JP2019186462A - Mold, resin molding apparatus, resin molding method, and conveying tool - Google Patents

Abstract

To provide a mold capable of exposing a surface of a semiconductor chip and perform resin molding, a resin molding apparatus, and a resin molding method, and an optimum conveying tool for these apparatuses and methods.SOLUTION: While a mold 1 is closed, a chip pressing portion 3d is pressed against a chip T through a film F to relatively reduce a volume of a recess 3i, so that a mold resin R accommodated in the recess 3i is filled in a gap of the chips T while being pressurized.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a mold, a resin molding apparatus, a resin molding method, and a conveying tool used in these apparatuses and methods, in which a workpiece having a plurality of chips mounted on a substrate is resin-molded by exposing the surface of each chip. .

  In recent years, with the spread of AI technology, processor units such as GPU (Graphics Processing Unit) on the silicon substrate with TSV wiring and HBM (High Bandwidth Memory) in the vicinity are arranged close to each other, and the high density between the chips. Products relating to SIP (System In Package) structure products connected by wiring and FPGAs (Field-Programmable Gate Array) having similar configurations have been developed. For example, many semiconductor chips such as GPU, FPGA, and HBM are mounted on a wafer as an interposer of φ300 mm, and these semiconductor chips having different heights can be easily protected and connected to external peripheral circuits. Therefore, there is a need to provide a package mold.

  In this case, the GPU has a large mounting area, for example, 20 × 30 mm, and an extremely large number of elements are included. The HBM is stacked in multiple layers so that an extremely large number of memory elements are arranged, and these are high frequency signals. Each of them generates a large amount of heat. For this reason, in resin molding, it is necessary to expose the surface of each semiconductor chip to ensure heat dissipation. Further, since the height of each semiconductor chip is different, there is also a problem that it is weak against mechanical stress and easily distorted.

For this reason, when resin-molding a work on which a large number of semiconductor chips such as GPU and HBM are mounted, the chip surface is once covered with a mold resin in order to eliminate the high heat generation of the semiconductor chip, and then the resin on the chip surface is cut. The chip surface is exposed by cutting (including the case of chemical removal), or a heat sink is attached after separation.
Further, there is a method of compression molding using a compression molding die in which a lower mold cavity is formed (Patent Document 1: Japanese Patent Laid-Open No. 2017-87453; see FIGS. 16 and 17).
Further, as an apparatus for performing underfill molding, a molding chip supplied to the lower mold cavity is compression-molded by using a clamping piece for a semiconductor chip (hereinafter simply referred to as “chip”) and a pressing piece for resin pressure. A method has also been proposed. (Patent Document 2: WO2015 / 159743; see FIGS. 1 to 6).

JP 2017-87453 A WO2015 / 159743

If the chip surface is once covered with mold resin and then exposed by cutting, etc. (including when it is chemically removed), there is a risk that the boundary between the chip and the mold resin may be damaged by filler mixed in the mold resin. is there. Further, chipping during cutting and warping due to stress are likely to occur. Since thinner products have been desired in recent years, defects due to this manufacturing method have been attracting more attention.
Further, as an example of resin molding by exposing the chip, as in Patent Document 1 above, after the chip is clamped by a spring, the mold resin is melted from outside the cavity of the lower mold, sent into the cavity, and pressurized. Then, resin burrs are generated on the side surface of the workpiece due to the resin straddling the workpiece end. Also, since unnecessary resin remains outside the cavity, the unnecessary resin must be removed after molding. Moreover, since it was not able to follow when the height of a chip | tip differs, the resin flash generate | occur | produced on the chip | tip.
In addition, when the mold resin is arranged around the chip in the lower mold cavity and is pressurized with the pressure piece as in Patent Document 2, the chips are arranged very close to each other, so the installation space for the pressure piece cannot be secured. In some cases, it is unclear whether or not the film can be adsorbed and held following the concavo-convex surface present in the lower mold cavity. If the elongation of the film increases, it may be damaged.

  Disclosure applied to some embodiments described below has been made in order to solve the above-described problems, and the object of the disclosure is to provide a mold metal that can be resin-molded with the chip surface reliably exposed. An object of the present invention is to provide a mold, a resin molding apparatus, a resin molding method, and a conveying tool optimal for these apparatuses and methods.

  Disclosure relating to some embodiments described below includes at least the following configurations. That is, a mold having a plurality of chips mounted on a substrate and a resin mold that exposes the surface of each chip, and a first mold that supports the work, and a chip mounting area of the work A chip pressing piece disposed oppositely, an elastic member that supports the chip pressing piece spaced apart from a support portion, and a second mold in which a recess for housing a mold resin is formed around the chip pressing piece. The volume of the recess is relatively reduced while the chip pressing piece is pressed against the chip while closing the first mold and the second mold, and the mold resin accommodated in the recess is The gap between the chips is filled while being pressurized.

Thus, while closing the first mold and the second mold, the volume of the concave portion is relatively reduced while the chip pressing piece is pressed against the chip, and the mold resin accommodated in the concave portion is inserted into the gap between the chips. By filling with pressure, the surface of the chip is exposed, and the mold resin can be filled in the gap between the chips and the gap between the chip and the substrate.
At this time, it is filled while applying the resin pressure to the mold resin while releasing the excessive clamping pressure by the elastic member while holding the individual chip by the chip pressing piece, so that the chip surface is not subjected to excessive mechanical stress. The resin can be prevented from entering, and the mold resin can be pressurized and filled in the gap around the chip, between the stacked chips, and the gap between the chip and the substrate.

The second mold includes a clamper that clamps the peripheral edge of the substrate, the chip pressing piece that is disposed opposite to the chip mounting area and presses the surface of each chip, and an elastic that supports the chip pressing piece while being spaced apart from a support portion. A pressure piece that is disposed in a cavity area surrounded by the member and the chip pressing piece and that is surrounded by the clamper and that accommodates mold resin, and the clamper and the chip pressing piece are supported at the same height. May be.
As described above, since the chip pressing piece and the clamper are supported at the same height and surrounded by them to form the recess, they are reliably delivered to the recess without spilling the mold resin. In addition, since the clamper and the chip pressing piece are supported at the same height, the pressure piece surrounded by them is relatively pressed so as to reduce the concave volume by the mold closing operation while pressing the chip surface with the chip pressing piece. The mold resin can be pressurized and filled in the gaps between the chips. Therefore, the resin stress can be molded by exposing the chip surface with less mechanical stress acting on the chip.

The pressurizing piece arranged in the cavity area may be relatively moved to a height position that forms a gap for performing underfill molding on the workpiece in a mold closed state.
Thereby, in the mold closed state, the pressure piece can be preferentially performed with the underfill molding while being relatively moved to a height position that forms a gap for underfill molding with respect to the workpiece.

The second mold includes a connection plate floatingly supported on a lower mold base by a first elastic member, and the chip pressing piece supported floating on the connection plate by a second elastic member so as to face the chip mounting area. A pressure piece erected on the lower mold base by avoiding the connection plate on the outer peripheral side of the chip pressing piece, and a clamper supported by the connection plate on the outer peripheral side of the pressure piece, The mold resin may be accommodated in a recess formed by being surrounded by the pressure piece provided between the chip pressing piece and the clamper.
As a result, the variation in the height of the chip is absorbed by the second elastic member that urges the chip holding piece, and the mechanical stress acting on the workpiece when the mold is closed is absorbed by the first elastic member and the second elastic member. Therefore, excessive mechanical stress does not act on the chip.

