TWI718447B - Molding mold, resin molding device, and manufacturing method of resin molded product - Google Patents

Abstract

The present invention provides a molding die capable of ensuring a large area of a resin molding area on a molding object. The molding mold of the present invention includes an upper mold 100 and a lower mold 200, and is characterized in that the upper mold 100 can absorb a molded object, and the lower mold 200 includes a lower mold bottom surface member 202, a lower mold side member 201, and a molded object fall prevention block 211 The space enclosed by the lower mold bottom surface member 202 and the lower mold side member 201 forms the lower mold cavity 203, and the molded object falling prevention block 211 is provided on a part of the end of the lower mold side member 201 facing the lower mold cavity 203. Moving up and down.

Description

Molding mold, resin molding device, and manufacturing method of resin molded product

The present invention relates to a molding die, a resin molding device, and a method of manufacturing a resin molded product.

In recent years, in the technology of resin molding of substrates, it has been proposed to enlarge the area of resin molding.

For example, regarding the molding die (molding die) described in Patent Document 1, according to the description of the same document, it is possible to prevent the workpiece (semiconductor wafer, rectangular substrate, etc.) held on the clamping surface of the die from shifting or falling off, and to ensure The size of the larger resin encapsulation part (resin molding area).

[Prior Technical Literature]

[Patent Literature[

Patent Document 1: Japanese Patent Application Publication No. 2017-24398.

However, with the structure of the molding die (molding die) of Patent Document 1, the resin encapsulation portion (resin molding area) cannot be sufficiently large. Specifically, in Patent Document 1, as shown in FIGS. 9 and 10 of the same document, it is necessary to clamp the entire outer peripheral end of the workpiece by the movable jig 6g of the lower mold. This limits the size of the resin encapsulation part.

Therefore, an object of the present invention is to provide a molding die, a resin molding apparatus, and a method of manufacturing a resin molded product, which can ensure a large area of a resin molding area in a molding object.

In order to achieve the above-mentioned object, the molding die of the present invention includes an upper die and a lower die, and is characterized in that the upper die can adsorb a molding object, The lower mold includes a lower mold bottom surface member, a lower mold side member, and a molded object falling prevention block, a space enclosed by the lower mold bottom surface member and the lower mold side member forms a lower mold cavity, and the molded object The falling prevention block is provided on a part of the end of the lower mold side member facing the lower mold cavity and can move up and down.

The resin molding apparatus of the present invention is characterized by including the molding die of the present invention.

The method of manufacturing a resin molded article of the present invention uses the molding die of the present invention or the resin molding apparatus of the present invention, and is characterized by including a pressure reduction step, wherein the upper mold adsorbs the molded object and the molded In a state where the object falling prevention block is in contact with at least one of the upper mold and the resin molded object, depressurize the inside of the lower mold cavity; in the mold closing step, the upper mold and the lower mold are closed Mold; resin molding step, using the lower mold cavity, the molded object is resin molded.

According to the present invention, it is possible to provide a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product, which can ensure a large area of a resin molding area in a molding object.

1: substrate (molded object)

1b: Resin molded products

2: chip

13: Allocator

20: Cured resin

20a: Granular resin (resin material)

20b: Molten resin (flowable resin)

40: release film

100: upper die

101: Upper die side member (upper die outer peripheral member)

102: Upper mold upper surface member (upper mold cavity member)

103: Convex part (fixture part)

104: Recessed part (surface pressure release part)

105: height difference

106: adsorption hole

200: lower die

201: Lower mold side member

201A: Side member of lower die (A)

201B: Lower mold side member (B)

202: Lower mold bottom surface member

203: Lower model cavity

205: Release film adsorption tank (release film holding part)

211, 211b, 211c: Molded object falling prevention block

212: Through hole for bolt fixing

213: Spring storage hole

214: Bolt

215: Gasket

216: Ring

217: Spring (elastic member)

510: Release film cutting module (release film cutting mechanism)

511: Membrane fixing table mounting mechanism

512: Roll release film

513: Membrane Fixture

520: Resin supply module (resin supply mechanism)

521: Resin Loader

522: Post-processing mechanism

523: Membrane fixing table moving mechanism

530: Compression molding mechanism (compression molding module)

531: Forming Die

532: Lower model cavity

540: handling mechanism (handling module)

541: Substrate Loader

542: Rail

543: Robotic Arm

544a: resin package front substrate (pre-molding substrate)

544b: Resin encapsulated substrate (molded substrate)

550: Control Department

1000: Forming mold

V1, V2: Arrows showing the direction of attraction

α: Cut part (excavated part)

β: The part that is not molded by resin (resin encapsulated)

FIG. 1 is a perspective view schematically showing the structure of the lower mold in the molding mold of Example 1. FIG.

Fig. 2 is a perspective view of a part of the lower mold of Fig. 1; Fig. 2(a) shows the mold open state, and Fig. 2(b) shows the mold closed state.

Fig. 3 is a partial cross-sectional view showing the structure of the mounting part of the molded object falling prevention block in the lower mold of Fig. 1.

4 is a partial cross-sectional perspective view of the upper mold in the forming mold of Example 1. FIG.

5 is a partial cross-sectional view of the molding die in the pressure reduction step of Example 1. FIG.

Fig. 6 (a) and (b) are partial cross-sectional views of the closed mold state of the molding die of Example 1, respectively.

7 is a cross-sectional view schematically showing one step of the method of manufacturing a resin molded article using the molding die of Example 1. FIG.

Fig. 8 is a cross-sectional view schematically showing another step of the method of manufacturing the resin molded article same as that of Fig. 7.

Fig. 9 is a cross-sectional view schematically showing still another step of the method of manufacturing the resin molded article same as that of Fig. 7.

Fig. 10 is a cross-sectional view schematically showing still another step of the method of manufacturing the resin molded article same as that of Fig. 7.

FIG. 11 is a cross-sectional view schematically showing still another step of the method of manufacturing the resin molded article same as that of FIG. 7.

Fig. 12 is a cross-sectional view schematically showing still another step of the method of manufacturing the resin molded article same as that of Fig. 7.

FIG. 13 is a schematic diagram showing the structure of the lower mold in the forming mold of Example 2. FIG. Fig. 13(a) is a plan view (top view), and Fig. 13(b) is a side view.

Fig. 14 is a perspective view of the same lower mold as in Fig. 13.

Figs. 15(a) to (c) are schematic diagrams showing the structure of the mounting part of the molded object falling prevention block of the same lower mold as in Figs. 13 and 14 and the operation of the lower mold, respectively. Figure 15 (a) and (b) are partial cross-sectional views, respectively, and Figure 15 (c) is a partial plan view.

16 is a partial perspective view showing a modified example of the lower mold in the molding mold of the second embodiment. Figure 16 (a) shows the mold open state, and Figure 16 (b) shows the mold closed state.

FIG. 17 is a cross-sectional view schematically showing the closed state of the molding die of Example 2. FIG.

18 is a cross-sectional view schematically showing a closed mold state of a modification of the molding mold of Example 2. FIG.

19 is a plan view schematically showing the structure of a resin molded product resin molded with the molding die of Example 2. FIG.

20 is a plan view schematically showing the structure of a resin molding apparatus of Example 3. FIG.

