JP7102238B2 - Resin molding equipment and manufacturing method of resin molded products - Google Patents

Description

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

A transport mechanism for transporting an object to be transported to a predetermined position of a mold of a resin molding apparatus is known.
For example, Japanese Patent No. 6094781 (Patent Document 1) describes a transport mechanism having a positioning pin for determining the position of a lead frame to be transported at a required position, and a guide member capable of contacting the tip of the positioning pin of the transport mechanism. The lower mold having the above is disclosed (paragraphs [0017], [0018], [0022], etc.).

Further, in Japanese Patent Application Laid-Open No. 2012-44139 (Patent Document 2), the semiconductor wafer is placed on a protrusion pin that provides a force for assisting the release of the semiconductor wafer as a workpiece from the cavity of the molding portion. Later, it is disclosed that the semiconductor wafer is placed in the cavity (paragraphs [0026], [0027], etc.).

Japanese Patent No. 60994781 Japanese Unexamined Patent Publication No. 2012-44139

When performing transfer molding using a thermosetting resin, the object to be molded placed on the molding die is heated to a predetermined temperature. The molding die and the positioning means for the object to be molded are provided at positions assuming that they are thermally expanded from each other. In the step of placing the object to be molded on the molding die, if the thermal expansion of the object to be molded is not sufficient, the accuracy of alignment may be lowered and the object to be molded may not be placed at a predetermined position on the molding die. As a result, for example, there may be a concern that the IC chip or the wire connecting the chip and the lead frame comes into contact with the cavity surface of the molding die.

An object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product, which can position a molding object on a molding mold with high accuracy.

The resin molding apparatus according to the present invention is a resin molding apparatus that transfers and molds a molding object including a metal portion, and comprises an upper molding die, a lower molding die facing the upper molding die and containing a cavity, and a molding object. A transport mechanism for transporting between the upper molding die and the lower molding die, a first projecting member provided at a position corresponding to the metal portion of the object to be molded and capable of projecting from the upper surface of the lower forming die, and a cavity. Drive that can independently control the amount of protrusion of the second protruding member capable of protruding from the bottom surface, the amount of protrusion of the first protruding member from the upper surface of the lower molding die, and the amount of protrusion of the second protruding member from the bottom surface of the cavity. It is provided with a mechanism and a heating mechanism capable of heating the lower molding die.

The method for manufacturing a resin molded product according to the present invention includes a step of transporting a molded object including a metal portion and a positioning hole between the upper molding die and the lower molding die by using a transport mechanism, and a step of projecting from the upper surface of the lower molding die. With the process of projecting the member, the position of the positioning hole of the object to be molded, and the position of the positioning member provided in the lower molding die aligned, the projecting member protruding from the upper surface of the lower forming die is molded from the transfer mechanism. The process of delivering an object, the process of driving the projecting member downward with the protruding member supporting the metal part of the object to be molded, and the process of placing the object to be molded on the lower molding die , and the upper molding die and the lower molding. The process includes a step of mold-fastening the mold to transfer the object to be molded, and a step of opening the upper molding mold and the lower molding mold.

According to the present invention, the object to be molded can be placed on the molding die in a state of being sufficiently thermally expanded. Further, by appropriately controlling the downward driving speed of the protruding member protruding from the upper surface of the lower molding die, the molding target can be placed on the molding while suppressing the displacement of the molding target. can. As a result of the above, the accuracy of positioning the object to be molded with respect to the molding die can be improved.

It is a top view which shows the whole structure of the resin molding apparatus which concerns on one Embodiment of this invention. It is a front view of the resin molding apparatus which concerns on one Embodiment of this invention. It is a partial cross-sectional view of the resin molding apparatus shown in FIG. It is a partial cross-sectional view of the resin molding apparatus shown in FIG. (A) is a top view of the lower molding die shown in FIG. 4, and (b) is a cross-sectional view corresponding to (a). It is a side sectional view of the resin molding apparatus shown in FIG. It is a flow chart which shows the manufacturing method of the resin molded article which concerns on one Embodiment of this invention. It is a figure which shows one step of the manufacturing method of the resin molded article which concerns on one Embodiment of this invention. It is a figure which shows one step of the manufacturing method of the resin molded article which concerns on one Embodiment of this invention. It is a figure which shows one step of the manufacturing method of the resin molded article which concerns on one Embodiment of this invention. It is a figure which shows one step of the manufacturing method of the resin molded article which concerns on one Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described. In addition, the same reference code may be attached to the same or corresponding part, and the explanation may not be repeated.

