) out of the mold by the second resin holding portion 4B can be switched at the time of the work carrying-out operation (see fig. 10A).

With the above configuration, the work holding portion 3 can hold the work W before and after forming, and the resin holding portion 4 is provided with: the first resin holding portion 4a for holding the molding resin R1 supplied to the molding die and the second resin holding portion 4b for holding the unnecessary resin R2 (molded article return) after molding are alternately movable to the carry-in/out position (the holding hole 8e2: see fig. 1A) of the carrying device main body 2, and therefore, the work and the resin before and after molding can be carried in/out by the same work carrying device.

The first resin holding portion 4a may hold any of the molded resin R1, such as a powdery resin, a granular resin, and a liquid resin, in addition to the solid resin. Thus, regardless of the type of resin used, the resin can be carried in and out together with the work W by the general work carrier device 1. In addition, in the case of a liquid resin, a syringe may be used.

Next, the structure of the resin molding apparatus 5 will be described with reference to fig. 1A and 1B. In fig. 1A and 1B, a resin molding device 5 for transfer molding is described. The mold opening and closing mechanism is omitted, and the description will be given centering on the structure of the molding mold 6.

The molding die 6 molds the resin by sandwiching the work W and the molding resin R1 carried in by the work conveying apparatus 1 between an upper die 7 (first die) and a lower die 8 (second die), and then carries out the molded product W and the unnecessary resin R2 after molding by the work conveying apparatus 1.

First, the structure of the upper die 7 will be described. As shown in fig. 1A, an upper die block 7b is supported by an upper die holder 7a in a ring-like suspension along its outer peripheral edge portion. An upper die locking block 7c for positioning with the lower die 8 is provided protruding from the lower end surface of the upper die block 7b. As shown in fig. 8A, upper die locking blocks 7c (convex blocks) are respectively arranged on two pairs of opposite sides of the upper die block 7b on a center line passing through the center of the work W. It is not necessary to dispose the lock blocks on a center line passing through the center of the workpiece W, and at least the lock blocks may be provided on each side of the upper module 7b.

In the upper die space surrounded by the upper die block 7b, an upper die clamping portion 7d having a rectangular shape and an upper die cavity unit 7e having a circular shape are respectively suspended and supported by the upper die holder 7a via coil springs 7f (see fig. 1A and 8A). An upper cavity concave portion 7n is formed by an upper cavity unit 7e (cavity bottom) and an upper mold clamping portion 7d (cavity side portion) surrounding the upper cavity unit 7 e.

An upper mold runner 7g and an upper mold runner gate 7h connected to the upper mold runner 7g are engraved on a clamping surface (lower end surface) of the upper mold clamping portion 7d so as to be connected to the upper cavity concave portion 7 n. In the upper mold clamping portion 7d, a plurality of upper mold vent grooves 7i connected to the upper mold cavity recess 7n are engraved on the side opposite to the upper mold runner gate 7h through the upper mold cavity recess 7 n. A closing pin 7j is assembled to each upper mold vent groove 7i, and the closing pin 7j can open and close the upper mold vent groove 7i. The closing pin 7j is assembled in the upper die holder 7a in a state of being biased downward via the coil spring 7 k. Thereby, the tip (lower end surface) of the closing pin 7j is supported at a position substantially flush with the bottom of the upper mold vent groove 7i.

The upper cavity recess 7n and the upper mold clamping surface including the resin path connected to the upper cavity recess 7n are covered with a release film F held by suction holes not shown. The reason is that, in order to perform the exposure molding of the surface of the semiconductor chip T mounted on the workpiece W, it is necessary to cover the surface with the release film F sucked and held in the upper cavity concave portion 7 n. The release film F may be a long film which is continuous between reels in a long form, or may be a segmented film which is cut according to the size of the upper die holding surface, and the release film may be any of the above films. The release film F has a thickness of about 50 μm, is heat-resistant, is easily released from the mold surface, and has flexibility and ductility, and for example, a single-layer film or a composite film mainly composed of PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film, polyvinylidene chloride (PVDC), etc. is recommended.

Next, the structure of the lower die 8 will be described.