Next, the present invention will be further explained in detail with examples. However, the present invention is not limited to the following description.

In the molding die of the present invention, for example, the molding object falling prevention block may be attached to the side member of the lower mold via an elastic member.

In the molding die of the present invention, for example, the upper mold may be provided with a convex portion as a protrusion below, and the convex portion may surround the outer periphery of the portion capable of adsorbing the molding object in the upper mold. Mode configuration.

In the molding die of the present invention, for example, the lower mold side member may be provided with a release film holding portion capable of holding a release film on the outer side of the molded object falling prevention block.

In the method of manufacturing a resin molded article of the present invention, for example, the pressure reduction step may be performed in a state where the molded object is supported by the molded object fall prevention block and the upper mold.

With regard to the method of manufacturing a resin molded product of the present invention, for example, the side member of the lower mold in the molding die may be provided with a release film capable of holding a release film on the outer side of the molded object falling prevention block The holding part may further include a release film holding step, holding the release film in the release film holding part, and performing the reduction in a state in which the release film is held in the release film holding part.压步。 Pressing steps.

In the present invention, the resin molded product is not particularly limited. For example, it may be a resin molded product in which only resin is molded, or a resin molded product in which components such as a wafer are resin-encapsulated. In the present invention, the resin molded product may be, for example, an electronic component or the like. And, in the present invention, The resin molded product may be, for example, a finished product or an unfinished semi-finished product.

In the present invention, "resin molding" or "resin encapsulation" means, for example, a state where the resin is cured (solidified). However, in the present invention, "resin molding" or "resin encapsulation" is not limited to the above-mentioned meaning, and for example, may be a semi-cured (semi-cured) state in which the resin is not completely cured (solidified). The semi-cured (semi-cured) state may be, for example, a cured (solidified) state to the extent that the resin can be released from the mold or can be transported together with the mold.

In the present invention, the resin material before molding and the resin after molding are not particularly limited. For example, it may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. In addition, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. In the present invention, the form of the resin material before molding includes, for example, pellet resin, fluid resin, sheet resin, plate resin, powder resin, and the like. In the present invention, as long as the fluid resin is a resin having fluidity, it is not particularly limited, and examples thereof include liquid resins, molten resins, and the like. In the present invention, the liquid resin refers to, for example, a resin that is liquid or has fluidity at room temperature. In the present invention, the molten resin refers to, for example, a resin that is melted into a liquid state or becomes a fluid state. Regarding the form of the resin, as long as it can be supplied to a cavity, a groove, or the like of a molding die, there is no problem with other forms.

In addition, generally speaking, "electronic component" includes the case of the chip before resin encapsulation and the case of the chip with resin encapsulation. However, in the present invention, it is simply referred to as the case of "electronic component". In particular, it refers to an electronic component in which the chip is resin-encapsulated (as a finished electronic component). In the present invention, the "wafer" refers to a wafer before resin encapsulation, and specifically, for example, a wafer such as an IC, a semiconductor wafer, and a semiconductor element for power control can be cited. In the present invention, in order to distinguish it from electronic components after resin encapsulation, the wafer before resin encapsulation is referred to as a "chip" for convenience. However, as long as the "wafer" of the present invention is a wafer before resin encapsulation, it is not particularly limited, and it does not have to be a wafer shape.

In the present invention, "flip chip" refers to electrodes (pads) on the surface of an IC chip An IC chip with bumps called bumps on the top, or this kind of chip form. This wafer can be mounted on a wiring part such as a printed circuit board downward (face down), for example. The flip chip can be used as, for example, a chip for wireless bonding or one of mounting methods.

In the present invention, the molded object is not particularly limited, and is, for example, a substrate of a resin molded product, a supporting member, and the like. As the object to be molded, for example, a supporting member capable of supporting a semiconductor wafer, a wafer-shaped electronic member, or a film (including a conductive film, an insulating film, and a semiconductor film), etc. can be cited. More specifically, as the supporting member, for example, lead frames, substrates, interposers, semiconductor substrates (silicon wafers, etc.), metal substrates, glass substrates, ceramic substrates, resin substrates, wiring substrates, and the like can be cited. In addition, as the supporting member, for example, an interposer such as a substrate, a resin substrate, a wiring substrate, and L/F can be cited. The substrate (also referred to as a workpiece or an interposer) is not particularly limited, and examples thereof include lead frames, wiring substrates, wafers, and ceramic substrates. However, the molded object of the present invention is not limited to this, and may be arbitrary. In addition, the shape of the molding object is not particularly limited. For example, the surface shape of the molding object may be round or square. In addition, the molding object may or may not include wiring. In addition, the molded object may include those used for, for example, a fan-out wafer level package (Fan Out wafer Level Package; FO-WLP) or a fan-out wafer panel level package (Fan Out wafer Panel Level Package; FO-PLP). Carrier for plate-shaped members. Furthermore, in the present invention, a member such as a wafer may be mounted on one or both surfaces of the molded object, or it may not be mounted. The method of mounting the wafer is not particularly limited, and examples thereof include wire bonding, flip chip bonding, and the like.

In the present invention, for example, only one side of the molded object may be resin molded to produce a resin molded product, or both sides may be resin molded to produce a resin molded product. In addition, for example, a member (for example, a wafer, a flip chip, etc.) mounted on one or both surfaces of the molded object may be resin-encapsulated to produce a resin molded product (for example, an electronic component, etc.). In addition, the use of the resin molded product manufactured according to the present invention is not particularly limited, but examples include high-frequency module substrates for mobile communication terminals, module substrates for power control, and substrates for machine control. Board and so on.

In addition, in the present invention, "installation" includes "placement" or "fixation". Furthermore, in the present invention, "mounting" includes "fixing".

In addition, in the present invention, the "molding mold" is not particularly limited, but is, for example, a metal mold, a ceramic mold, or the like.

Furthermore, in the present invention, in the method of manufacturing a resin molded product, for example, compression molding can be used. In addition, as the resin molding apparatus, for example, a compression molding apparatus can be used.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For the convenience of description, each figure will be schematically described with appropriate omissions, exaggerations, etc.

[Example 1]

In this embodiment, an example of a molding die and a resin molding apparatus and an example of a method of manufacturing a resin molded product using the same will be described.

The structure of the lower mold of the forming mold used in this embodiment is schematically shown in the perspective view of FIG. 1. As shown in the figure, the lower mold 200 includes a lower mold bottom surface member 202, a lower mold side surface member 201, and a molded object falling prevention block (substrate falling prevention block) 211. The lower mold side member 201 is provided so as to surround the lower mold bottom member 202. Then, the space enclosed by the lower mold bottom surface member 202 and the lower mold side surface member 201 forms a lower mold cavity. In addition, the lower mold side member 201 is formed by the lower mold side member (A) 201A and the lower mold side member (B) 201B. The lower mold side member (A) 201A is placed on the upper surface of the lower mold side member (B) 201B.