In the embodiments described below, when the number, quantity, etc. are referred to, the scope of the present invention is not necessarily limited to the number, quantity, etc., unless otherwise specified. Further, in the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified.

FIG. 1 is a plan view showing the overall configuration of the resin molding apparatus according to one embodiment of the present invention. As shown in FIG. 1, the resin encapsulation device according to the present embodiment includes, for example, a molding unit A including a molding mechanism portion 1000 for resin encapsulating a substrate on which a semiconductor chip is mounted, and a molding mold of the molding unit A. It includes an inloader unit B including an inloader 2000 for supplying a substrate, an outloader 3000 for taking out a molded product from a molding mold of the molding unit A, and an outloader unit C including an accommodating portion for accommodating the molded product. The inloader 2000 and the outloader 3000 move in the vertical direction in FIG.

The molding unit A, the inloader unit B, and the outloader unit C are detachably connected to each other via a connecting mechanism such as a bolt or a pin. In the example of FIG. 1, two molding units A are provided, but the number of molding units A can be increased or decreased according to the production amount. The number of molding units A may be one, or may be expanded to four, for example. That is, the resin sealing device of the present embodiment can be configured so that the number of molding units can be increased or decreased.

Further, in the example of FIG. 1, the molding unit A, the inloader unit B, and the outloader unit C are arranged in this order. For example, the molding unit A, the inloader unit B, and the outloader unit C are arranged in this order. A resin sealing device may be configured by arranging one integrated master unit and one or more slave units having only the molding unit A side by side.

Next, the resin molding apparatus according to the embodiment of the present invention will be described with reference to FIGS. 2 to 4. The resin molding apparatus is provided in the molding mechanism portion 1000.

FIG. 2 is a front view of the resin molding apparatus. The resin molding apparatus of this embodiment is a resin molding apparatus that transfers and molds a molding object (details will be described later) including a metal portion such as a lead frame.

The resin molding apparatus of the present embodiment includes an upper fixing plate 200, a movable plate 300, and a lower fixing plate 400. The upper fixing plate 200 and the lower fixing plate 400 are fixed to each other by a support column 500. The strut portion 500 may be a columnar strut or a flat plate. The movable platen 300 can be moved vertically upward and vertically by the press drive mechanism 600 between the upper fixed platen 200 and the lower fixed platen 400. The press drive mechanism 600 is arranged on the upper surface of the lower fixed plate 400, and is a power generation mechanism for raising and lowering the movable platen 300 and generating molding pressure. In the present embodiment, since the upper fixing plate 200 is fixed, the movable platen 300 is relatively movable with respect to the upper fixing plate 200.

An upper molding die 10 is attached to the vertically lower side of the upper fixing plate 200. A lower molding die 20 is attached to the vertically upper side of the movable platen 300. The lower molding die 20 faces the upper molding die 10. By molding the upper molding die 10 and the lower molding die 20, the object to be molded is resin-molded. The object to be molded is conveyed between the upper molding die 10 and the lower molding die 20 by a conveying mechanism described later.

FIG. 3 is a partial cross-sectional view of the resin molding apparatus shown in FIG. 2, showing an upper molding die 10 and an upper molding die holding portion 30. The upper molding die 10 includes a cal 11 and a recess 12. The cal 11 is a pool portion before the resin material is transferred to the molding objects located on the left and right in FIG. 3 during transfer molding. The recess 12 is a space for preventing the positioning members (for example, positioning pins) (see FIG. 4) of the lower molding die 20 from interfering with each other when the upper molding die 10 and the lower molding die 20 are molded.

