SG11201508166RA - Resin molding apparatus and resin molding method - Google Patents

Resin molding apparatus and resin molding method

Info

Publication number
SG11201508166RA
SG11201508166RA SG11201508166RA SG11201508166RA SG11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA SG 11201508166R A SG11201508166R A SG 11201508166RA
Authority
SG
Singapore
Prior art keywords
resin molding
molding method
molding apparatus
resin
molding
Prior art date
Application number
SG11201508166RA
Inventor
Masahiko Fujisawa
Hideaki Nakazawa
Yoshikazu Muramatsu
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013113222A priority Critical patent/JP2014231185A/en
Priority to JP2013115783A priority patent/JP2014233882A/en
Priority to JP2013139424A priority patent/JP6180206B2/en
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to PCT/JP2014/061014 priority patent/WO2014192456A1/en
Publication of SG11201508166RA publication Critical patent/SG11201508166RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
SG11201508166RA 2013-05-29 2014-04-18 Resin molding apparatus and resin molding method SG11201508166RA (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013113222A JP2014231185A (en) 2013-05-29 2013-05-29 Resin molding apparatus and resin molding method
JP2013115783A JP2014233882A (en) 2013-05-31 2013-05-31 Resin molding device and method
JP2013139424A JP6180206B2 (en) 2013-07-03 2013-07-03 Resin sealing method and compression molding apparatus
PCT/JP2014/061014 WO2014192456A1 (en) 2013-05-29 2014-04-18 Resin molding device and resin molding method

Publications (1)

Publication Number Publication Date
SG11201508166RA true SG11201508166RA (en) 2015-12-30

Family

ID=51988495

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508166RA SG11201508166RA (en) 2013-05-29 2014-04-18 Resin molding apparatus and resin molding method

Country Status (5)

Country Link
KR (1) KR102203781B1 (en)
CN (1) CN105283294B (en)
SG (1) SG11201508166RA (en)
TW (1) TWI606526B (en)
WO (1) WO2014192456A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6066889B2 (en) * 2013-11-25 2017-01-25 Ｔｏｗａ株式会社 Compression molding apparatus and compression molding method
WO2017010319A1 (en) * 2015-07-15 2017-01-19 アピックヤマダ株式会社 Molding die and resin molding device
JP6654861B2 (en) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP6598642B2 (en) * 2015-11-09 2019-10-30 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP6506680B2 (en) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 Resin sealing apparatus and resin sealing method
JP6491120B2 (en) * 2016-02-13 2019-03-27 Ｔｏｗａ株式会社 Resin sealing device, resin sealing method, and resin molded product manufacturing method
JP6640003B2 (en) * 2016-04-05 2020-02-05 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP6723185B2 (en) * 2017-03-29 2020-07-15 Ｔｏｗａ株式会社 Mold, resin molding apparatus, resin molding method, and resin molded article manufacturing method
JP6923423B2 (en) * 2017-11-21 2021-08-18 Ｔｏｗａ株式会社 Manufacturing method of transport equipment, resin molding equipment and resin molded products
JP6876637B2 (en) * 2018-01-22 2021-05-26 Ｔｏｗａ株式会社 Molding mold, resin molding equipment and manufacturing method of resin molded products
JP7102238B2 (en) * 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
JP7084247B2 (en) * 2018-08-02 2022-06-14 Ｔｏｗａ株式会社 Manufacturing method for resin molding equipment, molding molds, and resin molded products
JP2020107700A (en) * 2018-12-27 2020-07-09 アピックヤマダ株式会社 Resin supply and extraction device, work transfer device, and resin molding device
JP2021126852A (en) * 2020-02-14 2021-09-02 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
CN113394326A (en) * 2021-06-29 2021-09-14 顺德职业技术学院 Molding device for waterproof LED water inlet packaging adhesive

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10249901A (en) * 1997-03-18 1998-09-22 Toyo Mach & Metal Co Ltd Mold clamping controlling method for molding machine
JP3282988B2 (en) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP4262468B2 (en) 2002-10-30 2009-05-13 アピックヤマダ株式会社 Resin molding method, resin molding apparatus, and support jig used therefor
JP4181984B2 (en) * 2003-12-25 2008-11-19 住友重機械工業株式会社 Compression molding equipment
JP2006027098A (en) * 2004-07-16 2006-02-02 Apic Yamada Corp Resin molding method and resin molding device
JP2008132719A (en) * 2006-11-29 2008-06-12 Sumitomo Heavy Ind Ltd Resin sealing device of compression molding die and compression method
JP5165268B2 (en) * 2007-04-01 2013-03-21 キョーラク株式会社 Method for producing hollow molded body and hollow molded body
JP2008254266A (en) * 2007-04-03 2008-10-23 Towa Corp Method and apparatus for compression-molding electronic component
KR100931295B1 (en) * 2008-01-24 2009-12-11 세크론 주식회사 Electronic component molding device and electronic component molding method
JP5419070B2 (en) * 2009-03-13 2014-02-19 アピックヤマダ株式会社 Resin sealing device
DE102010034923A1 (en) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Process for the preparation of a composite layer of a luminescence conversion layer and a litter layer

Also Published As

Publication number Publication date
KR20160013202A (en) 2016-02-03
CN105283294B (en) 2017-08-25
CN105283294A (en) 2016-01-27
TW201448074A (en) 2014-12-16
WO2014192456A1 (en) 2014-12-04
KR102203781B1 (en) 2021-01-15
TWI606526B (en) 2017-11-21

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