The molded object falling prevention block 211 is provided on a part of the end of the lower mold side member (A) 201A facing the lower mold cavity, and can move up and down. In addition, a through hole 212 for bolt fixing and a spring receiving hole 213 are provided at the position of the lower mold side member (A) 201A where the molded object fall prevention block 211 is attached. As will be described later, these are provided for fixing the molded object falling prevention block 211 to the lower mold side member 201 by bolts and springs (elastic members). In addition, in FIG. 1, the lower mold bottom surface member 202 has a circular shape. However, in the present invention, the lower die The shape of the bottom surface member is not limited to a circle but is arbitrary, and may be, for example, a rectangle (rectangular or square) or the like. In addition, in the lower mold 200 of FIG. 1, there are four molded object falling prevention blocks 211, which are provided at equal intervals on the circumference of the lower mold side member (A) 201A. In the same figure, in order to facilitate the illustration of the bolt fixing through hole 212 and the spring housing hole 213, two of the four molded object falling prevention blocks 211 are omitted. In addition, in the molding die of the present invention, the number of the molded object falling prevention blocks is not limited to four, but is arbitrary. For example, the number of the molded object falling prevention blocks may be one, or any number of two or more. The number of the molded object falling prevention blocks is preferably 2 or more, more preferably 3 or more from the viewpoint of preventing the molding object from falling off and ensuring a large area of the resin molding area.

In addition, the lower mold side member (A) 201A is provided with a mold release film suction groove 205 on the upper surface of the lower mold side member (A) 201A on the outer side of the molded object falling prevention block 211. The mold release film adsorption groove 205 can adsorb and hold the mold release film, and forms a mold release film holding portion of the lower mold side member 201.

The structure of the molded object falling prevention block 211 of the lower mold 200 of FIG. 1 and its surroundings is shown in the perspective view of FIG. 2. Fig. 2(a) shows the mold open state, and Fig. 2(b) shows the mold closed state. As described above, the molded object falling-off prevention block 211 can move up and down. As shown in FIG. 2(a), in the mold opened state, the molded object falling prevention block 211 rises and protrudes from the upper surface of the lower mold side member (A) 201A. Therefore, as will be described later, the molded object can be supported by the molded object falling prevention block 211, and the molded object can be prevented from falling off. On the other hand, as shown in FIG. 2(b), in the closed mold state, the molded object fall prevention block 211 descends without protruding from the upper surface of the lower mold side member (A) 201A, so that the lower mold side member (A) ) The upper surface of 201A and the upper surface of the molded object falling-off prevention block 211 form the same plane. However, the part of the upper end of the molded object falling prevention block 211 facing the lower mold cavity 203 slightly protrudes from the upper surface of the lower mold side member (A) 201A. As described later, this part will be a part that is not molded (resin-encapsulated) by resin.

In the partial cross-sectional view of FIG. 3, the structure of the attachment part of the molded object falling prevention block 211 in the lower mold 200 of FIG. 1 is shown. As shown in the figure, the spring on the side member (B) 201B of the lower mold In the housing hole (elastic member housing hole) 213, a spring (elastic member) 217 is arranged. A hole is provided in the lower part of the molded object falling prevention block 211, and the upper part of the spring 217 is accommodated therein. Thereby, the spring 217 is arrange|positioned so that it may be pinched|interposed by the molded object fall prevention block 211 and the lower mold side member (B) 201B. In addition, the molded object falling prevention block 211 is attached to the lower mold side member (B) 210B through the bolt 214, the spacer 215, and the collar 216 in the bolt fixing through hole 212. The molded object falling prevention block 211 can be moved up and down by the collar 216 moving up and down in the bolt-fixing through hole 212. In addition, when the mold is opened, as shown in FIG. 3, the molded object falling-off prevention block 211 is in a state of being raised by the tensile force of the spring 217. In this state, the spacer 215 is caught in the upper part of the bolt-fixing through hole 212, so that the molded object fall prevention block 211 does not fall off from the lower mold side member (B) 201B.

In addition, in the partial cross-sectional perspective view of FIG. 4, a part of the structure of the upper mold 100 used with the lower mold 200 in the molding mold of this embodiment is shown. In addition, for convenience of illustration, FIG. 4 has been turned upside down compared to when the upper mold 100 is used. As shown in the figure, the upper mold 100 includes an upper mold side member (upper mold outer peripheral member) 101 and an upper mold upper surface member (upper mold cavity member) 102. The upper mold upper surface member 102 is provided with suction holes 106, and as shown in the figure, the substrate (molding object) 1 can be sucked and sucked from the suction holes 106. The upper mold side member 101 is arranged so as to surround the periphery of the upper mold upper surface member 102. There is a gap (a gap) between the upper mold upper surface member 102 and the upper mold side member 101, and a height difference 105 is formed at the same time. This height difference forms a cavity (upper mold cavity) surrounded by the upper mold upper surface member 102 and the upper mold side member 101, in which the substrate 1 can be adsorbed as described above. In addition, on the lower surface of the upper mold side member 101 (the upper surface of FIG. 4), a convex portion (clamp portion) 103 is formed downward as a protrusion, and the lower surface (the upper surface of the same figure) becomes the clamping surface . The convex part 103 is arrange|positioned so that the outer periphery of the part (upper mold upper surface member 102) which can adsorb|suck the board|substrate (molding object) 1 of the upper mold|type 100 may be surrounded. In addition, a portion other than the convex portion 103 of the upper mold side member 101 forms a concave portion 104 as a surface pressure release portion. In addition, the convex part 103 may not be provided on the upper mold side member 101, and the lower surface of the upper mold side member 101 may be provided with The lower surface of the upper surface member 102 is on the same plane. In this case, a concave portion 104 as a surface pressure release portion may be formed.

In addition, in this embodiment, the substrate (molding object) 1 is circular, and in combination with this, the lower mold bottom surface member 202 and the upper mold upper surface member 102 are also circular. However, in the present invention, the shape of the molding object (substrate, etc.) is not limited to a circle but is arbitrary, and may be, for example, a rectangle (square or rectangle) or the like. The shapes of the lower mold bottom surface member 202 and the upper mold upper surface member 102 are also not particularly limited, and may be a shape that matches the shape of the substrate (molding object) 1. In addition, the substrate (molding object) 1 is not particularly limited. As described above, examples include lead frames, substrates, interposers, semiconductor substrates (silicon wafers, etc.), metal substrates, glass substrates, ceramic substrates, resin substrates, and wiring. Substrate and so on. The substrate 1 may be, for example, a circular silicon wafer, a circular metal substrate, a glass substrate, or the like.

The partial cross-sectional view of FIG. 5 shows the structure of a part of the molding die in the pressure reduction step of the method of manufacturing a resin molded article using the molding die of this embodiment. As shown in the figure, in the decompression step, the end portion of the substrate 1 is clamped by the molded object falling prevention block 211 and the upper mold side member 101 to be in a fixed (clamped) state. In this state, as shown in the figure, a gap is formed between the lower mold side member (A) 201A and the upper mold side member 101. By sucking the gas in the lower mold cavity from the gap, the inside of the lower mold cavity can be decompressed. According to the structure of the same figure, even if the vacuum degree in the lower mold cavity is close to the vacuum degree of the molded object suction part (inside the suction hole 106 of the upper mold upper surface member 102), the molded object falling prevention block 211 can prevent the substrate ( Molding object) 1 falling off.