The upper mold holding portion 30 is a member for holding the upper mold 10 on the lower surface of the upper fixing plate 200. The upper molded mold holding portion 30 includes an upper heater plate 31, an upper heat insulating plate 32, and an upper spacer plate 33. The upper heater plate 31 is a plate that houses the heater 34 (upper heating mechanism). The heater 34 is a heat source capable of heating the upper molding die 10. The heater 34 extends in the normal direction of the paper surface of FIG. The upper heat insulating plate 32 is a plate-shaped member located between the upper heater plate 31 and the upper fixing plate 200. The upper heat insulating plate 32 is preferably made of a material that does not easily conduct heat in order to prevent the upper fixing plate 200 from being thermally deformed by the heat from the heater 34. The upper spacer plate 33 is a plate arranged between the upper heater plate 31 and the upper molding die 10.

FIG. 4 is a partial cross-sectional view of the resin molding apparatus shown in FIG. 2, showing a lower molding die 20, a lower molding die holding portion 40, a lower first plate 51, and a lower second plate 52.

The lower molding mold 20 includes a cavity 21 and a positioning member 22. The cavity 21 is a molded recess provided in the lower molding mold 20. The positioning member 22 is a member for positioning an object to be molded on the upper surface 20a (molding mold surface) of the lower molding mold 20. The positioning member 22 has a conical tapered portion 22a located on the tip side and a cylindrical straight portion 22b located on the root side.

The lower mold holding portion 40 is a member for holding the lower mold 20 on the upper surface of the movable platen 300. The lower mold holding portion 40 includes a lower heater plate 41, a lower heat insulating plate 42, a lower third plate 43, a clamper head 45, and a clamper rod 46. The lower heater plate 41 is a plate that houses the heater 44 (lower heating mechanism). The heater 44 is a heat source capable of heating the lower molding mold 20. The heater 44 extends in the normal direction of the paper surface of FIG. The lower heat insulating plate 42 is a plate-shaped member located between the lower heater plate 41 and the movable platen 300. The lower heat insulating plate 42 is preferably made of a material that does not easily conduct heat in order to prevent the movable platen 300 from being thermally deformed by the heat from the heater 44. The lower third plate 43 is a flat plate-like member for matching the height of the lower mold holding portion 40 with the height of the lower mold 20. The clamper head 45 is a member having a U-shape formed so that the lower second plate 52 fits. The clamper rod 46 is a rod-shaped member fixed to the clamper head 45.

A clamper positioning rod 47 is provided below the clamper rod 46. The clamper positioning rod 47 is a rod-shaped member for positioning the lowest points of the clamper head 45 and the clamper rod 46 by abutting against the clamper rod 46.

The resin molding apparatus according to the present embodiment further includes a projecting member 100 (first projecting member) and a projecting member 110 (second projecting member). The projecting member 100 can be driven in the vertical direction and can project from the upper surface 20a of the lower molding die 20. The projecting member 110 can project from the bottom surface 21a of the cavity 21. A crossguard 100a is provided on the root side of the projecting member 100. The material of the projecting member 100 may be, for example, metal or ceramic.

The projecting member 100 is provided at a position corresponding to a metal portion of the object to be molded (for example, a lead frame on which an IC chip is mounted). The projecting member 110 is provided at a position corresponding to the resin molded portion of the object to be molded. The projecting members 100 and 110 are pin members (ejector pins) that project upward after resin molding of the object to be molded. When the projecting members 100 and 110 project, the resin molded product is released from the lower molding die 20.

The projecting members 100 and 110 can be raised and lowered together with the lower first plate 51 and the lower second plate 52. When the projecting members 100 and 110 move upward, the projecting member 100 projects from the upper surface 20a of the lower molding die 20, and the projecting member 110 projects from the bottom surface 21a of the cavity 21. At this time, the amount of protrusion from the upper surface 20a of the protruding member 100 and the amount of protrusion from the bottom surface 21a of the protruding member 110 are the same.