A plurality of the recesses may be provided in a cavity area other than the chip mounting surface of the work area.
As a result, depending on the form of the workpiece (circular, rectangular, etc.) and the layout of the chip mounted on the substrate, mold resin is supplied to the area other than the chip mounting surface, and the gap between the chips is pressurized and filled. can do.

A mold mold for resin-molding a workpiece having a plurality of chips mounted on a substrate with the surface of each chip exposed, and a lower mold for holding the substrate with the chip mounting surface facing upward, and the workpiece A chip pressing piece supported opposite to the chip mounting area, an elastic member that supports the chip pressing piece spaced apart from a support portion, and a recess that accommodates a mold resin formed around the chip pressing piece. The upper mold and the lower mold are closed, the volume of the concave portion is relatively reduced while the chip is held by the chip pressing piece while the upper mold and the lower mold are closed, and the work corresponding to the concave portion is reduced. The mold resin supplied above is filled while pressing the gap between the chips.
Accordingly, the mold resin and the film can be transferred to the lower clamp surface at the same time and transferred efficiently. In addition, the volume of the concave portion is relatively reduced while the chip mounted on the work held on the upper clamp surface is pressed by the chip pressing piece while the upper die and the lower die are closed, and is accommodated in the concave portion. Since the mold resin is filled while pressurizing the gaps between the chips, it is possible to perform the exposure molding while keeping the chip surface uniformly pressed.

The upper die is a connecting plate supported by being suspended from the upper die base by a first elastic member, and a chip pressing piece supported by the second elastic member while being suspended from the connecting plate by facing the chip mounting area. A pot block having a through hole supported by the connecting plate on the outer peripheral side of the chip pressing piece, a plunger supported by the upper mold base and inserted into the through hole, and the work on the outer peripheral side of the pot block. It may have a clamper for clamping, and the mold resin supplied onto the workpiece may be accommodated in the through hole of the pot block facing.
As a result, the second elastic member absorbs variations in the pressing force of the chip pressing piece that holds the chip, and mechanical stress acting on the workpiece when the mold is closed is absorbed by the first elastic member and the second elastic member. Excessive mechanical stress will not be applied to this.

  In a resin molding apparatus that molds a workpiece having a plurality of chips mounted on a substrate with each chip surface exposed, an upper mold that holds the substrate with the chip mounting surface facing down, A lower mold in which a chip pressing piece supported to face the chip mounting area, an elastic member that supports the chip pressing piece spaced apart from a support portion, and a recess that accommodates a mold resin around the chip pressing piece The mold resin is supplied to the recess while being superimposed on the lower mold clamping surface while the mold resin is accommodated on the film, and the chip holding piece is moved while closing the upper mold and the lower mold. The volume of the recess is relatively reduced while being pressed against the workpiece through the film, and the mold resin accommodated in the recess is inserted into the chip. Wherein the filling under pressure into the gap.

As a result, the lower mold in which the work is held on the lower mold clamping surface and the mold resin is provided on the substrate, and the upper mold is closed while the film is adsorbed and held on the upper mold clamping surface, and mounted on the work. With the chip pressed by the chip pressing piece through the film, the volume of the concave portion can be relatively reduced, and the mold resin accommodated in the concave portion can be filled while pressing the gap between the chips. Therefore, exposure molding can be performed while the chip surface is uniformly pressed. Further, by covering the chip surface with a film, it is possible to mold while preventing variations in height and preventing intrusion of mold resin.
Furthermore, an optimal mold can be selected according to the form of the workpiece, and resin molding can be performed with the chip surface exposed. For example, a processor unit such as a GPU and a semiconductor chip having a different height such as an HBM are arranged close to each other, and an FPGA (Field-Programmable) having a SIP (System In Package) structure in which the chips are connected by high-density wiring. Gate Array) can realize high-quality package molding.
The film is preferably a release film or a porous film. In the case of a porous film, air can be released without allowing mold resin to enter, so that molding quality can be improved by releasing air mixed in the mold resin or generated gas under reduced pressure. .

Also, a transport tool for transporting the mold resin together with the film into the cavity area of the mold, and the transport tool body has a through hole for resin injection corresponding to the outside of the chip mounting area in the cavity area, It has a resin accommodating part which hold | maintained the film on the lower surface of the said conveyance tool main body, and the lower end opening of the said through-hole was block | closed.
By using the above conveying tool, the mold resin is delivered to the lower mold clamping surface, and the mold resin accommodated in the resin accommodating portion is dropped into the recess around the chip pressing piece, thereby efficiently supplying the mold resin and the film. be able to.

  In the resin molding method, a resin containing portion in which a through hole for resin charging is perforated outside the chip mounting area in the transport tool body, a film is held on one surface of the transport tool body, and a lower end opening of the through hole is blocked A step of preparing a carrier having a mold, a step of carrying the carrier containing the mold resin in the resin containing portion into a lower mold of a mold mold opened, and a work having a plurality of chips mounted on the substrate A step of adsorbing and holding the substrate with the chip mounting surface facing down on the upper clamp surface of the mold, a chip pressing piece disposed opposite to the chip mounting area of the workpiece, and a mold resin formed around the chip holding piece A step of aligning the resin accommodating portion and the concave portion on a lower mold clamping surface in which a concave portion for accommodating the concave portion is formed, and superimposing the conveying tool through the film; and the conveying tool book Releasing the film and starting the suction of the film by the chip presser and the lower mold clamper to deliver the film to the lower mold surface and dropping the resin container into the recess; and Removing and closing the upper mold and the lower mold to form a decompressed space in the mold; and a mold closing operation to advance the chip pressing piece against the chip through the film And a step of relatively reducing the volume of the concave portion and filling the mold resin accommodated in the concave portion while pressurizing the gap between the chips.

  Accordingly, the mold resin and the film can be efficiently supplied by transferring the film to the lower mold clamping surface by the conveying tool and dropping the mold resin accommodated in the resin accommodating portion into the recess around the chip pressing piece. In addition, mold resin is supplied to areas other than the chip mounting area, and the mold resin is pressed and filled into the gaps between the chips while holding the chip mounting area through the film with the chip pressing piece, so that the chips with different heights can be used. The chip surface can be exposed and molded without applying excessive stress. At this time, since molding can be performed while pressing the mold resin, not only a narrow gap around the chip and a gap between stacked chips but also a chip mounted on a flip chip can be underfill molded.

  It is possible to provide a mold, a resin molding apparatus, and a resin molding method capable of resin molding by reliably exposing the surface of the chip. Moreover, the conveyance tool used for these apparatuses and methods and supplying a mold resin and a film efficiently can be provided.