)。但是，如圖6之(b)所示，就基板1而言，在未設置成型對象物脫落防止塊211的部分中，未被下模側面構件(A)201A夾緊。因此，在該部分中，直到基板1的周緣部，都能進行樹脂成型(又稱模製或樹脂封裝)。進一步，由於基板1和上模側面構件(上模外周構件)101之間有間隙(縫隙)，所以樹脂能夠進入該間隙，從而直到基板1的側面，都能進行樹脂成型。另外，在本實施例中，成型對象物脫落防止塊211接觸基板1的部分不被樹脂成型。 In addition, the partial cross-sectional views of (a) and (b) of FIG. 6 show the structure of the molding die in the closed state of the present embodiment. Fig. 6(a) is a longitudinal cross-sectional view of a part provided with a molded object falling prevention block 211. Fig. 6(b) is a longitudinal cross-sectional view of a portion where the molded object falling prevention block 211 is not provided. As shown in Figure 6(a), in the closed mold state, the molded object fall prevention block 211 is lowered and does not protrude from the upper surface of the lower mold side member (A) 201A, and the upper surface of the lower mold side member (A) 201A and The upper surface of the molded object falling prevention block 211 forms the same plane. At this time, as shown in FIG. 6(a), the substrate 1 is clamped and fixed (clamped) by the molded object falling prevention block 211 and the upper mold upper surface member (upper mold cavity member) 102. By this clamping, it is possible to suppress back flash (inside) caused by resin entry between the substrate 1 and the upper cavity member 102.

). However, as shown in FIG. 6(b), the substrate 1 is not clamped by the lower mold side member (A) 201A in the portion where the molded object fall prevention block 211 is not provided. Therefore, in this part, resin molding (also called molding or resin encapsulation) can be performed up to the peripheral edge of the substrate 1. Furthermore, since there is a gap (a gap) between the substrate 1 and the upper mold side member (upper mold outer peripheral member) 101, resin can enter the gap, and resin molding can be performed up to the side surface of the substrate 1. In addition, in this embodiment, the portion of the molded object falling prevention block 211 that contacts the substrate 1 is not molded by the resin.

Next, in the step cross-sectional views of FIGS. 7 to 12, a part of the structure of the molding die and the resin molding apparatus using the same, and the method of manufacturing the resin molded product of the present embodiment using these are schematically shown summary.

First, the outline of the structure of the molding die 1000 of this embodiment is shown in the cross-sectional view of FIG. 7. As mentioned above, the forming mold 1000 includes an upper mold 100 and a lower mold 200. In addition, in FIGS. 7 to 12, for the convenience of illustration, the structures of the upper mold 100 and the lower mold 200 are simplified and shown as described later.

As shown in FIG. 7 and as illustrated in FIG. 4, the upper mold 100 includes an upper mold side member (upper mold outer peripheral member) 101 and an upper mold upper surface member (upper mold cavity member) 102. The upper mold upper surface member 102 is provided with suction holes 106, and the substrate (molding object) 1 can be sucked and sucked from the suction holes 106 as described later. As shown in FIG. 7, the upper mold side member (upper mold outer peripheral member) 101 is provided so as to surround the upper mold upper surface member (upper mold cavity member) 102. Between the upper mold upper surface member 102 and the upper mold side member 101, as shown in FIG. 7 and as explained in FIG. 4, a height difference is formed. With this height difference, a cavity (upper mold cavity) surrounded by the upper mold upper surface member 102 and the upper mold side member 101 is formed, and the substrate (molding object) can be adsorbed in this cavity as described later. 1. In addition, in FIGS. 7 to 12, for the convenience of illustration, the structure of the upper mold 100 is simplified and shown, and the illustration of the convex portion 103 and the concave portion 104 of the upper mold side member 101 shown in FIG. 4 is omitted. .

As illustrated in FIGS. 1 to 3, the lower mold 200 includes a lower mold bottom surface member 202, a lower mold side surface member 201, and a molding object falling prevention block (substrate falling prevention block) 211. The lower mold side member 201 is arranged so as to surround the lower mold bottom member 202. Then, by the space enclosed by the lower mold bottom surface member 202 and the lower mold side member 201, as shown in FIG. 7, a lower mold cavity 203 is formed. The molded object falling prevention block 211 is provided on a part of the end of the lower mold side member 201 that faces the mold cavity 203 downward. A spring (elastic member) 217 is arranged between the molded object falling prevention block 211 and the lower mold side member 201. Since the spring 217 can expand and contract, the molded object falling prevention block 211 can move up and down. In addition, the lower mold side member 201 is provided with a mold release film suction groove 205 on the upper surface of the lower mold side member 201 on the outer side of the molded object falling prevention block 211. The mold release film adsorption groove 205 can adsorb and hold a mold release film, and constitutes a mold release film holding portion of the lower mold side member 201. In addition, in FIGS. 7 to 12, for the convenience of illustration, the structure of the lower mold 200 is simplified and shown. That is, first, the lower mold side member 201 is not divided into the lower mold side member (A) 201A and the lower mold side member (B) 201B but is shown as a whole. In addition, the bolt fixing through hole 212, the spring housing hole 213, the bolt 214, the washer 215, and the collar 216 shown in FIG. 3 are not shown in FIGS. 7 to 12. In addition, in the cross-sectional views of FIGS. 7 to 12, for the convenience of illustration and description, the cross section of the part where the molded object falling prevention block 211 is provided is shown on the right side of the figure, and the left side of the figure shows that no molding The object falls off the part of the preventing block 211.

In addition, the lower mold bottom surface member 202 and the lower mold side surface member 201 are respectively arranged on the lower mold base (base, not shown). The lower mold bottom surface member 202 is directly fixed to the upper surface of the lower mold base. The lower mold side member 201 is connected to the upper surface of the lower mold base by an elastic member (not shown, such as a spring, etc.). Thereby, the lower mold side member 201 can move up and down with respect to the lower mold base.

The method of manufacturing a resin molded product using the molding die and the resin molding apparatus of FIG. 7 can be performed in the manner shown in FIGS. 8 to 12, for example.

First, as shown in FIG. 8, the substrate (into the substrate) is formed by a suction mechanism (not shown, such as a pump, etc.) The molding object) 1 is sucked from the suction hole 106 of the upper mold upper surface member (upper mold cavity member) 102 in the direction of arrow V1, and sucked to the lower surface of the upper mold upper surface member (upper mold cavity member) 102. The wafer 2 is mounted (fixed) on the lower surface of the substrate 1 (the surface on the opposite side of the surface sucked to the upper surface member 102 of the upper mold).

On the one hand, as shown in FIG. 8, in a state where the pelletized resin (resin material) 20a is placed on the release film 40, the pelletized resin (resin material) 20a is supplied (mounted) in the lower mold cavity 203 (resin material supply step ). Then, the release film 40 is sucked from the release film suction groove 205 in the direction of arrow V2 (toward the outside of the lower mold 200) by another suction mechanism (not shown, for example, a pump). In this way, the release film 40 can be held by the release film suction groove (release film holding portion) 205. As a result, as shown in the figure, the cavity surface of the lower mold cavity 203 is covered with the release film 40 and the pellet resin (resin material) 20 a is placed on the release film 40. In addition, the release film 40 can be transported to the position of the lower mold cavity 203 by a transport mechanism (not shown) or the like in a state where the pellet resin (resin material) 20a is placed, for example. In addition, at this time, the entire lower mold 200 may be heated by a heating mechanism (heater, not shown) before the supply of the release film 40 and the pellet resin 20a. The method of supplying the pellet resin 20a to the mold release film 40 is not specifically limited, For example, a measuring mechanism (not shown) etc. can be used, and the pellet resin 20a can be supplied to the mold release film 40 while measuring an appropriate amount.