The projecting member 100 is driven in the vertical direction with respect to the lower first plate 51 and the lower second plate 52 by a drive mechanism described later. In one example, the drive mechanism comprises a cotter mechanism including the upper wedge member 71 and the lower wedge member 73 shown in FIG. The upper wedge member 71 and the lower wedge member 73 move relative to each other in the horizontal direction, so that the upper wedge member 71 moves upward. The flange portion 100a of the projecting member 100 is pushed by the upper wedge member 71 and moves upward together with the upper wedge member 71. As a result, the projecting member 100 can move upward while the lower first plate 51 and the lower second plate 52 are stationary (the projecting member 110 is also stationary). That is, in the resin molding apparatus according to the present embodiment, the amount of protrusion of the projecting member 100 from the upper surface 20a of the lower molding die 20 and the amount of protrusion of the projecting member 110 from the bottom surface 21a of the cavity 21 are independently controlled. It is possible.

The lower first plate 51 is a flat plate-like member that accommodates the flange portion 100a of the projecting member 100 and the elastic member 77. The lower first plate 51 is fixed to the lower second plate 52 and moves up and down together with the lower second plate 52. The elastic member 77 is housed in the lower first plate 51 together with the crossguard 100a, and the crossguard 100a is urged downward. In one example, the elastic member 77 is composed of a leaf spring. When the projecting member 100 is driven upward, the elastic member 77 is bent by the crossguard 100a, and when the projecting member 100 is driven downward, the elastic member 77 urges the crossguard 100a downward. As a result, the projecting member 100 is prevented from projecting from the upper surface 20a of the lower molding die 20 except when the projecting member 100 is driven upward. The elastic member 77 may be, for example, a coiled spring. Further, the elastic member 77 may be made of metal, rubber, or a composite of a plurality of materials.

The lower second plate 52 is below the lower first plate 51. The lower second plate 52 accommodates the upper wedge member 71 and the lower wedge member 73. That is, the lower second plate 52 accommodates at least a part of the drive mechanism that drives the projecting member 100 up and down.

5 (a) is a top view of the lower molding die 20 shown in FIG. 4, and FIG. 5 (b) is a cross-sectional view corresponding to FIG. 5 (a). The alternate long and short dash line in FIG. 5A represents an example of the size of the object 1 to be molded. The molded object 1 in the present invention has, for example, a width of about 60 mm or more and 100 mm or less, a length of about 200 mm or more and 300 mm or less, and a thickness of about 0.1 mm or more and 0.3 mm or less. The object 1 to be molded may be an IC chip mounted. The pitch between the IC chips is, for example, about 3.5 mm or more and 10.0 mm or less in the first direction, and about 7 mm or more and 10 mm or less in the direction orthogonal to the first direction. FIG. 5A shows an example of arrangement of a plurality of projecting members 100. In the example of FIG. 5, the projecting member 100 is provided in a region (outer peripheral region) surrounding a portion (central region) in which the cavity 21 is formed. Needless to say, the position and number of the projecting members 100 are not limited to the example of FIG.

FIG. 6 is a side sectional view of the resin molding apparatus shown in FIG. The drive mechanism 70 includes an upper wedge member 71, a lower wedge member 73, and a drive unit 75. The upper wedge member 71 has a first inclined surface 72. The lower wedge member 73 has a second inclined surface 74 facing the first inclined surface 72. The drive unit 75 can move the lower wedge member 73 in the horizontal direction in a state where the first inclined surface 72 and the second inclined surface 74 can slide with each other. The upper wedge member 71 moves in the vertical direction as the lower wedge member 73 moves in the horizontal direction (direction of arrow 76). As described above, since the projecting member 100 is arranged on the upper wedge member 71, the projecting member 100 also moves in the vertical direction as the upper wedge member 71 moves in the vertical direction. The drive unit 75 is provided on the outside of the lower molding mold holding unit 40. As a result, the influence of heat from the heater 44 on the drive unit 75 can be suppressed, and the occurrence of failure can be suppressed. In the example of FIG. 6, the drive unit 75 is composed of an air cylinder or the like capable of reciprocating the lower wedge member 73, but a drive mechanism capable of more precise speed control such as a servomotor may be used. good. Further, the plurality of lower wedge members 73 may be driven by one actuator, or one actuator may be arranged for each lower wedge member 73. Further, the projecting member 100 may be moved in the vertical direction by using, for example, a cam mechanism instead of the wedge mechanism shown in FIG.