As shown in fig. 1A, a lower die 8a is supported in an annular shape along the outer peripheral edge of a lower die holder, not shown. A lower die lock block 8b (two paired rectangular parallelepiped blocks or one concave block) for positioning with the upper die 7 is provided on the upper end surface of the lower die 8a. As shown in fig. 8B, on opposite sides of the lower die 8a, concave portions 8c of the lower die lock block 8B are respectively arranged on a center line passing through the center of the work W. It is not necessary to dispose the lock blocks on the center line passing through the center of the work W, but the lock blocks may be disposed at any position of the sides as long as the lock blocks are provided at least on the sides of the lower die block 8a and the upper die lock block 7c and the lower die lock block 8b can be combined with each other and engaged.

Thus, by engaging the upper die locking block 7c with the recess 8c of the lower die locking block 8b, the upper die 7 can be aligned and clamped with the lower die 8.

A seal 8d is fitted annularly to the clamping surface of the lower module 8a. The lower die block 8a is abutted against the clamping surface of the upper die block 7b facing thereto to seal the space in the die. The lower die block 8a is supported so as to float by a coil spring 8s a containing unit 8e (movable unit) so as to be biased upward with respect to the lower die holder at the time of die opening. The upper end of the accommodating unit 8e includes a flat mold separation surface and a bridge portion 8e1, and an accommodating hole 8e2 is formed in a substantially center of the upper end of the accommodating unit 8 e. The accommodating hole 8e2 has a cylindrical shape in which the molding resin R1 can be filled, and the plunger 8f is inserted into the accommodating hole 8e2 so that the plunger 8f can be lifted and lowered.

In the die space surrounded by the lower die block 8a, a circular workpiece support block 8g is supported and fixed to the lower die holder. The upper end surface of the work support block 8g is supported at a lower level than the upper end surface of the surrounding lower module 8a, and at a lower level corresponding to the plate thickness of the work W. Thereby, the workpiece W can be placed in the placement recess 8h formed by the workpiece support block 8g and the lower module 8a enclosing the workpiece support block 8 g. The placement recess 8h can also serve as a means for positioning the workpiece W, but it is not necessary to provide the placement portion as a recess by providing the lower die 8 with a positioning pin 8t (see fig. 8B) corresponding to a V-shaped notch provided for positioning the workpiece W so as to stand.

As shown in fig. 7A and 7B, a bridge portion 8e1 is formed at the upper end portion of the accommodating unit 8e, and the bridge portion 8e1 is arranged to: in an overhanging shape, overlaps with the upper end portion of the work W placed in the placement recess 8 h. The bridge portion 8e1 is provided at a position facing the upper mold runner gate 7h, and the bridge portion 8e1 is formed in a wedge shape so as to be thinner as the plate thickness is removed from the accommodating portion side to the outer peripheral edge portion. Accordingly, the molding resin R1 can pass between the bridge portion 8e1, which is the upper end surface of the accommodating unit 8e, and the upper mold runner gate 7h, and then is filled into the upper cavity concave portion 7n, and therefore, the resin does not pass through the end portion of the work W but straddles the end portion of the work W, and thus, resin leakage does not occur. In the present embodiment, the runner and the runner groove forming the runner gate 7h of the upper mold are provided on the upper mold side, but may be provided on the bridge portion 8e1 side, or may be provided on both of them. Since the boundary between the upper mold runner gate 7h and the cavity is a gate, the cross-sectional shape is formed in an inclined shape so that gate breakage (japanese) described later can be easily achieved.

As shown in fig. 8B, a plurality of chips T are arranged on the work W, and the chips T are arranged up to the vicinity of the end of the circular work. Since the molding region is thin and the area is wide, it is necessary to ensure resin injection balance to avoid a horizontal gap between the chips T and a gap under the chips T from generating a region not filled with the molding resin R1. Therefore, in view of the filling property of the molding resin R1, it is desirable to secure a gate width G (see fig. 7A) as wide as possible on the tip side connected to the cavity (gate on the side connected to the cavity and the runner), and thus, it is desirable to have an inclined shape that gradually expands as the width G goes from the accommodating portion toward the cavity. When the accommodating unit 8e is overlapped with the circular workpiece W in a plan view, the overhanging amount L of the bridge portion 8e1 (an overlapping length from an end portion of the accommodating unit 8e overlapped with the workpiece to an outer peripheral end portion of the workpiece: refer to fig. 7B) is large. Thus, when the upper and lower molds are clamped, a resin path can be formed between the upper end surface of the accommodating unit 8e and the upper mold runner gate 7 h.