It is sectional explanatory drawing of the mold metal mold | die which concerns on a 1st Example. FIG. 2 is a cross-sectional explanatory view of the mold after FIG. 1. FIG. 3 is a cross-sectional explanatory view of the mold following FIG. 2. FIG. 4 is a cross-sectional explanatory view of the mold after FIG. 3. FIG. 5 is a cross-sectional explanatory view of the mold after FIG. 4. FIG. 6 is a cross-sectional explanatory view of the mold after FIG. 5. FIG. 7 is a cross-sectional explanatory view of the mold after FIG. 6. It is a top view of a lower mold. It is a top view of a conveyance tool. It is a metal mold section explanatory view showing other examples of a chip press piece. FIG. 11A is a plan view showing another example of the conveying tool, and FIG. 11B is a perspective view showing the arrangement of the chip and the resin charging hole of the conveying tool. It is a top view which shows an example of a molded article. It is sectional explanatory drawing of the mold metal mold | die which concerns on a 2nd Example. FIG. 14 is a cross-sectional explanatory view of the mold following FIG. 13. It is a top view of a lower mold. It is sectional explanatory drawing of the mold metal mold | die which concerns on a 3rd Example. FIG. 17 is a cross-sectional explanatory view of the mold following FIG. 16. It is sectional explanatory drawing of the mold metal mold | die which concerns on 4th Example. It is a top view of the upper mold | type clamp surface of FIG. It is a top view of the conveyance tool of FIG. 18, and a lower mold | type clamp surface. It is a top view of the conveyance tool which concerns on another example, and a lower mold | type clamp surface. It is a top view of the conveyance tool which concerns on another example, and a lower mold | type clamp surface. It is a top view of the conveyance tool which concerns on another example, and a lower mold | type clamp surface. It is sectional explanatory drawing of the mold metal mold | die which concerns on 5th Example. It is a top view of the conveyance tool of FIG. 25, and a lower mold | type clamp surface. It is sectional drawing of the mold metal mold | die which concerns on 6th Example, and the top view of an upper mold | type clamp surface. It is a top view of the conveyance tool of FIG. 26, and a lower mold | type clamp surface.

  Hereinafter, an embodiment for carrying out the invention will be described in detail with reference to the accompanying drawings. In addition, when it is called a mold die, it shall point out the upper mold | type and lower mold | type respectively supported by the mold base, and shall point out the thing except a mold opening / closing mechanism. In addition, when referring to a resin molding apparatus, a mold and a mold opening / closing mechanism (an electric motor and a screw shaft, a toggle link mechanism, etc .; not shown) for opening and closing the mold are provided, and further, a resin conveying apparatus or a work conveying apparatus, molding It is an apparatus provided with at least 1 or more of a subsequent workpiece carrying-out apparatus. In the case of resin transfer transfer molding for transferring a work loader 4 and a transfer tool 5 to be described later, a transfer mechanism for operating a plunger inserted in the pot, a pressure reducing mechanism for forming a reduced pressure space in the mold when the mold is closed, etc. It shall be provided. Hereinafter, the configuration of the mold will be mainly described. In addition, the work W is made of an interposer substrate (semiconductor wafer, resin substrate, etc.) on which a large number of semiconductor chips such as processors and HBM are mounted, as well as an interposer substrate (semiconductor wafer, resin substrate, etc.) on which MEMS chips are mounted. The case where it molds is assumed. As an example, the mold will be described assuming that the lower mold is a movable mold and the upper mold is a fixed mold, but the upper mold may be a movable mold and the lower mold may be a fixed mold, or both may be movable molds.

The workpiece W includes a substrate K and a chip T, and the chip T is electrically connected to the substrate K (flip chip connection or the like). The chip T includes a semiconductor chip and a functional component such as a MEMS chip. The above-described semiconductor chip, MEMS chip, or the like has been exemplified as the chip T that needs to be exposed. However, the present invention is not limited to these. The chip T indicates the entire mounted component of the substrate K that needs to be exposed.
In the following, the case where the chip T is sandwiched and formed using the film F will be described, but the film F is not necessarily a necessary member and may be omitted.

[First embodiment]
FIG. 1 is a cross-sectional explanatory view of a mold 1. The work W is mounted with a plurality of chips T by arranging a processor chip such as GPU and an HBM chip around it on a silicon wafer substrate K on which a wiring pattern such as φ300 mm TSV is formed. The mold 1 includes an upper mold 2 (first mold) and a lower mold 3 (second mold), and the workpiece W is resin-molded with the surface of each chip T exposed.

  In FIG. 1, the upper mold | type 2 equips the upper mold | type clamp surface 2a with the workpiece | work adsorption | suction part 2b. A suction hole 2m (see FIG. 10) is vacant in the work suction part 2b and is connected to a suction mechanism. The workpiece W is carried into the mold 1 opened by the workpiece loader 4 and the upper surface of the workpiece W is sucked. The lower die 3 is formed with a chip pressing piece 3d disposed opposite to the chip mounting area of the workpiece W and a recess 3i that accommodates a mold resin R formed therearound.

Hereinafter, a configuration example of the mold 1 will be specifically described.
The upper mold 2 is provided with an upper mold block 2B overlaid on an upper mold base 2A. A work suction portion 2b is provided on the upper clamp surface 2a of the upper block 2B. The workpiece suction portion 2b is provided with suction holes 2m (see FIG. 10) at a plurality of locations. Each suction hole 2m is connected to a suction mechanism (not shown). The workpiece W is transferred to the upper mold 2 from the work loader 4 with the chip T mounting surface facing downward, and is sucked and held by the work sucking portion 2b (see FIG. 2). The workpiece W is attracted to the mold 1 by suction, but is not limited to suction, and may be fixed by a clamp mechanism.

  In the lower mold 3, the connecting plate 3B is supported in a floating manner by a plurality of first coil springs 3a (first elastic members) provided on the lower mold base 3A. On the lower mold base 3A, a first pressurizing piece 3b that pressurizes the mold resin R when the connecting plate 3B relatively moves due to the bending of the first coil spring 3a is provided upright. A chip pressing support portion 3c is provided on the connecting plate 3B so as to face the chip mounting area E. A hanging pin 3e connected to the lower surface of the chip pressing piece 3d is inserted into the chip pressing support portion 3c. The lower end portion of each suspension pin 3e is urged by a second coil spring 3f (second elastic member), and the chip pressing piece 3d is floatingly supported with respect to the chip pressing support portion 3c. For this reason, the upper surface of the chip pressing piece 3d is supported so as to be higher than the bottom surface of the recess 3i.