Hereinafter, the method for producing the resin molded product of the present embodiment, which is an example of the method for producing the resin molded product using the resin molding apparatus of the present embodiment, will be described with reference to FIGS. 7 to 11. FIG. 7 is a flow chart showing a method for manufacturing a resin molded product according to the present embodiment. As shown in FIG. 7, in the method for manufacturing a resin molded product according to the present embodiment, a step (S10) of transporting a molding object between the upper molding die 10 and the lower molding die 20 and a step of lowering the protruding member are performed. A step of projecting from the molding die (S20), a step of transferring the object to be molded from the transport mechanism to the projecting member (S30), and a step of driving the projecting member downward to place the object to be molded on the lower molding die (S20). S40), a mold clamping step (S50), and a mold opening step (S60) are included. Hereinafter, each step will be described in more detail.

First, as shown in the schematic cross-sectional view of FIG. 8, the object 1 to be molded including the metal portion 2 and the positioning hole 3 is conveyed between the upper molding die 10 and the lower molding die 20 by using the conveying mechanism 60. The object 1 to be molded may be preheated by a preheater (not shown) that operates together with the transport mechanism 60.

After that, the projecting member 100 is projected from the upper surface 20a of the lower molding die 20. The protrusion of the projecting member 100 uses a drive mechanism 70 including an upper wedge member 71 having a first inclined surface 72 and a lower wedge member 73 having a second inclined surface 74 facing the first inclined surface 72. It is done. The upper wedge member 71 is raised as the lower wedge member 73 is moved in the horizontal direction (direction of arrow 76 in FIG. 6) while sliding the first inclined surface 72 and the second inclined surface 74 with each other. By driving the projecting member 100 arranged on the upper wedge member 71 upward, the projecting member 100 projects from the upper surface 20a of the lower molding die 20. At this time, the elastic member 77 housed in the lower first plate 51 is elastically deformed by being pushed by the crossguard 100a of the projecting member 100.

After that, in a state where the position of the positioning hole 3 of the object 1 to be molded and the position of the positioning member 22 provided on the lower molding die 20 are aligned, the conveying mechanism 60 is sent to the protruding member 100 protruding from the upper surface 20a of the lower molding die 20. The object 1 to be molded is delivered from. When the claw portion 61 of the transport mechanism 60 is opened, the object 1 to be molded is delivered from the transport mechanism 60 to the projecting member 100. At this time, the positioning hole 3 of the object 1 to be molded is in a state of being fitted in the tapered portion 22a of the positioning member 22 of the lower molding die 20. Further, the metal portion 2 of the object 1 to be molded is supported by the tip of the projecting member 100. By keeping the height of the object to be molded 1 when the claw portion 61 of the transport mechanism 60 is opened and the height of the tip of the protruding member 100 as close as possible, the object to be molded 1 released from the claw portion 61 can be immediately released. It is held by the projecting member 100 and enables more precise positioning of the object 1 to be molded.

Next, as shown in FIG. 9, with the protruding member 100 supporting the metal portion 2 of the molding target 1, the protruding member 100 is driven downward to place the molding target 1 on the lower molding mold 20. ..

Here, the protruding member 100 supports the metal portion 2 of the object 1 to be molded, and the heater 44 heats the lower molding die 20 to raise the temperature of the lower molding die 20. This heating temperature is, for example, 175 ° C. The object 1 to be molded receives radiant heat from the lower molding die 20 which has been heated by the heater 44. As a result, the object 1 to be molded is heated, and the thermal expansion of the object 1 to be molded caused by the preheating is maintained.

After that, the projecting member 100 is driven downward. The downward drive of the projecting member 100 is performed by moving the lower wedge member 73 in the horizontal direction opposite to the direction indicated by the arrow 76 (see FIG. 6) and lowering the upper wedge member 71. Is done. The lower wedge member 73 moves toward the original position, and the upper wedge member 71 descends. The upper wedge member 71 is urged downward by the elastic force of the elastic member 77 to surely descend and return to the original position. As the upper wedge member 71 descends, the protruding member 100 arranged on the upper wedge member 71 also moves downward.