Then, the bridge portion 8e1 of the accommodating unit 8e is separated from the lower mold holding surface (see fig. 1A) in a state where the mold is opened, and after the end surface of the workpiece held by the workpiece conveying device 1 is positioned below the bridge portion 8e1 in the placement recess portion 8h (see fig. 3B), the bridge portion 8e1 is overlapped with the workpiece so as to overlap with the outer peripheral end portion of the workpiece, and the molding mold 6 is made to clamp the workpiece W. In this way, the reason why the workpiece is positioned not only by the die but also by the workpiece conveying device 1 is that, particularly in the case where the workpiece W is circular, even if the workpiece end is pushed toward the accommodating portion side by using a moving unit or the like as in the case of the edge mechanism conventionally applied to the rectangular substrate, the amount of movement (the overhanging amount L of the bridge portion 8e 1) is large in the case where the workpiece W is large, and misalignment and rotation of the workpiece W are likely to occur. Further, the lower die 8 may be provided with a positioning pin 8t corresponding to the V-shaped notch provided for positioning the workpiece W, whereby both the rotation stop and the positioning can be achieved (see fig. 8B).

As shown in fig. 1A, the work support block 8g is provided with a plurality of suction holes 8i, and the suction holes 8i are configured to suction and hold the work W placed in the placement recess 8 h. The suction hole 8i is connected to a suction device not shown. Further, a plurality of movable support pins 8j penetrating the work support block 8g are provided. The support pin 8j is provided as: the pin can be moved between a position where the pin tip end portion protrudes from the bottom of the placement recess 8h and a position where the pin tip end portion is retracted into the work support block 8 g. When the workpiece W held by the workpiece conveying device 1 is transferred to the placement recess 8h, the pin distal end portions of the plurality of support pins 8j are projected from the placement recess 8h in advance, and the workpiece W is transferred to the support pins 8j. Thus, when the work W is positioned toward the molding die, damage to the work due to sliding of the work with respect to the die surface does not occur. Further, the support pin 8j may be omitted.

Further, a suction hole 8k is provided in the lower die block 8A radially inward of the seal 8d and opposite to the upper die overflow chamber 7r (see fig. 8A and 8B). The suction hole 8k is connected to a suction device not shown. In a state where the molding die 6 is clamped to the work W, air is sucked from the suction hole 8k, and resin molding is performed while air remaining in the upper cavity concave portion 7n is discharged through the upper die vent groove 7i, thereby preventing occurrence of a void.

With the above configuration, when the workpiece W held by the workpiece conveying device 1 is carried into the molding die 6, the workpiece W is slid to a position where the end face of the workpiece overlaps the bridge portion 8e1 of the holding unit 8e, and the workpiece W is positioned in this state and delivered to the lower die 8 (the placement recess 8 h), so that the workpiece W can be accurately positioned into the molding die 6 regardless of the shape of the workpiece W, and no resin leakage to the end of the workpiece occurs.

Here, with reference to fig. 1 to 6, an operation example of carrying a work in and out by the work carrying device 1 and an operation example of resin molding by the resin molding device 5 will be described.

Fig. 1A shows a state in which the molding die 6 is opened. The release film F (long film or segmented film) is supplied to the nip surface of the upper die 7. In the lower die 8, the holding unit 8e is biased upward so that the bridge portion 8e1 is separated from the lower die 8 a.

Fig. 1B shows a process of loading a work W and a sheet-like resin R1 into a mold 6 in an open state by a work transfer device 1. The outer peripheral end portion of the work W is held by the jaw 3a of the work holding portion 3, and the sheet-like resin R1 is held by the resin holding portion 4 (first resin holding portion 4 a). The positioning block 2a of the conveying device main body 2 is aligned with the concave portion 8c of the lower die lock block 8 b. Further, since the workpiece holding portion 3 is in the carry-in and carry-out position, the workpiece W held by the workpiece holding portion 3 is held at a position deviated from the seating recess 8 h. Further, the workpiece W and the sheet-like resin R1 may be carried by separate carrying devices, instead of the same carrying device.

