SG11201508701YA - Resin molding die set and resin molding apparatus - Google Patents

Resin molding die set and resin molding apparatus

Info

Publication number
SG11201508701YA
SG11201508701YA SG11201508701YA SG11201508701YA SG11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA SG 11201508701Y A SG11201508701Y A SG 11201508701YA
Authority
SG
Singapore
Prior art keywords
resin molding
die set
molding die
molding apparatus
resin
Prior art date
Application number
SG11201508701YA
Inventor
Makoto Kawaguchi
Shinya Tajima
Kenji Nakajima
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG11201508701YA publication Critical patent/SG11201508701YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/123—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels for centering the inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
SG11201508701YA 2013-06-14 2014-04-25 Resin molding die set and resin molding apparatus SG11201508701YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013125978A JP6062810B2 (en) 2013-06-14 2013-06-14 Resin mold and resin mold apparatus
PCT/JP2014/061748 WO2014199733A1 (en) 2013-06-14 2014-04-25 Resin-molding die and resin-molding device

Publications (1)

Publication Number Publication Date
SG11201508701YA true SG11201508701YA (en) 2015-12-30

Family

ID=52022035

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508701YA SG11201508701YA (en) 2013-06-14 2014-04-25 Resin molding die set and resin molding apparatus

Country Status (6)

Country Link
JP (1) JP6062810B2 (en)
KR (2) KR102301482B1 (en)
CN (1) CN105283289B (en)
SG (1) SG11201508701YA (en)
TW (1) TWI593538B (en)
WO (1) WO2014199733A1 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3271131B1 (en) * 2015-03-20 2020-12-30 Husky Injection Molding Systems Ltd. Molding system having a mold stack with a cleaning configuration and a shut height adjustment mechanism
JP6236486B2 (en) * 2016-03-07 2017-11-22 Ｔｏｗａ株式会社 A position adjusting mechanism, a resin sealing device, a resin sealing method, and a resin sealing product manufacturing method.
JP6499105B2 (en) * 2016-03-11 2019-04-10 東芝メモリ株式会社 Mold
JP6576862B2 (en) 2016-03-16 2019-09-18 東芝メモリ株式会社 Transfer molding equipment
JP6710107B2 (en) 2016-06-10 2020-06-17 アサヒ・エンジニアリング株式会社 Resin sealing device
JP7036720B2 (en) * 2016-07-08 2022-03-15 株式会社小糸製作所 Manufacturing method for molds and two-color molded products
CN106079282B (en) * 2016-07-25 2018-04-17 安徽宁国中鼎模具制造有限公司 A kind of new structure is molded encapsulated handle mold
KR101953260B1 (en) 2016-09-23 2019-02-28 동국실업 주식회사 Resin molding manufacturing method using the resin backflow gas injection
JP6304517B1 (en) * 2017-02-14 2018-04-04 第一精工株式会社 Resin sealing method and resin sealing device
JP6721525B2 (en) 2017-03-03 2020-07-15 キオクシア株式会社 Mold
JP6891048B2 (en) * 2017-06-02 2021-06-18 アピックヤマダ株式会社 Resin mold mold and resin mold equipment
JP6822901B2 (en) * 2017-06-02 2021-01-27 アピックヤマダ株式会社 Resin mold mold and resin mold equipment
KR101973630B1 (en) 2017-10-23 2019-09-02 케이비아이동국실업 주식회사 Resin molding manufacturing method using the resin backflow gas injection
JP6861609B2 (en) * 2017-10-30 2021-04-21 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
JP6541746B2 (en) * 2017-10-30 2019-07-10 Ｔｏｗａ株式会社 Resin molding apparatus and method of manufacturing resin molded article
CN108198764B (en) * 2017-12-18 2019-07-02 重庆市长寿区普爱网络科技有限公司 Electronic component manufacturing method
DE102017131110A1 (en) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh METHOD FOR EMBEDDING OPTOELECTRONIC COMPONENTS INTO A LAYER
TWI787417B (en) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 Mold for compression molding and compression molding device
JP6936177B2 (en) * 2018-03-23 2021-09-15 アピックヤマダ株式会社 Resin molding equipment
JP7102238B2 (en) * 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
DE102018214823A1 (en) 2018-08-31 2020-03-05 Bayerische Motoren Werke Aktiengesellschaft Injection mold
NL2021845B1 (en) * 2018-10-22 2020-05-13 Besi Netherlands Bv Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
CN109545694B (en) * 2018-11-13 2020-11-17 无锡中微高科电子有限公司 Mold sealing method for damaged substrate
JP7084348B2 (en) 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
JP7084349B2 (en) * 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
KR102257217B1 (en) * 2019-06-18 2021-05-28 한국생산기술연구원 Apparatus for preventing air trap on the bullet-shaped injection products
CN111391219B (en) * 2020-03-20 2021-12-24 东莞市艾尔玛塑件科技有限公司 In-mold transfer printing system
JP7277936B2 (en) * 2020-04-28 2023-05-19 アピックヤマダ株式会社 Resin molding equipment
JP7417495B2 (en) * 2020-08-28 2024-01-18 Ｔｏｗａ株式会社 Resin molding equipment and method for manufacturing resin molded products
CN115214068B (en) * 2021-04-25 2024-01-23 广州汽车集团股份有限公司 Machining die and machining method for forming holes
KR102446919B1 (en) * 2021-06-02 2022-09-23 한화솔루션 주식회사 Undercover molding apparatus
KR102408586B1 (en) * 2021-08-23 2022-06-16 광성기업 주식회사 Molding apparatus and method of injection mold
WO2023144856A1 (en) * 2022-01-25 2023-08-03 アピックヤマダ株式会社 Resin sealing device, sealing mold, and resin sealing method
KR102494872B1 (en) * 2022-05-31 2023-02-07 장용수 Apparatus and method for manufacturing a water proof panel