The molding target 1 is placed on the lower molding mold 20 by inserting the straight portion 22b of the positioning member 22 of the lower molding mold 20 into the positioning hole 3 provided in the molding target 1. When the molding target 1 is accurately positioned on the lower molding mold 20, electronic parts such as the IC chip 4 on the molding target 1 are housed in the cavity 21 of the lower molding mold 20. In this way, the object 1 to be molded is positioned on the lower molding die 20.

The straight portion 22b of the positioning member 22 is provided so as to correspond to the position of the positioning hole 3 in a state where the object 1 to be molded is sufficiently thermally expanded. When the object to be molded is transferred from the transfer mechanism 60 to the lower molding die 20, if the object 1 to be molded is separated from the preheater that cooperates with the transfer mechanism 60, the temperature of the object 1 to be molded drops and the object 1 to be molded is deformed. I have something to do. In this case, due to insufficient thermal expansion of the object 1 to be molded, the position of the positioning hole 3 of the object 1 to be molded and the position of the positioning member 22 of the lower molding die 20 may not be accurately aligned. If the molding target 1 is to be placed on the lower molding mold 20 in this state, the molding target 1 may enter the positioning member 22 at an angle or be caught by the tapered portion 22a of the positioning member 22 to align the molding target 1. The accuracy of As a result, the object 1 to be molded may not be installed at a predetermined position of the lower molding die 20. At this time, when the object 1 to be molded is for mounting a small IC chip, for example, there is a concern that the IC chip, the wire connecting the chip and the frame, or the like may come into contact with the cavity surface of the lower molding die 20.

In the resin manufacturing apparatus of the present embodiment, since the molding target 1 receives the radiant heat from the lower molding mold 20 which has been heated by the heater 44, the molding target 1 can be in a state of being thermally expanded by a predetermined amount. .. As a result, the position of the positioning hole 3 of the molding target 1 and the position of the positioning member 22 of the lower molding mold 20 can be accurately aligned, so that the molding target 1 is accurately positioned with respect to the lower molding mold 20. be able to.

Further, when the lowering speed of the molding target 1 is made smaller, that is, when the molding target 1 is slowly lowered, the molding target 1 further compares the radiant heat from the lower molding mold 20 which has been heated by the heater 44. Since the object 1 is subjected to a target long time, the object 1 to be molded can be further sufficiently thermally expanded. As a result, the accuracy of positioning the object 1 to be molded on the lower molding die 20 can be further improved.

When the projecting member 100 has thermal conductivity, the heat from the heater 44 is conducted to the metal portion 2 of the molded object 1 supported by the projecting member 100 via the projecting member 100. As a result, the accuracy of positioning the object 1 to be molded on the lower molding die 20 can be further improved.

Further, the metal portion 2 of the object 1 to be molded may be maintained in a state of being supported by the tip of the projecting member 100 for a certain period of time. As a result, the object 1 to be molded can be further sufficiently thermally expanded. As a result, the accuracy of positioning the object 1 to be molded on the lower molding die 20 can be further improved. The fixed time is the time required for the object 1 to be molded by thermal expansion to have a shape that does not cause any problem even if it is transferred and molded, and in one example, it can be about several seconds to several minutes.

Further, by receiving the molding object 1 from the transport mechanism 60 by the projecting member 100 projecting from the upper surface 20a of the lower molding die 20, the molding target 1 released from the transport mechanism 60 is received by the upper surface 20a of the lower molding die 20. The drop distance of the object 1 to be molded from the transport mechanism 60 can be shortened as compared with the case where the object 1 is placed directly on the surface. This also contributes to improving the positioning accuracy of the object 1 to be molded.