Next, as shown in fig. 2A, the workpiece conveying device 1 is lowered toward the clamping surface of the lower die 8, and the positioning block 2A of the conveying device body 2 is fitted into the concave portion 8c of the lower die locking block 8b so as to be fitted with the concave and convex portions, whereby the conveying device body 2 is positioned with respect to the lower die 8. Thus, the cylindrical housing portion 4a1 of the resin holding portion 4 is positioned directly above the accommodating hole 8e2 and concentrically aligned with the accommodating hole 8e2.

As shown in fig. 2B, the workpiece holding portion 3 holding the workpiece W moves from the carry-in/out position laterally to the delivery position. At this time, the workpiece W horizontally moves to a position overlapping the bridge portion 8e1 at a position below the bridge portion 8e1 of the accommodating unit 8 e. Thereby, the outer peripheral end portion of the work W is aligned with the seating recess 8 h.

Further, the sheet-like resin R1 is filled from the resin holding portion 4 into the accommodating hole 8e2 of the accommodating unit 8 e. Specifically, the opening/closing portion 4a2 closing the bottom of the cylindrical housing portion 4a1 is opened, and the sheet-like resin R1 is dropped into the accommodating hole 8e2.

As shown in fig. 3A, the tip end portion of the support pin 8j inserted into the workpiece support block 8g is protruded from the bottom of the placement recess 8h, and the jaw 3A of the workpiece holding portion 3 is released, whereby the workpiece W is transferred to the support pin 8j.

Next, as shown in fig. 3B, the workpiece conveying device 1 is raised relative to the lower die 8, and thereafter, is retracted outside the molding die 6. Then, the support pin 8j is retracted into the work support block 8g, and the work W is accommodated in the accommodation recess 8h and sucked and held by the suction hole 8 i. The release film F is then sucked and held on the nip surface of the upper die 7.

As shown in fig. 4A, for example, the lower die 8 is raised relative to the upper die 7 to clamp the molding die 6. Suction from the suction hole 8k is started, and when the upper die block 7b and the lower die block 8a sandwich the seal 8d, a decompression space is formed in the upper cavity concave portion 7n by the action of the upper die ventilation groove 7 i. The workpiece W is held by the upper die holding portion 7d, and the surface of the chip T is brought into contact with the upper die cavity unit 7e via the release film F. The plunger 8f is raised, and the molten molding resin R1 in the accommodating hole 8e2 is filled into the upper cavity concave portion 7n through the upper sprue 7g and the upper runner gate 7 h. When the resin comes near the vent portion, the mold is closed again, and at this time, the tip of the closing pin 7j protrudes relatively from the upper mold clamping portion 7d, and the upper mold vent groove 7i is closed, thereby preventing the flow of the resin and air. The molding resin R1, which has been prevented from flowing, in the cavity recess 7n is heated and pressurized, and in this state, pressure is maintained, so that the resin is cured.

When the curing of the molding resin is completed, as shown in fig. 4B, the molding die 6 is opened. The holding unit 8e moves under the urging force of the coil spring 8s (refer to fig. 8B) so that the bridge portion 8e1 is separated from the lower module 8a. The holding unit 8e is not limited to being moved upward by the coil spring 8s, and may be moved upward by a cylinder, a motor, or the like that can be driven independently. The work W is still in a state of being sucked and held in the seating recess 8 h. Thereby, the unnecessary resin R2 (molded article return) on the accommodating unit 8e can be separated from the gate of the molded article (package portion) and lifted. Since the release film F is adsorbed and held on the nip surface of the upper die 7, it is easily separated from the resin. Further, since the height position of the plunger 8f is not changed, the unnecessary resin R2 can be separated from the plunger tip by the upward movement of the accommodating unit 8 e. Further, the unnecessary resin R2 on the containing unit 8e may be separated by pushing up the plunger 8f to push the unnecessary resin from below. The above-described upward movement of the plunger is preferably performed when the second resin holding portion 4b of the workpiece conveying device 1 is disposed above the unnecessary resin R2, so that the unnecessary resin R2 can be prevented from splashing.

After the mold 6 is opened, the workpiece carrying device 1 enters the mold. Specifically, the carrier body 2 is brought into a position in which it can be aligned with the lower die 8. The workpiece holding portion 3 is located at the workpiece delivery position and is in a state where the gripping claws 3a are opened. As shown in fig. 10A, the resin holding portion 4 is moved to a position where the second resin holding portion 4b faces the accommodating hole 8e 2.