In addition, although the resin material 20a is a granular resin in the figure, as described above, it is not limited to this and may be arbitrary. The resin material 20a may be, for example, a solid resin material such as a powder, granular, or flake shape, or may be a liquid resin as described above. In addition, the resin material 20a may be, for example, a thermosetting resin such as epoxy resin and silicone resin, etc., or may be a thermoplastic resin, and may further contain additives and the like.

In addition, in FIGS. 8 to 12, after the mold release film 40 is supplied in the lower mold cavity 203, the resin material 20 a is supplied to the lower mold cavity 203 covered by the mold release film 40. However, it is not limited to this. For example, after the resin material 20 a is placed (supply) on the release film 40, the release film 40 and the resin material 20 a may be transported, and the lower mold cavity 203 may be covered with the release film 40. Thereby, it can be covered by the release film 40 The resin material 20a is supplied into the lower mold cavity 203 of FIG. In addition, when the resin material 20a is placed on the release film 40 outside the lower mold cavity 203, for example, in order to prevent the resin material 20a from overflowing, the resin material 20a is preferably liquid resin, sheet resin, or the like. In addition, the present invention is not limited to the example using the release film, and for example, the release film may not be used.

Next, as shown in FIG. 9, the resin material 20a is heated to a molten resin (flowable resin) 20b by the heat of the lower mold 200 heated by a heating mechanism (heater, not shown).

After that, as shown in FIG. 10, the lower mold 200 is raised in the direction of arrow X1 by a driving mechanism (not shown) provided in the lower mold 200. As a result, the molded object falling-off prevention block 211 is brought into contact with the upper mold. In this state, as shown in FIG. 5 as well, the end of the substrate 1 is pinched and fixed (clamped) by the molded object falling prevention block 211 and the upper mold upper surface member 101. In this state, the gap between the upper surface of the lower mold side member 201 and the upper mold 100 on the lower mold side member 201 without the molding object falling prevention block 211 is used to remove the lower mold by a pressure reducing mechanism (not shown, such as a suction pump, etc.) The inside of the cavity 203 is decompressed (decompression step).

In addition, for example, when the convex portion 103 is not provided on the upper mold side member 101 and the lower surface of the upper mold side member 101 is provided on the same plane as the lower surface of the upper mold upper surface member 102 (refer to FIG. 4) Therefore, the molded object falling-off prevention block 211 does not contact the upper mold, but contacts the substrate 1. Therefore, in the pressure reduction step, it is only necessary that the molded object fall-off preventing block contacts at least one of the upper mold and the resin molded object.

Next, the lower mold 200 is further raised, and the upper mold 100 and the lower mold 200 are closed (mold closing step). Specifically, first, the entire lower mold 200 is further raised, and the upper surface (upper end surface) of the lower mold side member 201 of the lower mold side member 201 without the molded object falling prevention block 211 is brought into contact with the upper mold 100. After that, if the lower mold 200 is further raised, the elastic member (elastic body) connecting the lower mold base and the lower mold side member 201 will shrink. As a result, the lower mold bottom surface member 202 is pushed up with respect to the lower mold side surface member 201. In this step, the wafer 2 mounted on the lower surface (mounting surface) of the substrate 1 and the mounting surface are immersed in the fluid resin 20b.

Then, in the closed mold state, the necessary time for curing the fluid resin 20b and the closed mold state are maintained. As a result, as shown in FIG. 11, the fluid resin 20 b in the lower mold cavity 203 is cured to become a cured resin (encapsulation resin) 20. In this way, the substrate (molding object) 1 is resin molded using the lower mold cavity 203 (resin molding step). In addition, the method of curing the fluid resin 20b is not particularly limited. For example, when the fluid resin 20b is a thermosetting resin, the fluid resin 20 can be cured (solidified) by heating continuously. In addition, for example, when the fluid resin 20b is a thermoplastic resin, it can be cured by stopping the heating of the fluid resin 20b and allowing it to stand for a while.

Thereafter, as shown in FIG. 12, the lower mold 200 and the upper mold 100 are opened by lowering the entire lower mold 200 in the direction of arrow X2. As a result, the resin molded body (resin molded product) 1 b in which one surface of the substrate 1 is resin molded with the cured resin (encapsulation resin) 20 is removed from the lower mold 200. After that, the resin molded product 1b is removed from the upper mold 100 by releasing the suction in the direction of the arrow X1 in the upper mold 100. As described above, the resin molded product 1b can be manufactured. The resin molded product 1b is an electronic component in which the wafer 2 on the substrate 1 is resin-encapsulated.

8 to 12 show an example in which the wafer 2 is mounted on the substrate 1, and the resin molded product 1b as an electronic component is manufactured by resin encapsulation (resin molding) of the wafer. However, the present invention is not limited to this. For example, the components mounted on the surface of the substrate 1 are not limited to the wafer 2 and may be arbitrary. That is, on the surface of the substrate 1, other components can be mounted (fixed) in addition to the wafer 2 or instead of it. The components other than the wafer 2 are not particularly limited and may be arbitrary, but for example, leads and the like can be mentioned. In addition, for example, the surface of the substrate (molding object) 1 may not be mounted with other components, and only the substrate 1 may be resin molded and used as a resin molded product. The resin molded product of the present invention is not limited to electronic components, and may be any resin molded product.

In addition, although FIGS. 8 to 12 show a "pre-cut" method in which resin is supplied to a release film that has been cut in advance and then transported to the position of the molding die, the present invention is not limited to this. For example, in the manufacturing method of the molding die, the resin molding apparatus, or the resin molded product of the present invention, it is applicable to arrange (supply) a release film on the cavity of the molding die, and then place the release film on the cavity of the molding die. Supply tree The "roll to roll (reel to reel) method" of grease. In the case of the pre-cut method, for example, as shown in FIGS. 8 to 12, a mold release film suction portion (a mold release film holding portion) may be provided on the side member of the lower mold. In the case of a roll-to-roll (roll-to-roll) method, in addition to or instead of the mold release film adsorption section (release film holding section), another mold release film holding mechanism may be used. The release film holding mechanism in the roll-to-roll (roll-to-roll) system is not particularly limited, and for example, it may be the same or substantially the same as a general release film holding mechanism. As the release film holding mechanism, for example, a type in which the side members of the upper mold and the lower mold hold and hold the release film (for example, as described in JP 2017-183443 A), a middle mold (intermediate plate) and a lower mold The side member pinches and holds the type of the release film (for example, as described in JP 2017-7272 A) and the like.

In addition, in this embodiment, the resin molded body 1b manufactured by the resin molding step may be used as a resin molded product as it is. However, the present invention is not limited to this, and may include a step of further processing the resin molded body manufactured by the resin molding step as a resin molded product. For example, in molding using transfer molding or the like, when the resin molded body contains unnecessary resin, burrs, etc., the unnecessary resin, burrs, etc. may be removed from the resin molded body as a resin molded product.

In addition, an example of compression molding is shown in this embodiment. However, as described above, in the present invention, the resin molding method is not particularly limited. For example, any molding method such as compression molding, transfer molding, and injection molding may be used.