After the molding object 1 is placed on the lower molding die 20, as shown in FIG. 10, the upper molding die 10 and the lower molding die 20 are mold-clamped to transfer-mold the molding object 1. First, the press drive mechanism 600 raises the movable platen 300 and the lower forming die 20, and clamps the upper forming die 10 and the lower forming die 20. After that, the resin material 6 supplied into the pot (not shown) in the lower molding die 20 is press-fitted using a plunger (not shown) to lower the resin material 6 through the resin passage 23 and the cal 11. It is transferred to the cavity 21 of the molding die 20.

Next, as shown in FIG. 11, the upper molding die 10 and the lower molding die 20 are opened. In this step, first, the press drive mechanism 600 is lowered to drive the lower molding die 20 downward, and the upper molding die 10 and the lower molding die 20 are opened. At this time, the clamper rod 46 comes into contact with the clamper positioning rod 47, whereby the position of the clamper rod 46 is fixed. After that, when the lower molding die 20 is further lowered, the lower second plate 52 sandwiched by the clamper head 45 is raised relative to the lower molding die holding portion 40. As a result, the projecting members 100 and 110 fixed on the lower second plate 52 project from the upper surface 20a of the lower molding die 20 and the bottom surface 21a of the cavity 21, respectively, and the resin molded product 5 is released from the mold. At this time, the projecting members 100 and 110 function as ejector pins. The resin material 6 solidified by the cal 11 is separated from the resin molded product 5 and discarded.

After that, the resin material remaining in the cavity 21 is removed, and the above manufacturing process is repeated in order to manufacture a new resin molded product.

However, some resin materials, dust, and the like may remain in the cavity 21 without being removed.

When the projecting member 110 protrudes from the bottom surface 21a of the cavity 21 with the resin material or the like remaining in the cavity 21, the resin material adheres to the vicinity of the tip of the projecting member 110, or the bottom surface 21a of the cavity 21 and the projecting member 110 come together. The resin material may get into the gap between them. In a resin molding apparatus in which all ejector pins are driven in the vertical direction at the same time, if the projecting member is projected except in the mold release step, the above problem is concerned around the projecting member projecting from the bottom surface of the cavity.

On the other hand, in the present embodiment, since the protrusion amount of the protrusion member 100 and the protrusion member 110 can be controlled independently by the drive mechanism 70, the protrusion member 100 without projecting the protrusion member 110 which is a package ejector pin. Can be projected. As a result, only the projecting member 100 projects when the object 1 to be molded is delivered from the transport mechanism 60, so that the resin material 6 that remains without being removed from the cavity 21 in the previous resin molding may adhere to the projecting member 110. , It is possible to prevent it from entering the gap.

The method for manufacturing a resin molded product described above is a manufacturing method for die-down in which a cavity 21 is provided in a lower molding die 20, but the method for manufacturing a resin molded product according to the present invention is a manufacturing method for forming a cavity in an upper molding die. It can also be applied to the manufacturing method related to the provided die-up.

In the method for manufacturing a resin molded product according to die-up, after the mold is opened, the resin molded product is released by an ejector pin provided in the upper molding mold separately from the protruding member provided in the lower molding mold. Therefore, the projecting member that holds the resin molded product from the transport mechanism does not function as an ejector pin when the resin molded product is released, which is different from the method for manufacturing a resin molded product related to die-down. Since the other steps of the manufacturing method related to die-up are almost the same as those of the manufacturing method related to die-down, the detailed description will not be repeated.

According to the resin molding apparatus and the method for manufacturing a resin molded product according to the present embodiment, the molding target 1 can be placed on the molding mold in a state of being sufficiently thermally expanded, so that the molding target 1 can be molded. The accuracy of positioning on the mold can be improved.

Although the embodiments of the present invention have been described above, it should be considered that the embodiments disclosed this time are exemplary in all respects and are not restrictive. The scope of the present invention is indicated by the claims and is intended to include all modifications within the meaning and scope equivalent to the claims.