As shown in fig. 5A, the support pin 8j is lifted up relative to the work support block 8g, and the work W is lifted up from the placement recess 8h while being supported by the pin tip. In this state, the workpiece conveying device 1 descends, the outer peripheral end portion of the workpiece W is held by the jaw 3a of the workpiece holding portion 3, and the unnecessary resin R2 (molded article return) is sucked and held by the suction cup 4b1 of the second resin holding portion 4 b. In this case, the plunger 8f may be raised to push the unnecessary resin R2 down from the upper surface of the accommodating unit 8e, thereby positively urging the unnecessary resin to be separated. In this state, when the workpiece conveying device 1 is lifted, the outer peripheral end portion of the workpiece W interferes with the bridge portion 8e1 of the accommodating unit 8 e. For this purpose, the support pins 8j are lowered, and the workpiece holding portion 3 holding the workpiece W is moved from the delivery position shown in fig. 5A laterally to the carry-in/out position shown in fig. 5B, which is apart from the accommodating unit 8 e. Thereby, the outer peripheral end portion of the work W and the bridge portion 8e1 of the accommodating unit 8e do not overlap in the height direction.

As shown in fig. 6, the work conveying apparatus 1 is raised and retracted outside the molding die 6 in a state where the work holding portion 3 holds the work W and the second resin holding portion 4b (suction cup 4b 1) holds the unnecessary resin R2 (molded article return). At this time, the cleaning brush 2b provided in the conveying device main body 2 is lowered to the lower die holding surface, and the brush portion is rotated, so that suction is performed while wiping the lower die surface, and resin residues are removed and retracted. The release film F held by suction on the nip surface of the upper die 7 is removed by suction, and the release film is peeled off and replaced with a new release film F. In the case of a long release film, the release film is transported transversely and replaced with a new one.

Then, the work W and the unnecessary resin R2 carried out from the molding die 6 by the work carrying device 1 are sorted and collected.

With the above resin molding method, the workpiece W and the molding resin R1 can be held by the workpiece conveying device 1 and carried into the molding die 6, and the molded workpiece W and the unnecessary resin R2 can be carried out of the molding die 6 in a state separated from each other, so that the conveying device structure can be simplified.

When the workpiece conveying device 1 is carried into the mold 6, the workpiece W is slid from the carrying-in/out position to the delivery position corresponding to the placement recess 8h, and is slid to a position overlapping the bridge portion 8e1 of the accommodating unit 8e in the height direction, and in this state, the workpiece W is delivered to the lower mold 8 (placement recess 8 h), so that not only a rectangular workpiece but also a circular workpiece can be accurately positioned to the mold 6, regardless of the shape of the workpiece W, and no resin leakage to the end of the workpiece occurs.

In the above embodiment, the workpiece W is assumed to be a semiconductor wafer having a circular shape, but the workpiece is not necessarily limited to a circular shape, and may be a long substrate or a large-sized (square or rectangular) substrate. The holding unit is provided with a holding portion of the lower die 8, but a plurality of holding portions may be arranged in one holding unit, or a plurality of rows of holding portions may be provided. Although only one accommodating unit 8e is illustrated, a plurality of accommodating units 8e may be provided for the workpiece W.

Further, the workpiece holding portion 3 included in the workpiece conveying device 1 is movable in the longitudinal direction of the conveying device body 2 between the carry-in and carry-out position and the delivery position, but may be provided as shown in fig. 9: can move in the X-Y direction according to the arrangement of the accommodating units 8e and the arrangement of the accommodating holes 8e 2. Further, the workpiece holding portion 3 may be moved obliquely in the X-Y direction, and any of the above methods may be selected as long as the workpiece W is prevented from interfering with the holding unit 8e by the vertical movement when being set in the die.

Fig. 11A is a cross-sectional view of a resin molding apparatus of another embodiment in which a runner gate unit 8n (movable unit) is provided as a movable unit instead of a housing unit 8e that was a movable unit before, and a housing portion is fixed. The same reference numerals are given to the same components as those in the above embodiment, and the description will be given below, with the configuration of the workpiece conveying device 1 and the upper die 7 being the same as those in the above embodiment, and therefore, the description will be given centering on the configuration of the lower die 8.