As shown in FIG. 8, the chip pressing piece 3d is divided and formed according to the arrangement of the opposing chips T, and the chip pressing piece 3d divided into small block shapes is the second coil spring shown in FIG. Each is biased by 3f and is supported away from the chip pressing support portion 3c. The chip pressing piece 3d may be movable for each chip, but may be movable for each group for each functioning product. In the case of a normal IC chip arranged in a matrix, the chip pressing pieces 3d are arranged in a matrix according to the work. The height of the upper surface of the chip pressing piece 3d may be the same as or slightly higher than the height of the upper surface of the lower mold clamper 3h. If slightly higher, the total thrust of the second coil spring 3f of the chip pressing piece 3d needs to be set to be weaker than the total thrust of the first coil spring 3a. Further, as shown in FIG. 1, the second pressure piece 3g is supported and fixed through the connecting plate 3B so as to overlap the first pressing piece 3b on the outer peripheral side of the chip pressing support portion 3c (the connecting plate 3B). In the case of a rod-shaped, the first pressure piece 3b or the second pressure piece 3g may be stacked across the rod-shaped connecting plate 3B. It is only necessary to stand on the base 3A). The supply amount of the mold resin R can be adjusted by changing the total height of the first pressure piece 3b and the second pressure piece 3g. The first pressure piece 3b and the second pressure piece 3g may be integrally formed. A lower clamper 3h is supported on the connecting plate 3B on the outer peripheral side of the second pressure piece 3g. As will be described later, the mold resin R is accommodated in a recess 3i formed by being surrounded by a second pressure piece 3g provided between the chip pressing piece 3d and the lower mold clamper 3h. As will be described later, a suction hole 3n (see FIG. 10) for sucking and holding the film F is provided on the clamp surface of the lower mold clamper 3h, and is connected to a suction mechanism (not shown). In FIG. 8, a lower outer wall 3k (see FIG. 5) surrounding the outer periphery of the lower mold clamper 3h is shown. A sealing material 8 may be provided on the end surface of the lower outer wall 3k.
The chip pressing piece 3d is divided into small blocks as shown in FIG. 8, but may be formed as a single block as shown in FIG. In this case, the chip pressing piece 3d needs to have a plurality of suction holes 3n for sucking and holding the film F.

The mold resin R is transported by the transport tool 5 as shown in FIG. As shown in FIG. 9, the transport tool 5 is provided with a plate-shaped transport tool body 5a and a through hole 5b corresponding to the recess 3i.
As shown in FIG. 1, the carrier body 5a is provided with suction holes 5d (see FIG. 10) and connected to a suction mechanism (not shown). The suction hole 5d may be a suction groove. A film F having a size slightly larger than the size covering the workpiece W is sucked and held on the lower surface side of the transport tool body 5a. The film F does not necessarily have to be attracted to the lower surface of the transport tool 5 by suction. Even if the film F is mechanically gripped and stretched to cover the lower surface of the transport tool 5, the through hole 5b is blocked. good. Therefore, the lower end opening of the through-hole 5b of the transporting tool 5 is covered with the film F, and the resin accommodating portion 5c is formed.

  Note that the through hole 5 b provided in the transport tool 5 does not necessarily have a shape along the outer diameter of the recess 3 i provided in the lower mold 3. For example, as shown in FIGS. 11A and 11B, a through hole 5b having an arbitrary shape (for example, a round hole) may be provided in addition to the chip mounting area E (see FIG. 11B). In this case, the second pressure piece 3g may also have a round shape. Thus, it is not necessary to make all the planar spaces excluding the chip pressing piece 3d from the cavity area shape as the second pressure piece 3g. Conversely, the second pressurization piece 3g may be arranged in all plane spaces excluding the chip pressing piece 3d from the cavity area shape. In this case, the mold resin R may be selectively supplied from the transport tool 5 onto the second pressure piece 3g. In addition, in order to make it easier to inject the mold resin R onto the second pressure piece 3g than the conveying tool 5, it is preferable that the shape (recess 3i) of the second pressure piece 3g is larger than the through hole 5b. Further, the outer shape of the carrier 5 may be a rectangular shape as shown in FIG. 11A or a circular shape as shown in FIG. 11B.

  As shown in FIG. 1, in a mold 1 that has been opened, a transport tool 5 in which a mold resin R (granular resin, powder resin, liquid resin, solid resin) is accommodated in a resin accommodating portion 5c is provided by a resin loader (not shown). It is brought in. As shown in FIG. 2, the transport tool 5 aligns the through hole 5 b and the recess 3 i of the lower mold 3 and overlaps the lower mold clamping surface. Then, the film adsorption (holding) on the conveying tool 5 side is released, and the film F is delivered by starting the adsorption of the lower clamp surface, and the mold resin R is supplied to the recess 3i (see FIG. 3). Since the chip pressing piece 3d and the lower mold clamper 3h are supported at the same height and are surrounded by these to form a recess 3i, the recess can be formed without spilling the mold resin R stored in the resin storage portion 5c. 3i is certainly delivered. Further, since the molding resin R is not placed on at least the chip pressing piece 3d, the molten molding resin R does not enter the chip surface.

  As the film F, for example, a release film (sheet-fed film) having a thickness of about 50 μm and having heat resistance is used. The release film is easily peeled off from the mold surface, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film, polyvinyl chloride, etc. A single layer or a multi-layer film mainly composed of is preferably used. As a result, it is possible to cover the surface of the chip T and absorb variations in height, and to prevent the mold resin R from entering the chip surface and perform exposure molding.

  Further, the film F may be a filtration film-like porous film that does not allow moisture or the like to escape and escapes moisture and air, such as Poeflon (trade name), microporous film, and the like. Further, in the case of a porous film, air can be released without allowing the mold resin R to enter, so that the molding quality is improved by releasing the air mixed in the mold resin R and the generated gas under a reduced pressure environment. be able to.

Here, the molding operation of the mold 1 will be described with reference to FIGS. As shown in FIG. 1, a transporting tool 5 is prepared in which a plate-shaped transporting tool body 5a has a through hole 5b for resin charging outside the chip mounting area, and sucks and holds a film F that closes the lower end opening of the through hole 5b. To do.
An amount of mold resin R required for one molding is measured and stored in the resin storage portion 5c of the transport tool 5. In the case where the mold resin R is a granular resin or a powder resin, it is desirable to melt the resin surface by preheating so that dust does not rise during conveyance.

As shown in FIG. 1, a work W on which a plurality of chips T are mounted on a substrate K is held in a work loader 4 and is carried into a mold 1 opened. The work loader 4 sucks and holds the substrate K on the work suction portion 2b with the work W facing the upper mold clamping surface 2a and the chip mounting surface facing downward. In addition, the transfer tool 5 in which the mold resin R is accommodated in the resin accommodating portion 5c is carried into the lower mold 3 of the mold 1 with the mold opened by a resin loader (not shown).
Any of the work W, the mold resin R, and the film F may be carried in before or after, or simultaneously.

  As shown in FIG. 2, the resin holding portion 5c and the concave portion 3i are aligned with the chip pressing piece 3d of the lower die 3 and the lower mold clamping surface in which the concave portion 3i is formed around the chip holding piece 3d. Through the lower clamp surface. At this time, since the chip pressing piece 3d is set to be the same as or slightly higher than the lower mold clamper 3h, the planar shape of the resin containing portion 5c and the planar shape of the recess 3i overlap with the film F interposed therebetween.

  As shown in FIG. 3, the film suction of the carrier body 5a is released (the holding is released), and the suction of the film F by the chip pressing piece 3d and the lower mold clamper 3h is started, so that the film F is placed on the lower mold clamping surface. Pass to. At this time, since the chip pressing piece 3d is set to be the same as or slightly higher than the lower mold clamper 3h, the mold resin R is reliably delivered. There is a suction hole (not shown) in each gap of the recess 3i between the lower mold clamper 3h and the second pressurizing piece 3g and / or the chip pressing piece 3d. Following the shape, it is supplied to the lower mold 3 together with the mold resin R. At this time, the resin container 5c is dropped into the recess 3i, and the film F is sucked and held. Thereby, the film F is delivered to the lower mold clamping surface by the conveying tool 5 and the mold resin R accommodated in the resin accommodating portion 5c is dropped into the concave portion 3i around the chip pressing piece 3d, whereby the mold resin R and The film F can be supplied efficiently and reliably.