1 Molding object, 2 Metal part, 3 Positioning hole, 4 IC chip, 5 Resin molded product, 6 Resin material, 10 Upper molding mold, 11 cal, 12 concave part, 20 Lower molding mold, 20a top surface, 21 cavity, 21a bottom surface , 22 Positioning member, 22a Tapered part, 22b Straight part, 23 Resin passage, 30 Upper molded mold holding part, 31 Upper heater plate, 32 Upper heat insulating plate, 33 Upper spacer plate, 34 Heater, 40 Lower molded mold holding part, 41 Lower heater plate, 42 Lower insulation plate, 43 Lower 3rd plate, 44 Heater, 45 Clamper head, 46 Clamper rod, 47 Clamper positioning rod, 51 Lower 1st plate, 52 Lower 2nd plate, 60 Conveyance mechanism, 61 Claws , 70 drive mechanism, 71 upper wedge member, 72 first inclined surface, 73 lower wedge member, 74 second inclined surface, 75 drive part, 76 arrow, 77 elastic member, 100, 110 protruding member, 100a flange part, 200 upper fixed plate, 300 movable plate, 400 lower fixed plate, 500 strut part, 600 press drive mechanism, 1000 mold mechanism part, 2000 inloader, 3000 outloader, A molding unit, B inloader unit, C outloader unit.

Claims (6)

A resin molding device that transfers and molds a molding object including a metal part.
Top molding and
A lower molding die facing the upper molding die and containing a cavity, and a lower molding die.
A transport mechanism for transporting the object to be molded between the upper molding die and the lower molding die,
A first projecting member provided at a position corresponding to the metal portion of the object to be molded and capable of projecting from the upper surface of the lower molding die.
A second projecting member that can project from the bottom surface of the cavity,
A drive mechanism capable of independently controlling the amount of protrusion of the first protruding member from the upper surface of the lower molding die and the amount of protrusion of the second protruding member from the bottom surface of the cavity.
It is equipped with a heating mechanism capable of heating the lower molding mold.
The first projecting member can be driven downward while the object to be molded is delivered from the transport mechanism and supports the metal portion, and the object to be molded can be placed on the lower molding die. A resin molding device. The drive mechanism is
An upper wedge member having a first inclined surface and
A lower wedge member having a second inclined surface facing the first inclined surface, and
The lower wedge member includes a drive unit capable of moving the lower wedge member in the horizontal direction in a state where the first inclined surface and the second inclined surface can slide with each other.
As the lower wedge member moves in the horizontal direction, the upper wedge member moves in the vertical direction.
The resin molding apparatus according to claim 1, wherein the first protruding member is arranged on the upper wedge member. A process of transporting a molding object including a metal part and a positioning hole between an upper molding die and a lower molding die using a transport mechanism.
The step of projecting the projecting member from the upper surface of the lower molding die and
In a state where the position of the positioning hole of the molding object and the position of the positioning member provided in the lower molding die are aligned with each other, the projecting member protruding from the upper surface of the lower molding die is subjected to the molding target from the conveying mechanism. The process of delivering things and
A step of driving the projecting member downward to place the object to be molded on the lower molding die while the metal portion of the object to be molded is supported by the projecting member.
A step of molding the upper molding die and the lower molding die to transfer molding the object to be molded.
A method for producing a resin molded product, which comprises a step of opening the upper molding die and the lower molding die. In the step of preliminarily placing the object to be molded, the projecting member is maintained in a state where the metal portion of the object to be molded is supported for a certain period of time, and then the projecting member is driven downward to move the object to be molded. The method for producing a resin molded product according to claim 3, which is placed on the lower molding mold. The step of projecting the projecting member from the upper surface of the lower molding mold includes an upper wedge member having a first inclined surface and a lower wedge member having a second inclined surface facing the first inclined surface. Using the mechanism, the upper wedge member is raised as the lower wedge member is moved in the first horizontal direction while sliding the first inclined surface and the second inclined surface with each other. The method for manufacturing a resin molded product according to claim 3 or 4, which comprises driving the protruding member arranged on the upper wedge member upward. In the step of driving the protruding member downward and placing the molding object on the lower molding die, the lower wedge member is moved in a second horizontal direction opposite to the first horizontal direction. The method for producing a resin molded product according to claim 5, further comprising lowering the upper wedge member and driving the protruding member arranged on the upper wedge member downward.

Images