A cylindrical and fixed accommodating portion 8m is assembled to the lower die 8a of the lower die 8, and a plunger 8f is inserted into the accommodating portion 8 m. A lower mold runner gate unit 8n is provided between the accommodating portion 8m and the placement recess 8h so as to be movable up and down. The lower mold runner gate unit 8n is coupled to and supported by an upper end of a lift rod 8p penetrating the lower mold block 8 a. The lower mold runner gate unit 8n is biased upward by a coil spring or the like, not shown, when the mold is opened.

A resin path is formed between the upper surface of the lower mold runner gate unit 8n and the upper mold runner gate 7g and the upper mold runner gate 7h opposed thereto. In particular, a bridge portion 8n1 is formed on a surface of the lower mold runner gate unit 8n facing the upper mold runner gate 7h, and the bridge portion 8n1 is arranged so as to overlap an upper end portion of the work W placed in the placement recess 8h in a cantilevered manner. The bridge portion 8n1 gradually becomes thinner as it goes toward the outer peripheral end portion connected to the upper cavity concave portion 7n and toward the outer peripheral end portion connected to the containing portion 8m, and both ends of the bridge portion 8n1 are formed in a wedge shape.

Fig. 11B is a cross-sectional view illustrating a resin molding apparatus further having a lower die bridge vent unit 8q connected to the upper die cavity recess and the upper die vent groove as a movable unit in addition to fig. 11A. A cylindrical and fixed accommodating portion 8m is assembled to the lower die 8a of the lower die 8, and a plunger 8f is inserted into the accommodating portion 8 m. A lower mold runner gate unit 8n is provided between the accommodating portion 8m and the placement recess 8h of the lower mold block 8a so as to be movable up and down. The lower mold runner gate unit 8n is coupled to and supported by an upper end of a lift rod 8p penetrating the lower mold block 8 a. When the mold is in the open state, the lower mold runner gate unit 8n is biased upward by a coil spring or the like, not shown.

Further, an upper die bridge vent groove 7m connected to the upper die cavity recess 7n and the upper die vent groove 7i is engraved in the upper die clamping portion 7 d. A lower die bridge vent unit 8q (movable unit) that can be lifted and lowered is provided at a position of the lower die block 8a that faces the upper die bridge vent groove 7m. The lower die bridge ventilation unit 8q is connected to and supported by an upper end of a lifter bar 8p penetrating the lower die block 8 a. The lower die bridge ventilation means 8q is biased upward by a coil spring or the like, not shown, at the time of die opening. A ventilation path is formed between the upper surface of the lower die bridge ventilation unit 8q and the upper die bridge ventilation groove 7m opposed thereto. In particular, a bridge portion 8q1 is formed in the lower die bridge-shaped ventilation unit 8q, and the bridge portion 8q1 is arranged so as to overlap the upper end portion of the work W placed in the placement recess 8h in a cantilever manner. The bridge 8q1 is tapered as it goes toward the outer peripheral end connected to the upper cavity concave portion 7n and toward the end on the upper die overflow cavity 7r side, and both ends of the bridge 8q1 are formed in a wedge shape.

As described above, in the configuration in which the lower mold runner gate unit 8n and the lower mold bridge vent unit 8q are disposed on both sides of the placement recess 8h, the workpiece holding portion 3 of the workpiece conveying device 1 slides in the short side direction of the conveying device main body 2 (the direction perpendicular to the paper surface on which fig. 11B is located), and positioning and delivery of the workpiece W and the placement recess 8h are performed.

The resin molding device 5 described above uses the molding die 6 for transfer molding, but the resin molding device 5 having the molding die 6 for compression molding may be used.

The resin molding apparatus 5 shown in fig. 12 has the following structure: the structure of the lower die 8 and the upper die 7 in the structure of the molding die 6 in fig. 11B are interchanged, and the workpiece handling apparatus 1 is inverted. That is, the structure of the upper die 7 'in fig. 12 is shown by turning over the structure of the lower die 8 in fig. 11B, and is denoted by the symbol'. The structure of the lower die 8' is different from that described above in that the lower die 8a ' and the lower die 8b ' are surrounded by each other. The following description will be made with respect to different configurations.