  As shown in FIG. 4, the work loader 4 is retracted from the mold 1, and the transfer tool 5 is held by a resin loader (not shown) and removed from the lower mold 3. The transport tool 5 may be transported by a dedicated transport means without being removed by the resin loader.

  Next, as shown in FIG. 5, the upper mold 2 and the lower mold 3 are closed to form a reduced pressure space in the mold. For example, the upper outer wall 2c provided on the upper mold base 2A and the lower outer wall 3k provided on the lower mold base 3A overlap each other to seal the mold space with the sealing material 8, and the suction hole 3m provided on the lower outer wall 3k. A reduced pressure space is formed by air suction. In addition, you may make it pinch | interpose through the sealing material between the end surfaces of the upper outer wall 2c and the lower outer wall 3k.

  When the mold closing operation proceeds as shown in FIG. 6, the lower mold clamper 3 h moves the workpiece W (outer peripheral portion of the substrate K) through the film F while the chip T and the chip pressing piece 3 d are pressed through the film F. Clamp. At this time, even if there are variations in the height of the plurality of chips T, the second coil spring 3f that biases the film F and the chip pressing piece 3d bends, so that excessive stress does not act on the chips T. Pressed down by the thickness. The second coil spring 3f starts to bend from the state in which the chip pressing piece 3d is pressed against the chip T. Further, the first coil spring 3a starts to bend when the lower mold clamper 3h is pressed against the workpiece W via the film F, and continues to bend to the final clamp position, thereby acting on the chip T in the mold closing operation. To escape the stress. Further, the first coil spring 3a is bent, so that the height position of the second pressure piece 3g with respect to the connecting plate 3B is relatively high, and the mold is heated and melted in the recess 3i by the second pressure piece 3g. The resin R begins to enter the chip mounting area E (see FIG. 11B). In addition, since a heater (not shown) is mounted on the mold, the mold resin R is heated and melted.

  As shown in FIG. 7, when the mold closing progresses, the lower mold 3 moves upward while the work W and the chip pressing piece 3d are pressed through the film F, so that the relative position of the second pressure piece 3g is increased. Further rises to relatively reduce the volume of the recess 3i. At this time, the mold resin R accommodated in the recess 3i is filled while being pressed into a gap between chips of the work W and a gap corresponding to an underfill part under the chip (hereinafter collectively referred to as “gap”). Further, when the pressing force is increased by closing the mold, the connecting plate 3B is pushed down to the final clamp position against the bias of the first coil spring 3a. Thus, the mold resin R which has been melted while the workpiece 2 is clamped at the final clamping position by the upper mold 2 and the lower mold 3 is heat-cured.

  Therefore, when pressing and filling the mold resin R into the gap between the workpieces W while pressing the chip mounting area through the film F by the chip pressing piece 3d, the chip surface is not subjected to excessive stress. Can be exposed and molded. Further, since the molding resin R can be molded while being pressed, not only a narrow gap around the chip but also a chip T mounted on a flip chip can be underfill molded.

  The workpiece W after molding is shown in FIG. FIG. 12A shows a molded workpiece W. The workpiece W is molded with the gap between the chips T and the gap between the substrate K and the chip T covered with the mold resin R while the surface of each chip T is exposed. The molded workpiece W is diced into a plurality of exposed chips T in units of functional units to produce individual semiconductor devices. FIG. 12B shows a plurality of chips T diced in units of functional units.

In this manner, the volume of the recess 3i is relatively reduced while the chip pressing piece 3d is pressed against the work W (chip T) through the film F while closing the upper mold 2 and the lower mold 3, and the recess The mold resin R accommodated in 3i is filled in the gap between the workpieces W while being pressed, thereby exposing the surface of the chip W and filling the gap between the chips and the gap between the chip and the substrate K with the mold resin R. Can do.
At this time, while pressing the chip T through the film F by the chip pressing piece 3d, the resin pressure is applied to the mold resin R while releasing the excessive clamping pressure by the elastic members (the second coil spring 3f and the first coil spring 3a). Since the gap is filled, the resin can be prevented from entering the chip surface without applying excessive mechanical stress to the chip T, and the mold resin R can be pressurized and filled into the gap of the chip T.

[Second Example]
Next, a second embodiment of the mold 1 will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals, and the description will be referred to.
In the first embodiment, a granule resin is used as the mold resin R, but a solid resin (tablet resin) may be used as shown in FIG. An amount of mold resin R necessary for one molding is accommodated in the resin accommodating portion 5c of the transport tool 5. A transporter 5 in which the mold resin R is accommodated in the resin accommodating portion 5c is carried into the lower mold 3 of the mold 1 with the mold opened by a resin loader (not shown).

  As shown in FIG. 13, the resin container 5 c and the recess 3 i are aligned with the chip pressing piece 3 d of the lower mold 3 and the lower mold clamping surface in which the recess 3 i is formed around the chip holding piece 3 d, and the film F of the carrier 5 is attached. The suction of the film F on the carrier body 5a is canceled by superimposing it on the lower mold clamping surface, and the film F is clamped by starting the suction of the film F by the chip pressing piece 3d and the lower mold clamper 3h. Hand it over to the surface. At this time, the film F is sucked and held following the recess 3i by sucking the recess 3i. As a result, the film F is delivered to the lower mold clamping surface by the conveying tool 5 and the mold resin R accommodated in the resin accommodating part 5c is dropped into the recess 3i and can be delivered efficiently and reliably. FIG. 15 shows a state in which the mold resin R (tablet resin) is dropped into the recess 3 i provided in the lower mold 3. Note that the tablet drop position is an example, and is not limited to the form shown in FIG. In FIG. 15, there is a chip pressing piece 3 d in the wafer-shaped circular cavity area, and all except the chip pressing piece 3 d in the cavity area becomes the second pressing piece 3 g, and the tablet-like resin R is partially placed thereon. Although it is a figure, it is not necessary for all to be the 2nd pressurization piece 3g, For example, as shown by the code | symbol with a parenthesis in FIG. 15, it is good also considering only the injection | throwing-in place of the tablet-shaped resin R as a 2nd pressurization piece (3g). (In other words, the arrangement may be such that the tablet-shaped resin R and the second pressure piece 3g (recess 3i) are interchanged). In this case, the other part of the second pressure piece (3g) becomes a recess (3s) and is supported higher than the bottom of the support part 3c, and the height at which the same gap as the underfill height is formed when the mold is closed. (Depth) is desirable. The height of the recess (3s) is not necessarily the height for underfill molding, and may be the same as the chip height.

  FIG. 14 shows a state where the mold closing of the upper mold 2 and the lower mold 3 is completed, and the molten resin is heated and cured while the workpiece W is clamped at the final position. At this time, the resin pressure is applied to the mold resin R while releasing the excessive clamping pressure by the elastic members (the second coil spring 3f and the first coil spring 3a) while pressing the chip F through the film F by the chip pressing piece 3d. However, since the gap is filled, the resin can be prevented from entering the chip surface without applying excessive mechanical stress to the chip T, and the mold resin R can be pressurized and filled in the gap around the chip T.