According to the present invention, the molded object falling-off preventing block is used. As shown in the present invention, for example, the molded object can be held by only a part of the end. Therefore, for example, on the resin molding surface (resin encapsulation surface) of the molding object, all parts other than the portion held by the molding object fall prevention block can be resin molded (resin encapsulation). As a result, since almost the entire surface of the resin molding surface (resin encapsulation surface) of the molding object can be resin molded (resin encapsulation), it is possible to ensure a large area of the resin molding area in the molding object. . More specifically, for example, as shown in this embodiment, it is also possible to view the side surface of the molded object (substrate, etc.). Line resin molding (resin encapsulation).

According to the present invention, for example, as described above, in the decompression step of depressurizing the inside of the lower mold cavity, even if the vacuum degree in the lower mold cavity is close to that of the molding in the state where the upper mold is adsorbing the molding object The degree of vacuum of the object suction portion can also prevent the molded object from falling off.

Furthermore, according to the present invention, as shown in this embodiment, for example, it is possible to arrange a release film on the lower mold and perform resin molding. For example, Japanese Patent Application Laid-Open No. 2014-39065 describes that the inside of the cavity is reduced in pressure while the substrate is held by holding pins, but a release film cannot be used in this structure. However, according to the present invention, it is possible to perform resin molding using a release film. However, the present invention is not limited to this, and resin molding can be performed without using a release film as described above.

[Example 2]

Next, other embodiments of the present invention will be described.

In this embodiment, an example different from Embodiment 1 of the molding die, the resin molding apparatus, and the method of manufacturing a resin molded product using the same will be described.

In this embodiment, in order to make the area of the molding area (resin molding area) larger than that of Example 1, the area of the molded object falling prevention block contacting the molded object is smaller than that of Example 1.

FIG. 13 is a schematic diagram showing the structure of the lower mold 200 in the molding mold of this embodiment (Embodiment 2). Fig. 13(a) is a plan view (top view), and Fig. 13(b) is a side view. In addition, FIG. 14 is a perspective view of the lower mold 200 the same as that of FIG. 13. As shown in the figure, the lower mold 200 is similar to Example 1 except that it is provided with a molding object falling prevention block (substrate falling prevention block) 211b instead of the molding target falling prevention block (substrate falling prevention block) 211. The lower die 200 is the same. As shown in the figure, the molded object fall-off prevention block 211b is smaller than the molded object fall-off prevention block 211. In addition, the structure of the attachment portion of the molding target falling prevention block 211b is different from the molding target falling prevention block 211. The specific description will be made using FIG. 15.

15(a) to (c) are schematic diagrams showing the structure of the attachment portion of the molded object falling prevention block 211b of the lower mold 200 shown in FIGS. 13 and 14 and the operation of the lower mold 200, respectively. Figure 15(a) and (b) are partial cross-sectional views, respectively, and Fig. 15(c) is a partial plan view.

FIG. 15(a) shows a mold opened state (a state where the molded object falling-off prevention block 211b rises). FIG. 15(b) shows a closed mold state (a state where the molded object falling-off prevention block 211b is lowered). As in the first embodiment, a spring (elastic member) 217 is arranged in the spring receiving hole (elastic member receiving hole) 213 of the lower mold side member (B) 201B. A hole is provided in the lower part of the molded object falling prevention block 211, and the upper part of the spring 217 is accommodated therein. Thereby, the spring 217 is arranged so as to be pinched by the molded object falling prevention block 211b and the lower mold side member (B) 201B. In addition, in this embodiment, the bolt fixing through hole 212, the bolt 214, the gasket 214, and the collar 216 do not exist. As shown in FIGS. 15(a) and (b), the molded object falling prevention block 211b is fixed to the lower mold side member 201 only by the spring housing hole 213 and the spring 217. In this way, in this embodiment, in order to make the structure of the attachment portion of the molded object fall prevention block simpler than that of the first embodiment, the shape of the molded object fall prevention block 211b is L-shaped when viewed from the side. That is, as shown in FIGS. 15(a) and (b), the shape of the molded object falling prevention block 211b is an L-shape with a laterally protruding lower part. Then, as shown in FIG. 15(a), with the molded object falling-off preventing block 211b in a raised state, the protruding portion at the lower part of the molded object falling-off preventing block 211b is caught on the lower mold side member (A) 201A Therefore, the molded object falling-off prevention block 211b does not fall off from the lower mold side member 201.

15(c) is a partial plan view (top view) showing a state after resin molding of the lower mold 200 of the molding mold of the present embodiment. In the same figure, for the convenience of illustration, illustration of the upper mold 100 and the substrate 1 is omitted. As shown in the figure, in the peripheral portion of the region where the resin is molded (encapsulated) with the cured resin (encapsulation resin) 20, the portion where the molded object fall prevention block 211b contacts the substrate 1 is not molded by the resin. However, in this embodiment, since the size of the molded object falling prevention block 211b is smaller than the molded object falling prevention block 211b of Example 1, the area of the region not molded by the resin is also reduced. In addition, as described later, as a modification of this embodiment, in order to remove the area not molded by the resin, a cut-out portion (excavation portion) can be provided in the molded object falling-off prevention block.

FIG. 16 shows the structure of the lower mold 200 of the molding mold of the present embodiment to prevent the object from the molding mold from falling off and the surrounding structure. Fig. 16(a) shows the mold open state, and Fig. 16(b) shows the mold closed state. In FIG. 16, as a modified example, an example in which a cut-out portion (excavated portion) is provided in the molded object falling prevention block is shown. As shown in the figure, the lower mold 200 is provided with a molding target falling prevention block 211c instead of the molding target falling prevention block 211b. The molding target falling-off preventing block 211c is the same as the molding target falling-off preventing block 211b except that a notch (excavated portion) α is provided at the portion facing the mold cavity 203 at the upper end. As shown in FIG. 16(a), in the closed mold state, the molded object falling prevention block 211c rises and protrudes from the upper surface of the lower mold side member (A) 201A. Therefore, as in Example 1, the molded object can be held by the molded object falling prevention block 211c, and the molded object can be prevented from falling off. On the other hand, as shown in FIG. 16(b), in the closed mold state, the molded object falling prevention block 211c descends without protruding from the upper surface of the lower mold side member (A) 201A, and the lower mold side member (A) 201A The upper surface and the upper surface of the molded object fall prevention block 211 are formed in the same plane. In the example of FIG. 16, as described above, the cut-out portion (excavated portion) α is provided in the molded object falling prevention block 211c. Thereby, as shown in FIG. 16(b), in the closed mold state, the molded object falling prevention block 211c does not protrude from the upper surface of the lower mold side member (A) 201A. As a result, as will be described later, it is possible to remove the part that is not resin-molded (resin-encapsulated) in the peripheral portion of the resin-molded area. In addition, when the lower mold 200 does not include the molding target falling-off prevention block 211c but includes the molding target falling-off prevention block 211b, it is the same as FIG. 16 except that there is no cutout portion (excavation portion) α.