In the lower die 8', a lower die block 8b ' is supported in an annular shape along the outer peripheral edge of the lower die holder 8a '. A lower die lock block (not shown) for positioning with the upper die 7 'is provided protruding from the upper end surface of the lower die block 8b'.

In the lower die space surrounded by the lower die block 8b ', the annular lower die holding portion 8d' is supported by the lower die holder 8a 'in a floating manner via the coil spring 8 f'. The lower cavity unit 8e ' is surrounded by the lower die clamping portion 8d ', and is supported and fixed to the lower die holder 8a '. A lower cavity recess 8r is formed by a lower cavity unit 8e ' (cavity bottom) and a lower mold clamping portion 8d ' (cavity side portion) enclosing the lower cavity unit 8e '.

A lower die bridge vent groove 8m 'connected to the lower cavity concave portion 8r is engraved on the clamping surface (upper end surface) of the lower die clamping portion 8 d'. The lower die bridge vent grooves 8m 'are also connected to a plurality of lower die vent grooves 8i'. A closing pin 8j ' is assembled to each lower die vent groove 8i ', and the closing pin 8j ' can open and close the lower die vent groove 8 i. The closing pin 8j ' is assembled in the lower die holder 8a ' in a state biased upward by the coil spring 8k '. Thereby, the tip (upper end surface) of the closing pin 8j 'is supported at a position substantially flush with the bottom of the lower die vent groove 8i'. Preferably, the release film F is sucked and held on the lower mold clamping surface including the lower cavity concave portion 8 r.

The workpiece conveying device 1 enters the molding die 6 (in the left-right direction in the paper surface of fig. 12) in a state in which the workpiece W is held by the workpiece holding portion 3, and holds the workpiece by suction in the placement recess 7h 'of the upper die 7'. The work holding portion 3 slides in the short side direction of the conveying apparatus main body 2 (the direction perpendicular to the paper surface in fig. 12), and conveys the work in the direction perpendicular to the paper surface in fig. 12 until the upper bridge-shaped ventilation units 7q' are respectively overlapped with the outer peripheral end portions of the work W in an overhanging manner. The workpiece holding portion 3 may hold the workpiece W not only by the holding jaw 3a but also by holding the workpiece in the seating recess 7h 'while being held by suction by the seating recess 7h'. Although the work conveying apparatus 1 may not have a cleaning mechanism, it is preferable to have a cleaning mechanism because resin residues may adhere to the surface of the upper die bridge ventilation unit 7 q'.

Further, the molded resin R1 (for example, granular resin, powdery resin, liquid resin, etc.) may be supplied to the cavity recess 8R by the work conveying apparatus 1, or only the molded resin R1 may be conveyed by a relatively independent resin conveying and supplying apparatus, and only the unnecessary resin R2 after molding may be taken out by a relatively independent resin conveying and discharging apparatus. In the compression molding, the work W and the resin are taken out in an integrated state without causing the unnecessary resin R2 after the molding to flow into the overflow cavity. In the case of the upper cavity compression molding die, the resin R1 may be placed on the work and then the work may be carried into the die by the work carrier. Further, a mold having an upper cavity recess and a lower cavity recess may be formed.

Further, two types of resins (R1, R2) before and after molding may be supplied and taken out independently from the work conveying apparatus 1 by one resin conveying apparatus. In addition, the workpiece conveying device 1 performs the supply and the removal by the same workpiece conveying device, but may perform the supply and the removal by the workpiece conveying devices independent of each other. In any of the methods, the work conveying apparatus of the present invention is effective when the work is fed to and discharged from the same surface of the mold, and the surface of the mold to which the resin is fed and discharged is the same surface of the mold, when the work is fed and discharged from the same surface of the mold.