[Third embodiment]
Next, a third embodiment of the mold 1 will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof is used. Hereinafter, different configurations will be mainly described. In the first and second embodiments, the workpiece W is supported on the upper mold 2 and the film F and the molding resin R are supported on the lower mold 3, but this embodiment employs a configuration that is vertically inverted. .

  In FIG. 16, the lower mold 3 is provided with a lower mold block 3 </ b> C overlaid on a lower mold base 3 </ b> A. A work suction portion 3q is provided on the lower mold clamping surface 3p of the lower mold block 3C. The work suction part 3q is provided with a plurality of suction holes (not shown) for sucking the work W, and these are connected to a suction mechanism (not shown). The workpiece W is held by suction by the workpiece suction portion 3q with the chip T mounting surface facing upward. Further, a mold resin R (solid resin; tablet resin) is supplied outside the chip mounting area E (see FIG. 11B) of the substrate K.

  In the upper mold 2, the connecting plate 2 </ b> C is supported by being suspended by a plurality of first coil springs 2 d (first elastic members) provided on the upper mold base 2 </ b> A. On the upper mold base 2A, a plunger 2D is suspended and supported so as to face a mold resin R (solid resin) supplied onto the substrate K. A chip pressing support portion 2e is provided on the coupling plate 2C so as to face the chip mounting area E (see FIG. 11B). A hanging pin 2f is inserted into the chip pressing support portion 2e, and a chip pressing piece 2g is connected to the lower end of the hanging pin 2f. A second coil spring 2h (second elastic member) is provided between the connecting plate 2C and the upper end of the suspension pin 2f. The chip pressing piece 2g is suspended and supported by the chip pressing support portion 2e by the second coil spring 2h. As in the lower mold 3 in FIG. 8, the chip pressing piece 2g is divided and formed according to the opposing chip T, and the chip pressing pieces 2g divided into small block shapes are respectively formed on the second coil springs 2h. It is urged and supported away from the chip pressing support 2e.

A pot block 2i is suspended and supported by a coil spring 2j on the connecting plate 2C on the outer peripheral side of the chip pressing support 2e. The lower end portion of the plunger 2D is slidably inserted into the cylindrical hole of the pot block 2i. When the mold 1 is closed, the mold resin R (solid resin) supplied to the substrate K is accommodated in the cylindrical hole of the pot block 2i. An upper clamper 2k is supported on the connecting plate 2C on the outer peripheral side of the pot block 2i. The upper mold clamping surface (pot block 2i, upper mold clamper 2k) is provided with a suction hole for sucking and holding the film F, and is connected to a suction mechanism (not shown). The pot block 2i may be supported higher in the height direction than the chip pressing support 2e and may be a part of the cavity recess.
The chip pressing piece 2g is divided into small blocks as shown in FIG. 8, but may be formed as a single block as shown in FIG. Further, it may be a block having a middle size and a group for each of a plurality of chips or for each functional chip. In this case, the chip pressing piece 2g needs to have a plurality of suction holes (see FIG. 10) for sucking and holding the film F.

  As shown in FIG. 16, the film F is adsorbed and held on the upper mold clamping surface provided with the chip pressing piece 2g of the upper mold 2 and the pot block 2i and the upper mold clamper 2k provided therearound, and the mold resin R is lowered. Mold resin R (solid resin) is supplied onto the substrate K of the work W sucked and held by the work sucking portion 3q of the mold 3. The film F and the mold resin R may be supplied separately, but may be supplied all at once by a resin loader.

  FIG. 17 shows a state in which the mold closing of the upper mold 2 and the lower mold 3 is completed and the molten resin is heated and cured while the workpiece W is clamped at the final position. The plunger 2D inserted into the pot block 2i is relatively moved and pressurizes the mold resin R to fill the gap of the workpiece W. The pot block 2i may have a height at which the entire bottom surface flows through the chip T (the gap height between the chip T and the substrate K is ideal), but a recess serving as a runner is partially formed. Also good. At this time, the resin pressure is applied to the mold resin R while releasing the excessive clamping pressure by the elastic members (second coil spring 2h and first coil spring 2d) while holding the chip T through the film F by the chip pressing piece 2g. However, since the gap is filled, the resin can be prevented from entering the chip surface without applying excessive mechanical stress to the chip T, and the mold resin R can be pressurized and filled in the gap of the chip T.

[Fourth embodiment]
Next, a fourth embodiment of the mold 1 will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof is used. Hereinafter, different configurations will be mainly described. In the first embodiment, the substrate K on which the chip T is mounted is assumed to be a circular silicon wafer as the workpiece W, but may be a rectangular resin substrate or the like. Moreover, although the recessed part which accommodates mold resin R was provided in the cavity area from the 1st Example to the 3rd Example, the recessed part does not necessarily need to be provided in a cavity and is provided in the outer side of the workpiece | work W outside a cavity. The case is shown as an example. In the case of a wafer, since the end face is particularly chamfered, it is necessary to provide a recess in the cavity. However, in the case of a substrate, since the end face is not chamfered as compared to the wafer, it is possible to provide a recess outside the cavity. .

  FIG. 18 shows a cross-sectional configuration of the mold 1. As shown in FIG. 19, the upper die 6 is provided by engraving a workpiece suction portion 6 b corresponding to the outer shape of the workpiece W on the upper die clamping surface 6 a. As shown in FIG. 19, a plurality of suction holes 6c are provided in the work suction portion 6b along the outer peripheral portion, and are connected to a suction mechanism (not shown). As shown in FIG. 18, the workpiece W is sucked and held by the workpiece suction portion 6b with the chip mounting surface facing downward.

  In FIG. 18, the lower die 7 is supported by the lower die base 7 </ b> A in a floating manner so as to face the chip mounting area E (see FIG. 11B) via a coil spring 7 a (elastic member). An annular lower clamper 7c is floatingly supported by a coil spring 7d around the chip pressing piece 7b. The lower mold clamper 7c is provided with a pot hole (through hole) 7e. In the pot hole 7e, a plunger 7B that is supported upright on the lower mold base 7A is inserted. As shown to FIG. 20A, the pot hole 7e and the plunger 7B are each provided in multiple places (for example, 3 places) along the opposing side (short side) of the rectangular work area L (range in which the workpiece | work W is mounted). Yes.

  As shown in FIG. 20A, an annular lower mold cull 7f is engraved around the pot hole 7e on the clamp surface side of the lower mold clamper 7c, and the lower mold runner gate 7g connected to the lower mold cull 7f is connected to the chip pressing piece 7b. It is carved toward. Also, suction holes for adsorbing the film F are provided around the outer periphery of the chip pressing piece 7b forming the lower mold clamping surface, the work area outer periphery of the lower mold clamper 7c, and the lower mold cull 7f and the lower mold runner gate 7g. A plurality of 7h are provided and connected to a suction mechanism (not shown).

  The film F and the mold resin R are transported by the transport tool 5 as shown in FIG. As shown in FIG. 20B, the transport tool 5 is provided with a plate-shaped transport tool body 5a and a through hole 5b corresponding to the pot hole 7e. The transport tool body 5a is provided with a plurality of suction holes 5d along a portion corresponding to the outer shape of the workpiece and the periphery of the through hole 5b, and these are connected to a suction mechanism (not shown). The suction hole 5d may be a suction groove or both of them as necessary. A film F having a size covering the workpiece W is sucked and held on the lower surface side of the transport tool body 5a. Thereby, as shown in FIG. 18, the lower end opening of the through-hole 5b of the transport tool 5 is covered with the film F, and the resin accommodating part 5c is formed.