The closed state of the molding die 1000 of the present embodiment is schematically shown in the cross-sectional views of FIGS. 17 and 18. More specifically, FIGS. 17 and 18 respectively show a state where the lower surface of the substrate 1 is resin-molded with a cured resin (encapsulation resin) 20 after the molding die 1000 is closed. FIG. 17 shows an example in which the molded object falling-off prevention block does not include a cutout portion (excavated portion), and FIG. 18 shows an example in which the molded object falling off prevention block includes a cutout portion (excavated portion). In addition, in FIG. 17 and FIG. 18, the release film 40 and the wafer 2 are omitted in order to simplify the illustration. In addition, it is the same as in Figs. 7-12 (Example 1), in Fig. 17 In FIG. 18, the structures of the upper mold 100 and the lower mold 200 are also simplified and shown appropriately.

The molding die 1000 of FIG. 17 is the same as the molding die 1000 of Example 1 (FIGS. 7 to 12) except that it is provided with a molding object falling prevention block 211 b instead of the molding target falling prevention block 211. In addition, the molding die 1000 of FIG. 18 is the same as the molding die 1000 of Example 1 (FIGS. 7 to 12) except that it is provided with a molding object falling prevention block 211 c instead of the molding object falling prevention block 211. As described above, the molded object falling-off prevention block 211b does not include the cutout portion (cut-out portion) α, and the molded object falling-off prevention block 211c includes the cutout portion (cutout portion) α.

As shown in FIG. 17, in the case of the molded object falling-off preventing block 211b that does not have the cutout portion (excavated portion) α, the portion of the outer peripheral portion of the substrate 1 that is in contact with the molded object falling-off preventing block 211b and A portion β that is not molded (resin-encapsulated) by resin is formed in the vicinity thereof. On the other hand, as shown in FIG. 18, in the case of the molded object falling-off prevention block 211c provided with the cutout portion (excavation portion) α, the resin can enter the gap between the cutout portion (excavation portion) α and the substrate 1. In the gap, it is impossible to form a portion that is not molded (resin-encapsulated) by resin on the outer periphery of the substrate 1.

If the gap between the cut portion (excavated portion) α and the substrate 1 is large, the substrate 1 may fall off from the gap. However, when the gap between the cut portion (excavated portion) α and the substrate 1 is small and the risk of falling off of the substrate 1 is not a problem, as shown in FIG. 18, the molded object falling-off prevention block 211c can be equipped with a cut portion (dig Opening) The form of α.

On the other hand, as shown in FIG. 17, if the molded object fall-off prevention block 211b does not have the cutout portion (cut-out portion) α and there is no gap between the substrate 1 and the molded object fall-off prevention block 211b, the substrate 1 is not at risk of falling off. In addition, according to the present invention, it is possible to extremely reduce the portion β that is not resin molded (resin-encapsulated) in the outer periphery of the substrate 1. An example of this is shown in the plan view of FIG. 19. The same figure is a plan view schematically showing the structure of a resin molded product 1b that has been resin molded using the molding die 1000 of FIG. 17. As shown in the figure, on the outer periphery of the substrate 1, there are four portions β that are not resin molded (resin-encapsulated) at the portion contacting the molded object falling prevention block 211b and its vicinity. However, as shown in the figure, the surface of the portion β that is not molded (resin-encapsulated) by resin is positively small.

[Implementation column 3]

Next, other different embodiments of the present invention will be described.

In this example, an example different from Example 1 and Example 2 of the manufacturing method of a molding die, a resin molding apparatus, and a resin molded product using the same will be described.

In Embodiment 1 and Embodiment 2, the structure of the molding die is mainly shown, but in this embodiment, an example of the structure of the entire resin molding apparatus will be shown. However, the structure of the resin molding apparatus of the present invention is not limited to this, and may be arbitrary. In addition, the molding die is not particularly limited, but it may be the same as in Example 1 and Example 2, for example.

The structure of the resin molding apparatus of this embodiment is schematically shown in the plan view of FIG. 20. The resin molding apparatus in the same figure is an apparatus for manufacturing resin molded products (for example, electronic components). As shown in the figure, for this device, starting from the right side of the figure, follow the release film cutting module (release film cutting mechanism) 510, the resin supply mechanism (resin supply module) 520, and the compression molding mechanism ( The compression molding module) 530, the transport mechanism (transport module) 540, and the control unit 550 are arranged in order. Although the modules are separated from each other, they can be installed and detached from adjacent modules. The resin supply module 520 supplies the resin material for resin molding on the release film as described later.

The release film cutting module (release film cutting mechanism) 510 can cut and separate a round release film from a long release film. As shown in the figure, the release film cutting module 510 includes a film fixing table mounting mechanism 511, a roll release film 512, and a film clamp 513. A stage (not shown) is mounted on the upper surface of the film fixing stage mounting mechanism 511. The table is a fixing table for fixing the release film 40, and can be referred to as a "film fixing table". As shown in the figure, the tip of the release film can be drawn from the roll-shaped release film 512 and cover the upper surface of the table placed on the film fixing table mounting mechanism 511, and the release film can be fixed on the table.模膜。 Film. The film clamp 513 can fix the tip of the release film drawn from the roll release film 512 to the opposite side of the roll release film 512 as seen from the film fixing table mounting mechanism 511, and at the same time can hold the The release film is drawn from the roll release film 512. In the film fixing table mounting mechanism 511, the mold release film can be cut into a circular mold release film 40 with a cutter (not shown). Further, the mold release film is cut off The group 510 includes a waste disposal mechanism (not shown) that processes the remaining release film (scrap) of the circular release film 40 that is cut and separated.

The resin supply module 520 includes a resin discharge mechanism, a resin loader (resin conveying mechanism) 521, and a post-processing mechanism 522. The resin discharge mechanism includes a dispenser 13 equipped with a nozzle. In addition, since FIG. 20 is a plan view (top view), the stage is hidden from the release film 40 and is not shown in the figure. In addition, since the nozzle is hidden from the dispenser 13 in FIG. 20, it is not shown. Further, the resin supply module 520 may include a camera (sensor), a heater, etc. as described later. In addition, the resin loader 521 and the post-processing mechanism 522 are integrally formed. The resin loader 521 can be used to attach the resin material 20a (not shown in FIG. 20) to the release film 40 (resin accommodating portion) that is sucked and fixed on the upper surface of the lower mold to be bonded to the release film.膜40。 Film 40. Then, in this state, the resin material 20 a can be supplied and set in a lower mold cavity for compression molding described later in the compression molding module 530 in a state placed on the release film 40.

The compression molding module 530 includes a molding die 531 as shown in the figure. The molding mold 531 is not particularly limited, and may be, for example, a mold. The upper mold and the lower mold of the forming mold 531 are main components (not shown), and the lower mold cavity 532 is circular as shown in the figure. The molding mold 531 is further provided with an upper mold substrate setting portion (not shown) and a lower mold cavity bottom surface member (not shown) for resin pressing. In the compression molding module 530, a chip (such as a semiconductor chip) mounted on a resin encapsulation front substrate (pre-molding substrate) can be resin-encapsulated in the encapsulating resin (resin encapsulation) in the lower mold cavity to form a resin encapsulation Finished substrate (finished substrate). The compression molding module 530 may include a compression molding mechanism, for example, and the molding die 531 can be the same as the molding die 1000 of the first embodiment or the second embodiment, for example, as described above. Although the resin molding method (the manufacturing method of the resin molded article) using the compression molding module 530 is not specifically limited, it can be the same as Example 1 and Example 2, for example.