Claims

1. A resin molding device for clamping a work and a molding resin carried in by a work carrying device by a first mold and a second mold of a molding mold, and molding the resin, wherein the work carrying device carries out the molded work and the resin without any use,

the resin molding device has:

a conveying device main body capable of positioning with respect to the molding die by a positioning portion provided on a die holding surface of the molding die;

a workpiece holding unit provided in the conveying device body, and configured to reciprocate, with a gripper, in a state in which an outer peripheral end portion of the workpiece is held by sandwiching the workpiece at a plurality of positions, between a workpiece carry-in/out position and a delivery position with respect to the conveying device body positioned on the die holding surface, by a linear motion mechanism, in a horizontal direction orthogonal to an entering direction of the molding die with respect to the conveying device body;

a resin holding portion provided in the conveying device main body, the resin holding portion having a first resin holding portion for holding the molding resin supplied to the molding die and a second resin holding portion for holding the unnecessary resin after molding, the first and second resin holding portions being provided: a resin carrying-in/out position of the carrying device main body is alternately movable in a horizontal direction orthogonal to an entering direction of the molding die;

A movable unit having a bridge portion configured to be overlapped with an end portion of the work so as to be an air movement path or a molded resin movement path connected to a cavity concave portion formed in either one of the first mold and the second mold, and supported by: when the mold is opened, the movable unit moves upward so as to be away from the mold clamping surface,

in the case where the mold is in the mold-opened state, the movable unit is separated from the mold clamping surface, the workpiece carrying device moves the workpiece holding portion from the workpiece carrying-in/out position in a horizontal direction orthogonal to a direction in which the workpiece is entered with respect to the mold with respect to the carrying device main body positioned on the mold clamping surface, the workpiece is transferred to the first mold and the second mold at the transfer position where the end portion of the workpiece held by the workpiece holding portion overlaps the bridge portion, the molded resin held by the first resin holding portion positioned at the resin carrying-in/out position is supplied to the mold, and then the movable unit is pressed down by a clamping operation, whereby the end portion of the workpiece is clamped and clamped by the bridge portion to perform resin molding, and the molded workpiece is held by the workpiece carrying-in/out position with respect to the carrying device main body positioned on the mold clamping surface at the transfer position, and is not used to hold the resin by the second resin carrying-in/out device under the condition where the resin is not held by the resin carrying-in/out portion.

2. The resin molding apparatus according to claim 1, wherein,

the movable unit is: the bridge portion is formed to be capable of connecting with any one of a containing unit, a runner gate unit, and a ventilation unit of the cavity concave portion.

3. The resin molding apparatus according to claim 1 or 2, wherein,

4. The resin molding apparatus according to claim 1, wherein,

the first resin holding portion is capable of holding a molding resin in any one form of a sheet resin, a powdery resin, a granular resin, and a liquid resin, and the second resin holding portion adsorbs and holds a molded article return.

5. A resin molding method, in which a workpiece and a molding resin are carried into a molding die having a first die and a second die by a workpiece carrying device, the workpiece and the molding resin are clamped to mold the resin, and the molded workpiece and a resin are carried out from the molding die by the workpiece carrying device,

The resin molding method includes the steps of:

aligning a handling device body with a mold clamping surface of the first mold of the molding molds of the open mold;

a workpiece holding portion for holding the workpiece by sandwiching an outer peripheral end portion of the workpiece at a plurality of positions by a jaw by a linear movement mechanism is moved from a workpiece carry-in/out position to a delivery position where a movable unit is overlapped with the end portion of the workpiece in a horizontal direction orthogonal to a direction of entering the molding die with respect to the conveying device main body positioned on the die clamping surface, wherein the movable unit is supported by: when the mold is opened, the movable unit moves upwards and leaves the first mold clamping surface;

the work is joined to the first mold clamping surface from the work holding portion, and the molding resin held in the first resin holding portion located at the resin carry-in/out position is joined to the first mold clamping surface;

clamping the molding die in a state in which the movable unit overlaps the end of the workpiece, and heating and curing the molding resin filled in the cavity concave portion;

when the first die and the second die are opened, the movable unit is separated from the die clamping surface of the first die, so that the formed workpiece is separated from the useless resin;

The transfer device includes a transfer device body that is placed in the molding die and positioned on the first die holding surface, and that holds the molded workpiece at the delivery position by the workpiece holding portion and moves the molded workpiece to the workpiece carry-in/out position, and that suctions and holds the unnecessary resin by a second resin holding portion that moves to the resin carry-in/out position in a horizontal direction orthogonal to a direction in which the molded workpiece is placed in the molding die, instead of the first resin holding portion; and

And the workpiece carrying device carries the formed workpiece and the unnecessary resin out of the molding die in a state in which the formed workpiece and the unnecessary resin are held.