Here, another example of the lower mold 3 and the conveying tool 5 will be described with reference to FIGS. FIG. 21 shows another example of the layout arrangement of the pot holes 7e provided in the lower mold clamper 7c and the through holes 5b of the transport tool 5. In FIG. 21A, pot holes 7e may be provided in a pair of diagonal portions of the rectangular work area L of the lower clamper 7c. This is advantageous in that the resin flows from a pair of diagonal portions and the air and the resin having a large amount of initial impurities flow to the other diagonal portions. An annular lower mold cull 7f is engraved around the pot hole 7e, and a lower mold runner gate 7g connected to the lower mold cull 7f is engraved toward the chip pressing piece 7b. A plurality of suction holes 7h for sucking the film F are provided at the outer periphery of the work area L of the lower mold clamper 7c and around the lower mold cull 7f and the lower mold runner gate 7g. In addition, the pot hole 7e may be further provided in another pair of diagonal part, and may be one.
As shown in FIG. 21B, the transport tool main body 5a of the transport tool 5 is provided with a through hole 5b corresponding to the pot hole 7d shown in FIG. 21A. The transport tool body 5a is provided with a plurality of suction holes 5d along the part corresponding to the workpiece outer shape and the periphery of the through hole 5b.

Another example of the lower mold 7 and the conveying tool 5 will be described with reference to FIG. FIG. 22 shows another example of the layout arrangement of the pot holes 7e provided in the lower mold clamper 7c and the through holes 5b of the conveying tool 5. In FIG. 22A, pot holes 7d may be provided in a plurality (for example, three locations) along adjacent sides (long side and short side) of the rectangular work area L of the lower mold clamper 7c. This is advantageous in that the mold resin R flows at a corner that is diagonally opposite to the corners of adjacent sides, and the resin with a large amount of air and initial impurities flows. An annular lower mold cull 7f is engraved around the pot hole 7e, and a lower mold runner gate 7g connected to the lower mold cull 7f is engraved toward the chip pressing piece 7b. A plurality of suction holes 7h for sucking the film F are provided on the outer periphery of the rectangular work area L of the lower mold clamper 7c and around the lower mold cull 7f and the lower mold runner gate 7g. The pot hole 7e may be further provided along other adjacent sides (long side and short side).
As shown in FIG. 22B, the transport tool main body 5a of the transport tool 5 is provided with a through hole 5b corresponding to the pot hole 7d shown in FIG. 22A. The transport tool body 5a is provided with a plurality of suction holes 5d along the part corresponding to the workpiece outer shape and the periphery of the through hole 5b.

Another example of the lower mold 7 and the conveying tool 5 will be described with reference to FIG. FIG. 23 shows another example of the layout arrangement of the pot holes 7e provided in the lower mold clamper 7c and the through holes 5b of the transport tool 5. In FIG. 23A, pot holes 7e may be provided in parallel to each side (long side and short side) of the rectangular work area L of the lower clamper 7c. In this case, it is possible to easily use powder and granular resin other than the resin tablet. Although the pot holes 7e are provided on all the sides, any one may be selectively provided. A plurality of lower runner gates 7g are carved into each pot hole 7e toward the chip pressing piece 7b. A plurality of suction holes 7h for sucking the film F are provided on the outer periphery of the rectangular work area L of the lower mold clamper 7c and around the lower mold runner gate 7g.
As shown in FIG. 23B, a through-hole 5b corresponding to the pot hole 7d shown in FIG. 23A is provided in the transport body 5a of the transport tool 5. The transport tool body 5a is provided with a plurality of suction holes 5d along the part corresponding to the workpiece outer shape and the periphery of the through hole 5b.

[Fifth Example]
Next, a fifth embodiment, which is a modification of the mold 1 (fourth embodiment) shown in FIG. 18, will be described with reference to FIGS. The same members as those in the fourth embodiment are designated by the same reference numerals, and the description thereof is used. Hereinafter, different configurations will be mainly described. The difference from the fourth embodiment is the form of the lower mold 7 and the carrier 5.
In FIG. 24, the upper die 6 has a workpiece adsorbing portion 6b corresponding to the outer shape of the workpiece W formed on the upper die clamping surface 6a. The workpiece W is sucked and held by the workpiece suction portion 6b with the chip mounting surface facing downward.

  As shown in FIG. 24, in the lower die 7, a chip pressing piece 7b is floatingly supported on a lower die base 7A by a coil spring 7a. The plunger 7B stands up and is supported in contact with the lower mold base 7A outside the chip pressing piece 7b. On the lower mold base 7A, an annular lower mold clamper 7c surrounding the chip pressing piece 7b and the plunger 7B is floating supported by a coil spring 7d. Between the lower mold clamper 7c and the chip pressing piece 7b, pot holes 7e (through holes) are formed on two opposite sides (short sides). A rectangular plunger 7B is inserted into the pot hole 7e.

As shown in FIG. 25A, the pot hole 7e is formed in a rectangular shape along the short side of the chip pressing piece 7b, and the plunger 7B is formed in a rectangular shape so as to slide along the pot hole 7e. .
Further, as shown in FIG. 25B, the transport tool main body 5a of the transport tool 5 is provided with a rectangular through hole 5b corresponding to the pot hole 7d shown in FIG. 25A. The transport tool main body 5a is provided with a plurality of suction holes (not shown) along a portion corresponding to the outer shape of the workpiece and the periphery of the through hole 5b. As shown in FIG. 24, the lower end opening of the through-hole 5b of the transport tool 5 is covered with the film F, so that the resin container 5c is formed.

[Sixth embodiment]
Next, a sixth embodiment, which is a modification of the mold 1 (fourth embodiment) shown in FIG. 18, will be described with reference to FIGS. The same members as those in the fourth embodiment are designated by the same reference numerals, and the description thereof is used. Hereinafter, different configurations will be mainly described. The difference from the fourth embodiment is the form of the lower mold 7 and the carrier 5.
In FIG. 26A, the upper die 6 has a workpiece suction portion 6b corresponding to the outer shape of the workpiece W formed on the upper die clamp surface 6a, and the workpiece W is sucked and held by the workpiece suction portion 6b with the chip mounting surface facing downward. . As shown in FIG. 26B, the workpiece W has chips T mounted on a rectangular substrate K in a matrix arrangement (for example, 3 rows and 6 columns).

  As shown in FIG. 26A, the lower mold 7 is supported in a floating manner by a coil spring 7a in a matrix arrangement with a chip holding piece 7b facing the chip T on a lower mold base 7A. A pressure piece 7i is supported and fixed on the lower die base 7A around the chip pressing piece 7b. On the lower mold base 7A, an annular lower mold clamper 7c surrounding the chip pressing piece 7b and the pressure piece 7i is floatingly supported by a coil spring 7d (see FIG. 27A).