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217222A (en) * 2001-01-17 2002-08-02 Mitsubishi Electric Corp Semiconductor manufacturing device and method therefor
US7985357B2 (en) * 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
JP4194596B2 (en) * 2005-11-25 2008-12-10 第一精工株式会社 Resin sealing mold apparatus and resin sealing method
CN101809088B (en) * 2007-09-25 2012-10-24 日立化成工业株式会社 Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
JP5352896B2 (en) 2008-01-19 2013-11-27 アピックヤマダ株式会社 Transfer molding method and transfer molding apparatus
JP5140517B2 (en) * 2008-08-07 2013-02-06 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
JP5185069B2 (en) * 2008-10-31 2013-04-17 アピックヤマダ株式会社 Transfer mold, transfer mold apparatus and resin molding method using the same
JP5215886B2 (en) * 2009-01-27 2013-06-19 Ｔｏｗａ株式会社 Resin sealing molding equipment for electronic parts
JP5560479B2 (en) * 2009-07-01 2014-07-30 アピックヤマダ株式会社 Resin mold, resin mold apparatus, and resin mold method
JP2012035433A (en) * 2010-08-04 2012-02-23 Sumitomo Heavy Ind Ltd Compression mold and compression molding method
JP5663785B2 (en) * 2010-12-17 2015-02-04 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP5807898B2 (en) * 2011-03-24 2015-11-10 アピックヤマダ株式会社 Mold and resin molding apparatus using the same
JP5906528B2 (en) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 Mold and resin molding apparatus using the same
CN103842396B (en) * 2011-09-30 2016-03-16 Dic株式会社 Active energy ray-curable resin composition, its manufacture method, coating, film and film

Also Published As

Publication number Publication date
KR102208459B1 (en) 2021-01-27
TWI593538B (en) 2017-08-01
KR20160021240A (en) 2016-02-24
WO2014199733A1 (en) 2014-12-18
JP2015000520A (en) 2015-01-05
CN105283289A (en) 2016-01-27
KR20210011070A (en) 2021-01-29
JP6062810B2 (en) 2017-01-18
TW201446458A (en) 2014-12-16
CN105283289B (en) 2017-08-08
KR102301482B1 (en) 2021-09-13

Similar Documents

Publication Publication Date Title
SG11201508701YA (en) Resin molding die set and resin molding apparatus
SG11201508166RA (en) Resin molding apparatus and resin molding method
SG10201406077QA (en) Molding die set and resin molding apparatus having the same
IL243785A0 (en) Plastic moulding method
EP2910323A4 (en) Production method and production device for three-dimensionally shaped molded object
EP2987603A4 (en) Injection molding apparatus and injection molding method
HRP20180586T1 (en) Tire vulcanizer-unloading device and tire vulcanizer
ZA201707256B (en) Press molding device and press molding method
EP3023168A4 (en) Press molding method
EP2979837A4 (en) Injection molding method and injection molding device
EP2952537A4 (en) Water-absorbable resin material and method for producing same
EP2990132A4 (en) Metal plate molding method and molding device
EP2979835A4 (en) Molding apparatus
EP3059064A4 (en) Plastic molding method
PL2789239T3 (en) Device and method for producing spherical molded products
EP2979776A4 (en) Sand-mold molding method and sand-mold molding apparatus
EP3017893A4 (en) Press molding device and press molding method
PL3192644T3 (en) Process and device for producing fiber-reinforced thermoplastic resin tape
EP3229266A4 (en) Resin molding device and resin molding method
EP3020492A4 (en) Plate molding method and preliminary molded shape setting method
EP3037478A4 (en) Polyamide resin composition and molded product
EP2993018A4 (en) Mold for molding tire, and tire
EP3059063A4 (en) Molding method for thermoplastic resin material
PT3003679T (en) Injection molding device
EP2803470A4 (en) Molding method and molding device