The transport mechanism (transport module) 540 can transport the chip (resin-encapsulated object) before resin encapsulation to each substrate, and can transport the resin-encapsulated electronic component (resin molded product). As shown in the figure, the transport mechanism (transport module) 540 includes a substrate loader 541 guide rail 542, Robotic arm 543. The guide rail 542 protrudes from the transport mechanism (transport module) 540 and reaches the area of the compression molding module 530 and the resin supply module 520. The substrate loader 541 can mount the substrate 544 thereon. The substrate 544 may be a resin-encapsulated substrate (pre-molding substrate) 544a, or a resin-encapsulated substrate (molded substrate) 544b. The substrate loader 541 and the resin loader 521 (post-processing mechanism 522) can move between the resin supply module 520, the compression molding module 530, and the transport module 540 on the guide rail 542. In addition, as shown in the figure, the transport mechanism 540 includes a substrate accommodating portion, which can respectively accommodate a resin-encapsulated substrate (pre-molded substrate) 544a and a resin-encapsulated substrate (molded substrate) 544b. A wafer (not shown in FIG. 20, such as a semiconductor wafer) is mounted on the substrate 544a before molding. As for the molded substrate 544b, the resin (encapsulation resin) obtained by curing the wafer with a fluid resin is encapsulated to form an electronic component (resin molded product). The robot arm 543 can be used in the following manner, for example. That is, firstly, the pre-molding substrate 544 a taken out from the accommodating portion of the pre-molding substrate 544 a can be placed on the substrate loader 541 with the wafer mounting surface side facing downward. Second, by taking out the molded substrate 544b from the substrate loader 541 and turning it inside and out, the encapsulating resin side can be turned upward, and the molded substrate 544b can be accommodated in the accommodating portion of the molded substrate.

The control unit 550 controls the cutting of the release film, the discharge of the fluid resin, the expansion of the fluid resin, the transportation of the substrate before and after the packaging, the transportation of the resin material, the transportation of the mold release film, the heating and molding of the mold Mold closing and mold opening. In other words, the control unit 550 controls each operation in the release film cutting module 510, the resin supply module 520, the molding module 530, and the transport module 540. In this way, the resin molding apparatus of the present invention can control the various components by the control unit, and function as a fully automatic machine. Alternatively, the resin molding apparatus of the present invention may function as a manual machine instead of the control unit, but it is more efficient if the respective members are controlled by the control unit.

The position where the control unit 550 is arranged is not limited to the position shown in FIG. 20 but may be arbitrary. For example, it may be arranged on at least one of the modules 510, 520, 530, and 540, or may be arranged On the outside of each module. Also, the control part 550 may be configured as a plurality of control parts, at least a part of which is separated according to the action of the control object.

In the resin molding apparatus of FIG. 20, as described above, the transport module 540 for supplying the substrate and the resin supply module 520 for supplying the resin material on the release film are arranged facing each other with the compression molding module 530 sandwiched therebetween. Furthermore, a mold release film cutting module 510 that forms a circular mold release film is arranged on the outside of the resin supply module 520. The resin molding device is a separate type resin molding device in which the modules are separately arranged. In addition, the arrangement of the modules of the resin molding apparatus of the present invention is not particularly limited, and arrangements other than the arrangement shown in FIG. 20 may be used. For example, it is possible to adopt a structure in which compression molding modules are detachably arranged according to the required number. In addition, the release film cutting module (round release film forming module), the resin supply module, and the transport module (substrate module) can be arranged close to the release film cutting module (substrate module). ) On one side. In this case, the release film module, the resin supply module, and the substrate module become the mother module, and the compression molding module becomes the child module (mother-child type). In this case, it is possible to sequentially arrange the required number of compression molding modules in order. In addition, the release film cutting module, the resin supply module, and the transport module (substrate module) can be integrated. In addition, the release film cutting module, the resin supply module, and the transport module (substrate module) can be integrated with one molding module, and these components are integrated as a resin molding device (such as a compression molding device). ) And work alone.

In addition, when multiple compression molding modules are arranged between the transport module (substrate module) and the resin supply module, and when multiple compression molding modules are sequentially arranged for the mother module, it is preferable to follow Configure in the following way. That is, the molding modules are arranged side by side along the extending direction of the guide rail used when the members including the substrate loader, the resin loader, and the post-processing mechanism move. In addition, the modules of the resin molding apparatus of the present invention can use a connecting mechanism such as a bolt and a nut, or an appropriate position determining mechanism, so that they can be attached and detached from each other. In addition, it may be a structure in which other compression molding modules can be installed and disassembled relative to the compression molding module. In this way, it is possible to increase or decrease the compression molding module afterwards.

Furthermore, the present invention is not limited to the above-mentioned embodiments, as long as it does not deviate from the gist of the present invention, it can be combined, changed, and selected arbitrarily and appropriately as needed.

This application claims priority based on Japanese Application Japanese Patent Application No. 2018-008487 filed on January 22, 2018, and the entire contents of the disclosure are included here.

100: upper die

101: Upper die side member (upper die outer peripheral member)

102: Upper mold upper surface member (upper mold cavity member)

106: adsorption hole

200: lower die

201: Lower mold side member

202: Lower mold bottom surface member

203: Lower model cavity

205: Release film adsorption tank (release film holding part)

211: Molded object falling off prevention block

217: Spring (elastic member)

1000: Forming mold

Claims (7)

A molding mold includes an upper mold and a lower mold; wherein the upper mold can absorb a molded object; the lower mold includes a lower mold bottom surface member, a lower mold side member, and a molded object falling prevention block; The space enclosed by the bottom surface member and the lower mold side member forms a lower mold cavity; the molded object falling prevention block is provided on a part of the end of the lower mold side member facing the lower mold cavity and can be up and down When the upper mold and the lower mold are closed, the side surface of the molded object is housed in the mold formed by the upper mold and the lower mold. Cavity. The molding die according to claim 1, wherein the molding target falling-off preventing block is attached to the side member of the lower mold via an elastic member. The molding die according to claim 1 or 2, wherein the lower mold side member is provided with a release film holding portion capable of holding a release film on an outer side of the molding target falling prevention block. A resin molding device comprising the molding die according to any one of claims 1 to 3. A method of manufacturing a resin molded product using the molding die described in any one of claims 1 to 3 or the resin molding apparatus described in claim 4, the manufacturing method comprising the following steps: a pressure reduction step, In the state where the upper mold adsorbs the molding object and the molding object fall-off prevention block contacts the molding object, the lower mold cavity Internal pressure reduction; mold closing step, closing the upper mold and the lower mold; and resin molding step, using the lower mold cavity to resin mold the molded object; in the closing mold step In this case, the side surface of the molding object is housed in a cavity formed by the upper mold and the lower mold. The method of manufacturing a resin molded article according to claim 5, wherein the pressure reduction step is performed in a state where the molded object is supported by the molded object fall prevention block and the upper mold. The method of manufacturing a resin molded product according to claim 5 or 6, wherein the molding die is the molding die described in claim 3; the manufacturing method further includes a release film holding step to hold the release film in On the release film holding portion; in a state where the release film is held on the release film holding portion, the pressure reduction step is performed.

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