As shown in FIG. 27A, the upper surface of the pressure piece 7i corresponding to the gap between the chip pressing pieces 7b corresponds to the pot into which the mold resin R is charged. The supply amount of the mold resin R can be adjusted by changing the height of the pressure piece 7i.
Further, as shown in FIG. 27B, the transport tool body 5a of the transport tool 5 is provided with a through hole 5b in a portion corresponding to the pressurizing piece 7i shown in FIG. 27A, and an island corresponding to the tip pressing piece 7b. (Plate material) exists. The transport tool main body 5a is provided with a plurality of suction holes (not shown) along a portion corresponding to the outer shape of the workpiece and the periphery of the through hole 5b. As shown in FIG. 26A, the lower end opening of the through-hole 5b of the transport tool 5 is covered with the film F to form the resin container 5c.

  The workpiece W described above is adsorbed and held on the upper mold clamp surface or the lower mold clamp surface. However, the workpiece W may be mechanically held by a claw or the like, or the adsorption and claw holding may be used in combination.

1 Mold Die K Substrate T Chip R Mold resin E Chip mounting area F Film L Work area 2,6 Upper mold 2A Upper mold base 2B Upper mold block 2D, 7B Plungers 2a, 6a Upper mold clamping surface 2b, 3q, 6b Workpiece Adsorption part 2c Upper outer wall 2d, 3a First coil spring 2e, 3c Tip holding support part 2f, 3e Hanging pin 2g, 3d Tip holding piece 2h, 3f Second coil spring 2i Pot block 2j, 7a, 7d Coil spring 2k Mold clamper 2m, 3j, 3n, 5d, 6c, 7h Suction hole 3, 7 Lower mold 3A, 7A Lower mold base 2C, 3B Connecting plate 3C Lower mold block 3b First pressure piece 3g Second pressure piece 7i Pressure Piece 3h, 7c Lower clamper 3i Recess 3k Lower outer wall 3m引孔 3p lower die clamping surface 4 workpiece loader 5 conveyance member 5a conveyance member body 5b through hole 5c resin receiving portions 7b chip retention piece 7e pot holes 7f lower mold cull 7g lower mold runner gate 8 sealing material

Claims (10)

A mold in which a workpiece having a plurality of chips mounted on a substrate is resin-molded by exposing the surface of each chip,
A first mold for supporting the workpiece;
A chip pressing piece disposed opposite to the chip mounting area of the workpiece; an elastic member that supports the chip pressing piece spaced apart from a support; and a recess that accommodates a mold resin around the chip pressing piece. With two molds,
While closing the first mold and the second mold, the volume of the recess is relatively reduced while the chip pressing piece is pressed against the chip, and the mold resin contained in the recess is A mold mold for filling a gap between chips while applying pressure.   The second mold includes a clamper that clamps the peripheral edge of the substrate, the chip pressing piece that is disposed opposite to the chip mounting area and presses the surface of each chip, and an elastic that supports the chip pressing piece while being spaced apart from a support portion. A pressure piece which is disposed in a cavity area surrounded by the member, the chip pressing piece and the clamper and which accommodates mold resin, and the clamper and the chip pressing piece are supported at the same height. The mold according to claim 1.   3. The mold according to claim 2, wherein the pressure piece disposed in the cavity area moves relatively to a height position that forms a gap for performing underfill molding on the workpiece in a mold-closed state.   The second mold includes a connection plate floatingly supported on a lower mold base by a first elastic member, and the chip pressing piece supported floating on the connection plate by a second elastic member so as to face the chip mounting area. A pressure piece erected on the lower mold base by avoiding the connection plate on the outer peripheral side of the chip pressing piece, and a clamper supported by the connection plate on the outer peripheral side of the pressure piece, The mold die according to any one of claims 1 to 3, wherein the mold resin is accommodated in a recess formed by being surrounded by the pressure piece provided between the chip pressing piece and the clamper. .   The mold according to any one of claims 1 to 4, wherein a plurality of the recesses are provided in a cavity area other than a chip mounting surface of a work area. A mold in which a workpiece having a plurality of chips mounted on a substrate is resin-molded by exposing the surface of each chip,
A lower mold for adsorbing and holding the substrate with the chip mounting surface facing upward;
A chip pressing piece supported to face the chip mounting area of the workpiece, an elastic member that supports the chip pressing piece spaced apart from a support portion, and a recess that accommodates a mold resin formed around the chip pressing piece And an upper mold formed with
The mold resin supplied to the work corresponding to the concave portion by relatively reducing the volume of the concave portion while holding the tip by the tip pressing piece while closing the upper die and the lower die. Is filled in the gap between the chips while being pressed.   The upper mold includes a connection plate that is suspended and supported on the upper mold base by a first elastic member, and the chip pressing piece that is suspended and supported on the connection plate by a second elastic member so as to face the chip mounting area. A pot block having a through hole supported by the connecting plate on the outer peripheral side of the chip pressing piece; a plunger supported by the upper mold base and inserted into the through hole; and the workpiece on the outer peripheral side of the pot block. The mold mold according to claim 6, further comprising: a clamper that clamps the mold block, wherein mold resin supplied onto the workpiece is accommodated in the through hole of the pot block facing the mold mold. A resin molding device that molds a workpiece having a plurality of chips mounted on a substrate by exposing the surface of each chip,
An upper mold for holding the substrate with the chip mounting surface facing downward;
A chip pressing piece supported opposite to the chip mounting area of the workpiece, an elastic member that supports the chip pressing piece spaced apart from a support portion, and a recess that accommodates a mold resin around the chip pressing piece are formed. With a lower mold,
The mold resin is supplied to the concave portion while being superimposed on the lower mold clamping surface while the mold resin is accommodated on the film, and the chip pressing piece is interposed through the film while closing the upper mold and the lower mold. The resin molding apparatus is characterized in that the volume of the concave portion is relatively reduced while being pressed against the workpiece, and the mold resin accommodated in the concave portion is filled while pressing the gap between the chips. A transport tool for transporting a mold resin together with a film into a cavity area of a mold,
Resin in which a through hole for resin charging is perforated in the carrier body corresponding to the outside of the chip mounting area in the cavity area, the film is held on the lower surface of the carrier body, and the lower end opening of the through hole is blocked A carrier having a receiving portion. A transport tool having a resin containing portion in which a through hole for resin charging is perforated outside the chip mounting area in the transport tool body, a film is held on one surface of the transport tool body, and a lower end opening of the through hole is blocked is prepared. And a process of
A step of carrying the carrier containing the mold resin in the resin container into a lower mold of a mold mold that is opened;
A step of adsorbing and holding the substrate with the chip mounting surface facing downward on the upper mold clamping surface of the mold with a workpiece having a plurality of chips mounted on the substrate;
The resin holding portion and the concave portion are aligned with the chip holding piece disposed opposite to the chip mounting area of the workpiece and the lower mold clamping surface formed with the concave portion for containing the mold resin formed around the chip holding piece, and the transfer Superimposing tools through the film;
Releasing the film holding of the transport body and transferring the film to the lower mold surface by starting the suction of the film by the chip presser and the lower mold clamper, and dropping the resin container into the recess;
Removing the carrier and closing the upper mold and the lower mold to form a decompression space in the mold; and
The mold closing operation is advanced to relatively reduce the volume of the concave portion while pressing the chip pressing piece against the chip via the film, and the mold resin accommodated in the concave portion is separated from the gap between the chips. Filling the resin while pressurizing the resin, and a resin molding method.

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